JP4959302B2 - Method for manufacturing piezoelectric vibrator - Google Patents

Description

  The present invention relates to a manufacturing method of a cylinder package type piezoelectric vibrator in which a piezoelectric vibrating piece is joined to a lead terminal, a piezoelectric vibrator manufactured by the manufacturing method, an oscillator having the same, an electronic device, and a radio timepiece.

  In recent years, a piezoelectric vibrator using a crystal or the like is used as a time source, a timing source of a control signal, a reference signal source, or the like in a mobile phone or a portable information terminal device. Various piezoelectric vibrators of this type are provided. As one of them, a cylinder package type piezoelectric vibrator formed in a cylindrical shape is known.

As shown in FIG. 27, the piezoelectric vibrator 70 includes a tuning-fork type piezoelectric vibrating piece 71, a bottomed cylindrical case 72 that houses the piezoelectric vibrating piece 71, and the piezoelectric vibrating piece 71 in the case 72. And an airtight terminal 73 that is hermetically sealed.
The hermetic terminal 73 includes an annular stem 74 made of a metal material, two lead terminals 75 arranged so as to penetrate the stem 74 and joined to both the mount electrodes 71 a of the piezoelectric vibrating piece 71, and the leads The terminal 75 and the stem 74 are integrally fixed in an insulated state, and a filler 76 that seals the inside of the case 72 is formed.
In the two lead terminals 75, a portion protruding into the case 72 is an inner lead 75a, and a portion protruding outside the case 72 is an outer lead 75b. The outer lead 75b functions as an external connection terminal.
The case 72 is press-fitted into the outer periphery of the stem 74 and is fixedly fitted. Since the press-fitting of the case 72 is performed in a vacuum atmosphere, the space surrounding the piezoelectric vibrating piece 71 in the case 72 is hermetically sealed in a vacuum state.

  In the piezoelectric vibrator 70 configured as described above, when a predetermined voltage is applied as a drive voltage to the outer leads 75b of the two lead terminals 75, a current is passed from the inner lead 75a to the piezoelectric vibrating piece 71 via the mount electrode 71a. Flowing into. Thereby, the piezoelectric vibrating piece 71 oscillates at a predetermined frequency.

The piezoelectric vibrator 70 configured as described above may be mounted by directly soldering the outer lead 75b to a circuit board or the like when mounted on various electronic devices or the like. It is mounted after the periphery is molded with resin.
As shown in FIG. 28, the piezoelectric vibrator 70 in this case includes a resin mold portion 80 in which the periphery of the case 72 is molded with a thermosetting resin such as an epoxy resin or a thermoplastic resin such as a liquid crystal polymer. The piezoelectric vibrator 70 includes a connection terminal 81 formed in a crank shape and a dummy terminal 82. One end side of the connection terminal 81 is electrically and mechanically connected to the two outer leads 75 b, and the other end side is exposed on the bottom surface side of the resin mold portion 80. Further, the dummy terminal 82 is arranged in a state where it is simply in contact with the case 72, and is exposed on the bottom surface of the resin mold portion 80, like the connection terminal 81.

  Thus, the piezoelectric vibrator 70 packaged by the resin mold part 80 can be surface-mounted when mounted on a circuit board or the like. In addition, since the case 72 is molded, it is possible to secure an insulation state with respect to the case 72 and to protect it from dust and the like, and to improve the quality.

  By the way, in order to manufacture the piezoelectric vibrator 70 having the resin mold part 80 described above, it is necessary to roughly divide three processes. That is, three steps including an airtight terminal manufacturing process for manufacturing the airtight terminal 73, a vibrator manufacturing process for attaching the piezoelectric vibrating piece 71 and the case 72 to the airtight terminal 73, and a resin molding process for molding the resin mold portion 80. It is.

Here, after manufacturing a plurality of hermetic terminals 73 from a plate-like lead frame made of a conductive material, a method of performing a vibrator manufacturing process in a state where these hermetic terminals 73 are arranged on a ceramic pallet is known ( Patent Document 1).
In this method, first, when the hermetic terminal manufacturing process is performed, a plurality of hermetic terminals 73 are formed at a time on the lead frame. The plurality of hermetic terminals 73 are separated from the lead frame and then placed side by side on a ceramic pallet. In this state, a vibrator manufacturing process for attaching the piezoelectric vibrating piece 71 and the case 72 is performed. Further, when the resin molding process is performed, the resin mold portion 80 is molded after the airtight terminals 73 with the case 72 fixed are arranged on another lead frame on which the dummy terminals 82 and the connection terminals 81 are formed. Thereby, the piezoelectric vibrator 70 having the resin mold part 80 can be manufactured.

Also known is a manufacturing method in which the above three steps are performed while continuing to use a lead frame used in manufacturing the airtight terminal 73 (see Patent Document 2).
In this method, a plurality of airtight terminals 73 are formed on the lead frame, and the dummy terminals 82 and the connection terminals 81 are simultaneously formed in advance. Next, after attaching the piezoelectric vibrating piece 71 to the airtight terminal 73, the case 72 is fixed. When fixing the case 72, the lead frame is once bent 90 degrees, and then the case 72 is inserted and fixed. This is to prevent the case 72 from interfering with the lead frame or the like when the case 72 is fixed. Then, after fixing the case 72, the lead frame is bent again by 90 degrees in the reverse direction and returned to the original position. Finally, the piezoelectric vibrator 70 can be manufactured by forming the resin mold portion 80.
According to this method, since the airtight terminal manufacturing process to the resin molding process can be manufactured in a series of flows without exchanging the lead frame, the manufacturing efficiency is excellent and the assembling accuracy can be improved.
JP 2006-211142 A JP 2006-217547 A

However, the following problems remain in the conventional method.
That is, in the method described in Patent Document 1, it is necessary to arrange a plurality of hermetic terminals 73 on the pallet after the hermetic terminal manufacturing process is completed. Therefore, time and labor are required, and efficient production cannot be performed. Moreover, it is necessary to prepare a pallet only for performing the vibrator manufacturing process, resulting in an increase in manufacturing cost. Further, since the piezoelectric vibrating piece 71 and the case 72 are fixed after the airtight terminals 73 are arranged on the pallet, an assembly error is likely to occur. For this reason, there is a concern about quality degradation.
Furthermore, when performing the resin molding process, it is necessary to prepare another lead frame, and it is necessary to arrange the airtight terminals 73 to which the case 72 is fixed on the lead frame. Therefore, the above-described problem is further repeated. There was a fear.

