JP4970451B2 - Light diffusion resin composition and light diffusion plate - Google Patents
Light diffusion resin composition and light diffusion plate Download PDFInfo
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- JP4970451B2 JP4970451B2 JP2008526758A JP2008526758A JP4970451B2 JP 4970451 B2 JP4970451 B2 JP 4970451B2 JP 2008526758 A JP2008526758 A JP 2008526758A JP 2008526758 A JP2008526758 A JP 2008526758A JP 4970451 B2 JP4970451 B2 JP 4970451B2
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- light diffusing
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- 239000011342 resin composition Substances 0.000 title claims description 30
- 238000009792 diffusion process Methods 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 claims description 65
- 239000011347 resin Substances 0.000 claims description 65
- 239000002245 particle Substances 0.000 claims description 41
- 229920005992 thermoplastic resin Polymers 0.000 claims description 33
- -1 aromatic vinyl compound Chemical class 0.000 claims description 29
- 239000011324 bead Substances 0.000 claims description 17
- 238000002834 transmittance Methods 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 12
- 229920001903 high density polyethylene Polymers 0.000 claims description 10
- 239000004700 high-density polyethylene Substances 0.000 claims description 10
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 229920001684 low density polyethylene Polymers 0.000 claims description 9
- 239000004702 low-density polyethylene Substances 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 229920006026 co-polymeric resin Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 claims description 5
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000000088 plastic resin Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 19
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 229920000573 polyethylene Polymers 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920003355 Novatec® Polymers 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- 229920005497 Acrypet® Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000004605 External Lubricant Substances 0.000 description 1
- 239000004610 Internal Lubricant Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- SFBTTWXNCQVIEC-UHFFFAOYSA-N o-Vinylanisole Chemical compound COC1=CC=CC=C1C=C SFBTTWXNCQVIEC-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005553 polystyrene-acrylate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/14—Copolymers of styrene with unsaturated esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
本発明は、照明カバーやディスプレイなど光拡散用途に広く用いられる光拡散板用樹脂組成物及び光拡散板に関する。 The present invention relates to a resin composition for a light diffusing plate and a light diffusing plate that are widely used for light diffusing applications such as lighting covers and displays.
ポリカーボネート樹脂やアクリル樹脂など透明性樹脂は光拡散性を有する拡散剤を添加し、シート若しくは板状に加工することで、均一な輝度面が得られることから、照明カバー、内部照明式看板、透過型ディスプレイなどの用途に広く用いられている。特に近年では、液晶ディスプレイあるいは液晶テレビの直下型バックライト用の面光源体として光拡散用途の需要は大きく伸びている。 Transparent resin such as polycarbonate resin and acrylic resin can be obtained by adding a light diffusing agent and processing it into a sheet or plate shape to obtain a uniform luminance surface. Widely used in applications such as mold displays. In particular, in recent years, the demand for light diffusing applications as a surface light source body for a direct backlight of a liquid crystal display or a liquid crystal television has greatly increased.
上記の光拡散機能を好適に発現させるためには、光線をできる限り直進させることなく散乱させるとともに、できる限り光透過損失を抑えることが求められる。 In order to make the above light diffusing function appear appropriately, it is required to scatter the light ray without making it travel as straight as possible and to suppress the light transmission loss as much as possible.
このような要求特性を発現させるために、光拡散板は、従来、透明性樹脂に炭酸カルシウム、硫酸バリウム、酸化チタン、酸化ケイ素、タルク、マイカ、水酸化アルミニウム、酸化マグネシウムなどの無機系粒子を添加する方法が提案されている。また、有機系ビーズとしてスチレン系重合体粒子、アクリル系重合体粒子、シロキサン系重合体粒子などの部分的に架橋したポリマー微粒子を添加する方法、あるいはこれらを併用する方法によって光を散乱させる手法が提案されている(特許文献1)。 In order to express such required characteristics, the light diffusing plate has conventionally used inorganic particles such as calcium carbonate, barium sulfate, titanium oxide, silicon oxide, talc, mica, aluminum hydroxide, and magnesium oxide in a transparent resin. A method of adding is proposed. In addition, there is a method of scattering light by adding partially crosslinked polymer fine particles such as styrene polymer particles, acrylic polymer particles, siloxane polymer particles, etc. as organic beads, or by using these in combination. It has been proposed (Patent Document 1).
また、均一な輝度になるような拡散性、優れた透明性を持ち、明るい拡散光の得られる光拡散シートを作製するために、マトリックス相となるアクリル系樹脂やスチレン系樹脂などの透明な樹脂に、マトリックス相樹脂との親和性が良好な分散相としてメタアクリル酸エステル系樹脂、非晶質環状オレフィン系樹脂などのポリマーを高温・高圧下にて一旦相溶させ、常温・常圧下にて相分離させてサブミクロンオーダーの微細な海島構造を形成させる方法が提案されている(特許文献2、3、4、5)。 In addition, in order to produce a light diffusion sheet that has a diffusibility that achieves uniform brightness, excellent transparency, and provides bright diffused light, a transparent resin such as an acrylic resin or styrene resin that forms the matrix phase In addition, a polymer such as a methacrylic ester resin or amorphous cyclic olefin resin as a dispersed phase having a good affinity with the matrix phase resin is once dissolved at a high temperature and a high pressure, and then at a normal temperature and a normal pressure. A method for forming a fine sea-island structure on the order of submicron by phase separation has been proposed (Patent Documents 2, 3, 4, 5).
更に、屈折率の異なるポリマーの組合せを用いて、フィルムを延伸し、アスペクト比を大きくすることで効率的に光拡散性を向上させる方法が提案されている(特許文献6)。 Furthermore, there has been proposed a method for efficiently improving light diffusivity by stretching a film using a combination of polymers having different refractive indexes and increasing an aspect ratio (Patent Document 6).
