JP4876454B2 - Insulating film for flat cable and flat cable using the same - Google Patents
Insulating film for flat cable and flat cable using the same Download PDFInfo
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- JP4876454B2 JP4876454B2 JP2005191984A JP2005191984A JP4876454B2 JP 4876454 B2 JP4876454 B2 JP 4876454B2 JP 2005191984 A JP2005191984 A JP 2005191984A JP 2005191984 A JP2005191984 A JP 2005191984A JP 4876454 B2 JP4876454 B2 JP 4876454B2
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- 239000012790 adhesive layer Substances 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 229920001225 polyester resin Polymers 0.000 claims description 24
- 239000004645 polyester resin Substances 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 16
- 239000003063 flame retardant Substances 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 230000009477 glass transition Effects 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 229920006395 saturated elastomer Polymers 0.000 claims description 7
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 11
- 238000010894 electron beam technology Methods 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
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- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
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- 230000001070 adhesive effect Effects 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
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- 239000001993 wax Substances 0.000 description 2
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical class C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Description
本発明は、フラットケーブル用絶縁フィルムおよびそれを用いたフラットケーブルに関し、詳しくは、難燃性かつ耐熱性に優れたフラットケーブル用絶縁フィルムおよびそれを用いたフラットケーブルに関する。 The present invention relates to an insulating film for a flat cable and a flat cable using the same, and more particularly, to an insulating film for a flat cable excellent in flame resistance and heat resistance and a flat cable using the same.
近年、コンピュータ、液晶表示装置、携帯電話、プリンター、自動車、家電製品、複写機、その他等の各種の製品においては、各種機器内配線が複雑化するのに対応して、その配線作業の省力化や誤配線防止のために、フラットケーブルが、多く使用されている。 In recent years, in various products such as computers, liquid crystal display devices, mobile phones, printers, automobiles, home appliances, copiers, etc., the wiring work in various devices has become complicated, and labor saving of wiring work has been achieved. In order to prevent incorrect wiring, flat cables are often used.
これらのフラットケーブルは、一般に、まず、フィルム状基材に接着剤層を積層することによってフラットケーブル用絶縁フィルムを作製し、その後、２枚のフラットケーブル用絶縁フィルムの互いの接着剤層面を重ね合わせ、熱融着して一体化する際に、その接着剤層面の間に、複数本の導体を並列して挟持させておくことにより製造される。 In general, these flat cables are generally produced by first laminating an adhesive layer on a film-like substrate to produce an insulating film for a flat cable, and then superposing the adhesive layer surfaces of the two flat cable insulating films on each other. When they are combined and heat-sealed and integrated, they are manufactured by sandwiching a plurality of conductors in parallel between the adhesive layer surfaces.
具体的には、上記のフラットケーブルとしては、例えば、二軸延伸ポリエステル系樹脂フィルム等のフィルム状基材の片面に、飽和ポリエステル系樹脂と難燃化剤とを含む樹脂組成物による接着剤層を形成してフラットケーブル用絶縁フィルムを作製し、次いで、２枚のこのフラットケーブル用絶縁フィルムを用いて、互いの接着剤層面を対向させて重ね合わせ、更に、その層間に、多数本の導体を挟み込んだ後、加熱ロール等により加熱加圧して、接着剤層を溶融し、多数本の導体を接着剤層中に埋め込むと共に、接着剤層同士を熱接着して製造されるポリエステル系樹脂製フラットケーブルが知られている。 Specifically, as the flat cable, for example, an adhesive layer made of a resin composition containing a saturated polyester resin and a flame retardant on one surface of a film-like substrate such as a biaxially stretched polyester resin film. To form an insulating film for a flat cable, and then, using the two insulating films for a flat cable, the adhesive layer surfaces of each other are overlapped with each other, and a large number of conductors are provided between the layers. Made of polyester resin that is manufactured by heating and pressing with a heating roll, etc., melting the adhesive layer, embedding a large number of conductors in the adhesive layer, and thermally bonding the adhesive layers together Flat cables are known.
