JP4813384B2 - Pattern forming substrate and pattern forming method - Google Patents

Description

  The present invention relates to a substrate for pattern formation, and more particularly to a substrate suitable for forming a pattern using an ink jet.

  In recent years, ink-jet pattern formation technology has attracted attention as a technology that does not require mask formation and can form a desired pattern on demand. In addition, in the pattern forming technique by ink jet, the cost can be reduced because the ink material can be used efficiently and efficiently, and further, the apparatus can be downsized because the vacuum chamber is not required.

  However, for example, when ink is applied to the substrate by inkjet, the following problems occur. That is, when the substrate is lyophilic with respect to the ink, the ink applied to the substrate spreads out and it is difficult to control the spread of the ink. A thick pattern cannot be formed. Furthermore, since it is difficult to control the wetting and spreading of the ink, the outline of the pattern formed on the substrate is blurred, and a clear pattern cannot be formed.

  On the other hand, when ink is applied onto a substrate having liquid repellency with respect to the ink, a narrow pattern, a thick film pattern, or the like can be formed in order to prevent the applied ink from spreading. However, when forming a line-shaped pattern, it is necessary to apply ink so that the applied inks overlap each other, resulting in an increase in tact time. Furthermore, since the ink discharge position is shifted, the line-shaped pattern is interrupted. For example, when a wiring is formed on the substrate, there is a possibility that a defect such as a disconnection may occur. Therefore, a highly accurate pattern forming apparatus is required. .

  Therefore, the following techniques are known as techniques for solving the above-described problems. Patent Document 1 discloses a method of previously forming a pattern of a lyophilic region and a liquid repellent region on a substrate so as to correspond to a pattern to be formed. Further, Patent Document 2 discloses a method of previously forming an uneven pattern corresponding to a pattern to be formed on a substrate. In this way, by forming the lyophobic pattern and the concavo-convex pattern corresponding to the desired pattern in advance on the substrate, the tact time can be shortened and the desired pattern can be accurately formed.

Further, Patent Document 3 discloses a method of forming a pattern by forming a hydrophilic-water-repellent pattern on the surface of a sheet-like member having water repellency, and applying and solidifying a coating liquid on the hydrophilic part. It is disclosed. Thereby, a desired pattern can be formed with high accuracy. Patent Document 4 discloses a method of forming hydrophilic and water-repellent regions on a substrate by arranging concave and convex structures repelling liquid on the substrate with a smoother portion smoother than the concave and convex structures interposed therebetween. ing. Thereby, the hydrophilic-water repellent effect on the substrate is enhanced, and a desired pattern can be formed with high accuracy. Further, in Patent Document 5, a pattern is formed by adhering droplets across a lyophilic region and a liquid repellent region on a substrate formed so that the lyophilic region and the liquid repellent region are adjacent to each other. A method of forming is disclosed. As a result, for example, even when a droplet having a diameter larger than the pattern width is attached, the droplet collects in the lyophilic region, so that the number of droplets ejected onto the substrate can be reduced and a desired pattern can be easily formed. it can.
JP 2001-305523 A (released on October 31, 2001) JP 2000-353594 A (published on December 19, 2000) JP 2003-190874 A (published July 8, 2003) JP 2003-190876 A (published July 8, 2003) JP 2004-89878 A (published on March 25, 2004)

  However, in the methods described in Patent Documents 1 to 4, it is necessary to previously form a lyophilic-liquid repellent region pattern corresponding to the pattern to be formed or an uneven pattern corresponding to the pattern to be formed on the substrate. That is, when the pattern to be formed is changed, it is necessary to change the lyophilic-liquid-repellent region pattern or the concave / convex pattern on the substrate, resulting in poor versatility and an increase in cost.

  Further, in the method described in Patent Document 5, it is difficult to reliably store a droplet within a region to which a droplet is to be attached on a substrate, and the droplet leaks and spreads outside the target region. Therefore, a desired pattern cannot be formed with high accuracy.

  The object of the present invention has been made in view of the above-mentioned problems, and the object thereof is not to form a concavo-convex pattern or the like corresponding to the pattern to be formed on the substrate in advance, and a desired pattern can be easily and The object is to realize a substrate that can be formed with high accuracy.

  In order to solve the above-described problem, the pattern forming substrate according to the present invention has a first region having a contact angle of a first contact angle when a droplet adheres to the substrate, and the first contact. A second region having a second contact angle larger than the corner, and the second region is regularly scattered on the first region, and the liquid adhered to the first region. It is characterized by being arranged at an interval capable of blocking the spreading of the droplets.

  The pattern forming method according to the present invention is characterized in that a predetermined pattern is formed by discharging droplets onto the pattern forming substrate.

  According to said structure, since a 2nd contact angle is larger than a 1st contact angle, the 1st area | region is highly lyophilic with respect to a droplet compared with a 2nd area | region. For this reason, the droplet adhering on the base material spreads in the first region showing higher lyophilicity. Further, the second regions are regularly scattered on the first region, and are arranged at intervals that can block the spread of the droplets attached to the first region. For this reason, the droplet which adheres on a base material and spreads on a 1st area | region can be dammed by a 2nd area | region. As a result, the liquid adhering to the substrate can be contained within a certain range.

  As described above, when the droplets are deposited on the substrate, the droplets can be contained within a desired range, so that a desired pattern can be formed on the substrate. That is, if the pattern forming substrate according to the present invention is used, a desired pattern can be easily formed on the substrate without forming an uneven pattern corresponding to the desired pattern in advance on the substrate. It is.

  In the pattern formation substrate according to the present invention, the second region is formed on the first region so that a regular polygon is formed by a straight line connecting the center points of the adjacent second regions. It is preferable that they are arranged.

  According to said structure, the 2nd area | region is arranged so that a regular polygon may be formed on the 1st area | region by the straight line which connects the center point of the 2nd area | region which adjoins. For this reason, when a droplet is ejected onto the substrate, for example, the liquid is first deposited on the center point of the target area surrounded by a straight line connecting the center points of the second area. When the droplets are ejected, the spread of the droplets on the substrate can be more surely accommodated in the target region.

  In this way, it is possible to easily form a desired pattern on the substrate without previously forming a concavo-convex pattern corresponding to the desired pattern on the substrate, and to form droplets on the substrate. When adhered, the droplets can be contained within a desired range, so that a desired pattern can be accurately formed on the substrate.

  In the pattern forming substrate according to the present invention, the first region is lyophilic with respect to the droplet, and the second region is lyophobic with respect to the droplet. It is preferable.