  On the other hand, the method disclosed in Patent Document 2 is a method that can be manufactured in a series of steps from the hermetic terminal manufacturing process to the resin molding process without replacing the lead frame. When doing so, it is necessary to bend the lead frame once and then bend it again in the opposite direction at the same point. For this reason, the plastic deformation is repeated, and there is a risk that the stress is concentrated on the lead frame and the strength is lowered. Therefore, the quality is deteriorated. In particular, with the miniaturization of the piezoelectric vibrator 70, the lead terminal 75 has a very small thickness and width. Therefore, the lead terminal 75 may be cracked or deformed.

  The present invention has been made in view of such circumstances, and an object of the present invention is to efficiently manufacture a high-quality cylinder package type piezoelectric vibrator packaged in a resin mold portion at a low cost. A piezoelectric vibrator manufacturing method, a piezoelectric vibrator manufactured by the manufacturing method, an oscillator having the piezoelectric vibrator, an electronic device, and a radio timepiece are provided.

The present invention provides the following means in order to solve the above problems.
A method of manufacturing a piezoelectric vibrator according to the present invention includes a piezoelectric vibrating piece, a case that houses the piezoelectric vibrating piece, an annular stem, and a state that penetrates the stem, with the stem interposed therebetween. A pair of lead terminals whose one end side is an inner lead electrically connected to the piezoelectric vibrating piece and whose other end side is an outer lead electrically connected to the outside, and the lead terminal and the stem are fixed. A method of manufacturing a piezoelectric vibrator having an airtight terminal that has a filler and hermetically seals the inside of the case, and an insulating resin mold portion that packages the case with the outer leads exposed. Then, a base substrate made of a conductive material is processed to form a band-shaped base, and a plurality of the pair of lead terminals are formed in a state where the outer lead is connected to one side of the base. A base substrate processing step, a stem mounting step of assembling the hermetic terminal by mounting the stem via the filler at a predetermined position of the pair of lead terminals, and connecting the inner lead and the piezoelectric vibrating piece. Piezoelectric vibrating piece connecting step, fixing the case and the airtight terminal in a state in which the piezoelectric vibrating piece is housed, and a case fixing step for sealing the inside of the case, bending a part of the outer lead, A bending step of adjusting the position of the case so that the case is substantially parallel to a virtual plane passing through the surface of the base and the outer peripheral surface of the case is not in contact with the virtual plane; Repeating the process, preparing a plurality of the bases with the case positions adjusted, fixing the plurality of bases to the mold frame, and directly fixing the cases of the bases. A base fixing step that is arranged in a line, a resin molding step that molds an insulating resin so as to embed the case and the bent outer lead, and forms the resin mold portion; and A cutting step of cutting and separating between the base and the outer lead is performed.

  In the method for manufacturing a piezoelectric vibrator according to the present invention, the base substrate processing step, the stem mounting step, the piezoelectric vibrating piece connecting step, the case fixing step, the bending step, the repeating step, the base fixing step, the resin molding step, and the cutting step are performed. By doing so, it is possible to manufacture a plurality of cylinder package type piezoelectric vibrators having a resin mold portion at a time while continuing to use the base substrate from the beginning to the end.

First, a base substrate made of a conductive material is processed while being patterned to form a strip-shaped base portion extending in one direction, and a base substrate processing step for forming a plurality of pairs of lead terminals connected to the base portion is performed. . At this time, the outer lead is formed along the base in a state where the outer lead is connected to one side of the base. In particular, since the outer lead side of the lead terminal is connected to the base, the inner lead side is a free end, and is freely accessible from the outside.
Next, a stem mounting process is performed in which an annular stem is mounted through a filler at a predetermined position of the lead terminal. Accordingly, the stem and the pair of lead terminals are fixed in a state of penetrating the stem, and the hermetic terminal can be assembled.

  Next, a piezoelectric vibrating piece connecting step for electrically and mechanically connecting the inner lead and the piezoelectric vibrating piece is performed. At this time, since the inner lead side is a free end as described above, the piezoelectric vibrating reed can be easily brought close to and connected without any restriction. Subsequently, a case fixing process is performed in which the case is covered with the piezoelectric vibrating piece and the case and the airtight terminal are fixed. Thereby, the piezoelectric vibrating piece can be sealed and sealed in the case. Also in this process, the case can be easily brought close to and fixed without any restriction as in the piezoelectric vibrating piece connecting process described above. Therefore, unlike the prior art, it is not necessary to bend the lead terminal twice at the same point just to fix the case. When this step is finished, a plurality of pairs of lead terminals to which the case is fixed are arranged along the base. In addition, since the base and the pair of lead terminals are both formed from the same base substrate, they are flat at this point.

Next, a bending process is performed in which a part of the outer lead connected to the base is bent to adjust the position of the case. As a result, the case is substantially parallel to a virtual plane passing through the surface of the base, and the outer peripheral surface is not in contact with the virtual plane. That is, when the base portion is placed on the bottom surface, the case can be lifted from the bottom surface in a state of being substantially parallel to the bottom surface.
Next, each of the above-described steps is repeated again, and a repeated step of preparing a plurality of base portions each having a plurality of pairs of lead terminals whose case positions are adjusted is performed.

After preparing a plurality of bases, a base fixing process is performed in which each base is fixed to a mold frame. At this time, the bases are fixed while being arranged so that the cases provided on the bases are arranged in a straight line. As a result, the pair of lead terminals and the case provided on each base are in a state of being aligned in the vertical direction and the horizontal direction.
Next, an insulating resin is molded so as to embed the case and the bent outer lead, and a resin molding process is performed to form a resin mold portion. In particular, since the position of the case is adjusted by the bending process, packaging can be performed in a state where the case is easily embedded in the resin mold. Further, the outer lead on the base side is exposed to the outside from the resin mold portion. And finally, the cutting process which cut | disconnects and cuts between a base and an outer lead is performed. As a result, a piezoelectric vibrator having a resin mold portion can be manufactured.

The piezoelectric vibrator manufactured in this way can vibrate the piezoelectric vibrating piece at a predetermined frequency by applying a predetermined voltage to the piezoelectric vibrating piece via the outer lead, and can generate a time source, a control signal, etc. It can be used as a timing source for In addition, since the case is packaged by the resin mold portion, it is difficult to be affected by dust and the like. Further, it can be directly mounted on a circuit board or the like and can be surface-mounted.
In particular, since the base portion obtained by processing the base substrate can be continuously used from the first step to the last step, the piezoelectric vibrator can be manufactured in a series of flows. Therefore, it is possible to perform efficient production at low cost without taking time and effort. In addition, since an assembly error is unlikely to occur during manufacturing, high quality can be achieved. Moreover, since it is not necessary to bend the lead terminal twice at the same point as in the prior art, stress concentration can be prevented, and the strength of the lead terminal can be prevented as much as possible. In this respect as well, high quality can be achieved.

