JP4926759B2 - Laser processing apparatus, laser processing method, programming apparatus, and programming method - Google Patents

Description

  The present invention relates to a laser processing apparatus, a laser processing method, a programming apparatus, and a programming method for performing laser processing by selecting a piercing method.

  When performing laser processing on a workpiece, in order to perform laser processing efficiently, the processing proceeds while sequentially moving to a plurality of processing regions on the workpiece. At this time, in order to process the workpiece with high processing accuracy, piercing is performed for each processing region. Since this piercing requires processing time, it must be pierced quickly. For this reason, it is necessary to set an appropriate piercing method according to the processing region and to perform laser processing with high processing accuracy quickly.

  Conventionally, in continuous processing (one workpiece), the same piercing method has been used in each processing region. That is, even when a plurality of piercing methods can be used, a predetermined piercing method is selected for each NC program, and one piercing method is set for each NC program. The proper use of the piercing method for each NC program is based on the experience and know-how of the programmer who creates the NC program and the operator who operates the laser processing apparatus, and it is difficult to properly use the piercing method.

  The laser processing machine described in Patent Document 1 has a piercing mode capable of performing piercing processing in a short time and a piercing mode capable of performing piercing processing with high processing accuracy as a piercing mode for the same workpiece. ing. Then, either one of the piercing modes is selected and used according to the processing position of the workpiece.

Japanese Utility Model Publication No. 63-56982

  However, in the above-described conventional technology, since the piercing method is selected without considering the influence of scattered matter (working waste) accompanying the piercing process, laser processing with high processing accuracy cannot be performed, and the workpiece is There was a problem of getting dirty.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus, a laser processing method, a programming apparatus, and a programming method capable of quickly performing laser processing with high processing accuracy.

In order to solve the above-described problems and achieve the object, the present invention is used when processing a workpiece in a laser processing apparatus that performs laser processing on the workpiece after piercing the workpiece. A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from a machining program, and piercing the workpiece A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object scattered on the workpiece, and the processing path information and the scattered object information. comprising of a selection unit said every product area selecting piercing method according to the product area, and a processing unit for performing the laser processing of the workpiece in piercing wherein said selecting unit selects, The scattered object information includes information related to an in-plane area of the scattered object adhering to the processed surface of the workpiece, and the selection unit is a piercing method in which the product area and the in-plane area of the scattered object do not overlap. In addition, a piercing method capable of performing piercing in the shortest time is selected .

  According to this invention, the piercing method corresponding to the machining area is selected for each machining area on the workpiece based on the machining path of the workpiece and the area of the scattered object when piercing the workpiece. Therefore, there is an effect that laser processing with high processing accuracy can be performed quickly.

  Embodiments of a laser processing apparatus, a laser processing method, a programming apparatus, and a programming method according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a block diagram showing the configuration of the laser processing apparatus according to Embodiment 1 of the present invention. The laser processing apparatus 1 is an apparatus for laser processing a workpiece by selecting a piercing method corresponding to a processing path or a piercing position from a plurality of piercing methods. The laser processing apparatus 1 includes a processing program input unit 11, a processing path determination unit (processing path extraction unit) 12, a piercing selection unit (selection unit) 13, a piercing information storage unit (storage unit) 14, an instruction unit 15, and a processing control unit. 16, a processing unit 17, and a control unit 19.

  The machining program input unit 11 inputs a machining program (NC (Numerical Control) program) for laser machining a workpiece from an external device (not shown). The machining program input unit 11 sends the inputted machining program to the machining path determination unit 12 and the instruction unit 15.

  The machining path determination unit 12 extracts a machining path (a product area that is a machining path other than the piercing line) and a piercing position from the machining program sent from the machining program input unit 11 as machining path information. The machining path determination unit 12 sends the extracted machining path and piercing position to the piercing selection unit 13.

  The piercing information storage unit 14 includes information on each piercing method (the piercing type information 101 and the priority information 102 described later), and information on the scattered matter (processed waste) that is scattered on the workpiece when piercing is performed (scattering area). ) And the like are stored for each piercing method.

  The piercing selection unit 13 responds to the processing region (product region) based on the processing route and the piercing position extracted by the processing route determination unit 12 and the piercing type information 101 and priority information 102 stored in the piercing information storage unit 14. Select the piercing method for each processing area. The piercing selection unit 13 associates the selected piercing method with the processing area, and sends it to the instruction unit 15 as piercing information. The processing region in the present embodiment is a closed frame-like region for one round when the inner side is cut out, or a closed frame-like region for one round when the outer side is cut off.

  The instruction unit 15 sends an instruction (instruction information) related to the processing of the workpiece to the processing control unit 16 based on the processing program from the processing program input unit 11 and the piercing information from the piercing selection unit 13. The instruction unit 15 of the present embodiment transmits, for example, a piercing method for each processing region to the processing control unit 16.