  According to the above configuration, since the first region is a lyophilic region showing lyophilicity with respect to the droplet and the second region is a lyophobic region showing lyophobic property with respect to the droplet, A droplet discharged on the center point of the target area formed by a straight line connecting the center points of the liquid repellent area spreads in the lyophilic area of the target area and is repelled by the liquid repellent area on the outer periphery of the target area. In other words, the liquid droplets ejected into the target area fall within the target area surrounded by the liquid repellent area. Note that, as the center of the droplet that adheres to the target region approaches the center of the target region, the certainty that the droplet spreading in the target region fits in the target region is improved.

  As described above, when the droplets are deposited on the substrate, the droplets can be surely contained within a desired range, so that a desired pattern can be accurately formed on the substrate. . That is, if the pattern forming substrate according to the present invention is used, a desired pattern can be easily formed on the substrate without forming an uneven pattern corresponding to the desired pattern in advance on the substrate. It is.

  Furthermore, in the substrate for pattern formation according to the present invention, it is preferable that the second region has a symmetrical shape.

  According to said structure, the 2nd area | region on a base material has a symmetrical shape up and down, right and left in the pattern formation surface of a base material. Examples of such a shape include a circular shape, a square shape, and a cross shape. As a result, the spread of the droplets adhering to the base material can be more reliably stored in the desired target region. In addition, when an area surrounded by a straight line connecting the center points of the second areas is referred to as an object area, the object area having the same shape is defined by the fact that the second area is symmetrical. Array. As described above, a desired pattern can be formed on the substrate with higher accuracy.

  In the pattern formation substrate according to the present invention, it is preferable that the second region protrudes from the pattern formation surface of the substrate than the first region.

  As a result, it is possible to more reliably store the droplets adhering to the base material within the target region. For example, a desired pattern such as a narrow line pattern or a thick film pattern can be more accurately applied to the base material. Can be formed.

  In the pattern forming substrate according to the present invention, the distance between two adjacent second regions is L, and the length of a straight line connecting the center points of the two second regions is W. It is preferable that the second region is arranged on the first region so as to satisfy L ≧ W / 2.

  Since a droplet easily forms a nearly spherical shape due to surface tension, when the distance between two adjacent second regions is extremely short, the shape of the droplet attached to the first region becomes an irregular shape. End up. As a result, the droplets attached to the adjacent target regions are not connected to each other, and for example, a linear pattern connected to one cannot be formed with high accuracy.

  According to the pattern forming substrate of the present invention, the distance between two adjacent second regions and the length of a straight line connecting the center points of the two second regions satisfy the above relationship. By arranging the second regions, a desired pattern can be formed with high accuracy.

  The pattern forming method according to the present invention further includes a discharge step of discharging a droplet so that the droplet first attaches to the center point of the target region surrounded by a straight line connecting the center points of the second region. It is preferable to contain.

  Thereby, since the droplet discharged on the base material can be stored in the target region, a desired pattern can be formed on the base material with high accuracy. That is, a desired pattern can be easily and accurately formed on a substrate without forming an uneven pattern corresponding to the desired pattern in advance on the substrate.

  In the pattern forming method according to the present invention, when a droplet having an amount twice as large as a droplet to be ejected is ejected to a target region surrounded by a straight line connecting the center points of the second region, It is preferable to include a discharge step of discharging the droplets so that the droplets first adhere on the center point of the region formed by the two target regions.

  According to the above configuration, when ejecting a droplet having an amount twice as large as the liquid ejected to the target region, ink first adheres to the center point of the region formed by the two target regions adjacent to each other. Ink is discharged as follows. As a result, the number of ejections of ink or the number of ejected droplets for forming a desired pattern can be reduced, so that the tact time can be reduced and the life of the inkjet head can be extended.

In order to solve the above-described problem, the pattern forming method according to the present invention has a contact angle when a droplet is deposited on a substrate as a first region having a first contact angle and the first contact angle. A second region having a larger second contact angle, and the second region is scattered on the first region, and is formed by a straight line connecting the center points of the adjacent second regions. A pattern forming method for forming a predetermined pattern on a base material arranged so that a regular polygon is formed, and when a droplet is discharged onto the base material, the center point of the second region In order to satisfy the following formula (1), the droplet discharge amount V when the droplet is discharged such that the droplet first adheres to the center point of the target region surrounded by the straight line connecting It includes a step of depositing droplets on a substrate.
V <{S (2 + X) / 3 (1 + X)} × √ {S (1-X) / π (1 + X)} (1)
Here, X = (COSθ ₂ −COSθ ₁ ) A + COSθ ₁
θ ₁ : first contact angle θ ₂ : second contact angle S: area of the target region surrounded by a straight line connecting the center points of the second region A: area ratio of the second region in the area S It is.

  According to the above configuration, the ejection amount of the liquid droplets ejected to the base material is set to a larger contact angle with respect to the contact angle of the region formed on the base material and the area of the target region to which the liquid droplets adhere. It calculates from the area ratio of the area | region which has. By discharging the droplet with the calculated discharge amount to the center point of the target region of the base material, the droplet is surely repelled by the second region formed around the target region. The droplets adhering to the base material can be more reliably stored in the target area.

  As described above, the pattern forming substrate according to the present invention includes the first region having the first contact angle and the second region having the second contact angle larger than the first contact angle. The second region is scattered on the first region, and is arranged at intervals that can block the spread of the droplets attached to the first region. It is possible to easily form a desired pattern without forming an uneven pattern corresponding to the desired pattern in advance.

(First embodiment)
The following describes the first embodiment of the present invention with reference to FIGS.

  The configuration of the substrate (pattern forming substrate) 1 according to the present invention will be described below with reference to FIG. FIG. 1 is a plan view showing a substrate 1 according to the present embodiment. As shown in FIG. 1, the substrate 1 includes a lyophilic region (first region) 2 and a liquid repellent region (second region) 3. Here, the liquid repellent areas 3 are regularly scattered on the lyophilic areas 2. Since the contact angle (first contact angle) with respect to the droplet in the lyophilic region 2 is smaller than the contact angle (second contact angle) with respect to the droplet in the lyophobic region 3, the droplet attached on the substrate 1 is The liquid is repelled by the liquid repellent area 3 that exhibits liquid repellency with respect to the liquid droplets and gathers on the lyophilic area 2 that exhibits liquid affinity for the liquid droplets. Further, the liquid repellent areas 3 are arranged at intervals W that can block the spread of droplets attached to the lyophilic areas 2.