  Further, the method for manufacturing a piezoelectric vibrator according to the present invention is the method for manufacturing a piezoelectric vibrator according to the present invention, wherein the protruding portion protruding outward from the other side of the base portion is formed in the base substrate processing step. A plurality of protrusions formed so as to face the lead terminals, a part of the protruding portion is bent in the same direction as the bending direction of the outer lead during the bending step, and the protruding portion is bent during the forming step. The resin mold part is formed so as to be embedded, and the base part and the protruding part are cut and separated during the cutting step.

  In the method for manufacturing a piezoelectric vibrator according to the present invention, at the time of the base substrate processing step, a pair of lead terminals is formed, and at the same time, a protruding portion that protrudes outward from the other side of the base portion is formed. deep. At this time, a plurality of protrusions are formed at the same interval as the pair of lead terminals along the base so as to face the pair of lead terminals. In the bending step, a part of the protruding portion is bent in the same direction as the bending direction of the outer lead. Accordingly, when the plurality of bases are fixed to the mold frame by the base fixing step, the protruding portion bent earlier is in a state of facing the case provided on the adjacent base. And in the case of a shaping | molding process, the resin mold part is formed so that this bent protrusion part may be embedded. And in the case of a cutting process, between a base and a protrusion part is cut | disconnected and cut | disconnected.

  As a result, a piezoelectric vibrator in which a part of the protrusion is embedded in the resin mold part can be manufactured, and a part of the protrusion can be used as a dummy terminal. In particular, since the dummy terminal is located on the opposite side of the outer lead with the case interposed therebetween, the piezoelectric vibrator sits better when the surface is mounted on a circuit board or the like, and the posture is stabilized. Therefore, it becomes easy to mount and quality can be further improved.

  The piezoelectric vibrator manufacturing method according to the present invention is the above-described piezoelectric vibrator manufacturing method according to the present invention, wherein the outer lead of one lead terminal of the pair of lead terminals is provided after the piezoelectric vibrating piece connecting step. A frequency adjusting step is performed in which a frequency is adjusted between the outer leads by applying a voltage between both outer leads while cutting and separating from the base portion.

In the method for manufacturing a piezoelectric vibrator according to the present invention, after the inner lead and the piezoelectric vibrating piece are connected, only one of the outer leads connected to the base is cut and separated from the base. . Thereby, a pair of outer leads do not conduct through the base. That is, the pair of outer leads are in a state of being conducted via the inner lead and the piezoelectric vibrating piece instead of the base portion. Therefore, the piezoelectric vibrating piece can be vibrated by applying a voltage between both outer leads. And frequency adjustment is performed according to the vibration state at this time. Thereby, the frequency of the piezoelectric vibrating piece can be adjusted within a predetermined frequency range, and a high-quality piezoelectric vibrator can be manufactured.
In particular, since the frequency adjustment can be performed reliably only by cutting one of the outer leads, this frequency adjustment process does not take time and effort.

  The method for manufacturing a piezoelectric vibrator according to the present invention is the method for manufacturing a piezoelectric vibrator according to any one of the above-described present invention, wherein the position of the filler is positioned at the predetermined position during the base substrate processing step. A positioning part is formed on the lead terminal.

  In the method for manufacturing a piezoelectric vibrator according to the present invention, the positioning portion is formed on the lead terminal during the base substrate processing step. Thus, the stem can be mounted with high accuracy at a predetermined position determined in the stem mounting step. Therefore, the mounting error of the stem can be minimized, and further improvement in quality can be achieved.

  The piezoelectric vibrator according to the present invention is manufactured by any one of the above-described piezoelectric vibrator manufacturing methods of the present invention.

  Since the piezoelectric vibrator according to the present invention is manufactured by the above-described manufacturing method, high quality and low cost can be achieved.

An oscillator according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to an integrated circuit as an oscillator.
An electronic apparatus according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to a time measuring unit.
The radio-controlled timepiece according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to a filter portion.

  According to the oscillator, electronic device, and radio timepiece according to the present invention, since the above-described piezoelectric vibrator is provided, the cost can be similarly reduced, and high quality and reliability can be improved.

According to the method for manufacturing a piezoelectric vibrator according to the present invention, a high-quality cylinder package type piezoelectric vibrator packaged with a resin mold portion can be efficiently manufactured at low cost.
Further, according to the piezoelectric vibrator according to the present invention, since it is manufactured by the above-described manufacturing method, it is possible to achieve high quality and low cost.
Furthermore, according to the oscillator, the electronic device, and the radio timepiece according to the present invention, since the above-described piezoelectric vibrator is provided, the cost can be similarly reduced, and high quality and reliability can be improved. it can.

Hereinafter, an embodiment of a piezoelectric vibrator and a method of manufacturing the piezoelectric vibrator according to the present invention will be described with reference to FIGS.
The piezoelectric vibrator 1 of the present embodiment is a cylinder package type piezoelectric vibrator, and as shown in FIGS. 1 to 5, a piezoelectric vibrating piece 2 and a case 3 in which the piezoelectric vibrating piece 2 is housed. An airtight terminal 4 for sealing the piezoelectric vibrator 1 in the case 3 and a resin mold part 5 for packaging in a state where the case 3 is embedded therein are provided.

4 and 5, the piezoelectric vibrating piece 2 is a tuning fork type vibrating piece formed of a piezoelectric material such as crystal, lithium tantalate or lithium niobate, and is arranged in parallel, with the base end side being the base portion. A pair of vibrating arm portions 2b fixed integrally to 2a, an excitation electrode (not shown) formed on the outer surface of the pair of vibrating arm portions 2b and vibrating the pair of vibrating arm portions 2b; It has the mount electrode 2c electrically connected.
The excitation electrode is an electrode that vibrates the pair of vibrating arms 2b in a direction approaching or separating from each other at a predetermined resonance frequency, and is electrically connected to the mount electrode 2c via a lead electrode (not shown). The piezoelectric vibrating reed 2 is applied with a voltage via the mount electrode 2c.

  Note that a weight metal film (not shown) for adjusting the vibration state of the pair of vibrating arms 2b so as to vibrate within a predetermined frequency range (frequency adjustment) is coated on the tips of the pair of vibrating arms 2b. By adjusting the frequency using this weight metal film, the frequency of the pair of vibrating arm portions 2b can be kept within the range of the nominal frequency of the device.

  The case 3 is formed in a bottomed cylindrical shape, and is press-fitted into an outer periphery of a stem 10 (to be described later) of the airtight terminal 4 to be fitted and fixed. The press-fitting of the case 3 is performed in a vacuum, and the space surrounding the piezoelectric vibrating piece 2 in the case 3 is kept in a vacuum.

