JP4706601B2 - Film forming substrate manufacturing equipment - Google Patents

Description

  The present invention relates to an apparatus for manufacturing a film formation substrate.

  Currently, liquid crystal panels are widely used in mobile phones, projectors, and the like. In particular, liquid crystal panels used as projector light valves use light sources that are strong in lighting, so liquid crystal panels that use conventional organic alignment films can deteriorate the alignment film and affect the display. It has been known. Therefore, a liquid crystal panel using an inorganic alignment film has been developed in place of an organic substance. In the ion beam sputtering method, film formation molecules at the time of sputtering are incident on the substrate at an angle of 45 degrees or less with respect to the substrate. Thus, the alignment film surface of the columnar structure is formed of an inorganic material, and the alignment of the liquid crystal is realized.

Conventionally, when a film is formed on a substrate using an ion beam sputtering method, the substrate is set on a substrate holding jig called a holder as shown in Patent Documents 1 and 2 below, and the holder is used as a film forming apparatus. It was common to perform film formation processing.
Japanese Utility Model Publication No. 5-94267 Japanese Utility Model Publication No. 5-96060

  However, in the film forming method in which the film forming molecules are incident on the substrate at an angle, the holding portion that holds the substrate blocks the film forming particles, so that an undeposited portion is not formed on the film formation surface of the substrate. There was a problem that it occurred. For this reason, there has been proposed a method in which only one side of the substrate is held except for the holding portion positioned on the direction in which the film forming molecules are incident. Thereby, it can prevent that a non-film-forming part generate | occur | produces. Further, since the number of holding parts is reduced, the interval between the holding parts can be narrowed, and the apparatus can be miniaturized. However, there is a possibility that the holding part positioned in front of the film forming molecules in the incident direction may block the film forming particles on the film forming surface of the substrate located behind the holding part. This causes a problem that an undeposited portion is generated on a subsequent substrate. As a result, the arrangement interval between the holding portions has to be increased in the end, making it difficult to achieve downsizing.

  Further, as shown in FIGS. 17A and 17B, there is a film formation substrate holding jig 90 called a drop-in type. This film forming substrate holding jig 90 drops the substrate 93 into the hole 92 formed in the holding base material 91 and holds the four corners of the substrate 93 by the claw portions 94 provided at the bottom of the hole 92. It is. However, as shown in FIG. 18, when the film is formed on the film formation surface 93 </ b> A of the substrate 93, the film formation surface 93 </ b> A is positioned lower than the upper surface 91 a of the holding base material 91. Film formation particles (indicated by an arrow T in the figure) are blocked. As a result, there arises a problem that an undeposited region B occurs on the deposition surface 93A of the substrate 93.

  In the holding method as described above, if an attempt is made to prevent the occurrence of an undeposited portion, it is difficult not only to reduce the size of the substrate holding jig, but also the number of substrates that can be held at one time is limited. Therefore, improvement in processing efficiency cannot be expected.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a film formation substrate that can hold a larger number of substrates while preventing downsizing of the deposited film and reducing the size. It is to provide a manufacturing apparatus.

An apparatus for manufacturing a film formation substrate is an apparatus for manufacturing a film formation substrate for forming a film by an oblique growth film method on a surface of a substrate having a recess or protrusion on a side surface, and engages the recess or protrusion. Provided with a plurality of holding base materials having a holding portion, the holding base material is disposed so as to face the side surface direction of the film formation substrate, and the holding portions of the holding base materials facing each other, While holding the concave portion or the convex portion of the film formation substrate, the surface of the holding base material on the film formation surface side of the film formation substrate does not protrude from the film formation surface of the film formation substrate, A holding part consists of a protrusion which protrudes toward the other holding base material side adjacent.
Further, it is possible to hold a plurality of the substrates, a plurality of the holding base materials are provided continuously, and an inclination angle of the protruding direction of the holding portion with respect to a horizontal plane is increased along the connecting direction. preferable.
Further, it is a film forming substrate manufacturing apparatus for forming a film by the oblique growth film method on the surface of a substrate having a concave portion or a convex portion on a side surface, and includes a plurality of first wire rods that engage the concave portion or the convex portion. The first wire is disposed so as to face the side surface direction of the film formation substrate, and the first wire materials facing each other hold the concave portion or the convex portion of the film formation substrate, and It is preferable that the first wire does not protrude from the film formation surface of the film substrate.
Moreover, it is preferable to have at least one pair of second wires extending perpendicularly to the pair of first wires.
Moreover, it is possible to hold a plurality of the substrates, and it is preferable that a plurality of the first wire rods are connected in series, and the height position of the first wire rods is increased along the connecting direction.
The oblique growth film method is preferably oblique deposition by vacuum deposition.
The oblique growth film method is preferably oblique sputtering by ion beam sputtering.
In order to solve the above-described problem, an apparatus for manufacturing a film formation substrate is an apparatus for manufacturing a film formation substrate for forming a film on the surface of a substrate having a recess or a protrusion on a side surface by an oblique growth film method. Alternatively, a plurality of holding base materials having holding portions that engage the convex portions are provided, and the holding base materials are arranged so as to face the side surface direction of the film formation substrate, and the holding portions of the holding base materials that face each other are arranged. Thus, the concave portion or the convex portion of the film formation substrate is held, and the upper surface of the holding base material does not protrude from the film formation surface of the film formation substrate.

  According to the film forming substrate manufacturing apparatus of the present invention, since the concave portions or the convex portions of the substrate can be held by the holding portions of the holding bases facing each other, the film formation surface of the substrate can be exposed entirely. it can. Furthermore, since the upper surface of the holding base material does not protrude beyond the film-forming surface of the substrate, the holding base material does not become a shadow and block the film forming molecules. Therefore, an undeposited portion does not occur on the film formation surface, and a vapor deposition film having a desired film performance can be formed.

