JP4751140B2 - Printed circuit board design / printed circuit board production support system, judgment system - Google Patents

Description

  The present invention relates to a printed wiring board design support system and a printed circuit board production support system (hereinafter referred to as “printed wiring board design / printed circuit board production support system”) that can be adapted to environmental measures such as the abolition of designated hazardous substances. Is.

Conventionally, Sn—Pb solder has been used for joining printed wiring boards and electronic components. Moreover, most of the electrode plating of electronic parts was Sn-Pb plating products. Regarding the joining of Sn-Pb solder and component electrode Sn-Pb plated products, there are past evaluation data and use results, and even when newly producing printed circuit boards, pay attention to the heat resistance guarantee conditions and soldering conditions of the components. There was no problem if the process was set up by paying.
However, when the discarded printed circuit board is buried in the ground, the lead contained in the solder and the electronic components is melted by the influence of acid rain and the like, and the groundwater and the river are contaminated. It has been found that when lead is absorbed into the human body through contaminated groundwater, it has a negative effect on the human body. Currently, lead, cadmium, hexavalent chromium, mercury, and the like are listed as hazardous substances, and there is a movement to ban their use in products including printed circuit boards. Even chemical substances that are not listed as hazardous substances may be designated as hazardous substances in the future.
In addition, the following patent documents 1-4 are mentioned as a prior art document.
Patent Document 1 discloses a printed wiring board design support apparatus that reflects the process conditions for manufacturing a printed circuit board and lessons learned from previously occurring defect cases at the layout stage when designing the printed wiring board.
Patent Document 2 discloses a system for simulating the bonding reliability of lead-free solder and lead-free parts and evaluating the bonding quality.
Patent Documents 3 and 4 disclose techniques for managing the types and contents of harmful substances for each part in a database and utilizing them for environmental load calculation and the like.
JP 2001-196720 A JP 2001-358460 A Japanese Patent Laid-Open No. 2001-14366 JP 2002-259403 A

By the way, the conventional component database that supports printed wiring board design and printed circuit board production relates to component dimension data, reflow / flow / hand soldering, etc. and component heat resistance data. For this reason, there was no information about what kind of chemical substances were used for individual parts, and whether specified hazardous substances were contained. In order to acquire such information, it was in a state that would not be understood unless an inquiry was made to the parts manufacturer or the in-house parts jurisdiction. In such a situation, when trying to design printed circuit boards and printed circuit boards with parts that do not contain the specified hazardous substances, it is necessary to investigate the presence or absence of harmful substances in individual parts in advance. Takes a lot of time. As a result, there has been a drawback that the design of the printed wiring board and the production and shipment of the printed circuit board cannot be performed in a timely manner.
Moreover, the lead-free solder which does not contain lead has a higher melting point than the conventional Sn—Pb eutectic solder. The melting point of the conventional Sn-37Pb solder was 183 ° C., but the melting point of Sn-3Ag-0.5Cu, which is a typical lead-free solder, is 217 ° C., and the melting point increases by about 34 ° C. For this reason, especially when lead-free soldering is used to reflow solder the parts, the thermal load on the parts increases. Currently, some parts have improved heat resistance, but there are parts that cannot raise the heat resistance guarantee conditions. Even if there are multiple parts with the same function, the heat-resistance guarantee conditions may differ depending on the part. In addition to not including the specified hazardous substances, understand which part is best to select from the standpoint of heat-resistant parts. It was hoped that. However, since there is no tool that can easily grasp this, when trying to design a printed wiring board and produce a printed circuit board using parts that do not contain the specified hazardous substance, including part selection, process allocation, etc. There was a drawback that it took a lot of time.

