JP4968139B2 - Insect-type flying toy wing and insect-type flying toy equipped with the wing - Google Patents

Description

  The present invention relates to an insect-type flying toy and a wing used for an insect-type flying toy, and more particularly, to a wing that imitates an insect wing vein and an insect-type flying toy provided with the wing.

Insect wings have a thin thickness of several μm, and the thickness of the veins to be patterned is 10 to 1000 μm.
Insect wings for traditional models use materials such as cloth and synthetic resin sheets, and the appearance of the insects resembles the shape of the insects by printing a vein pattern on the cloth sheets. Was forming. However, these wing bodies resemble the pattern as a whole, but the thickness of the wing bodies themselves is on the order of mm, and there has been no reproduction of insect wings with a thickness of several μm.
In addition, a conventional insect wing for a model uses a thin sheet material such as a metal, a synthetic resin, or a cloth having a thickness of about 1 mm. Then, the wing body is formed by pasting the sheet material on a bone frame formed of metal, synthetic resin, wood, or the like to resemble an insect vein.

  For example, an insect model described in Patent Document 1 includes a wing body that imitates a pair of butterflies on a main body in the shape of a beetle such as a beetle, and an insect that does not actually exist is configured as a model. The wing body is made of a vinyl chloride plate having a thickness of about 0.5 mm.

On the other hand, in recent years, with the development of measurement technology and simulation technology, research to accurately measure the shape of insect wings, research on wing strength when wings are blown, and aerodynamic influences around wings have been reported Has been.
Further, in the semiconductor manufacturing technology, LSI is manufactured by nano-order measurement technology and processing technology. Research to produce minute structures, machine parts, and the like using these technologies has been conducted, called micromachine (MEMS), and research and development has been conducted.
Research on insect wing measurement technology and simulation technology has been reported (see Non-Patent Document 1).
In addition, it has been proposed that there is rotational circulation and wake capture other than stall delay in fly hovering using an enlarged fly model (see Non-Patent Document 2).
In addition, the mechanism of the swimming of minute creatures was elucidated, and it was proposed that wing cross sections with very thin and jagged edges would be used for insect-sized flying, and that this shape of wing was superior in insect size (See Non-Patent Document 3).
Further, hydrodynamic analysis is also performed by a simulation technique (see Non-Patent Document 4).
In addition, simulation of the flapping of butterflies is also performed (see Non-Patent Document 5).

Utility model registration No. 3119367 "Leading-edge vortices in insect flight" (Ellington C.P et al., Nature, vol.384, pp626-630 1996) "Wing Rotation and the Aerodynamic Basis of Insect Flight", (Dickinson et al., 18 JUNE 1999 VOL284 SCIENCE) "Airfoil section characteristics at a low Reynolds number", (Sunada, S. and Kawachi,: Journal of fluids enginieering.1997 March, VOL.284 SCIENCE) "Simulation of biological flight and small flying object" (Liu Hiroshi, JSME Journal of Computational Fluid Dynamics, Vol. 12, No. 3, January 2005, pp.139-142) “Aiming at the realization of a small flapping robot” (Kouo Kikuchi, JSME Journal of Computational Fluid Dynamics, Vol. 12, No. 3, January 2005, pp.113-122)

  However, when constructing a wing body using sheet material, the thickness of the thickest part of the insect moth and the thickness of the sheet material may be the same, but the sheet material is less than the thin part of the insect moth. It was clearly thick. In addition, since the wing frame is thicker than the sheet material, it is difficult to say that the shape of the insect wing is accurately reproduced.

In addition, in order to reproduce a wing body that is exactly the same size as an insect wing, it is necessary to measure and manufacture the shape and size of the insect wing with an accuracy of μm. In order to reproduce a wing that looks exactly the same in appearance, high precision of the order of several μm is required with a thin-film structure, and it has been difficult to produce a wing that looks exactly like an insect wing with conventional machine tools.
Because of the above, the conventional insect model wings are generally designed for decoration and display purposes. The wings are attached to the insect model and allowed to fly and fly. There was no insect-like wing that assumed an insect model.