上記のポリエステル系樹脂製フラットケーブルは、フィルム状基材を二軸延伸ポリエステル系樹脂フィルム等で、接着剤層をポリエステル系樹脂成分等で構成していることから難燃性に欠け、そのために接着剤層を構成する樹脂組成物中に大量の難燃化剤を添加して、その難燃性を得なければならない。しかし、大量の難燃化剤を添加して調製した樹脂組成物による接着剤層は、フィルム基材との密接着性が低下するという問題点がある。 The above-mentioned flat cable made of polyester resin lacks flame retardancy because the film base is composed of a biaxially stretched polyester resin film and the like, and the adhesive layer is composed of a polyester resin component and the like. A large amount of flame retardant should be added to the resin composition constituting the agent layer to obtain the flame retardancy. However, an adhesive layer made of a resin composition prepared by adding a large amount of a flame retardant has a problem that the tight adhesion with a film substrate is lowered.
そこで、難燃性と耐熱性に優れたフラットケーブル用絶縁フィルムを得る手段として、イソシアネート基、カルボジイミド基を有する多官能性化合物とポリエステル系樹脂とポリウレタン系樹脂よりなる架橋層（アンカーコート層）が、特開２００１−２２２９１９号公報（特許文献１）で提案されている。しかし、ウレタン系樹脂を、イソシアネートなどを用いて硬化させるためには、長時間の加熱が必要であり、硬化後の耐熱性も十分とは言い難い。また、液状成分をコーティングして、架橋層（アンカーコート層）を得るので、塗布工程、乾燥工程等を必要とし、生産効率に問題がある。 Therefore, as a means for obtaining a flat cable insulating film excellent in flame retardancy and heat resistance, a cross-linked layer (anchor coat layer) composed of a polyfunctional compound having an isocyanate group and a carbodiimide group, a polyester resin, and a polyurethane resin is used. Japanese Patent Laid-Open No. 2001-222919 (Patent Document 1). However, in order to cure the urethane resin using isocyanate or the like, heating for a long time is required, and it is difficult to say that the heat resistance after curing is sufficient. In addition, since a liquid component is coated to obtain a crosslinked layer (anchor coat layer), a coating process, a drying process, and the like are required, and there is a problem in production efficiency.
また、特開平７ー１５０１２６号公報（特許文献２）において、熱可塑性高分子量ポリエステル樹脂に含臭素リン酸エステルおよび無機充填剤を配合した接着剤に電子線やガンマー線等の放射線を照射する方法が提案されている。しかし、ここで用いられているポリエステル樹脂は、線状の飽和ポリエステル樹脂であり、放射線により分解しやすく、また熱変形しやすく耐熱性が十分とは言い難い。 Also, in JP-A-7-150126 (Patent Document 2), a method of irradiating an adhesive prepared by blending a thermoplastic high molecular weight polyester resin with a bromine-containing phosphate ester and an inorganic filler, such as an electron beam or a gamma ray. Has been proposed. However, the polyester resin used here is a linear saturated polyester resin, is easily decomposed by radiation, is easily deformed by heat, and cannot be said to have sufficient heat resistance.
さらに、特許３３８１８６９号公報（特許文献３）において、絶縁基材の片面に加速電圧を制御した電子線を照射して、絶縁基材の厚みの２０〜９０％を架橋することが提案されている。しかし、この方法では、電子線照射量のバラツキや絶縁基材の厚み精度のバラツキ等により、架橋部分（架橋層）と接着部分（接着剤層）の厚さに不均一が生じることが避けられず、接着性や耐熱性において、部分的なバラツキが生じる。
本発明は、高い難燃性を有しながらも耐熱性や密着性に優れるフラットケーブル用絶縁フィルムおよびそれを使用したフラットケーブルを提供することを目的とする。 An object of this invention is to provide the insulating film for flat cables which is excellent in heat resistance and adhesiveness, while having high flame retardance, and a flat cable using the same.
本発明者等は、上記の目的に鑑み、鋭意検討の結果、難燃性フラットケーブル用フィルムを、絶縁性樹脂基材、架橋層、および接着剤層シートの積層構造とし、架橋層に、不飽和基を含有する樹脂組成物を用い、それに所定の条件で、高エネルギー線を照射することによって、優れた耐熱性や密着性を発現し得ることを見いだし、本発明を完成するに至った。 As a result of intensive investigations, the present inventors have made the flame retardant flat cable film a laminated structure of an insulating resin base material, a crosslinked layer, and an adhesive layer sheet. By using a resin composition containing a saturated group and irradiating it with high energy rays under predetermined conditions, it was found that excellent heat resistance and adhesion can be expressed, and the present invention has been completed.
