JP4924989B2 - Glass substrate, flat display panel using the same, and method for producing glass substrate - Google Patents
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Description
本発明は、フラットディスプレイパネルに用いられるガラス基板に係り、特に３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃であるガラス基板に関する。 The present invention relates to a glass substrate used for a flat display panel, and more particularly to a glass substrate having a linear expansion coefficient of 60 to 130 × 10 −7 / ° C. in a temperature range of 30 to 380 ° C.
周知のように、プラズマディスプレイパネル｛ＰＤＰ｝、フィールドエミッションディスプレイパネル｛ＦＥＤ［サーフェイスエミッションディスプレイ（ＳＥＤ）を含む：以下同様］｝等のフラットディスプレイパネルは、表面に微細な電極や隔壁等の素子或いは構造体を形成した二枚のガラス基板を対向させて製作される。 As is well known, a flat display panel such as a plasma display panel {PDP}, a field emission display panel {FED [including a surface emission display (SED); The two glass substrates on which the structure is formed are manufactured to face each other.
この種のガラス基板は、フュージョン法（オーバーフローダウンドロー法）、フロート法、またはスロットダウンドロー法に代表される公知の方法により成形された大型のガラス元板を、四辺が所定寸法の矩形をなすように切断して得られる。 This type of glass substrate is a large glass base plate formed by a known method represented by a fusion method (overflow down draw method), a float method, or a slot down draw method, and has a rectangular shape with four sides. It is obtained by cutting as follows.
この切断後のガラス基板に対する種々の素子や構造体の形成は、一般的にはガラス基板の各辺の所定ポイントを基準とする位置決めをして行われるが、その際には通例、この種のガラス基板の歪点付近或いは歪点以上の温度である５００〜６００℃で熱処理が行われる。 The formation of various elements and structures on the glass substrate after cutting is generally performed by positioning with reference to a predetermined point on each side of the glass substrate. The heat treatment is performed at 500 to 600 ° C., which is a temperature near or above the strain point of the glass substrate.
このような熱処理が行われることにより、熱処理後のガラス基板の寸法は、熱処理前の元寸法と比較して微妙に変化するが、その変化の態様は、元の寸法よりも膨張することがあるものの、収縮することが多いことから、一般に熱収縮と称されている。この熱収縮は、ガラス基板に素子や構造体を形成する際に、設計した形成態様との間でズレを生じさせる主たる要因となっているのが実情である。 By performing such a heat treatment, the dimension of the glass substrate after the heat treatment slightly changes compared to the original dimension before the heat treatment, but the mode of the change may expand more than the original dimension. However, since it often shrinks, it is generally called heat shrinkage. The fact is that this thermal shrinkage is a main factor causing a deviation from the designed formation mode when an element or a structure is formed on a glass substrate.
そこで、このズレに対しては、素子や構造体をガラス基板に形成する際に使用されるマスク（版）を、熱処理に伴う熱収縮分に応じた補正をして製作し、或いは素子や構造体の形成に際して使用される装置を補正するなどして、熱収縮の影響を極小化しているが、その補正によっても対処できない分については、加熱・徐冷のオフラインアニール処理によりガラス基板の構造の安定化及びこれに伴う熱収縮の低減を企図することが、従来の一般的手法とされていた。 Therefore, for this displacement, a mask (plate) used when forming an element or structure on a glass substrate is manufactured with correction according to the heat shrinkage accompanying the heat treatment, or the element or structure. The effect of thermal shrinkage has been minimized by correcting the equipment used in the formation of the body, but for the part that can not be dealt with even by the correction, the structure of the glass substrate is changed by heating / slow cooling offline annealing treatment. Attempting to stabilize and reduce the thermal shrinkage associated therewith has been the traditional approach.
一方、特許文献１には、ＰＤＰ等のフラットディスプレイパネルに用いられるガラス基板として、一定条件下での熱処理後における当該ガラス基板の縦方向と横方向の熱収縮率の差が±５ｐｐｍ以下になるようにして、ガラス基板に形成される電極パターンのズレを抑制することが開示されている。 On the other hand, in Patent Document 1, as a glass substrate used in a flat display panel such as a PDP, the difference in thermal shrinkage between the vertical direction and the horizontal direction of the glass substrate after heat treatment under a certain condition is ± 5 ppm or less. Thus, it is disclosed to suppress the deviation of the electrode pattern formed on the glass substrate.
また、特許文献２には、液晶ディスプレイパネルやＥＬディスプレイパネルに用いられる無アルカリガラス基板として、所定の温度スケジュールで熱処理した時の熱収縮率の絶対値が５０ｐｐｍ以上になるようにして、当該ガラス基板に安定してパターン形成を行うことが開示されている。
ところで、上記例示したように、ガラス基板の熱収縮に起因する素子等の形成のズレを抑制すべく、マスクの補正、素子等形成用の装置の補正、或いはオフラインアニール処理の付加を行うのみでは、ガラス基板の相互間に熱収縮率のバラツキが生じていると、マスクや装置に同一の補正をしても、上記バラツキが原因となって全てのガラス基板に正確に素子や構造体を形成することができなくなる。そのため、マスクや装置の共通化を図ることができず、それらの製作の困難化を余儀なくされる。そして、ガラス基板の熱収縮率絶対値の大きさ、および各ガラス基板相互間の熱収縮率のバラツキ、ならびにその絶対値とバラツキとの相対関係は、ＰＤＰやＦＥＤからなるフラットディスプレイパネルを量産する上で極めて重要な要因となる。すなわち、マスクや装置の共通化を図るには、上記の絶対値およびバラツキが小さければ有利となることは当然であるが、この絶対値が過度に小さいと、過剰品位となって無駄が生じるため、特にその絶対値とバラツキとの相対関係をどのようにすれば最適であるかが問題となる。 By the way, as exemplified above, in order to suppress the deviation of the formation of elements and the like due to the thermal shrinkage of the glass substrate, it is only necessary to correct the mask, correct the apparatus for forming the elements, or add an offline annealing process. If there is variation in the thermal shrinkage between the glass substrates, even if the same correction is made to the mask and the device, elements and structures are accurately formed on all glass substrates due to the variation. Can not do. For this reason, it is impossible to make the mask and the apparatus common, and it is necessary to make them difficult to manufacture. The magnitude of the absolute value of the thermal shrinkage rate of the glass substrate, the variation in the thermal shrinkage rate between the glass substrates, and the relative relationship between the absolute value and the variation are mass-produced flat display panels made of PDP or FED. This is a very important factor. In other words, in order to make the mask and apparatus common, it is natural that it is advantageous if the absolute value and variation are small, but if the absolute value is excessively small, excessive quality is generated and waste is generated. In particular, it is a problem how the relative value between the absolute value and the variation is optimal.
なお、特許文献１に開示された技術的思想は、ＰＤＰ等に用いられるガラス基板の縦方向と横方向の熱収縮率の差を問題とするものであるため、ＰＤＰ等の生産に用いられる多数または二枚のガラス基板相互間のバラツキ等、更にはそのようなバラツキ等と複数のガラス基板の熱収縮率絶対値との相対関係を問題としたものではない。そのため、上述のマスクの共通化の問題に対処することは当然の事ながら不可能である。 In addition, since the technical idea disclosed in Patent Document 1 is concerned with the difference in the thermal shrinkage rate between the vertical direction and the horizontal direction of a glass substrate used for PDP or the like, many of them are used for production of PDP or the like. Alternatively, there is no problem with variations between two glass substrates, or the relative relationship between such variations and the absolute value of the thermal shrinkage rate of a plurality of glass substrates. For this reason, it is not possible of course to deal with the problems of the common of the above-mentioned mask.
また、特許文献２に開示された技術的思想は、液晶ディスプレイパネルやＥＬディスプレイパネルに用いられる無アルカリガラス基板を対象とするものであるため、ＰＤＰやＦＥＤを対象とするガラス基板（３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃のガラス基板）については対処することが不可能である。しかも、同文献に開示された技術的思想は、ガラス基板の熱収縮率の絶対値のみを問題とするものであって、複数のガラス基板相互間における熱収縮率のバラツキ等、およびそのようなバラツキ等と複数のガラス基板の熱収縮率絶対値との相対関係を問題としたものではない。そのため、この場合にも、上述のマスクの共通化の問題、或いはパネルに二枚のガラス基板を組み付ける際の対向する素子等の位置関係の正確性および組み付け性の問題に対処することは当然の事ながら不可能である。 In addition, since the technical idea disclosed in Patent Document 2 is directed to a non-alkali glass substrate used for a liquid crystal display panel or an EL display panel, a glass substrate (30 to 380) targeted for a PDP or FED. It is impossible to deal with a glass substrate having a linear expansion coefficient of 60 to 130 × 10 −7 / ° C. in the temperature range of ° C. Moreover, the technical idea disclosed in the same document is concerned only with the absolute value of the thermal shrinkage rate of the glass substrate, and the variation in the thermal shrinkage rate between the plurality of glass substrates, and the like. The relative relationship between the variation or the like and the absolute value of the thermal shrinkage rate of the plurality of glass substrates is not a problem. Therefore, in this case as well, it is a matter of course to deal with the above-mentioned problem of the common use of the mask or the problem of the positional relationship between the opposing elements when the two glass substrates are assembled to the panel and the assembling property. It is impossible.
