JP4881247B2 - Electronic device and manufacturing method thereof - Google Patents

Electronic device and manufacturing method thereof Download PDF

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Publication number
JP4881247B2
JP4881247B2 JP2007184385A JP2007184385A JP4881247B2 JP 4881247 B2 JP4881247 B2 JP 4881247B2 JP 2007184385 A JP2007184385 A JP 2007184385A JP 2007184385 A JP2007184385 A JP 2007184385A JP 4881247 B2 JP4881247 B2 JP 4881247B2
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JP
Japan
Prior art keywords
molded body
antenna pattern
electronic device
antenna
forming
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007184385A
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Japanese (ja)
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JP2009021932A (en
Inventor
政臣 中畑
晃一 佐藤
昌治 加藤
智 本田
朋子 本田
淳 森本
実 櫻井
誠 田幡
義和 畑
彰宏 辻村
信好 黒岩
Original Assignee
株式会社東芝
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Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP2007184385A priority Critical patent/JP4881247B2/en
Publication of JP2009021932A publication Critical patent/JP2009021932A/en
Application granted granted Critical
Publication of JP4881247B2 publication Critical patent/JP4881247B2/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Description

  The present invention relates to an electronic device and a method for manufacturing the same.

  There is a strong demand for downsizing electronic devices including mobile phones and PDAs (Personal Digital Assistants). To reduce the size while reducing the influence of electromagnetic waves radiated from the antenna on circuit components and the influence of noise from integrated circuits and high-frequency circuits on the antenna, it is necessary to improve the housing structure.

  In this case, it is possible to consider a structure in which the antenna is arranged on the housing side away from the substrate on which the integrated circuit and the high frequency circuit are arranged. In the case where the antenna is disposed on the outer surface side of the housing, a design restriction occurs. In addition, the antenna characteristics may change when a human body approaches. Therefore, it is more preferable to arrange the antenna on the inner surface side of the housing.

  However, in order to ensure rigidity, the inner surface side of the housing is often a rib structure, and a boss for component placement is often provided. When an antenna pattern is arranged on the inner surface side of a housing provided with ribs and bosses, there is a restriction on the shape.

There is a technology disclosure example in which a linear antenna is arranged in a loop around a liquid crystal display window of a portable wireless device to save space for mounting the antenna (Patent Document 1).
JP-A-11-187096

  The present invention provides an electronic device that can be reduced in size while maintaining good antenna characteristics, and a method for manufacturing the same.

  According to one aspect of the present invention, a first molded body having a concave cross section and made of resin, and a second molded body fitted inside the first molded body and having a concave cross section and made of resin. And an antenna pattern sandwiched between the first and second molded bodies, wherein a side of the surface of the first molded body that is not adjacent to the antenna pattern is an outer surface. An electronic device is provided.

According to another aspect of the present invention, there is provided a method for manufacturing the above electronic device,
Forming the first molded body; inserting the antenna pattern into the first molded body; and sandwiching the antenna pattern so that the second molded body is the first molded body. And a step of forming or fitting inside the molded body. A method for manufacturing an electronic device is provided.

  According to yet another aspect of the present invention, there is provided a method for manufacturing the electronic apparatus, wherein the antenna is formed on the surface of the second molded body by any one of printing, plating, and applying a conductive material. There is provided a method for manufacturing an electronic device, comprising: forming a pattern; and forming the first molded body on the outside of the second molded body so as to sandwich the antenna pattern. The

  According to still another aspect of the present invention, there is provided a method for manufacturing the electronic apparatus, the step of forming the second molded body into a sheet shape, and the antenna on the second molded body. Forming a pattern, bending the second molded body and the end of the antenna pattern inward, and forming the first molded body on the outside of the second molded body so as to sandwich the antenna pattern And a method of manufacturing an electronic device.

  The present invention provides an electronic device that can be reduced in size while maintaining good antenna characteristics, and a method for manufacturing the same.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A and 1B are schematic diagrams illustrating an electronic apparatus according to an embodiment of the present invention. FIG. 1A is a schematic perspective view, and FIG. 1B is a schematic diagram illustrating a configuration of a housing.