本発明は、絶縁性樹脂基材、架橋層及び接着剤層の順で積層されてなるフラットケーブル用絶縁フィルムであって、前記架橋層は、不飽和基を有する化合物及び不飽和基を有する熱可塑性樹脂を主成分とする樹脂組成物に、高エネルギー線を前記熱可塑性樹脂のガラス転移点温度以上の温度で照射して得られた層であり、また、前記接着剤層は、難燃剤を含む熱可塑性樹脂組成物からなることを特徴とするフラットケーブル用絶縁フィルムを提供するものである（請求項１）。 The present invention is an insulating film for a flat cable formed by laminating an insulating resin base material, a cross-linked layer, and an adhesive layer in this order, and the cross-linked layer includes a compound having an unsaturated group and a heat having an unsaturated group. It is a layer obtained by irradiating a resin composition mainly composed of a plastic resin with high energy rays at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin, and the adhesive layer contains a flame retardant. The present invention provides an insulating film for a flat cable, comprising the thermoplastic resin composition.
上記絶縁性樹脂基材を構成する材料としては、機械的強度、寸法安定性等に優れ、かつ、耐熱性、可撓性、耐薬品性、耐溶剤性、屈曲性、絶縁性等に富む樹脂が使用できる。中でも、ポリエステル系樹脂、ポリアミド系樹脂、ポリイミド系樹脂及びポリフェニレンサルファイド系樹脂が好ましく例示される。請求項２は、前記のフラットケーブル用絶縁フィルムであって、例示の樹脂から選ばれる樹脂よりなる絶縁性樹脂基材を用いることを特徴とするフラットケーブル用絶縁フィルムを提供するものである。 As a material constituting the insulating resin base material, a resin excellent in mechanical strength, dimensional stability, etc., and having excellent heat resistance, flexibility, chemical resistance, solvent resistance, flexibility, insulation, etc. Can be used. Of these, polyester resins, polyamide resins, polyimide resins and polyphenylene sulfide resins are preferably exemplified. A second aspect of the present invention provides an insulating film for a flat cable, which is an insulating film for a flat cable using an insulating resin substrate made of a resin selected from the exemplified resins.
架橋層は、絶縁性樹脂基材と接着剤層との密着力を向上させ、その層間剥離等を抑制するとともに、熱接着加工速度を向上させ、また、耐熱接着性を向上させるために設けられるものである。 The cross-linked layer is provided to improve the adhesion between the insulating resin base material and the adhesive layer, suppress the delamination, etc., improve the thermal bonding processing speed, and improve the heat resistant adhesiveness. Is.
架橋層を構成する樹脂組成物としては、ポリエステル系樹脂を主成分とする熱可塑性樹脂１００質量部に対し、不飽和基を分子内に２個以上を有する化合物１〜３０質量部の質量比の混合物を主成分とするものが好ましい。請求項３は、前記のフラットケーブル用絶縁フィルムであって、この好ましい樹脂組成物を用いることを特徴とするフラットケーブル用絶縁フィルムを提供するものである。
The resin composition constituting the crosslinked layer, of the thermoplastic resin 100 parts by weight of a main component a polyester resin,
熱可塑性樹脂に対する不飽和化合物の割合が、前記の範囲の下限より少なければ、架橋効率が低く、被膜の形成が進みににくくなる場合がある。逆に、不飽和化合物の割合が前記の範囲の上限より多ければ、架橋が進みすぎ、被膜のフレキシビリティーが失われ、折り曲げ時などにクラックが入りやすくなる場合がある。 If the ratio of the unsaturated compound to the thermoplastic resin is less than the lower limit of the above range, the crosslinking efficiency is low, and the formation of the film may be difficult to proceed. On the other hand, if the ratio of the unsaturated compound is larger than the upper limit of the above range, the crosslinking proceeds excessively, the flexibility of the film is lost, and cracks may easily occur during bending.