液晶ディスプレイあるいは液晶テレビは近年大画面化が進み、これに伴ってバックライト用拡散板も大型化している。このため、比重の大きな無機系粒子を使用する場合は重量が増加し、また有機系ビーズと比較して性能が劣ること、更には加工時に無機物特有の硬さのため加工装置が磨耗するなどの問題があることから、現在では有機系ビーズを用いた材料に置き換わってきている。 In recent years, liquid crystal displays or liquid crystal televisions have become larger in screen size, and accordingly, a backlight diffusion plate is also enlarged. For this reason, when inorganic particles having a large specific gravity are used, the weight increases, the performance is inferior compared to organic beads, and the processing equipment wears due to the hardness specific to inorganic materials during processing. Due to the problems, they are now being replaced by materials using organic beads.
また、有機系ビーズは懸濁重合などによって微粒子を架橋反応によって合成するため、粒度分布が比較的揃っており、粒子径の品揃えも豊富であることから、光拡散性材料の添加剤として主流となっている。しかしながら、より高輝度化を達成するためには粒子径が8μm以上のビーズを多量に添加する必要があり、分散粒子の二次凝集による機械的強度の低下の問題や大幅なコストアップになるといった問題がある。 In addition, organic beads synthesize fine particles by a cross-linking reaction such as suspension polymerization, so they have a relatively uniform particle size distribution and a wide range of particle sizes, so they are the mainstream additive for light diffusing materials. It has become. However, in order to achieve higher brightness, it is necessary to add a large amount of beads having a particle diameter of 8 μm or more, resulting in a problem of a decrease in mechanical strength due to secondary aggregation of dispersed particles and a significant increase in cost. There's a problem.
また、5〜200μmの薄いフィルム用途で溶融粘度の違いにより5μm前後の分散粒子を形成する方法が提案されているが、この方法では0.1μm〜0.5μmの微粒子の生成が避けられず、この粒子径範囲での紫外線付近の波長をもった光の吸収が大きく、大幅に全光線透過率は低下し、結果として拡散性能は大幅に低下する。 In addition, although a method for forming dispersed particles of around 5 μm due to a difference in melt viscosity in a thin film application of 5 to 200 μm has been proposed, this method inevitably generates fine particles of 0.1 μm to 0.5 μm, Absorption of light having a wavelength in the vicinity of ultraviolet rays in this particle size range is large, and the total light transmittance is greatly reduced, with the result that the diffusion performance is greatly reduced.
更に、高温・高圧下で相溶し、常温・常圧下で非相溶系のポリマーの組合せによって微粒子を生成させて拡散性能を発現させる手法が提案されているが、この方法でも同様に0.5μm以下の微粒子が生成するため、光透過性が大幅に低下し、光拡散性能としては不十分である。 Furthermore, a technique has been proposed in which fine particles are produced by a combination of polymers that are compatible at high temperature and high pressure, and incompatible polymers at normal temperature and normal pressure. Since the following fine particles are generated, the light transmittance is greatly reduced, and the light diffusion performance is insufficient.
また、屈折率の異なるポリマー組成物を押出シートによって延伸させ、アスペクト比を大きくして拡散効率を高くする手法が提案されているが、この方法では意図的に延伸によって分散粒子を引き伸ばすため、短径側の0.5μm以下の比率が増加し、光透過性が著しく低下するため、光拡散性能としては不十分である。 In addition, a technique has been proposed in which polymer compositions having different refractive indexes are stretched by an extruded sheet to increase the diffusion efficiency by increasing the aspect ratio. Since the ratio of 0.5 μm or less on the diameter side increases and the light transmittance is remarkably lowered, the light diffusion performance is insufficient.
更に、ポリメタクリル酸メチル及びポリカーボネート系の材料は吸湿の問題があり、大型化が進むに従い反りの問題が大きくなる。また、ポリカーボネート系樹脂は、アクリル系樹脂やスチレン系樹脂と比較して高価であるといった問題がある。 Furthermore, polymethyl methacrylate and polycarbonate-based materials have a problem of moisture absorption, and the problem of warpage increases as the size increases. Further, the polycarbonate resin has a problem that it is more expensive than an acrylic resin or a styrene resin.
本発明は、上記の課題に鑑みてなされたものであり、高輝度、高光拡散性、軽量、高強度の光拡散性を有し、且つ低吸湿で反りが発生し難い光拡散板及びそれに使用される樹脂組成物を提供することを目的とする。 The present invention has been made in view of the above problems, and has a high brightness, high light diffusibility, light weight, high strength light diffusibility, and low moisture absorption and hardly causes warping, and a light diffusion plate used therefor An object of the present invention is to provide a resin composition.
本発明者は、鋭意検討した結果、マトリックス樹脂相と混ざることのない特定の樹脂を分散相として溶融混合することによって、0.5μm以下の低粒子径の分散相生成を抑え、安定した粒子径を有する分散相を形成させることによって光拡散性能が優れる拡散板が得られることを見出し、本発明を完成するに至った。 As a result of diligent study, the present inventor has suppressed the generation of a dispersed phase having a low particle diameter of 0.5 μm or less and stable particle diameter by melt-mixing a specific resin not mixed with the matrix resin phase as a dispersed phase. The present inventors have found that a diffuser plate having excellent light diffusion performance can be obtained by forming a dispersed phase having the above, and the present invention has been completed.
本発明は、マトリックス相を形成する熱可塑性樹脂(A)と、熱可塑性樹脂(A)と溶け合うことのない完全非相溶系の熱可塑性樹脂からなる分散相を形成する分散相樹脂(B)1種類以上を溶融混合してなる樹脂組成物であって、0.1Hzでの剪断粘度/1Hzでの剪断粘度で表される分散相樹脂(B)の剪断粘度の粘度比率が3〜6の範囲にあり、熱可塑性樹脂(A)と分散相樹脂(B)の割合が熱可塑性樹脂(A)100重量部に対し分散相樹脂(B)0.2〜10重量部の範囲にあること、且つ分散相の算術平均粒子径が0.8〜500μmの範囲にあることを特徴とする光拡散板用樹脂組成物である。 The present invention relates to a dispersed phase resin (B) 1 that forms a dispersed phase comprising a thermoplastic resin (A) that forms a matrix phase and a completely incompatible thermoplastic resin that does not dissolve in the thermoplastic resin (A). A resin composition obtained by melt-mixing at least two types, wherein the viscosity ratio of the shear viscosity of the dispersed phase resin (B) expressed by the shear viscosity at 0.1 Hz / 1 the shear viscosity at 1 Hz is in the range of 3-6 The ratio of the thermoplastic resin (A) and the dispersed phase resin (B) is in the range of 0.2 to 10 parts by weight of the dispersed phase resin (B) with respect to 100 parts by weight of the thermoplastic resin (A), and An arithmetic average particle size of the dispersed phase is in the range of 0.8 to 500 μm .