本発明は、上記事情に鑑み、ガラス基板に素子等を形成する際に使用するマスクの共通化等を図るために、熱収縮率が適切に特定されたガラス基板を提供することを技術的課題とする。 In view of the above circumstances, the present invention provides a glass substrate having a heat shrinkage rate appropriately specified in order to make a mask used for forming elements and the like on a glass substrate common. And
本発明者等は、鋭意研究を重ねた結果、特にＰＤＰやＦＥＤに使用されるガラス基板の熱収縮率に関する条件のうち、熱収縮率絶対値の大きさと、複数のガラス基板相互間の熱収縮率のバラツキまたは差との相対関係に着目し、この相対関係が適切であれば、過剰品位およびこれに起因する無駄を生じることなく、当該パネルを有利な状態で生産できることを案出し、これにより本発明を完成させるに至ったものである。 As a result of intensive research, the present inventors have determined that the absolute value of the thermal contraction rate and the thermal contraction between a plurality of glass substrates among the conditions relating to the thermal contraction rate of the glass substrate used in PDP and FED in particular. Paying attention to the relative relationship with the rate variation or difference, if this relative relationship is appropriate, devised that the panel can be produced in an advantageous state without causing excess quality and waste due to this, thereby The present invention has been completed.
このような見地から、上記技術的課題を解決するために創案された本発明は、フラットディスプレイパネルに用いられ、３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃であり、短辺寸法が６００〜３０００ｍｍ及び長辺寸法が７００〜５０００ｍｍの矩形をなし、板厚が１．１〜４．０ｍｍのガラス基板であって、一のロットにおける板厚が異なる二種以上のガラス基板の各々に対して室温から加熱処理を施すことにより６００℃で１時間に亘って保持した後に再び室温に戻した時の該各ガラス基板の熱収縮率絶対値が３５０〜５００ｐｐｍであり、且つ、該各ガラス基板相互間の前記熱収縮率絶対値のバラツキ及び該各ガラス基板内の前記熱収縮率絶対値のバラツキが±８％以内であることに特徴づけられる。 From this point of view, this onset Ming was invented in order to solve the above technical problem, used for a flat display panel, the linear expansion coefficient in a temperature range of 30 to 380 ° C. is 60 to 130 × 10 -7 / A glass substrate having a rectangular shape with a short side dimension of 600 to 3000 mm and a long side dimension of 700 to 5000 mm, a plate thickness of 1.1 to 4.0 mm, and different plate thicknesses in one lot. 350 is the absolute value thermal shrinkage of each of the glass substrate when again returned to room temperature after holding for one hour at 600 ° C. followed by heat treatment from room temperature to each of the species or more glass substrate is 500 ppm, and, the variation of the thermal shrinkage absolute value of the thermal shrinkage absolute value of the variation and the respective glass substrates between respective glass substrates each other is marked particular feature is within 8% ±.
ここで、上記の「一のロット」とは、狭義には、同一条件で製造された製品の集まりを意味するが、これに限定されず、広義には、同一の管理者により品質管理された同種の製品の集まりを意味する（以下、同様）。また、上記の「３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃」であるガラス基板は、ＰＤＰやＦＥＤの製作に用いられるガラス基板であって、このガラス基板は、液晶ディスプレイやＥＬディスプレイに用いられるガラス基板（３０〜３８０℃の温度範囲における線膨張係数が３０〜５０×１０-7／℃）とは明確に区別できるものである（以下、同様）。更に、上記の「熱収縮率絶対値」と表した理由は、上記の条件でガラス基板に加熱処理を施した場合に熱収縮のみならず熱膨張が生じて、符号が負と正とになることがあり、この熱収縮と熱膨張とを総称して熱収縮としたことから、その熱収縮率の絶対値をとる必要性が生じたことによる。なお、以下で述べている全ての事項において、単に「熱収縮率」と記載されている用語は、「熱収縮率絶対値」を意味している。また、上記の「室温」とは、２５℃を意味する。 Here, the above-mentioned “one lot” means a collection of products manufactured under the same conditions in a narrow sense, but is not limited to this, and in a broad sense, quality control is performed by the same manager. It means a collection of similar products (the same applies hereinafter). The glass substrate having the above-mentioned “linear expansion coefficient in the temperature range of 30 to 380 ° C. of 60 to 130 × 10 −7 / ° C.” is a glass substrate used for manufacturing PDP and FED, and this glass substrate Is clearly distinguishable from a glass substrate (linear expansion coefficient in a temperature range of 30 to 380 ° C. is 30 to 50 × 10 −7 / ° C.) used for a liquid crystal display or an EL display (the same applies hereinafter). Furthermore, the reason why the above-mentioned “heat shrinkage rate absolute value” is expressed is that not only heat shrinkage but also thermal expansion occurs when the glass substrate is heated under the above conditions, and the sign becomes negative and positive. In some cases, the heat shrinkage and the thermal expansion are collectively referred to as heat shrinkage, so that it is necessary to take the absolute value of the heat shrinkage rate. In all matters described below, the term simply described as “heat shrinkage rate” means “absolute value of heat shrinkage rate”. The above “room temperature” means 25 ° C.
このような構成によれば、一のロット内における各ガラス基板の上記条件での熱処理後の熱収縮率絶対値が３５０〜５００ｐｐｍとされているから、ＰＤＰやＦＥＤ用のガラス基板としては、過剰品位とならない範囲内で熱変形による悪影響を受けることが抑止される。詳述すると、熱収縮率絶対値が上記の数値範囲内に存するガラス基板は、素子や構造体を当該ガラス基板に形成するに際して、歪点付近或いは歪点以上の温度で熱処理を受けても、その形成をする以前における当初の設計との間にズレによる問題は生じない。すなわち、ガラス基板に素子或いは構造体を形成する際に使用されるマスクや装置を補正することなく熱処理を伴ってそれらの形成が可能になるか、または上記のマスクや装置を補正可能な範囲内に留めた状態で熱処理を伴ってそれらの形成が可能になる。したがって、上記のマスクや装置を補正可能な範囲内に留めることを目的とした場合の上限値が５００ｐｐｍであり、過剰品位とならないようにすることを目的とした下限値が３５０ｐｐｍである。そして、このような数値範囲の熱収縮率絶対値とされた上で、各ガラス基板相互間の熱収縮率のバラツキが±８％以内とされていることから、すなわち両者の値の相対関係が適切であるから、素子や構造体を各ガラス基板に形成する際に使用されるマスク（補正後のマスクを含む）の共通化を図ることが可能となる。したがって、熱収縮率絶対値が３５０〜５００ｐｐｍとされた状態の下では、上記のバラツキが±８％を超えると、マスクの共通化を図ることが困難となる。これに加えて、各ガラス基板内の熱収縮率のバラツキも±８％以下とされているため、各ガラス基板に均等に且つ機能面で支障なく素子や構造体を形成することが可能になると共に、マスクの補正削減および共通化を図る上でより一層有利となる。 According to such a configuration, the absolute value of the heat shrinkage rate after heat treatment under the above conditions for each glass substrate in one lot is set to 350 to 500 ppm. Therefore, as a glass substrate for PDP or FED, it is excessive. It is possible to prevent adverse effects from thermal deformation within a range that does not result in quality. Specifically, a glass substrate having a thermal contraction rate absolute value within the above numerical range may be subjected to a heat treatment at a temperature near or above the strain point when forming an element or structure on the glass substrate. There is no problem of deviation from the original design before the formation. That is, it becomes possible to form them with heat treatment without correcting the masks and devices used when forming elements or structures on the glass substrate, or within the range where the above masks and devices can be corrected. They can be formed with heat treatment in the state of being kept in the state. Therefore, the upper limit for the purpose of keeping the above-described mask or apparatus within the correctable range is 500 ppm, and the lower limit for the purpose of avoiding excessive quality is 350 ppm. And after setting the absolute value of the heat shrinkage rate in such a numerical range, the variation in the heat shrinkage rate between the glass substrates is within ± 8%, that is, the relative relationship between the two values is Since it is appropriate, it is possible to share a mask (including a corrected mask) used when forming elements and structures on each glass substrate. Therefore, under the condition that the absolute value of the heat shrinkage rate is 350 to 500 ppm, it becomes difficult to make the mask common if the above variation exceeds ± 8%. In addition, since the variation in the thermal shrinkage rate within each glass substrate is ± 8% or less, it becomes possible to form elements and structures on each glass substrate evenly and without any functional problems. At the same time, it is even more advantageous in reducing mask correction and sharing.
この場合、前記一のロットにおける前記ガラス基板の各々は、板厚が異なる二種以上からなるものとされている。 In this case, each of the glass substrates in the one lot is made of two or more kinds having different plate thicknesses .
このようにすれば、一のロット内における各々のガラス基板の板厚が異なる場合であっても、各ガラス基板の熱収縮率絶対値と、各ガラス基板相互間の熱収縮率のバラツキとの相対関係が、既述にように適切になり、且つ各ガラス基板内の熱収縮率のバラツキも適切になるため、ＰＤＰやＦＥＤ用のガラス基板として過剰品位とならない範囲内で熱変形による悪影響を受けることが抑止される。なお、ＰＤＰやＦＥＤ用のガラス基板としては、仕様が相違しまたは変更されるなどの理由により、板厚の異なるガラス基板を仕様に応じて変更して用いる場合があるが、その場合に、板厚の変更前後のガラス基板に対する素子や構造体の形成に際して、そのガラス基板が歪点付近或いは歪点以上の温度で熱処理されても、上記と同様に、当初の設計との間におけるズレが問題となることはない。 In this way, even if the thickness of each glass substrate in one lot is different, the absolute value of the thermal shrinkage rate of each glass substrate and the variation in the thermal shrinkage rate between the glass substrates. Since the relative relationship is appropriate as described above, and the variation in the thermal shrinkage rate in each glass substrate is also appropriate, there is an adverse effect due to thermal deformation within a range that does not become excessive quality as a glass substrate for PDP or FED. It is deterred from receiving. In addition, as a glass substrate for PDP or FED, there is a case where a glass substrate having a different thickness is used depending on the specification because the specification is different or changed. When forming an element or structure on a glass substrate before and after the change of thickness, even if the glass substrate is heat-treated at a temperature near or above the strain point, there is a problem of deviation from the original design as described above. It will never be.