不飽和基を分子内に有する化合物の不飽和基としては、アクリル基、メタクリル基、ビニル基及びビニルエーテル基が好ましく例示される。 As the unsaturated group of the compound having an unsaturated group in the molecule, an acrylic group, a methacrylic group, a vinyl group and vinyl ether group Ru are preferably exemplified.
樹脂組成物を構成する熱可塑性樹脂は、不飽和基を有する熱可塑性樹脂が好ましい。ここで、不飽和基を有する熱可塑性樹脂とは、不飽和基をその分子内に有する熱可塑性樹脂からなるもの、又は不飽和基をその分子内に有する熱可塑性樹脂と他の熱可塑性樹脂との混合物を意味する。熱可塑性樹脂が不飽和基を有しない場合は、絶縁フィルムの耐熱性が、不飽和基を有する場合に比べると低い。樹脂中の不飽和基を多くすると、より低温での架橋が可能となり、架橋効率がよくなる。 The thermoplastic resin constituting the resin composition is preferably a thermoplastic resin having an unsaturated group. Here, the thermoplastic resin having an unsaturated group is composed of a thermoplastic resin having an unsaturated group in its molecule, or a thermoplastic resin having an unsaturated group in its molecule and another thermoplastic resin. Means a mixture of When the thermoplastic resin does not have an unsaturated group, the heat resistance of the insulating film is lower than that when it has an unsaturated group. When the number of unsaturated groups in the resin is increased, crosslinking at a lower temperature is possible and the crosslinking efficiency is improved.
通常、請求項３に記載のポリエステル系樹脂は、不飽和ポリエステル樹脂と飽和ポリエステル樹脂との混合物として提供される。混合物における不飽和ポリエステル樹脂の割合としては、１０質量％以上であることが好ましい。請求項４は、この好ましい態様に該当する。
Usually, the polyester resin according to
架橋層は、前記架橋層を構成する樹脂組成物からなる層に、紫外線、電子線等の高エネルギー線を照射して得られる。高エネルギー線照射の際の、樹脂組成物からなる層の温度は、架橋層を構成する熱可塑性樹脂のガラス転移点温度以上であることが必要であり、この条件で架橋することにより、高い架橋効率が得られる。又、架橋の温度は、熱可塑性樹脂の融点未満の範囲で高温であることが好ましいが、基材層、架橋層、および接着剤層を構成する各種素材の物性その他を勘案して適宜設定すればよい。 The crosslinked layer is obtained by irradiating a layer made of the resin composition constituting the crosslinked layer with high energy rays such as ultraviolet rays and electron beams. The temperature of the layer composed of the resin composition at the time of high energy ray irradiation needs to be equal to or higher than the glass transition temperature of the thermoplastic resin constituting the crosslinked layer. Efficiency is obtained. The crosslinking temperature is preferably a high temperature within the range below the melting point of the thermoplastic resin, but may be appropriately set in consideration of the physical properties of various materials constituting the base material layer, the crosslinked layer, and the adhesive layer. That's fine.
接着剤層は、互いの接着剤層間に、金属等の導体を挟持して、相互に強固に融着するとともに、導体を接着剤層中に埋め込ませるために設けられる。それゆえ、導体との密接着性に優れていると共に、埋め込み後は、導体との間に空隙等を発生しないものが好ましい。更に、フラットケ−ブルが使用される全ての環境下において、柔軟性、折り曲げ性、耐熱性、難燃性、耐久性、耐ブロッキング性、加工適性、その他の諸特性に優れた性能を有するものが好ましい。 The adhesive layer is provided in order to sandwich a conductor such as metal between the adhesive layers and firmly fuse each other and to embed the conductor in the adhesive layer. Therefore, it is preferable that it is excellent in close adhesion with the conductor and does not generate a gap or the like between the conductor after embedding. Furthermore, in all environments where flat cables are used, those having excellent performance in flexibility, bendability, heat resistance, flame resistance, durability, blocking resistance, processability, and other characteristics. preferable.
