JP4722658B2 - Electronic component mounting device - Google Patents

Description

  The present invention provides a mounting head that can be moved up and down, turns on a vacuum valve, and vacuum-sucks and removes an electronic component from an electronic component supply device from a suction nozzle provided on the mounting head. The present invention relates to an electronic component mounting apparatus configured to mount air on a printed board by blowing air from the suction nozzle holding the electronic component by suction.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In a general electronic component mounting device, when a rotary shaft rotates a predetermined angle by an index unit that intermittently rotates a rotary table, an angle detection signal from the cam switch is sent to the control device, and the control device that receives this rotates the suction nozzle. When a predetermined signal is sent to the drive control circuit of the drive motor to be driven, the drive control circuit sends an on / off signal to the vacuum valve to take out the electronic component by vacuum suction using the suction nozzle or hold the electronic component by suction. Control is performed so that air is blown out from the suction nozzle and mounted on the printed circuit board.
JP 2004-112003 A

  However, when the angle detection signal is sent from the cam switch to the control device, the predetermined signal is sent from the control device to the drive control circuit, or the on / off signal is sent from the drive control circuit to the vacuum valve, each signal arrives. Therefore, there is a problem that the electronic component cannot be taken out from the electronic component supply device or the electronic component is not properly mounted on the printed circuit board.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that can perform on / off switching control of a vacuum valve without delay and without variation.

For this reason, the first invention provides a mounting head that can be moved up and down, opens the vacuum valve, and vacuum-sucks and extracts the electronic component from the electronic component supply device from the suction nozzle provided in the mounting head. In an electronic component mounting apparatus which is closed and mounted on a printed circuit board by blowing air from the suction nozzle holding the electrical component by suction, it detects that the mounting head has reached a specific position when lowered. An electronic component that includes a detection sensor and that detects that the detection sensor has reached the specific position when the mounting head is lowered is separate from the main control device provided on the fixed side of the electronic component mounting device. provided on the movable side of the mounting device the main control unit electrically connected to the control device of the local control in the substrate receives are in the predetermined time after b Controller in the local control board and adjusting according to the weight or size of at least part of the predetermined time controls to switch the opening and closing of the vacuum valve.

According to a second aspect of the present invention, a mounting head that can be moved up and down is provided, the vacuum valve is opened , an electronic component is vacuum-sucked from an electronic component supply device by a suction nozzle provided in the mounting head, and the vacuum valve is closed. In the electronic component device that is mounted on the printed circuit board by blowing air from the suction nozzle that holds the electrical component by suction, the scale on the scale is read according to the height of the mounting head. A movement signal indicating that the mounting head is lowered by a predetermined distance from the reading head is provided on the movable side of the electronic component mounting device separately from the main control device provided on the fixed side of the electronic component mounting device. control apparatus for local control substrate to which it is connected receives a heavy least part of the predetermined distance together with the control device switches the opening and closing of the vacuum valve Or and adjusting according to the size.

  According to the present invention, switching control of opening and closing of the vacuum valve can be performed without delay and without variation.

  Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. 1 and 2, reference numeral 100 denotes an automatic mounting apparatus for chip-shaped electronic components. The electronic component automatic mounting apparatus 100 includes an electronic component supply section 101, a take-out section 102, and a mounting section 103.

  First, the electronic component supply section 101 will be described. The electronic component supply section 101 has a component supply base 1, and a ball screw 5 is screwed to the supply base 1 via a nut 3. The ball screw 5 is connected to a feed motor 7 through a coupling 6. When the ball screw 5 is driven by the feed motor 7, the component supply base 1 is guided by a pair of linear guides 9, 9. It is designed to reciprocate in the direction. The component supply base 1 is provided with a plurality of component supply devices 11, and the component supply device 11 is provided with a lever 13 (FIG. 1).

  The lever 13 is engaged with a lift lever 15 that is interlocked with the operation of an index unit 83 described later. When the lift lever 15 moves up and down, the lever 13 swings. When the lever 13 swings, the tape wound around the tape reel 17 is fed out toward the take-out section 102, and the chip-like component housed in the tape from which the cover tape is peeled off is the component suction position I of the take-out section 102. (Fig. 2).

  The take-out section 102 includes a rotary table 21 (FIG. 1) capable of intermittent rotation, and a plurality of mounting heads 23, 23... 23 are attached to the outer peripheral portion of the rotary table 21 at equal intervals. .