Moreover, it is also preferable that a holding part is a groove | channel opened toward the other holding base material side adjacent.
According to such a configuration, when a substrate having a protrusion on the side is held, the substrate can be held by inserting the convex portion of the substrate into the groove of the holding base material.

It is also preferable that the holding portion is composed of a protrusion that protrudes toward the other holding substrate side adjacent to the holding portion.
According to such a configuration, when a substrate having a groove portion on the side is held, the substrate can be held by inserting the protruding portion of the holding base material into the concave portion of the substrate.

It is also preferable that a plurality of substrates can be held, a plurality of holding base materials are provided continuously, and the inclination angle of the holding portion is increased along the connecting direction.
According to such a configuration, the incident angle of the film formation molecules can be made constant with respect to the film formation surfaces of all the substrates to be held. Moreover, since the holding part of another holding base material does not become a shadow, it can prevent that a non-film-forming part generate | occur | produces on the film-forming surface of the board | substrate hold | maintained between adjacent holding base materials. From the above, the uniform thickness distribution of the obliquely deposited film is realized.

An apparatus for manufacturing a film formation substrate according to the present invention is an apparatus for manufacturing a film formation substrate for forming a film on the surface of a substrate having a recess or a protrusion on a side surface by an oblique growth film method. A plurality of first wire rods are provided, the first wire rods are arranged so as to face the side surface direction of the film formation substrate, and the first wire rods facing each other hold the concave portion or the convex portion of the film formation substrate. In addition, the first wire rod does not protrude from the film formation surface of the film formation substrate.
According to the film forming substrate manufacturing apparatus of the present invention, the sides of the substrate can be held by the clamping force of the pair of first wires. For example, when holding a substrate having recesses on both sides, the substrate can be held by inserting the first wire into each recess of the substrate. Furthermore, since the first wire is configured not to protrude from the film formation surface of the substrate, there is no possibility that the first wire will shade and block the film-forming molecules. In this manner, by holding the side of the substrate, the entire film formation surface can be exposed, so that an undeposited portion is not generated on the film formation surface. Therefore, a deposited film having a desired film performance can be obtained. In addition, the use of the wire can reduce the size of the entire jig.

It is also preferable to have at least a pair of second wires extending perpendicular to the pair of first wires.
According to such a configuration, for example, when the substrate is rectangular in plan view, the four sides of the substrate can be supported, so that the substrate can be reliably and stably held.

In addition, it is also possible to hold a plurality of substrates, and it is also preferable that a plurality of first wire rods are connected in series, and the height position of the first wire rods is increased along the connecting direction.
According to such a configuration, the incident angle of the film formation molecules can be made constant with respect to the film formation surfaces of all the substrates to be held. In addition, since the other first wire does not become a shadow, it is possible to prevent an undeposited portion from occurring on the film formation surface of the substrate held between the first wires that are arranged in series. From the above, the uniform thickness distribution of the obliquely deposited film is realized.

Further, the oblique growth film method is preferably oblique deposition by vacuum deposition.
By forming a film by a vacuum evaporation method, it is possible to perform the evaporation with a kinetic energy of about the heat speed without giving excessive energy to the film forming molecules. This is advantageous in obliquely aligning the film forming molecules.

Further, the oblique growth film method is preferably an oblique sputtering by an ion beam sputtering method.
By performing film formation by ion beam sputtering, almost all substances such as metals, alloys, compounds, and organic substances can be deposited. In addition, adhesion to the substrate is good.

  In the apparatus for manufacturing a film formation substrate according to the present invention, since the processing is performed in a state where the substrate is provided on the film formation substrate holding jig, it is possible to eliminate the formation defect of the vapor deposition film on the substrate. In addition, according to the PVD method having a relatively low processing temperature, the influence of heat on the film formation surface of the substrate can be reduced. Therefore, for example, it is possible to prevent damage to wirings, electrodes, and the like disposed on the deposition surface of the substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the film thicknesses and dimensional ratios of the respective components are appropriately changed in order to make the drawings easy to see. In the following description, an xyz orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the xyz orthogonal coordinate system. A predetermined direction in the horizontal plane is an x direction, a direction orthogonal to the x direction in the horizontal plane is a y direction, and a direction orthogonal to each of the x direction and the y direction is a z direction.

  The film formation substrate manufacturing apparatus of the present invention is a film formation apparatus including a film formation substrate holding jig, and forms a film on the surface of the substrate held by the film formation substrate holding jig by an oblique film formation method. To do.

First, the film formation substrate holding jig will be described.
The film formation substrate holding jig of each embodiment described below is for holding a substrate to be formed in a film formation apparatus described later.

[First Embodiment]
First, a first embodiment will be described with reference to FIGS.
FIG. 1 is a plan view showing an outline of the entire film forming substrate holding jig in the present embodiment. FIG. 2 is a sectional side view of the holding substrate. FIG. 3 is an explanatory view showing a holding state of the substrate by the film formation substrate holding jig. FIG. 3 shows a substrate corresponding to the film formation substrate holding jig of this embodiment.

First, the configuration of the substrate 14 corresponding to the film formation substrate holding jig 10 of this embodiment will be described.
As shown in FIGS. 1 and 3A, the substrate 14 has a longitudinal direction in a plan view on the bottom (the lower surface 14b side opposite to the film formation surface 14a when the film formation surface 14a is the upper surface). It has a shape having a pair of projecting portions 15 and 15 projecting vertically from the side surfaces 14c and 14c on both sides.

  The film forming substrate holding jig 10 of the present embodiment is capable of holding a plurality of substrates 14 having the above-described configuration. As shown in FIGS. A plurality of holding base materials 12 provided in the frame 11 and arranged in parallel with each other at a predetermined interval.

  In the frame 11, a plurality of holding base materials 12 extending along the y direction shown in FIG. 1 are provided at intervals in the x direction. And the flame | frame 11 of this embodiment shall be able to remove any one side part (Here, the side part 11a shown with the dashed-two dotted line in a figure) in the extension direction of the holding base material 12, for example. . Thereby, it has the structure which can hold | maintain the some board | substrate 14 between adjacent holding base materials 12 from the edge part side of each holding base material 12. FIG.

