JP4789314B2 - Solder discharge pump and automatic solder filling apparatus having the same - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a discharge pump used for filling a container with solder. More specifically, the present invention relates to a discharge pump suitable for discharging cream solder (solder cream, solder paste) in which solid particles are dispersed in a liquid medium. Furthermore, the present invention relates to an automatic solder filling apparatus which can automatically and continuously fill a container with cream solder having the above-mentioned special form by providing such a discharge pump.
[0002]
[Prior art]
Conventionally, cream solder has been widely used in the manufacture of circuit boards and the like. Conventionally commercially available cream solder is filled in small containers such as syringes, barrels or cartridges, and dispenser type is used by supplying pressurized air from one of the containers and discharging it from the other port connected to the on-off valve Is offered as.
[0003]
By the way, filling of the solder paste into the small container has not been automated yet. This is because cream solder has a special form in which solid particles are dispersed in a liquid medium. In a general-purpose discharge pump, the solder particles in cream solder are fitted between the cylinder and piston in the pump. This is because a phenomenon (burn-in phenomenon) occurs in which the operating resistance of the pump rises and becomes inoperable by biting into the gap. Further, when the solder particles bite into the gap between the cylinder and the piston, the particles are deformed, resulting in a problem that the properties of the cream solder deteriorate. For this reason, it is the actual situation that cream solder supply manufacturers have manually filled cream solder into small containers using a spatula or the like.
[0004]
However, in manual filling, air is mixed in the solder at the time of filling, and thus defoaming is necessary. In addition, since a large amount of labor is required, in addition to the net cost of materials, such filling costs (labor costs) are a major burden for cream solder suppliers.
[0005]
[Problems to be solved by the invention]
An object of the present invention is to solve the above-described conventional problems. First, a dispersion liquid in which solid particles are dispersed in a liquid medium, particularly a cream solder, without causing a seizure phenomenon. An object of the present invention is to provide a discharge pump capable of continuously feeding or discharging liquid. A second object of the present invention is to provide an automatic solder filling apparatus capable of automatically and quantitatively filling cream solder into a container by providing the discharge pump.
[0006]
Furthermore, the present invention enables automatic filling of cream solder based on the development of a new discharge pump suitable for the discharge of cream solder and the development of an apparatus suitable for continuous or quantitative filling of cream solder. The purpose is to contribute to the improvement of cream solder productivity and economic efficiency of a cream solder supplier.
[0007]
[Means for Solving the Problems]
The inventor has made various studies to solve the above-mentioned object desired in the field, and in a piston-type pump including a cylinder and a piston, the inner diameter of the cylinder is designed to be larger than the outer diameter of the piston head. By providing a clearance so that cream solder (solder particles) leaks from the side of the fitting when the piston head is inserted into the cylinder, the cream solder can be applied for a long time without causing seizure of the pump. It was found that continuous discharge is possible. In addition, according to such a discharge pump, the solder particles contained in the cream solder can be quantitatively filled into the container while maintaining the properties of the cream solder without being deformed and damaged. It was confirmed that quality cream solder-filled products (cartridges, barrels, syringes, etc.) can be stably provided. By using such a discharge pump, it is possible to provide an automatic filling device for cream solder that can be driven continuously, and in particular, according to such a filling device, since bubbles do not enter into the cream solder, the container can be efficiently used without providing a defoaming step. It was confirmed that it was possible to fill The present invention has been developed based on these findings.
[0008]
That is, the first of the present invention is a discharge pump described in the following (1) to (5) suitable for discharging cream solder having a form in which solid particles are dispersed in a liquid medium:
(1) A piston-type discharge pump including a cylinder and a piston, wherein the inner diameter of the cylinder is larger than the outer diameter of the piston head, and the clearance formed on the side surface portion where the cylinder and the piston head are inserted is the particle size of the solder particles Solder discharge pump characterized by being larger.