  In addition, research and development of micromachines (MEMS) for manufacturing minute structures, machine parts, and the like using semiconductor manufacturing technology are being conducted. However, what has been reported in research and development of micromachines is mostly micro actuators, optical parts, mechanical parts, fuel cell electrodes, etc., and produces wings that look exactly like the appearance used for insect models. There were no reported cases.

  In view of the above problems, an object of the present invention is to provide a wing body of an insect flying toy in which the thickness, pattern, etc. of an insect wing are exactly the same, and an insect flying toy flying by providing the wing body.

In order to solve the above-mentioned problem, the present invention comprises a wafer-like silicon substrate having a thickness of 1000 μm or less and made of polycrystalline Si, single crystal Si or SiC, and has an external shape imitating an insect's wing and etching the surface. A wing body of an insect-type flying toy characterized in that a concavo-convex pattern imitating the insect vein was formed by treatment.
Therefore, it is possible to obtain a wing body having a convex portion having a thickness substantially the same as the thickness of the vein of the insect wing and a concave portion having a thickness smaller than the convex portion.

  Here, what coat | covered the single side | surface or both surfaces with the polymer protective film is preferable.

  In addition, it is preferable that the etching is performed by patterning using a photomask for exposure created based on data obtained by measuring the uneven shape of the actual vein of the insect.

  The present invention also provides an insect-type flying toy provided with a plurality of the above wing bodies.

  The wing body of the insect-type flying toy according to the present invention as described above has a convex portion that is substantially the same as the thickness of the insect wing vein, and further, the surface of the silicon substrate is etched to form a concave portion. A wing body having the same shape and thickness as the above can be obtained.

  Moreover, since one side or both sides were coat | covered with the polymer protective film, joining strength with the drive member which performs a flapping operation | movement can be raised. In addition, the strength of the wing body covered with the polymer protective film can be increased.

  In addition, since the etching is patterned using an exposure photomask created based on data obtained by measuring the concave and convex shape of the actual insect vein of the insect, a wing body having a pattern similar to that of the insect vein is formed. it can.

  Since a plurality of wing bodies as described above are provided, a realistic insect type flying toy can be obtained.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram showing an overall configuration of an insect-type flying toy according to the present invention. FIGS. 1 and 2 show typical embodiments. In the figure, reference numeral 1 is an insect-type flying toy, 2 is a wing body, A support shaft, 4 is a swing support shaft, 5 is a first connection arm, 6 is a second connection arm, 7 is a driving means, 8 is a crank portion, and 9 is a main body.

  In the following description, a dragonfly-type flying toy will be described as an insect-type flying toy, but other insect shapes may be imitated. For example, a flying toy that performs a flapping operation simulating the shape of a bee, moth, butterfly, moth, moth, or the like may be used.

  As shown in FIG. 2, the wing body 2 of the insect-type flying toy of the present invention comprises a silicon substrate 15 (see FIG. 5) of Si or Si compound having a thickness of 1000 μm or less and has an external shape imitating an insect wing. In addition, the surface is etched to form a concavo-convex pattern 10 that imitates the insect's vein, imitating the shape and vein of an actual insect's cage and flying as a flying toy In addition to enjoyment, you can appreciate and enjoy the realistic shapes of insects even when you are not flying.

FIG. 1 shows an insect-type flying toy 1 provided with a wing body 2 according to the present invention. A long dragonfly body 9 in the front and rear is provided with two pairs of wing bodies 2a, 2a, 2b and 2b in the front and rear. The wing body 2 is provided with a swing support shaft 4 and supported by the support shaft 3 so as to be swingable. The wing body 2 swings by a first connecting arm 5 connected to the swing support shaft 4 and a second connection arm 6 connected rearward from the swing support shaft 4 to perform a flapping operation. One end side of the first connection arm 5 is connected to the swing support shaft 4, the other end side is pivotally supported by the crank portion 8, one end side of the second connection arm 6 is connected to the wing body 2, and the other Since the end side is pivotally supported by the crank portion 8, the wing body 2 can be flapped by rotating the crank portion 8 by the driving means 7. And it flies by the lift of the wing body 2 by this flapping operation.
In FIG. 1, the drive mechanism is exemplified by a dragonfly. However, as described above, other insects can be configured with the same mechanism.
In addition, in order to include what glides like a glider, the driving means 7 or the like may not be provided, and the wing body 2 may be fixed to the main body 9, or the wing body may be manually swingable.