  The processing control unit 16 controls the processing unit 17 based on instruction information from the instruction unit 15 (such as a piercing method for each processing region). The processing unit 17 performs laser processing on each processing region (workpiece) using a piercing method selected for each processing region.

  The control unit 19 controls the machining program input unit 11, the machining path determination unit 12, the piercing selection unit 13, the piercing information storage unit 14, and the instruction unit 15. Here, although the laser processing apparatus 1 is configured to include the processing control unit 16 and the processing unit 17, the laser processing apparatus 1, the processing control unit 16, and the processing unit 17 may be configured separately.

  Here, the types of piercing methods will be described. 2 and 3 are diagrams for explaining types of piercing methods. When piercing is performed on the workpiece 5, processing waste is generated during the piercing, and the processing waste adheres around the piercing hole as scattered matter. This scattered object deteriorates the processing accuracy of the workpiece 5 and deteriorates the appearance of the workpiece 5.

  When piercing is performed in a short time, the piercing hole becomes larger and the area of scattered matter (scattering area) that scatters around the piercing hole becomes wider. On the other hand, in order to reduce the piercing hole and narrow the scattering region, it takes a long time for piercing. In order to cleanly laser-process the workpiece 5, it is necessary to secure an area having the same size as the scattering area when piercing. For this reason, in this embodiment, the scattering region (scattering matter information) is set as a piercing region necessary for piercing, and the piercing method in each processing region is selected.

  2 and 3 show a case where the piercing area of the piercing hole a1 is the piercing area a2, the piercing area of the piercing hole b1 is the piercing area b2, and the piercing area of the piercing hole c1 is the piercing area c2. .

  Further, the case where the piercing hole and the piercing region are widened in the order of the piercing method A for the piercing hole a1, the piercing method B for the piercing hole b1, and the piercing method C for the piercing hole c1 is shown. Therefore, the piercing time is shortened in the order of piercing method A, piercing method B, and piercing method C.

  By the way, even if the scattered matter adheres to the periphery of the piercing hole, if the scattered matter is inside the processing area of the workpiece 5 (the portion to be cut out), the scattered matter is cut out (the product does not become a product). Since it adheres to (part), the scattered matter can be removed by processing (cutout processing) after piercing. Moreover, even if a scattered object adheres around the piercing hole, if the scattered object is outside (the part to be cut off) of the processing area of the workpiece 5, the scattered object is not cut into a product (a product). Since it adheres to (part), scattered objects can be removed by processing (cutting) after piercing. For this reason, in this Embodiment, the piercing method which a piercing area does not overlap with a product part (each process area) is selected as a piercing method which does not adhere a scattered material to the to-be-processed object 5. FIG. In other words, as a piercing method in which the scattered object does not adhere to the workpiece 5, a piercing method in which the piercing area is inside (no overlap) of the processing area (one closed area), or the piercing area is the processing area. A piercing method is selected that is outside (no overlap) (one closed region). At this time, a piercing method capable of performing piercing in as short a time as possible is selected. For example, when the machining area is widened in the order of the machining area P, the machining area Q, and the machining area R, the piercing area is widened in the order of the machining area P, the machining area Q, and the machining area R, and piercing is performed in as short a time as possible. To do. In other words, the larger the processing area, the wider the piercing area and the higher the speed of piercing.

  Next, an operation procedure of the laser processing apparatus 1 will be described. FIG. 4 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment. When performing laser processing on the workpiece 5, the processing program input unit 11 of the laser processing apparatus 1 inputs and reads a processing program for laser processing the workpiece 5 from an external device or the like (step S110). The machining program input unit 11 sends a machining program input from an external device or the like to the machining path determination unit 12 and the instruction unit 15.

  Here, an example of the machining program will be described. The machining program read from the machining program input unit 11 includes information on the machining procedure such as the machining area of the workpiece 5, the movement path of the machining nozzle, the machining path, and the piercing position. FIG. 5 is a diagram illustrating an example of a processing procedure for a workpiece. The machining program includes information related to the movement path of the machining nozzle from the start point S1 to the machining end point E1. This moving path includes a path for moving the processing nozzle without performing laser processing (path indicated by a broken line) and a path for performing laser processing (path indicated by a solid line). In each processing area in the workpiece 5, a movement path is set so that laser processing can be performed after piercing.

  The machining path determination unit 12 extracts a machining path (product area) for each machining area and a piercing position for each machining area from the machining program sent from the machining program input unit 11 (step S120). The machining path determination unit 12 sends the extracted machining path and piercing position to the piercing selection unit 13.

  The piercing selection unit 13 determines the processing position and piercing of each processing region based on the processing route and the piercing position extracted by the processing route determination unit 12 and the piercing type information 101 and priority information 102 stored in the piercing information storage unit 14. A piercing method corresponding to the position is selected for each processing region (step S130).