The hermetic terminal 4 is provided with a stem 10 and an inner lead 11a that is disposed in a state of penetrating the stem 10 and one end of which is electrically connected to the mount electrode 2c of the piezoelectric vibrating piece 2 with the stem 10 interposed therebetween. The other end side has a pair of lead terminals 11 which are outer leads 11 b electrically connected to the outside, and a filler 12 for fixing the lead terminals 11 and the stem 10.
The stem 10 is made of a metal material (for example, low carbon steel (Fe), iron nickel alloy (Fe—Ni), iron nickel cobalt alloy (Fe—Ni—Co)) in an annular shape. Moreover, as a material of the filler 12, it is a borosilicate glass, for example. Note that the outer periphery of the stem 10 is coated with a plating (metal film) of the same material as that of the lead terminal 11.

The pair of lead terminals 11 are formed from a base substrate (for example, a thickness of about 0.1 mm) 20 described later, which is made of a conductive material that is the same material as the stem 10, and protrudes into the case 3. The part which has become the inner lead 11a and the part which protrudes out of the case 3 becomes the outer lead 11b. The inner lead 11a and the mount electrode 2c are electrically and mechanically connected within the case 3.
In particular, as shown in FIGS. 1 to 3, the outer lead 11 b is bent twice at a substantially right angle, and a part of the outer lead 11 b is exposed to the bottom surface of the resin mold portion 5 and protrudes outward. . Further, as shown in FIGS. 1 and 4, the outer lead 11 b is formed with a protrusion (positioning portion) 11 c at a position in contact with the filler 12. This protrusion 11c positions the attachment position of the filler 12 and the stem 10 at a predetermined position. This will be described in detail later.

  The resin mold portion 5 is molded with an insulating resin (for example, a thermosetting resin such as an epoxy resin or a thermoplastic resin such as a liquid crystal polymer), as shown in FIGS. 1 to 3. The case 3 is embedded in a state in which a part of the outer lead 11b is exposed as described above. This resin mold part 5 is formed in a substantially rectangular parallelepiped shape. In addition, as for the resin mold part 5 of this embodiment, a part by the side of the outer lead 11b is cut diagonally, and direction can be visually confirmed now.

  Moreover, the piezoelectric vibrator 1 of this embodiment is provided with the dummy terminal 13, as shown in FIG.1 and FIG.2. The dummy terminal 13 is formed from the same base substrate 20 as the lead terminal 11 and has an L-shaped cross section. The dummy terminal 13 is located on the opposite side of the outer lead 11b with the case 3 interposed therebetween, and a part of the dummy terminal 13 is exposed to the bottom surface of the resin mold portion 5 and protrudes outward, like the outer lead 11b. It has become a state. The remaining part of the dummy terminal 13 has a structure in which an appropriate gap is provided with respect to the case 3.

Here, an example of dimensions and materials of main parts constituting the piezoelectric vibrator 1 of the present embodiment will be described.
First, as a dimension example of the resin mold part 5, the total length L is about 3.0 mm to 5.0 mm, and the width W and the thickness T are about 1.0 mm to 1.5 mm. As an example of dimensions of the piezoelectric vibrating piece 2, the width is about 0.5 mm to 0.6 mm, the total length is about 1.0 mm to 3.2 mm, and the thickness is about 0.10 mm, which is the same as the base substrate. The diameter of the stem 10 is about 0.9 mm at the stage after plating.

Further, as a material for plating the stem 10 and the lead terminal 11, heat-resistant solder plating, tin copper alloy, gold-tin alloy or the like is used. In addition, the inside of the case 3 can be hermetically sealed in a vacuum state by interposing a plating on the outer periphery of the stem 10 and cold-welding the case 3 in a vacuum.
The mount electrode 2c is a laminated film of chromium (Cr) and gold (Au), and is formed by depositing a thin film of gold on the surface after forming a chromium film having good adhesion to crystal as a base. . However, the present invention is not limited to this, and for example, a gold thin film may be further laminated on the surface of a laminated film of chromium and nichrome (NiCr).

When the piezoelectric vibrator 1 configured as described above is operated, a predetermined drive voltage is applied to the outer leads 11 b of the two lead terminals 11. Thereby, a current can be passed through the excitation electrode via the inner lead 11a, the mount electrode 2c, and the extraction electrode, and the pair of vibrating arm portions 2b can be vibrated at a predetermined frequency. And it can utilize as a time source, a timing source of a control signal, a reference signal source, etc. using a vibration of a pair of vibration arm parts 2b.
In addition, since the case 3 is packaged in the resin mold portion 5, it is hardly affected by dust or the like. Moreover, since it has the resin mold part 5, it can be mounted directly on a circuit board etc. and can be surface-mounted easily. In particular, since the dummy terminal 13 is provided, the seating is improved when mounted on the surface, and the posture is stabilized. Therefore, it is easy to perform the mounting work. Moreover, since the resin mold portion 5 is cut obliquely on the outer lead 11b side, the mounting operation can be reliably performed without making a mistake in direction.

Next, a method for manufacturing the above-described piezoelectric vibrator 1 will be described below.
The manufacturing method of the piezoelectric vibrator 1 of the present embodiment includes a base substrate processing process, a stem mounting process, a piezoelectric vibrating piece connecting process, a case fixing process, a bending process, a repeating process, a base fixing process, a resin molding process, and a cutting process. This is a method of manufacturing a plurality of piezoelectric vibrators 1 at a time while continuing to use the base substrate 20 from the beginning to the end by performing in order. Each of these steps will be described in detail with reference to the flowcharts shown in FIGS.

First, the base substrate 20 made of a conductive material is processed while being patterned to form a strip-like plug lead frame (base portion) 21 extending in one direction as shown in FIGS. 9 and 10, and the plug lead A base substrate processing step for forming a plurality of pairs of lead terminals 11 connected to the frame 21 is performed.
More specifically, after preparing the flat base substrate 20 (S1), the plug lead frame 21 and the pair of lead terminals 11 are subjected to chemical processing such as pressing, laser processing or etching. Are formed (S2). At this time, the lead terminals 11 are formed so as to be arranged at predetermined intervals L along the plug lead frame 21 in a state where the outer leads 11 b are connected to one side of the plug lead frame 21. In particular, since the lead terminal 11 is connected to the outer lead 11b side, the inner lead 11a side is a free end and can be freely accessed from the outside.

  In the present embodiment, the lead terminal 11 is formed in a state where the tips of the inner leads 11a are connected to each other. By forming in this way, even if a load is applied to each lead terminal 11 during the manufacturing process, this load can be received by the two lead terminals 11. Therefore, it becomes difficult to deform | transform and it can prevent that the parallelism of a pair of lead terminal 11 falls. Further, when the lead terminal 11 is formed, as shown in FIG. 10, a protruding portion 11c for positioning the position of the filler 12 to be attached later is formed at the same time.

