JP4788666B2 - Power module - Google Patents

Description

  The present invention relates to a power module having a plurality of semiconductor elements and a heat radiating member that radiates heat from the semiconductor elements.

  Conventionally, as shown in FIG. 7, there is known a power module 9 in which a plurality of semiconductor elements 92 are arranged on a mounting surface 930 of a radiator plate 93 (see, for example, Patent Document 1). In the power module 9, a plurality of semiconductor elements 92 are planarly arranged on a flat heat sink 93. Therefore, when the number of mounted semiconductor elements 92 increases, it is necessary to increase the area of the heat radiating plate 93, and the physique of the power module 9 may be increased. And the physique of this power module 9 expands planarly in the direction (X direction and Y direction in FIG. 7) in which the mounting surface 930 of the heat sink 93 becomes larger, and is orthogonal to this plane (hereinafter, for convenience). (In other words, it is called “the height direction”).

  Accordingly, there has been proposed a power module 9 that is reduced in size by dispersing the expansion of the mounting surface 930 of the heat sink 93 according to the number of mounted semiconductor elements 92 also in the height direction (Z direction in FIG. 8). (See Patent Document 2). In the power module 9, as shown in FIGS. 8 and 9, a plurality of semiconductor elements 92 are dispersedly placed in contact with two non-parallel mounting surfaces 930 provided on the heat sink 93.

  Thereby, the physique of the power module 9 is reduced in the direction (X direction) perpendicular to the bent side 95 formed by bending the heat radiating plate 93 so that the central portion thereof protrudes in the height direction Z. It is possible. However, in such a configuration, the physique of the power module 9 cannot be reduced in the direction parallel to the bent side 95 (the Y direction in FIG. 9). That is, the physique of the power module 9 cannot be reduced in both the Y direction which is the vertical direction and the X direction which is the horizontal direction.

  Further, as shown in FIG. 10, there is a power module 9 in which a semiconductor element 92 is mounted on a non-flat surface 940 of a non-flat component 94 such as a rotating electrical machine (see Patent Document 3). In the power module 9, the semiconductor element 92 is mounted on the element mounting portion 944 having a flat surface protruding outward from the side surface 941 of the non-flat component 94. However, since the element mounting portion 944 is formed, a dead space D, which is a useless space, is formed in association with the element mounting portion 944, so that the size of the power module 9 may be increased.

  In addition, as shown in FIG. 11, in the non-flat component 94, it is conceivable to mount the semiconductor element 92 on the end surface 942 in the axial direction of the non-flat component 94. In such a power module 9, an element mounting portion 944 having a flat surface is formed around a protruding portion 943 protruding at a central portion as a bearing of the non-flat component 94 or the like, and the semiconductor element 92 is mounted on the surface. However, in this case as well, a large dead space D is formed around the protrusion 943, so that the physique of the power module 9 may be increased.

JP 2006-174572 A JP 2002-343909 A JP 2004-190547 A

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a power module capable of effectively reducing the size.

The reference invention is a power module having three or more semiconductor elements and a heat radiating member for radiating heat of the semiconductor elements,
A non-parallel three or more mounting surfaces mutually provided on the heat dissipation member, Ru power module near, characterized in that are in contact arranged by dispersing the three or more semiconductor elements.

Next, the effects of the reference invention will be described.
The three or more semiconductor elements are dispersedly arranged in contact with three or more non-parallel mounting surfaces provided on the heat dissipation member. According to such a configuration, the semiconductor elements are arranged at an angle to each other on non-parallel mounting surfaces provided on the heat dissipation member. Therefore, not only one plane direction in the power module but also a height direction perpendicular thereto can be used as a space for mounting the semiconductor element. Therefore, the projection area projected in the height direction of the power module can be reduced, and the physique of the power module can be reduced.

In particular, in the power module of the reference invention , three or more semiconductor elements are arranged in contact with three or more mounting surfaces. Therefore, both the vertical and horizontal dimensions of the projection surface projected in the height direction of the power module can be reduced. As a result, the physique of the power module can be effectively reduced.

As described above, according to the reference invention , it is possible to provide a power module that can be effectively reduced in size.

The present invention relates to a power module mounted to the rotary electric machine is a non-planar part having a three or more semiconductor devices, have a heat radiating member for conducting heat radiation of the semiconductor element, a non-planar surface,
The heat dissipating member has three or more element mounting portions attached to the non-flat surface of the non-flat component in a non-parallel state, and each of the element mounting portions is a flat surface on which the semiconductor element is mounted. A mounting surface
A non-parallel three or more of the mounting surface with each other provided on the heat dissipation member, is in a power module, characterized in that are in contact arranged by dispersing the three or more semiconductor elements (Claim 1).