以上のガラス基板は、成形を終えた後に、オフラインアニール処理が施されていないことが好ましい。ここで、オフラインアニール処理は、オンラインアニール処理と区別されるものであって、オンラインアニール処理は、ガラス基板の成形工程に連続する処理またはその成形工程中の終盤で行われる処理であるのに対して、オフラインアニール処理は、ガラス基板の成形工程を終えた後に別途行われる処理である。 The above glass substrate is preferably not subjected to an offline annealing treatment after the molding. Here, the offline annealing process is distinguished from the online annealing process, and the online annealing process is a process that is continuous with the glass substrate molding process or a process that is performed at the end of the molding process. The offline annealing process is a process separately performed after the glass substrate forming step.
このようにすれば、オフラインアニール処理を不要として、既述の適切な特性を有するガラス基板を得ることができるため、処理数の削減および処理時間の短縮を図ることが可能となる。 In this way, since the glass substrate having the appropriate characteristics described above can be obtained without the need for offline annealing, it is possible to reduce the number of processes and the processing time.
以上のガラス基板は、ＰＤＰまたはＦＥＤに用いられることにより、その効果を最大限に発揮できるものであると共に、このガラス基板を用いて、フラットディスプレイパネル、特にＰＤＰを製作すれば、品質の優れたパネルを得ることができる。 The above glass substrate can be used for PDP or FED to maximize its effect, and if this glass substrate is used to produce a flat display panel, particularly a PDP, the quality is excellent. You can get a panel.
また、上記技術的課題を解決するために創案された本発明に係る方法は、フラットディスプレイパネルに用いられ、３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃であり、短辺寸法が６００〜３０００ｍｍ及び長辺寸法が７００〜５０００ｍｍの矩形をなし、板厚が１．１〜４．０ｍｍのガラス基板を成形する工程に連続してまたはその成形工程中の終盤に、ガラスリボンがオンラインアニールゾーンを通過してオンラインアニール処理を受けるガラス基板の製造方法であって、一のロットにおける板厚が異なる二種以上のガラス基板の各々に対して室温から加熱処理を施すことにより６００℃で１時間に亘って保持した後に再び室温に戻した時の該各ガラス基板の熱収縮率絶対値が３５０〜５００ｐｐｍの範囲内に収まっているか否か、並びに該各ガラス基板相互間の前記熱収縮率絶対値のバラツキ及び該各ガラス基板内の前記熱収縮率絶対値のバラツキが±８％の範囲内に収まっているか否かを検査し、その検査の結果、前記双方の数値が共に前記範囲内に収まっていない場合に、前記オンラインアニール処理に関する条件を変更調整することに特徴づけられる。 The method according to the present invention, which was created to solve the above technical problem, is used for a flat display panel, and has a linear expansion coefficient of 60 to 130 × 10 −7 / ° C. in a temperature range of 30 to 380 ° C. There is a rectangle with a short side dimension of 600 to 3000 mm and a long side dimension of 700 to 5000 mm, and is continuous with the process of forming a glass substrate with a plate thickness of 1.1 to 4.0 mm, or at the end of the forming process the glass ribbon is passed through a line annealing zone to a process for producing a glass substrate for receiving the line annealing treatment, heat treatment from room temperature to each of the glass substrates of thickness different two or more kinds in one lot When the glass substrate is held at 600 ° C. for 1 hour and then returned to room temperature, the absolute value of the thermal shrinkage of each glass substrate is in the range of 350 to 500 ppm. And whether fall, as well as whether or not the variation of the thermal shrinkage rate absolute value of the thermal shrinkage absolute value of the variation and the respective glass substrates between respective glass substrates each other is within a range of 8% ± If both of the numerical values are not within the range as a result of the inspection, the condition relating to the online annealing process is changed and adjusted.
ここで、上記の「オンラインアニールゾーン」とは、フロート法、フュージョン法またはスロットダウンドロー法等のガラス板製造方法における溶融ガラスからの成形工程で得られるガラスリボンに対してオンラインアニール処理を施すためのゾーンをいう。 Here, the above-mentioned “online annealing zone” is for performing on-line annealing treatment on a glass ribbon obtained in a molding process from molten glass in a glass plate manufacturing method such as a float method, a fusion method or a slot down draw method. Zone.
このような方法によれば、一のロットにおける各ガラス基板の熱収縮率絶対値と、各ガラス基板相互間の熱収縮率のバラツキ及び該各ガラス基板内の熱収縮率のバラツキとを検査し、その検査結果としてガラス基板が不良品である場合には、その後のガラス基板の製造時において、溶融ガラスからガラス元板を成形する工程の終盤におけるオンラインアニール処理に関する条件が変更調整される。すなわち、ガラス基板を製造する過程では、最終的に得られるガラス基板の特性を変化させる条件が多数存在するが、上記の熱収縮率絶対値及び二種のバラツキという特性を変化させる条件としては、オンラインアニール処理に関する条件を変更調整することが最適であることを、本発明者等が知見して、この方法が案出されるに至った。そして、この変更調整に伴って、ガラスリボンに対して適切なアニール処理が施されることになるため、そのガラスリボンが固化して最終的に得られるガラス基板は、その諸特性を示す上記数値の全てが上記範囲内に収まった良品となる。 According to such a method, the absolute value of the heat shrinkage rate of each glass substrate in one lot, the variation in the heat shrinkage rate between the glass substrates, and the variation in the heat shrinkage rate in each glass substrate are inspected. When the glass substrate is defective as a result of the inspection, the conditions relating to the online annealing process at the end of the process of forming the glass base plate from the molten glass are changed and adjusted during the subsequent production of the glass substrate. That is, in the process of manufacturing the glass substrate, there are many conditions for changing the properties of the finally obtained glass substrate, but as the conditions for changing the above characteristics of the thermal shrinkage absolute value and the two types of variation, The present inventors have found that it is optimal to change and adjust the conditions related to the online annealing treatment, and have come up with this method. And with this change adjustment, an appropriate annealing treatment is applied to the glass ribbon, and the glass substrate finally obtained by solidifying the glass ribbon has the above-mentioned numerical values indicating its various characteristics. Are all non-defective products within the above range.
上述の方法において、前記オンラインアニール処理に関する条件は、前記オンラインアニールゾーンの長さと、前記オンラインアニールゾーンを流れるガラスリボンの幅と、その板厚と、その速さと、前記オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布と、前記オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布とであって、それらのうち少なくとも一つの条件を変更調整することが好ましい。 In the above-described method, the conditions relating to the online annealing treatment are the length of the online annealing zone, the width of the glass ribbon flowing through the online annealing zone, the thickness thereof, the speed thereof, and the glass ribbon in the online annealing zone. and the temperature distribution in the flow direction of, the there between a temperature distribution in the direction perpendicular to the flow direction of the glass ribbon in the online annealing zone, it is preferable to adjust change their least one condition of the.
すなわち、オンラインアニールゾーンの長さと、前記オンラインアニールゾーンを流れるガラスリボンの幅と、その板厚と、その速さと、前記オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布と、前記オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布とは、各ガラス基板の熱収縮率絶対値を３５０〜５００ｐｐｍの範囲内に収め且つ各ガラス基板相互間の熱収縮率のバラツキ及び該各ガラス基板内の熱収縮率のバラツキを±８％の範囲内に収めるための重要な要因である。したがって、不良品のガラス基板を良品とするためには、それらの要因の少なくとも一つを変更調整すればよいことになる。その結果、一時的に不良品のガラス基板が製造されても、上記の変更調整によって、既述のガラス基板と同様の効果を奏する良品のガラス基板を得ることが可能となる。 That is, the length of the online annealing zone, the width of the glass ribbon flowing through the online annealing zone, the plate thickness, the speed thereof, the temperature distribution in the flow direction of the glass ribbon in the online annealing zone, and the online annealing zone The temperature distribution of the glass ribbon in the direction orthogonal to the flow direction is that the absolute value of the thermal shrinkage rate of each glass substrate falls within the range of 350 to 500 ppm, and the variation in the thermal shrinkage rate between the glass substrates, This is an important factor for keeping the variation of the thermal shrinkage rate in each glass substrate within a range of ± 8%. Therefore, in order to make a defective glass substrate a non-defective product, at least one of those factors may be changed and adjusted. As a result, the glass substrate temporarily defective products be manufactured by above changes adjustment, it is possible to obtain a glass substrate of good to achieve the same effect as glass substrate described above.
以上のように本発明によれば、とりわけＰＤＰやＦＥＤに使用されるガラス基板について、一のロット内における板厚が異なる二種以上の各ガラス基板の熱収縮率に関する条件のうち、熱収縮率絶対値の大きさと、複数のガラス基板相互間の熱収縮率のバラツキとの相対関係が適切とされ、且つ個々のガラス基板内の熱収縮率のバラツキが適切とされているので、過剰品位およびこれに起因する無駄を生じることなく、当該パネルを有利な状態で製造できることになる。特に、ガラス基板に素子或いは構造体を形成する際に使用されるマスクや装置を共通化する上で、極めて有利となる。 According to the present invention as described above, especially for glass substrates used in PDP and FED, of the conditions relating to thermal shrinkage thickness different two or more kinds of the glass board within one lot, heat shrinkable and the magnitude of the rate absolute value, relative relationship between Baratsu key of thermal shrinkage between the plurality of glass substrates each other is appropriate, and since variations in individual heat shrinkage of the glass substrate is appropriate, excess The panel can be manufactured in an advantageous state without causing quality and waste due to this. In particular, it is extremely advantageous in sharing a mask and an apparatus used when forming an element or a structure on a glass substrate.
