JP4903741B2 - Flexible substrate, flexible substrate bonding method, droplet discharge head, and image forming apparatus - Google Patents

Description

  The present invention relates to a flexible substrate, a flexible substrate bonding method for bonding the flexible substrate to a counterpart member, a droplet discharge head using the flexible substrate, and an image forming apparatus using the droplet discharge head.

  As a connection structure for connecting a flexible substrate to an electronic component (a counterpart member), for example, in Patent Document 1, a protruding portion of an electronic component is inserted into a through-hole formed in a wiring of a flexible substrate to be electrically connected. The structure made is described.

  By the way, in the structure of patent document 1, since the flexible substrate does not exist in the part in which the through-hole of the wiring was formed, there is a concern that the position of the wiring, particularly the position of the through-hole may be shifted at the time of connection. Becomes unable to insert the protrusion into the through hole.

  In order to prevent the occurrence of such inconvenience, a configuration in which the through hole is formed to be sufficiently large and the positional deviation between the through hole and the protrusion is allowed is conceivable. However, when the through-hole is enlarged, the gap between the inner surface of the through-hole and the protrusion is also increased, and the electrical connection area is also reduced.

In particular, if the wiring width is narrowed due to demands such as high wiring density, the rigidity of the wiring also decreases, so there is a limit to increasing the through hole.
JP 2007-36009 A

  In view of the above facts, the present invention takes into account the above facts, a flexible substrate capable of ensuring the rigidity of the connection portion of the wiring, a flexible substrate bonding method for bonding the flexible substrate to the counterpart member, a droplet discharge head using the flexible substrate, and this An object is to obtain an image forming apparatus using a droplet discharge head.

  The invention according to claim 1 is configured as a flexible flexible substrate main body, a wiring formed on the flexible substrate main body, and a part of the wiring, and protrudes from the flexible substrate main body so as to protrude from the flexible substrate main body. A connection part to be connected to, a reinforcing member pasted so as to connect the connection parts or the connection part and the flexible substrate body, and formed through the connection part and the reinforcing member, And an insertion hole into which the insertion convex portion provided on the counterpart member is inserted.

  In this flexible substrate, a connection portion is provided in the wiring, and the connection portion can be connected to the counterpart member. Since the connection portion is configured by partially protruding the wiring from the flexible substrate, the rigidity of the connection portion itself may be low, but in the present invention, the connection portion is reinforced by the reinforcing member, and the rigidity Is high. For this reason, the rigidity of a connection part is securable even at the time of a connection with the other party member.

  The connection portion and the reinforcing member are formed with insertion holes into which insertion convex portions provided on the counterpart member are inserted. That is, the flexible substrate can be connected to the counterpart member by inserting the insertion convex portion into the insertion hole.

  As a method for connecting the flexible substrate to the counterpart member, for example, the flexible substrate can be joined to the counterpart member by the flexible substrate joining method according to claim 5.

  That is, first, in the insertion step, the insertion convex portion is inserted into the insertion hole. At this time, the connecting portion is reinforced by the reinforcing member to increase the rigidity, and the connecting convex portion is not inadvertently deformed or displaced, so that the insertion convex portion can be accurately and easily inserted into the insertion hole.

  After the insertion, the reinforcing member is removed in the removing step. Since the wiring is exposed by removing the reinforcing member, the area that can be brought into contact with the insertion convex portion is increased.

  In the joining step, the insertion convex portion and the wiring are joined. Here, in particular, as described in claim 6, in the configuration in which the insertion convex portion has a height protruding from the insertion hole, in the joining step, a portion protruding from the insertion hole of the insertion convex portion is For example, by expanding the diameter by caulking or the like, the cross-sectional area of the protruding portion is widened to enable more reliable joining, and a wide contact area between the insertion convex portion and the wiring can be secured.

  Further, in the joining step, as described in claim 7, the wiring and the insertion convex portion may be joined by soldering or plating, thereby enabling more reliable joining and securing a wide contact area.

