JP4752684B2 - Heat sink mounting device and disk device using the same - Google Patents

Description

The present invention relates to a heat sink mounting device that is mounted to dissipate heat generated from electronic components such as an integrated circuit (IC) and a large scale integrated circuit (LSI) used in a disk device or the like.

  In recent years, DVD recorders capable of recording and reproducing information signals on DVDs have been required to increase the dubbing function from the HDD. However, the increase in the number of rotations of the disk due to the increase in speed, that is, rotation of the spindle motor that rotates the disk As the number increases, the amount of heat generated in the spindle motor drive circuit increases, and thermal shutdown tends to occur. Therefore, in order to prevent the occurrence of thermal shutdown, it has been performed to dissipate heat by attaching a heat sink to the electronic component.

A conventional heat sink will be described below. Conventionally, the heat sink has a structure in which the four corners of the heat sink are fixedly supported on the substrate by screws. The screws use two-stage screws, and a coil spring wound around the screw is screwed onto the tip of the screw. It is known that the heat sink is pressed and adhered with equal force to an electronic component mounted on a substrate by the elastic force of a coil spring by being sandwiched between the nut and the heat sink (for example, Patent Document 1). reference).
JP-A-5-243439

  However, in the above-described conventional configuration, coil springs and two-stage screws are used at the four corners of the heat sink, and there are problems that the number of component parts is large and the assemblability is poor.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and to provide a heat sink mounting apparatus having few components, good assembling to a substrate, and excellent heat dissipation.

In order to solve the above-described problems, a heat sink mounting apparatus according to the present invention is a heat sink mounting apparatus that is mounted to dissipate heat generated by an electronic component mounted on a substrate fixed to a structure. An elastic part provided at a part of the elastic part, a latching part provided at an opposing position across the position where the elastic part and the electronic component are crimped, and a notch part serving as a positioning part of the elastic part when the heat sink is attached And the structure has a contact portion provided so as to lock the elastic portion, and a projection portion provided so as to position the notch portion, and the heat sink includes the notch portion. locking the said elastic part on the abutting portion in a state of being positioned in the projecting portions, and locking the hook portion to the substrate, the so that to resiliently mounted holding on to the electronic component mounted on the substrate It is configured.

In the heat sink mounting device according to the present invention, the heat sink is configured at a position where the elastic portion and the latching portion are substantially symmetrical with respect to a holding position of the electronic component .

Moreover, the heat sink attachment device of the present invention is characterized in that the notch portion of the heat sink is provided in parallel with the attachment direction to the structure and the substrate when the heat sink is attached .

Further, the heat sink mounting device of the present invention includes a heat conductive rubber material provided on the electronic component, and the heat sink is configured to elastically mount and hold the rubber material in a compressed state. It is characterized by.

Further, the heat sink mounting device according to the present invention is characterized in that the heat sink is elastically held by the elasticity of the elastic portion and the compression of the rubber material .

Further, a disk apparatus characterized by comprising a heat sink mounting system of claim 1, wherein.

According to the heat sink mounting device having the above-described configuration, the elastic member can be attached only by locking one of the elastic portions with respect to the structure while the other latching portion is locked to the substrate, and the positioning portion is locked with the positioning portion. it is a position configuration that can crimp the electronic parts that are sandwiched between the parts, components less, it is possible to improve the assembling property to the substrate was excellent as Ru can contact the heatsink stably to electronic component An effect is obtained.

Further, according to the present invention, since the heat sink is configured at a position where the elastic portion and the latching portion are substantially symmetrical with respect to the holding position of the electronic component, the heat sink can be stably adhered to the electronic component. Has an effect.

Further, the present invention has an effect that the notch portion is provided in parallel with the mounting direction when the heat sink is mounted, so that the positioning during the assembly can be easily performed and the assemblability can be improved .