  Furthermore, simultaneously with the formation of the lead terminals 11, a protruding portion 22 is formed that protrudes outward from the other side of the plug lead frame 21 with a predetermined width W. The protrusions 22 will later become dummy terminals 13, and a plurality of protrusions 22 are formed at the same interval L as the pair of lead terminals 11 along the plug lead frame 21 so as to face the pair of lead terminals 11. At this point, the base substrate processing step is finished.

  Next, a stem mounting step of mounting the stem 10 at a predetermined position of the lead terminal 11 through the filler 12 is performed. This process will be specifically described. First, the base substrate 20 is oxidized in order to improve the adhesion with the filler 12 (S3). Moreover, the raw material of the filler 12 is prepared during this oxidation process (S4). An example of this raw material is borosilicate glass powder. Subsequently, the raw material of the filler 12 is filled into predetermined positions of the pair of lead terminals 11 that have been oxidized using a mold (not shown), and is pressure-molded (S5). At this time, since the protrusion 11c is formed on the lead terminal 11, the raw material of the filler 12 can be filled with high accuracy at a predetermined position. Subsequently, temporary baking is performed in a temperature atmosphere around 750 ° C., and the filler 12 is sintered as shown in FIG. 11 (S6). At this time, the filler 12 still has a gap with the lead terminal 11.

Moreover, the following process is performed simultaneously with the said process, and the stem 10 is prepared. That is, after preparing a plate material for the stem 10 made of low carbon steel, iron nickel alloy, iron nickel cobalt alloy or the like (S7), the plate material is punched out by a press to form an annular shape (S8). Subsequently, after pre-treatment such as acid cleaning and reduction treatment (S9), an oxidation treatment is performed to improve the adhesion with the filler 12 (S10). By performing these steps, the stem 10 is prepared in advance.
Then, as shown in FIG. 12, the stem 10 is mounted on the outside of the filler 12 (S11). Further, after the stem 10 is mounted, the filler 12 is fired in a temperature atmosphere around 1000 ° C. (S12). Thereby, the space between the filler 12 and the lead terminal 11 and the space between the filler 12 and the stem 10 are completely sealed, and a structure that can withstand airtightness is obtained. That is, the stem 10 and the pair of lead terminals 11 can be fixed in a state of penetrating the stem 10, and the hermetic terminal 4 can be assembled. At this point, the stem mounting process is completed.

Next, a piezoelectric vibrating piece connecting step for electrically and mechanically connecting the inner lead 11a and the piezoelectric vibrating piece 2 is performed. However, before performing this process, the following process is performed first. First, since the inner leads 11a of each pair of lead terminals 11 remain in a state where the distal ends are connected, the distal ends are cut and disconnected as shown in FIG.
Subsequently, a metal film of the same material is coated on the surface of the lead terminal 11 and the outer peripheral surface of the stem 10 for a later process by a wet plating method. As a pretreatment for that purpose, the surface of the lead terminal 11 and the outer peripheral surface of the stem 10 are washed, degreased with an alkaline solution, and then washed with hydrochloric acid and sulfuric acid (S13). After this pretreatment is completed, a base metal film is formed on the surface of the lead terminal 11 and the outer peripheral surface of the stem 10 (S14). For example, Cu plating or Ni plating is coated with a film thickness of about 2 μm to 5 μm.

Subsequently, a finish metal film is formed on the base metal film (S15). For example, in addition to a single material such as tin or silver, a tin lead alloy, a tin bismuth alloy, a tin antimony alloy, a tin copper alloy, or the like is coated with a film thickness of about 8 μm to 15 μm.
In this way, the inner lead 11a and the piezoelectric vibrating piece 2 can be connected by coating the metal film including the base metal film and the finish metal film. In addition to the connection of the piezoelectric vibrating reed 2, the metal film coated on the outer peripheral surface of the stem 10 has a characteristic of being soft and elastically deformed, so that the cold pressure welding between the stem 10 and the case 3 is possible. And airtight joining can be performed.

Subsequently, in order to stabilize the metal film, annealing is performed in a vacuum atmosphere furnace (S16). For example, heating is performed at a temperature of 170 ° C. for 1 hour. Thereby, the residual stress remaining in the metal film can be removed.
When this annealing is completed, the piezoelectric vibrating piece connecting step can be started. In addition, although the case where it carried out by the wet-plating method was taken as an example when coating a metal film, it is not restricted to this case, For example, a vapor deposition method, a chemical vapor phase method, etc. may be used.

Next, the piezoelectric vibrating piece connecting step is started. As shown in FIG. 14, the piezoelectric vibrating reed 2 is supplied with the mount electrode 2c facing the inner lead 11a (S17), and the mount electrode 2c and the inner lead 11a are mechanically aligned. Subsequently, the metal film previously applied to the inner lead 11a is melted by a heat source to connect the inner lead 11a and the mount electrode 2c (S18). Thereby, as shown in FIG. 15, the piezoelectric vibrating reed 2 can be mounted. As a heat source, a heated inert gas, a laser, a light source, or the like is used. Alternatively, the base material itself of the inner lead 11a may be melted, and for example, a technique such as arc discharge heat can be used.
At this point, the piezoelectric vibrating piece connecting step is completed. When performing this step, the inner lead 11a side is a free end, so that the piezoelectric vibrating reed 2 can be easily brought close to and connected without any restriction.

  After the piezoelectric vibrating reed 2 is mounted, baking is performed at a predetermined temperature in order to remove distortion caused by the mounting (S19). Subsequently, before fixing the case 3, the frequency adjustment (fine adjustment) of the piezoelectric vibrating piece 2 is performed (S20). Specifically, the frequency adjustment will be described. First, as shown in FIG. 16, only one outer lead 11b is cut from the plug lead frame 21 out of the pair of outer leads 11b connected to the plug lead frame 21. Separate. Thus, the pair of outer leads 11b are not electrically connected via the plug lead frame 21. That is, the pair of outer leads 11 b are electrically connected via the inner lead 11 a and the piezoelectric vibrating piece 2 instead of the plug lead frame 21. Therefore, the piezoelectric vibrating piece 2 can be vibrated by applying a voltage between the outer leads 11b. And frequency adjustment can be performed according to the vibration condition at this time.

More specifically, the piezoelectric vibrating reed 2 is vibrated in a state where the entirety is placed in a vacuum chamber. Then, the frequency is adjusted by evaporating the weight metal film provided at the tips of the pair of vibrating arms 2b by the laser while measuring the frequency. In order to perform frequency measurement, as shown in FIG. 17, the measurement can be accurately performed by pressing the tips of the probes P against both outer leads 11b. By performing this frequency adjustment step, the frequency of the piezoelectric vibrating piece 2 can be adjusted within a predetermined frequency range.
In particular, since the frequency adjustment can be performed reliably only by cutting one outer lead 11b, this frequency adjustment does not take time and labor. In addition, when evaporating the weight metal film, other than the laser, argon ions may be irradiated and evaporated.