また、本発明は、熱可塑性樹脂(A)が、芳香族ビニル樹脂又は芳香族ビニル化合物と不飽和カルボン酸エステル化合物を共重合して得られる共重合樹脂からなり、不飽和カルボン酸エステル化合物単位の含有量が0〜60重量%で、重量平均分子量が100,000〜400,000である上記の光拡散板用樹脂組成物である。ここで、熱可塑性樹脂(A)としては、ポリスチレン又はスチレン-メタクリル酸メチル共重合樹脂が好ましく、分散相樹脂(B)としては、その少なくとも一部が、重量平均分子量が100,000以上の高分子量の高密度ポリエチレン又は重量平均分子量が80,000以上の低密度ポリエチレンが好ましく例示される。 Further, the present invention, the thermoplastic resin (A) comprises an aromatic vinyl resin or a copolymer resin obtained by copolymerizing an aromatic vinyl compound and an unsaturated carboxylic acid ester compound, the unsaturated carboxylic acid ester compound unit Is a resin composition for a light diffusing plate having a weight average molecular weight of 100,000 to 400,000. Here, as the thermoplastic resin (A), polystyrene or styrene-methyl methacrylate copolymer resin is preferable, and as the dispersed phase resin (B), at least a part of the thermoplastic resin (B) has a high weight average molecular weight of 100,000 or more. Preferred examples include high-density polyethylene having a molecular weight or low-density polyethylene having a weight average molecular weight of 80,000 or more.
更に、本発明は、上記の樹脂組成物を成形して得られる光拡散板において、0.5μm以下の粒子径をもつ分散相樹脂(B)の割合が、分散相の粒度分布換算で5.0%以下であり、且つ板の厚さが0.5〜5mmであることを特徴とする光拡散板である。ここで、上記光拡散板が次のいずれか1以上を満足するとより優れた性能を与える。1)吸水率が、0.3%以下であること、2)2mm厚での全光線透過率を80%としたときのヘイズが、70%以上であること、又は、3)上記の樹脂組成物中の樹脂100重量部に、1.0〜100μmの平均粒子径を有する有機系架橋ビーズ又は無機系ビーズを1種以上、0.001〜10重量部配合してなること。 Furthermore, according to the present invention, in the light diffusion plate obtained by molding the above resin composition, the proportion of the dispersed phase resin (B) having a particle size of 0.5 μm or less is 5. The light diffusing plate has a thickness of 0 to 5% and a plate thickness of 0.5 to 5 mm. Here, when the light diffusing plate satisfies any one or more of the following, better performance is provided. 1) The water absorption is 0.3% or less, 2) The haze is 70% or more when the total light transmittance at 2 mm thickness is 80%, or 3) The above resin composition One or more organic cross-linked beads or inorganic beads having an average particle diameter of 1.0 to 100 μm are blended with 0.001 to 10 parts by weight of 100 parts by weight of resin in the product.
本発明の光拡散板用樹脂組成物は、マトリックス相を形成する熱可塑性樹脂( A)に、分散相を形成する分散相樹脂(B)が分散されてなる。 The resin composition for a light diffusing plate of the present invention is obtained by dispersing a dispersed phase resin (B) forming a dispersed phase in a thermoplastic resin (A) forming a matrix phase.
マトリックス相を形成する熱可塑性樹脂(A)は、熱可塑性樹脂であれば特に制限はないが、例えば、ポリエチレン、ポリプロピレンなどのオレフィン系樹脂、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体などの塩化ビニル系樹脂、ポリ酢酸ビニル、エチレン−酢酸ビニル共重合体などの酢酸ビニル系樹脂、ポリビニルアルコール,エチレン−ビニルアルコール共重合体などポリビニルアルコール系樹脂、ポリメタアクリル酸メチル、メタアクリル酸メチル−アクリル酸エステル共重合体などのアクリル系樹脂、ポリスチレン、スチレン−メタアクリル酸メチル共重合体、スチレン−無水マレイン酸共重合体などのホモポリマー又はコポリマーや変性ポリマー、ゴム変性スチレン系樹脂などのスチレン系樹脂、ポリアルキレンテレフタレートなどのポリエステル系樹脂、ナイロン6、ナイロン66などのポリアミド系樹脂、ポリカーボネート樹脂などを挙げることができる。なお、熱可塑性樹脂(A)は、相互に完全相溶する樹脂であれば、複数の樹脂からなっていてもよい。 The thermoplastic resin (A) forming the matrix phase is not particularly limited as long as it is a thermoplastic resin, but examples thereof include olefin resins such as polyethylene and polypropylene, polyvinyl chloride, and vinyl chloride-vinyl acetate copolymers. Vinyl chloride resins, polyvinyl acetate, vinyl acetate resins such as ethylene-vinyl acetate copolymer, polyvinyl alcohol resins such as polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polymethyl methacrylate, methyl methacrylate- Acrylic resins such as acrylic acid ester copolymers, homopolymers or copolymers such as polystyrene, styrene-methyl methacrylate copolymers, styrene-maleic anhydride copolymers, and styrene such as rubber-modified styrene resins Resin, polyalkylene terephthalate Polyester resins such as nylon 6, polyamide resins such as nylon 66, and the like polycarbonate resin. The thermoplastic resin (A) may be composed of a plurality of resins as long as they are completely compatible with each other.