In addition, the present invention comprises a heat conductive rubber material on the electronic component, and the heat sink is configured to be elastically attached and held in a compressed state of the rubber material, so that the heat dissipation effect can be improved. In addition, the electronic component can be protected by absorbing variations in pressure applied to the electronic component by the heat sink .

Further, according to the present invention, the heat sink is configured to be elastically held by the elasticity of the elastic portion and the compression of the rubber material. Therefore , the variation in the pressure applied to the electronic component by the heat sink is absorbed, and the electronic component Can be protected.

According to the sixth aspect of the present invention, by using the heat sink mounting device for the disk device, it is possible to improve the assembling property of the disk device and to improve the heat dissipation effect, thereby further increasing the disk rotation speed. It has the effect of being able to.

Embodiments of the present invention will be described with reference to FIGS.

(Embodiment 1)
First, the configuration of the first embodiment of the heat sink mounting device of the present invention will be described with reference to FIGS. 1 and 2 Ri plan view and a sectional view der state of attaching the heat sink to the disk device, FIG. 1 shows a cross section of A-A section, Figure 2 shows a cross section of B-B section . Figure 3 is a plan view of a heat sink, Figure 4 shows a perspective view of a state of attaching the heat sink to the disk device. 1 to 4, reference numeral 1 denotes a heat sink. As a material for the heat sink, sheet metal or aluminum having high thermal conductivity is preferable. In the present embodiment, sheet metal is used. 1a is an elastic part of the heat sink 1, and in this embodiment, a leaf spring is used. 1b is a latching part for latching to a board | substrate and uses the hook of a U-shape bending in this Embodiment. Reference numeral 1c denotes a locking portion for locking to the end surface of the substrate, and is used as a position restriction in the Y direction when the heat sink 1 is attached and as a rotation stop when tightening a set screw. In this embodiment, it is bent at 90 °. Reference numeral 1d denotes a notch, which is used for positioning in the X direction when the heat sink 1 is attached, and is provided in parallel to the Y direction. Reference numeral 2 denotes a heat radiating rubber, for example, preferably a silicon rubber having a high thermal conductivity. In the present embodiment, a silicon rubber is used. 3 is a drive circuit (drive IC) of a spindle motor used for rotating the disk, and 4 is a substrate on which a drive IC 3 is mounted, and is fixed to a frame to be described later with a stop screw. Reference numeral 5 denotes a frame for fixing the substrate 4 and is made of, for example, sheet metal or resin. In particular, a sheet metal is preferable because it has high thermal conductivity. In the present embodiment, a sheet metal is used. 5a is an abutting portion with which the elastic portion 1a of the heat sink 1 abuts when the heat sink 1 is attached. Reference numeral 5b denotes a projection of the frame, which is provided in parallel to the Y direction in the figure, which is the mounting direction of the heat sink 1. When the heat sink 1 is mounted, it engages with the notch 1d of the heat sink 1 and is positioned in the X direction. Used as a detent when tightening the set screw. Reference numeral 6 denotes a set screw for fastening and fixing the substrate 4 and the heat sink 1 together to the frame 5 to prevent the heat sink 1 from being detached from the substrate 4 due to vibration or dropping of the apparatus, and to prevent the substrate 4 from being detached from the frame 5. To prevent.

In the mounted state of the disk device of the heat sink 1, always, the elastic portion 1a of the heat sink 1 flexes, elastic force for pressing the placed radiator rubber 2 on the drive IC3 The heat sink 1 is generated held in, it is configured to contact the heat sink 1 to the heat radiating rubber 2. For this purpose , the height from the surface of the hooking portion 1b of the heat sink 1 that contacts the lower surface of the substrate 4 to the surface of the heat sink 1 that contacts the heat radiating rubber 2 is set to the thickness of the substrate 4, the thickness of the drive IC 3, and the heat radiating rubber 2. The height of the surface of the elastic portion 1a that contacts the heat sink contact portion 5a is higher than the surface of the heat sink contact portion 5a that contacts the heat sink 1 It must be set so that it is always high before installation.