  In the case of an insect, the width of the front wing is about 10 mm, the length is about 50 mm, the width of the back wing is about 12.4 mm, and the length is about 50 mm. Therefore, as shown in FIG. 2, the wing body 2 of the present invention has a width 13A of the front wing body 2a of 10 mm, a length 13B of 50 mm, and a width 14A of the rear wing body 2b, as shown in FIG. Is 12.4 mm and the length 14B is 50 mm. Further, the shape of the vein pattern 10 including the convex portion 10a and the concave portion 10b, the shape of the wing body 2 and the shape of the vein pattern 10 are also measured for the shape of the insect's onyamma wing and vein, and the wing body 2 is determined based on the measured data. create.

To measure the shape of insect wings, the insect wings are magnified by a microscope and recorded as digital images. Then, the unevenness of the surface of the cocoon is measured by a distance sensor or a focal depth function of a microscope while corresponding to the digital image, and the shape of the insect cocoon is made into three-dimensional data. Furthermore, based on the three-dimensional data of the insect wings, when the insect wings are attached to the insect flying toy 1 and fluttered, the stress applied to the wing body 2 and the influence of air caused by the wings are examined by simulation. The data of the wing body 2 is created. In the simulation, the simulation is performed with the attachment portion 12 and the like for attaching the wing body 2 to the flying toy 1.
This data is used when creating a photomask for exposure, as will be described later.

FIG. 3 is a cross-sectional explanatory view of the wing body 2 shown in FIG. 2. The surface of the silicon substrate 15 as shown in FIG. 5A is subjected to an etching process, and a convex portion 10 a and a concave portion 10 b imitating the vein pattern 10. And are formed.
The material of the silicon substrate 15 may be any material as long as it is an etchable Si compound such as polycrystalline Si, single crystal Si, or SiC.
The thickness of the silicon substrate 15 is preferably 1000 μm or less, and if it is thicker than this, the productivity is poor and cannot be used. Further, as will be described later, silicon substrates 15 having various thicknesses such as 100 μm to 150 μm and 300 μm can be used. However, if the thickness is too thin, the strength is insufficient, and flying by a flapping operation is impossible. In addition, when it is set as an ornamental model without performing flapping operation | movement, the thickness of less than 100 micrometers may be sufficient.

The concavo-convex pattern 10 provided on the wing body 2 is formed only on one side (upper surface in FIG. 3) as shown in FIGS. 2 and 3, but the concavo-convex pattern 10 may be formed on both sides. In this case, in addition to etching on both sides, for example, two sheets having a concavo-convex pattern 10 on one side are prepared, and the concavo-convex pattern 10 is formed on both sides by joining them so that the concavo-convex pattern is on the outside. It can also comprise as the wing | blade body 2 provided with. In FIG. 2, the concavo-convex pattern 10 is formed on almost the entire upper surface other than the attachment portion 12, but the concavo-convex pattern 10 may be formed only on a part thereof.
The concavo-convex pattern 10 imitating a vein may not be the same as an actual vein, and the number of the protrusions 10a and the recesses 10b may be increased or decreased in consideration of stress, etching ease, aesthetics, and the like related to the wing body 2. The position may be changed or the shape may be changed.