  In the present embodiment, the liquid repellent areas 3 on the substrate 1 are circular and are arranged so that a square is formed by a straight line connecting the centers of the adjacent liquid repellent areas 3. For example, the diameter of the circular liquid repellent region 3 is 30 μm, and the distance W between the centers of the adjacent liquid repellent regions 3 is 100 μm. That is, a plurality of liquid repellent regions 3 are regularly arranged on the substrate 1 at intervals of 100 μm. In addition, water-based ink is used as droplets ejected on the substrate to form a pattern, and the contact angle between the lyophilic region 2 and the water-based ink is 10 degrees by measuring the contact angle with a contact angle meter in advance. The contact angle between the liquid region 3 and the water-based ink is set to 85 degrees.

  Next, the manufacturing method of the board | substrate 1 which concerns on this invention is demonstrated below with reference to Fig.2 (a)-(d). 2 (a) to 2 (d) are diagrams showing each step for manufacturing a substrate according to the present invention.

  First, as shown in FIG. 2A, a wettability changing layer 5 made of a silane coupling agent or the like is formed on a glass substrate 4 by using a spin coating method or the like and dried. In this embodiment, ZONYL FSN (trade name, manufactured by DuPont), which is a fluorine-based nonionic surfactant, is mixed with isopropyl alcohol as the wettability changing layer 5.

  Next, as shown in FIG. 2B, UV exposure is performed through a photomask 6 in which a mask pattern 7 made of chromium or the like and a photocatalyst layer 8 made of titanium oxide or the like are previously formed. In the present embodiment, the photocatalyst layer 8 is formed by applying a mixture of the titanium dioxide fine particle dispersion and ethanol by a spin coat method and then heat-treating at 150 ° C. As for the exposure conditions, exposure is performed for 2 minutes at an illuminance of 70 mW / cm 2 by a mercury lamp (wavelength 365 nm).

  As a result, as shown in FIGS. 2C and 2D, the UV-exposed portion has improved wettability and becomes a lyophilic region 2 having lyophilicity, and the portion not exposed to UV is lyophobic. And the liquid repellent region 3 is maintained. A pattern is formed by discharging droplets onto the substrate 1 thus formed.

  Next, a pattern forming apparatus 10 for realizing the pattern forming method of the present invention will be described below with reference to FIG. FIG. 3 is a schematic perspective view of a pattern forming apparatus applied to the pattern forming method of the present invention.

  As shown in FIG. 3, the pattern forming apparatus 10 according to this exemplary embodiment includes a stage 12 on which a substrate 11 according to the present invention is placed, and ink (droplets) is placed on the stage 12 with respect to the substrate 11. ), A Y-direction drive unit 14 that moves the inkjet head 13 in the Y direction, and an X-direction drive unit 15 that moves it in the X direction.

  Further, the pattern forming apparatus 10 includes a droplet supply system 16 that supplies droplets to the inkjet head 13, a liquid pipe 18, ejection control of the inkjet head 13, and drive control of the Y-direction drive unit 14 and X-direction drive unit 15. And a device control unit 17 for performing various controls such as the above.

  A signal cable 18 is provided between the inkjet head 13 and the droplet supply system 16, and droplet supply control to the inkjet head 13 is performed by the droplet supply system 16.

  Further, a signal cable (not shown) is provided between the inkjet head 13, the Y-direction drive unit 14 and the X-direction drive unit 15, and the device control unit 17. The droplet discharge control and the Y direction drive unit 14 and the X direction drive unit 15 are controlled.

  That is, discharge information is input from the apparatus control unit 17 to the driver (not shown) of the inkjet head 13 in conjunction with the application position information on the substrate 11 in conjunction with the Y direction drive unit 14 and the X direction drive unit 15. A target amount of droplets is supplied to the position. As a result, it is possible to drop droplets on the entire area of the substrate 11.

  As the inkjet head 13, a piezoelectric element that deforms when a voltage is applied is used, and a piezo-type inkjet head that pushes liquid (droplet) from the nozzle by instantaneously increasing the fluid pressure in the ink chamber or attached to the head. A thermal ink jet head that generates bubbles in the liquid by the heater and pushes out the liquid is used. In any type of inkjet head, the droplet diameter to be ejected can be adjusted in accordance with the voltage applied to the piezoelectric element or the heater.

  In the present embodiment, in the pattern forming apparatus 10 described above, a piezo drive type ink jet head having a plurality of nozzles with a diameter of 40 μm is used as the ink jet head 13 to change the discharge voltage diameter by changing the drive voltage waveform. It changes from about 20 pl to 200 pl.

  The ink ejection position when ejecting ink onto the substrate 1 using the pattern forming apparatus 10 described above will be described below with reference to FIGS. FIG. 4 is an explanatory diagram for explaining the ejection position when ejecting ink onto the substrate of the present embodiment. As shown in FIG. 4, the circular liquid-repellent region 3 on the substrate 1 is disposed so that the distance between the centers of the adjacent liquid-repellent regions 3 is 100 μm. A square is formed by a straight line connecting the centers of the three. That is, the liquid repellent area on the substrate 1 is formed such that a plurality of squares formed by straight lines connecting the centers of the four adjacent liquid repellent areas 3 are arranged. In this way, a region formed by a straight line connecting the centers of the liquid repellent regions 3 present at the closest position is defined as a minimum unit (target region) 9 in the present embodiment and the embodiments described later. The minimum unit 9 is a minimum range of a pattern formed by droplets ejected from the inkjet head 13 of the pattern forming apparatus 10.

  In the present embodiment, when ink is ejected onto the substrate 1, the ink is first attached to the center point of the minimum unit 9 to be drawn, that is, the position of the center point A shown in FIG. Discharge. The amount of ink discharged at this time is set to about 50 pl, for example. FIG. 5 shows a state after the landing of the ink ejected toward the center point A in this way. As shown in FIG. 5, the ink droplet 20 that has landed on the center point A spreads in the lyophilic region 2 that exhibits lyophilicity with respect to the ink, and has four repellent positions located at the four vertices of the minimum unit 9, respectively. It is repelled in the liquid region 3. That is, since the spread of the ink is suppressed by the four liquid repellent areas 3 that exhibit liquid repellency with respect to the ink, the ink droplets 20 adhering to the substrate 1 are generally within the minimum unit 9 as shown in FIG. Fits in.

  Further, by discharging ink toward the center point of the minimum unit 9 and repeating the discharge of ink to the adjacent minimum unit 9 in the same manner, the ink that has landed on the adjacent minimum unit 9 can be connected. Therefore, the line pattern 21 as shown in FIG. 6 can be drawn.

(Second Embodiment)
The second embodiment of the present invention will be described below with reference to FIGS.