本発明は、前記のフラットケーブル用絶縁フィルムに加えて、これらを用いて製造されたフラットケーブルを提供する。すなわち、前記フラットケーブル用絶縁フィルムを用いたことを特徴とするフラットケーブルである（請求項５）。 This invention provides the flat cable manufactured using these in addition to the said insulating film for flat cables. That is, a flat cable, characterized in that using an insulating film for the flat cable (claim 5).
本発明のフラットケーブル用絶縁フィルムは、絶縁性樹脂基材、架橋層、接着剤層の順で積層されてなり、難燃性、耐熱性、密着性に優れるものである。すなわち、前記架橋層として、不飽和基を有する化合物並びに熱可塑性樹脂を主成分とする樹脂組成物に所定の条件で高エネルギー線照射した被膜を用いることにより、優れた耐熱性、密着性が得られ、難燃性を付与するために前記接着剤層を構成する熱可塑性樹脂組成物に難燃剤を添加しても、充分な耐熱性、密着性が達成される。 The insulating film for a flat cable of the present invention is laminated in the order of an insulating resin substrate, a cross-linked layer, and an adhesive layer, and is excellent in flame retardancy, heat resistance, and adhesion. That is, as the cross-linked layer, excellent heat resistance and adhesiveness can be obtained by using a film obtained by irradiating a compound having an unsaturated group and a thermoplastic resin as a main component with high energy rays under predetermined conditions. Even if a flame retardant is added to the thermoplastic resin composition constituting the adhesive layer in order to impart flame retardancy, sufficient heat resistance and adhesion can be achieved.
このフラットケーブル用絶縁フィルムを用いて得られた本発明のフラットケーブルは、難燃性及び耐熱性に優れ、フラットケーブルを構成する絶縁フィルム間の剥離も生じにくいので、信頼性が高く、又容易に得られるものである。 The flat cable of the present invention obtained by using this insulating film for flat cable is excellent in flame retardancy and heat resistance, and is difficult to peel off between insulating films constituting the flat cable, so it is highly reliable and easy. Is obtained.
次に本発明を実施するための最良の形態を説明するが、本発明はこの形態に限定されるものではなく、本発明の趣旨を損なわない限り、他の形態への変更も可能である。 Next, the best mode for carrying out the present invention will be described. However, the present invention is not limited to this mode, and can be changed to other modes as long as the gist of the present invention is not impaired.
絶縁性樹脂基材を構成する材料の例としては、ポリエチレンテレフタレ−ト、ポリブチレンテレフタレ−ト、ポリエチレンナフタレ−ト等のポリエステル系樹脂、ナイロン１２、ナイロン６６、ナイロン６等のポリアミド系樹脂、ポリイミド、ポリアミドイミド、ポリエ−テルイミド等のポリイミド系樹脂、ポリフェニレンサルファイド樹脂等があげられる。 Examples of the material constituting the insulating resin substrate include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyamides such as nylon 12, nylon 66, and nylon 6. Examples thereof include resins, polyimide resins such as polyimide, polyamideimide, and polyetherimide, and polyphenylene sulfide resins.
絶縁性樹脂基材は、未延伸、あるいは一軸方向または二軸方向に延伸したフィルム等のいずれでもよく、その厚さは、その表面に架橋層、接着剤層を積層する工程の作業性、コスト等より、５〜１００μｍ程度が好ましく、１０〜５０μｍ程度が更に好ましい。また、絶縁性樹脂基材の表面には、必要に応じて、コロナ処理、ブラズマ処理、オゾン処理、その他等の前処理等を任意に施すことができる。 The insulating resin base material may be either unstretched or a film stretched uniaxially or biaxially, and the thickness thereof is the workability and cost of the process of laminating a cross-linked layer and an adhesive layer on the surface. From about these, about 5-100 micrometers is preferable and about 10-50 micrometers is still more preferable. In addition, the surface of the insulating resin base material can be optionally subjected to pretreatment such as corona treatment, plasma treatment, ozone treatment, and the like, if necessary.