  Next, a method for assembling each component will be described with reference to FIG. FIG. 5 is a cross-sectional view taken along the line AA of FIG. 1 showing the process of assembling the heat sink in the first embodiment, and is assembled in the order of STEP1 to STEP3.

First, in STEP1, a state in which heat dissipation rubber 2 is placed on the predetermined drive mounted on the substrate 4 fixed to a position IC3 of frame 5. From this state, the elastic part 1a of the heat sink 1 is inserted inside the heat sink contact part 5a and pushed in the Y direction. At this time, the cutout portion 1d of the heat sink 1, so as to engage with the protrusion 5b of the frame 5, attaching the heat sink 1 while positioning. Further, at this time, by preventing the heat sink 1 from coming into contact with the heat radiating rubber 2, it is possible to prevent the positional deviation of the heat radiating rubber 2. Will insert from STEP1 state the heat sink 1 in the Y direction, the engaging portion 1b of the heat sink 1 has reached to the position caught by the lower surface of the substrate 4, ing and STEP2 state. In this state, the elastic portion 1a of the heat sink 1 is in contact with the inner side of the heat sink contact portion 5a, it begins to pressurize the heat dissipation rubber 2 by inserting further inside of the heat sink contact portion 5a while being elastically deformed. Further, when press the heat sink 1 in the Y direction from STEP2, engaging portion 1b is hooked on a substrate 4, it stops at an STEP3, mounting et be in a state of being crimped radiating rubber 2 by the heat sink 1. Thereafter, the heat sink 1, the substrate 4, and the frame 5 are fastened and fixed together with the retaining screw 6 as shown in FIGS. 1 to 3.

As described above, according to the first embodiment, by providing the heat sink 1 with the elastic portion 1a, the latching portion 1b, and the cutout portion 1d, the frame is formed on the cutout portion 1d when the heat sink 1 is attached to the substrate 4. 5 so that the protruding portion 5b is engaged, and the elastic portion 1a is inserted into the heat sink contact portion 5 so as to be in pressure contact with the lower portion of the substrate 4 so as to be hooked on the lower surface of the substrate 4. by pushing the, while crimping the heat sink 1 to the heat radiating rubber 2 and the electronic component 3 can be mounted Rukoto, it can be realized easily assembled by pushing in one direction only. Further, the heat of the heat sink 1 is transmitted from the heat sink contact portion 5a to the frame 5, so that the heat dissipation effect of the heat sink 1 can be enhanced, and the heat sink 1 can be miniaturized or the disk rotation speed can be further increased.

In addition, by holding the heat sink 1 with the elastic portion 1a and the latching portion 1b on both sides opposed to each other with the electronic component 3 interposed therebetween , it is possible to realize stable crimping of the heat sink 1 to the electronic component 3 and to withstand vibration. It can be.

(Embodiment 2)
FIG. 6 is a plan view and a cross-sectional view of a state in which the heat sink in Embodiment 2 of the present invention is attached to the disk device. In the figure, the same components as those in the first embodiment are given the same numbers, and the description thereof is omitted. In FIG. 6, reference numerals 2 to 5 are the same as those in FIG. A difference from the configuration of FIG. 1 is that the hooking portion 7 b of the heat sink 7 to the substrate 4 is formed at two locations on the rear portion of the heat sink 7. The CC cross section shows only one of the two hooking portions 7b, but the other hooking portion 7b has the same cross-sectional shape. By providing the latching portions 7b at two locations, the holding force of the heat sink 7 to the substrate 4 is improved, and fixing with a retaining screw is not necessary.

  In order to securely fix the heat sink 7 to the substrate 4 by the elastic portion 7a and the two latching portions 7b, the heat radiation rubber 2 of the heat sink 7 and the surface of the latching portion 7b that contacts the lower surface of the substrate 4 The height to the abutting surface is set to a value equal to or smaller than the sum of the thickness of the substrate 4, the thickness of the drive IC 3 and the thickness of the heat radiation rubber 2, and the heat sink abutting portion 5a of the elastic portion 7a. It is necessary to set the height of the surface to be in contact with the heat sink 7a of the heat sink contact portion 5a so that it is always higher than the surface to be in contact with the heat sink 7. In addition, although the shape of two latching | locking parts is made the same, a different shape may be sufficient respectively.