(2) The solder discharge pump according to (1), wherein a clearance formed in a side surface portion between the cylinder and the piston head is 80 to 300 μm.
(3) The solder discharge pump according to any one of (1) and (2), wherein the piston head includes a piston whose vertical width is 30% or more of the outer diameter of the piston head.
(4) The solder discharge pump according to any one of (1) to (3), wherein the cylinder or the piston head is made of materials having different hardnesses.
(5) The solder discharge pump according to any one of (1) to (4), wherein the piston insertion port of the cylinder communicates with the raw material tank.
[0009]
Furthermore, the present invention is an automatic solder filling apparatus comprising any one of the above-described solder discharge pumps as means for injecting solder into a container. In addition to the solder discharge pump, the apparatus can further include a container moving means, a solder injection amount measuring means, a defective product sorting means, and a raw material storage means.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
(1) Solder discharge pump
The first aspect of the present invention is a discharge pump suitable for discharging a liquid in which solid particles are dispersed in a liquid medium, particularly cream solder. The pump is a piston type pump having a configuration in which the solder in the cylinder is discharged from the other port (discharge port) of the cylinder by inserting the piston head into the cylinder from the one port (piston insertion port) of the cylinder. Further, when the piston head is inserted into the cylinder, it is designed such that a predetermined clearance is generated on the side surface (insertion side surface portion) of the both insertion portions to be formed. .
[0011]
Such a pump can be designed by using a cylinder whose inner diameter (φD) is larger than the outer diameter (φd) of the piston head inserted therein. The size of the clearance [(φD−φd) / 2] formed on the side surface portion inserted by the cylinder and the piston head is slightly larger than the maximum diameter of the solder particles contained in the cream solder that is the discharge target. preferable. Specifically, for example, when the maximum diameter of the solder particles is 100, the clearance size [(φD−φd) / 2] is preferably 120 to 500, more preferably 150 to 300. it can.
[0012]
More specific clearance size [(φD−φd) / 2] may be in the range of 80 to 300 μm, preferably in the range of 100 to 200 μm.
[0013]
According to the discharge pump provided with the cylinder and the piston in which the cylinder and the piston head are in the above relationship, by inserting the piston head into the cylinder, the solder filled in the cylinder is discharged from the cylinder discharge port, It leaks into the piston insertion port through a side gap (clearance) formed in the fitting portion between the cylinder and the piston head. That is, according to the present invention, the solder particles are intentionally leaked at the insertion side surface portion between the cylinder and the piston head so that the solder particles can be leaked, so that the solder particles are inserted into the gap between the cylinder and the piston head. Problems such as the seizure phenomenon of the pump due to biting in and deformation of the solder particles can be solved.
[0014]
Further, it is preferable that the piston head has a longer vertical width (L) to increase the area in contact with the cylinder inner surface. In the present invention, the longitudinal width (L) of the piston head means the axial length of the portion where the head fits into the cylinder inner wall surface when the piston head is inserted into the cylinder. In other words, the vertical width (L) means the length in the piston axial direction (longitudinal direction) of the portion that maintains the clearance formed in the insertion side surface portion of the piston head and the cylinder.
By increasing the longitudinal width L of the piston head, it is possible to reduce a drop in the discharge pressure due to the clearance provided in the side surface portion where the cylinder and the piston head are fitted, thereby enabling efficient discharge. The longitudinal width (L) of the piston head varies depending on the viscosity of the cream solder that is the discharge target and the clearance dimension between the cylinder and the piston head, and cannot generally be specified, but is usually the outer diameter (φd) of the piston head. It is possible to adopt a length of 30% or more. The length is preferably 30 to 100% of the outer diameter (φd) of the piston head, more preferably 40 to 60%.