  Here, the configuration of the piercing type information 101 and the priority information 102 will be described. FIG. 6 is a diagram illustrating an example of the configuration of the piercing type information, and FIG. 7 is a diagram illustrating an example of the configuration of the priority information.

  The piercing type information 101 is information (data table) relating to the type of piercing method, and the piercing conditions for performing piercing are associated with each type of piercing method. In FIG. 6, laser output, frequency, duty, assist gas type, gas pressure, piercing time, laser focus position, machining nozzle height, and the like are associated with each piercing method.

  For example, in the piercing method A, the laser output is 4000 W, the frequency is 500 Hz, the duty is 100%, the assist gas type is oxygen, the gas pressure is 0.1 Mpa, the piercing time is 1.0 s, and the laser focal position is 2. 0 mm and the height of the processing nozzle is 5.0 mm.

  The priority information 102 is information (data table) indicating the order (priority) of piercing methods to be preferentially selected when selecting a piercing method. In the present embodiment, in order to perform piercing in as short a time as possible, a piercing method in which the piercing area is as wide as possible is selected from among the piercing methods in which the piercing area is inside the processing area.

  FIG. 7 shows a case where the piercing method A has priority 1 (highest priority), the piercing method B has priority 2, and the piercing method C has priority 3. Each piercing method is associated with an allowable piercing area radius.

  When selecting the piercing method, in order to select a piercing method that does not overlap the product part, the piercing method or the piercing region that is inside the cutting processing area extracted from the processing program is processed. Select a piercing method outside the cutting area extracted from the program. Further, the piercing method with the highest priority among the selected piercing methods is selected.

  In the present embodiment, in order to set any processing method included in the piercing type information 101 for all the processing regions, the piercing region of the lowest priority piercing method is not set.

  The piercing selection unit 13 selects a piercing method for all processing regions of the workpiece. The piercing selection unit 13 associates the selected piercing method with the processing area, and sends it to the instruction unit 15 as piercing information.

  For example, the piercing method A for the piercing hole a1 (piercing region a2) is selected for the processing region P in FIG. 2, and the piercing method B for the piercing hole b1 (piercing region b2) is selected for the processing region Q. For R, the piercing method C for the piercing hole c1 (piercing region c2) is selected.

  The instruction unit 15 sends an instruction (instruction information) related to the processing of the workpiece 5 to the processing control unit 16 based on the processing program from the processing program input unit 11 and the piercing information from the piercing selection unit 13.

  The processing control unit 16 controls the processing unit 17 based on the instruction information from the instruction unit 15 (such as a piercing method for each processing region) and the piercing type information 101. Thereby, the process part 17 starts the laser processing of each process area | region using the piercing method selected for every process area (step S140).

  Here, the selection process of the piercing method according to the processing position and the piercing position (the process of step S130) will be described in detail. FIG. 8 is a flowchart showing a piercing method selection processing procedure.

  Here, the piercing selection unit 13 selects a piercing method for each processing region based on the priority information. The piercing selection unit 13 first selects the piercing method (piercing condition) A with priority 1 from the priority information 102 (step S210), and sets the piercing area with priority 1 (piercing method A) in the priority information 102. Read from the inside (step S220).

  Next, when piercing is performed at the piercing position set in the machining program, the piercing selection unit 13 interferes between the priority 1 piercing area and the machining area to be selected for the piercing method ( It is determined whether there is an overlap) (step S230).

  When there is no interference between the priority 1 piercing area and the processing area to be selected (step S230, Yes), the piercing selection unit 13 sets the priority 1 piercing method A. The piercing selection unit 13 associates the set piercing method A with the processing area and sends it to the instruction unit 15 as piercing information. Thereby, the laser processing apparatus 1 performs piercing by the piercing method A with priority 1 (step S240).

  On the other hand, if there is an interference between the priority 1 piercing area and the processing area to be selected (No in step S230), the piercing selection unit 13 selects the priority 2 piercing from the priority information 102. Method B is selected (step S250), and a piercing area of priority 2 is read from the priority information 102 (step S260).

  Next, when piercing is performed at the piercing position set in the machining program, the piercing selection unit 13 causes interference between the priority 2 piercing area and the machining area to be selected for the piercing method. It is determined whether or not there is (step S270).

  When there is no interference between the priority 2 piercing area and the processing area to be selected (step S270, Yes), the piercing selection unit 13 sets the priority 2 piercing method B. The piercing selection unit 13 associates the set piercing method B with the processing area and sends it to the instruction unit 15 as piercing information. Thereby, the laser processing apparatus 1 performs the piercing by the piercing method B with the priority 2 (step S280).

  On the other hand, when there is interference between the priority 2 piercing area and the processing area to be selected (No in step S270), the piercing selection unit 13 selects the priority 3 piercing from the priority information 102. The method C is selected (step S290), and the priority 3 piercing method C is set. The piercing selection unit 13 associates the set piercing method C with the processing area, and sends it to the instruction unit 15 as piercing information. Thereby, the laser processing apparatus 1 performs the piercing by the piercing method C with the priority 3 (step S295). The piercing selection unit 13 performs a piercing method selection process based on the priority information for each processing region.