  The invention according to claim 2 is the invention according to claim 1, wherein the reinforcing member is a shrinkable film member that shrinks by at least one of irradiation of ultraviolet rays, irradiation of active energy rays, heating, cooling, and addition of a drug. Has been.

  Therefore, the shrinkable film member can be easily removed from the connecting portion by shrinking.

  The invention according to claim 3 is the invention according to claim 1, wherein the reinforcing member is a molten film member that melts by at least one of irradiation with ultraviolet rays, irradiation with active energy rays, heating, cooling, and addition of a drug. Has been.

  Therefore, it can be easily removed from the connecting portion by melting the molten film member.

  According to a fourth aspect of the present invention, in the first aspect of the present invention, the reinforcing member is adhered to the connecting portion or the flexible substrate body, and irradiation with ultraviolet rays, irradiation with active energy rays, heating, cooling, and medicine are performed. It has an adhesive whose adhesiveness is reduced by at least one addition.

  Therefore, the reinforcing member can be easily removed from the connecting portion by reducing the adhesiveness of the adhesive.

  According to an eighth aspect of the present invention, there is provided a liquid droplet ejection head main body for ejecting liquid droplets, a circuit board provided on the liquid droplet ejection head main body, and a circuit board bonded to the circuit board. 4. The flexible substrate according to any one of 4 above.

  This droplet discharge head has a circuit board to which a flexible board is connected, and the flexible board can be reliably bonded to the circuit board (this circuit board or a component on the circuit board becomes a counterpart member). . In a state where the flexible substrate is bonded to the circuit board, the droplet discharge head main body can be driven or controlled to discharge droplets.

  According to a ninth aspect of the invention, there is provided a conveying device that conveys a recording sheet, and a droplet discharge head according to the eighth aspect that ejects droplets onto the recording sheet conveyed by the conveying device.

  Accordingly, it is possible to form an image by ejecting droplets from the droplet ejection head onto the recording sheet while conveying the sheet material by the conveying device.

  Since the present invention has the above-described configuration, a flexible substrate capable of ensuring the rigidity of the connection portion of the wiring, a flexible substrate bonding method for bonding the flexible substrate to the counterpart member, a droplet discharge head using the flexible substrate, and this An image forming apparatus using a droplet discharge head is obtained.

  Hereinafter, an image forming apparatus according to an embodiment of the present invention will be described.

  First, the overall configuration of the image forming apparatus 10 will be described.

[Image forming apparatus]
As shown in FIG. 1, the image forming apparatus 10 according to the present embodiment feeds and feeds paper to the upstream side in the transport direction of a sheet as a recording medium (hereinafter referred to as “paper”). A portion 12 is provided. On the downstream side of the paper feeding / conveying unit 12, a processing liquid applying unit 14 for applying a processing liquid to the recording surface of the paper along the paper conveying direction, an image forming unit 16 for forming an image on the recording surface of the paper, An ink drying unit 18 that dries the ink of the image formed on the recording surface, an image fixing unit 20 that fixes the dried ink on the paper, and a discharge unit 21 that discharges the paper on which the image is fixed are provided.

  Hereinafter, each processing unit will be described.

(Paper feed section)
The sheet feeding / conveying unit 12 is provided with a stacking unit 22 on which sheets are stacked, and a sheet feeding unit that feeds the sheets stacked on the stacking unit 22 one by one downstream of the stacking unit 22 in the sheet conveying direction. A paper portion 24 is provided. The sheet fed by the sheet feeding unit 24 is conveyed to the processing liquid application unit 14 via a conveying unit 28 configured by a plurality of roller pairs 26.

(Processing liquid application part)
In the treatment liquid application unit 14, a treatment liquid application drum 30 is rotatably disposed. The processing liquid coating drum 30 is provided with a holding member 32 that holds the paper by sandwiching the leading end of the paper, and the paper is held on the surface of the processing liquid coating drum 30 via the holding member 32. Then, the sheet is conveyed downstream by the rotation of the treatment liquid coating drum 30.

  Note that an intermediate conveying drum 34, an image forming drum 36, an ink drying drum 38, and an image fixing drum 40, which will be described later, are also provided with a holding member 32 in the same manner as the processing liquid coating drum 30. The holding member 32 transfers the paper from the upstream drum to the downstream drum.