This figure shows an electronic device which is a foldable mobile phone. Of course, a sliding electronic device may be used. The upper housing 50 includes an outer housing 52 and an inner housing 54. The outer casing 52 is located outside in a state in which the folding mobile phone is folded. That is, a part of the design surface outside the mobile phone is formed in the folded state. On the other hand, the inner casing 54 is positioned inside in a state in which the folding mobile phone is folded. That is, the outer design surface is not substantially configured in a state in which the cellular phone is folded.
Or the outer housing | casing 52 is provided in an outer side seeing a user in a normal use state. On the other hand, the inner casing 54 is provided on the inner side, that is, on the user's side as viewed from the user in a normal use state. In the inner casing 54, for example, at least one of an image display unit such as a liquid crystal display device 55 and an operation unit is disposed.

  The lower housing 60 includes an outer housing 62 and an inner housing 64. A substrate on which a high-frequency circuit including a power feeding unit, a signal processing circuit, a control circuit, a power supply circuit, and the like are disposed, a secondary battery, and the like are fixed to the outer casing 62. In addition, a keyboard or the like is disposed on the inner housing 64.

  FIG. 1B is a schematic diagram showing the configuration of the outer casing 52 that constitutes the upper casing 50. The outer surface 56 of the outer casing 52 is a design surface, and the appearance is important when the electronic device is closed. The antenna pattern layer 26 is disposed inside the first molded body 10. The antenna pattern layer 26 includes, for example, two antenna patterns 20a and 20b, an antenna pattern protective film, an insulating film, and the like.

  The antenna pattern layer 26 is sandwiched between the first molded body 10 and the second molded body 30, and has a three-layer structure with an integrated housing. The first and second molded bodies 10 and 30 are formed by molding using, for example, a resin material. In this way, the outer casing 52 can be formed.

  According to this embodiment, the antenna pattern can be arranged in a wide area on the inner surface of the outer casing 52. In FIG. 1B, two antenna patterns 20a and 20b are arranged, but more antenna patterns 20 can be arranged. In addition, the antenna shape can be designed more freely without being influenced by the positions of the ribs and bosses inside the housing, so that favorable antenna characteristics can be obtained.

  FIG. 2A is a schematic cross-sectional view illustrating the first embodiment of the housing-integrated antenna of the electronic device according to the present embodiment, and represents a cross section taken along the chain line AA in FIG. FIG.2 (b) is an enlarged view of the A section in Fig.2 (a). FIG. 3 is a flowchart showing the manufacturing process of the first embodiment. The configuration and manufacturing process of the first embodiment will be described with reference to FIGS. First, the first molded body 10 made of resin is molded (S100). Subsequently, a conductive layer is formed on the film by a process such as plating, vapor deposition, and printing to form the antenna pattern layer 26 (S102).

  The antenna pattern layer 26 is inserted into the first molded body 10 having a concave cross section and made of resin (S104). In this case, the antenna pattern protective film 21 may be the above film or may be provided separately. Similarly, the insulating film 22 may be the above film or a resin sheet having a thickness of several micrometers. After the antenna pattern layer 26 is inserted, a second molded body 30 made of resin and having a concave cross section is formed (S106), and a housing integrated antenna is obtained. In this case, the second molded body 30 may be formed in advance and fitted, and then bonded or welded to the first molded body 10.

  In FIG. 2, when the second molded body 30 is made of a conductive resin and is an electromagnetic shield layer, noise from the power supply unit 40 such as a liquid crystal display unit or a substrate can be cut off and the antenna characteristics can be improved. In this case, in order to prevent the feeding point 42 from contacting the conductive second molded body 30, the insulating layer 24 is provided on the side wall of the opening 31 of the second molded body 30 surrounding the feeding point 42. Provided (S108). If the second molded body 30 is an insulating material, the insulating film 22 and the insulating layer 24 can be omitted.

  The power supply unit 40 including a substrate or a liquid crystal display unit is connected to the antenna pattern via the feeding point 42 (S110).