Next, a case fixing process for fixing the case 3 and the airtight terminal 4 is performed while covering the piezoelectric vibrating reed 2 with the case 3 and storing it inside. This process will be specifically described. As shown in FIG. 18, the case 3 is approached in a vacuum, and the case 3 is press-fitted into the outer periphery of the stem 10 of the hermetic terminal 4 while applying a predetermined load (S21). Then, since the metal film formed on the outer peripheral surface of the stem 10 is elastically deformed, it can be hermetically sealed. Thereby, as shown in FIG. 19, the piezoelectric vibrating reed 2 can be sealed and vacuum-sealed in the case 3.
Moreover, before performing this process, the airtight terminal 4, the piezoelectric vibrating piece 2, and the case 3 are sufficiently heated to desorb surface adsorbed moisture and the like.

  Even when this case fixing process is performed, the case 3 can be easily brought close to and fixed without any restriction, similarly to the above-described piezoelectric vibrating piece connecting process. Therefore, unlike the prior art, it is not necessary to bend the lead terminal 11 twice at the same point just to fix the case 3. When this step is completed, as shown in FIG. 20A, a plurality of pairs of lead terminals 11 to which the case 3 is fixed are arranged along the plug lead frame 21. Further, since the plug lead frame 21, the projecting portion 22, and the pair of lead terminals 11 are all formed from the same base substrate 20, as shown in FIG. 20B, they are still flat at this point. .

  Moreover, after fixing the case 3, screening is performed. This screening is performed in order to stabilize the frequency and the resonance resistance value, and to suppress the occurrence of metal whisker due to compressive stress at the place where the case 3 is press-fitted.

Next, a bending process for adjusting the position of the case 3 by bending a part of the outer lead 11 b connected to the plug lead frame 21 is performed. This process will be specifically described. First, as shown in FIGS. 21A and 21B, the outer lead 11b is bent twice at a substantially right angle (S22). As a result, the case 3 is substantially parallel to the virtual plane H passing through the surface of the plug lead frame 21 and the outer peripheral surface is not in contact with the virtual plane H. That is, when the plug lead frame 21 is placed on the bottom surface, the case 3 can be lifted from the bottom surface while being substantially parallel to the bottom surface.
Simultaneously with the bending of the outer lead 11b, a part of the protruding portion 22 is bent at a substantially right angle in the same direction as the bending direction of the outer lead 11b (S23).

  Next, the above-described steps are repeated again, and the plug lead frame 21 having a plurality of pairs of lead terminals 11 in which the protrusions 22 are bent and the outer leads 11b are bent and the position of the case 3 is adjusted. Are repeated. That is, a plurality of the same plug lead frames 21 as shown in FIG.

Next, a mold frame 23 shown in FIG. 22A is prepared (S24). The mold frame 23 is formed in a band shape from a conductive material (for example, the same material as the base substrate 20), and is used in a state of being arranged in parallel with a predetermined interval.
Then, after preparing a plurality of plug lead frames 21 as described above, a base fixing step of fixing each plug lead frame 21 to the molding frame 23 is performed. Specifically, as shown in FIG. 22A, the plug lead frame 21 is joined by welding or the like so as to be bridged between the molding frames 23 (S25). Further, the case 3 provided on each plug lead frame 21 is arranged in a straight line along a direction (arrow A direction) orthogonal to the plug lead frame 21. As a result, the pair of lead terminals 11 and the case 3 provided on each plug lead frame 21 are aligned in the vertical direction (arrow A direction) and the horizontal direction (arrow B direction).

  Further, as shown in FIG. 22B, a part of the protruding portion 22 bent earlier is in a state of facing the case 3 provided in the adjacent plug lead frame 21. In performing this process, the plug lead frame 21 in which only the bent protrusion 22 is formed is bonded to the outermost end portion of the molding frame 23.

  Next, as shown in FIGS. 23A and 23B, an insulating resin is molded so that the case 3, the bent outer lead 11b, and the bent protrusion 22 are embedded, and the resin is molded. A resin molding step for forming the mold part 5 is performed (S26). In particular, since the position of the case 3 is adjusted by the bending process described above, the case 3 can be packaged while being easily embedded in the resin mold. Further, the outer lead 11 b and the protruding portion 22 on the plug lead frame 21 side are exposed to the outside from the resin mold portion 5.

Here, an internal electrical characteristic inspection packaged by the resin mold part 5 is performed (S27). That is, the resonance frequency, resonance resistance value, drive level characteristic (excitation power dependence of the resonance frequency and resonance resistance value), etc. of the piezoelectric vibrating piece 2 are measured and checked. Also check the insulation resistance characteristics and other factors.
After the electrical property inspection is completed, a cutting process is performed in which the plug lead frame 21 and the outer lead 11b and the plug lead frame 21 and the protruding portion 22 are cut and separated (S28). As a result, the piezoelectric vibrator 1 shown in FIGS. 1 to 3 can be manufactured. Note that the separated protrusion 22 functions as the dummy terminal 13. Then, the appearance inspection of the finally manufactured piezoelectric vibrator 1 is performed (S29), and the dimensions and quality are finally checked. Thereby, the manufacturing method which manufactures the several piezoelectric vibrator 1 at once is complete | finished.

As described above, the manufacturing method of this embodiment can continue to use the plug lead frame 21 obtained by processing the base substrate 20 from the first step to the last step, and thus the piezoelectric vibrator 1 is manufactured in a series of flows. can do. Therefore, it is possible to perform efficient production at low cost without taking time and effort. In addition, since an assembly error is unlikely to occur during manufacturing, high quality can be achieved. Particularly in the case of the present embodiment, since the stem 10 is mounted with high accuracy at a predetermined position determined in advance, the assembly error of the hermetic terminal 4 can be minimized. Also from this, quality can be improved.
In addition, since it is not necessary to bend the lead terminal 11 twice at the same point as in the prior art, stress concentration can be prevented, and a decrease in strength of the lead terminal 11 can be prevented as much as possible. In this respect as well, high quality can be achieved.
In the above description, the tuning fork type vibrating piece is taken as an example. However, the vibrating piece is not limited to a tuning fork type that vibrates flexibly, and may be a vibrating piece that vibrates in a thickness-shear mode, for example. In the case of the thickness sliding vibration piece, the press-fitting may be performed in an inert gas such as N ₂ .

Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 24, the oscillator 30 according to the present embodiment is configured such that the piezoelectric vibrator 1 is an oscillator electrically connected to an integrated circuit 31. The oscillator 30 includes a substrate 33 on which an electronic component 32 such as a capacitor is mounted. The integrated circuit 31 for the oscillator is mounted on the substrate 33, and the piezoelectric vibrating piece 2 of the piezoelectric vibrator 1 is mounted in the vicinity of the integrated circuit 31. The electronic component 32, the integrated circuit 31, and the piezoelectric vibrator 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 30 configured as described above, when a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating reed 2 in the piezoelectric vibrator 1 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 2 and input to the integrated circuit 31 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 31 and output as a frequency signal. Thereby, the piezoelectric vibrator 1 functions as an oscillator.
Further, by selectively setting the configuration of the integrated circuit 31, for example, an RTC (real time clock) module or the like as required, in addition to a single function oscillator for a clock, the operation date and time of the device or external device A function for controlling the time, providing a time, a calendar, and the like can be added.

  As described above, according to the oscillator 30 of the present embodiment, since the piezoelectric vibrator 1 having excellent strength and high quality is provided, the quality of the oscillator 30 itself can be improved and the reliability of the product can be improved. Can be improved. In addition to this, it is possible to obtain a highly accurate frequency signal that is stable over a long period of time.

Next, an embodiment of an electronic apparatus according to the invention will be described with reference to FIG. Note that a portable information device 40 having the above-described piezoelectric vibrator 1 will be described as an example of the electronic device.
First, the portable information device 40 of the present embodiment is typified by, for example, a mobile phone, and is a development and improvement of a wrist watch in the prior art. The appearance is similar to that of a wristwatch, and a liquid crystal display is arranged in a portion corresponding to a dial so that the current time and the like can be displayed on this screen. Further, when used as a communication device, it is possible to perform communication similar to that of a conventional mobile phone by using a speaker and a microphone that are removed from the wrist and incorporated in the inner portion of the band. However, it is much smaller and lighter than conventional mobile phones.

  Next, the configuration of the portable information device 40 of this embodiment will be described. As shown in FIG. 25, the portable information device 40 includes the piezoelectric vibrator 1 and a power supply unit 41 for supplying power. The power supply unit 41 is made of, for example, a lithium secondary battery. The power supply unit 41 includes a control unit 42 that performs various controls, a clock unit 43 that counts time, a communication unit 44 that communicates with the outside, a display unit 45 that displays various information, and the like. A voltage detection unit 46 that detects the voltage of the functional unit is connected in parallel. The power supply unit 41 supplies power to each functional unit.

  The control unit 42 controls each function unit to control the operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 42 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area of the CPU.

  The timer unit 43 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the piezoelectric vibrator 1. When a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece 2 vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal and input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 42 via the interface circuit, and the display unit 45 displays the current time, the current date, calendar information, and the like.

The communication unit 44 has functions similar to those of a conventional mobile phone, and includes a radio unit 47, a voice processing unit 48, a switching unit 49, an amplification unit 50, a voice input / output unit 51, a telephone number input unit 52, and a ring tone generation unit. 53 and a call control memory unit 54.
The radio unit 47 exchanges various data such as voice data with the base station via the antenna 55. The audio processing unit 48 encodes and decodes the audio signal input from the radio unit 47 or the amplification unit 50. The amplifying unit 50 amplifies the signal input from the audio processing unit 48 or the audio input / output unit 51 to a predetermined level. The voice input / output unit 51 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a voice.

In addition, the ring tone generator 53 generates a ring tone in response to a call from the base station. The switching unit 49 switches the amplifying unit 50 connected to the voice processing unit 48 to the ringing tone generating unit 53 only when an incoming call is received, so that the ringing tone generated by the ringing tone generating unit 53 passes through the amplifying unit 50. To the audio input / output unit 51.
The call control memory unit 54 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 52 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys or the like, the telephone number or the like of the call destination is input.

  When the voltage applied to each functional unit such as the control unit 42 by the power supply unit 41 falls below a predetermined value, the voltage detection unit 46 detects the voltage drop and notifies the control unit 42 of the voltage drop. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary for stably operating the communication unit 44, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 46, the control unit 42 prohibits the operations of the radio unit 47, the voice processing unit 48, the switching unit 49, and the ring tone generation unit 53. In particular, it is essential to stop the operation of the wireless unit 47 with high power consumption. Further, the display unit 45 displays that the communication unit 44 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 44 can be prohibited by the voltage detection unit 46 and the control unit 42, and that effect can be displayed on the display unit 45. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 45.
In addition, the function of the communication part 44 can be more reliably stopped by providing the power supply cutoff part 56 which can selectively interrupt the power supply of the part which concerns on the function of the communication part 44.

  As described above, according to the portable information device 40 of the present embodiment, since the piezoelectric vibrator 1 having excellent strength and high quality is provided, the portable information device 40 itself has excellent strength and high quality as well. The reliability of the product can be improved. In addition to this, it is possible to display highly accurate clock information that is stable over a long period of time.

Next, an embodiment of a radio timepiece according to the present invention will be described with reference to FIG.
As shown in FIG. 26, the radio timepiece 60 of the present embodiment includes the piezoelectric vibrator 1 electrically connected to the filter unit 61, and receives a standard radio wave including timepiece information to accurately It is a clock with a function of automatically correcting and displaying the correct time.
In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), each transmitting standard radio waves. Long waves such as 40 kHz or 60 kHz have the property of propagating the surface of the earth and the property of propagating while reflecting the ionosphere and the surface of the earth, so the propagation range is wide, and the above two transmitting stations cover all of Japan. doing.

Hereinafter, the functional configuration of the radio timepiece 60 will be described in detail.
The antenna 62 receives a long standard wave of 40 kHz or 60 kHz. The long-wave standard radio wave is obtained by subjecting time information called a time code to AM modulation on a 40 kHz or 60 kHz carrier wave. The received long standard wave is amplified by the amplifier 63 and filtered and tuned by the filter unit 61 having the plurality of piezoelectric vibrators 1.
The piezoelectric vibrator 1 in this embodiment includes crystal vibrator portions 68 and 69 having resonance frequencies of 40 kHz and 60 kHz, which are the same as the carrier frequency, respectively.

Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 64. Subsequently, the time code is taken out via the waveform shaping circuit 65 and counted by the CPU 66. The CPU 66 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected on the RTC 67, and accurate time information is displayed.
Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrator portions 68 and 69 are preferably vibrators having the tuning fork type structure described above.

  In addition, although the above-mentioned description was shown in the example in Japan, the frequency of the long standard wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Accordingly, when the radio timepiece 60 that can be used overseas is incorporated in a portable device, the piezoelectric vibrator 1 having a frequency different from that in Japan is required.