  As shown in FIGS. 1 and 2, the holding substrate 12 has a thin rod shape that is rectangular in a plan view, and has a pair of groove portions 13 (holding portions) that are recessed inward on both sides in the width direction. The groove portion 13 is formed along the longitudinal direction of the holding base material 12 (y direction in FIG. 1), and serves as a groove for inserting the protruding portion 15 of the substrate 14 described above. And each holding base material 12 is provided in the frame 11 in the state which mutually faced the groove part 13. Moreover, since the positions (positions in the z direction) with respect to the frame 11 are matched with each other, the positions of the groove portions 13 of the adjacent holding base materials 12 are necessarily matched. The board | substrate 14 is hold | maintained by inserting the protrusion part 15 of the board | substrate 14 in the groove part 13 which these adjacent holding base materials 12 oppose. Therefore, the interval between the holding base materials 12 in this embodiment is an interval corresponding to the length in the longitudinal direction of the substrate 14 so that the longitudinal direction of the substrate 14 to be held is perpendicular to the holding base material 12. Yes.

  As shown in FIG. 2, the groove 13 includes inner surfaces 16, 16 that face each other and a connecting surface 17 that connects the inner surfaces 16, 16 to each other. Here, the inner surfaces 16 may be parallel to each other (see FIG. 3A), but one of the inner surfaces 16 (16a in the present embodiment) is in a horizontal plane so that the opening 13a side of the groove 13 is widened. It may be inclined at a predetermined angle. In this case, the width dimension of the connecting surface 17 is set to be equal to or less than the thickness dimension of the protrusion 15 of the substrate 14. By doing so, a desired pressing force is applied to the protrusion 15 simply by inserting the substrate 14 into the groove 13. Therefore, the substrate 14 can be held without being displaced between the inner surfaces 16 and 16 of the groove 13.

  The depth of the groove 13, that is, the width dimension of the inner surface 16 is appropriately set according to the protruding amount of the protruding portion 15 of the substrate 14.

  When holding the substrate 14 on the film formation substrate holding jig 10, as shown in FIG. 1 to FIG. 3, in the groove portions 13 facing each other between the holding base materials 12 adjacent in the frame 11, The protrusions 15 of the substrate 14 are inserted from the side of the one opening 13 b in the longitudinal direction of each groove 13 and are slid along the extending direction of the groove 13.

  As shown in FIG. 1, the substrate 14 is inserted between the holding base materials 12 from the side 11 a side from which the frame 11 is removed. Therefore, even if the end portions on the opening 13b side of the inner surface 16 and the connecting surface 17 are slightly inclined so that the opening 13b on one end side (lower side in the drawing) in the longitudinal direction of the holding substrate 12 is widened. Good. Thereby, since the opening 13b spreads, it becomes easy to insert the board | substrate 14 in the groove parts 13 and 13 of the adjacent holding base materials 12 and 12. FIG.

  In this way, the plurality of substrates 14 held by the film formation substrate holding jig 20 are held with the respective film formation surfaces 14a facing upward.

  According to the film formation substrate holding jig 10 of this embodiment, the entire film formation surface 14a of the substrate 14 can be exposed. That is, the film formation substrate holding jig 10 is configured to hold the substrate 14 without holding the upper surface 12a of the holding base material 12 from the film formation surface 14a of the substrate 14 when holding the substrate 14. ing. Therefore, as shown in FIG. 3B, since the entire surface 14a of the substrate 14 is exposed, the holding base material 12 is shaded to form film formation molecules (indicated by an arrow T in the figure). ) As a result, film formation can be performed without generating an undeposited portion on the film formation surface 14a. Therefore, it is possible to effectively obtain a deposited film having a desired film performance.

  Furthermore, since the thickness of the holding base material 12 is formed thinner than the thickness of the substrate 14, the jig can be made thinner, that is, smaller. Further, the width dimension of the holding base 12 is adjusted, or the groove 13 is formed along the shape of the protrusion 15 of the substrate 14 (for example, the depth dimension of the groove 13 is adjusted to the protrusion dimension of the protrusion 15). Therefore, further downsizing can be achieved.

  The basic configuration of the film formation substrate holding jig of each embodiment shown below is the same as that of the first embodiment, and only the configuration of the holding substrate of the first embodiment is different. Therefore, in the following, only the configuration of the holding substrate will be described, and description of common parts will be omitted. In each drawing used for explanation, the same reference numerals are given to the same components as those in FIGS. 1 to 3.

[Second Embodiment]
Next, a second embodiment will be described with reference to FIGS.
FIG. 4 is a perspective view showing an outline of the entire holding substrate. FIG. 5 is an explanatory view showing a holding state of the substrate.

  As shown in FIG. 4, the holding base material 21 of the present embodiment has a flat plate-like base portion 22 at the center and a pair of substrate holding portions 23 on both sides in the width direction. The substrate holding portion 23 includes a connecting plate portion 24 perpendicular to the base portion 22 and holding plate portions 25 extending perpendicularly from both ends in the width direction of the connecting plate portion 24, and has a U-shape in cross section. Is. With such a configuration, the groove portion 26 (holding portion) into which the protruding portion 15 of the substrate 14 can be inserted is provided.

  Although the pair of holding plate portions 25 are provided perpendicular to the connecting plate portion 24, the predetermined angle with respect to the connecting plate portion 24 so that the opening 26a side in the width direction of the groove portion 26 is widened. It may be inclined with. Then, it will be in the attitude | position which the direction of the edge part side spaced apart rather than the base part side of the opposing connection board part 24. FIG. In this case, the width dimension of the connecting plate portion 24 is slightly shorter than the thickness dimension of the protruding portion 15 of the substrate 14.