  A processing liquid coating device 42 and a processing liquid drying device 44 are disposed above the processing liquid coating drum 30 along the circumferential direction of the processing liquid coating drum 30. The treatment liquid is applied to the surface, and the treatment liquid is dried by the treatment liquid drying device 44.

  Here, the treatment liquid reacts with the ink to aggregate the color material (pigment) and has an effect of promoting separation of the color material (pigment) and the solvent. The treatment liquid application device 42 is provided with a storage portion 46 in which the treatment liquid is stored, and a part of the gravure roller 48 is immersed in the treatment liquid.

  A rubber roller 50 is disposed in pressure contact with the gravure roller 48, and the rubber roller 50 comes into contact with the recording surface (front surface) side of the paper to apply the processing liquid. Further, a squeegee (not shown) is in contact with the gravure roller 48 to control the amount of treatment liquid applied to the recording surface of the paper.

  The film thickness of the treatment liquid is ideally sufficiently smaller than the diameter of a droplet (hereinafter referred to as “head droplet ejection”) ejected from the inkjet line head 64 described later. That is, since the ink floats in the processing liquid film, if the processing liquid film is thick, the ink dots float in the processing liquid and do not come into contact with the recording surface of the paper. For example, in the case of a droplet ejection amount of 2 pl, the average droplet diameter of the head droplet is 15.6 μm. The dots float in the processing liquid and do not come into contact with the recording surface of the paper. In order to obtain a landing dot diameter (diameter of a droplet in contact with the recording surface of the paper) of 30 μm or more with a droplet ejection amount of 2 pl, the treatment liquid film thickness is preferably 3 μm or less.

  On the other hand, in the treatment liquid drying device 44, a hot air nozzle 54 and an infrared heater 56 (hereinafter referred to as “IR heater 56”) are disposed close to the surface of the treatment liquid application drum 30. The hot air nozzle 54 and the IR heater 56 evaporate a solvent such as water in the processing liquid to form a solid or thin film processing liquid layer on the recording surface side of the paper. By thinning the treatment liquid in the treatment liquid drying step, the dots deposited by ink in the image forming unit 16 come into contact with the surface of the paper to obtain the required dot diameter, and react with the thinned treatment liquid. It is easy to obtain an action of agglomerating color materials and fixing to the paper surface.

  In this way, the paper on which the processing liquid has been applied and dried on the recording surface by the processing liquid application unit 14 is conveyed to an intermediate conveyance unit 58 provided between the processing liquid application unit 14 and the image forming unit 16.

(Intermediate transport section)
An intermediate transport drum 58 is rotatably provided in the intermediate transport unit 58, and the leading end of the sheet is held on the surface of the intermediate transport drum 34 via a holding member 32 provided in the intermediate transport drum 34. The sheet is conveyed downstream by the rotation of the conveyance drum 34.

(Image forming part)
An image forming drum 36 is rotatably provided in the image forming unit 16, and a sheet is held on the surface of the image forming drum 36 via a holding member 32 provided on the image forming drum 36. The sheet is conveyed downstream by the rotation of 36.

  Above the image forming drum 36, a head unit 66 composed of a single-pass inkjet line head 64 is disposed adjacent to the surface of the image forming drum 36. In this head unit 66, at least the basic color YMCK inkjet line heads 64 are arranged along the circumferential direction of the image forming drum 36, and are formed on the processing liquid layer formed on the recording surface of the paper by the processing liquid coating unit 14. An image of each color is formed. The configuration of the head unit 66 will be described later.

  The treatment liquid has the effect of aggregating the color material (pigment) and latex particles dispersed in the ink into the treatment liquid, and forms an aggregate that does not generate color material flow on the paper. As an example of the reaction between the ink and the treatment liquid, by using a mechanism that contains acid in the treatment liquid and destroys and disperses the pigment dispersion by PH down, the color material bleeds, the color mixture between each color ink, and the ink droplet landing To avoid interference of droplets due to liquid coalescence.