熱可塑性樹脂(A)は、光透過性と吸湿性の観点から芳香族ビニル化合物重合体又は不飽和カルボン酸エステルと芳香族ビニル化合物を共重合して得られる共重合体(以下、MS共重合体ともいう)が好ましい。 The thermoplastic resin (A) is an aromatic vinyl compound polymer or a copolymer obtained by copolymerizing an unsaturated carboxylic acid ester and an aromatic vinyl compound from the viewpoint of light transmittance and hygroscopicity (hereinafter referred to as MS copolymer). (Also called coalescence) is preferred.
芳香族ビニル化合物重合体を与える芳香族ビニル化合物としては、スチレン、α‐メチルスチレン、p-メチルスチレン、m-メチルスチレン、o-メチルスチレン、p-メトキシスチレン、o-メトキシスチレン、p-クロロスチレン、o-クロロスチレン、4-ビニルピリジン、2-ビニルピリジンなどが挙げられる。中でも、スチレン、α‐メチルスチレンが好ましく用いられる。 Examples of aromatic vinyl compounds that give aromatic vinyl compound polymers include styrene, α-methylstyrene, p-methylstyrene, m-methylstyrene, o-methylstyrene, p-methoxystyrene, o-methoxystyrene, and p-chloro. Examples include styrene, o-chlorostyrene, 4-vinylpyridine, 2-vinylpyridine and the like. Of these, styrene and α-methylstyrene are preferably used.
MS共重合体に用いられる芳香族ビニル化合物としては、上記芳香族ビニル化合物の1種又は2種以上を用いることができる。 As the aromatic vinyl compound used in the MS copolymer, one or more of the above aromatic vinyl compounds can be used.
MS共重合体に用いる不飽和カルボン酸エステルとしては、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸イソプロピル、メタクリル酸ブチル、メタクリル酸イソブチル、メタクリル酸t-ブチル、アクリル酸メチル、アクリル酸エチル、アクリル酸イソプロピル、アクリル酸ブチル、アクリル酸イソブチル、アクリル酸t-ブチル、アクリル酸2-エチルヘキシルなどが挙げられる。このうち、好ましくはメタクリル酸メチル、メタクリル酸エチル、メタクリル酸ブチル、メタクリル酸t-ブチルであり、特に好ましくはメタクリル酸メチルである。これら不飽和カルボン酸エステル化合物は1種又は2種以上を用いることができる。 The unsaturated carboxylic acid ester used in the MS copolymer is methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, methyl acrylate, ethyl acrylate, acrylic acid Examples include isopropyl, butyl acrylate, isobutyl acrylate, t-butyl acrylate, and 2-ethylhexyl acrylate. Of these, methyl methacrylate, ethyl methacrylate, butyl methacrylate, and t-butyl methacrylate are preferable, and methyl methacrylate is particularly preferable. These unsaturated carboxylic acid ester compounds can be used alone or in combination of two or more.
MS共重合体としては、上記芳香族ビニル化合物と不飽和カルボン酸エステル化合物を共重合して得られる樹脂があるが、好ましくはスチレン-メタクリル酸メチル共重合樹脂である。また、MS共重合体中の不飽和カルボン酸エステル化合物に由来する単位の含有量は吸湿性の観点から60重量%以下が好ましい。 Examples of the MS copolymer include a resin obtained by copolymerizing the above aromatic vinyl compound and an unsaturated carboxylic acid ester compound, and a styrene-methyl methacrylate copolymer resin is preferable. Further, the content of units derived from the unsaturated carboxylic acid ester compound in the MS copolymer is preferably 60% by weight or less from the viewpoint of hygroscopicity.
熱可塑性樹脂(A)は、公知の方法により重合して製造することができる。この樹脂の重量平均分子量(Mw)は、100,000〜400,000であることが好ましい。100,000未満であると流動性が高くなり、脆くなるため加工時に割れなどが発生しやすい。 The thermoplastic resin (A) can be produced by polymerization by a known method. The weight average molecular weight (Mw) of the resin is preferably 100,000 to 400,000. If it is less than 100,000, the fluidity becomes high and becomes brittle, so that cracking or the like is likely to occur during processing.
分散相を形成する分散相樹脂(B)は、マトリックス相を形成する熱可塑性樹脂(A)と完全非相溶の熱可塑性樹脂であり、その好ましい組み合わせ熱可塑性樹脂(A)の種類によって異なる。分散相樹脂(B)は、剪断粘度の粘度比率(以下、剪断粘度比率という。)が3〜6の範囲にある。ここで、剪断粘度はずり剪断粘度と、剪断粘度比率はずり剪断粘度の粘度比率と同じ意味であるので、ずり剪断粘度又はずり剪断粘度比率ともいう。この剪断粘度比率は、分散相樹脂(B)単独について、周波数0.1Hzで測定した剪断粘度V0.1と、周波数1Hzで測定した剪断粘度V1との比(V0.1/V1)をいう。すなわち、(0.1Hzのときの剪断粘度/1Hzのときの剪断粘度)で計算される比をいう。
剪断粘度比率が3より小さいと分散粒子径が細かくなりすぎ、光を吸収することで全光線透過率が低下するので好ましくなく、6より大きいと分散粒子径が大きくなりすぎ材料強度などの機械的特性を損なうため好ましくない。具体的には剪断粘度比率が3より小さい分散相は0.5μm以下の粒子の生成が避けられず、拡散性能が低下する。The dispersed phase resin (B) that forms the dispersed phase is a thermoplastic resin (A) that forms the matrix phase and is completely incompatible with the thermoplastic resin (A), and the preferred combination of the thermoplastic resins (A) varies. The dispersed phase resin (B) has a viscosity ratio of shear viscosity (hereinafter referred to as shear viscosity ratio) in the range of 3-6. Here, since the shear viscosity shear shear viscosity and the shear viscosity ratio have the same meaning as the shear ratio, the shear viscosity is also referred to as shear shear viscosity or shear shear viscosity ratio. This shear viscosity ratio refers to the ratio (V 0.1 / V 1 ) between the shear viscosity V 0.1 measured at a frequency of 0.1 Hz and the shear viscosity V 1 measured at a frequency of 1 Hz for the dispersed phase resin (B) alone. That is, the ratio calculated by (shear viscosity at 0.1 Hz / 1 shear viscosity at 1 Hz).