In FIG. 3, the concavo-convex pattern 10 is formed on the upper surface of the wing body 2 by an etching process, and the lower surface is covered with the polymer protective film 18 to increase the strength of the wing body 2. As the polymer protective film 18, a transparent fluororesin such as Cytop (registered trademark) is used, but other resins may be used. In particular, the transparent fluororesin is preferable because it is transparent without impairing the aesthetic appearance of the wing body 2.
By providing the polymer protective film 18 on the lower surface side of the wing body 2, that is, the surface where the oscillating support shaft 4 and the second connecting arm 6 are joined, the wing body 2 and the oscillating support shaft 4 and The bonding strength with the second connecting arm 6 can be increased. Furthermore, by increasing the bonding strength, the wing body 2 can be fluttered at a high cycle.
Further, a bonding material 19 such as silk cloth or polymer resin may be provided at the bonding portion between the swing support shaft 4 and the wing body 2 or the bonding portion between the second connecting arm 6 and the wing body 2 to increase the bonding strength. Good.
Furthermore, since a large force is applied to the front end portion 11 of the wing body 2 during the flapping operation, the polymer protective film 18 may be applied to the front end portion 11 to increase the strength.
Although not shown, the etching surface (upper surface in FIG. 3) may be covered with the polymer protective film 18 after the etching process is finished. Further, the coating with the polymer protective film 18 may not be performed.

Below, the etching process of the uneven | corrugated shape on the surface of a wing | blade body is demonstrated based on FIG.
First, as shown in FIG. 5A, a wafer-like silicon substrate 15 is prepared. The thickness of the silicon substrate 15 is related to the thickness of the completed wing body 2, but a substrate of 1000 μm or less is used.
The wafer-like silicon substrate 15 is heat-treated to form a silicon oxide film 16 (SiO ₂ film) on the upper and lower surfaces as shown in FIG. Then, as shown in FIG. 5 (c), an aluminum thin film 17 is formed by sputtering, and as shown in FIG. 5 (d), a polymer protective film 18 is applied by spin coating.
Then, as shown in FIG. 5 (e), after applying the resist solution, the data of the wing body 2 created based on the insect wing described above is used as a photomask for resist exposure. The resist film 20 is formed by performing similar patterning.
Further, the surface on which the resist film 20 is formed is etched as shown in FIG. Specifically, after the aluminum thin film 17 is etched by ICP-REI (inductively coupled reactive ion etching), the thermal oxide film 16 (SiO ₂ ) is etched by BHF (buffered hydrofluoric acid), and the silicon substrate 15 is further etched. Is etched by RIE (reactive ion etching).
Finally, as shown in FIG. 5G, the resist film 20 is removed to form the convex portions 10a and the concave portions 10b.
Thus, the etched wing body 2 is cut from the wafer-like silicon substrate 15 and attached to the insect-type flying toy 1.

As mentioned above, although the process of the etching process of the wing | blade body 2 of this invention was demonstrated, you may etch in processes other than these and may use another etching technique.
For example, the silicon substrate 15 is etched by RIE, but may be etched by ICP-REI. In addition, SiO ₂ (thermal oxide film 16) is etched by BHF, but may be etched by RIE or ICP-RIE.

Example 1
A thermal oxide film 16 (SiO ₂ ) having a thickness of 0.6 μm is formed on both surfaces of a wafer-like silicon substrate 15 having a thickness of 100 to 150 μm by a heat treatment at 1050 ° C. for about 3 hours. An aluminum thin film 17 having a thickness of 0.2 μm is formed on the surface by sputtering at 500 W for 7 minutes. Further, a 0.2 μm aluminum thin film 17 is formed on the back surface by sputtering at 500 W for 7 minutes.
Further, Cytop (registered trademark) is applied to the surface by spin coating at 2000 rpm for 20 seconds to form a polymer protective film 18.
On the back surface, a resist solution (for example, manufactured by Shipley Co., Ltd .: S1830) is applied by spin coating to a film thickness of 4 μm, and patterning simulating insect wings is performed by photolithography using a photomask for exposure. Then, the aluminum thin film 17 on the back surface is etched by ICP-RIE using Cl gas and Ar. Thereafter, the thermal oxide film 16 (SiO ₂ ) is etched with BHF.
Further, the silicon substrate 15 is removed from the rear surface to a depth of 100 μm to 150 μm by SF ₆ gas using RIE (that is, the silicon substrate 15 of 100 μm to 150 μm is removed), and the wing body 2 having the cross-sectional structure shown in FIG.
Finally, the wing body 2 is cut from the wafer-like silicon substrate 15.
In FIG. 3, the etching with the same thickness as the silicon substrate 15 is performed. However, as shown in FIG. 6A, the etching may be shallower than the thickness of the silicon substrate 15.