  Each mounting head 23 is fixed to the lower end of a head lifting table 26, and the head lifting table 26 is fixed to a pair of rails 28. The pair of rails 28 is supported by a nut member 27 fixed to the outer peripheral portion of the rotary table 21 so as to be movable up and down. A mounting plate 25 is attached to the upper end of the head lifting table 26. The mounting plate 25 extends upward, and a pair of cam followers 29 are attached to the upper end portion 25a.

  The pair of cam followers 29 sandwich the cylindrical rib cam 31 fixed to the outer periphery of the support base 30 from above and below, and are fixed to the mounting plate 25 via the head lifting table 26 when the rotary table 21 described above rotates. The mounting head 23 rotates integrally with the above-described rotary table 21 while moving up and down according to the profile of the cylindrical rib cam 31 via the cam follower 29.

  Although the cylindrical rib cam 31 is not shown in the figure, two places are cut, and when a pair of cam followers 29 get into one of the two places, the cams not shown in the figure drive the lifting body through the cutting places. 32 is moved up and down, and the mounting head 23 is moved up and down integrally with the lifting body 32.

The above-mentioned two places refer to FIG. 2 for component adsorption position I and mounting position I of the electronic component.
The mounting head 23 moves up and down to take out the supplied electronic component at the suction position I, and the mounting position III is used to mount the electronic component taken out on the printed board 79 as described later. The mounting head 23 moves up and down.

  As shown in FIG. 3, the mounting head 23 includes a pulse motor 39 including a stator 35 and a rotor 37 fitted therein via a bearing 36, and the mounting head 23 itself is provided by the pulse motor 39. It is formed to be rotatable.

  Permanent magnets 43 are embedded in the outer periphery of the rotor 37 over the entire circumference, and iron cores 45 magnetized by the permanent magnets 43 are provided on the upper and lower sides of the permanent magnets 43 so as to have unevenness in the circumferential direction. Yes. In addition, an iron core 47 is provided on the inner periphery of the stator 35, and protrusions are formed on the iron core 47 at appropriate intervals in the circumferential direction. A coil 49 is wound around the protrusions. Yes.

  As will be described in detail later, the coil 49 is supplied with a pulse current from the drive unit 200 disposed above the rotary table 21, and this pulse current is supplied to the iron core 45 magnetized in the permanent magnet 43. A repulsive force is generated between the protrusion 37 and the rotor 37 constituting the mounting head 23, thereby rotating by a predetermined angle according to the number of pulses of the pulse current.

  In the rotor 37 constituting the mounting head 23, six suction nozzles 51 (only two are illustrated) are provided so as to be movable up and down at equal intervals in the circumferential direction and vertically. Each suction nozzle 51 is provided with a vacuum suction hole 53, and this vacuum suction hole 53 communicates with a horizontal hole 55 of the suction nozzle 51 on the way, and this horizontal hole 55 corresponds to the vertical position of the suction nozzle 51. It communicates with the vacuum chamber 57 at the center of the rotor 37 through the communication hole 56.

  Specifically, the horizontal hole 55 communicates with the vacuum chamber 57 via the communication hole 56 at the position of the right nozzle 51 in the figure, and the horizontal hole 55 is at the position of the vacuum chamber 57 at the position of the left nozzle 51 in the figure. No communication with 57. The vacuum chamber 57 is connected to a vacuum tube 59 (FIG. 1) through a hole 58 formed in the rotor 37, and the vacuum tube 59 is connected to a vacuum generator (not shown).

  An engaging body 61 is integrally formed at the upper end of the suction nozzle 51, and the engaging body 61 is biased downward via a spring 62. An upper end 61 a of the engaging body 61 can be engaged with a lower end 63 a of the lever 63, and the lever 63 is connected to a fixing portion 37 a that integrally extends upward from the rotor 37 via a pin 65. The upper end of the lever 63 is urged outward by a spring 67, and the engagement force between the engagement body 61 and the lever 63 is held by this urging force.

  Next, the operation will be described. When the suction nozzle 51 (the nozzle on the right side in the drawing) reaches the suction position I of the take-out section 102 as the rotary table 21 rotates, the rotation of the rotary table 21 is temporarily stopped, and the mounting head 23 as described above. Is lowered, and the chip-shaped component 300 is sucked to the tip of the suction nozzle 51. At this time, since the horizontal hole 55 of the suction nozzle 51 communicates with the vacuum chamber 57 via the communication hole 56, a vacuum is generated in the vacuum suction hole 53. When the chip-shaped component 300 is sucked, the mounting head 23 is raised and the rotary table 21 is rotated again.