[0015]
The material used for the piston head and the cylinder is not particularly limited, but in order to prevent deformation and damage of the solder particles by passing through the clearance of the insertion side surface of the cylinder and the piston head, different hardnesses are used. It is preferable to be comprised from the material which has. For example, when using a hard material with high hardness for the piston head, use a soft material with low hardness for the cylinder. When using a soft material with low hardness for the piston head, use a hard material with high hardness for the cylinder. preferable. Preferably, the material of the piston head may be a soft material having a low hardness such as hard urethane or polyethylene, and the material of the cylinder may be a hard material having a high hardness such as hardened steel, nitrided steel, or silicon carbide.
[0016]
In addition, members such as cylinders, pistons, and raw material tanks that are in contact with the cream solder that is the raw material (other piston bearings and cylinder-piston frames described later) are made of a corrosion-resistant material in order to prevent corrosion caused by flux components contained in the cream solder. Alternatively, the surface in contact with the cream solder is preferably coated with a corrosion-resistant material.
[0017]
Furthermore, in the discharge pump of the present invention, the piston insertion port of the cylinder communicates with the discharge port of the raw material tank formed by storing and filling the cream solder that is the discharge target, and thereby the inside of the cylinder through the piston insertion port from the raw material tank. It is preferable to have a form in which cream solder is supplied.
[0018]
More preferably, in the discharge pump according to the present invention, the cylinder and the piston are horizontally disposed so that the piston moves back and forth in the cylinder, and the material tank is disposed on the horizontally disposed cylinder-piston. It can have a form in which the bottom discharge port of the tank is vertically suspended. According to this configuration, the cream solder can be automatically supplied and replenished from the raw material tank into the discharge pump, and the cream solder is automatically inserted into the cylinder as the piston head is inserted into and removed from the cylinder by the reciprocating motion of the piston. As a result, cream solder can be continuously discharged from the cylinder discharge port over a long period of time.
[0019]
The discharge pump of the present invention can discharge a predetermined amount of cream solder according to the distance (piston stroke width, S) that the piston reciprocates. That is, the discharge pump of the present invention can adjust and set the discharge amount to a desired amount by adjusting the piston stroke width. Therefore, the discharge pump of the present invention can be used as a metered discharge pump (metering pump) that can continuously discharge a certain amount of cream solder by setting the piston stroke width to a desired width.
[0020]
(2) Solder automatic filling equipment
Secondly, the present invention relates to an automatic solder filling device capable of continuously filling cream solder into a small container such as a syringe, cartridge or barrel. The automatic solder filling apparatus is characterized in that the above-described solder discharge pump of the present invention is used as a pump for quantitatively injecting cream solder from a raw material tank into a small container.
[0021]
The automatic solder filling apparatus of the present invention sequentially transfers empty containers to a solder injection position, injects and fills a predetermined amount of cream solder into the empty container disposed at the position by the operation of the discharge pump, and then a predetermined amount. A series of flows such as selectively transferring only non-defective products (cream solder-filled products) filled with cream solder to a product (non-defective product) stock location are automated.
[0022]
Specifically, the automatic solder filling apparatus of the present invention sequentially transfers empty containers to a solder injection position, or uses a container filled with cream solder (cream solder filled product) as a product (non-defective product) stock location or defective product stock. “Container moving means” for transporting to a predetermined position such as a place, “Solder injecting means” for injecting and filling a predetermined amount of cream solder into an empty container arranged at the injection position, and “inspecting the injected solder amount” It is possible to provide "solder injection amount measuring means", "defective product sorting means" for sorting out and rejecting defective products from cream solder-filled products, and "raw material storage means" for storing solder as a raw material.
[0023]
The container moving means is not particularly limited as long as it can continuously convey and move a plurality of small containers (for example, syringes, cartridges, or barrels) to a desired position. For example, the lane automatically moves. A belt conveyor, a chain conveyor, and the like that can convey a plurality of small containers on the lane in a row can be exemplified. The container moving means includes at least a “container supply line” for transporting and moving an empty container to a solder injection position, and a “filled container transport line” for transporting and transporting a container filled with cream solder to a product stock location. Further, the container moving means is a “container feeding device” for feeding the next container one by one to the position following the fact that the preceding container is filled with solder at the solder injection position and moved to the filling container transport line. “Container lifting device” that raises and lowers the container placed at the solder injection position, and inserts and removes the discharge nozzle of the discharge pump into the container, and discharges the selected defective products from the transport line and transports them to a predetermined place. A “defective product discharge device” can be provided.