In addition, when producing printed circuit boards that do not contain designated hazardous substances, it was necessary to pay attention to the joining of solder and components.
Furthermore, the composition and mixing ratio of lead-free solder can be selected, but electronic parts are purchased from outside the company, select parts that do not contain designated hazardous substances, and deliver parts that do not contain designated hazardous substances to the manufacturer. Although it is possible to work on it, it is necessary to leave it to the component manufacturer regarding the electrode plating specifications of the component. In fact, even the same parts manufacturer may have different electrode plating specifications depending on the product group and the like, and the lead-free plating specifications are diversified. Regarding the joining of lead-free solder and lead-free parts, the actual situation is that there is not yet sufficient evaluation data and use results.
Furthermore, it is expected that new lead-free electrode plating specifications will appear in the future. Regarding the joint reliability of lead-free solder and lead-free parts, there is no choice but to build up from the evaluation results and manufacturing results in the company, the evaluation results at the manufacturer, etc. However, no database has been established regarding the bonding reliability between lead-free solder and lead-free parts, and only certain persons can judge whether or not the lead-free electrode plating has good bonding and the need for evaluation. In addition, the company's manufacturing results with lead-free parts could not be grasped.
Therefore, the present invention has been made in view of the above points, and provides a printed wiring board design / printed circuit board production support system and a determination system that can be adapted to environmental measures such as the abolition of designated hazardous substances. Objective.

According to the first aspect of the present invention, there is provided a joint specification quality determination criteria database in which quality criteria for joint specifications of parts are registered, a manufacturer joint evaluation result database in which manufacturer evaluation results are registered, and parts having the same shape The same-shaped parts in-house manufacturing results database with registered in-house manufacturing results, the same-part in-house manufacturing results database with registered in-house manufacturing results for the same parts, and the joining reliability status with the criteria for joining reliability status registered When the data of the judgment standard database, the joint specification quality judgment standard database, the same part in-house manufacturing performance database, the manufacturer joint evaluation result database, and the same shape part in-house manufacturing performance database are updated, the joint reliability Based on the degree status criteria database, the joining reliability of the parts Determining means for determining status indicating, characterized in that and a junction reliability status database to register separately the status of the bonding reliability of the individual was determined part by said determining means.
The invention described in claim 2 is that the same parts in-house manufacturing results database and the same-shaped parts in-house manufacturing results database are registered in such a way that the in-house manufacturing results are classified according to the multi-stage status according to the production amount. Features.
A third aspect of the present invention is a printed wiring board design / printed circuit board production support system using the determination system according to the first or second aspect, wherein the selected component information registered in the selected component database and the component Display means for displaying the component placement of the printed circuit board from the component mounting position data in the printed circuit board registered in the mounting position database and the component outer size data and mass data registered in the component outer size / mass database; A heat resistance information database in which the heat resistance information for each part is registered, and information on the heat resistance information database and the joining reliability status database is displayed on the display unit in accordance with the component arrangement displayed on the display unit. It is characterized by.
According to a fourth aspect of the present invention, the heat resistance information registered in the heat resistance information database includes reflow heat resistance information, a restriction condition after opening the moisture-proof packing component, and a reflow mounting guarantee count.

  According to the present invention, any of the joint specification pass / fail judgment reference data, manufacturer joint evaluation result data, in-house manufacturing performance data of the same shape part (same joint specification), or in-house manufacturing performance data of the same part (same joint specification) When such data is updated, the data indicating the joint reliability of each part is collected, and the status representing the joint reliability is updated for each part by collating with the joint reliability status criteria database. To do. Therefore, anyone can easily grasp the latest data. In addition, since these processes are performed on the system, the status is automatically updated, so that it is possible to prevent human error that occurs when a person intervenes.

The best mode for carrying out the present invention will be described.
Note that the printed wiring board design support tool in the present embodiment refers to a layout CAD system. The printed circuit board production support tool is a CAM system.