また、架橋層を構成する前記ポリエステル系樹脂の混合物中の不飽和ポリエステル樹脂の割合としては、前記のように１０質量％以上であることが好ましいが、混合物中における不飽和度は、０．１〜１０質量％がより好ましい。前記ポリエステル系樹脂中には、さらに、必要に応じて、光重合開始剤等を添加してもよい。 Moreover, as a ratio of the unsaturated polyester resin in the mixture of the polyester resin constituting the cross-linked layer, it is preferably 10% by mass or more as described above, but the degree of unsaturation in the mixture is 0.1 10 mass % is more preferable. A photopolymerization initiator or the like may be further added to the polyester resin as necessary.
接着剤層を構成する材料としては、ポリエステル系樹脂、および難燃剤を含むフィラー成分よりなる樹脂組成物が使用できる。フィラ−成分としては、まず、難燃剤として、水酸化アルミニウム、水酸化マグネシウム、酸化アンチモン、赤燐、ホウ酸亜鉛、ジルコニウム系難燃剤、錫系難燃剤、リン酸系難燃剤、ハロゲン系難燃剤、または、その他等の難燃剤の１種ないし２種以上を使用することができる。その他のフィラ−成分としては、例えば、ポリアミド系ワックス類、シリカ微粒子、タルク、炭酸カルシウム、有機顔料、酸化チタン等の無機顔料、カ−ボン、ワックス類、その他等を使用することができる。 As a material constituting the adhesive layer, a resin composition comprising a polyester resin and a filler component containing a flame retardant can be used. As the filler component, first, as a flame retardant, aluminum hydroxide, magnesium hydroxide, antimony oxide, red phosphorus, zinc borate, zirconium flame retardant, tin flame retardant, phosphoric flame retardant, halogen flame retardant Alternatively, one or more flame retardants such as other can be used. As other filler components, for example, polyamide waxes, silica fine particles, talc, calcium carbonate, organic pigments, inorganic pigments such as titanium oxide, carbon, waxes, and the like can be used.
図１は、本発明のフラットケーブル用絶縁フィルムの構造模式図であるが、この図に示されるように、前記のようにして得られた接着剤層用樹脂組成物、ならびに架橋層用樹脂組成物は、フィルム成形機等を用いてフィルム状に成形された後、絶縁性樹脂基材１の片面に、架橋層２、接着剤層３として積層される。多軸の溶融押出機を用いて、絶縁性樹脂基材１上に、架橋層２、並びに接着剤層３を同時に押し出して、一体成形する方法が作業効率等より好ましい。架橋層の厚さは、１〜３０μｍ程度が好ましく、また、接着剤層の厚さは、１０〜１００μｍ程度が好ましい。
FIG. 1 is a structural schematic diagram of an insulating film for a flat cable according to the present invention. As shown in this figure, the resin composition for an adhesive layer and the resin composition for a crosslinked layer obtained as described above are shown in FIG. The product is formed into a film using a film molding machine or the like, and then laminated as a
難燃性フラットケーブル用フィルムは、得られた積層体において、絶縁性樹脂基材１側から高エネルギー線を照射して得られる。高エネルギー線が紫外線の場合、逆に、接着剤層３側から照射すると、接着剤層を構成するフィラーの存在により、高エネルギー線が架橋層２まで到達しにくい。
The film for flame-retardant flat cable is obtained by irradiating a high energy ray from the insulating
高エネルギー線は、紫外線、Ｘ線、電子線、α線、γ線、イオンビーム、レーザー光等の各種高エネルギー線より適宜選択して使用することが可能であるが、通常は、紫外線、あるいは電子線が使用される。その照射量は、必要とされる架橋度合に応じて、適宜設定すればよい。 The high energy rays can be appropriately selected from various high energy rays such as ultraviolet rays, X-rays, electron rays, α rays, γ rays, ion beams, and laser beams. An electron beam is used. What is necessary is just to set the irradiation amount suitably according to the required crosslinking degree.