  Also in the present embodiment, ink is ejected to the substrate 1 using the pattern forming apparatus 10 as in the first embodiment. The ink ejection position in the present embodiment will be described below with reference to FIG. FIG. 7 is an explanatory diagram illustrating the ejection position when ejecting ink onto the substrate of the present embodiment. As shown in FIG. 7, the circular liquid repellent areas 3 on the substrate 1 are arranged so that a square is formed by a straight line connecting the centers of the four adjacent liquid repellent areas 3. In the present embodiment, the midpoint B of one side constituting the minimum unit 9 formed by the straight line connecting the centers of the adjacent liquid repellent regions 3, that is, the straight line connecting the centers of two adjacent liquid repellent regions 3 is formed. Ink is ejected so that the ink first adheres to the midpoint B. At this time, the ink discharge amount is, for example, 100 pl, which is twice the amount of ink discharged from the center point A shown in FIG. 4 in the first embodiment.

  FIG. 8 shows a state after the landing of the ink ejected toward the middle point B shown in FIG. As shown in FIG. 8, the ink droplet 22 that has landed on the middle point B spreads over the lyophilic region 2. The ink droplet 22 that spreads in the Y direction on the lyophilic region 2 is repelled by the liquid repellent region 3 of the minimum unit 9 and falls between two liquid repellent regions 3 adjacent in the Y direction. That is, the ink droplet 22 that has landed on the middle point B spreads in the Y direction by a length substantially the same as the length of one side constituting one minimum unit 9. On the other hand, the ink droplet 22 spreading in the X direction on the lyophilic region 2 is repelled by the two liquid repellent regions 3 of the smallest unit 9 sharing the side including the midpoint B and adjacent in the X direction. In other words, the ink droplet 22 that has landed on the midpoint B falls between the liquid repellent regions 3 that are located farthest in the X direction in the two smallest units 9 adjacent in the X direction.

  In this way, by ejecting ink to the middle point B, the length of one side of the minimum unit 9 is doubled in the X direction, and the length of one side of the minimum unit 9 is expanded in the Y direction. An ink pattern can be formed. In other words, by ejecting ink to the center point of the rectangular target area formed by the two smallest units 9 sharing one side, the ink can be contained in the rectangular target area. Thereby, it is possible to form an ink pattern more accurately. When ink is ejected to the middle point B ′ shown in FIG. 7, the ink that has landed on the middle point B ′ is the length of one side of the minimum unit 9 in the X direction and the minimum unit in the Y direction. Thus, an ink pattern extending by twice the length of one side of 9 can be formed.

  Further, by ejecting ink toward the center point of the target area formed by the two adjacent minimum units 9, and repeating the ink discharge similarly to the target area adjacent to the target area, the adjacent target area The ink that landed on can be connected. Therefore, the line pattern 23 as shown in FIG. 9 can be drawn. That is, by ejecting ink to the middle point B shown in FIG. 7, it is possible to reduce the number of ink ejections when forming the line pattern in the X direction. The number of ink ejections when forming a line pattern in the Y direction can be reduced.

  In this way, by ejecting ink so that the ink first adheres to the center point of the region where the pattern is to be formed, the number of ink ejections or the number of ejected droplets for forming the line pattern can be reduced. Therefore, the tact time can be reduced and the life of the inkjet head can be extended.

(Third embodiment)
The third embodiment of the present invention will be described below with reference to FIGS.

  Also in the present embodiment, ink is ejected to the substrate 1 using the pattern forming apparatus 10 as in the first embodiment. The arrangement state of the liquid repellent region 3 in the substrate 1 according to this embodiment will be described below with reference to FIG. FIG. 10 is a plan view showing an arrangement state of the liquid repellent region 3 formed on the substrate 1 according to the present embodiment.

  In the present embodiment, the liquid repellent areas 3 on the substrate 1 are circular and arranged so that a regular hexagon is formed by a straight line connecting the centers of the adjacent liquid repellent areas 3. For example, the diameter of the circular liquid repellent region 3 is 30 μm, and the distance W between the centers of the adjacent liquid repellent regions 3 among the liquid repellent regions 3 forming the regular hexagon as described above is 100 μm. . In the present embodiment, the target region to be ejected with ink is a regular hexagonal minimum unit 24 formed by the adjacent liquid repellent region 3, and is first at the position of the center point C of the minimum unit 24 shown in FIG. 10. Ink is discharged so that the ink adheres to the surface. The amount of ink discharged at this time is set to 100 pl, for example.

  FIG. 11 shows a state after the landing of the ink ejected toward the center point C in this way. As shown in FIG. 11, the ink 25 that has landed on the center point C spreads on the lyophilic region and is repelled in the six lyophobic regions 3 located at the six vertices of the minimum unit 24. Accordingly, since the spread of the ink 25 is suppressed by the liquid repellent region 3, the ink adhering to the substrate 1 is generally contained within the minimum unit 24 as shown in FIG. Thereby, an ink pattern can be accurately formed on the substrate.

  In addition, by ejecting ink toward the center point of the minimum unit 24, sharing one side with the minimum unit 24, and repeating the ink ejection to other adjacent minimum units 24 in the same manner, The ink that has landed on the unit 24 can be connected. In this way, line patterns can be drawn.

  Further, a pattern is formed on the substrate on which the liquid repellent regions 3 are arranged so that other regular polygons such as a regular triangle, a regular pentagon, and a regular octagon are formed by a straight line connecting the centers of the adjacent liquid repellent regions 3. Even when ink is ejected using the forming apparatus 10 in the same manner, ink droplets can be contained in the target region, so that an ink pattern can be accurately formed on the substrate.

(Fourth embodiment)
The following describes the fourth embodiment of the present invention with reference to FIGS. FIGS. 12A to 12C are explanatory views for explaining an arrangement example of the liquid repellent regions on the substrate 1 in the present embodiment. Since the ink droplet easily forms a spherical shape due to the surface tension, as shown in FIG. 12A, when the interval between the adjacent liquid repellent areas 3 is extremely narrow, the adjacent liquid repellent areas 3 When the ink is ejected so that the ink first adheres to the center point of the minimum units 34 and 35 formed by the straight line connecting the centers, the droplets 32 and 33 have an irregular shape. As a result, as shown in FIG. 12A, a space is generated in the region E, and the adjacent droplets 32 and 33 are not connected to each other. Therefore, for example, a pattern having a shape connected to one like a linear pattern. Can not form.