The piercing method selection process based on the priority information 102 may be performed before laser processing of the workpiece 5 is started, or may be performed while the workpiece 5 is laser processed.
When the piercing method is selected while laser processing the workpiece 5, for example, the piercing method is selected immediately before piercing of each processing region, and piercing in this processing region is started. Then, a piercing method for the next processing area is selected during laser processing in this processing area or when the processing nozzle moves after laser processing.

  In the present embodiment, the laser processing apparatus 1 selects the piercing method. However, a processing program in which the piercing method is selected by a programming apparatus may be created, and laser processing may be performed using the created processing program.

  FIG. 9 is a diagram showing the configuration of the programming device. Among the constituent elements in FIG. 9, constituent elements that achieve the same functions as those of the laser processing apparatus 1 shown in FIG. 1 are given the same numbers, and redundant descriptions are omitted. The programming device 2 is a device that creates a new machining program using an existing machining program, and includes a machining program input unit 11, a machining path determination unit 12, a piercing selection unit 13, a piercing information storage unit 14, an output unit 18, A control unit 19 is provided.

  When the piercing selection unit 13 of the programming device 2 creates the piercing information based on the piercing type information 101, the priority information 102, and the like, based on the existing machining program input from the machining program input unit 11 and the created piercing information. Then, a new machining program (a machining program in which a piercing method is set for each machining area) is created. This new machining program is sent to the output unit 18. The output unit 18 outputs a new machining program created by the piercing selection unit 13 to an external device such as the laser machining device 1. Note that a machining program corresponding to an existing machining program may be created by the programming device 2.

  In the present embodiment, the piercing method is selected for each processing region based on the piercing region (in-plane region of the scattered object) in the processing surface (main surface) of the workpiece. The piercing method may be selected based on the piercing area (space area of scattered objects) in the height direction of the surface and the workpiece (direction perpendicular to the machining surface) (laser irradiation direction).

  As shown in FIG. 10, when the scattered object 32 is accumulated in the height direction when piercing is performed, the scattered object 32 and the processed object are processed even when the processing position T and the piercing area 61X are not interfered with each other. The nozzle 30 may collide. For this reason, for example, the piercing area of the priority information 102 shown in FIG. 7 is set as radius information and height information (piercing area 61Y).

  Specifically, when selecting the piercing method, a piercing method is selected in which the moving path of the processing nozzle extracted from the processing program (the position of the processing nozzle when laser processing the product region) does not overlap the piercing region 61Y. Further, the piercing method having the highest priority is selected from among the piercing methods in which the moving path of the processing nozzle does not contact the piercing region 61Y.

  In the present embodiment, the case where the priority information 102 has three levels of priority as the priority of the piercing method has been described. However, the priority information 102 has two levels or four as the priority of the piercing method. It is good also as a structure which has a priority more than a step.

  As described above, according to the first embodiment, the piercing method having a short piercing time (high priority) is selected from the piercing methods in which the movement path of the machining nozzle extracted from the machining program does not overlap the piercing area. Accurate laser processing can be performed quickly.

  In addition, since the information on the piercing area used when selecting the piercing method includes the piercing area in the processing surface of the workpiece, the piercing method that can avoid the collision between the processing nozzle and the scattered object in the in-plane region is easy. It becomes possible to select.

  In addition, since the information on the piercing area used when selecting the piercing method includes the piercing area in the height direction of the workpiece, the piercing method that can avoid the collision in the height direction between the machining nozzle and the scattered object is easy. It becomes possible to select.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the piercing shape is changed according to the shape and size of the machining area, and the workpiece is pierced.

  FIG. 11 is a block diagram showing the configuration of the laser processing apparatus according to Embodiment 2 of the present invention. Among the constituent elements in FIG. 11, constituent elements that achieve the same functions as those of the laser processing apparatus 1 of the first embodiment shown in FIG. 1 are given the same numbers, and redundant descriptions are omitted.

  The laser processing apparatus 1 includes a piercing shape control unit 21 that controls the piercing shape in the processing control unit 16. The piercing shape control unit 21 controls the piercing shape by blowing air or the like near the laser irradiation position when performing laser irradiation. The piercing shape control unit 21 controls the air flow rate and the air blowing direction so that the piercing shape becomes an ellipse as shown in FIG. 12, for example, according to the shape and size of the processing region.

  For example, if the machining area is an elongated area, piercing can be performed in a short time while preventing the interference between the machining area and the piercing area by controlling the piercing shape so that the longitudinal direction of the machining area is the same as the longitudinal direction of the piercing shape. Can be performed.