図２は、本発明のフラットケーブルの構造模式図である。この図に示すように、得られた難燃性フラットケーブル用フィルム２枚を、各々の接着剤層３の面が対向するように配置し、その層間に、金属等の導体４を介在させた後、加熱ロ−ルあるいは加熱板等を用いて、加熱加圧し、接着剤層３を軟化、溶融させて接着剤層３と導体４とを密接着させると共に、導体４を接着剤層３中に埋め込み、更に、接着剤層３を相互に自己密接着させて導体４との間に空隙等の発生を防止しながら一体化することにより、本発明のフラットケ−ブルを得ることができる。
FIG. 2 is a structural schematic diagram of the flat cable of the present invention. As shown in this figure, the obtained two flame retardant flat cable films were arranged so that the surfaces of the respective
以下に、実施例（表１）並びに比較例（表２）を挙げて、本発明を具体的に、より詳しく説明する。 Hereinafter, the present invention will be described in more detail with reference to Examples (Table 1) and Comparative Examples (Table 2).
１．接着剤層用樹脂組成物の作製
融点１２０℃、ガラス転移温度６℃、溶融粘度６００ポイズの飽和ポリエステル系樹脂５０質量部に対して、臭素系難燃剤（商品名：ｓａｙｔｅｘ８０１０、ＡＬＢＥＭＡＲＬＥ社製）３０質量部、三酸化アンチモン１５質量部、および酸化チタン５質量部を加えて、溶融混合し、接着剤層用樹脂組成物を得た。
1. Preparation of resin composition for adhesive layer Brominated flame retardant (trade name: saytex 8010, manufactured by ALBEMALLE) 30 with respect to 50 parts by mass of saturated polyester resin having a melting point of 120 ° C., a glass transition temperature of 6 ° C., and a melt viscosity of 600 poises 30 Mass parts, 15 parts by mass of antimony trioxide, and 5 parts by mass of titanium oxide were added and melt-mixed to obtain a resin composition for an adhesive layer.
２．架橋層用樹脂組成物の作製
表１、表２に示す配合表に従って、各材料を溶融混合し、架橋層用樹脂組成物を得た。ただし、表における各数字は、配合量（質量部）を示している。
2. Preparation of Crosslinked Layer Resin Composition According to the formulation tables shown in Tables 1 and 2, the materials were melted and mixed to obtain a crosslinked layer resin composition. However, each number in the table indicates the blending amount (parts by mass ).
各表において、樹脂１は、融点１１５℃、ガラス転移温度８℃、溶融粘度４３０ポイズの飽和ポリエステル系樹脂（ＥＭＳ社製、Ｄ１６１９Ｅ）、樹脂２は、融点１２０℃、ガラス転移温度７℃、溶融粘度５５０ポイズの不飽和ポリエステル系樹脂、樹脂３は、融点９５℃の酸変性エチレン・アクリル酸エステル樹脂（商品名：ボンダインＴＸ８０３０、住友化学工業（株）社製）を示す。また、ＤＰＨＡは、ジペンタエリスリトールヘキサアクリレート、Ｍ−７１００は、ポリエステルアクリレート（商品名：アロニックスＭ−７１００、東亞合成（株）社製）、ＴＡＩＣは、トリアリルイソシアヌレートを示し、更に、Ｉｒｒｇａｃｕｒｅ３６９は、チバ・スペシャルティ・ケミカルズ社製の光重合開始剤である。
In each table,
３．積層フィルムの作製
２５μｍ厚の基材フィルム（素材は表１、表２に示す）の片面に、架橋層が１０μｍ厚、接着剤層が３０μｍ厚となるようにフィルム成形機で作製した架橋層および接着剤層を積層した。表において、ＰＥＴは、ポリエチレンテレフタレ−トを、またＰＥＮは、ポリエチレンナフタレ−トを示す。
3. Production of Laminated Film A cross-linked layer produced by a film molding machine such that a cross-linked layer is 10 μm thick and an adhesive layer is 30 μm thick on one side of a 25 μm-thick base film (materials are shown in Tables 1 and 2) An adhesive layer was laminated. In the table, PET indicates polyethylene terephthalate, and PEN indicates polyethylene naphthalate.