  Therefore, in the present embodiment, as shown in FIGS. 12B and 12C, the liquid repellent regions 3 are arranged so that the interval between the adjacent liquid repellent regions 3 satisfies a certain condition. Specifically, as shown in FIG. 12B, when the minimum unit 36 formed by a straight line connecting the centers of the adjacent liquid repellent regions 3 is a square, the length of one side constituting the minimum unit 36 is set as follows. When W is L and the distance between adjacent liquid repellent areas 3 is L, the liquid repellent areas 3 are arranged so as to satisfy L ≧ W / 2. Thereby, the droplet adhering to the minimum unit 36 spreads in the minimum unit 36 and is connected to the droplet adhering to the minimum unit adjacent thereto. That is, a linear pattern can be formed with high accuracy by attaching droplets to adjacent minimum units. In particular, when the shape of the minimum unit is square and the shape of the liquid repellent region is circular, W ≧ 4R is satisfied, where W is one side of the minimum unit and R is the radius of the circular liquid repellent region. Even if the liquid repellent regions are arranged in the same manner, the same effect can be obtained.

In addition, as shown in FIG. 12C, when the minimum unit 37 formed by the straight line connecting the centers of the adjacent liquid repellent areas 3 is not a square, the straight line connecting the center points of the two adjacent liquid repellent areas 3 The liquid repellent area 3 is arranged so that L _x ≧ W _x / 2 is satisfied, where W _x is W _x and the distance between the two liquid repellent areas 3 is L _x . That is, the short side length W _{1 of} the minimum unit 37 and the distance L ₁ between the liquid-repellent regions 3 adjacent to each other in the extending direction of the short side satisfy L ₁ ≧ W _1/2 , and the minimum unit 37 the length W ₂ of the long side of, and the distance L ₂ between the liquid repellent area 3 between adjacent its longitudinal direction is to arrange the liquid repellent region 3 so as to satisfy L ₂ ≧ W _2/2. Thereby, a desired pattern can be formed with high accuracy as described above.

(Fifth embodiment)
The following describes the fifth embodiment of the present invention with reference to FIGS.

  Also in the present embodiment, ink is ejected to the substrate 1 using the pattern forming apparatus 10 as in the first embodiment. The shape of the liquid repellent area on the substrate 1 in this embodiment will be described below with reference to FIGS. 13-15 is explanatory drawing explaining other embodiment of the shape of a liquid repellent area | region. As shown in FIG. 13, the liquid-repellent regions 26 on the substrate 1 have a square shape, and are arranged so that a square is formed by a straight line connecting the centers of four adjacent liquid-repellent regions 26. At this time, the liquid-repellent region 26 is sized so as to be inscribed in a circle having a diameter of 30 μm, for example, and the distance between the centers of the adjacent liquid-repellent regions 26 is, for example, 100 μm. Further, the amount of ink discharged from the pattern forming apparatus 10 is set to 50 pl, for example.

  Even if the shape of the liquid repellent area 26 is a square shape, the ink first adheres to the center point of the square minimum unit 27 formed by the straight line connecting the centers of the four adjacent liquid repellent areas 26. By ejecting ink, ink droplets adhering to the substrate 1 can be accommodated in the smallest unit 27 in general. Further, even if the shape of the liquid repellent region is a cross shape that is symmetrical in the vertical and horizontal directions, by arranging the liquid repellent region on the substrate 1 in the same manner as described above, the ink droplets ejected onto the substrate 1 are within the minimum unit. It is possible to fit.

  On the other hand, when the shape of the liquid repellent region is not symmetrical in the vertical and horizontal directions, the ink droplets ejected onto the substrate 1 cannot be contained within the minimum unit. More specifically, as shown in FIG. 14A, for example, when the liquid repellent region 3 is circular, the circular shape is symmetrical in the vertical and horizontal directions, and thus is formed by four adjacent liquid repellent regions 3. When the ink droplet adheres to the center of the smallest unit, the wet ink droplet is evenly repelled by the four liquid repellent areas 3 positioned at the apex of the smallest unit, and exerts a force in the direction of staying within the smallest unit. receive. That is, the liquid repellent area 3 at the position of the area F and the liquid repellent area 3 at the position of the area F ′ apply a force in the center direction (arrow direction) of the minimum unit to the ink droplet. In this way, ink droplets can be contained within the minimum unit.

  However, as shown in FIG. 14B, for example, when the shape of the liquid repellent region 38 is a triangular shape, the triangular shape is asymmetric in the vertical direction, and therefore the minimum unit formed by four adjacent liquid repellent regions 38 The direction of force received from the liquid repellent area 38 at the position of the area G and the direction of force received from the liquid repellent area 38 at the position of the area G ′ Is different. In particular, in the case shown in FIG. 14B, the liquid repellent area 38 at the position of the area G acts to push the ink droplets outside the minimum unit. Thus, when the shape of the liquid repellent area is not symmetrical vertically and horizontally, the shape of the contact surface (boundary surface) between the ink droplet and the liquid repellent area differs depending on the position of the liquid repellent area. The direction of the force received from the liquid repellent area is different, and the ink droplet cannot be effectively contained within the minimum unit.

  That is, as shown in FIG. 15, when the liquid repellent region 28 on the substrate 1 is semicircular, the center point of the square minimum unit 29 formed by a straight line connecting the centers of the four adjacent liquid repellent regions 28 The ink droplets 30 ejected toward the end may not fit within the minimum unit 29 but may overflow from the minimum unit 29 and spread into the adjacent minimum unit 9.

  For this reason, it is preferable that the shape of the liquid repellent region is symmetrical with respect to the X direction and the Y direction on the XY plane of the substrate. As a result, the contact surface between the ink droplets ejected onto the substrate and the liquid repellent area located at the top of the target area is uniform in all directions, so that the ink liquid droplet is equally affected by the liquid repellent effect. It is possible to fit the ink droplets more effectively within the smallest unit.

  Alternatively, a three-dimensional liquid repellent region may be formed on the substrate by applying a resist on the glass substrate and then exposing and developing. That is, the region where the glass substrate is exposed is a lyophilic region showing lyophilicity, and the region where the resist remains is a lyophobic region showing lyophobic properties. At this time, the liquid repellent region may have a rectangular shape with a shape of the XY plane, for example, a square with a side of 30 μm and a thickness in the Z direction of 2 μm. Further, the distance between the centers of the adjacent liquid repellent areas is, for example, 100 μm, and the amount of ink ejected onto the substrate is 50 pl.

  Even in a substrate in which the shape of the liquid repellent area is a rectangular parallelepiped, when ink is ejected to the center point of the minimum unit formed by a straight line connecting the centers of adjacent liquid repellent areas, the ink droplets are within the minimum unit. Fits and does not spread outside the smallest unit. Similarly, a line pattern can be formed with high accuracy by ejecting ink continuously to adjacent central points of the smallest unit.