[First Embodiment]
FIG. 1 is a diagram showing a configuration of a printed wiring board design / printed circuit board production support system according to a first embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 1 is configured by a computer from a database 101 in which designated hazardous substances are registered and a database 102 in which the contents of chemical substances targeted for individual electronic components are registered. The determination unit 201 determines the presence / absence of the designated harmful substance for each part, and the database 103 stores the determination result.
Specifically, the parts A, B, and C shown in FIG. 5 each contain the chemical substances shown in the table, but are shown in FIG. 6 by matching with the designated hazardous substance information data shown in FIG. As described above, the result of presence / absence of designated hazardous substances for each part is determined, and the result is stored.
The information data in the database 103 in which the presence / absence of the designated hazardous substance for each part is registered and the database 104 in which the heat resistance information data of the part is registered are used for the printed wiring board design support tool and the printed circuit board production support tool 701a. .
With this configuration, the presence / absence of designated hazardous substances and heat resistance information data of each electronic component are registered in the databases 103 and 104. Therefore, the presence / absence of designated hazardous substances and heat resistance information of each electronic component constituting the printed circuit board. Data can be acquired at the same time. Especially for printed circuit boards that completely abolish designated hazardous substances, it is possible to check the presence or absence of designated hazardous substances in parts to be mounted in advance during printed circuit board design and printed circuit board production, and to easily acquire heat resistance information data. It is possible to smoothly select parts, place parts on a printed wiring board, and set part processes when assembling a printed circuit board.

[Second Embodiment]
FIG. 2 is a diagram showing the configuration of a printed wiring board design / printed circuit board production support system according to the second embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 2 includes data in a database 101 in which specified hazardous substances are registered, and data in a database 102 in which the content of chemical substances targeted for each electronic component is registered. Therefore, in the determination unit 201 configured by a computer, the presence / absence of the designated harmful substance for each part is determined, and the determination result is stored in the database 103.
The data of the database 103 in which the presence / absence of designated harmful substances for each part is registered and the data in the database 105 in which the joint specifications of the parts are registered are utilized in the printed wiring board design support tool and the printed circuit board production support tool 701b. Yes.
With this configuration, the presence / absence of the designated hazardous substance and the joint specification of each electronic component are registered in the databases 103 and 105. Therefore, the presence / absence of the designated hazardous substance and the joint of each electronic component constituting the printed circuit board. You can get specifications at the same time. In particular, in printed circuit boards that completely abolish designated hazardous substances, it is possible to check the presence or absence of designated hazardous substances in parts to be mounted in advance during printed circuit board design and printed circuit board production, and to obtain joint specifications. It becomes possible to easily grasp the necessity of component selection and joint evaluation based on pass / fail results.

[Third Embodiment]
FIG. 3 is a diagram showing the configuration of a printed wiring board design / printed circuit board production support system according to the third embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 3 is configured by a computer from a database 101 in which designated hazardous substances are registered and a database 102 in which the contents of chemical substances targeted for individual electronic components are registered. The determination unit 201 includes a database 103 that determines the presence / absence of a designated hazardous substance for each part and stores the determination result.
Data of the database 103 in which the presence / absence of designated harmful substances for each part is registered, data in the database 104 in which heat resistance information data of parts is registered, and data in the database 105 in which joint specifications of parts are registered The printed circuit board production support tool 701c is utilized.
With this configuration, the presence / absence of designated hazardous substances, heat resistance information data, and joint specifications for each electronic component are registered in the database. Information data and joint specifications can be acquired simultaneously. In particular, in printed circuit boards that completely abolish designated hazardous substances, it is possible to check the presence or absence of designated hazardous substances in parts to be mounted in advance, and easily acquire heat resistance information data and joint specifications. It is possible to smoothly select the parts, place the parts on the printed wiring board, and set up the parts process when assembling the printed circuit board, and easily grasp the necessity for evaluating the joining of the parts.

[Fourth Embodiment]
FIG. 7 is a diagram for explaining a component heat resistance information database as a fourth embodiment of the present invention. In the database shown in FIG. 7, the peak temperature in reflow, the restriction temperature and time in the main heating, the restriction condition after opening the moisture-proof management component, the number of mounting (guaranteed), the peak temperature in the flow, the soldering MAX time, It is possible to register the peak temperature in manual soldering, the soldering MAX time, and other component-specific constraints.
If comprised in this way, since the heat-resistant specification of each electronic component is covered, a detailed heat-resistant specification can be acquired easily. This eliminates the need to check the heat-resistant description column of the delivery specification or make an inquiry to the manufacturer.
Here, the restriction temperature and time in the main heating in the reflow will be briefly described.
The main heating in the reflow indicates a region where the heat load is most applied to the component.
Not only the peak temperature but also the temperature and time in the main heating contribute to the damage of the parts. For this reason, it is necessary to limit the temperature and time in the main heating.
In the database shown in FIG. 7, the restriction temperature corresponds to the main heating temperature, and the restriction time corresponds to the main heating time.
A specific example is shown by the reflow temperature profile of FIG. Here, as an example of the restriction temperature and time of the main heating, the regulation is within 230 ° C. and 40 seconds.