  The ink jet line head 64 performs droplet ejection in synchronization with an encoder (not shown) that detects the rotational speed disposed on the image forming drum 36, thereby determining the landing position with high accuracy and at the same time. Irregular droplet ejection can be reduced without depending on the shake, the accuracy of the rotary shaft 68, and the drum surface speed.

  The head unit 66 can be retracted from the upper part of the image forming drum 36, and maintenance operations such as cleaning of the nozzle surface of the inkjet line head 64 and discharging of the thickened ink are performed on the head unit 66 at the upper part of the image forming drum 36. It is carried out by evacuating from.

  The sheet on which the image is formed on the recording surface is conveyed to an intermediate conveyance unit 70 provided between the image forming unit 16 and the ink drying unit 18 by the rotation of the image forming drum 36. Since the configuration is substantially the same as that of the intermediate conveyance unit 58, description thereof is omitted.

(Ink drying section)
An ink drying drum 38 is rotatably provided in the ink drying unit 18, and a plurality of hot air nozzles 72 and IR heaters 74 are arranged on the upper portion of the ink drying drum 38 in proximity to the surface of the ink drying unit 18. It is installed. The hot air generated by the hot air nozzle 72 and the IR heater 74 dries the solvent separated by the color material aggregating action in the paper image forming unit, thereby forming a thin image layer.

  The hot air is usually set to 50 ° C. to 70 ° C., although it varies depending on the sheet conveyance speed. The evaporated solvent is discharged together with air to the outside of the image forming apparatus 10, but the air is recovered. This air may be cooled by a cooler / radiator or the like and recovered as a liquid.

  The sheet on which the image on the recording surface is dried is conveyed to an intermediate conveyance unit 76 provided between the ink drying unit 18 and the image fixing unit 20 by the rotation of the ink drying drum 38. Since the configuration is substantially the same as that of the intermediate conveyance unit 58, description thereof is omitted.

(Image fixing part)
An image fixing drum 40 is rotatably provided in the image fixing unit 20. In the image fixing unit 20, latex particles in a thin image layer formed on the ink drying drum 38 are heated / pressurized. And has a function of fixing and fixing on the paper.

  A heating roller 78 is disposed above the image fixing drum 40 in the vicinity of the surface of the image fixing drum 40. The heating roller 78 has a halogen lamp incorporated in a metal pipe made of aluminum or the like having a good thermal conductivity. The heating roller 78 applies heat energy equal to or higher than the Tg temperature of the latex. As a result, the latex particles are melted and pressed into the irregularities on the paper for fixing, and the irregularities on the image surface are leveled to obtain glossiness.

  A fixing roller 80 is provided on the downstream side of the heating roller 78. The fixing roller 80 is disposed in pressure contact with the surface of the image fixing drum 40 so as to obtain a nip force with the image fixing drum 40. I have to. Therefore, at least one of the fixing roller 80 and the image fixing drum 40 has an elastic layer on the surface and a uniform nip width with respect to the paper.

  The sheet on which the image on the recording surface is fixed by the above-described process is conveyed to the discharge unit 21 side provided on the downstream side of the image fixing unit 20 by the rotation of the image fixing drum 40.

  In this embodiment, the image fixing unit 20 has been described. However, the image fixing unit 20 is not necessarily required because it is sufficient that the image formed on the recording surface can be dried and fixed by the ink drying unit 18.

[Head unit]
As shown in detail in FIG. 2, the head unit 66 has a head housing 82. A driver board 84 and a control board 86 are provided in the head casing 82, and drive and various controls of the head unit 66 are performed, respectively. In particular, a plurality of nozzles are provided in the lower portion of the driver substrate 84. For example, by driving a piezoelectric element provided corresponding to these nozzles, it is possible to discharge liquid droplets from the nozzles onto the paper. ing. In the present embodiment, the flexible substrate 88 is bonded to the driver substrate 84.