(Example 2)
An internal photomask constituting the wing body 2 and a removal photomask for removing the wing body 2 are prepared from the wafer-like silicon substrate 15, and etching is performed in two steps.
First, a thermal oxide film 16 (SiO ₂ ) of about 1 μm is formed on both surfaces of a wafer-like silicon substrate 15 having a thickness of 300 μm by heat treatment at 1140 ° C. for about 3 hours and 20 minutes. Cytop (registered trademark) is applied to the surface by spin coating at 2700 rpm for 20 seconds to form a four-layer film thickness of 3.0 μm to form a polymer protective film 18. On the other hand, Ti, Pt, and Ti are formed on the back surface by sputtering 400 W, 200 W, and 400 W, respectively, so as to have film thicknesses of 5 nm, 200 nm, and 10 nm, respectively.
In order to etch the removed portion of the wing body 2, a resist solution (for example, S1830 manufactured by Shipley Co., Ltd.) is applied to the silicon substrate 15 at 2500 rpm for 120 seconds, and the removed portion is exposed by photolithography using a removal photomask. To do.
The Ti / Pt / Ti thin film is removed by etching with ICP-RIE (Cl: 25, Ar: 28, degree of vacuum: 0.58 Pa, ICP: 500 W, BIAS: 125 W) for 5 minutes. Thereafter, SiO ₂ is etched with BHF to remove SiO ₂ of 1070 nm to 740 nm. Further, etching is performed for 80 to 90 minutes by RIE (SF ₆ , O ₂ , vacuum degree: 1.33 × 10 ⁴ Pa (100 tor), RF: 100 W), and the silicon substrate 15 of 70 μm to 80 μm is removed. Thereafter, the resist film 20 is removed.
Furthermore, a resist solution (for example, manufactured by Shipley Co., Ltd .: S1830) is applied to the silicon substrate 15 by spin coating at 2500 rpm for 200 to 240 seconds. Using a photomask inside the wing body, the pattern inside the wing body is exposed by photolithography, and patterning imitating insect wings is performed.
The Ti / Pt / Ti thin film is etched and removed by ICP-RIE for 5 minutes. Thereafter, SiO ₂ is etched with BHF to remove SiO ₂ of 1070 nm to 740 nm. Further, the silicon substrate 15 is removed by etching by RIE. Thereafter, the resist film 20 is removed.