  Furthermore, even when the ejection amount of the ink ejected with respect to the minimum unit is increased to, for example, 100 pl, 150 pl, and 200 pl, the ejected ink droplet does not spread out outside the minimum unit, Fits within the smallest unit. In this manner, it is possible to form a thick pattern by increasing the ink discharge amount. In addition, a line pattern can be easily formed by ejecting ink continuously in adjacent minimum units.

  By setting the shape of the liquid repellent area to a rectangular parallelepiped, the liquid repellent area protrudes from the lyophilic area on the substrate, so that the contact area between the ink droplets that have landed on the substrate and the liquid repellent area is increased. For this reason, the force to hold the ink droplets within the smallest unit is increased, and even if the amount of ink ejected to the substrate increases, the ink droplets can be contained within the smallest unit and the pattern can be accurately formed. Can be formed.

(Sixth embodiment)
The following describes the sixth embodiment of the present invention with reference to FIGS.

  Also in the present embodiment, ink is ejected to the substrate 1 using the pattern forming apparatus 10 as in the first embodiment. The ink ejection position in the present embodiment will be described below with reference to FIG. FIG. 16 is an explanatory diagram for explaining the ejection position when ejecting ink to the substrate of the present embodiment. As shown in FIG. 16, the circular liquid repellent areas 3 of the substrate 1 are arranged so that a square is formed by a straight line connecting the centers of the adjacent liquid repellent areas 3. In the present embodiment, ink is first deposited on the center point D of the liquid repellent area 3 located at the apex of the minimum unit 9 formed by a straight line connecting the centers of the adjacent liquid repellent areas 3. Ink is ejected. That is, the ink is ejected so that the ink first adheres to the center point of the target area including the four minimum units 9 sharing the liquid repellent area 3 existing at the center point D. At this time, the ink discharge amount is set to 150 pl, for example.

  FIG. 17 shows a state after the landing of the ink ejected toward the center point D shown in FIG. As shown in FIG. 17, the ink droplet 31 that has landed on the center point D spreads over the lyophilic region 2 around the center point D. That is, the ink droplet that has landed at the center of the liquid repellent region located at the apex of the minimum unit 9 spreads in the four minimum units 9 around it and spreads by the liquid repellent region 3 constituting the four minimum units 9. Is suppressed. As a result, the ink droplets ejected onto the substrate 1 are contained within the four minimum units 9.

  That is, by including the liquid-repellent area 3 and ejecting ink so as to straddle the lyophilic area 2 and the liquid-repellent area 3, the liquid-repellent area arranged around the target area is increased and the ink is wetted to unnecessary portions. Spreading can be suppressed. Furthermore, since the liquid repellent areas 3 exist in the ± X direction and ± Y direction of the ejection position of the ejected ink droplet, respectively, the ink droplet effectively wets and spreads in the X direction and the Y direction. The line pattern to be formed can be clarified without bleeding.

(Seventh embodiment)
Also in the present embodiment, ink is ejected onto the substrate 1 using the pattern forming apparatus 10 as in the first embodiment. The configuration of the substrate 1 used for pattern formation in this embodiment is the same as the configuration of the substrate 1 in the first embodiment, and the ink ejection position is the same as that in the first embodiment (FIGS. 1 and 4). checking).

At this time, by setting the droplet amount V to be ejected to the minimum unit 9 so as to satisfy the following expression (1), the ejected ink droplets can be more reliably contained in the minimum unit 9.
V <{S (2 + X) / 3 (1 + X)} × √ {S (1-X) / π (1 + X)} (1)
Where X = (cos θ ₂ −cos θ ₁ ) A + cos θ ₁
θ ₁ : first contact angle θ ₂ : second contact angle S: area A formed by a straight line connecting the centers of the liquid repellent regions of the second contact angle A: second contact angle occupying the area S The area ratio of the liquid repellent region.

The above equation (1) will be described below. The ink droplets ejected at the center point A of the minimum unit 9 shown in FIG. 4 spread on the lyophilic area 2 until they contact the liquid repellent area 3. The contact angle of the ink at this time is theta _1. Ink droplets wet spread to lyophobic area 3 of the contact angle theta ₂ is subjected to a force in the inward direction of the minimum unit 9 by the liquid repellent area 3 of the contact angle theta _2. This force changes the contact angle of the ink droplet from θ ₁ to θ ₃ . The contact angle θ ₃ approximates a value obtained by the following equation (2).
cos θ ₃ = (cos θ ₂ −cos θ ₁ ) A + cos θ ₁ (2)
Here, A indicates the area ratio of the liquid repellent region 3 having the second contact angle in the minimum unit 9. In the equation (1), cos θ ₃ = X is replaced for simplification of the equation. X is determined by the area ratios of the contact angle regions of the contact angle θ ₁ and the contact angle θ _{2. For} the same area S of the minimum unit 9, the smaller the value of X, the smaller the value of θ ₃ . The larger the value, the more ink can be accommodated within the smallest unit 9.

X values and is calculated from the area S of the minimum unit 9, the maximum ink amount V _max that can be held in the minimum unit 9 approximates to a value determined by the following equation (3).
V _max = {S (2 + X) / 3 (1 + X)} × √ {S (1-X) / π (1 + X)} (3)
That is, when the ejection amount V of the ink ejected to the minimum unit 9 is smaller than V _max calculated by the equation (3), the ejected ink droplets do not overflow outside the minimum unit 9 and the minimum unit 9 is held inside. For example, the substrate 1 including the lyophilic region 2 having a contact angle θ ₁ = 10 degrees and the lyophobic region 3 having a contact angle θ ₂ = 85 degrees is used. At this time, the diameter of the circular liquid-repellent region 3 is 30 μm, and the minimum unit 9 formed by the straight line connecting the centers of the adjacent liquid-repellent regions 3 is a square having a side length of 100 μm.

At this time, the area of the minimum unit 9 is 100 × 100 = 10000 μm ² , and the area of the liquid-repellent region 3 with the contact angle θ ₂ in the minimum unit 9 is 15 × 15 × π / 4 × 4≈706.5 μm ² . Therefore, the area ratio A of the liquid repellent region 3 having the contact angle θ ₂ occupying the area of the minimum unit 9 is about 0.07. Therefore, X is about 0.92 from the above formula, and if this is substituted into the formula (1), V <57.6 pl.