  As described above, according to the second embodiment, the piercing shape control unit 21 controls the piercing shape according to the shape and size of the processing region, so that laser processing with high processing accuracy can be performed quickly.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the piercing method is selected based on the time required for piercing processing and the time required for piercing line processing.

  As described with reference to FIG. 2 of the first embodiment, the laser processing of the workpiece 5 is a cut-out processing of the workpiece and actually requires laser processing (for example, the outer periphery of the processing region P) (product) Shape) and processing such as piercing.

  FIG. 13 is a diagram for explaining a processing path from piercing to product processing. From the piercing position 41 to the position (product processing start position) 45 where processing of the product shape (product region) 46 is started, piercing processing for processing the piercing position 41 and product processing from the end portion (outer peripheral portion) of the piercing position 41 Piercing line processing up to the start position 45 is performed.

  Here, the piercing line processing is processing of the piercing line section 44 including the start section 42 and the cutting section 43. The start section 42 is a highly stable and low-speed processing section for stabilizing the discharge of the melt at the start of processing and preventing processing defects due to spattering of the piercing portion. The cutting section 43 is a processing section that cuts the workpiece 5 under the same processing conditions as when the product shape is processed.

  The time from the start of processing at the piercing position 41 to the end of the laser processing to the product processing start position 45 is the sum of the time required for piercing processing, the time required for processing the start section 42, and the time required for processing the cutting section 43. (Total piercing time).

  Therefore, the piercing time and the total piercing time do not necessarily have a proportional relationship. In the present embodiment, the type of piercing method is selected based on the total piercing time.

  FIG. 14 is a flowchart showing an operation procedure of the laser processing apparatus according to the third embodiment. In addition, the laser processing apparatus 1 which concerns on Embodiment 3 has the structure similar to the laser processing apparatus of Embodiment 1 shown in FIG.

  The piercing selection unit 13 first determines whether or not to change the length of the piercing line (step S310). Whether to change the length of the piercing line may be set in the piercing selection unit 13 in advance, or may be set by the user for each processing region or for each laser processing of the workpiece 5.

  When the piercing selection unit 13 determines to change the length of the piercing line (step S310, Yes), the piercing method A (piercing position) with priority 1 (piercing priority 1) or priority 2 (piercing priority) 2) Set the piercing method B (piercing position). Here, a method for setting the piercing position will be described. 15 to 17 are diagrams for explaining a method of setting the piercing position.

  As shown in FIG. 15, it is assumed that a standard piercing method (piercing position PO) (initially set piercing position) is initially set in the processing area 51. In this case, a priority 1 piercing method A (piercing position PA) and a priority 2 piercing method B (piercing position PB) are set. In the piercing method A and the piercing method B, the minimum necessary piercing line length is set in advance for each type of piercing method. The minimum required piercing line length is determined, for example, by using information (data table) regarding the type of piercing method. As a result, the piercing area 61A is set for the piercing method A of priority 1, and the piercing area 61B is set for the piercing method B of priority 2.

  Similarly, it is assumed that a standard piercing method (piercing position PO) is initially set in the processing region 52 shown in FIG. In this case, a priority 1 piercing method A (piercing position PA) and a priority 2 piercing method B (piercing position PB) are set. In the piercing method A and the piercing method B, the minimum necessary piercing line length is set in advance for each type of piercing method. The minimum required piercing line length is determined, for example, by using information (data table) regarding the type of piercing method. As a result, the piercing area 61A is set for the piercing method A of priority 1, and the piercing area 61B is set for the piercing method B of priority 2.

  Further, it is assumed that a standard piercing method (piercing position PO) is initially set in the processing region 53 shown in FIG. In this case, a priority 1 piercing method A (piercing position PA) and a priority 2 piercing method B (piercing position PB) are set. In the piercing method A and the piercing method B, the minimum necessary piercing line length is set in advance for each type of piercing method. The minimum required piercing line length is determined, for example, by using information (data table) regarding the type of piercing method. As a result, the piercing area 61A is set for the piercing method A of priority 1, and the piercing area 61B is set for the piercing method B of priority 2.

  Here, the piercing selection unit 13 first sets the priority 1 piercing method A (piercing position PA) on the extension of the piercing line (step S320). Then, the piercing selection unit 13 determines whether or not the piercing area 61A corresponding to the priority 1 piercing method A interferes with the machining path of the product shape 46 (step S330).

  When the piercing area 61A does not interfere with the machining path of the product shape 46 (Yes at Step S330), the piercing selection unit 13 sets the piercing total time using the piercing position PA rather than the total piercing time using the piercing position PO. It is determined whether the shorter one is shorter (step S340). For example, when the priority 1 piercing position PA is set in the machining area 53 shown in FIG. 17, the piercing area 61A and the machining path of the product shape 46 do not interfere with each other.