以下、本発明の実施形態に係るガラス基板を説明する。なお、当該ガラス基板は、ＰＤＰやＦＥＤに使用されるものであって、液晶ディスプレイやＥＬディスプレイに使用されるものではない。 Hereinafter, the glass substrate which concerns on embodiment of this invention is demonstrated. In addition, the said glass substrate is used for PDP and FED, and is not used for a liquid crystal display or EL display.
本発明の第１実施形態に係るガラス基板は、ＰＤＰやＦＥＤを対象とするものであるため、３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃であると共に、短辺寸法が６００〜３０００ｍｍとされ且つ長辺寸法が短辺寸法よりも長尺な範囲内における７００〜５０００ｍｍとされた矩形を呈し、板厚が１．１〜４．０ｍｍとされている。この場合、短辺寸法が６００ｍｍ未満で且つ長辺寸法が７００ｍｍ未満のガラス基板は、そもそも熱変形の問題が生じないとの知見から除外し、また短辺寸法が３０００ｍｍを超え且つ長辺寸法が５０００ｍｍを超えるガラス基板は、熱による反りや撓みの影響が大きくなって使用に耐え得ないとの知見から除外している。更に、板厚が１．１ｍｍよりも薄いガラス基板は、ＰＤＰやＦＥＤからなるパネルに使用した場合の強度上の問題があるとの知見から除外し、板厚が４．０ｍｍよりも厚いガラス基板は、不当な重量増を招き当該パネルの軽量化の要請に応じることができないとの知見から除外している。 Since the glass substrate according to the first embodiment of the present invention is intended for PDP and FED, the linear expansion coefficient in the temperature range of 30 to 380 ° C. is 60 to 130 × 10 −7 / ° C., It has a rectangular shape with a short side dimension of 600 to 3000 mm and a long side dimension of 700 to 5000 mm in a range longer than the short side dimension, and a plate thickness of 1.1 to 4.0 mm. In this case, a glass substrate having a short side dimension of less than 600 mm and a long side dimension of less than 700 mm is excluded from the knowledge that the problem of thermal deformation does not occur in the first place, and the short side dimension exceeds 3000 mm and the long side dimension is The glass substrate exceeding 5000 mm is excluded from the knowledge that the influence of warping and bending due to heat becomes large and cannot be used. Furthermore, a glass substrate having a thickness less than 1.1 mm is excluded from the knowledge that there is a problem in strength when used for a panel made of PDP or FED, and a glass substrate having a thickness greater than 4.0 mm is excluded. Is excluded from the knowledge that it is not possible to meet the demand for weight reduction of the panel due to unreasonable weight increase.
この第１実施形態に係るガラス基板の第１の特徴は、一のロットにおける上記のガラス基板の各々に対して室温から６００℃まで１０℃／分の速度で昇温し、１時間に亘って６００℃に保持し、５℃／分の速度で室温まで降温するという加熱処理を施した後の熱収縮率絶対値が、３５０〜５００ｐｐｍになるように成形されている点にある。これらのガラス基板の加熱処理時における温度を６００℃に保持した理由は、加熱処理温度が歪点を超えると加速度的に熱収縮量が変化するため、実際にガラス基板に素子や構造体を形成する際の加熱処理条件の略上限である６００℃が目安になることによる。そして、ガラス基板の熱収縮率絶対値を上記の数値範囲としたのは、以下の理由による。すなわち、熱収縮率絶対値を３５０ｐｐｍよりも小さくするには、ガラス基板の製造時における成形工程の終盤でオンラインアニールゾーンを通過するガラスリボンの速度を低速とするか或いはオンラインアニールゾーンを延ばす必要があり、そのようにした場合には、生産効率が低下するという致命的欠点が生じる。したがって、上記の熱収縮率絶対値を３５０ｐｐｍ未満としても、それに見合うだけの効果が得られず、後述する熱収縮率のバラツキとの相対関係を加味すれば、過剰品位となる。一方、熱収縮率絶対値が５００ｐｐｍを超えたのでは、実際にガラス基板に素子や構造体を形成する際に使用されるマスクや装置の補正が許容範囲を逸脱してしまう。なお、これらのガラス基板は、全てについて板厚が同一であってもよく、また板厚が異なる二種以上であってもよい。 The first feature of the glass substrate according to the first embodiment is that the temperature of each glass substrate in one lot is increased from room temperature to 600 ° C. at a rate of 10 ° C./min for 1 hour. The heat shrinkage rate absolute value after heat treatment of holding at 600 ° C. and lowering to room temperature at a rate of 5 ° C./min is 350 to 500 ppm. The reason why the temperature during the heat treatment of these glass substrates is maintained at 600 ° C. is that when the heat treatment temperature exceeds the strain point, the amount of thermal shrinkage changes at an accelerated rate, so elements and structures are actually formed on the glass substrate. This is because 600 ° C., which is a substantially upper limit of the heat treatment conditions for the heat treatment, is a guide. The reason why the absolute value of the thermal contraction rate of the glass substrate is in the above numerical range is as follows. That is, in order to make the absolute value of heat shrinkage smaller than 350 ppm, it is necessary to reduce the speed of the glass ribbon passing through the online annealing zone at the end of the molding process at the time of manufacturing the glass substrate or to extend the online annealing zone. In such a case, a fatal defect that the production efficiency is lowered occurs. Therefore, even if the absolute value of the heat shrinkage rate is less than 350 ppm, an effect corresponding to the heat shrinkage rate cannot be obtained, and if the relative relationship with the variation of the heat shrinkage rate described later is taken into account, the quality becomes excessive. On the other hand, if the absolute value of the heat shrinkage rate exceeds 500 ppm, the correction of the mask and apparatus used when actually forming elements and structures on the glass substrate will deviate from the allowable range. These glass substrates may all have the same thickness, or may be two or more different thicknesses.
この第１実施形態に係るガラス基板の第２の特徴は、一のロットにおける各々のガラス基板相互間の熱収縮率のバラツキが、±８％以内になるように成形されている点にある。すなわち、上述のように各々のガラス基板の熱収縮率絶対値が、好ましいと推認される数値範囲内にあっても、それだけでは、マスクや装置の補正を許容範囲に収め且つそれらの共通化を図ることはできない。そこで、各々のガラス基板の熱収縮率絶対値と、各々のガラス基板相互間の熱収縮率のバラツキとの相対関係が重要となるのであり、そのバラツキが±８％以内であることにより、マスクや装置の補正を不要または許容範囲に収め且つそれらの共通化を図ることが可能となる。換言すれば、各々のガラス基板の熱収縮率絶対値が上述の数値範囲内にあっても、それらの熱収縮率のバラツキが±８％の範囲を超えていれば、マスクや装置の補正が困難となり且つそれらの共通化が阻害され得る。なお、ここでいう各ガラス基板相互間の熱収縮率のバラツキとは、全てのガラス基板の熱収縮率の平均値を基準とした場合における個々のガラス基板の熱収縮率の変位の度合い、すなわちその変位量を全てのガラス基板の熱収縮率の平均値で除算した値である。 The second feature of the glass substrate according to the first embodiment is that the glass substrate is molded so that the variation in the thermal shrinkage rate between the glass substrates in one lot is within ± 8%. That is, as described above, even if the absolute value of the thermal contraction rate of each glass substrate is within a numerical value range that is presumed to be preferable, the correction of the mask and the apparatus is within the allowable range and the common use thereof is not possible. It cannot be planned. Therefore, the relative relationship between the absolute value of the thermal shrinkage rate of each glass substrate and the variation of the thermal shrinkage rate between the glass substrates is important, and since the variation is within ± 8%, the mask And correction of the apparatus is unnecessary or within an allowable range and can be made common. In other words, even if the absolute value of the thermal shrinkage rate of each glass substrate is within the above numerical range, if the variation of the thermal shrinkage rate exceeds the range of ± 8%, the correction of the mask and the apparatus is possible. It becomes difficult and their commonality can be inhibited. In addition, the variation in the heat shrinkage rate between the glass substrates here is the degree of displacement of the heat shrinkage rate of each glass substrate when the average value of the heat shrinkage rates of all the glass substrates is used as a reference, that is, It is a value obtained by dividing the amount of displacement by the average value of the thermal shrinkage rates of all the glass substrates.