  That is, by setting the ink discharge amount V to less than 57.6 pl with respect to the minimum unit 9 of the substrate 1, the ink can be held inside the minimum unit 9 without overflowing the ink from the minimum unit 9. . When the ink is ejected using the pattern forming apparatus 10 with the ink ejection amount to the substrate 1 being 20 pl, 50 pl, 60 pl, 80 pl, and 100 pl, the ink may be held within the minimum unit 9 when the ejection amount is 50 pl or less. it can. On the other hand, when the ejection amount is 60 pl or more, the ink spreads outside the minimum unit 9 and it is difficult to fit the ink in the minimum unit 9.

  Thus, by determining the ejection amount of the ink ejected in the minimum unit 9 from the equation (1), the pattern formation can be optimized. Further, the expression (1) is not limited to the method of discharging with respect to the minimum unit 9, but for the target region (hatched portion in FIG. 18) in which four minimum units 9 each having a square of 100 μm are arranged. Since the discharge amount can be calculated in the same manner, the pattern formation can be optimized.

For example, the ejection amount of the ink ejected to the shaded portion shown in FIG. 18 can be calculated as follows. The diameter of the circular liquid repellent region 3 is 30 μm, the contact angle θ ₁ is 10 degrees, and the contact angle θ ₂ is 85 °. At this time, the area of the target region constituted by the four minimum units 9 is 200 × 200 = 40000 μm ² , and the area of the liquid repellent region 3 having the contact angle θ ₂ included in the target region is 4 × 15 × 15 ×. π / 4 × 4≈2826 μm ² . Then, the area ratio A of the liquid repellent region 3 at the contact angle θ ₂ is about 0.07, and X is about 0.92 from the above formula. Substituting this into equation (1) results in V <460 pl.

  That is, in the substrate 1 shown in FIG. 18, the ink overflows from the target area by setting the ink discharge amount V to less than 460 pl for the target area (shaded portion in FIG. 18) constituted by the four minimum units 9. The ink can be held inside the target area without any problem. In the case where the ink is ejected at 350 pl, 400 pl, 450 pl, 500 pl, and 600 pl as the ejection amount of the ink ejected to the center point of the target region with respect to the target region shown in FIG. Ink droplets can be contained in the target area without the droplets spreading out. On the other hand, when the ejection amount is 500 pl or more, the ink droplets spread out outside the target region, and it is difficult to store the ink droplets within the target region.

  That is, not only when droplets are discharged into the minimum unit 9, but also when calculating the discharge amount of ink discharged to the target region as described above, the discharge amount is calculated by the equation (1). It is effective.

Further, the ink in the droplet volume V and the flying state of the ink and the droplet radius R, since a relationship that satisfies V = 4πR ^3/3, the ink discharged to the minimum unit 9 droplet radius R of the following ( Also by setting so as to satisfy the expression 4), it is possible to store the ink droplets ejected more reliably within the minimum unit 9. Here, the droplet diameter of the ink after landing on the substrate 1 changes depending on the characteristics of the substrate 1 and changes as needed until the contact angle at which the surface tension of the ink droplet and the interface tension of the substrate 1 are balanced. . Therefore, by calculating the droplet radius R in the flying state according to the above equation (4), more accurate and effective ink droplet conditions are calculated.
{S (2 + COSθ ₁ ) / 4π (1 + COSθ ₁ )} × √ {S (1-COSθ ₁ ) / π (1 + COSθ ₁ )} <R ³ <{S (2 + X) / 4π (1 + X)} × √ {S ( 1-X) / π (1 + X)} (4)
Furthermore, although the shape of the liquid repellent region 3 is circular in this embodiment, the present invention is not limited to this, and the same effect can be obtained with other shapes. Further, the liquid repellent areas are arranged so that the shape of the minimum unit 9, that is, the area formed by the straight line connecting the centers of the liquid repellent areas 3 is a square, but is not limited thereto, and the centers of the liquid repellent areas 3 are connected. The area formed by the straight line may be a regular polygon.

  Since the normal pattern forming apparatus 10 cannot eject droplets of 200 pl or more, when the appropriate amount of liquid to land on the target region is 200 pl or more, a plurality of droplets are ejected to the same ejection position.

  In each of the above-described embodiments, the ink jet method is employed as the means for ejecting ink. However, the means for ejecting ink is not limited to this, and the pattern forming substrate can be accurately controlled by controlling the ink ejection amount. The same effect can be obtained as long as the method allows ink to adhere.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

(Other configurations)
The present invention can also be expressed as follows.

(First configuration)
In the pattern forming substrate which droplets predetermined pattern by being discharged onto the surface to be formed, in a region of the contact angle theta ₁ with respect to the droplet, different contact angles theta is the contact angle theta ₁ A pattern-forming substrate, wherein the _two regions are regularly arranged.

(Second configuration)
The pattern forming substrate according to the first configuration, wherein the contact angle θ ₁ is smaller than the contact angle θ ₂ .

(Third configuration)
The pattern forming substrate according to the first or second configuration, wherein the shape of the region of the contact angle θ _{2 on} the region forming surface of the contact angle θ ₂ is symmetrical with respect to the top, bottom, left and right.

(Fourth configuration)
The first to third configurations are characterized in that the region of the contact angle θ ₂ is arranged at a position where the shape connecting the centers of the regions of the contact angle θ ₂ located at the closest distance becomes a regular polygon. The pattern forming substrate according to 1.

(Fifth configuration)
Region of the contact angle theta ₂ is patterned substrate according the first, which is a convex than the area of the contact angle theta ₁ to the fourth configuration.

(Sixth configuration)
A pattern forming method, wherein a predetermined pattern is formed by discharging droplets onto the pattern forming substrate according to any one of the first to fifth configurations.

(Seventh configuration)
Ejecting droplets in the region of the contact angle theta _1, the area of contact angle theta ₂ which is disposed around the droplets, according to a sixth structure of which is characterized by suppressing the spreading of the droplet Pattern forming method.

(Eighth configuration)
A sixth pattern or a seventh pattern is characterized in that a predetermined pattern is formed by discharging a droplet near the center of a regular polygonal region obtained by connecting the centers of the regions of the contact angle θ _{2 at} the closest position. The pattern formation method as described in the structure.

(Ninth configuration)
Sixth or seventh pattern forming method according to the structure of which is characterized by forming a predetermined pattern by discharging a droplet in the vicinity of the midpoint of the two contact angle theta ₂ of the area located closest.

(Tenth configuration)
Liquid droplets discharged on the substrate comprises at least one contact angle theta ₂ of the region, and characterized by forming a predetermined pattern and discharging droplets to straddle the contact angle theta ₁ and the contact angle theta ₂ The pattern forming method according to the sixth configuration.