Referring to FIG. 2, when the mounting head 23 that has sucked the chip-shaped component 300 reaches the component recognition position II as the rotary table 21 rotates, the component recognition device 69 is activated, and the chip-shaped component with respect to the suction nozzle 51 is activated. A positional deviation of the component 300 is recognized. If the position of the chip-shaped component 300 is displaced, the displacement is corrected in any section up to the mounting position III. The description of this correction section is omitted together with the illustration.

After the mounting head 23 that has adsorbed the chip-like component 300 corrects the positional deviation and then reaches the mounting position III along with the rotation of the rotary table 21, the rotation of the rotary table 21 is stopped, and the mounting head as described above. 23 is lowered, and the chip-like component 300 at the tip of the suction nozzle 51 is mounted on a printed circuit board 79 of a mounting section 103 to be described later.

When the chip-shaped component 300 is mounted on the printed circuit board, the rotary table 21 rotates and is sent to the next station of the mounting position III, where the mounting head 23 is lowered and is attracted to a contact table (not shown). The tip of the nozzle 51 hits, the suction nozzle 51 is pushed up, the lower end of the engaging body 61 engages with the lower end 63a of the lever 63, and the suction nozzle 51 is held like the suction nozzle 51 on the left side in FIG. Is done.

  Referring to FIG. 2, the mounting section 103 is moved in the Y direction by the Y axis motor 71 and moved in the X direction by the X axis motor 75 on the Y table 72. As a result, the mounting section 103 is moved in the XY direction. And an XY table 77 that moves. On this XY table 77, a printed circuit board 79 coated with an adhesive is supplied from an adjacent supply unit (not shown), and the chip-shaped electronic component 300 is mounted on this printed circuit board 79.

  Further, according to this embodiment, the drive unit 200 for driving the pulse motor 39 of the mounting head 23 is arranged together above the rotary table 21 as shown in FIGS. As shown, electrical wiring is routed using a single motherboard 210.

  That is, the output shaft 81 of the rotary table 21 extends upward through the index unit 83 as shown in FIG. 1, and is fixed to the end portion 81a of the output shaft 81 as shown in FIG. The block 85 is fixed.

  An output shaft block 87 is fixed to the fixed block 85, and a rotation shaft 93 of a slip ring 91 is disposed opposite to the output shaft block 87 via a coupling 89. The coupling 89 can transmit the rotational force even if the output shaft 81 and the rotation shaft 93 do not coincide with each other. Reference numeral 95 denotes a slip ring fixing plate. According to this, the slip ring 91 is fixed.

  A driver box cover 187 is attached to the driver box fixing block 85 via a screw 86, and a motherboard mounting plate 88 is interposed between the cover 187 and the fixing block 85. As shown in FIGS. 5 to 6, a board mounting plate 97 is fixed to the mother board mounting plate 88 through screws 96, and the same number of driver boards as the pulse motors 39 of the mounting head 23 are attached to the board mounting plate 97. 98 and a local control board 99 are attached. Further, as shown in FIG. 4, one motherboard 210 is screwed to the motherboard mounting plate 88 via a plurality of collars 111.

  As shown in FIGS. 4 and 7, the connector 210 a of the motherboard 210 is connected to the connector 99 a of the local control board 99, and the local control board 99 and the driver board 98 are connected via a connector cord 113. The driver board 98 and the coil 49 (FIG. 3) of each pulse motor 39 described above are connected via a connector cord 115 (see FIG. 7).

  The connector 210b of the motherboard 210 is connected with a driving cord 116 and a communication cord 116. The cord 116 is connected to the power supply unit 117 and the CPU 119 via the slip ring 91. The CPU 119 is connected to the ROM 121 and the RAM 123. Yes. In FIG. 5, 125 is a speed reducer, and 127 is an input shaft.

  The mounting structure of the mounting head 23 is provided with a head lifting mechanism 151 with reference to FIGS. 8 and 9. As described above, the head lifting mechanism 151 includes a pair of rails 28 and a nut member 27 that is slidably provided between the pair of rails 28 and is slightly thicker than the pair of rails 28. .

  The nut member 27 of the head elevating mechanism 151 is fixed to the rotary table 21, and the pair of rails 28 are fixed to the aluminum head elevating table 26 using screws 153 as shown in FIGS. The

  As shown in FIG. 12, a ball 157 is interposed between the pair of rails 28 and the nut member 27, so that the nut member 27 is slidably supported between the pair of rails 28. For the ball 157, a ball 157 having an appropriate size can be selected to adjust the preload between the pair of rails 28 and the nut member 27. The size of the ball 157 is prepared in units of 0.5 μm in advance.