この第１実施形態に係るガラス基板の第３の特徴は、一のロットにおける各々のガラス基板内の熱収縮率のバラツキが、±８％以内になるように成形されている点にある。すなわち、上述のように各々のガラス基板の熱収縮率絶対値と、各々のガラス基板相互間の熱収縮率のバラツキとが、マスクや装置の補正削減及び共通化を図ることが可能な数値範囲内にあっても、各々のガラス基板内の熱収縮率のバラツキが不当に大きい場合には、個々のガラス基板に均等に素子や構造体が形成されず、またそれらの形成後の個々のガラス基板が有する機能を阻害する要因にもなり、結果的にはマスクや装置の補正削減及び共通化を図る上で妨げとなり得る。そこで、各々のガラス基板内の熱収縮率のバラツキについても、±８％以内とすることにより、個々のガラス基板に均等に且つ機能面で支障なく素子や構造体を形成することができ、マスクや装置の補正削減及び共通化を図る上で、より一層有利となる。なお、ここでいう各ガラス基板内の熱収縮率のバラツキとは、ガラス基板一枚毎についての複数箇所の熱収縮率の平均値を基準とした場合における複数箇所の熱収縮率の変位の度合い、すなわちその変位量を複数箇所の熱収縮率の平均値で除算した値である。 The third feature of the glass substrate according to the first embodiment is that the glass substrate is molded so that the variation of the thermal shrinkage rate in each glass substrate in one lot is within ± 8%. That is, as described above, the absolute value of the heat shrinkage rate of each glass substrate and the variation in the heat shrinkage rate between the glass substrates can be corrected and shared by the mask and the apparatus. If the variation in thermal shrinkage within each glass substrate is unreasonably large, elements and structures are not formed evenly on the individual glass substrates, and the individual glasses after their formation It also becomes a factor that hinders the function of the substrate, and as a result, it may hinder the reduction and common use of masks and apparatuses. Therefore, by setting the variation in thermal shrinkage within each glass substrate to within ± 8%, it is possible to form elements and structures on each glass substrate evenly and without any functional problems, and masks. It is even more advantageous in reducing correction and sharing of devices. In addition, the variation in the heat shrinkage rate in each glass substrate here is the degree of displacement of the heat shrinkage rate at a plurality of locations when the average value of the heat shrinkage rates at a plurality of locations for each glass substrate is used as a reference. That is, it is a value obtained by dividing the displacement amount by the average value of the heat shrinkage rates at a plurality of locations.
この第１実施形態に係るガラス基板が、上述の熱収縮率絶対値及び二種のバラツキに関する全ての数値条件を満たす場合には、そのガラス基板は良品として処理されるが、何れか一つでも数値条件を満たさないことが検査により判明した場合には、その後にフロート法等によりガラス基板を製造する過程において、以下に示すような措置が講じられる。すなわち、溶融ガラスからガラス元板を成形する工程の終盤におけるオンラインアニール処理に関する条件、具体的には、オンラインアニールゾーンの長さと、オンラインアニールゾーンを流れるガラスリボンの幅と、その板厚と、その速さと、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布と、オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布とのうち、少なくとも一つの条件が変更調整される。その結果として、オンラインアニールゾーンを通過してアニール処理を受けたガラスリボンから得られるガラス基板は、上記全ての数値条件を満たすことになる。 When the glass substrate according to the first embodiment satisfies all the numerical conditions regarding the above-described absolute value of heat shrinkage rate and two types of variation, the glass substrate is processed as a non-defective product, but any one of them is processed. When it is found by inspection that the numerical conditions are not satisfied, the following measures are taken in the process of manufacturing the glass substrate by the float method or the like thereafter. That is, the conditions related to the online annealing process at the end of the process of forming the glass base plate from the molten glass, specifically, the length of the online annealing zone, the width of the glass ribbon flowing through the online annealing zone, its thickness, At least one of the speed, the temperature distribution in the flow direction of the glass ribbon in the online annealing zone, and the temperature distribution in the direction perpendicular to the flow direction of the glass ribbon in the online annealing zone is changed and adjusted. As a result, the glass substrate obtained from the glass ribbon that has passed through the online annealing zone and has been subjected to the annealing treatment satisfies all the above numerical values.
次に、本発明の第２実施形態に係るガラス基板について説明する。この第２実施形態に係るガラス基板も、ＰＤＰやＦＥＤを対象とするものであるため、３０〜３８０℃の温度範囲における線膨張係数が６０〜１３０×１０-7／℃であると共に、短辺寸法が６００〜３０００ｍｍとされ且つ長辺寸法が短辺寸法よりも長尺な範囲内における７００〜５０００ｍｍとされた矩形を呈し、板厚が１．１〜４．０ｍｍとされている。 Next, the glass substrate which concerns on 2nd Embodiment of this invention is demonstrated. Since the glass substrate according to the second embodiment is also intended for PDP and FED, the linear expansion coefficient in the temperature range of 30 to 380 ° C. is 60 to 130 × 10 −7 / ° C., and the short side It has a rectangular shape with a dimension of 600 to 3000 mm and a long side dimension of 700 to 5000 mm in a range longer than the short side dimension, and a plate thickness of 1.1 to 4.0 mm.
この第２実施形態に係るガラス基板の第１の特徴は、ＰＤＰやＦＥＤの前面板及び背面板を構成する上記のガラス基板の二枚に対して室温から６００℃まで１０℃／分の速度で昇温し、１時間に亘って６００℃に保持し、５℃／分の速度で室温まで降温するという加熱処理を施した後の熱収縮率絶対値が、３５０〜５００ｐｐｍになるように成形されている点にある。これらのガラス基板の加熱処理時における温度を６００℃に保持した理由と、ガラス基板の熱収縮率絶対値の下限値を３５０ｐｐｍにした理由とは、上述の第１実施形態に係るガラス基板と同一である。一方、ガラス基板の熱収縮率絶対値の上限値を５００ｐｐｍとした理由は、５００ｐｐｍ以下であれば、二枚のガラス基板の機能が相違するためにその両者にそれぞれ素子や構造体を形成する際に使用されるマスクや装置の共通化は図れないものの、マスクや装置を補正することなく熱処理を伴って素子や構造体を形成することが可能になるか、または上記のマスクや装置を補正可能な範囲内に留めた状態で熱処理を伴って素子や構造体を形成することができ、しかも当該パネルに二枚のガラス基板を組み付ける際の対向する素子等の位置関係の正確性および組み付け性を改善できることに由来している。 The first feature of the glass substrate according to the second embodiment is that the temperature is 10 ° C./minute from room temperature to 600 ° C. with respect to the two glass substrates constituting the front plate and the back plate of PDP or FED. Molded so that the absolute value of the heat shrinkage rate after heating treatment is raised to 600 ° C for 1 hour and lowered to room temperature at a rate of 5 ° C / min. There is in point. The reason why the temperature during the heat treatment of these glass substrates is maintained at 600 ° C. and the reason why the lower limit value of the absolute value of the heat shrinkage of the glass substrate is 350 ppm are the same as those of the glass substrate according to the first embodiment described above. It is. On the other hand, the reason why the upper limit value of the absolute value of the thermal shrinkage of the glass substrate is 500 ppm is that when the elements are each 500 ppm or less, the functions of the two glass substrates are different. Although it is not possible to share the masks and devices used in the process, elements and structures can be formed with heat treatment without correcting the masks and devices, or the above masks and devices can be corrected It is possible to form elements and structures with heat treatment in a state where they are kept within a certain range, and to ensure the accuracy and assembly of the positional relationship of the opposing elements when two glass substrates are assembled to the panel. It comes from being able to improve.
この第２実施形態に係るガラス基板の第２の特徴は、二枚のガラス基板相互間の熱収縮率の差が、±６０ｐｐｍ以内になるように成形されている点にある。すなわち、上述のように各々のガラス基板の熱収縮率絶対値が、好ましいと推認される数値範囲内にあっても、それだけでは、マスクや装置の補正を確実に許容範囲に収めることはできず、しかも対向する素子等の位置関係の正確性および組み付け性を確実に向上させることもできない。そこで、二枚のガラス基板の熱収縮率絶対値と、両ガラス基板相互間の熱収縮率の差との相対関係が重要となるのであり、その差が±６０ｐｐｍ以内であることにより、マスクや装置の補正を不要または確実に許容範囲に収め且つ対向する素子等の位置関係の正確性および組み付け性を確実に向上させることが可能となる。 The second feature of the glass substrate according to the second embodiment is that the glass substrate is molded such that the difference in thermal shrinkage between the two glass substrates is within ± 60 ppm. That is, as described above, even if the absolute value of the heat shrinkage rate of each glass substrate is within the numerical value range that is presumed to be preferable, the correction of the mask and the apparatus cannot be reliably within the allowable range by itself. Moreover, it is impossible to reliably improve the accuracy and assembly of the positional relationship between the opposing elements. Therefore, the relative relationship between the absolute value of the thermal contraction rate of the two glass substrates and the difference in thermal contraction rate between the two glass substrates is important, and since the difference is within ± 60 ppm, It is possible to unnecessarily or reliably keep the correction of the apparatus within an allowable range, and to reliably improve the accuracy and assembling property of the positional relationship between the elements facing each other.
この第２実施形態に係るガラス基板の第３の特徴は、二枚のガラス基板内の熱収縮率のバラツキが、±８％以内になるように成形されている点にある。すなわち、上述のように各々のガラス基板の熱収縮率絶対値と、各々のガラス基板相互間の熱収縮率のバラツキとが、マスクや装置の補正削減及び対向する素子等の位置関係の正確性やガラス基板の組み付け性を向上させることが可能な数値範囲内にあっても、各々のガラス基板内の熱収縮率のバラツキが不当に大きい場合には、二枚のガラス基板に均等に素子や構造体が形成されず、またそれらの形成後の個々のガラス基板が有する機能を阻害することになり、結果的にはマスクや装置の補正削減及び対向する素子等の位置関係の正確性やガラス基板の組み付け性の向上を図る上で妨げとなり得る。そこで、各々のガラス基板内の熱収縮率のバラツキについても、±８％以内とすることにより、二枚のガラス基板に均等に且つ機能面で支障なく素子や構造体を形成することが可能となる。なお、ここでいう二枚のガラス基板内の熱収縮率のバラツキとは、ガラス基板一枚毎についての複数箇所の熱収縮率の平均値を基準とした場合における複数箇所の熱収縮率の変位の度合い、すなわちその変位量を複数箇所の熱収縮率の平均値で除算した値である。 The third feature of the glass substrate according to the second embodiment is that the glass substrate is molded so that the variation in the thermal shrinkage rate between the two glass substrates is within ± 8%. That is, as described above, the absolute value of the thermal contraction rate of each glass substrate and the variation in the thermal contraction rate between the glass substrates reduce the correction of the mask and the device and the accuracy of the positional relationship between the opposing elements. If the variation in thermal shrinkage within each glass substrate is unreasonably large even if it is within the numerical range that can improve the assemblability of the glass substrate, the elements and the The structure is not formed, and the functions of the individual glass substrates after the formation are hindered. As a result, the correction of the mask and the apparatus, the accuracy of the positional relationship between the opposing elements, and the glass are reduced. This may hinder the improvement of the assembly of the substrate. Therefore, by setting the variation of the thermal shrinkage rate in each glass substrate to within ± 8%, it is possible to form elements and structures on the two glass substrates equally and without any functional problems. Become. The variation in the heat shrinkage rate in the two glass substrates referred to here is the displacement of the heat shrinkage rate at a plurality of locations on the basis of the average value of the heat shrinkage rates at a plurality of locations for each glass substrate. This is a value obtained by dividing the amount of displacement, that is, the amount of displacement by the average value of the thermal contraction rates at a plurality of locations.