  As described above, according to the radio-controlled timepiece 60 of the present embodiment, the radio-controlled timepiece 60 is provided with the high-quality piezoelectric vibrator 1 with high strength. This can improve the reliability of the product. In addition to this, it is possible to count time stably and with high accuracy over a long period of time.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

1 is a perspective view showing an embodiment of a piezoelectric vibrator according to the present invention. FIG. 2 is a diagram of the piezoelectric vibrator shown in FIG. 1 viewed from the direction of arrow C. FIG. 2 is a diagram of the piezoelectric vibrator shown in FIG. 1 viewed from the direction of an arrow D. FIG. 2 is a cross-sectional view illustrating a positional relationship among a piezoelectric vibrating piece, a case, and an airtight terminal of the piezoelectric vibrator illustrated in FIG. 1. It is sectional drawing along the cutting line EE shown in FIG. FIG. 2 is a flowchart showing a step in manufacturing the piezoelectric vibrator shown in FIG. 1. FIG. It is a continuation of the flowchart shown in FIG. It is a continuation of the flowchart shown in FIG. FIG. 2 is a diagram showing a step in manufacturing the piezoelectric vibrator shown in FIG. 1, in which a base substrate is processed to form a strip-shaped plug lead frame, and a pair of lead terminals and protrusions on the plug lead frame It is a figure which shows the state which formed multiple each. FIG. 10 is a diagram showing a partially enlarged state of the plug lead frame shown in FIG. 9. It is a figure which shows the state which attached the filler to the predetermined position of a pair of lead terminal from the state shown in FIG. It is a figure which shows the state which mounted | wore with the stem from the state shown in FIG. It is a figure which shows the state which cut | disconnected and cut | disconnected the front-end | tip of the connected inner lead from the state shown in FIG. FIG. 14 is a diagram showing a state in which the piezoelectric vibrating piece is brought close to the state shown in FIG. 13 with the mount electrode facing the inner lead side. It is a figure which shows the state which mounted the piezoelectric vibrating piece by electrically and mechanically connecting an inner lead and the mount electrode from the state shown in FIG. It is a figure which shows the state which cut | disconnected and cut off between one outer lead and the plug lead frame from the state shown in FIG. It is a figure which shows the state which is adjusting the frequency of a piezoelectric vibrating piece, making a probe contact both outer leads from the state shown in FIG. It is a figure which shows the state which has covered the case so that a piezoelectric vibrating piece may be accommodated in the inside from the state shown in FIG. It is a figure which shows the state which press-fixed the case to the outer periphery of the stem from the state shown in FIG. (A) is the figure which looked at the state shown in FIG. 19 from upper direction, (b) is the figure which shows the state which looked at (a) from the side. (A) is a figure which shows the state which bent the outer lead and the protrusion part from the state shown in FIG. 20, (b) is a figure which shows the state which looked at (a) from the side. FIG. 22A is a diagram showing a state in which a plurality of plug lead frames shown in FIG. 21 are arranged adjacent to a mold frame, and FIG. 22B is a diagram showing a state when FIG. (A) is a figure which shows the state which shape | molded resin from the state shown in FIG. 22, and shape | molded the resin mold part, (b) is a figure which shows the state which looked at (a) from the side. It is a block diagram which shows one Embodiment of the oscillator which concerns on this invention. It is a block diagram which shows one Embodiment of the electronic device which concerns on this invention. It is a block diagram which shows one Embodiment of the radio timepiece which concerns on this invention. It is a perspective view which shows an example of the conventional piezoelectric vibrator. FIG. 28 is a side view of a piezoelectric vibrator obtained by packaging the piezoelectric vibrator shown in FIG. 27 with a resin mold portion.

Explanation of symbols

H Virtual plane of plug lead frame 1 Piezoelectric vibrator 2 Piezoelectric vibrating piece 3 Case 4 Airtight terminal 5 Resin mold part 10 Stem 11 Lead terminal 11a Inner lead of lead terminal 11b Outer lead of lead terminal 11c Projection (positioning part)
12 Filling material 20 Base substrate 21 Plug lead frame (base)
22 Protruding part 23 Mold frame 30 Oscillator 31 Integrated circuit 40 Portable information device (electronic device)
43 Timekeeping part 60 Radio clock 61 Filter part

Claims (3)

A piezoelectric vibrating piece;
A case for accommodating the piezoelectric vibrating piece therein;
An annular stem is disposed in a state of penetrating the stem, and one end side is electrically connected to the piezoelectric vibrating piece with the stem interposed therebetween, and the other end side is electrically connected to the outside. A pair of lead terminals that are outer leads, a filler that fixes the lead terminals and the stem, and an airtight terminal that seals the inside of the case;
A method of manufacturing a piezoelectric vibrator including an insulating resin mold portion that packages the case with the outer lead exposed.
A base substrate processing step of processing a base substrate made of a conductive material to form a band-shaped base portion, and forming a plurality of the pair of lead terminals in a state where the outer leads are connected to one side of the base portion;
A stem attachment step of assembling the airtight terminal by attaching the stem to the predetermined position of the pair of lead terminals via the filler;
A piezoelectric vibrating piece connecting step of connecting the inner lead and the piezoelectric vibrating piece;
Of the pair of lead terminals, the outer lead of one lead terminal is cut off and separated from the base, and a frequency adjustment step of adjusting the frequency of the piezoelectric vibrating piece by applying a voltage between both outer leads;
A case fixing step of fixing the case and the airtight terminal in a state in which the piezoelectric vibrating piece is housed, and sealing the inside of the case;
A case where a part of the outer lead is bent so that the case is substantially parallel to a virtual plane passing through the surface of the base and the outer peripheral surface of the case is not in contact with the virtual plane. A folding process for adjusting the position of
Repeating each of the above steps to prepare a plurality of the bases in which the position of the case is adjusted; and
A base fixing step of fixing the plurality of bases to a mold frame, and arranging the cases of the bases in a straight line;
A resin molding step for forming the resin mold part by molding an insulating resin so as to embed the case and the bent outer lead;
A method of manufacturing a piezoelectric vibrator, comprising performing a cutting step of cutting and separating between the base and the outer lead. In the manufacturing method of the piezoelectric vibrator according to claim 1,
During the base substrate processing step, a plurality of projecting portions projecting outward from the other side of the base portion are formed so as to face the lead terminals,
During the bending step, a part of the protruding portion is bent in the same direction as the bending direction of the outer lead,
During the molding step, the resin mold portion is formed so as to embed the bent protrusion.
A method of manufacturing a piezoelectric vibrator, wherein the base portion and the protruding portion are cut and separated during the cutting step. In the manufacturing method of the piezoelectric vibrator according to claim 1 or 2,
A method of manufacturing a piezoelectric vibrator, wherein a positioning portion for positioning the filler at the predetermined position is formed on the lead terminal during the base substrate processing step.

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