[0024]
Examples of the solder injection means include the solder discharge pump of the present invention described above. The solder discharge pump is fixed laterally on the gantry so that the discharge nozzle communicating with the cylinder discharge port faces the solder injection position with the discharge port facing downward. The solder injection means may further include an injection amount adjusting device (such as a device for adjusting the piston stroke width of the solder discharge pump) so that the injection amount into the container can be appropriately set and adjusted according to the capacity of the container.
[0025]
As described above, the solder discharge pump communicates with the discharge port of the raw material tank, which is the raw material storage means, so that the cream solder as the raw material can be automatically and replenished into the pump. Preferably it is. The raw material storage means may be provided with a device for monitoring the amount of stored solder, for example, a solder storage amount management device or an alarm device for notifying when the remaining amount is low, attached to the raw material tank.
[0026]
The solder injection amount measuring means only needs to be able to measure the amount of solder injected into the empty container. For example, even if it is an apparatus for measuring the solder capacity filled in the container, it is an apparatus for measuring the weight. Also good. A weight measuring device is preferable. Further, the solder injection amount measuring means can include a device for processing or storing and managing the measurement data such as a computer, and a printing device for printing the filling amount in each container as required.
[0027]
As the defective product selection means, for example, based on the result measured by the above-mentioned solder injection amount measuring means, an appropriate injection amount of solder-filled product (good product) and an inappropriate injection amount of solder-filled product (defective product) are selected. An apparatus can be mentioned. Further, the defective product sorting means may include a device for sorting non-defective products and defective products based on the result of measurement by a bubble detecting means such as a radiation measuring instrument or a foreign matter detecting means. The defective products selected by using such an apparatus are discharged from the filling container transport line connected to the product (non-defective product) stock location by the operation of the above-mentioned “defective product discharge device” and transported to the defective product stock location. The non-defective product is transported to the product (non-defective product) stock place on the filling container transport line.
[0028]
【Example】
Example 1   Solder discharge pump
The solder discharge pump of the present invention will be described with reference to FIG. Note that the pump device shown in these drawings merely shows one embodiment of the present invention, and the present invention is not limited to such a specific device.
[0029]
FIG. 1 shows a solder discharge pump according to the present invention.1It is sectional drawing which looked at from the side. Such a discharge pump1Is a kind of piston type pump, basically a cylinder3Inside piston head41Cylinder by being inserted3Inside cream solder2Cylinder discharge port32From discharge nozzle33It consists of a mechanism that discharges to the outside. In FIG. 1, the piston head indicated by the solid line41The piston head is a cylinder3Piston head shown in dotted line41 'The piston head is a cylinder3The state inserted in is shown.
[0030]
The solder discharge pump1Basically a piston4(Piston shaft42, Piston head41) And cylinder3Other, piston shaft42Piston bearings that can be reciprocated5, A drive source (not shown) for reciprocating a piston such as an air cylinder or a servo motor, a piston head41Is a cylinder3Cylinder so that it can be inserted and removed with a certain amount of side clearance inside3And the piston bearing5Piston-cylinder frame that positions and integrates6These consist of a piston-cylinder frame6Through the gantry7It is fixed horizontally.
[0031]
Solder discharge pump arranged horizontally1On top of the cream solder2Raw material tank filled and stored8But piston insertion port31 WhenRaw material tank8The material tank is suspended by gravity so that it communicates with the bottom outlet8Inside cream solder2The discharge pump1It comes to flow in. Specifically, the piston-cylinder frame6The part where the piston head is removed from the cylinder, specifically the piston bearing5And cylinder3And the opening is located in the housing tube9And the raw material tank through the raw material tank bottom outlet8And fluidly connected. That is, as shown in FIG.1Inside is a piston4Is a cylinder3Reciprocating passage and raw material tank8The crossing area (three-way crossing area) with the passage where cream solder flows in and out from the piston insertion port31Is formed in a liquid-tight manner in the upper region (the left region of the piston insertion port in the figure).