Next, the effects of the present invention will be described.
The heat dissipating member has a plurality of element mounting portions attached to the non-flat surface of the non-flat component in a non-parallel state, and the plurality of semiconductor elements are dispersed in the plurality of element mounting portions. Are in contact with each other. According to such a configuration, it is possible to arrange the element mounting portion of the heat dissipation member so as to appropriately correspond to the shape of the non-flat surface of the non-flat component. That is, if a heat dissipating member having a flat element mounting portion is arranged on a non-flat component and a plurality of semiconductor elements are mounted on the flat element mounting portion, it is inevitably wasteful between the non-flat component and the semiconductor element. A dead space (see symbol D in FIGS. 10 and 11) is generated.

In contrast, according to the above configuration, as described above, the element mounting portion of the heat radiating member can be disposed in an appropriate manner corresponding to the shape of the non-flat surface of the non-flat component, thereby forming a dead space. It can be suppressed.
As a result, even when the number of semiconductor elements to be mounted is increased, the semiconductor elements can be mounted on the heat dissipation member while sufficiently suppressing the formation of dead space, and the size of the power module can be effectively reduced.

  As described above, according to the present invention, it is possible to provide a power module that can be effectively reduced in size.

In the above reference invention and the present invention (Claim 1 ), as the semiconductor element, for example, a general-purpose semiconductor element such as an IGBT element or a MOS FET element can be used.
In the above-described reference invention , by varying the number and arrangement of the three or more mounting surfaces that are not parallel to each other, power modules having various shapes such as a substantially triangular pyramid shape, a substantially quadrangular pyramid shape, and a substantially pentagonal pyramid shape are provided. Can be formed.

  In this specification, the three-dimensional space will be described using the X direction, the Y direction, and the Z direction orthogonal to each other. In other words, the Z direction in FIG. 1 is the height direction of the power module, and the X direction and the Y direction, which are the horizontal directions of the power module in FIG. 2, are the horizontal direction and the vertical direction of the power module, respectively.

Moreover, in the said invention , it is preferable that the said non-flat component consists of a substantially cylindrical shape (Claim 2 ).
In this case, the effect of the present invention can be effectively exhibited. That is, when a semiconductor element is mounted on a non-flat part having a substantially cylindrical shape, the problem of the dead space is remarkably generated. Therefore, when the present invention is applied to such a non-flat part, the formation of a dead space can be sufficiently suppressed and the power module can be reduced in size.

Further, the element mounting portion may be disposed on a side surface of the non-flat part .
In this case, since the semiconductor element can be disposed on the side surface while suppressing the formation of the dead space, the power module can be easily downsized.

Further, the non-flat component has a protrusion protruding from a central portion of the end face in the axial direction, and planarly extends from the peripheral edge of the top surface of the protrusion to the peripheral edge of the end face of the non-flat component. it is preferable that the mounting surface of the element mounting portion is disposed so as to be formed (claim 3).
In this case, since the space around the protrusion can be used effectively, the power module can be easily downsized.

The non-flat part is a rotating electrical machine .
In general, the power module is generally arranged adjacent to the rotating electrical machine in order to form a high voltage circuit together with the rotating electrical machine. Therefore, by applying the present invention to a configuration in which the power module is mounted on the rotating electrical machine, the effects of the present invention can be effectively exhibited .

( Reference Example 1 )
A power module according to a reference example of the present invention will be described with reference to FIGS.
The power module 1 of this example includes three or more semiconductor elements 2 and a heat radiating member 3 for radiating heat from the semiconductor elements 2.
In the power module 1, the three or more semiconductor elements 2 are dispersedly arranged in contact with three or more non-parallel mounting surfaces 30 provided on the heat radiating member 3.

The heat radiating member 3 of the power module 1 of this example is configured in a three-dimensional manner by combining the four mounting surfaces 30 in a non-parallel state.
As the semiconductor element 2 in the power module 1 of this example, for example, an IGBT element can be used. In this example, a total of eight semiconductor elements 2 are distributed and arranged on the four mounting surfaces 30 as a set of two.
And the back surface 20 of the semiconductor element 2 and the mounting surface 30 of the heat radiating member 3 are adhered to each other through, for example, grease (not shown).