  When holding the substrate 14 on the film formation substrate holding jig 20, as shown in FIGS. 1, 4, and 5, in the groove portions 26 facing each other between the holding base materials 21 adjacent to each other in the frame 11. The projecting portions 15 of the substrate 14 are inserted into the respective groove portions 26 from the one opening 26b side in the longitudinal direction of the respective groove portions 26 and are slid along the extending direction of the groove portions 26. The plurality of substrates 14 held by the film formation substrate holding jig 20 is held with each film formation surface 14a facing upward.

  According to the film formation substrate holding jig 20 of the present embodiment, the entire film formation surface 14a of the substrate 14 can be exposed. That is, when the film formation substrate holding jig 20 holds the substrate 14, the upper surface 25 a of the holding plate portion 25 of the holding base material 21 holds the substrate 14 without protruding from the film formation surface 14 a of the substrate 14. It has a configuration that can. Therefore, the film forming substrate holding jig 20 can obtain the same effect as that of the above embodiment.

  The film formation substrate holding jigs 10 and 20 of the first and second embodiments described above are configured to correspond to the substrate 14 having the protruding portion 15 and can hold the protruding portion 15 of the substrate 14. The holding base materials 12 and 21 having the groove portions 13 and 26 are provided. On the other hand, in the third and fourth embodiments described below, the shape of the substrate to be held is different from the shape of the substrate 14 corresponding to the film formation substrate holding jigs 10 and 20 of the above embodiment. Therefore, before describing the third embodiment and the fourth embodiment, first, substrates corresponding to the third embodiment and the fourth embodiment will be described.

  As shown in FIGS. 8 and 10, the substrates 28 and 28 ′ corresponding to the following third and fourth embodiments have concave portions 29 and 29 ′ that are recessed inwardly on the side surfaces 28 b on both sides in the longitudinal direction in plan view. It has a shape. The recesses 29 and 29 'are provided substantially at the center of the side surface 28b and extend in the longitudinal direction (y direction in the figure) of the side surface 28b. The shape of the recesses 29 and 29 ′ is rectangular or triangular when viewed in cross section, but may be other shapes.

[Third Embodiment]
A third embodiment will be described with reference to FIGS.
FIG. 6 is a plan view showing an outline of the entire deposition substrate holding jig. FIG. 7 is a side sectional view showing a schematic configuration of the holding substrate. FIG. 8 is an explanatory diagram showing a holding state of the substrate.
Note that the film formation substrate holding jig of this embodiment is configured to hold a substrate having a recess having a rectangular shape in cross section.

  The holding base material 31 of the present embodiment includes a base material part 32 having a rectangular shape in a cross-sectional view extending in the y direction of the frame 11 shown in FIG. 6, and a center part of each side surface 32a on both sides in the width direction of the base material part. And a flat plate-like protrusion 33 (holding part) protruding perpendicularly to each side surface 32a. The protruding portion 33 extends along the longitudinal direction of the base material portion 32 (y direction in FIG. 6).

  The protrusion 33 has a thickness dimension that can be inserted into the recess 29 of the substrate 28. Moreover, the dimension in the protrusion direction of a protrusion is suitably set according to the depth dimension of the groove part of a board | substrate.

  The holding substrate 31 of the third embodiment is connected to the frame 11 so that the protrusions 33 face each other. When the substrate 28 is held by these holding base materials 31, as shown in FIGS. 6 to 8, the protrusions 33 that face each other between the holding base materials 31 adjacent to each other in the frame 11 in the recess 29 of the substrate 28. Is inserted and the substrate 28 is slid along the extending direction of the protrusion 33. The plurality of substrates 28 held by the film formation substrate holding jig 30 is held with each film formation surface 28A facing upward.

  According to the film formation substrate holding jig 30 of the present embodiment, the entire film formation surface 28A of the substrate 28 can be exposed. That is, the film formation substrate holding jig 30 is configured to be able to hold the substrate 28 without holding the upper surface 31 a of the holding base material 31 from the film formation surface 28 </ b> A of the substrate 28 when holding the substrate 28. ing. Therefore, the film forming substrate holding jig 30 can obtain the same effect as that of the above embodiment.

[Fourth Embodiment]
Next, 4th Embodiment is described using FIG.6, FIG.9 and FIG.10.
FIG. 6 is a plan view showing an outline of the entire film forming substrate holding jig of the present embodiment. FIG. 9 is a side sectional view showing a schematic configuration of the holding substrate. FIG. 10 is an explanatory diagram showing a holding state of the substrate.
The film formation substrate holding jig of the present embodiment is configured to correspond to a substrate having a concave portion that has a triangular shape in cross section.

  As shown in FIGS. 6 and 9, the holding base material 41 of the present embodiment includes a base material portion 42 having a rectangular shape in cross section extending in the y direction of the frame 11, and both side surfaces 42 a of the base material portion 42. It has a protruding portion 43 (holding portion) that protrudes in a triangular shape in sectional view. The protrusion 43 extends along the longitudinal direction (y direction in FIG. 6) of the base portion 42, and of the pair of side surfaces 44 constituting the protrusion 43, the end of one side 44 is a holding base. 41 is arranged along the end of the upper surface 41A of 41. And the top part 45 (joining point of side surfaces 44) comprised from a pair of side surface 44 has faced the protrusion direction outer side.

  The protrusion 43 has a shape corresponding to the recess 29 ′ of the substrate 28 ′, and forms an inclination angle θ 1 between the inner surfaces 29 a constituting the recess 29 ′ of the substrate 28 ′ and the top 45 of the protrusion 43. The inclination angle θ2 of the two side surfaces 44 are the same angle. The dimension of the protrusion 43 in the protruding direction must be at least larger than the depth dimension of the recess 29 'of the substrate 28'.