[0032]
Raw material tank by this8Cream solder supplied from2The housing tube9Of the above crossing area and cylinder3It will be in the state satisfy | filled in (FIG. 2).
[0033]
The cream solder stored in the raw material tank is preferably deaerated beforehand. The raw material tank may have a raw material supply port at the top, or may be graduated so that the storage amount (remaining amount) of the cream solder as the raw material can be understood. Furthermore, it may be configured to issue an alarm or the like when a cream solder remaining amount is reduced by attaching an optical sensor or the like.
[0034]
Also piston bearing5For example, as shown in FIG.51High hardness flat bearing52Multi-stage packing53, Adjustment screw to adjust the binding force of the multi-stage packing54And housing for integrating them55Can be configured. Where seal51Plays a role of preventing the cream solder from flowing out from the crossing region, and for example, a highly airtight fluorine-based seal can be used. High hardness flat bearing52Is responsible for positioning the axial centers of the piston head 41 and the cylinder 3 and maintaining a constant clearance for a long period of time, which is formed on the side surface where the piston head and the cylinder are fitted. Multistage packing53Is the above seal to prevent the outflow of cream solder51As a result, it is possible to completely prevent the leakage of cream solder that may occur due to variations in processing accuracy of the component parts or initial wear. Multistage packing53Adjust the tightening force as described above54Therefore, even if it is worn out, the airtightness can be maintained for a long time by adjusting it.
[0035]
Next, the operation of the solder discharge pump of the present invention will be described with reference to FIG.
[0036]
In FIG. 1, cream solder as a discharge object is placed in the pump.2Raw material tank in the state where it is deaerated beforehand8Supplied and filled (see Fig. 2), cylinder3Piston insertion port31Piston head in the upper area (left direction in the figure, crossover area)41Is waiting to be inserted into the cylinder (solid line). Piston shaft here42When a piston drive source (not shown) that is directly connected to is operated, the piston4Moves in the piston insertion direction (moving to the right in the figure).41Is a cylinder3Inserted into (dotted line part in Fig. 1), resulting in cylinder3The cream solder inside is pressed, and a predetermined amount of cream solder is applied to the cylinder discharge port according to the piston stroke width (S).32From discharge nozzle33It is discharged outside through. Piston head41When the end of reaches the bottom of the cylinder, the piston4Continues to move in the opposite direction (piston attachment / detachment direction, left direction in the figure)41Is a cylinder3Return to the above-mentioned standby state, which is detached from the above.
[0037]
Note that, as described above, the solder discharge pump of the present invention is a cylinder.3Inner diameter (φD) is the piston head41Since the outer diameter (φd) of the cylinder is larger than the outer diameter (φd), a certain clearance (gap, gap) is formed on the side surface portion where the cylinder and the piston head are fitted. For this reason, the cylinder3Inside piston head41When the pressure is inserted, the cream solder inside the cylinder33And the piston insertion port on the opposite side through the clearance31Leak to the side. That is, the discharge pump of the present invention can prevent the soldering phenomenon of the pump and the wear deformation of the solder particles by causing the cream solder to leak out from the piston insertion port when the piston is inserted. Conversely, the cylinder3Piston head inserted in41When removing and installing the cylinder3As the inside becomes negative pressure, the cream solder is cylinder through the clearance.3As a result, the cream solder can be supplied into the cylinder without mixing bubbles, and the negative pressure in the syringe can be reduced, so that the piston head can be easily attached and detached.