  The antenna pattern layer 26 may be a sheet metal punched out of a thin metal. FIG. 4 is a modification of the first embodiment, and is a schematic cross-sectional view of a housing-integrated antenna in which the antenna pattern 20 is made of sheet metal. In addition, in the following drawings, the same number is attached | subjected to the component similar to FIG. 2, and detailed description is abbreviate | omitted. In this case, the protective film 21 may not be provided. This structure can simplify the manufacturing process.

  FIG. 5A is a schematic cross-sectional view showing a second embodiment of the housing-integrated antenna, and FIG. 5B is an enlarged view of a portion B in FIG. FIG. 6 is a flowchart showing the manufacturing process. In this case, the second molded body 30 made of resin is first molded (S200). The antenna pattern 20 is formed on the second molded body 30 by plating, vapor deposition, printing, etc., and the antenna pattern protective film 21 is further formed thereon to form the antenna pattern layer 26 (S202).

  A conductive paste 43 made of resin or the like is applied to the opening 31 connected to the feeding point 42 (S204). Subsequently, the first molded body 10 is formed (S206), and the antenna pattern 20 and the feeding point 42 are connected (S208).

  FIG. 7 is a schematic cross-sectional view showing a third embodiment of a housing integrated antenna. FIG. 8 is a flowchart of the manufacturing process. The 2nd molded object 30 is made into the sheet form which consists of an insulator (S300). The antenna pattern 20 is formed on the sheet by plating, vapor deposition, printing, sheet metal pasting, or the like (S302).

  Subsequently, the antenna pattern 20 is bent so as to be bonded to the first molded body 10 (S304), and the first molded body 10 is formed so as to cover the antenna pattern 20 (S306). The power supply unit 40 including a substrate or a liquid crystal display unit is connected to the feeding point 42 at the bent portion (S308).

  FIG. 9A is a schematic cross-sectional view showing a fourth embodiment of the housing-integrated antenna, and FIG. 9B is an enlarged view of a portion C in FIG. 9A. First and second molded bodies 10 and 30 made of resin are formed in advance. After the antenna pattern layer 26 is inserted into the first molded body 10 and the second molded body 30 is fitted, the end portions of the first and second molded bodies 10 and 30 are bonded or ultrasonically welded. The outer casing 52 is fixed.

  In the electronic apparatus using the housing-integrated antenna according to the first to fourth embodiments, a wide area on the inner surface of the housing can be used as an antenna pattern region. For this reason, it is possible to reduce the size of the electronic device while providing other types of antennas having different characteristics.

  Moreover, by integrating with a housing | casing, it can isolate | separate from a board | substrate and can reduce the influence of the noise from an electronic component on a board | substrate. Moreover, noise can be further reduced if the molded body on the substrate side has a shielding effect. Moreover, it is possible to prevent the antenna pattern from being shielded by hand, and to suppress changes in antenna characteristics such as directivity.

  Here, the antenna pattern 20 will be described. FIG. 10 is a schematic diagram illustrating an example of an antenna that can be used in the present embodiment. FIG. 10A shows a dipole antenna. The antenna pattern 20 has a length of approximately one-half wavelength, and is excited by the power feeding unit 70 at an intermediate portion thereof.

  FIG. 10B shows a monopole antenna. The antenna pattern 20 has a length of approximately a quarter wavelength, and considering the ground plane 72, it can be considered in the same way as a half wavelength antenna.

  FIG. 10C shows a folded dipole pole antenna, which enables high radiation efficiency with high impedance.

  FIG. 10D shows an inverted F antenna having a plate-like element 20a, and the plate-like element 20a has a peripheral length of approximately one half wavelength. In this case, since the antenna excites the casing and current flows through the casing, the effective dimension of the antenna can be increased.

  By arranging an antenna selected from the group including the antenna pattern 20 illustrated in FIG. 10 in the outer casing 52 as shown in FIG. That is, not only mobile phone triple bands such as GSM (Global System for Mobile Communication), DCS (Digital Cellular System) / PCS (Personal Communications Service), but also wireless LAN, FM and AM broadcasting, GPS (Global Positioning System), ground The transmission / reception function can be expanded to include electronic payment applications such as One Seg, Felica (trademark) / SUICA (trademark) for receiving digital broadcasting. However, it is difficult to provide such a variety of antennas with the rod antenna exposed outside the casing.