以下、表１に示す実施例１〜４と、表２に示す実施例５〜８と、表３に示すトータル集計について説明する。なお、これら全ての実施例においては、ＰＤＰ用ガラスである高歪点ガラス（日本電気硝子株式会社製；品名ＰＰ−８）を使用した。 Hereinafter, Examples 1 to 4 shown in Table 1, Examples 5 to 8 shown in Table 2, and total tabulation shown in Table 3 will be described. In all these examples, high strain point glass (manufactured by Nippon Electric Glass Co., Ltd .; product name PP-8), which is a glass for PDP, was used.
実施例１〜４は板厚が１．８ｍｍであり、実施例５〜８は板厚が２．８ｍｍであって、何れの実施例も、短辺寸法ａが２０００ｍｍ及び長辺寸法ｂが２４００ｍｍの矩形をなすガラス基板を対象とし、各ガラス基板の熱収縮率絶対値が小さく且つ各ガラス基板内の熱収縮率のバラツキが小さく更には各ガラス基板相互間の熱収縮率のバラツキが小さくなるように、オンラインアニールゾーンの長さと、オンラインアニールゾーンを流れるガラスリボンの幅と、その板厚と、その速さと、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布と、オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布とを制御することにより、好ましい特性を示すガラス基板を製作した。 Examples 1 to 4 have a plate thickness of 1.8 mm, Examples 5 to 8 have a plate thickness of 2.8 mm, and in each example, the short side dimension a is 2000 mm and the long side dimension b is 2400 mm. The absolute value of the thermal shrinkage rate of each glass substrate is small, the variation of the thermal shrinkage rate in each glass substrate is small, and the variation of the thermal shrinkage rate between the glass substrates is small. The length of the online annealing zone, the width of the glass ribbon flowing through the online annealing zone, its thickness, its speed, the temperature distribution in the flow direction of the glass ribbon in the online annealing zone, By controlling the temperature distribution in the direction perpendicular to the flow direction of the glass ribbon, a glass substrate exhibiting desirable characteristics was produced.
具体的には、実施例１〜４では、オンラインアニールゾーンの長さが３００００〜４００００ｍｍ、オンラインアニールゾーンを流れるガラスリボンの幅が４５００〜４８００ｍｍ、その板厚が１．７〜１．９ｍｍ、その速さが７０００〜８０００ｍｍ／分、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布（温度勾配）が１．７〜１．９℃／ｍ、オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布（温度差の最大値）が１０℃以下になるように制御した。また、実施例５〜８では、オンラインアニールゾーンの長さが１５０００〜２５０００ｍｍ、オンラインアニールゾーンを流れるガラスリボンの幅が４５００〜４８００ｍｍ、その板厚が２．７〜２．９ｍｍ、その速さが４５００〜５５００ｍｍ／分、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布（温度勾配）が２．６〜２．８℃／ｍ、オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布（温度差の最大値）が１０℃以下になるように制御した。なお、以上の全てのガラス基板は、オフラインアニール処理を受けていない。 Specifically, in Examples 1 to 4, the length of the online annealing zone is 30000 to 40000 mm, the width of the glass ribbon flowing through the online annealing zone is 4500 to 4800 mm, and the plate thickness is 1.7 to 1.9 mm. The speed is 7000 to 8000 mm / min, the temperature distribution (temperature gradient) in the flow direction of the glass ribbon in the online annealing zone is 1.7 to 1.9 ° C./m, and the flow direction of the glass ribbon in the online annealing zone is The temperature distribution in the orthogonal direction (maximum value of temperature difference) was controlled to be 10 ° C. or less. In Examples 5 to 8, the length of the online annealing zone is 15000 to 25000 mm, the width of the glass ribbon flowing through the online annealing zone is 4500 to 4800 mm, the plate thickness is 2.7 to 2.9 mm, and the speed is 4500 to 5500 mm / min, temperature distribution (temperature gradient) in the flow direction of the glass ribbon in the online annealing zone is 2.6 to 2.8 ° C./m, a direction perpendicular to the flow direction of the glass ribbon in the online annealing zone The temperature distribution (maximum value of the temperature difference) was controlled to be 10 ° C. or less. In addition, all the above glass substrates have not received the offline annealing process.
これらのガラス基板の熱収縮率は、以下のようにして計測した。すなわち、オンラインアニールゾーンを通過して固化した二種のガラスリボンを切り出すことにより、図１（ａ）に示すように、板厚が１．８ｍｍと２．８ｍｍとについて、短辺寸法ａが２０００ｍｍで且つ長辺寸法ｂが２４００ｍｍであって矩形をなすガラス基板Ｇをそれぞれ用意した。そして、二種の板厚のそれぞれの一枚毎のガラス基板Ｇについて、同図に実線で示す矩形の６箇所から、図１（ｂ）に示すように、ガラスリボンの流れ方向である長辺（ｂ方向）の寸法ｄが１６０ｍｍで且つ短辺方向の寸法ｃが３０ｍｍの短冊状に切り出した３つの試料Ｇａに対して、図１（ｃ）に示すように、短辺に略平行で且つ相互に１４０ｍｍ離隔した位置に二本のけがき線ｋを入れ、この両けがき線ｋの相互間距離をＬとした。次に、この試料Ｇａを図１（ｄ）に鎖線で示す縦方向線Ｘで折り割って二分割し、図１（ｅ）に示す一方のガラス片Ｇ１を電気炉で室温から６００℃まで１０℃／分で昇温した後、１時間に亘って６００℃に保持し、その後、５℃／分で室温まで降温して取り出した。そして、この一方のガラス片Ｇ１と、他方のガラス片Ｇ２とを、折り割り部で突き合わせて、両ガラス片Ｇ１、Ｇ２の二本のけがき線ｋのズレ量ΔＬ１、ΔＬ２を計測し、ガラス基板Ｇの
左端部、中央部及び右端部の熱収縮率（ΔＬ１＋ΔＬ２）／Ｌを求めた。また、図１（ａ
）に示すように、板厚が１．８ｍｍと２．８ｍｍとの二種の板厚のそれぞれ一枚毎のガラス基板Ｇについて、鎖線で示すように短冊状に切り出した３つの試料Ｇｂに対しても、上記と同様の処理を行った。以上の熱収縮率の計測処理は、板厚が１．８ｍｍのガラス基板１００枚と板厚が２．８ｍｍのガラス基板１００枚とについて行った。
The thermal contraction rate of these glass substrates was measured as follows. That is, by cutting out the two types of glass ribbons that have solidified through the online annealing zone, as shown in FIG. 1A, the short side dimension a is 2000 mm for the plate thicknesses of 1.8 mm and 2.8 mm. In addition, a glass substrate G having a long side dimension b of 2400 mm and a rectangular shape was prepared. And about each glass substrate G of each of the two types of plate thicknesses, from the six rectangular locations indicated by the solid line in the same figure, as shown in FIG. As shown in FIG. 1C, three samples Ga cut in a strip shape having a dimension d in the (b direction) of 160 mm and a dimension c in the short side direction of 30 mm are substantially parallel to the short side and Two marking lines k were placed at positions 140 mm apart from each other, and the distance between the marking lines k was L. Next, this sample Ga is divided into two by folding along a vertical line X shown by a chain line in FIG. 1D, and one glass piece G1 shown in FIG. After the temperature was raised at a rate of C / min, the temperature was maintained at 600 ° C. for 1 hour, and then the temperature was lowered to room temperature at a rate of 5 ° C./min. And this one glass piece G1 and the other glass piece G2 are faced | matched by a folding part, The deviation | shift amount (DELTA) L1, (DELTA) L2 of the two scribe lines k of both glass pieces G1, G2 is measured, and glass The thermal contraction rate (ΔL1 + ΔL2) / L of the left end portion, the center portion, and the right end portion of the substrate G was determined. In addition, FIG.
As shown in FIG. 4), for each of the glass substrates G having two thicknesses of 1.8 mm and 2.8 mm, each of the three samples Gb cut out in a strip shape as indicated by a chain line However, the same processing as described above was performed. The above heat shrinkage measurement processing was performed on 100 glass substrates having a thickness of 1.8 mm and 100 glass substrates having a thickness of 2.8 mm.