  The method of assembling the heat sink 7 according to the second embodiment having the above-described configuration is the same as that shown in FIG. 5, and the two hooking portions are hooked on the lower surface of the substrate 4 and tightened with a locking screw. The difference is that work is unnecessary.

  As described above, according to the second embodiment, the heat sink 7 is fixed to the substrate 4 by providing the heat sink 7 with two hook portions 7b to the substrate 4 and strengthening the fixing to the substrate 4. Therefore, it is possible to eliminate the need for a set screw, reduce the number of assembly steps for tightening the set screw, and achieve an inexpensive configuration.

  In the above description, the heat radiating rubber 2 is used, but the heat radiating rubber 2 is not used, and the heat sink 1 or the heat sink 7 may be directly crimped and fixed to the drive IC 3. In this case, it is necessary to reset the height dimensions of the elastic portion 1a or 7a and the latching portion 1b or 7b of the heat sink in consideration of the thickness of the heat radiation rubber 2. In the above description, the example in which the heat sink 1 or the heat sink 7 is attached to the drive IC 3 of the disk device has been described. However, it may be used for electronic parts of other products. The present invention is not limited to the embodiment described above.

The heat sink mounting device according to the present invention is useful for an electric product using a substrate on which electronic components with heat generation are mounted, and in particular, a disk that needs to be rotated at high speed, such as a DVD drive for a PC or a DVD recorder. Suitable for equipment.

The top view and sectional view which show the attachment state of the heat sink in Embodiment 1 The top view and sectional view which show the attachment state of the heat sink in Embodiment 1 Plan view of heat sink in embodiment 1 The perspective view which shows the attachment state of the heat sink in Embodiment 1. FIG. Sectional drawing which shows the process of the assembly of the heat sink in Embodiment 1 A plan view and a cross-sectional view showing a mounting state of the heat sink in the second embodiment

DESCRIPTION OF SYMBOLS 1 Heat sink 1a Elastic part 1b Hook part 1c Locking part 1d Notch part 2 Heat radiation rubber 3 Drive IC
4 Substrate 5 Frame 5a Heat sink contact portion 5b Projection portion 6 Stop screw

Claims (6)

A heat sink attachment device attached to dissipate heat generated by electronic components mounted on a substrate fixed to a structure,
  The heat sink includes an elastic portion provided at a part of an outer peripheral portion, a latching portion provided at an opposing position across the position where the elastic portion and the electronic component are crimped, and the elastic portion when the heat sink is attached. It has a notch that becomes the positioning part,
  The structure has a contact portion provided so as to lock the elastic portion, and a projection portion provided so as to position the notch,
  The heat sink is elastically placed on the electronic component mounted on the substrate by engaging the elastic portion with the contact portion and the latching portion with the substrate in a state where the notch is positioned on the protrusion. Heat sink mounting device configured to be mounted and held in an automatic manner. The heat sink mounting device according to claim 1, wherein the heat sink is configured at a position where the elastic portion and the hooking portion are substantially symmetrical with respect to a holding position of the electronic component. The heat sink attachment device according to claim 1, wherein the notch portion of the heat sink is provided in parallel with an attachment direction to the structure and the substrate when the heat sink is attached . Comprising a thermally conductive rubber material provided on the electronic component;
The heat sink attachment device according to claim 1, wherein the heat sink is configured to be elastically attached and held in a state where the rubber material is compressed . The heat sink mounting device according to claim 4, wherein the heat sink is configured to be elastically held by elasticity of the elastic portion and compression of the rubber material . A disk device comprising the heat sink mounting device according to claim 1.

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