(Eleventh configuration)
A contact angle theta ₁ region, in the pattern forming method of performing pattern formation by ejecting droplets areas of contact angle theta ₂ is a liquid repellency regularly arranged pattern forming substrate than the contact angle theta ₁ ,
The discharge amount V of the droplet to be discharged in a region connecting the centers of the contact angle theta ₂ of the region, and the area S of a region connecting the center of the contact angle theta ₂ of the region, the contact angle theta ₂ which occupies the area S region The area ratio A is set so as to satisfy the following expression (1): The pattern forming method according to any one of the sixth to tenth structures.
V <{S (2 + X) / 3 (1 + X)} × √ {S (1-X) / π (1 + X)} (1)
Where X = (COSθ ₂ −COSθ ₁ ) A + COSθ ₁
θ ₁ : first contact angle θ ₂ : second contact angle S: area of the region connecting the centers of the regions of contact angle θ ₂ : area ratio of the region of contact angle θ _{2 to} the area S.

(Twelfth configuration)
The pattern forming method according to any one of the sixth to eleventh structures, wherein the means for applying is an ink jet method.

(13th configuration)
A pattern drawing substrate manufactured by the pattern forming method according to any one of the sixth to twelfth configurations.

  If the substrate for forming a pattern according to the present invention is used, a desired pattern can be easily and accurately formed on a substrate, so that it can be applied to the production of a color filter in which a pattern is formed with a plurality of colors.

It is a top view which shows one Embodiment of the board | substrate which concerns on this invention. (A)-(d) is explanatory drawing explaining the manufacturing method of the board | substrate which concerns on this invention. It is a schematic perspective view of the pattern formation apparatus applied to the pattern formation method of this invention. It is explanatory drawing explaining the discharge position when discharging ink with respect to the board | substrate which concerns on this invention. It is explanatory drawing explaining the state after the landing of the ink discharged with respect to the board | substrate which concerns on this invention. It is a figure which shows the line pattern formed on the board | substrate which concerns on this invention. It is explanatory drawing explaining the other form of the discharge position when discharging ink with respect to the board | substrate which concerns on this invention. It is explanatory drawing explaining the state after the landing of the ink discharged with respect to the board | substrate which concerns on this invention. It is a figure which shows the line pattern formed on the board | substrate which concerns on this invention. It is explanatory drawing explaining the other form of the discharge position when discharging ink with respect to the board | substrate which concerns on this invention. It is explanatory drawing explaining the state after the landing of the ink discharged with respect to the board | substrate which concerns on this invention. (A)-(c) is explanatory drawing explaining the example of arrangement | positioning of the liquid repellent area | region formed on the board | substrate which concerns on this invention. It is a figure which shows the other form of the liquid repellent area | region on the board | substrate which concerns on this invention. (A) And (b) is explanatory drawing explaining the shape of the liquid-repellent area | region on the board | substrate which concerns on this invention. It is a figure which shows the other form of the liquid repellent area | region on the board | substrate which concerns on this invention. It is explanatory drawing explaining the other form of the discharge position when discharging ink with respect to the board | substrate which concerns on this invention. It is explanatory drawing explaining the state after the landing of the ink discharged with respect to the board | substrate which concerns on this invention. It is explanatory drawing explaining the other form of the object area | region of the board | substrate which concerns on this invention.

Explanation of symbols

1 Substrate (Pattern for pattern formation)
2 lyophilic area (first area)
3 Liquid repellent area (second area)
4 Glass substrate 5 Wetting change layer 6 Photomask 7 Mask pattern 8 Photocatalyst layer 9 Minimum unit (target area)
DESCRIPTION OF SYMBOLS 10 Pattern formation apparatus 11 Board | substrate 12 Stage 13 Inkjet head 14 Y direction drive part 15 X direction drive part 16 Droplet supply system 17 Apparatus control unit 18 Liquid piping

Claims (12)

A first region where the contact angle when the droplet is deposited on the substrate is the first contact angle;
A second region having a second contact angle larger than the first contact angle,
The second regions are regularly scattered on the first region, and are arranged at intervals that can block the spread of droplets attached to the first region. A substrate for pattern formation characterized.   2. The second area is arranged on the first area so that a regular polygon is formed by a straight line connecting the center points of the adjacent second areas. The substrate for pattern formation as described in 2.   The pattern formation according to claim 1, wherein the first region is lyophilic with respect to the droplet, and the second region is lyophobic with respect to the droplet. Substrate for use.   The substrate for pattern formation according to claim 1, wherein the second region has a symmetrical shape.   2. The pattern forming substrate according to claim 1, wherein the second region protrudes from the pattern forming surface of the substrate more than the first region.   When the distance between two adjacent second regions is L, and the length of a straight line connecting the center points of the two second regions is W, the second region is over the first region. The substrate for pattern formation according to claim 1, wherein the regions are arranged so as to satisfy L ≧ W / 2.   The pattern formation method which forms a predetermined pattern by discharging a droplet to the pattern formation base material of any one of Claims 1-6.   8. The method according to claim 7, further comprising: a discharge step of discharging a droplet so that the droplet first adheres to a center point of a target region surrounded by a straight line connecting the center points of the second region. The pattern formation method as described.   The center of the region formed by the two target regions adjacent to each other when ejecting a droplet that is twice the amount of the droplet to be ejected onto the target region surrounded by a straight line connecting the center points of the second regions The pattern forming method according to claim 7, further comprising a discharge step of discharging a droplet so that the droplet first adheres on the point. A first region where the contact angle when the droplet is deposited on the substrate is the first contact angle;
A second region having a second contact angle larger than the first contact angle,
The second region is scattered on the first region, and on the base material arranged so that a regular polygon is formed by a straight line connecting the center points of the adjacent second regions. A pattern forming method for forming a predetermined pattern on
When ejecting a droplet onto a substrate, when ejecting a droplet so that the droplet first adheres to the center point of the target area surrounded by a straight line connecting the center points of the second area The pattern formation method including the process of making a droplet adhere on a base material so that the discharge amount V of this droplet may satisfy | fill the following (1) Formula.
V <{S (2 + X) / 3 (1 + X)} × √ {S (1-X) / π (1 + X)} (1)
Here, X = (COSθ ₂ −COSθ ₁ ) A + COSθ ₁
θ ₁ : first contact angle θ ₂ : second contact angle S: area of the target region surrounded by a straight line connecting the center points of the second region A: area ratio of the second region in the area S It is.   The pattern forming method according to claim 7, wherein an ink jet head is used for discharging droplets.   The board | substrate characterized by the pattern being formed on the said pattern formation base material by the pattern formation method of any one of Claims 7-11.

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