[Fifth Embodiment]
FIG. 9 is a diagram showing a configuration of a determination system according to the fifth embodiment of the present invention.
As shown in FIG. 9, the heat resistance information data is stored in the database 104 by using a tool 301 for inputting / editing the heat resistance information data for a part whose new registration or heat resistance specification is changed. From the data of the component heat resistance information database 104 and the data of the heat resistance status determination criterion database 106 in which the criteria and status for determining the superiority or inferiority of the heat resistance are defined, the determination unit 202 configured by a computer determines the heat resistance status of the component. And store it in the database 107.
FIG. 10 is a diagram showing a specific example of the criterion for determining the heat resistance information status.
In FIG. 10, heat resistance statuses are individually provided for the following three items.
・ Reflow peak temperature, restriction temperature / time ・ Restriction condition after opening of moisture-proof packing parts ・ Number of times of mounting For example, the heat resistance status shown in FIG. 11 is assigned to parts AA and BB shown in FIG. It is done.
By configuring in this way, the detailed heat resistance conditions of individual parts are matched against a database in which the heat resistance status and the heat resistance conditions defining the heat resistance status are registered. Because it is added, it is possible to easily grasp the superiority or inferiority of heat resistance and the suitability for lead-free without checking the detailed data of component heat resistance. In addition, since the status is automatically assigned on the system, it is possible to prevent an artificial mistake that occurs when a person intervenes.

[Sixth Embodiment]
FIG. 12 is a diagram for explaining a component joint specification database as a sixth embodiment of the present invention. The database shown in FIG. 12 includes an electrode base material and plating specifications. Regarding plating, composition, blending ratio, and thickness can be registered for each layer configuration.
If comprised in this way, since the junction part specification of each electronic component is covered, it can acquire a junction part specification easily. As a result, there is no need to confirm the joint specification description column of the delivery specification or to make an inquiry to the manufacturer.

[Seventh Embodiment]
FIG. 13 is a diagram showing a configuration of a determination system according to the seventh embodiment of the present invention.
The determination system shown in FIG. 13 stores the joint specification in the database 105 by using the tool 302 for inputting / editing the joint specification for a part that is newly registered or whose joint specification is changed. From this component joint specification database 105 and the joint quality judgment reference database 108, the judgment of the joint specifications of this part is performed by the judgment unit 203 by a computer and stored in the database 109.
FIG. 14 is a diagram showing a specific example of the joint specification pass / fail judgment criterion and status.
For example, the joint specification determination and status of a part whose joint specification is the base material: Fe-42Ni, the surface layer plating composition and the blending ratio: Sn-3Bi, and the thickness: 10 μm are ◯.
If comprised in this way, the joint part specification of a part with which the specification of a new part and a joint part is changed will be matched with the database 108 with which the joint part specification quality determination criteria were registered, and the joint part quality of the part will be evaluated. Since the necessity is automatically determined, anyone can easily grasp the determination result. In addition, since these processes are performed on the system, it is possible to prevent human error that occurs when a person checks the joint specifications for each part and determines whether or not the joint evaluation is necessary. Become.