If the shear viscosity ratio is smaller than 3, the dispersed particle diameter becomes too fine, and the total light transmittance is reduced by absorbing light. This is not preferable because the characteristics are impaired. Specifically, a dispersed phase having a shear viscosity ratio of less than 3 inevitably generates particles of 0.5 μm or less, and the diffusion performance is lowered.
分散相樹脂(B)は、熱可塑性樹脂(A)とは完全に非相溶である熱可塑性樹脂(A)と異なる熱可塑性樹脂であり、分散相樹脂(B)を単独で測定したずり剪断粘度比が3〜6の範囲にある。分散相樹脂(B)としては、屈折率差、吸水性、非相溶性の観点から、例えば熱可塑性樹脂(A)が芳香族ビニル化合物又はMS共重合体である場合、ポリオレフィン系樹脂が好ましい。 The dispersed phase resin (B) is a thermoplastic resin different from the thermoplastic resin (A) that is completely incompatible with the thermoplastic resin (A), and shear shear measured by measuring the dispersed phase resin (B) alone. The viscosity ratio is in the range of 3-6. As the dispersed phase resin (B), from the viewpoint of refractive index difference, water absorption, and incompatibility, for example, when the thermoplastic resin (A) is an aromatic vinyl compound or an MS copolymer, a polyolefin resin is preferable.
ポリオレフィン系樹脂としては、高分子量化が容易なポリエチレンが好ましい。直鎖状のポリエチレンである高密度ポリエチレン(HDPE)の場合、分子量(Mw)は100,000以上が好ましく、側鎖の分岐数が多い低密度ポリエチレン(LDPE)では分子量80,000以上が好ましい。HDPE及びLDPEの分子量が上記より小さいとずり剪断粘度比が3以下となり、溶融混合時での組成物が形成される際に微粒子の発生によって十分な光拡散性能が発揮できないため好ましくない。 As the polyolefin-based resin, polyethylene that can easily be increased in molecular weight is preferable. In the case of high-density polyethylene (HDPE), which is a linear polyethylene, the molecular weight (Mw) is preferably 100,000 or more, and in the case of low-density polyethylene (LDPE) having a large number of side chain branches, the molecular weight is preferably 80,000 or more. When the molecular weight of HDPE and LDPE is smaller than the above, the shear shear viscosity ratio is 3 or less, and it is not preferable because sufficient light diffusion performance cannot be exhibited due to generation of fine particles when a composition is formed during melt mixing.
分散相樹脂(B)は複数の樹脂からなってもよく、例えば、HDPE又はLDPEを2種類以上配合してなる樹脂であってもよい。この場合、相互に完全相溶する樹脂であれば、相溶した状態で上記分散相樹脂(B)の特性を備えればよい。また、相溶しない場合は、それぞれが上記分散相樹脂(B)の特性を備えるか、算術平均が上記数値の範囲にある必要がある。 The dispersed phase resin (B) may be composed of a plurality of resins, for example, a resin obtained by blending two or more types of HDPE or LDPE. In this case, as long as the resins are completely compatible with each other, the properties of the dispersed phase resin (B) may be provided in a compatible state. If they are not compatible, it is necessary that each of them has the characteristics of the above dispersed phase resin (B) or that the arithmetic average is in the above numerical range.
ポリプロピレン、直鎖状低密度ポリエチレンなどの他のポリマーも使用できるが、市販されている分子量が最も高いポリプロピレンでの剪断粘度比は3以下であり、また市販されている分子量が最も高い直鎖状低密度ポリエチレンでの剪断粘度比も3以下であり、所望の剪断粘度比を示す樹脂の入手が困難という問題が別にある。 Other polymers such as polypropylene and linear low density polyethylene can be used, but the commercially available polypropylene with the highest molecular weight has a shear viscosity ratio of 3 or less, and the linear chain with the highest molecular weight available on the market. Another problem is that it is difficult to obtain a resin having a desired shear viscosity ratio because the shear viscosity ratio of low-density polyethylene is 3 or less.
マトリックス相を形成する熱可塑性樹脂(A)と分散相樹脂(B)の配合割合は、所望される板厚、全光線透過率によって異なるが、例えば、本発明の樹脂組成物を2mm厚の板状の試験片に加工し、その全光線透過率が78〜82%となるように定めた場合、通常、熱可塑性樹脂( A)100重量部に対し、分散相樹脂(B)0.2〜10重量部、好ましくは0.5〜5重量部の範囲である。 The blending ratio of the thermoplastic resin (A) and the dispersed phase resin (B) forming the matrix phase varies depending on the desired plate thickness and total light transmittance. For example, the resin composition of the present invention is a 2 mm thick plate. In the case where the total light transmittance is determined to be 78 to 82%, the dispersed phase resin (B) is generally 0.2 to 100 parts by weight of the thermoplastic resin (A). The amount is 10 parts by weight, preferably 0.5 to 5 parts by weight.
本発明の樹脂組成物からなる光拡散板における分散相の算術平均粒子径は、それが0.8μmより低下した場合、0.5μm以下の微粒子の生成が避けられず拡散性能は大幅に低下する。また、平均粒子径が500μmを超えた場合は、材料強度などの機械特性に支障がでるため好ましくない。更に、平均粒子径が0.5μm以下の粒子径を持つ分散相樹脂(B)の割合が分散相の粒度分布換算で5.0%以下であることが好ましく、更には3.0%以下が好ましい。 When the arithmetic average particle size of the dispersed phase in the light diffusion plate made of the resin composition of the present invention is lower than 0.8 μm, the formation of fine particles of 0.5 μm or less is unavoidable, and the diffusion performance is greatly reduced. . Moreover, when the average particle diameter exceeds 500 μm, it is not preferable because mechanical properties such as material strength are hindered. Furthermore, the proportion of the dispersed phase resin (B) having an average particle size of 0.5 μm or less is preferably 5.0% or less in terms of the particle size distribution of the dispersed phase, more preferably 3.0% or less. preferable.