  As shown in FIG. 6, the holding substrate 41 of the present embodiment is connected to the frame 11 so that the protrusions 43 face each other. When holding the substrate 28 ′ on these holding base materials 41, as shown in FIG. 10, the corresponding protrusions 43 of the holding base materials 41 are inserted into the recesses 29 ′ of the substrate 28 ′ to hold the holding base materials. A plurality are provided while being slid along the longitudinal direction of 41. Further, according to the holding base material 41 of the present embodiment, the shape of the concave portion 29 ′ of the substrate 28 ′ is reflected in the shape of the protruding portion 43 as it is, so that it protrudes from the inner surface 29a of the concave portion 29 ′. Since the side surface 44 of the portion 43 can be brought into contact, the substrate 28 ′ is not easily displaced. Further, the plurality of substrates 28 ′ held by the film formation substrate holding jig 40 are held with each film formation surface 28 </ b> A facing upward.

  According to the film formation substrate holding jig 40 of the present embodiment, the entire film formation surface 28A 'of the substrate 28' can be exposed. That is, when the film formation substrate holding jig 40 holds the substrate 28 ′, the upper surface 41 a of the holding base material 41 can hold the substrate 28 ′ without protruding from the film formation surface 28 A ′ of the substrate 28 ′. It can be configured. Therefore, the film forming substrate holding jig 40 can obtain the same effect as that of the above embodiment.

[Fifth Embodiment]
Next, 5th Embodiment is described using FIG.11 and FIG.12.
The film formation substrate holding jig shown below is one embodiment in the case of holding a substrate with a wire.
FIG. 11 is a perspective view showing a schematic configuration of the film formation substrate holding jig of the present embodiment. FIGS. 12A and 12B are explanatory views showing a holding state of the substrate, in which FIG. 12A is an enlarged view of a main part of the deposition substrate holding jig, and FIGS. 12B and 12C are side sectional views of the substrate.

  As shown in FIG. 11, the film formation substrate holding jig 50 of the present embodiment includes a first wire 51 and a second wire 52 provided in a lattice shape along the opposing sides 11 a and 11 b of the frame 11. Yes. More specifically, in the frame 11 shown in FIG. 11, a plurality of first wires 51 extending along the y direction are stretched at predetermined intervals in the x direction. A plurality of second wires 52 extending in the x direction intersecting with the first wires 51 are stretched at predetermined intervals in the y direction.

  More specifically, each of the first wire 51 and the second wire 52 is provided as a pair. The substrate 38 is sandwiched between the two adjacent first and second wires 51 and 52. In other words, the first wire 51 and the second wire 52 that are formed of a set of these two wires constitute a holding portion 53 that holds a substrate 38 described later.

  The paired first wires 51 are stretched at a predetermined interval slightly narrower than the length of the substrate 38 in the longitudinal direction. The second wires 52 are arranged at a predetermined interval slightly narrower than the length of the substrate 38 in the short direction. Details of the spacing between the wires 51 and 52 will be described later. Furthermore, the interval between adjacent groups (holding portions 53) is set to an interval at which the substrates 38 held by the holding portions 53 constituted by the wires 51 and 52 do not interfere with each other.

  The first wire 51 and the second wire 52 are provided so as not to interfere with each other at the intersection, and the positions thereof are different in the z direction as shown in FIG. In the present embodiment, the second wire 52 is located closer to the surface side of the frame 11 than the first wire 51.

  The substrate 38 corresponding to the film formation substrate holding jig 50 of the present embodiment has a shape having recesses on all four side surfaces. The substrate 28 corresponding to the film formation substrate holding jigs 30 and 40 of the above embodiment has a shape (see FIGS. 8 and 10) having recesses 29 and 29 ′ only on the side surfaces 28b on both sides in the longitudinal direction in plan view. It was. In the present embodiment, as shown in FIG. 12, the substrate 38 corresponding to the film formation substrate holding jig 50 has not only the side surface 38b on both sides in the longitudinal direction but also the side surface 38c on both sides in the lateral direction. It has a shape.

  Specifically, as shown in FIG. 12 (b), a concave portion 37 having a triangular shape in cross section that is recessed inward from the side surface 38b is formed on the side surface 38b on both sides in the short side direction in plan view. In addition, in the side surface 38c on both sides in the longitudinal direction in the plan view of FIG. 12C, a concave portion 39 having a triangular shape in a sectional view that is recessed inward from the side surface 38c is formed.

  The positions of the recesses 37 on the side surfaces 38b facing each other and the positions of the recesses 39 on the side surfaces 38c facing each other are formed to be parallel to the substrate surface. Further, the positions of the recesses 37 and 39 provided in the adjacent side surfaces 38b and 38c are different in the z direction (thickness direction of the substrate) so as to correspond to the respective wires 51 and 52 provided in the frame 11. . That is, the concave portion 37 formed on the side surface 38 b is formed on the film formation surface 38 A side so as to correspond to the second wire 52. On the other hand, the recess 39 formed on the side surface 38 c is formed on the bottom surface 38 C side opposite to the film formation surface 38 A so as to correspond to the second wire 51.

  When holding the substrate 38 on the film formation substrate holding jig 50 of the present embodiment, the two adjacent first wires 51 and second wires 52 are inserted into the recesses 37 and 39 of the substrate 38, respectively. Hold. At this time, the distance between the two adjacent first and second wires 51 and 52 is increased while the substrate 38 is inserted into a region surrounded by the two adjacent first and second wires 51 and 52. To do. When the pull of the first wire 51 and the second wire 52 is released after the substrate 38 is inserted, the wires 51 and 52 return to their original state due to the tension. At this time, the substrate 38 is held by the first wire 51 entering the recess 39 of the substrate 38 and the second wire 52 entering the recess 37 of the substrate 38.

  As described above, the first wire 51 and the second wire 52 are arranged at a slightly narrower interval than the size of the substrate 38, and thus can be hooked on the concave portions 37 and 39 of the substrate 38. Specifically, the interval between the wires 51 and 52 in the holding portion 53 can be set by setting the interval between the recesses 37 of the substrate 38 and the interval between the recesses 39.