[Eighth Embodiment]
FIG. 15 is a diagram showing a configuration of a determination system according to the eighth embodiment of the present invention.
The determination system shown in FIG. 15 includes data in the database 105 in which the joint specifications of parts to be newly registered or whose joint specifications are changed, data in the joint quality judgment reference database 108, and manufacturer joint evaluation for each part. Data in the result database 110 and data in the in-house manufacturing performance database 111 of the same shape parts (same joint specifications) are once collected in the data collection unit 401. From the database 113 in which the collected data and the joining reliability status judgment criteria are registered, the judgment unit 204 configured by a computer performs judgment of the joint specification reliability status, and saves it in the joining reliability status database 114 for each part.
FIG. 16 is a diagram showing a specific example of the criterion for determining the joint reliability status.
Here, the connection reliability status is individually provided for the following three items.
-Joining evaluation results at the manufacturer-In-house manufacturing results of the same shape parts (same joint specifications)-In-house manufacturing results of the same parts (same joint specifications) For example, parts AA and BB shown in FIG. 17 are shown in FIG. A joint reliability status is assigned.
Note that the eighth embodiment is a part for which new registration or joint specification is changed, and there is no in-house manufacturing record of the same part (same joint specification). For this reason, in FIG. 15, the in-house manufacturing performance database of the same parts (same joint specifications) is deleted.
With this configuration, for each part's joint specifications, the part specifications can be determined from the joint specification pass / fail judgment reference data, manufacturer joint evaluation result data, and in-house manufacturing performance data of the same shape part (same joint specification). Therefore, it is possible to easily grasp the joining reliability of the component without checking the details of the joint specification of the component. In addition, since the status is automatically assigned on the system, it is possible to prevent an artificial mistake that occurs when a person intervenes.

[Ninth Embodiment]
FIG. 18 is a diagram showing a configuration of a determination system according to the ninth embodiment of the present invention.
The determination system shown in FIG. 18 uses the tool (input / editing means) 303 for inputting / editing the joint specification pass / fail judgment criteria to input the joint specification pass / fail judgment criteria registered in the joint specification pass / fail judgment database 108. Update. Based on the joint specification quality determination reference database 108 and the joint specification database 105 of each component, a determination unit (determination means) 203 configured by a computer determines the joint specification quality of each component and updates the database 109. .
If comprised in this way, when the junction specification quality determination criteria data is changed, the joint specification quality of each component and Because the necessity of evaluation is updated, anyone can easily grasp the latest data. In addition, since these processes are performed on the system, humans check the joint specifications for each part and prevent human errors that occur when re-determining whether the joint specifications are good or not and whether or not the evaluation is necessary. be able to.

[Tenth embodiment]
FIG. 19 is a diagram showing a configuration of a determination system according to the tenth embodiment of the present invention.
The determination system shown in FIG. 19 includes the joint specification pass / fail judgment reference data in the joint specification pass / fail judgment reference database 108, the manufacturer joint evaluation result in the manufacturer joint evaluation result database 110, and the same shape parts (the same joint in the in-house manufacturing performance database 111). Part data) and in-house production result data 112 of the same part (same joint specification) in-house production result data 112, all the data and the joint specification of each part are updated. Is temporarily collected in the data collection unit 401.
Then, from the data collected in the data collection unit 401 and the data in the database 113 in which the joining reliability status judgment criterion is registered, the judgment unit 204 configured in the computer performs the joint part specification reliability status judgment processing, The bonding reliability status database 114 is updated.
If comprised in this way, the joint specification quality judgment reference data, the manufacturer joint evaluation result data, the in-house manufacturing performance data of the same shape part (same joint specification), the in-house manufacturing performance data of the same part (same joint specification) When any of the data is updated, the data and the joint specifications of each part are collected, and the status indicating the joint reliability for each part is obtained by matching the joint reliability status criteria database. Update. Therefore, anyone can easily grasp the latest data. In addition, since these processes are performed on the system, the status is automatically updated, so that it is possible to prevent human error that occurs when a person intervenes.