本発明の光拡散板は、2mm厚の板状の試験片に加工したときの全光線透過率が78〜82%、好ましくは79〜81%になるように調整し、80%とした時のヘイズは70%以上、好ましくは80%以上であることがよい。ヘイズが70%未満の場合、最終的に所望の全光線透過率に調整した際、バックライト光源から発した透過光にムラが生じやすい。なお、全光線透過率は、樹脂組成物に添加する分散相樹脂(B)の量やその屈折率と分散粒子径によって異なるので、これらを調整することにより制御される。また拡散板に要求される全光線透過率が異なる場合は、分散相樹脂(B)の量等はそれによっても変化する。 The light diffusing plate of the present invention is adjusted so that the total light transmittance is 78 to 82%, preferably 79 to 81% when processed into a 2 mm thick plate-like test piece, and 80%. The haze is 70% or more, preferably 80% or more. When the haze is less than 70%, unevenness tends to occur in the transmitted light emitted from the backlight source when the desired total light transmittance is finally adjusted. The total light transmittance varies depending on the amount of the dispersed phase resin (B) added to the resin composition, its refractive index and the dispersed particle diameter, and is controlled by adjusting these. Further, when the total light transmittance required for the diffusion plate is different, the amount of the dispersed phase resin (B) and the like change accordingly.
本発明の光拡散板は、光源からの光照射により拡散板自体の温度が上昇し、光照射側とその裏面の透過側での吸水膨張の差によって拡散板の反りが生じやすいため、低吸湿の材料であることが好ましい。光拡散板に要求される吸水率は、光拡散板の大きさによって異なるが、例えば15インチ以上の中型・大型光拡散板であれば、吸水率は0.3%以下が好ましく、更に好ましくは0.25%以下である。 The light diffusing plate of the present invention has a low moisture absorption because the temperature of the diffusing plate itself increases due to light irradiation from the light source, and the diffusing plate tends to warp due to the difference in water absorption between the light irradiation side and the transmission side of the back surface. It is preferable that it is material. The water absorption required for the light diffusing plate varies depending on the size of the light diffusing plate. For example, if it is a medium or large light diffusing plate of 15 inches or more, the water absorption is preferably 0.3% or less, more preferably It is 0.25% or less.
本発明の樹脂組成物は上記熱可塑性樹脂(A)と分散相樹脂(B)のみからなる場合であっても、これを成形して得られる光拡散板は、単独で高輝度、高拡散性を有することができる。しかし、本発明の樹脂組成物は、必要に応じて第三成分として、ポリアミド系樹脂、ポリエステル系樹脂、ポリオレフィン系樹脂、不飽和カルボン酸エステル化合物系樹脂などからなる有機系拡散剤や無機系の拡散剤を含有してもよい。
また、樹脂組成物中の樹脂100重量部に、1.0〜100μmの平均粒子径を有する有機系架橋ビーズ又は無機系ビーズを1種以上、0.001〜10重量部配合することも好ましい。Even if the resin composition of the present invention is composed only of the thermoplastic resin (A) and the dispersed phase resin (B), the light diffusion plate obtained by molding the resin is high brightness and high diffusibility alone. Can have. However, the resin composition of the present invention may contain an organic diffusing agent or an inorganic resin comprising a polyamide resin, a polyester resin, a polyolefin resin, an unsaturated carboxylic acid ester compound resin, etc. A diffusing agent may be contained.
Moreover, it is also preferable to mix 0.001 to 10 parts by weight of one or more organic crosslinked beads or inorganic beads having an average particle diameter of 1.0 to 100 μm with 100 parts by weight of the resin in the resin composition.
更に、樹脂組成物には、必要に応じて、本発明の目的を損なわない範囲で、紫外線吸収剤、酸化防止剤、熱安定剤、着色剤、可塑剤、離型剤、帯電防止剤、耐候助剤、内部潤滑剤、外部潤滑剤、帯電防止剤、難燃剤、光安定剤、蛍光増白剤等の添加剤を1種又は2種以上含有してもよい。 Furthermore, the resin composition may include an ultraviolet absorber, an antioxidant, a heat stabilizer, a colorant, a plasticizer, a release agent, an antistatic agent, a weather resistance, as long as the object of the present invention is not impaired. You may contain 1 type (s) or 2 or more types of additives, such as an adjuvant, an internal lubricant, an external lubricant, an antistatic agent, a flame retardant, a light stabilizer, and a fluorescent brightening agent.
また、分散相の粒子に1μm以下の粒子が含まれた場合、透過光の色が黄色味と赤味を帯びることがあるので、必要に応じて、本発明の目的を損なわない範囲で、透過光の調整剤として顔料、染料、紫外線吸収剤、赤外線吸収剤を1種又は2種以上含有してもよい。 In addition, when the dispersed phase particles contain particles of 1 μm or less, the transmitted light may be yellowish and reddish. You may contain 1 type, or 2 or more types of a pigment, dye, an ultraviolet absorber, and an infrared absorber as a light regulator.
本発明の光拡散性樹脂組成物の光拡散板への加工方法に特に制限はなく、射出成形、押出し成形、ブロー成形等により所定形状に成形することができる。 There is no restriction | limiting in particular in the processing method in particular to the light-diffusion board of the light diffusable resin composition of this invention, It can shape | mold to a predetermined shape by injection molding, extrusion molding, blow molding, etc.
本発明の光拡散板の厚みは、延伸して製造されるフィルムなどの用途は分散粒子径が小さくなり易いことから、延伸の影響が少ない0.5mm以上である。但し、生産性などを無視して、延伸せずに0.5mm以下の拡散シートを作成する場合はこの限りではない。 The thickness of the light diffusing plate of the present invention is 0.5 mm or more, which is less affected by stretching because the dispersed particle diameter tends to be small in applications such as films produced by stretching. However, this is not the case when a diffusion sheet having a thickness of 0.5 mm or less is formed without stretching, ignoring productivity and the like.