  The total piercing time using the piercing position PO is the total of the time required for piercing processing at the piercing position PO (piercing time), the time required for processing the start section 42, and the time required for processing the cutting section 43. The total piercing time using the piercing position PA is the total of the time required for piercing processing at the piercing position PA (piercing time), the time required for processing the start section 42, and the time required for processing the cutting section 43.

  Here, a method of calculating the total piercing time will be described. 18 to 20 are diagrams showing the relationship between the piercing method and the total piercing time. The time (min) required for machining the start section 42 is obtained by dividing the distance (start section distance) (mm) of the start section 42 by the machining speed (start section speed) (mm / min) when machining the start section 42. Value. Further, the time required for processing the cutting section 43 is a value obtained by dividing the distance of the cutting section 43 (cutting section distance) by the processing speed (cutting section speed) when processing the cutting section 43. The total piercing time here is the total of the piercing time, the time required for processing the start section 42, and the time required for processing the cutting section 43, each converted into seconds.

  Under the processing conditions shown in FIG. 18, the total piercing time is shortened in the order of piercing method A, piercing method B, and standard piercing method D. Therefore, in the present embodiment, in the case of the processing conditions shown in FIG. 18, the selection priority of the piercing method is the order of piercing method A, piercing method B, and standard piercing method D.

  In the machining conditions shown in FIG. 19, the start condition section distance is changed with respect to the machining conditions in FIG. 18, but the total piercing time is shorter in the order of piercing method A, standard piercing method D, and piercing method B. It has become. Therefore, in the present embodiment, in the case of the processing conditions shown in FIG. 19, the selection priority of the piercing method is the order of piercing method A, standard piercing method D, and piercing method B.

  However, the piercing method B is not usually selected with this piercing priority. The processing conditions and the total piercing time shown in FIGS. 18 and 19 are stored in advance in the piercing information storage unit 14 or the like.

  When the total piercing time using the piercing position PA is shorter than the total piercing time using the piercing position PO (step S340, Yes), the piercing line is extended to the piercing position PA (step S350). Then, the piercing selection unit 13 selects the piercing method A with priority 1 (step S360), and the processing unit 17 performs piercing with the piercing method A with priority 1 (step S370). For example, when the machining condition is the machining condition shown in FIG. 18 and the machining area is the machining area 53 shown in FIG. 17, piercing is performed with the piercing method A (piercing position PA) with priority 1.

  On the other hand, when the piercing area 61A interferes with the machining path of the product shape 46 (No in step S330), the piercing selection unit 13 sets the priority 2 piercing method B (piercing position PB) on the extension of the piercing line. Setting is made (step S380).

  When the total piercing time using the piercing position PA is equal to or longer than the total piercing time using the piercing position PO (No in step S340), the piercing selection unit 13 performs piercing with priority 2 on the extension line of the piercing line. Method B (piercing position PB) is set (step S380).

  When the piercing selection unit 13 sets the piercing method B with the priority 2 on the extension line of the piercing line, the piercing selection unit 13 sets the piercing area 61B corresponding to the piercing method B with the priority 2 and the processing path of the product shape 46. Is interfering with each other (step S390).

  When the piercing area 61B and the machining path of the product shape 46 do not interfere (Yes in step S390), the piercing selection unit 13 sets the piercing total time using the piercing position PB rather than the total piercing time using the piercing position PO. It is determined whether or not the one is shorter (step S400). For example, when the piercing position PB of priority 2 is set in the machining area 52 shown in FIG. 16, the piercing area 61B and the machining path of the product shape 46 do not interfere with each other.

  When the total piercing time using the piercing position PB is shorter than the total piercing time using the piercing position PO (step S400, Yes), the piercing line is extended to the piercing position PB (step S410). Then, the piercing selection unit 13 selects the piercing method B with priority 2 (step S420), and the processing unit 17 performs piercing with the piercing method B with priority 2 (step S430). For example, when the machining conditions are the machining conditions shown in FIGS. 18 and 19 and the machining area is the machining area 52 shown in FIG. 16, the piercing is performed with the priority 2 piercing method B (piercing position PB). Done. Further, when the machining condition is the machining condition shown in FIG. 19 and the machining area is the machining area 53 shown in FIG. 17, the piercing is performed by the priority 2 piercing method B (piercing position PB).

  On the other hand, when the piercing area 61A interferes with the machining path of the product shape 46 (No in step S390), the piercing selection unit 13 selects the standard piercing position PO (initially set piercing position PO) that has been initially set. After selecting (step S440), the processing unit 17 performs piercing by the standard piercing method D (step S440).

  Also, when the piercing selection unit 13 determines that the length of the piercing line is not changed in the process of step S310 (step S310, No), the piercing selection unit 13 sets the standard piercing position PO that was initially set. Is selected (step S440), and the processing unit 17 performs piercing using the standard piercing method D (step S440). For example, when the machining area is the machining area 51 shown in FIG. 15, piercing is performed by the standard piercing method D (piercing position PO). Further, when the machining conditions are the machining conditions shown in FIG. 20 and the machining areas are the machining areas 51, 52, and 53 shown in FIGS. 15, 16, and 17, the standard piercing method D (piercing position PO) Piercing takes place at. The piercing selection unit 13 performs a piercing method selection process for each processing area based on the total piercing time.