[Eleventh embodiment]
FIG. 20 is a diagram showing the configuration of a printed wiring board design / printed circuit board production support system according to the eleventh embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 20 determines whether or not the printed circuit board component configuration data 115, 115 ′, the designated hazardous substance presence / absence database 103 of each part, and the designated hazardous substance are completely abolished. An input tool (input means) 304 is provided.
When the tool 304 specifies that the designated hazardous substance is to be abolished, a selection unit (first selection unit) 205 configured by a computer performs a process of selecting only parts that do not contain the designated hazardous substance, Once stored in the data storage unit 501.
Then, from the data stored in the data storage unit 501 and the joint specification quality determination database 109 or the joint reliability status database 114 of each component, a selection unit (second selection unit) 206 configured by a computer performs joint specification. As a result, a process for selecting a non-impossible part is performed, and the selected part is stored in the database 116a.
The printed circuit board component configuration 115 represents the component configuration data before the printed wiring board design. The printed circuit board component configuration 115 ′ represents the component configuration data before the printed circuit board production.
FIG. 21 is a diagram showing the specifics of the component configuration data before the printed wiring board design, and FIG. 22 is a diagram showing the specifics of the component configuration data before the printed circuit board production.
By configuring in this way, it is possible to automatically select only parts that do not contain the specified hazardous materials and are not impossible for the joint specification if the printed circuit board is designated as a target for the abolition of specified hazardous substances. For this reason, even when there are a plurality of parts having the same function, it is not necessary to individually check the parts joint specification. In addition, since these processes are performed on the system, it is possible to prevent human error that occurs when a person intervenes.

[Twelfth embodiment]
FIG. 23 is a diagram showing the configuration of a printed wiring board design / printed circuit board production support system according to the twelfth embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 23 is the same as in the eleventh embodiment until the selection unit 206 performs a process of selecting a part other than the unusable part as the joint specification. Is done. Then, the parts selected by the selection unit 206 are temporarily stored in the data storage unit 502, and the stored data and the data of the heat resistance status database 107 are used to perform heat resistance in a selection unit (third selection unit) 207 that is also configured by a computer. The difference is that a process for preferentially selecting a part having excellent properties is performed, and the selected part is stored in the database 116b.
With this configuration, priority is given to parts with excellent heat resistance from among the parts that do not contain designated hazardous materials and cannot be specified as joint specifications for printed circuit boards that completely eliminate designated hazardous substances. Since it can be selected, even if there are multiple parts with the same function, there is no need to individually check the heat resistance specifications of the parts. In addition, since these processes are performed on the system, it is possible to prevent human error that occurs when a person intervenes.

[Thirteenth embodiment]
FIG. 24 is a diagram showing the configuration of a printed wiring board design / printed circuit board production support system according to the thirteenth embodiment of the present invention.
In the printed wiring board design / printed circuit board production support system shown in FIG. 24, the selection unit 207 performs processing for preferentially selecting a part having excellent heat resistance, and stores the selected part in the data database 116b. Up to this point is the same as in the twelfth embodiment. For the components selected by the selection unit 207, the component mounting position database 117 of the printed circuit board, the database 118 of the component external size and mass, and the heat resistance information database 104 are matched with the component arrangement of the printed circuit board. The heat distribution and heat resistance information data of the parts are displayed by the display means 601a.
FIG. 25 shows a display example of heat resistance information data. In FIG. 25, (a) shows the reflow heat resistance guarantee condition, (b) shows the constraint condition after opening the moisture-proof packing parts, and (c) shows the number of reflow mounting (guarantee).
With this configuration, the heat resistance guarantee information data of the parts can be displayed on a personal computer or the like according to the arrangement of the parts on the printed circuit board, so that anyone can easily grasp the heat resistance distribution of the parts and the heat resistance information data. With this information data, it is possible to examine the mounting arrangement from the component heat resistance guarantee temperature in the design stage of the printed wiring board. In particular, for a double-sided reflow-assumed substrate, the component placement surface can be examined from the restriction time after opening the moisture-proof package and the mounting frequency data.
Also, in the printed circuit board production stage, before measuring the reflow temperature profile, it is possible to easily grasp the mounting location of the low heat resistant component that must be added. In addition, the process distribution work can be performed smoothly.