この場合、二種の板厚のそれぞれ二枚のガラス基板は、同一条件で熱履歴を受けているから、上記熱収縮率を計測したガラス基板とは異なる他方のガラス基板も同一の熱収縮特性であるとして、他方のガラス基板について四隅の近傍にそれぞれＩＴＯにてマーキングを短辺方向に１９００ｍｍの間隔で且つ長辺方向に２４００ｍｍの間隔で施し、パネルの製造時における温度条件に近い条件、つまり３０分に亘って６００℃に保持するという条件で熱処理を施した後に、ＩＴＯによるマーキング間の距離を測定し、この距離と補正をしていないマスクの対応する寸法とのズレを確認した。 In this case, each of the two glass substrates of the two types of plate thickness is subjected to the thermal history under the same conditions, and therefore the other glass substrate different from the glass substrate on which the thermal shrinkage rate is measured also has the same thermal shrinkage characteristics. As for the other glass substrate, marking is made with ITO in the vicinity of the four corners at intervals of 1900 mm in the short side direction and at intervals of 2400 mm in the long side direction, and conditions close to the temperature conditions at the time of manufacturing the panel, After heat treatment was performed under the condition that the temperature was maintained at 600 ° C. for 30 minutes, the distance between the markings made of ITO was measured, and a deviation between this distance and the corresponding dimension of the uncorrected mask was confirmed.
上記ズレの良否の判定は、素子や構造体をガラス基板に形成する際に使用されるマスクが熱処理での収縮分だけ予め補正することが可能なズレ量であるか、或いは素子や構造体をガラス基板に形成する際に使用される装置が補正可能なズレ量であるかによって行った。そして、このズレ量が、短辺方向で±４０μｍ以下で且つ長辺方向で±５０μｍ以下のものを良品とし、それ以外のものを不良品とした。 The determination of the quality of the deviation is based on whether the mask used when the element or structure is formed on the glass substrate has a deviation amount that can be corrected in advance by the amount of shrinkage caused by the heat treatment, or the element or structure is This was performed depending on whether the device used for forming the glass substrate had a correctable shift amount. And this deviation | shift amount was set to the non-defective product, and the thing of other than that which is +/- 40micrometer or less in the short side direction and +/- 50micrometer or less in the long side direction was made into the non-defective product.
下記の表１には、上記の計測後における板厚が１．８ｍｍのガラス基板１００枚の中から、無作為に抜き出した実施例１〜４に係る４枚について、それぞれ試料Ｇａ、Ｇｂが計１２個の熱収縮率絶対値の最大値と、同じくそれらの熱収縮率絶対値の最小値と、同じくそれらの熱収縮率絶対値の平均値と、マスクに関する短辺方向及び長辺方向のズレ量と、そのズレに関して良品であることを示す○印とを記載した。また、下記の表２には、上記の計測後における板厚が２．８ｍｍのガラス基板１００枚の中から、無作為に抜き出した実施例５〜８に係る４枚について、それぞれ試料Ｇａ、Ｇｂが計１２個の熱収縮率絶対値の最大値と、同じくそれらの熱収縮率絶対値の最小値と、同じくそれらの熱収縮率絶対値の平均値と、マスクに関する短辺方向及び長辺方向のズレ量と、そのズレに関して良品であることを示す○印とを記載した。更に、下記の表３には、板厚が１．８ｍｍと２．８ｍｍとのガラス基板の計２００枚についての集計結果を記載した。 In Table 1 below, samples Ga and Gb are respectively measured for four sheets according to Examples 1 to 4 randomly extracted from 100 glass substrates having a thickness of 1.8 mm after the measurement. The maximum value of the absolute value of the 12 heat shrinkage rates, the minimum value of the absolute value of the heat shrinkage rate, the average value of the absolute value of the heat shrinkage rate, and the deviation of the mask in the short side direction and the long side direction. The amount and the ○ mark indicating that it is a non-defective product with respect to the deviation are described. Table 2 below shows samples Ga and Gb for four samples according to Examples 5 to 8 which were randomly extracted from 100 glass substrates having a thickness of 2.8 mm after the measurement. Are the maximum absolute value of the total 12 heat shrinkage rates, the minimum value of the absolute value of the heat shrinkage rate, the average value of the absolute value of the heat shrinkage rate, the short side direction and the long side direction of the mask. The amount of misalignment and the ○ mark indicating that the misalignment is a non-defective product are described. Furthermore, in Table 3 below, tabulated results for a total of 200 glass substrates having a plate thickness of 1.8 mm and 2.8 mm are shown.
上記の表１によれば、板厚が１．８ｍｍの実施例１〜４のガラス基板は、４枚の全てについての熱収縮率絶対値が３５０〜５００ｐｐｍの範囲内（更には４１０〜４５０ｐｐｍの範囲内）に収まっている。また、上記の表２によれば、板厚が２．８ｍｍの実施例５〜８のガラス基板は、４枚の全てについての熱収縮率絶対値が３５０〜５００ｐｐｍの範囲内（更には３９０〜４４０ｐｐｍの範囲内）に収まっている。 According to Table 1 above, the glass substrates of Examples 1 to 4 having a plate thickness of 1.8 mm have a heat shrinkage absolute value in the range of 350 to 500 ppm for all four sheets (further, 410 to 450 ppm). (Within range). Moreover, according to said Table 2, the glass substrate of Examples 5-8 whose plate | board thickness is 2.8 mm is in the range whose heat shrinkage absolute value about all four sheets is 350-500 ppm (further 390-500). (Within the range of 440 ppm).
上記の表１を考察して、実施例１の平均値が４２８ｐｐｍ、実施例２のそれが４２４ｐｐｍ、実施例３のそれが４３０ｐｐｍ、実施例４のそれが４３４ｐｐｍであることを勘案すれば、板厚が１．８ｍｍのガラス基板について個々のガラス基板内のバラツキは、±８％以内（更には±３％以内）に収まっている。また、上記の表２を考察して、実施例５の平均値が４００ｐｐｍ、実施例６のそれが４０５ｐｐｍ、実施例７のそれが４１２ｐｐｍ、実施例８のそれが４１８ｐｐｍであることを勘案すれば、板厚が２．８ｍｍのガラス基板について個々のガラス基板内のバラツキは、±８％以内（更には±４％以内）に収まっている。 Considering Table 1 above, considering that the average value of Example 1 is 428 ppm, that of Example 2 is 424 ppm, that of Example 3 is 430 ppm, and that of Example 4 is 434 ppm, For glass substrates having a thickness of 1.8 mm, the variation in individual glass substrates is within ± 8% (and within ± 3%). Also, considering Table 2 above, considering that the average value of Example 5 is 400 ppm, that of Example 6 is 405 ppm, that of Example 7 is 412 ppm, and that of Example 8 is 418 ppm. The variation within each glass substrate with respect to the glass substrate having a plate thickness of 2.8 mm is within ± 8% (more preferably within ± 4%).
更に、上記の表１において、１００枚の板厚１．８ｍｍのガラス基板について熱収縮率の平均値を算出したところ、その平均値が４３０ｐｐｍであったことから、上記の表１におけるガラス基板相互間のバラツキは、±８％以内（更には±５％以内）に収まっている。また、上記の表２において、１００枚の板厚２．８ｍｍのガラス基板について熱収縮率の平均値を算出したところ、その平均値が４１１ｐｐｍであったことから、上記の表２におけるガラス基板相互間のバラツキは、±８％以内（更には±６％以内）に収まっている。 Further, in Table 1 above, when the average value of the heat shrinkage rate was calculated for 100 glass substrates having a thickness of 1.8 mm, the average value was 430 ppm. The variation between them is within ± 8% (and within ± 5%). Further, in Table 2 above, when the average value of the heat shrinkage rate was calculated for 100 glass substrates having a thickness of 2.8 mm, the average value was 411 ppm. The variation between them is within ± 8% (and within ± 6%).
加えて、上記の表３によれば、板厚が１．８ｍｍと２．８ｍｍの計２００枚についてのガラス基板について熱収縮率の平均値を算出したところ、その平均値が４２１ｐｐｍであったことから、上記の表１及び表２における全てのガラス基板相互間のバラツキは、±８％以内（更には±７％以内）に収まっている。したがって、板厚が１．８ｍｍのガラス基板と、板厚が２．８ｍｍのガラス基板とは、個々の群においてマスクの共通化を図る上で有利となるばかりでなく、板厚が１．８ｍｍと２．８ｍｍとのガラス基板を一つの群と捉えた場合にも、その群においてマスクの共通化を図る上で有利となる。 In addition, according to Table 3 above, when the average value of the heat shrinkage rate was calculated for the glass substrates for a total of 200 sheets having a thickness of 1.8 mm and 2.8 mm, the average value was 421 ppm. Therefore, the variation between all the glass substrates in the above Tables 1 and 2 is within ± 8% (and further within ± 7%). Therefore, a glass substrate having a plate thickness of 1.8 mm and a glass substrate having a plate thickness of 2.8 mm are not only advantageous for sharing a mask in each group, but also have a plate thickness of 1.8 mm. When the glass substrates of 2.8 mm and 2.8 mm are regarded as one group, it is advantageous for sharing the mask in the group.