４．高エネルギー線の照射（フラットケーブル用絶縁フィルムの作製）
作製した積層フィルムの基材フィルム面側から、表１、表２に示すように、紫外線（ＵＶ）あるいは電子線（ＥＢ）を照射した。このとき、紫外線は、超高圧水銀灯により、積算光量１０００ｍＪ／ｃｍ２となるよう照射し、電子線は、加速電圧２００ｋＶで、線量が６０ｋＧｙとなるよう照射した。また、照射時の温度を、表１、表２に併せて示す。
4). Irradiation with high energy rays (production of insulating film for flat cable)
As shown in Tables 1 and 2, ultraviolet rays (UV) or electron beams (EB) were irradiated from the base film side of the produced laminated film. At this time, ultraviolet rays were irradiated with an ultra-high pressure mercury lamp so that the accumulated light amount was 1000 mJ / cm 2, and the electron beam was irradiated with an acceleration voltage of 200 kV and a dose of 60 kGy. Moreover, the temperature at the time of irradiation is combined with Table 1 and Table 2, and is shown.
５．フラットケーブル作製
得られたフラットケーブル用絶縁フィルム２枚を接着剤層が向かい合うように配置し、互いの接着剤層間に０．０３５ｍｍ厚、０．８ｍｍ幅のスズメッキ軟銅箔を平行に１０本並べて挟持し、１３０℃の熱ロールを用いてラミネートし、フラットケーブルを作製した。
5. Flat cable production Two insulating films for flat cable obtained were arranged so that the adhesive layers face each other, and ten tin-plated annealed copper foils of 0.035 mm thickness and 0.8 mm width were arranged in parallel between the adhesive layers. And it laminated using the 130 degreeC hot roll, and produced the flat cable.
６．耐熱性、密着性の評価
得られたフラットケーブルを２つ折りにして、１４０℃恒温槽に２４時間放置し、折り曲げ部分の絶縁フィルム同士の剥がれ等異常の有無につき、目視にて評価した。ここで、異常がない場合には○で示し、そうでない場合には×で示した。結果を表１、表２に示す。
6). Evaluation of heat resistance and adhesion The obtained flat cable was folded in two and left in a constant temperature bath at 140 ° C. for 24 hours, and the presence or absence of abnormality such as peeling of the insulating films at the bent portion was visually evaluated. Here, when there was no abnormality, it was indicated by ◯, and when it was not, it was indicated by ×. The results are shown in Tables 1 and 2.
表１及び表２の結果より明らかなように、本発明のフラットケーブル用絶縁フィルムより得られたフラットケーブル（すなわち本発明のフラットケーブル）は、優れた耐熱性、密着性を示すのに対し、本発明の範囲外である比較例、すなわち、不飽和化合物を用いない比較例１、不飽和ポリエステル樹脂を用いない比較例２、及び高エネルギー線の照射時の温度が、熱可塑性樹脂のガラス転移点温度以下である比較例３では、低い耐熱性、密着性しか得られない。 As is clear from the results of Tables 1 and 2, the flat cable obtained from the insulating film for a flat cable of the present invention (that is, the flat cable of the present invention) exhibits excellent heat resistance and adhesion, Comparative example that is outside the scope of the present invention, that is, Comparative Example 1 that does not use an unsaturated compound, Comparative Example 2 that does not use an unsaturated polyester resin, and the temperature at the time of irradiation with high energy rays is a glass transition of a thermoplastic resin. In Comparative Example 3, which is below the point temperature, only low heat resistance and adhesion can be obtained.
１．絶縁性樹脂基材
２．架橋層
３．接着剤層
４．導体
1. 1. Insulating
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| JP2011187388A (en) * | 2010-03-10 | 2011-09-22 | Fujikura Ltd | Flexible flat cable |
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| JPH0326008A (en) * | 1989-06-23 | 1991-02-04 | Nec Corp | Automatic gain control circuit |
| JPH0326008U (en) * | 1989-07-21 | 1991-03-18 | ||
| JPH05101716A (en) * | 1991-05-16 | 1993-04-23 | Furukawa Electric Co Ltd:The | Tape cable |
| JPH05303918A (en) * | 1992-04-28 | 1993-11-16 | Furukawa Electric Co Ltd:The | Manufacture of taped electric wire |
| JP3401973B2 (en) * | 1995-02-06 | 2003-04-28 | 住友電気工業株式会社 | Shielded flat cable |
| JP2001222919A (en) * | 2000-02-09 | 2001-08-17 | Dainippon Printing Co Ltd | Heat sealed tape and flat cable using the same |
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