In order to improve the heat dissipation efficiency with respect to the semiconductor element 2, the heat dissipation member 3 can be made of, for example, a metal material having excellent thermal conductivity such as aluminum.
Moreover, the heat radiating member 3 has a refrigerant flow path 32 through which a cooling medium such as water flows. The refrigerant flow path 32 is formed substantially parallel to the mounting surface 30 on which the semiconductor element 2 is mounted in the heat radiating member 3. Thereby, the heat of the semiconductor element 2 can be radiated to the cooling medium flowing through the refrigerant flow path 32 through the heat radiating member 3, and the entire semiconductor element 2 can be cooled substantially uniformly.
In addition, it is preferable that inclination | tilt angle (theta) with respect to XY plane of the mounting surface 30 of the thermal radiation member 3 which mounts the semiconductor element 2 is 45 degrees or more, for example.

Next, the function and effect of this example will be described.
Three or more semiconductor elements 2 are dispersedly arranged in contact with three or more non-parallel surfaces 30 provided on the heat dissipation member 3. According to such a configuration, the semiconductor elements 2 are arranged on the mounting surfaces 30 provided on the heat dissipation member 3 so as not to be parallel to each other with an angle. Therefore, not only one plane direction (X direction and Y direction in FIG. 1) in the power module 1 but also a height direction (Z direction in FIG. 2) orthogonal thereto is used as a space for mounting the semiconductor element 2. be able to. Therefore, the projection area projected in the height direction Z of the power module 1 can be reduced, and the physique of the power module 1 can be reduced.

  In particular, in the power module of this example, four semiconductor elements 2 are arranged in contact with four mounting surfaces 30. Therefore, it is possible to reduce both the vertical direction Y and the horizontal direction X on the projection surface. As a result, the physique of the power module 1 can be effectively reduced.

  As described above, according to this example, it is possible to provide a power module that can be effectively reduced in size.

( Reference Example 2 )
This example is an example of the power module 1 in which the semiconductor element 2 is mounted on the mounting surface 30 of the recess 301 provided in the heat dissipation member 3 as shown in FIG. That is, the heat dissipating member 3 of the power module 1 of this example has a recess 301 that is recessed in the −Z direction, and the semiconductor element 2 is mounted on the mounting surface 30 thereof.
The shape of the recess 301, the same manner as in Reference Example 1 has a non-parallel four mounting surface 30 are combined shapes, has a shape turned over the heat dissipation member 3 shown in Reference Example 1.
Others have the same configuration and operational effects as in Reference Example 1 .

( Reference Example 3 )
This example is an example of the power module 1 mounted on the side surface 401 of the substantially cylindrical rotating electric machine 4 as shown in FIG. Here, the side surface 401 of the rotating electrical machine 4 is a curved surface, that is, a non-flat surface, and the rotating electrical machine 4 is a non-flat part.
The heat dissipating member 3 has two element mounting portions 41 attached to the side surface 401 of the rotating electrical machine 4 in a non-parallel state.

The two semiconductor elements 2 are dispersed and arranged in contact with the plurality of element mounting portions 41 of the heat dissipation member 3.
The heat dissipation member 3 is disposed so as to cover the entire circumference of the side surface 401 of the rotating electrical machine 4. Two element mounting portions 41 are provided on a part of the outer periphery of the rotating electrical machine 4, and a plurality of semiconductor elements 2 are dispersed and closely arranged on the non-parallel mounting surfaces 30 in the element mounting portion 41. Has been.
Further, the heat radiating member 3 can radiate heat from the semiconductor element 2 and can also radiate heat from the rotating electrical machine 4.

Next, the function and effect of this example will be described.
The heat dissipating member 3 has a plurality of element mounting portions 41 attached to the non-flat surface 40 of the rotating electrical machine 4 in a non-parallel state, and the plurality of semiconductor elements 2 are dispersed in the plurality of element mounting portions 41. Are in contact with each other. According to such a configuration, it is possible to arrange the element mounting portion 41 of the heat radiating member 3 appropriately corresponding to the shape of the non-flat surface 40 of the rotating electrical machine 4. That is, when the heat dissipating member 3 having the flat element mounting portion 41 is arranged in the rotating electrical machine 4 and a plurality of semiconductor elements 2 are mounted on the flat element mounting portion 41, the rotating electrical machine 4 and the semiconductor element 2 are inevitably used. , A dead space (see reference sign D in FIGS. 10 and 11) is generated.

On the other hand, according to the above configuration, as described above, the element mounting portion 41 of the heat radiating member 3 can be disposed corresponding to the shape of the non-flat surface 40 of the rotating electrical machine 4 as appropriate. Formation of a space can be suppressed.
As a result, the semiconductor element 2 can be mounted on the heat dissipation member 3 while sufficiently suppressing the formation of dead space even when the number of mounted semiconductor elements 2 is increased, and the size of the power module 1 can be effectively reduced. Can do.