以下、実施例により本発明を具体的に説明するが、本発明はこれら実施例に限定されるものではない。
光拡散板の物性評価は、以下の方法により行なった。EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.
The physical properties of the light diffusing plate were evaluated by the following methods.
(1)全光線透過率、平行光線透過率、ヘイズ
JIS K7105のB法に準拠して行なった。但し、試験片は40mm×40mm×厚み2mmを適用した。(1) Total light transmittance, parallel light transmittance, haze It was performed in accordance with method B of JIS K7105. However, the test piece was 40 mm × 40 mm × thickness 2 mm.
(2)粒度分布
熱可塑性樹脂相(A)と混ざり合うことのない特定の分散相樹脂(B)を溶融混合して得られたサンプル2gをマトリックス相のみ溶解可能な溶媒20mlに溶解させ、(株)堀場製作所製レーザー回折/散乱式粒度分布測定装置LA−910を用いて、分散相の粒度分布の測定を行った。使用した溶媒は分散相樹脂(B)がPMMA及びアクリルビーズを添加した系ではシクロヘキサンを用い、それ以外はメチルエチルケトンを用いてマトリックス相のみを溶解させた。その後、分散相の粒度分布は体積平均径にて測定を行ない分散相樹脂(B)の算術平均粒子径とその算術標準偏差を算出した。更に0.5μm以下の粒子の存在割合はレーザー計で検出される粒子の存在頻度の積算値を用いた。(2) Particle size distribution 2 g of a sample obtained by melt-mixing a specific dispersed phase resin (B) that does not mix with the thermoplastic resin phase (A) is dissolved in 20 ml of a solvent capable of dissolving only the matrix phase. The particle size distribution of the dispersed phase was measured using a laser diffraction / scattering particle size distribution analyzer LA-910 manufactured by Horiba, Ltd. As the solvent used, cyclohexane was used in the system in which the dispersed phase resin (B) was added with PMMA and acrylic beads, and in other cases, only the matrix phase was dissolved using methyl ethyl ketone. Thereafter, the particle size distribution of the dispersed phase was measured by the volume average diameter, and the arithmetic average particle diameter and the arithmetic standard deviation of the dispersed phase resin (B) were calculated. Further, as an abundance ratio of particles of 0.5 μm or less, an integrated value of the existence frequency of particles detected by a laser meter was used.
(3)ずり剪断粘度の測定
レオロジカ インスツルメンツ製 回転型動的粘弾性測定装置 DAR−50を用いて、Φ25mm、厚さ2mmの試験片を25mmΦのパラレルプレート治具と加熱プレートで挟み、周波数0.01〜100Hzの範囲、温度240℃にてずり剪断粘度の測定を行ない、粘度が安定する周波数0.1Hzのときの剪断粘度と1Hzのときの剪断粘度比(すなわち、その傾きを算出することによって、非ニュートン流動性が比較できる)を算出した。(3) Measurement of shear shear viscosity Using DAR-50, a rotational dynamic viscoelasticity measuring device, DAR-50, made by Rheologicala Instruments, a test piece having a diameter of 25 mm and a thickness of 2 mm is sandwiched between a parallel plate jig having a diameter of 25 mm and a heating plate. The shear shear viscosity is measured in the range of 01 to 100 Hz and at a temperature of 240 ° C., and the shear viscosity ratio at the frequency of 0.1 Hz and the shear viscosity ratio at 1 Hz (that is, the slope is calculated by calculating the slope thereof). , Non-Newtonian fluidity can be compared).
(1)樹脂組成物の調製
使用した樹脂を次に示す。
スチレン‐メタクリル酸メチル共重合樹脂(MS):新日鐵化学(株) MS‐200
ポリスチレン(GPPS):東洋スチレン(株)製 G−15L
高密度ポリエチレン:日本ポリエチレン(株)HB315R Mw 200000
高密度ポリエチレン:日本ポリエチレン(株)HB111R Mw 180000
高密度ポリエチレン:日本ポリエチレン(株)HF313 Mw 100000
高密度ポリエチレン:日本ポリエチレン(株)HF560 Mw 40000
直鎖状低密度ポリエチレン:日本ポリエチレン(株)NF375 Mw 100000
低密度ポリエチレン:日本ポリエチレン(株)LF128 Mw 120000
低密度ポリエチレン:東ソー(株)ペテロセン340
ポリプロピレン(高分子量PP):日本ポリプロ(株)ノバテック EA9
ポリメチルメタクリレート(PMMA):三菱レーヨン(株)製 アクリペット VH−001
架橋アクリルビーズ:積水化成品工業(株)製 MBX−8(1) Preparation of resin composition The resin used is shown below.
Styrene-methyl methacrylate copolymer resin (MS): Nippon Steel Chemical Co., Ltd. MS-200
Polystyrene (GPPS): G-15L manufactured by Toyo Styrene Co., Ltd.
High density polyethylene: Nippon Polyethylene Corporation HB315R Mw 200000
High density polyethylene: Nippon Polyethylene Co., Ltd. HB111R Mw 180000
High density polyethylene: Nippon Polyethylene Corporation HF313 Mw 100000
High density polyethylene: Nippon Polyethylene Corporation HF560 Mw 40000
Linear low density polyethylene: Nippon Polyethylene Corporation NF375 Mw 100000
Low density polyethylene: Nippon Polyethylene Corporation LF128 Mw 120000
Low density polyethylene: Tosoh Corporation Petersen 340
Polypropylene (high molecular weight PP): Nippon Polypro Co., Ltd. Novatec EA9
Polymethylmethacrylate (PMMA): Acrypet VH-001 manufactured by Mitsubishi Rayon Co., Ltd.
Cross-linked acrylic beads: MBX-8 manufactured by Sekisui Plastics Co., Ltd.