[Fourteenth embodiment]
FIG. 26 is a diagram showing a configuration of a printed wiring board design / printed circuit board production support system according to the fourteenth embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 26 performs processing for preferentially selecting a part having excellent heat resistance in the selection unit 207, and until the selected part is stored in the data database 116b. This is the same as in the twelfth embodiment. For the components selected by the selection unit 207, the component mounting position database 117 of the printed circuit board, the database 118 in which the component external size and mass are registered, the joint reliability status database 114, or the joint specification database 105 are stored. The data is displayed on the display means 601b in accordance with the arrangement of components on the printed circuit board and the bonding reliability or the joint specification.
FIG. 27 shows a display example of the bonding reliability.
By configuring in this way, it is possible to display the joining reliability information data of the parts and the joint specifications on the PC etc. according to the placement of the parts on the printed circuit board, so anyone can easily grasp the joining reliability information data of the parts. I can do it. Further, this information data makes it possible to determine whether or not a joint evaluation is necessary and to confirm items to be produced at the stage before designing a printed wiring board or the stage before producing a printed circuit board.

[Fifteenth embodiment]
FIG. 28 is a diagram showing a configuration of a printed wiring board design / printed circuit board production support system according to the fifteenth embodiment of the present invention.
In the printed circuit board design / printed circuit board production support system shown in FIG. 28, a printed circuit board component mounting position database 117, a component 118 size and mass registered database 118, a reflow profile measurement position, and a measurement result are registered. The simulation 208 of the package surface temperature / lead portion temperature of each component mounted on the printed circuit board is performed from the data in the database 119, and the result is stored in the library 120. From the result and the data of the heat resistance information database 104, the extraction unit 209 configured by a computer performs extraction processing of a part that does not satisfy heat resistance or a part that does not satisfy soldering standards, and the extracted part cannot be reflow mounted. Saved in the component extraction database 121.
If configured in this way, the temperature distribution of the entire component is simulated from the reflow profile measurement results at several locations, the component mounting position data of the printed circuit board, the external size and mass data of the component, and the heat resistance guarantee condition of the component is matched. By doing so, it is possible to easily assume the configuration of parts that cannot be reflow-mounted, and the process can be distributed smoothly. In addition, since these processes are performed on the system, it is possible to prevent human error that occurs when a person checks the reflow profile and the heat resistance guarantee condition of each simulated part one by one.

[Sixteenth Embodiment]
FIG. 29 is a diagram showing a configuration of a printed wiring board design / printed circuit board production support system according to the sixteenth embodiment of the present invention.
The printed wiring board design / printed circuit board production support system shown in FIG. 29 is the same as that in the fifteenth embodiment until the extraction unit 209 extracts components that do not satisfy heat resistance or components that do not satisfy soldering standards. Is done. In this case, the data extracted by the extraction unit 209 is temporarily stored in the data storage unit 503, and the accumulated data, the assembly cost database 122 for each process of each part, the assembly quality database 123 for each process, and other assembly related information data databases are stored. Based on the data 124, the optimal part process distribution simulation is performed in the simulation unit 210 configured by a computer, and the result is stored in the optimal part process distribution database 125.
With this configuration, when there are multiple candidate component configurations that cannot be reflowed and obtained by simulation, the optimal component process distribution is automatically performed by matching with assembly cost, assembly quality, and other assembly-related information data. Therefore, process setting can be easily performed.
In addition, since these processes are performed on the system, it is possible to prevent human error that occurs when a person intervenes.

The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 1st Embodiment of this invention. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is 2nd Embodiment. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is 3rd Embodiment. The figure which showed an example of designated hazardous substance information data. The figure which showed an example of the chemical substance contained in components. The figure which showed an example of the determination result of the presence or absence of the designation | designated harmful substance of components. The figure for demonstrating a component heat-resistant information database as the 4th Embodiment of this invention. The figure which showed the reflow temperature profile. The figure which showed the structure of the determination system which is the 5th Embodiment of this invention. The figure which showed the specific example of the criterion of heat-resistant information status. The figure which showed the example of allocation of heat-resistant information status. The figure for demonstrating a component junction part specification database as the 6th Embodiment of this invention. The figure which showed the structure of the determination system which is the 7th Embodiment of this invention. The figure which showed the specific example of the junction specification quality determination criteria and status. The figure which showed the structure of the determination system which is the 8th Embodiment of this invention. The figure which showed the specific example of the determination criterion of joining reliability status. The figure which showed the example of allocation of junction part reliability status. The figure which showed the structure of the determination system which is the 9th Embodiment of this invention. The figure which showed the structure of the determination system which is the 10th Embodiment of this invention. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 11th Embodiment of this invention. The figure which showed the specific of the component structure data of the stage before a printed wiring board design. The figure which showed the concrete of the component structure data in the stage before printed circuit board production. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 12th Embodiment of this invention. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 13th Embodiment of this invention. The figure which showed the example of a display of heat-resistant information data. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 14th Embodiment of this invention. The figure which showed the example of a display of joining reliability. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 15th Embodiment of this invention. The figure which showed the structure of the printed wiring board design / printed circuit board production support system which is the 16th Embodiment of this invention.