  Moreover, since the rotary electric machine 4 consists of a substantially cylindrical shape, the effect of this invention can be exhibited effectively. That is, when the semiconductor element 2 is mounted on the rotating electrical machine 4 having a substantially cylindrical shape, the problem of dead space is prominent. Therefore, when the present invention is applied to the rotating electrical machine 4, the dead space can be sufficiently suppressed to reduce the size of the power module 1.

  Moreover, since the heat radiating member 3 is arrange | positioned at the side surface 401 of the rotary electric machine 4, the effect of this invention can be exhibited more effectively. That is, since the semiconductor element 2 can be disposed on the side surface 401 while suppressing the formation of dead space, the power module 1 can be easily downsized.

  In this example, the non-flat part is the rotating electrical machine 4. In general, the power module 1 is often arranged adjacent to the rotating electrical machine 4 in order to form a high voltage circuit together with the rotating electrical machine 4. Therefore, by applying the present invention in a configuration in which the power module 1 is mounted on the rotating electrical machine 4, the effects of the present invention can be effectively exhibited.

  As described above, according to this example, it is possible to provide a power module that can be effectively reduced in size.

( Example 1 )
This example is an example of the power module 1 in which the semiconductor element 2 is disposed on the end surface 402 in the axial direction of the rotating electrical machine 4 as shown in FIG.
The end surface 402 has a protruding portion 43 protruding at the center portion. The protrusion 43 is a bearing of the rotating electrical machine 4.

  Further, the heat radiating member 3 is arranged adjacent to the protrusion 43. That is, the element mounting portion 41 is disposed so that the mounting surface 30 is formed in a plane from the peripheral portion 432 of the top surface 431 of the projection 43 to the peripheral portion 403 of the end surface 402 of the rotating electrical machine 4. And this element mounting part 41 is similarly arrange | positioned in the four-way position of the protrusion part 43, and has the mounting surface 30 which is mutually non-parallel.

As shown in FIG. 6, the element mounting portion 41 can also be provided on the side surface 401 of the rotating electrical machine 4, and the semiconductor element 2 can be arranged on the element mounting portion 41.
Others are the same as in Reference Example 3 .

The end surface 402 in the axial direction of the rotating electrical machine 4 has a protrusion 43, and the heat dissipation member 3 is disposed adjacent to the protrusion 43. Thereby, since the space around the protrusion 43 can be used effectively, the power module 1 can be reduced in size. That is, according to the above configuration, it is possible to reduce the dead space corresponding to the space indicated by the symbol E in FIG. Therefore, it is possible to effectively use the space around the protrusion 43 by arranging a peripheral member in the space E.
The other effects are the same as in Reference Example 3 .

The side view of the power module in the reference example 1. FIG. The top view of the power module in the reference example 1. FIG. The side view of the power module in the reference example 2 . The side view seen from the axial direction of the power module in the reference example 3 . (A) The side view of a power module in Example 1 , (b) The side view seen from the axial direction of the power module of (a). (A) The side view of another power module in Example 1 , (b) The side view seen from the axial direction of the power module of (a). The top view of the power module in a prior art example. The side view of the power module in a prior art example. The top view of the power module in a prior art example. The side view seen from the axial direction of the power module in a prior art example. The side view of the power module in a prior art example.

Explanation of symbols

1 Power Module 2 Semiconductor Element 3 Heat Dissipation Member 30 Mounting Surface

Claims (4)

And three or more semiconductor elements, a power module mounted to the rotary electric machine is non-planar part radiating a member possess, has a non-planar surface for performing the heat radiation of the semiconductor element,
The heat dissipating member has three or more element mounting portions attached to the non-flat surface of the non-flat component in a non-parallel state, and each of the element mounting portions is a flat surface on which the semiconductor element is mounted. A mounting surface
Power module, characterized in that the non-parallel three or more of the mounting surface with each other provided on the heat dissipation member, are brought into contact arranged by dispersing the three or more semiconductor elements. The power module according to claim 1, wherein the non-flat component has a substantially cylindrical shape . 3. The non-flat component according to claim 2, wherein the non-flat component has a protrusion protruding from a central portion of an axial end surface, and is planar from a peripheral portion of the top surface of the protrusion to a peripheral portion of the end surface of the non-flat component. Further, the power module is arranged so that the mounting surface of the element mounting portion is formed . 4. The power module according to claim 3, wherein the element mounting portion is also disposed on a side surface of the non-flat component .

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