  According to this, the preload adjustment between the rail 28 and the nut member 27 is simple. The preload adjustment will be described in order. First, as shown in FIGS. 10 and 11, the head elevating table 26 is fixed to a pair of rails 28, and the span S between the rails (FIG. 12) is measured after the ball travel groove processing. . Next, a ball 157 is interposed in the nut member 27, and in this state, a nut member span S ′ (not shown) is measured. Due to the difference between the spans S and S ′, the size of the ball 157 is changed so as to obtain a necessary preload so as to compensate for the difference. The balls 157 are prepared in units of 0.5 μm as described above.

  Finally, the head lifting mechanism 151 with the preload adjusted is attached to the outer periphery of the rotary table 21. In short, according to this embodiment, the assembly and adjustment of the head elevating mechanism 151 is extremely simple. Further, since the pair of rails 28 and the nut member 27 are thin, the radial size of the rotary table 21 is reduced, and space saving and weight reduction can be achieved.

  As shown in FIGS. 13 and 14, a vacuum valve 161 is provided on the upper part of the aluminum head elevating table 26. A manifold block 163 communicating with the vacuum valve 161 is integrally provided above the vacuum valve 161, and a vacuum suction passage 165 and an air blow passage 167 are formed in the manifold block 163.

  A vacuum suction pipe 171 is connected to the vacuum suction passage 165. As shown by a dotted line in FIG. 13, the path to be evacuated through the vacuum pulling pipe 171 first reaches from the tube 191 (see FIG. 15) to the communication hole 173, passes through the head side passage 175, and then is shown by a dotted line in FIG. As shown, the vacuum filter 161 is passed through to the vacuum valve 161, through the passage (not shown) in the vacuum valve 161, and through the vacuum passage 165 as shown by the dotted line in FIG. Further, the path reaches the evacuation tube 171.

  An air blow pipe 177 is connected to the air blow passage 167 in a non-contact state. The air blow path through this air blow pipe 177 first reaches the air blow passage 167 from the air blow pipe 177, passes through the air blow filter 179, and then reaches the vacuum valve 161 as shown by the solid line in FIG. A path that passes through a passage (not shown) in the vacuum valve 161, enters the vacuuming filter 176, and then passes through the communication hole 173 to the tube 191 (see FIG. 15) as shown by a solid line in FIG. It has become. The tube is connected to the suction nozzle 51 of the mounting head 23 described above. Reference numeral 181 denotes a seal.

  That is, the vacuum valve 161 is a valve for switching communication between the head side passage 175 communicating with the mounting head 23 and either the vacuum suction passage 165 or the air blow passage 167.

  Referring to FIG. 15, a cam follower 29 is attached to the upper end of the head elevating table 26 via a mounting plate 25, and the cam follower 29 holds the cylindrical rib cam 31 from above and below. A mounting head 23 is attached to the lower end of the head lifting table 26. The tube 191 communicates the communication hole 173 and the mounting head 23 with reference to FIG. Further, the connection terminal 193 is connected to the cable 161a of the vacuum valve 161, and connection maintenance is facilitated.

  When the vacuum valve 161 is turned on, as described above, the head side passage 175 communicating with the mounting head 23 and the vacuum suction passage 165 communicate with each other, and the electronic component is supplied from the suction nozzle 51 to the electronic component from the component supply device 11 by a vacuum source. Remove by vacuum suction. When the vacuum valve 161 is turned off, as described above, the head-side passage 175 communicating with the mounting head 23 and the air blow passage 167 communicate with each other, and the suction nozzle holds the electronic component by suction with an air supply source. Air is blown from 51 to mount electronic components on the printed circuit board 79.

  A detection sensor 201 for detecting the lowering of the mounting head 23 at the time of sucking and taking out electronic components or mounting on the printed circuit board 79 is provided on the head lifting table 26. This detection sensor 201 has a U-shaped transverse plane, and the light-emitting element 202 and the light-receiving element 203 are arranged so as to face each other through a space. The plate 204 passes through the space of the detection sensor 201.

  The CPU in the local control board 99 that has received the light shielding signal when the detection sensor 201 detects the light shielding by the light shielding plate 204 at the time of the passage has passed a predetermined time after the detection sensor 201 detects the lowering of the mounting head 23. After the elapse of time, the vacuum valve 161 is controlled to be switched on / off. That is, when the electronic component is mounted, it is switched from ON to OFF, so that the suction holding state of the electronic component by vacuum suction is stopped, and air from the air supply source is blown out from the lower end of the suction nozzle 51 to be printed on the printed circuit board 79. Attach electronic components to Further, when the electronic component is taken out, the head side passage 175 communicating with the mounting head 23 and the air blow passage 167 communicate with each other by switching from OFF to ON, but air is blown out from the air supply source. The head side passage 175 and the evacuation passage 165 communicate with each other from a state where there is no vacuum suction and air blowing, and the suction nozzle 51 takes out the electronic component from the component supply device 11 by vacuum suction using a vacuum source.