[0038]
Thus, according to the discharge pump of the present invention, by the reciprocating movement of the piston (piston insertion / removal movement) as described above, the cream solder is supplied from the raw material tank into the cylinder or supplied into the cylinder without mixing bubbles. The cream solder can be discharged continuously.
[0039]
Example 2   Automatic solder filling equipment
The solder automatic filling apparatus of the present invention will be described with reference to FIGS.
[0040]
FIG. 3 shows an automatic solder filling apparatus according to the present invention.100FIG. 4 is a front view of the solder filling device.100It is the top view which looked at from the top. 3 to 4 show only one aspect of the automatic solder filling apparatus of the present invention, and the present invention is not limited to such a specific apparatus.
[0041]
In FIG. 3, the above-described solder discharge pump of the present invention.1Is raw material tank8Located at the bottom of. That is, FIG. 3 shows the solder discharge pump shown in FIG.1Discharge nozzle33Corresponds to the view from the A direction (FIG. 1). In other words, the discharge pump shown in FIG.1And raw material tank81 corresponds to FIG. 1 (however, FIG. 1 is a cross-sectional view).
[0042]
Such an automatic solder filling apparatus of the present invention100An empty container filled with cream solder101(E.g., syringe, cartridge, barrel, etc.), container moving means (container supply conveyor)111And container feeding device112), The solder injection position sequentially102Container supply line for transferring to a container, and a container lifting device for lifting an empty container transferred to an injection position upward and inserting a discharge nozzle port into the empty container113, Raw material tank8Discharge nozzle mouth with cream solder filled in33Solder discharge pump that injects into the empty container from1, Solder-filled container (solder-filled product) into container moving means (filled container transport conveyor)114) Filling container transport line transported to product stock location (not shown), weight measuring device to measure the weight of solder filled product to verify the amount of solder injected103, A sorter that sorts defective products from the amount of solder injected104, Defective product discharge section for discharging defective products from the filling container transport line and transporting them to a defective product stock location (not shown)105, As well as turntables for product stock that transport non-defective products from the filling container transport line to a product stock location (not shown)106Can be provided.
[0043]
As shown in FIG. 4, the container supply line is located at the solder injection position.102Container feeding device located in front of112The container is bent at a right angle with respect to the moving direction of the container and communicates with a filled container transport line that is parallel to the container supply line at a different phase. A container feeding device for a plurality of empty containers moving in a row on the container supply line112Stop once before this, and the container feeding device112Solder injection position on the filling container transport line with different phases one by one102Can be sent to.
[0044]
For example, the operation of the automatic solder filling apparatus of the present invention will be described with reference to FIG.
[0045]
First empty container101Is a sequential container supply conveyor111Solder injection position placed on top102It is transported and moved in the direction (right direction in FIG. 3, arrow a). The empty container that has moved is a container feeding device.112The machine is temporarily stopped in front of the solder injection position102Each time the container is filled with solder and sent to the filling container transport line, the container feeding device one by one112Is moved in the direction of arrow b. The moved empty container is further moved in the direction of the arrow c to move the solder injection position.102And then the container lifting device shown in FIG.113By discharge nozzle mouth33Is lifted so as to be inserted deeply into the container. While maintaining this state, the above-described solder discharge pump1As a result of the operation, a predetermined amount of cream solder is injected and filled in the empty container. After the injection, the container filled with solder is the lifting device113Return to the original position by the descent of the filled container conveyor114On the weight measurement unit103It is conveyed to. The weight measurement unit measures the amount of solder injected into the container.104Is activated, defective product discharge section105Only the non-defective products are discharged from the filling container transport line to the product stock turntable.106And is supplied and stored as a product in a product (good product) stock place (not shown).
[0046]
In addition, when changing the amount of cream solder container injection, the discharge pump1This can be dealt with by changing the piston stroke width (S) and changing the set values of the automatic injection amount measuring unit and the sorter accordingly.