  In the present embodiment, the case where the piercing position is changed with respect to the standard piercing position PO has been described. However, when the standard piercing position PO is not set, the piercing method is based on the total piercing time or the like. You may choose. In this case, a piercing method that does not interfere with the piercing region and the machining path of the product shape 46 and that can pierce in the shortest time is selected.

  Further, in the present embodiment, the case has been described where the piercing line is extended from the standard piercing method D based on the total piercing time. However, the piercing line is made shorter than the standard piercing method D based on the total piercing time. May be. Also in this case, a piercing method that does not interfere with the piercing region and the machining path of the product shape 46 and that can perform piercing in the shortest time is selected.

  In this embodiment, the piercing method is selected so that the piercing region and the machining path of the product shape 46 do not interfere with each other. However, even if the piercing method capable of performing piercing in the shortest time regardless of the interference is selected. Good.

  In the present embodiment, the case where the total piercing time is the total of the piercing time, the time required for machining the start section 42, and the time required for machining the cutting section 43 has been described. You may add time. For example, the piercing method is selected by adding the movement time of the machining nozzle from the previous machining area to the piercing position of the next machining area to the total piercing time.

  As described above, according to the third embodiment, the piercing method in which the piercing region and the machining path of the product shape 46 do not interfere with each other and the piercing method having the shortest piercing time is selected. Can be performed quickly.

  As described above, the laser processing apparatus, laser processing method, programming apparatus, and programming method according to the present invention are suitable for selecting a piercing method.

1 is a block diagram illustrating a configuration of a laser processing apparatus according to Embodiment 1. FIG. It is a figure (1) for demonstrating the kind of piercing method. It is FIG. (2) for demonstrating the kind of piercing method. 3 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment. It is a figure which shows an example of the process sequence of a to-be-processed object. It is a figure which shows an example of a structure of piercing kind information. It is a figure which shows an example of a structure of priority information. It is a flowchart which shows the selection processing procedure of a piercing method. It is a figure which shows the structure of a programming apparatus. It is a figure for demonstrating the case where the scattered material accumulated in the height direction and the process nozzle collide. It is a block diagram which shows the structure of the laser processing apparatus which concerns on Embodiment 2. FIG. It is a figure which shows the piercing hole and piercing area | region at the time of controlling a piercing shape. It is a figure for demonstrating the process route from a piercing to a product process. 10 is a flowchart showing an operation procedure of the laser processing apparatus according to the third embodiment. It is a figure (1) for demonstrating the setting method of a piercing position. It is FIG. (2) for demonstrating the setting method of a piercing position. It is a figure (3) for demonstrating the setting method of a piercing position. It is a figure (1) which shows the relationship between a piercing method and piercing total time. It is a figure (2) which shows the relationship between a piercing method and piercing total time.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Programming apparatus 5 Workpiece 11 Processing program input part 12 Processing path judgment part 13 Piercing selection part 14 Piercing information storage part 15 Instruction part 16 Processing control part 17 Processing part 18 Output part 19 Control part 21 Piercing shape control Part 30 Processing nozzle 32 Scattered object 41 Piercing position 42 Start section 43 Cutting section 44 Piercing line section 45 Product processing start position 46 Product shape 50 to 53 Processing area 61A, 61B, 61X, 61Y Piercing area 101 Piercing type information 102 Priority information a1, b1, c1, d1 Piercing hole a2, b2, c2, d2 Piercing area E1 Processing end point P, Q, R Processing area PA, PB, PO Piercing position S1 Start point

Claims (9)