  As shown in FIGS. 3-6, the flexible substrate 88 has the flexible substrate main body 90 formed in the substantially plate shape with the materials which have flexibility, such as a polyimide. Hereinafter, the simple end means the one end 90A of the flexible substrate body 90. Further, the simple term “width direction” refers to the width direction of the flexible substrate body 90. 3 to 6, only the one end 90A side of the flexible substrate main body 90 is shown, and the other end side is not shown. The flexible substrate 88 has a connection region 108 connected to the electronic component 94 on the one end 90A side.

  Wiring 110 is formed on flexible substrate body 90 in a predetermined pattern using a conductive material such as copper. Particularly in the present embodiment, a plurality of parallel wires 110 are formed in the vicinity of one end 90 </ b> A of the flexible substrate body 90.

  Furthermore, an opening 112 that penetrates the flexible substrate main body 90 in the thickness direction is formed in the connection region 108 of the flexible substrate 88. The opening 112 partially exposes the wiring 110 so as to protrude from the flexible substrate main body 90, and this exposed portion serves as a connection portion 110 </ b> C in the wiring 110. In the present embodiment, one opening 112 is formed so as to correspond to the plurality of wirings 110.

  An insertion hole 106 that penetrates the wiring 110 in the thickness direction is formed in the connection portion 110C of the wiring 110. As will be described later, the insertion convex portion 104 protruding from the electronic component 94 is inserted into the insertion hole 106, and the flexible substrate 88 is connected to the electronic component 94. By forming the opening 112 in the flexible substrate main body 90, the insertion convex portion 104 does not come into contact with the flexible substrate main body 90 even if the insertion convex portion 104 is inserted into the insertion hole 106 of the wiring 110.

  On the other hand, in the electronic component 94, insertion protrusions 104 are formed of conductive materials such as Au, Ni, Cu, Sn, Ag, or alloys thereof at positions corresponding to the insertion holes 106, respectively. In this embodiment, the insertion convex portion 104 is formed to be substantially equal to the outer shape of the insertion hole 106 or slightly smaller than the outer shape of the insertion hole 106, and can be inserted into the insertion hole 106.

  The height of the insertion protrusion 104 is formed to be higher than the thickness of the wiring 110. Therefore, when the insertion convex portion 104 is inserted into the insertion hole 106 and the wiring 110 is in contact with the electronic component 94, the upper portion of the insertion convex portion 104 is inserted as shown in FIGS. 4B and 5B. A protruding portion 116 is formed by protruding from the hole 106 (the upper surface of the wiring 110).

  As shown in FIGS. 6A and 6B, in a state where the flexible substrate 88 is bonded to the electronic component 94, the protruding portion 116 is caulked to increase the diameter, and the expanded diameter portion 118 is configured. . The enlarged diameter portion 118 partially overlaps the connecting portion 110C of the wiring 110, and the flexible substrate 88 is attached to the electronic component 94 by the electronic component 94 and the enlarged diameter portion 118 being sandwiched by the so-called anchor effect. It is securely fixed against it. Further, since the enlarged diameter portion 118 contacts the connection portion 110 </ b> C of the wiring 110, electrical connection between the wiring 110 and the electronic component 94 is ensured in the connection region 108.

  Here, as shown in FIGS. 3A and 3B, the flexible substrate 88 in the previous stage of connection to the electronic component 94 has one side of the wiring 110 including the periphery of the insertion hole 106 of the flexible substrate body 90 ( When the insertion hole 106 is inserted into the insertion convex portion 104 of the electronic component 94, a reinforcing film member 120 is adhered to the surface opposite to the electronic component 94 with a peelable adhesive material.

  The reinforcing film member 120 has higher rigidity and strength than the wiring 110 and is attached so as to connect at least the wirings 110. In particular, in this embodiment, the reinforcing film member 120 is attached to the flexible substrate body 90 on both sides of the opening 112. That is, the reinforcing film member 120 is attached not only to the wiring 110 but also to the flexible substrate main body 90 to reinforce the wiring 110.

  Further, a through-hole 122 having the same shape is formed in the reinforcing film member 120 at the same position as the insertion hole 106 of the wiring 110.