一方、上記の表１から、板厚が１．８ｍｍの実施例１〜４は、それらのガラス基板相互間の熱収縮率の差が±６０ｐｐｍ以内（更には±５０ｐｐｍ以内）に収まっているため、それらの群の中から任意に二枚を選択して、その二枚のガラス基板をパネルの前面板及び背面板として使用すれば、パネルにおける二枚のガラス基板相互間の熱収縮率の差が±６０ｐｐｍ以内になり且つ両ガラス基板内の熱収縮率のバラツキが±８％以内（更には±３％以内）となる。また、上記の表２から、板厚が２．８ｍｍの実施例５〜８についても、それらのガラス基板相互間の熱収縮率の差が±６０ｐｐｍ以内（更には±４５ｐｐｍ以内）に収まっているため、それらの群の中から任意に二枚を選択して、その二枚のガラス基板をパネルの前面板及び背面板として使用すれば、パネルにおける二枚のガラス基板相互間の熱収縮率の差が±６０ｐｐｍ以内になり且つ両ガラス基板内の熱収縮率のバラツキが±８％以内（更には±４％以内）となる。加えて、上記の表３から、板厚が１．８ｍｍと２．８ｍｍの計２００枚のガラス基板についても、熱収縮率の最大値と最小値との差が５９ｐｐｍであることから、この全ての群の中から任意に二枚を選択して、その二枚のガラス基板をパネルの前面板及び背面板として使用すれば、パネルにおける二枚のガラス基板相互間の熱収縮率の差が±６０ｐｐｍ以内になる。 On the other hand, from Table 1 above, in Examples 1 to 4 having a plate thickness of 1.8 mm, the difference in thermal shrinkage between the glass substrates is within ± 60 ppm (and within ± 50 ppm). If the two glass substrates are arbitrarily selected from the group and the two glass substrates are used as the front plate and the back plate of the panel, the difference in thermal shrinkage between the two glass substrates in the panel Is within ± 60 ppm, and the variation of the thermal shrinkage rate in both glass substrates is within ± 8% (and further within ± 3%). Further, from Table 2 above, also in Examples 5 to 8 having a plate thickness of 2.8 mm, the difference in thermal shrinkage between the glass substrates is within ± 60 ppm (and further within ± 45 ppm). Therefore, if two sheets are arbitrarily selected from the group and the two glass substrates are used as the front plate and the back plate of the panel, the thermal contraction rate between the two glass substrates in the panel can be reduced. The difference is within ± 60 ppm, and the variation of the thermal shrinkage rate in both glass substrates is within ± 8% (and further within ± 4%). In addition, from Table 3 above, the difference between the maximum value and the minimum value of the heat shrinkage rate is 59 ppm for the total 200 glass substrates with the plate thicknesses of 1.8 mm and 2.8 mm. If two sheets are arbitrarily selected from the group of the two and the two glass substrates are used as the front plate and the back plate of the panel, the difference in thermal shrinkage between the two glass substrates in the panel is ± Within 60 ppm.
次に、板厚が１．８ｍｍと２．８ｍｍとのそれぞれについて、オンラインアニールゾーンの長さと、オンラインアニールゾーンを流れるガラスリボンの幅と、その板厚と、その速さと、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布と、オンラインアニールゾーン内のガラスリボンの前記流れ方向と直交する方向の温度分布とのうち、少なくとも一つの条件が上述の数値範囲を逸脱するようにしてガラス基板を製作し、板厚が１．８ｍｍのガラス基板１００枚と、板厚が２．８ｍｍのガラス基板２００枚とについて上記と同様にして熱収縮率絶対値を計測した。その結果、板厚が１．８ｍｍのものについては、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布が上述の数値範囲を逸脱するようにして製作した１００枚のガラス基板の大半が、熱収縮率絶対値が３５０〜５００ｐｐｍの範囲を逸脱し、且つマスクに関するズレ量は不良品に該当していることを確認した。一方、板厚が２．８ｍｍのものについては、オンラインアニールゾーン内のガラスリボンの流れ方向の温度分布とその流れ方向と直交する方向の温度分布との二つの条件が上述の数値範囲を逸脱するようにして製作した１００枚のガラス基板の大半が、熱収縮率絶対値が３５０〜５００ｐｐｍの範囲を逸脱し且つ個々のガラス基板内の熱収縮率のバラツキ及びガラス基板相互間の熱収縮率のバラツキの両者が±８％の範囲を逸脱し、またオンラインアニールゾーン内のガラスリボンの流れ方向と直交する方向の温度分布のみが上述の数値範囲を逸脱するようにして製作した１００枚のガラス基板の大半が、熱収縮率絶対値については３５０〜５００ｐｐｍの範囲内にあるものの、個々のガラス基板内の熱収縮率のバラツキ及びガラス基板相互間の熱収縮率のバラツキの両者が±８％の範囲を逸脱していることを確認した。更に、一つまたは二つの条件が上述の数値範囲を逸脱しているガラス基板の中から任意に選択した二枚のガラス基板相互間の熱収縮率の差も±６０ｐｐｍを超え、且つマスクに関するズレ量も不良品に該当していることを確認した。 Next, for each of the plate thicknesses of 1.8 mm and 2.8 mm, the length of the online annealing zone, the width of the glass ribbon flowing through the online annealing zone, its thickness, its speed, The glass substrate is formed such that at least one of the temperature distribution in the flow direction of the glass ribbon and the temperature distribution in the direction perpendicular to the flow direction of the glass ribbon in the online annealing zone deviates from the above numerical range. The absolute value of thermal contraction rate was measured in the same manner as described above for 100 glass substrates having a thickness of 1.8 mm and 200 glass substrates having a thickness of 2.8 mm. As a result, when the plate thickness is 1.8 mm, most of the 100 glass substrates manufactured in such a manner that the temperature distribution in the flow direction of the glass ribbon in the on-line annealing zone deviates from the above numerical range is mostly It was confirmed that the absolute value of the shrinkage rate deviated from the range of 350 to 500 ppm, and the amount of deviation related to the mask corresponds to a defective product. On the other hand, when the plate thickness is 2.8 mm, the two conditions of the temperature distribution in the flow direction of the glass ribbon in the online annealing zone and the temperature distribution in the direction perpendicular to the flow direction deviate from the above numerical range. Most of the 100 glass substrates manufactured in this way have an absolute value of the thermal shrinkage outside the range of 350 to 500 ppm, and the variation of the thermal shrinkage within individual glass substrates and the thermal shrinkage between the glass substrates. 100 glass substrates manufactured so that both of the deviations deviate from the range of ± 8% and only the temperature distribution in the direction perpendicular to the flow direction of the glass ribbon in the online annealing zone deviates from the above numerical range. Although most of the heat shrinkage ratio is within the range of 350 to 500 ppm in terms of absolute value of the heat shrinkage ratio, the variation of the heat shrinkage ratio among individual glass substrates and Both the thermal shrinkage variation and it was confirmed that by departing from the scope of 8% ±. Further, the difference in thermal shrinkage between the two glass substrates arbitrarily selected from the glass substrates whose one or two conditions deviate from the above numerical range exceeds ± 60 ppm, and the mask is misaligned. It was confirmed that the quantity also corresponds to a defective product.
Ｇ ガラス基板
Ｇａ 試料
Ｇｂ 試料
Ｇ１ ガラス片
Ｇ２ ガラス片
G Glass substrate Ga Sample Gb Sample G1 Glass piece G2 Glass piece
Claims (7)
一のロットにおける板厚が異なる二種以上のガラス基板の各々に対して室温から加熱処理を施すことにより６００℃で１時間に亘って保持した後に再び室温に戻した時の該各ガラス基板の熱収縮率絶対値が３５０〜５００ｐｐｍであり、且つ、該各ガラス基板相互間の前記熱収縮率絶対値のバラツキ及び該各ガラス基板内の前記熱収縮率絶対値のバラツキが±８％以内であることを特徴とするガラス基板。 Used in flat display panels, has a linear expansion coefficient in the temperature range of 30 to 380 ° C., 60 to 130 × 10 −7 / ° C., a rectangular shape with short side dimensions of 600 to 3000 mm and long side dimensions of 700 to 5000 mm. A glass substrate having a plate thickness of 1.1 to 4.0 mm,
Respective glass substrates when returned again to room temperature after holding for one hour at 600 ° C. followed by heat treatment from room temperature to each of the glass substrates of thickness different two or more kinds in one lot absolute value heat shrinkage rate is 350～500Ppm, and, the variation of the thermal shrinkage absolute value of the variation and the respective glass substrates of the heat shrinkage absolute value between respective glass substrates each other within 8% ± glass substrate characterized in that it.
一のロットにおける板厚が異なる二種以上のガラス基板の各々に対して室温から加熱処理を施すことにより６００℃で１時間に亘って保持した後に再び室温に戻した時の該各ガラス基板の熱収縮率絶対値が３５０〜５００ｐｐｍの範囲内に収まっているか否か、並びに該各ガラス基板相互間の前記熱収縮率絶対値のバラツキ及び該各ガラス基板内の前記熱収縮率絶対値のバラツキが±８％の範囲内に収まっているか否かを検査し、その検査の結果、前記双方の数値が共に前記範囲内に収まっていない場合に、前記オンラインアニール処理に関する条件を変更調整することを特徴とするガラス基板の製造方法。 Used in flat display panels, has a linear expansion coefficient in the temperature range of 30 to 380 ° C., 60 to 130 × 10 −7 / ° C., a rectangular shape with short side dimensions of 600 to 3000 mm and long side dimensions of 700 to 5000 mm. Manufacturing of a glass substrate that is subjected to an online annealing process through a glass ribbon passing through an online annealing zone continuously or at the end of the forming process of a glass substrate having a plate thickness of 1.1 to 4.0 mm A method,
Respective glass substrates when returned again to room temperature after holding for one hour at 600 ° C. followed by heat treatment from room temperature to each of the glass substrates of thickness different two or more kinds in one lot absolute value thermal shrinkage whether within the range of 350～500Ppm, as well as the heat shrinkage absolute value of the thermal shrinkage absolute value of the variation and the respective glass substrates between respective glass substrates each other Inspect whether or not the variation is within ± 8%, and if both the numerical values are not within the range as a result of the inspection, change and adjust the conditions for the online annealing process. A method for producing a glass substrate, comprising:
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