  Further, by arranging the wires 51 and 52 at intervals slightly smaller than the intervals between the recesses 37 and the recesses 39 of the substrate 38, it is possible to give the wires 51 and 52 a clamping force with respect to the substrate 38. That is, if the four side surfaces of the substrate 38 are clamped by the tension between the two adjacent wires 51 and 52, the substrate 38 can be stably held.

  In the film formation substrate holding jig 50, the substrate 38 is held while increasing the distance between the wires 51 and 52, so that the side portion 11a of the frame 11 does not need to be removable, and the four side portions are not required. Can be integrally formed.

  In the said embodiment, although the form which provided the some wires 51 and 52 in the grid | lattice form in the flame | frame 11 was described, not only this but a wire is stretched | stretched only in one direction of an x direction or a y direction. You may do it. For example, a configuration in which only the first wire 51 or only the second wire 52 is stretched may be used. According to such a film formation substrate holding jig, the concave portion of the substrate corresponding thereto needs to be formed only on a pair of opposing side surfaces (side surfaces 38b or side surfaces 38c). It can be set as a simple structure. However, the film formation substrate holding jig that supports four points on each side surface of the substrate can securely hold the substrate.

  According to the film formation substrate holding jig 50 of the present embodiment, the entire film formation surface 38A of the substrate 38 can be exposed. That is, the film formation substrate holding jig 50 is configured to hold the wires 51 and 52 without protruding from the film formation surface 38 </ b> A of the substrate 38 when holding the substrate 38. For this reason, the film formation surface 38A of the substrate 38 is exposed entirely. As a result, the wires 51 and 52 do not block the film-forming molecules, so that it is possible to prevent the non-film-forming portion from being formed on the film-forming surface 38A of the substrate 38. Thereby, a vapor deposition film having a desired film performance can be formed.

  Moreover, since it is the structure which hold | maintains the board | substrate 38 with the wires 51 and 52 which make a linear, the space | interval of the board | substrates 38 to hold | maintain can be narrowed by adjusting the arrangement | positioning space | interval of the wires 51 and 52. FIG. This makes it possible to hold more substrates 38 and to reduce the size of the jig.

  The film formation substrate holding jigs 10,..., 50 are formed in such a manner that the film formation surfaces 14 a, 28 A, 38 A of all the substrates 14, 28, 28 ′, 38 to be held are parallel. It is a tool. The embodiment described below is a film formation substrate holding jig configured such that a film formation surface of a substrate to be held is inclined at a predetermined angle.

[Sixth Embodiment]
Next, a sixth embodiment will be described with reference to FIG.
In the film forming substrate holding jig of the present embodiment shown below, the height positions of holding substrates adjacent in the x direction are different in the z direction, and the holding unit direction is set at a predetermined angle with respect to the horizontal plane. It differs in that it is inclined. In this embodiment, the holding substrate 31 of the third embodiment will be described, but any holding substrate in other embodiments may be used. FIG. 13 is a cross-sectional view showing an inclined state of the holding base material provided continuously in the x direction.

  As shown in FIG. 13, in the film forming substrate holding jig 60 of this embodiment, the positions of the holding base materials 31 connected in the X direction move in the z direction as moving toward one side in the x direction (left side in the figure). It is high. At the same time, the direction of each protrusion (the direction between the protrusions 33) is inclined at a predetermined angle with respect to the horizontal plane. The inclination angles θ of the respective holding base materials 31 with respect to the horizontal plane may be the same, but in this embodiment, the respective inclination angles θ are gradually increased from the holding base material 31a at the low position to the holding base material 31c at the high position. It is configured to be large. That is, as shown in FIG. 13, the inclination angle θ1 of the holding base material 31a increases in order, and the inclination angle θ3 of the holding base material 31c is larger than the inclination angle θ1 of the holding base material 31a.

  Conventionally, when oblique deposition is performed on the film formation surface 93A of the substrate 93, for example, as shown in FIG. ) Is incident. Then, it can be seen that the incident angle θ of the film-forming molecule T is different on the film-forming surface 93A of the substrate 93 in the x direction in the figure. At the point H farthest from the point P, the incident angle is θa, and at the point J closest to the point P, the incident angle is θc. Thus, the incident angle becomes larger as the point is closer to the point P.

  In the conventional film formation substrate holding jig 80 shown in FIG. 16B, since both ends of the substrate 93 are held by the holding portions 81, the arrow T in the drawing indicates the film formation surface 93A. When the film formation molecule T entered from the direction shown, the holding portion 81 on the incident direction side of the film formation molecule T blocked the film formation molecule T. As a result, an undeposited region B is generated on the film formation surface 93A, and there has been a concern about a decrease in film performance due to this. Further, as described above, the incident angle of the film-forming molecule T with respect to the film-forming substrate holding jig 80 is different in the x direction in the figure, so that the film thickness varies among the substrates 93 arranged in the x direction. There was also a fear.

  On the other hand, in the film formation substrate holding jig 60 of this embodiment, as shown in FIG. 13, the incident angles of the film formation molecules T with respect to the film formation surfaces 28A of all the substrates 28 to be held are the same angle. As described above, the inclination angle θ of the holding substrate 31 with respect to the horizontal plane is appropriately changed.

  Thus, by changing the inclination angle θ of the holding base material 31 adjacent in the x direction, the incident angle θs of the film forming molecules T with respect to each substrate 28 can be made constant. As a result, it is possible to prevent the occurrence of a non-deposited portion on the deposition surface 28A and to make the deposited film uniform. Thereby, a vapor deposition film having desired film characteristics can be formed on each substrate 28.

  Further, the holding portion 33 may be freely tilted with respect to the holding base material 31.

  In the case of a film forming substrate holding jig having a configuration in which wires are stretched only in one direction, it is only necessary to change the height position of each wire to be arranged so as to gradually become higher in the direction in which the wires are arranged. In this case, it is not necessary to provide the wires in a lattice shape.