マトリックス相となる樹脂に、分散相となる樹脂を2mm厚換算で全光線透過率が80%となるよう配合量を調整し、田辺プラスチック機械(株)製40mmΦ単軸押出機を用いて、バレル温度190〜240℃の温度条件にて溶融混練を行い、ペレット化し、熱可塑性樹脂組成物を得た。 Adjust the compounding amount so that the total light transmittance is 80% in terms of 2mm thickness, and the resin used as the dispersed phase in the matrix phase resin, using a Tanabe Plastic Machine Co., Ltd. 40mmΦ single screw extruder, Melt-kneading was performed under a temperature condition of 190 to 240 ° C. and pelletized to obtain a thermoplastic resin composition.
(2)評価用試験片の作製
日精樹脂工業(株)製小型射出成形機HM−7(69kN、シリンダー温度240℃)を用いて、40mm×40mm×2mmの試験片を作製した。(2) Preparation of test piece for evaluation Using a small injection molding machine HM-7 (69 kN, cylinder temperature 240 ° C.) manufactured by Nissei Plastic Industry Co., Ltd., a test piece of 40 mm × 40 mm × 2 mm was prepared.
実施例1
100重量部のMS-200と、2.0重量部のHB315Rを配合して、上記の樹脂組成物の調製及び評価用試験片の作製に従って、板状の試験片を得た。各種物性測定結果を表1に示す。Example 1
100 parts by weight of MS-200 and 2.0 parts by weight of HB315R were blended, and a plate-like test piece was obtained in accordance with the preparation of the resin composition and the production of the test piece for evaluation. Table 1 shows the measurement results of various physical properties.
実施例2
100重量部のMS-200と、1.7重量部のHB111Rを使用して、試験片を得た。Example 2
A test piece was obtained using 100 parts by weight of MS-200 and 1.7 parts by weight of HB111R.
実施例3
100重量部のMS-200と、1.6重量部のHF313を使用して、試験片を得た。Example 3
Test pieces were obtained using 100 parts by weight of MS-200 and 1.6 parts by weight of HF313.
実施例4
100重量部のMS-200と、1.7重量部のLF128を使用して、試験片を得た。Example 4
Test pieces were obtained using 100 parts by weight of MS-200 and 1.7 parts by weight of LF128.
実施例5
100重量部のGPPSと、2.0重量部のHB315Rを使用して、試験片を得た。Example 5
A test piece was obtained using 100 parts by weight of GPPS and 2.0 parts by weight of HB315R.
実施例6
100重量部のMS-200と、1.0重量部のHB315Rを使用し、更に0.8重量部の8μmの架橋アクリルビーズを配合して、実施例1と同様にして樹脂組成物を得て、次に試験片を得た。Example 6
Using 100 parts by weight of MS-200 and 1.0 part by weight of HB315R, and further blending 0.8 parts by weight of 8 μm cross-linked acrylic beads, a resin composition was obtained in the same manner as in Example 1. Next, a test piece was obtained.
比較例1
100重量部のMS-200と、0.5重量部のHF560を使用して、実施例1と同様にして樹脂組成物を得て、次に試験片を得た。Comparative Example 1
Using 100 parts by weight of MS-200 and 0.5 part by weight of HF560, a resin composition was obtained in the same manner as in Example 1, and then a test piece was obtained.
比較例2
100重量部のMS-200と、1.6重量部のNF375を使用して、試験片を得た。Comparative Example 2
Test pieces were obtained using 100 parts by weight of MS-200 and 1.6 parts by weight of NF375.
比較例3
100重量部のMS-200と、0.18重量部のノバテックEA9を使用して、試験片を得た。Comparative Example 3
Test pieces were obtained using 100 parts by weight of MS-200 and 0.18 parts by weight of Novatec EA9.
比較例4
100重量部のMS-200と、0.36重量部のVH−001を使用して、試験片を得た。Comparative Example 4
Test pieces were obtained using 100 parts by weight of MS-200 and 0.36 parts by weight of VH-001.
参考例1
100重量部のMS-200と、1.55重量部の8μmの架橋アクリルビーズを使用して、実施例1と同様にして樹脂組成物を得て、次に試験片を得た。Reference example 1
Using 100 parts by weight of MS-200 and 1.55 parts by weight of 8 μm crosslinked acrylic beads, a resin composition was obtained in the same manner as in Example 1, and then a test piece was obtained.
測定結果を表1〜2にまとめて示す。剪断粘度比は分散相となる樹脂の数値である(ビーズを使用した場合は、ビーズを除く)。また、0.5μm以下粒子(%)は、分散相の粒度分布換算で求めた数値である。表中、N.D.は非検出を示す。 The measurement results are summarized in Tables 1 and 2. The shear viscosity ratio is a numerical value of the resin to be a dispersed phase (excluding beads when beads are used). Moreover, 0.5 micrometer or less particle | grains (%) is the numerical value calculated | required by the particle size distribution conversion of the dispersed phase. In the table, N.D. indicates non-detection.
表1及び2から、実施例の試験片は、全光線透過率約80%のときのヘイズが約90%で極めて拡散性が高く、且つ0.5μm以下の分散粒子の数は非検出(N.D.)であることが分かる。また、比較例の試験片は、ヘイズは10〜50%と拡散性能が非常に低く、且つ0.5μm以下の分散粒子の数は5%以上であることが分かる。 From Tables 1 and 2, the test piece of the example has a haze of about 90% when the total light transmittance is about 80%, extremely high diffusibility, and the number of dispersed particles of 0.5 μm or less is not detected (ND ). Moreover, the test piece of a comparative example shows that the haze is very low as 10 to 50%, and the number of dispersed particles of 0.5 μm or less is 5% or more.
本発明に係る光拡散性樹脂組成物は、熱可塑性樹脂相(A)と混ざり合うことのない特定の分散相樹脂(B)を使用することで、0.5μm以下の微粒子の生成が極めて少ない安定した分散相粒子を形成させることができ、効率的に光拡散性機能を発現した材料を提供することができる。 The light diffusing resin composition according to the present invention uses the specific dispersed phase resin (B) that does not mix with the thermoplastic resin phase (A), so that the generation of fine particles of 0.5 μm or less is extremely small. A stable dispersed phase particle can be formed, and a material that efficiently expresses a light diffusing function can be provided.
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