  The material of the reinforcing film member 120 is not particularly limited as long as the wiring 110 can be reinforced. However, since the insulation between the wirings 110 may be confirmed when the flexible substrate 88 is inspected, it is preferable that at least the reinforcing film member 120 has an insulation property in order to enable this inspection. .

  Next, a method for joining the flexible substrate 88 of the present embodiment to the electronic component 94 will be described.

  As shown in FIGS. 3A and 3B, the flexible substrate main body 90 connects the wirings 110 in the opening 112 to each other, and is further spanned between the flexible substrate main bodies 90 on both sides of the opening 112. In this manner, the reinforcing film member 120 is pasted with a peelable adhesive. When the reinforcing film member 120 is attached in this way, the insertion hole 106 is not formed in the wiring 110 and the through hole 122 is not formed in the reinforcing film member 120.

  Therefore, after the reinforcing film member 120 is attached, the insertion hole 106 of the wiring 110 and the through hole 122 of the reinforcing film member 120 are formed simultaneously. At this time, since the wiring 110 is reinforced by the reinforcing film member 120, it is possible to prevent the perforation position from slipping or the wiring 110 from being broken.

  Next, as shown in FIGS. 4A and 4B, the insertion convex portion 104 of the electronic component 94 is inserted into the insertion hole 106 of the wiring 110. At this time, in the flexible substrate 88 of the present embodiment, the connection region 108 portion (the portion exposed from the opening 112) of the wiring 110 is reinforced by attaching a reinforcing film member 120 having high rigidity and strength. The insertion hole 106 and the insertion convex portion 104 are displaced due to the positional accuracy and dimensional accuracy of the insertion hole 106, the positional accuracy and dimensional accuracy of the insertion convex portion 104, and the lack of alignment accuracy between the insertion hole 106 and the insertion convex portion 104. Even if the wiring 110 and the insertion protrusion 104 come into contact with each other, the deformation of the wiring 110 is suppressed. Since the wiring 110 does not break or break, the insertion convex portion 104 can be inserted into the insertion hole 106 accurately and reliably without impairing the reliability of the electrical connection between the insertion convex portion 104 and the wiring 110. It is possible to work.

  Since the height of the insertion convex portion 104 is higher than the thickness of the wiring 110, when the insertion convex portion 104 is inserted into the insertion hole 106, the upper portion of the insertion convex portion 104 is higher than the insertion hole 106 (upper surface of the wiring 110). Is also located above and constitutes a protrusion 116.

  After the insertion convex portion 104 is inserted into the insertion hole 106 in this way, only the reinforcing film member 120 is removed from the wiring 110 and the flexible substrate main body 90 as shown in FIGS. Since the reinforcing film member 120 is attached to the wiring 110 and the flexible substrate body 90 with a peelable adhesive, for example, the reinforcing film member 120 can be removed easily by simply pulling the reinforcing film member 120.

  After removing the reinforcing film member 120, the upper portion of the insertion convex portion 104 protrudes from the insertion hole 106 (the upper surface of the wiring 110) to form a protruding portion 116. As shown in FIGS. 6A and 6B, the protruding portion 116 is expanded in diameter by means such as caulking to form an expanded diameter portion 118. As a result, the wiring 110 is sandwiched between the enlarged diameter portion 118 having an enlarged cross-sectional area and the electronic component 94, so that the connection is further ensured by the so-called anchor effect. Further, the electrical contact area between the insertion convex portion 104 and the wiring 110 also increases.

  In the above description, the reinforcing film member 120 is attached to the wiring 110 and the flexible substrate main body 90 with an adhesive that can be peeled off. However, instead of such an adhesive, irradiation with ultraviolet rays, heating, The reinforcing film member 120 is pasted using an adhesive whose adhesiveness decreases due to cooling, addition of a drug, etc., and after inserting the insertion convex portion 104 into the insertion hole 106, heating and cooling, adding a drug, etc., The film may be peeled off by reducing the adhesive strength.