  In each of the above-described film forming substrate holding jigs 10 to 40, it is preferable that the holding base materials 12, 21, 31, and 41 are made of, for example, a resin. In the film formation substrate holding jig 50, for example, the surfaces of the wires 51 and 52 are preferably covered with a resin or the like. For example, when used in a liquid crystal device or the like, since the substrates 14, 28, 28 ', 38 are formed of quartz, glass, or the like, if the holding base materials 12, 21, 31, 41 are hard, the substrate There is a possibility that the substrates 14, 28, 28 ', 38 may be damaged by the interference of both when the 14, 28, 28', 38 is mounted. Since a simple scratch may cause damage to the substrates 14, 28, 28 'and 38 later, the generation of the scratch must be avoided. However, since the holding bases 12, 21, 31, 41 can be made flexible by forming them from resin or the like, the substrates 14, 28, 28 ', 38 can be held without being damaged. The same can be said when the wires 51 and 52 are covered with resin or the like.

  In each of the film forming substrate holding jigs 10 to 40 described above, by adjusting the width dimension of the holding base material 12, 21, 31, 41, the adjacent substrate via the holding base material 12, 21, 31, 41. The arrangement | positioning space | interval of mutual can be narrowed. This makes it possible to reduce the size of the jig.

  Furthermore, according to the film-forming substrate holding jigs 10,..., 60 of the first to sixth embodiments described above, it can be reliably held regardless of the shape of the substrate. Further, for example, even if the film formation substrate holding jig is in an oblique or inverted state during transportation or film formation, the substrate does not fall out of the film formation substrate holding jig.

  The film formation substrate holding jigs 10,..., 60 described above hold the substrate on which the film is formed by the oblique film formation method. Examples of the oblique film forming method include oblique vapor deposition and oblique sputtering. Therefore, a film forming apparatus for forming a film by oblique deposition and a film forming apparatus for forming a film by oblique sputtering will be described below.

  A film forming apparatus including the film forming substrate holding jig will be described with reference to FIGS. Here, the case where the film formation substrate holding jig 10 of the first embodiment described above is used as the film formation substrate holding jig used in the film formation apparatus will be described as an example.

  An ion beam sputtering apparatus 100 shown in FIG. 14 includes a film forming chamber 101 as a film forming chamber, an ion gun 102 provided in the film forming chamber 101 for injecting film forming molecules of a film forming material, And a film formation substrate holding jig for holding a plurality of substrates 14. Then, the target 103 is irradiated with an ion beam from the ion gun 102 and the target 103 is sputtered to release the sputtered particles on all the substrates 14 held by the deposition substrate holding jig 10. The film is deposited at a constant incident angle θs (tilt angle). As a material of such a target 103, a desired material to be formed on the substrate 14 can be appropriately adopted. The film forming chamber 101 is connected to a vacuum pump 104 for controlling the internal pressure and obtaining a desired degree of vacuum.

  The film formation substrate holding jig provided in the ion beam sputtering apparatus 100 includes a reference line X1 that connects the target 22 and the position of the center of gravity of the substrate surface of the substrate 14, and a straight line X2 that intersects the film formation surface 14a of the substrate 14 perpendicularly. Is held in the film forming chamber 111 so as to have a predetermined value.

  A vacuum deposition apparatus 110 shown in FIG. 15 includes a deposition chamber 111 as a deposition chamber, a deposition source 112 that is provided in the deposition chamber 111 and generates a vapor flow of a deposition material, and an interior of the deposition chamber 101. A vacuum pump 114 for controlling the pressure and obtaining a desired degree of vacuum, and a film formation substrate holding jig provided in the film formation chamber 111 and holding a plurality of substrates 14 are provided. As indicated by the arrow Y1 in the figure, the film forming material sublimated from the vapor deposition source 112 is continuously incident on all the substrates 14 held by the film forming substrate holding jig at a constant incident angle θs (tilt angle). To do. As a result, the film forming material is deposited on the substrate 14 in an oblique column shape to form a film. As a film forming material, a desired material to be formed on the substrate 14 can be appropriately adopted.

  The deposition substrate holding jig provided in the vacuum deposition apparatus 110 includes a reference line X1 that connects the deposition source 112 and the center of gravity of the substrate surface of the substrate 14, and a straight line X2 that intersects the deposition surface 14a of the substrate 14 perpendicularly. Is held by the holding mechanism so that the angle θ0 is a predetermined value.

  14 and 15, an angle θs formed by a traveling direction of film forming molecules (film forming direction of the film forming material) and a substrate 14 (film forming surface 14 a) on which the film is formed, indicated by an arrow Y 1. The mounting direction of the film formation substrate holding jig 10 can be adjusted as appropriate so that the (incident angle) is constant for all the substrates 14 provided in the film formation substrate holding jig 10. In this embodiment, since oblique vapor deposition is performed, the incident angle θs with respect to the film formation surface 14a of each substrate 14 is set to be less than 90 °.

  If the film-forming substrate holding jigs 10,..., 60 of each embodiment according to the present invention are used, a holding base material that holds the substrate when the film forming process is performed by the ion beam sputtering apparatus 100 and the vacuum deposition apparatus 110. The 12, 21, 31, 41, the first wire 51, and the second wire 52 do not block the film forming molecules. Therefore, the entire film formation surface of the substrate can be exposed.

  Therefore, undeposited portions are generated on the deposition surfaces 14a, 28A, 28A ′, 38A of all the substrates 14, 28, 28 ′, 38 held by the deposition substrate holding jigs 10,. It is possible to form a uniform vapor deposition film over the entire surface without causing the above. Therefore, the formation defect of the vapor deposition film on the substrate can be eliminated, and the film formation process accuracy can be improved.

  Furthermore, the same incident angle θ is applied to the deposition surfaces 14a, 28A, 28A ′, 38A of all the substrates 14, 28, 28 ′, 38 held by the deposition substrate holding jigs 10,. Film-forming molecules can be deposited. As a result, the film thickness can be made uniform, and a deposited film having desired film performance can be obtained.