[0047]
【The invention's effect】
The discharge pump of the present invention is a piston-type pump suitable for discharging a dispersion liquid containing solid particles such as cream solder. According to the discharge pump of the present invention, there is no problem such as a baking phenomenon of the pump or deterioration of solder quality due to breakage of solder particles, and cream solder can be discharged stably and continuously for a long period of time. The discharge pump of the present invention can set the discharge amount to a predetermined amount by adjusting the piston stroke width, and functions as a metering pump. Further, according to the discharge pump of the present invention, since the dispersion liquid containing solid particles such as cream solder can be filled in the container without mixing bubbles, it is not necessary to separately perform a defoaming operation.
[0048]
The automatic solder filling apparatus of the present invention includes the above-described discharge pump as the solder filling means (solder injection means), so that the cream solder can be automatically and quantitatively and continuously injected into the container. The apparatus further includes a solder injection amount measuring unit and a defective product sorting unit, so that defective products that do not satisfy the specified filling amount can be automatically sorted out.
[0049]
Thus, according to the apparatus of the present invention, it is possible to automate the cream solder filling operation into a small container such as a syringe, which has been conventionally performed manually in a cream solder supply manufacturer, thereby reducing production costs and long-term continuous operation. The production efficiency of cream solder-filled products can be increased by improving the equipment utilization rate.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a solder discharge pump according to the present invention as viewed from the side.
FIG. 2 is a cross-sectional view showing a state in which solder is filled in a solder discharge pump.
FIG. 3 is a front view showing the automatic solder filling apparatus of the present invention.
4 is a plan view of the automatic solder filling apparatus of the present invention shown in FIG. 3 as viewed from above.
[Explanation of symbols]
1. Solder discharge pump
2. Cream solder
3. Cylinder
31.Piston insertion port
32.Cylinder outlet
33. Discharge nozzle
4). piston
41, 41'.Piston head
42.Piston shaft
5. Piston bearing
51.Seal
52.High hardness flat bearing
53. Multistage packing
54.Adjustment screw
55. Housing
6). Piston-cylinder frame
7). Stand
8). Raw material tank
9. Housing tube
100. Automatic solder filling equipment
101. Empty container
102. Solder injection position
103. Weight measuring device
104. Defective product sorter
105. Defective product discharge section
106. Product stock turntable
111. Container supply conveyor
112. Container feeding device
113. Container lifting device
114. Filling container conveyor
φD: Cylinder inner diameter
φd: Piston head outer diameter
L: Length of piston head
S: Piston stroke width

Claims (8)

A piston-type discharge pump that includes a cylinder and a piston and discharges cream solder,
The piston includes a piston head that is inserted into the cylinder and presses the cream solder,
Larger than the outer diameter of the inner diameter of the cylinder is the piston head,
Clearance formed inserting side portion of the cylinder and the piston head is greater than the diameter of the solder particles, the solder dispensing pump.   The solder discharge pump according to claim 1, wherein the clearance is 80 to 300 μm. The piston, the solder dispensing pump according to claim 1 or 2, wherein the height of the piston head is at least 30% of the outer diameter of the piston head. It said cylinder or said piston head, the solder dispensing pump according to any one of claims 1 to 3 is made of a material of mutually different hardnesses. The solder discharge pump according to any one of claims 1 to 4 , wherein a piston insertion port of the cylinder communicates with a raw material tank.   A piston-cylinder frame having the cylinder at the tip, a piston bearing for reciprocally supporting the piston at the rear end, and a crossing region formed between the cylinder and the piston bearing;
  A raw material tank connected to the crossover region and supplying cream solder into the cylinder; and
  The piston bearing has a seal for preventing the outflow of cream solder from the crossing region,
  The solder discharge pump according to claim 1, wherein the piston head can be completely inserted into the cylinder. An automatic solder filling apparatus comprising the solder discharge pump according to any one of claims 1 to 6 as solder injection means. The automatic solder filling apparatus according to claim 7 , further comprising a container moving unit, a solder injection amount measuring unit, a defective product selecting unit, and a raw material storage unit.

Images