  An example of a material whose adhesive strength is reduced by irradiation with ultraviolet rays or active energy rays is an acrylic ultraviolet curable resin. Furthermore, as an adhesive material whose adhesive strength is reduced by irradiation with ultraviolet rays, irradiation with active energy rays, or heating, at least one of a photopolymerizable prepolymer and a monomer may be used as required. Monofunctional or polyfunctional monomers, various polymers, photopolymerization initiators (acetophenones, benzophenones, Michler ketone, benzyl, benzoin, benzoin ether, benzyl ketals, thioxanthones, etc.), sensitizers (amines, diethylaminoethyl methacrylate) Etc.) is used. Here, examples of the photopolymerizable prepolymer include polyester acrylate, polyester urethane acrylate, epoxy acrylate, and polyol acrylate, and examples of the photopolymerizable monomer include monofunctional acrylate, bifunctional acrylate, and trifunctional or higher acrylate. In addition to the above, a phosphazene resin can be used as the photopolymerizable prepolymer or monomer. In this case, it is not necessary to add a photopolymerization initiator or a sensitizer.

  Moreover, it is good also as a structure which can be removed with the physical property of the reinforcement film member 120, without using such a peelable adhesive agent. For example, by using a material that contracts due to heating, cooling, addition of chemicals, or the like as the reinforcing film member 120, the reinforcing film member 120 is contracted by performing heating, cooling, addition of chemicals, or the like after connection, and the wiring 110 or the flexible substrate. The adhesive surface with the main body 90 may be peeled off.

  Polyester film, OPS (registered trademark), PET, PVC film, Hisilex (registered trademark), DXL film (trade name), Hishipet (registered trademark), polyvinyl chloride material, Hishi tube (Registered trademark).

  Furthermore, the reinforcing film member 120 may be formed using a material that melts by heating, addition of a solvent, or the like, and when removed, the reinforcing film member 120 may be melted by heating or material conversion.

  Further, in the above, the portion (projecting portion 116) that protrudes from the insertion hole 106 (the upper surface of the wiring 110) of the insertion convex portion 104 is caulked to configure the enlarged diameter portion 118, thereby making the connection more reliable, Although an example in which the electrical contact area is increased has been given, instead of this, for example, even if the projecting portion 116 and the wiring 110 are connected by soldering or electroless plating, the connection is similarly ensured, The electrical contact area of the connection part can be increased.

  Further, in the above example, the insertion convex portion 104 is formed so as to be substantially equal to the outer shape of the insertion hole 106 or slightly smaller than the outer shape of the insertion hole 106 and can be inserted into the insertion hole 106. However, it can be applied to a configuration in which the insertion convex portion 104 is inserted so as to push the insertion hole 106 wide so that the sectional area of the insertion convex portion 104 is slightly larger than the opening sectional area of the insertion hole 106. It is. In this configuration, when the insertion convex portion 104 is inserted into the insertion hole 106, the wiring 110 is contracted around the insertion hole 106 so as to closely contact the insertion convex portion 104, so that electrical connection can be made more reliable. It is. In such a configuration, a large force may act on the wiring 110 when the insertion convex portion 104 is inserted into the insertion hole 106. However, since the reinforcing film member 120 reinforces the wiring 110 at the time of insertion. Can be more effectively suppressed.

  In addition, in the above description, the configuration in which the flexible substrate 88 is connected to the driver substrate 84 of the head unit 66 has been described as an example. However, the connection symmetry of the flexible substrate 88 is not limited to this, for example, the control substrate 86 May be. Further, the flexible substrate 88 can be used for the connection of the flexible substrate 88 inside the head unit 66, for example, to the individual wiring of the piezoelectric element, and the electrical connection between the head unit 66 and an external member. In particular, in the structure in which the nozzle pitch is narrowed, the interval between the piezoelectric elements is correspondingly reduced. Therefore, it is preferable to apply the present invention to the connection of the flexible substrate to such individual wiring of the piezoelectric elements.