  Further, as shown in FIG. 16, a scale 206 with a scale 205 is attached to an immovable place outside the mounting head 23, and the moving distance of the mounting head 23 is read by reading the scale 205 attached to the scale 206. The reading head 207 is fixed to the head lifting table 26.

  When the CPU in the local control board 99 receives a movement signal indicating that the mounting head 23 has been lowered by a predetermined distance from the reading head 207, the CPU controls to turn on / off the vacuum valve 161. As described above, the electronic component is prepared to be picked up and attached by the suction nozzle 51. The vacuum valve 161 is switched on / off after a predetermined time has elapsed after the CPU in the local control board 99 receives a movement signal indicating that the mounting head 23 has been lowered by a predetermined distance from the reading head 207. You may control.

  As described above, after the detection sensor 201 detects the lowering of the mounting head 23, the CPU in the local control board 99 switches the vacuum valve 161 on / off after a predetermined time has elapsed, or the reading head 207. After receiving a movement signal indicating that the mounting head 23 has moved a predetermined distance from the CPU, the CPU in the local control board 99 controls the vacuum valve 161 to be switched on / off. An appropriate switching timing can be taken by adjusting the length of the predetermined time or the length of the predetermined distance according to the size (size).

  Furthermore, although the so-called rotary table type mounter has been described as an example of the electronic component mounting apparatus, the present invention is not limited to this and may be applied to a multifunctional chip mounter.

  As described above, the present invention can perform the on / off switching control of the vacuum valve 161 without delay and without variation.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a side view which shows one Example of the electronic component automatic mounting apparatus by this invention. It is a top view of FIG. It is a partially broken side view which shows a mounting head. It is a side view which shows a drive unit. FIG. 5 is a plan view of FIG. 4. It is a half top view which shows a driver box. It is a control block diagram. It is a top view which shows a pair of rail and nut member. It is a side view of FIG. It is a top view which shows the state which attached the head raising / lowering table to a pair of rail. It is a side view of FIG. It is AA sectional drawing of FIG. It is a front view of a manifold block. FIG. 14 is a side view of FIG. 13. It is a figure which shows the assembly state of a head raising / lowering table. It is a figure which shows the assembly state of the head raising / lowering table of other embodiment.

Explanation of symbols

21 Rotary Table 23 Mounted Head 26 Head Lifting Table 28 Rail 119 CPU
151 Head Elevating Mechanism 161 Vacuum Valve 165 Vacuuming Passage 167 Air Blow Passage 201 Detection Sensor 204 Light-shielding Plate 205 Scale 206 Scale 207 Reading Head

Claims (2)

A mounting head that can be moved up and down is provided, the vacuum valve is opened , the electronic component is vacuum-sucked from the electronic component supply device from the suction nozzle provided on the mounting head, and the vacuum valve is closed to suck the electrical component. In the electronic component mounting apparatus in which air is blown out from the suction nozzle that is held and mounted on the printed circuit board, the electronic component mounting apparatus includes a detection sensor that detects that the mounting head has reached a specific position when lowered. A detection signal indicating that the position has reached the specific position when the mounting head is lowered is provided on the movable side of the electronic component mounting device separately from the main control device provided on the fixed side of the electronic component mounting device. the main control unit electrically connected to the control device of the local control in the substrate receives are in, the local control board after a predetermined time has elapsed Electronic component mounting apparatus to which a control device and adjusting according to the weight or size of at least part of the predetermined time controls to switch the opening and closing of the vacuum valve. A mounting head that can be moved up and down is provided, the vacuum valve is opened , the electronic component is vacuum-sucked from the electronic component supply device from the suction nozzle provided on the mounting head, and the vacuum valve is closed to suck the electrical component. In an electronic component device that is mounted on a printed circuit board by blowing air from the suction nozzle that is held, the mounting head is predetermined from a reading head that reads a scale attached to a scale according to the height of the mounting head A local control that provides a movement signal indicating that the distance has been lowered is provided on the movable side of the electronic component mounting device separately from the main control device provided on the stationary side of the electronic component mounting device and is electrically connected to the main control device. controller in the substrate is subjected, depending on the weight or size of at least part of the predetermined distance together with the control device switches the opening and closing of the vacuum valve An electronic component mounting apparatus characterized by adjusting.

Images