In a laser processing apparatus that performs laser processing of a workpiece after piercing the workpiece,
A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from a machining program used when machining the workpiece. When,
A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
A selection unit that selects a piercing method according to the product area for each product area on the workpiece based on the processing path information and the scattered object information;
A processing unit that performs laser processing of the workpiece by the piercing method selected by the selection unit;
Equipped with a,
The scattered matter information includes information related to an in-plane region of the scattered matter that adheres to the processed surface of the workpiece,
The laser processing apparatus , wherein the selection unit selects a piercing method in which the product region and the in-plane region of the scattered object do not overlap with each other and the piercing method can be performed in the shortest time .   In a laser processing apparatus that performs laser processing of a workpiece after piercing the workpiece,
  A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from a machining program used when machining the workpiece. When,
  A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
  A selection unit that selects a piercing method according to the product area for each product area on the workpiece based on the processing path information and the scattered object information;
  A processing unit that performs laser processing of the workpiece by the piercing method selected by the selection unit;
  With
  The machining path information includes information related to the position of a machining nozzle when laser processing the product region, and the scattered matter information includes in-plane direction and scattering of the scattered matter adhering to the processed surface of the workpiece. Contains information about the spatial area of the flying object that is the height direction of the object,
  The laser processing apparatus, wherein the selection unit selects a piercing method in which the processing nozzle and the scattered object do not collide, and the piercing method can be performed in the shortest time.   In a laser processing apparatus that performs laser processing of a workpiece after piercing the workpiece,
  A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from a machining program used when machining the workpiece. When,
  A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
  A selection unit that selects a piercing method according to the product area for each product area on the workpiece based on the processing path information and the scattered object information;
  A processing unit that performs laser processing of the workpiece by the piercing method selected by the selection unit;
  With
  The storage unit stores, for each type of piercing method, a time required for processing a piercing position and a time required for processing a piercing line that is a route from the piercing position to the product area, as a total piercing time,
  The said selection part selects the piercing method for every said product area | region based on the said total piercing time, The laser processing apparatus characterized by the above-mentioned. Further comprising a piercing shape control unit for controlling the area where the scattered matter is scattered,
The storage unit stores scattered object information related to the area of the scattered object controlled by the piercing shape control unit, and the processing unit performs laser processing of the workpiece while controlling the area of the scattered object by the piercing shape control unit. The laser processing apparatus according to claim 1, wherein: In a programming device for creating a new machining program using machining position information relating to a laser machining position on the workpiece used when performing laser machining after piercing the workpiece,
A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from the machining position information;
A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
Based on the machining path information and the scattered object information, a piercing method corresponding to the product area is selected for each product area on the workpiece, and a new machining program is created using the selected piercing method. A selection section;
Equipped with a,
The scattered matter information includes information related to an in-plane region of the scattered matter that adheres to the processed surface of the workpiece,
The programming device according to claim 1, wherein the selection unit selects a piercing method in which the product region and the in-plane region of the scattered object do not overlap and can perform piercing in the shortest time .   In a programming device for creating a new machining program using machining position information relating to a laser machining position on the workpiece used when performing laser machining after piercing the workpiece,
  A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from the machining position information;
  A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
  Based on the machining path information and the scattered object information, a piercing method corresponding to the product area is selected for each product area on the workpiece, and a new machining program is created using the selected piercing method. A selection section;
  With
  The machining path information includes information related to the position of a machining nozzle when laser processing the product region, and the scattered matter information includes in-plane direction and scattering of the scattered matter adhering to the processed surface of the workpiece. Contains information about the spatial area of the flying object that is the height direction of the object,
  The programming device according to claim 1, wherein the selection unit selects a piercing method in which the machining nozzle and the scattered object do not collide and can perform piercing in the shortest time.   In a programming device for creating a new machining program using machining position information relating to a laser machining position on the workpiece used when performing laser machining after piercing the workpiece,
  A machining path extraction unit that extracts machining path information related to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from the machining position information;
  A storage unit that stores, for each type of piercing method, scattered object information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece.
  Based on the machining path information and the scattered object information, a piercing method corresponding to the product area is selected for each product area on the workpiece, and a new machining program is created using the selected piercing method. A selection section;
  With
  The storage unit stores, for each type of piercing method, a time required for processing a piercing position and a time required for processing a piercing line that is a route from the piercing position to the product area, as a total piercing time,
  The programming unit, wherein the selection unit selects a piercing method for each product area based on the total piercing time. In a laser processing method for performing laser processing on a workpiece after piercing the workpiece,
A machining path extracting step for extracting machining path information relating to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from a machining program used when machining the workpiece. When,
Based on the scattered object information and the processing path information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece, the product area for each product area on the workpiece A piercing selection step of selecting a corresponding piercing method;
A processing step of performing laser processing on the workpiece by the selected piercing method;
Only including,
The scattered matter information includes information related to an in-plane region of the scattered matter that adheres to the processed surface of the workpiece,
In the piercing selection step, a piercing method is selected in which the product region and the in-plane region of the scattered object do not overlap, and the piercing method capable of performing piercing in the shortest time is selected . In a programming method for creating a new machining program using machining position information related to a laser machining position on the workpiece used when performing laser machining after piercing the workpiece,
A machining path extraction step for extracting machining path information relating to a machining path of the workpiece including a piercing position of the workpiece and a product area of the workpiece from the machining position information;
Based on the scattered object information and the processing path information related to the area of the scattered object that scatters on the workpiece when piercing the workpiece, the product area for each product area on the workpiece A piercing selection step of selecting a corresponding piercing method;
A creation step for creating a new machining program using the selected piercing method;
Only including,
The scattered matter information includes information related to an in-plane region of the scattered matter that adheres to the processed surface of the workpiece,
In the piercing selection step, a piercing method is selected in which the product area and the in-plane area of the scattered object do not overlap with each other and the piercing method can be performed in the shortest time .

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