  Further, even if the incidence of film forming molecules is a low angle incidence of 45 ° or less, it is possible to form a deposited film having good film performance without generating an undeposited portion. In addition, since a plurality of substrates can be placed on the film formation substrate holding jigs 10,..., 60, it is possible to process a large number of substrates at a time, so that work efficiency is good.

  Furthermore, since film formation is performed using the PVD method having a relatively low processing temperature, the influence of heat on the film formation surface of the substrate can be reduced. Therefore, for example, it is possible to prevent damage to wirings, electrodes, and the like disposed on the deposition surface of the substrate.

  By performing the film forming process by the vacuum evaporation method, it is possible to perform the evaporation with a kinetic energy of about the heat speed without giving excessive energy to the film forming molecules. This is advantageous in obliquely aligning the film forming molecules.

  On the other hand, almost all substances such as metals, alloys, compounds, and organic substances can be deposited by performing a film forming process by ion beam sputtering. Moreover, the adhesiveness with respect to a board | substrate is also good.

  Note that the present embodiment is not limited to this, and is not limited to the wording of each claim as long as it does not depart from the scope described in each claim. In addition, improvements based on knowledge that a person skilled in the art normally has can be added as appropriate.

  The inclination angle θ of the holding substrate with respect to the horizontal plane is appropriately determined depending on the desired film performance on the substrate, the size and number of substrates to be held, the conditions when the film forming substrate holding jig is mounted on the film forming apparatus described later, etc. Be considered.

It is a top view which shows schematic structure of the film-forming board | substrate holding jig which concerns on 1st, 2 embodiment. It is a sectional side view which shows schematic structure of the holding base material which concerns on 1st Embodiment. It is explanatory drawing which shows the holding state of the board | substrate by the holding base material which concerns on 1st Embodiment. It is a sectional side view which shows schematic structure of the holding | maintenance base material which concerns on 2nd Embodiment. It is explanatory drawing which shows the holding state of the board | substrate by the holding base material which concerns on 2nd Embodiment. It is a top view which shows schematic structure of the film-forming board | substrate holding jig which concerns on 3rd, 4th embodiment. It is a sectional side view which shows schematic structure of the holding base material which concerns on 3rd Embodiment. It is explanatory drawing which shows the holding state of the board | substrate by the holding base material which concerns on 3rd Embodiment. It is a sectional side view which shows schematic structure of the holding base material which concerns on 4th Embodiment. It is explanatory drawing which shows the holding state of the board | substrate by the holding base material which concerns on 4th Embodiment. It is a perspective view which shows schematic structure of the film-forming board | substrate holding jig which concerns on 5th Embodiment. It is explanatory drawing which shows the holding | maintenance state of the board | substrate by the film-forming board | substrate holding jig which concerns on 5th Embodiment. It is sectional drawing which shows schematic structure of the film-forming board | substrate holding jig which concerns on 6th Embodiment. It is a schematic block diagram of an ion beam sputtering apparatus. It is a schematic block diagram of a vapor deposition apparatus. It is explanatory drawing which shows the incident angle of the film-forming molecule | numerator with respect to the film-forming surface of a board | substrate. It is a sectional side view which shows schematic structure of the film-forming board | substrate holding jig of other conventional embodiment. It is explanatory drawing which shows the subject at the time of forming into a film using the film-forming board | substrate holding jig shown in FIG.

Explanation of symbols

10, 20, 30, 40, 50, 60 ... film formation substrate holding jig, 14, 28, 28 ', 38 ... substrate, 14a, 28A, 28A', 38A ... film formation surface, 13, 26 ... groove (Holding part), 33, 43 ... protrusion (holding part), 51 ... first wire (first wire), 52 ... second wire (second wire), 100 ... ion beam sputtering apparatus, 110 ... vapor deposition apparatus

Claims (7)

An apparatus for manufacturing a film formation substrate for forming a film by oblique growth film method on a surface of a substrate provided with a concave portion or a convex portion on a side surface,
A plurality of holding base materials having holding portions that engage the concave portions or the convex portions,
The holding base material is arranged so as to face the side surface direction of the film formation substrate,
While holding the concave portion or the convex portion of the film formation substrate by the holding portions of the holding base material facing each other,
Than the film-forming surface of the deposition substrate, the surface of the supporting substrate of the film-forming surface side of the deposition substrate is decided not to protrude,
The apparatus for manufacturing a film-forming substrate, wherein the holding portion includes a protrusion protruding toward another adjacent holding substrate. It is possible to hold a plurality of the substrates,
The apparatus for manufacturing a film formation substrate according to claim 1 , wherein a plurality of the holding base materials are provided continuously, and an inclination angle in a protruding direction of the holding portion with respect to a horizontal plane is increased along the connecting direction. An apparatus for manufacturing a film formation substrate for forming a film by oblique growth film method on a surface of a substrate provided with a concave portion or a convex portion on a side surface,
A plurality of first wire rods engaging the concave portion or the convex portion,
The first wire is arranged so as to face the side surface direction of the film formation substrate,
While holding the concave portion or the convex portion of the film formation substrate by the first wire rods facing each other,
The apparatus for manufacturing a film formation substrate, wherein the first wire does not protrude from a film formation surface of the film formation substrate. The apparatus for manufacturing a film-forming substrate according to claim 3, comprising at least a pair of second wires extending perpendicularly to the pair of first wires. It is possible to hold a plurality of the substrates,
It said first wire plurality consecutively provided apparatus for producing a film-forming substrate according to claim 3 or 4, wherein the height position of the first wire is characterized in that it is higher along the continuously provided direction. The oblique deposition film forming method, manufacturing apparatus for deposition substrate according to any one of claims 1 to 5, characterized in that it is oblique evaporation by a vacuum evaporation method. The oblique deposition film forming method, manufacturing apparatus for deposition substrate according to any one of claims 1 to 6, characterized in that the oblique sputtering by ion beam sputtering.

Images