(Example 3)
An internal photomask constituting the wing body 2 and a removal photomask for removing the wing body 2 are prepared from the wafer-like silicon substrate 15, and etching is performed in two steps.
First, a thermal oxide film 16 (SiO ₂ ) of about 1 μm is formed on both surfaces of a wafer-like silicon substrate 15 having a thickness of 1000 μm by heat treatment at 1140 ° C. for about 3 hours and 20 minutes. Cytop (registered trademark) is applied to the surface by spin coating at 2700 rpm for 20 seconds to form a four-layer film thickness of 3.0 μm to form a polymer protective film 18. On the back surface, Ti, Pt, and Ti are formed by sputtering 400 W, 200 W, and 400 W, respectively, so as to have film thicknesses of 5 nm, 200 nm, and 10 nm, respectively.
In order to etch the removed portion of the wing body 2, a resist solution (for example, S1830 manufactured by Shipley Co., Ltd.) is applied to the silicon substrate 15 at 2500 rpm for 120 seconds, and the removed portion is exposed by photolithography using a removal photomask. To do.
The Ti / Pt / Ti thin film is removed by etching with ICP-RIE (Cl: 25, Ar: 28, degree of vacuum: 0.58 Pa, ICP: 500 W, BIAS: 125 W) for 5 minutes. Thereafter, SiO ₂ is etched with BHF to remove SiO ₂ of 1070 nm to 740 nm. Further, etching is performed for 80 to 90 minutes by RIE (SF ₆ , O ₂ , vacuum degree: 1.33 × 10 ⁴ Pa (100 tor), RF: 100 W), and the silicon substrate 15 of 70 μm to 80 μm is removed. Thereafter, the resist film 20 is removed.
Furthermore, a resist solution (for example, manufactured by Shipley Co., Ltd .: S1830) is applied to the silicon substrate 15 by spin coating at 2500 rpm for 200 to 240 seconds. Using a photomask inside the wing body, the pattern inside the wing body is exposed by photolithography, and patterning imitating insect wings is performed.
The Ti / Pt / Ti thin film is etched and removed by ICP-RIE for 5 minutes. Thereafter, SiO ₂ is etched with BHF to remove SiO ₂ of 1070 nm to 740 nm. Further, the silicon substrate 15 is removed by etching by RIE. Thereafter, the resist film 20 is removed.

  In addition to the above, the etching to the silicon substrate 15 is stopped in stages, the hard mask is cut from the pattern, and the etching is restarted. By repeating this, as shown in FIG. 6B, the wing body 2 may be formed so that the convex portions 10a have different heights. As a result, the wing body 2 of the insect wing can be expressed more realistically, and the wing body 2 can be obtained with better aesthetics.

  Further, in FIGS. 3 to 5 and FIGS. 6A to 6B, etching is performed with RIE perpendicular to the silicon substrate 15, but a predetermined inclination with respect to the normal of the silicon substrate 15 is obtained. It may be provided and etched in an oblique direction. As a result, as shown in FIG. 6 (c), the boundary portion 21 between the convex portion 10a and the concave portion 10b is formed smoothly, and can express the wing vein of the insect wing more realistically, and has excellent aesthetics. The wing body 2 can be obtained. Moreover, since it forms smoothly from the convex part 10a lower part to the recessed part 10b, the joint strength of the convex part 10a and the recessed part 10b can also be raised.

It is explanatory drawing of an insect type | mold flight toy. (A) is a wing body on the front side of an insect type flying toy, and (b) is an explanatory view of a wing body on the back side of an insect type flying toy. It is sectional drawing of a wing body. It is sectional drawing of the wing | blade body provided with the joining material. It is a figure explaining the process of the etching process of a wing | blade body. It is sectional drawing of the wing | blade body of another Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insect type flying toy 2 Wing body 3 Support shaft 4 Oscillation support shaft 5 1st connection arm 6 2nd connection arm 7 Drive means 8 Crank part 9 Main body 10 Concavity and convexity pattern, vein pattern 10a Convex part 10b Concave part 11 Front end part 12 Attachment Part 13A Front Wing Body Width 13B Front Wing Body Length 14A Rear Wing Body Width 14B Rear Wing Body Length 15 Silicon Substrate 16 Silicon Oxide Film 17 Aluminum Thin Film 18 Polymer Protective Film 19 Bonding Material 20 Resist Film 21 Boundary

Claims (4)

Convex / concave pattern made of a wafer-like silicon substrate made of polycrystalline Si, single crystal Si, or SiC with a thickness of 1000 μm or less , having an external shape imitating an insect's wing, and imitating the insect's vein by etching the surface Insect-type flying toy wings characterized by forming   The wing body of an insect type flying toy according to claim 1, wherein one side or both sides are coated with a polymer protective film.   The wing body of an insect type flying toy according to claim 1 or 2, wherein the etching is patterned using an exposure photomask created based on data obtained by measuring an uneven shape of an actual vein of the insect. An insect-type flying toy comprising a plurality of the wing bodies according to any one of claims 1 to 3.

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