1 is a schematic configuration diagram illustrating an image forming apparatus according to a first embodiment of the present invention. 1 is a schematic perspective view showing a head unit in an image forming apparatus according to a first embodiment of the present invention. The process of joining the flexible substrate of 1st Embodiment of this invention to an electronic component is shown, (A) is a perspective view, (B) is the BB sectional drawing of (A). The process of joining the flexible substrate of 1st Embodiment of this invention to an electronic component is shown, (A) is a perspective view, (B) is the BB sectional drawing of (A). The process of joining the flexible substrate of 1st Embodiment of this invention to an electronic component is shown, (A) is a perspective view, (B) is the BB sectional drawing of (A). The state which joined the flexible substrate of 1st Embodiment of this invention to the electronic component is shown, (A) is a perspective view, (B) is the BB sectional drawing of (A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Image forming apparatus 12 Paper feed conveyance part 14 Processing liquid application part 16 Image formation part 18 Ink drying part 20 Image fixing part 21 Discharge part 22 Stacking part 24 Paper feed part 26 Roller pair 28 Conveyance part 30 Processing liquid application drum 32 Holding member 34 Intermediate Conveying Drum 36 Image Forming Drum 38 Ink Drying Drum 40 Image Fixing Drum 42 Processing Liquid Coating Device 44 Processing Liquid Drying Device 46 Storage Unit 48 Gravure Roller 50 Rubber Roller 54 Hot Air Nozzle 56 IR Heater 58 Intermediate Conveying Unit 64 Inkjet Line Head 66 Head Unit 68 Rotating shaft 70 Intermediate transport part 72 Hot air nozzle 74 IR heater 76 Intermediate transport part 78 Heating roller 80 Fixing roller 82 Head housing 84 Driver board 86 Control board 88 Flexible board 90 Flexible board body 94 Electronic component 104 Insertion convex part 10 Insertion holes 108 connecting area 110 wiring 110C connecting portion 112 opening 116 protrusion 118 enlarged diameter portion 120 reinforcing film member 122 through hole

Claims (9)

A flexible substrate body having flexibility;
Wiring formed on the flexible substrate body;
A connection part that is configured as a part of the wiring and is connected to the counterpart member by protruding from the flexible substrate body,
A reinforcing member attached to connect the connecting portions or the connecting portion and the flexible substrate body; and
An insertion hole that is formed through the connection portion and the reinforcing member, and into which an insertion protrusion provided on the counterpart member is inserted;
A flexible substrate.   The flexible substrate according to claim 1, wherein the reinforcing member is a shrinkable film member that shrinks by at least one of irradiation of ultraviolet rays, irradiation of active energy rays, heating, cooling, and addition of a drug.   The flexible substrate according to claim 1, wherein the reinforcing member is a molten film member that melts by at least one of irradiation of ultraviolet rays, irradiation of active energy rays, heating, cooling, and addition of a drug.   2. The adhesive member that adheres the reinforcing member to the connecting portion or the flexible substrate body, and has an adhesive that lowers the adhesiveness by at least one of ultraviolet irradiation, active energy ray irradiation, heating, cooling, and chemical addition. The flexible substrate as described in 1. A flexible substrate bonding method for bonding the flexible substrate according to any one of claims 1 to 4 to the mating member,
An insertion step of inserting the insertion convex portion into the insertion hole;
A removing step of removing the reinforcing member after the inserting step;
A joining step of joining the insertion convex portion and the wiring after the removing step;
A flexible substrate bonding method comprising: The flexible substrate bonding method according to claim 5,
The insertion protrusion has a height protruding from the insertion hole;
A flexible substrate bonding method in which, in the bonding step, a diameter of a portion of the insertion convex portion protruding from the insertion hole is increased.   The flexible substrate bonding method according to claim 5, wherein in the bonding step, the wiring and the insertion convex portion are bonded by soldering or plating. A droplet discharge head body for discharging droplets;
A circuit board provided in the droplet discharge head body;
The flexible substrate according to any one of claims 1 to 4, wherein the flexible substrate is bonded to the circuit substrate.
A droplet discharge head having A conveying device for conveying a recording sheet;
The droplet discharge head according to claim 8, wherein droplets are discharged onto the recording sheet conveyed by the conveyance device;
An image forming apparatus.

Images