Explanation of symbols

101 Designated hazardous substance database, 102 Chemical substance content database for each part, 103 Designated hazardous substance presence / absence database for each part, 104 Heat resistance information database for each part 105 Joint specification database for each part, 106 Heat resistance status criteria database, 107 parts Heat-resistant status database for each, 108 joint specifications pass / fail judgment criteria database, 109 joint specifications pass / fail judgment database for each part, 110 manufacturer joint evaluation result database for each part, 111 in-house manufacturing results of parts with the same shape (same joint specifications) Database, 112 In-house manufacturing performance database of the same parts (same joint specifications), 113 Joint reliability status judgment reference database, 114 Joint reliability status database for each part, 115 Pre-printed wiring board design stage Component configuration database, 115 ′ Printed circuit board pre-production part configuration database, 116a, 116b Selected component storage database, 117 Printed circuit board component mounting position database, 118 Component external size / mass database, 119 Reflow profile measurement position and measurement Result database, 120 Reflow profile simulation result library for each part, 121 Reflow unmountable parts extraction database, 122 Assembly cost database for each part process, 123 Assembly quality database for each part process, 124 Other assembly related information database for each part 125 Optimal part process distribution storage database, 201-204 determination unit, 205-207 selection unit, 208, 210 simulation unit, 209 extraction unit, 301- 03 input and editing tool, 304 input tool, 401 data acquisition unit, 501 to 503 data storage unit, 601a, 601b display unit, 701a, 701b, 701c printed circuit board design support tool, printed circuit board production support tool

Claims (4)

  A joint specification pass / fail judgment criteria database in which the joint judgment specifications of parts are registered, and
  Manufacturer joint evaluation result database in which manufacturer joint evaluation results are registered,
  Same-shaped parts in-house production results database where in-house production results of identical-shaped parts are registered,
  The same parts in-house manufacturing results database where the in-house manufacturing results of the same parts are registered,
  Joining reliability status judgment criteria database in which judgment criteria for joining reliability status are registered,
  When the data of the joint specification pass / fail judgment reference database, the same part in-house manufacturing performance database, the manufacturer joint evaluation result database, and the same shape part in-house manufacturing performance database are updated, the joint reliability status judgment reference database A determination means for determining a status representing a joining reliability of the component,
  A joining reliability status database for classifying and registering the joining reliability status for each component determined by the determining means;
A determination system characterized by comprising:   The said same parts in-house manufacturing performance database and the said same shape parts in-house manufacturing performance database are classified and registered according to a multi-stage status according to a production amount, and are registered. Judgment system.   A printed wiring board design / printed circuit board production support system using the determination system according to claim 1 or 2,
  Information on the selected component registered in the selected component database, component mounting position data on the printed circuit board registered in the component mounting position database, and component outer size data and mass data registered in the component outer size / mass database And display means for displaying the component arrangement of the printed circuit board,
  A heat resistance information database in which the heat resistance information for each part is registered,
  A printed wiring board design / printed circuit board production support system characterized in that information on the heat resistance information database and the joining reliability status database is displayed on the display means in accordance with the component arrangement displayed on the display means.   4. The printed wiring board design / printing according to claim 3, wherein the heat resistance information registered in the heat resistance information database includes reflow heat resistance information, a constraint condition after opening the moisture-proof packing component, and the number of reflow mounting guarantees. Circuit board production support system.

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