  The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to these. Even if a person skilled in the art makes various design changes regarding the material, shape, size, arrangement, etc. of the antenna pattern, molded body, substrate, insulating film, casing, etc. constituting the electronic device, it departs from the gist of the present invention Unless otherwise included in the present invention.

It is a schematic diagram showing the electronic device concerning embodiment of this invention. 1 is a schematic cross-sectional view illustrating a first embodiment of a housing-integrated antenna of an electronic device according to the present embodiment. It is a flowchart of the manufacturing process of 1st Embodiment. It is a schematic cross section showing the modification of 1st Embodiment. It is a schematic cross section showing 2nd Embodiment of a housing integrated antenna. It is a flowchart of the manufacturing process of 2nd Embodiment. It is a schematic cross section showing 3rd Embodiment of a housing integrated antenna. It is a flowchart of the manufacturing process of 3rd Embodiment. It is a schematic cross section showing 4th Embodiment of a housing integrated antenna. It is a schematic diagram showing the structure of an antenna.

Explanation of symbols

  10 First molded body, 20 Antenna pattern, 21 Protective film, 22 Insulating film, 30 Second molded body, 56 Outer surface

Claims (8)

  1. A first molded body having a concave cross section and made of resin; a second molded body fitted inside the first molded body and having a concave cross section and made of resin; and the first molded body, An outer pattern having an antenna pattern sandwiched between the second molded body, and
    An inner case that is combined with the outer case and provided with at least one of an image display unit and an operation unit;
    An electronic device characterized by comprising:
  2.   The electronic apparatus according to claim 1, wherein the second molded body is conductive, and an insulating film is provided between the second molded body and the antenna pattern.
  3.   The electronic apparatus according to claim 1, wherein a protective film is provided between the antenna pattern and the first molded body.
  4.   The electronic device according to claim 2, wherein the antenna pattern includes a conductive layer formed on the insulating film or the protective film in a film form.
  5.   The electronic device according to claim 1, wherein the antenna pattern is made of sheet metal.
  6. It is a manufacturing method of the electronic device according to any one of claims 1 to 5,
    Forming the first molded body;
    Inserting the antenna pattern into the first molded body;
    Forming or fitting the second molded body inside the first molded body so as to sandwich the antenna pattern;
    The manufacturing method of the electronic device characterized by including.
  7. It is a manufacturing method of the electronic device of Claim 1, Comprising:
    Forming the antenna pattern on the surface of the second molded body by any one of printing, plating, and applying a conductive material;
    Forming the first molded body on the outside of the second molded body so as to sandwich the antenna pattern;
    The manufacturing method of the electronic device characterized by including.
  8. It is a manufacturing method of the electronic device of Claim 1, Comprising:
    Forming the second molded body into a sheet;
    Forming the antenna pattern on the second molded body, bending the second molded body and an end of the antenna pattern inward,
    Forming the first molded body on the outside of the second molded body so as to sandwich the antenna pattern;
    The manufacturing method of the electronic device characterized by including.
JP2007184385A 2007-07-13 2007-07-13 Electronic device and manufacturing method thereof Expired - Fee Related JP4881247B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007184385A JP4881247B2 (en) 2007-07-13 2007-07-13 Electronic device and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007184385A JP4881247B2 (en) 2007-07-13 2007-07-13 Electronic device and manufacturing method thereof
US12/171,592 US20090015490A1 (en) 2007-07-13 2008-07-11 Electronic device and method for manufacturing same
CN 200810130355 CN101345331A (en) 2007-07-13 2008-07-11 Electronic device and method for manufacturing same

Publications (2)

Publication Number Publication Date
JP2009021932A JP2009021932A (en) 2009-01-29
JP4881247B2 true JP4881247B2 (en) 2012-02-22

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JP (1) JP4881247B2 (en)
CN (1) CN101345331A (en)

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Publication number Publication date
US20090015490A1 (en) 2009-01-15
CN101345331A (en) 2009-01-14
JP2009021932A (en) 2009-01-29

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