JP4686360B2 - 酸化銅薄膜低摩擦材料とその成膜方法 - Google Patents
酸化銅薄膜低摩擦材料とその成膜方法 Download PDFInfo
- Publication number
- JP4686360B2 JP4686360B2 JP2005505804A JP2005505804A JP4686360B2 JP 4686360 B2 JP4686360 B2 JP 4686360B2 JP 2005505804 A JP2005505804 A JP 2005505804A JP 2005505804 A JP2005505804 A JP 2005505804A JP 4686360 B2 JP4686360 B2 JP 4686360B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- copper oxide
- oxide thin
- friction material
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title claims description 56
- 239000010409 thin film Substances 0.000 title claims description 44
- 239000005751 Copper oxide Substances 0.000 title claims description 40
- 229910000431 copper oxide Inorganic materials 0.000 title claims description 40
- 239000002783 friction material Substances 0.000 title claims description 18
- 239000010408 film Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 17
- 230000015572 biosynthetic process Effects 0.000 title claims description 9
- 239000007789 gas Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 8
- 229910001882 dioxygen Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000002294 plasma sputter deposition Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- -1 fifth Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Inorganic Insulating Materials (AREA)
Description
J.R.Whitehead,Proc.Roy.Soc.,A210(1950)109
この出願の発明である酸化銅薄膜の成膜方法においては、成膜用基板上にCuOを主とする酸化銅薄膜をプラズマ気相成膜する。
そして、この出願の発明のCuO薄膜で特徴的なことは、その結晶構造が異方性を有し、基板配向性を有していることである。
4)(2002)1458に記載の公知の方法に依拠している。
真空度:1×10−5Pa
RFパワー:100W
基板温度:300K
プレスパッタ時間:5分
スパッタ時間:30分
以上の条件において、アルゴンと酸素との混合ガス中における酸素ガス濃度を0〜100%分圧の範囲で変化させ、各々の場合について酸化銅薄膜を成膜した。
Claims (6)
- 成膜用基板上に、CuOをターゲットとして、1×10−4Pa〜1×10−6Paの真空減圧下で、85%以下の分圧の酸素ガスを含有する、希ガス・酸素ガスの混合ガスまたは希ガスのみを導入してプラズマスパッタ成膜し、その組成としてCuOを主とし、大気中および3×10−5Paの真空減圧下のいずれにおいても摩擦係数が0.06以下となる薄膜を形成することを特徴とする酸化銅薄膜低摩擦材料の成膜方法。
- 酸化銅薄膜は結晶配向させていることを特徴とする請求項1の成膜方法。
- 基板上の酸化銅薄膜低摩擦材料であって、その組成においてCuOを主として、大気中および3×10−5Paの真空減圧中のいずれにおいても摩擦係数が0.06以下であることを特徴とする酸化銅薄膜低摩擦材料。
- プラズマ成膜された薄膜であることを特徴とする請求項3の酸化銅薄膜低摩擦材料。
- 酸化銅薄膜は結晶配向されていることを特徴とする請求項3または4の酸化銅薄膜低摩擦材料。
- 請求項3ないし5のいずれかの酸化銅薄膜低摩擦材料により摺動面がコーティングされていることを特徴とする摺動装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005505804A JP4686360B2 (ja) | 2003-04-24 | 2004-04-23 | 酸化銅薄膜低摩擦材料とその成膜方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003120461 | 2003-04-24 | ||
JP2003120461 | 2003-04-24 | ||
PCT/JP2004/005902 WO2004094687A1 (ja) | 2003-04-24 | 2004-04-23 | 酸化銅薄膜低摩擦材料とその成膜方法 |
JP2005505804A JP4686360B2 (ja) | 2003-04-24 | 2004-04-23 | 酸化銅薄膜低摩擦材料とその成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2004094687A1 JPWO2004094687A1 (ja) | 2006-07-13 |
JP4686360B2 true JP4686360B2 (ja) | 2011-05-25 |
Family
ID=33308137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005505804A Expired - Fee Related JP4686360B2 (ja) | 2003-04-24 | 2004-04-23 | 酸化銅薄膜低摩擦材料とその成膜方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7713635B2 (ja) |
EP (1) | EP1642997B1 (ja) |
JP (1) | JP4686360B2 (ja) |
CN (1) | CN1802449A (ja) |
DE (1) | DE602004028620D1 (ja) |
WO (1) | WO2004094687A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2503018B8 (de) * | 2011-03-23 | 2018-11-21 | Oerlikon Metco AG, Wohlen | Plasmaspritzverfahren zum Herstellen einer ionenleitenden Membran |
JP6410869B2 (ja) * | 2017-04-26 | 2018-10-24 | 日東電工株式会社 | 導電性フィルムロールの製造方法 |
US11802330B1 (en) | 2022-08-22 | 2023-10-31 | The Royal Institution for the Advancement of Learning/McGill Concordia University | Gas turbine engine component with copper oxide coating |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003119578A (ja) * | 2001-10-15 | 2003-04-23 | National Institute For Materials Science | 低摩擦材料とその作製方法 |
JP2003277912A (ja) * | 2002-03-26 | 2003-10-02 | National Institute For Materials Science | 酸化銅薄膜の成膜方法 |
-
2004
- 2004-04-23 US US10/554,204 patent/US7713635B2/en not_active Expired - Fee Related
- 2004-04-23 CN CNA2004800108699A patent/CN1802449A/zh active Pending
- 2004-04-23 EP EP04729286A patent/EP1642997B1/en not_active Expired - Fee Related
- 2004-04-23 WO PCT/JP2004/005902 patent/WO2004094687A1/ja active Application Filing
- 2004-04-23 DE DE602004028620T patent/DE602004028620D1/de not_active Expired - Lifetime
- 2004-04-23 JP JP2005505804A patent/JP4686360B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003119578A (ja) * | 2001-10-15 | 2003-04-23 | National Institute For Materials Science | 低摩擦材料とその作製方法 |
JP2003277912A (ja) * | 2002-03-26 | 2003-10-02 | National Institute For Materials Science | 酸化銅薄膜の成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1642997B1 (en) | 2010-08-11 |
CN1802449A (zh) | 2006-07-12 |
US7713635B2 (en) | 2010-05-11 |
WO2004094687A1 (ja) | 2004-11-04 |
US20080113219A1 (en) | 2008-05-15 |
DE602004028620D1 (de) | 2010-09-23 |
EP1642997A4 (en) | 2008-04-02 |
EP1642997A1 (en) | 2006-04-05 |
JPWO2004094687A1 (ja) | 2006-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190172605A1 (en) | Metal oxide thin film, organic electroluminescence element including the thin film, solar cell, and thin film fabrication method | |
Lattemann et al. | Controlled glow to arc transition in sputtering for high rate deposition of carbon films | |
JP4717950B2 (ja) | 磁気光学効果特性測定用の組成傾斜フェライト材料およびフェライトの特性評価方法 | |
Ganesan et al. | Evolution of target condition in reactive HiPIMS as a function of duty cycle: An opportunity for refractive index grading | |
Gnanarajan et al. | Evolution of texture of CeO2 thin film buffer layers prepared by ion-assisted deposition | |
JP4686360B2 (ja) | 酸化銅薄膜低摩擦材料とその成膜方法 | |
Qasim et al. | Effects of ion flux density and energy on the composition of TiNx thin films prepared by magnetron sputtering with an anode layer ion source | |
TWI284361B (en) | Titanium nitride thin film formation on metal substrate by chemical vapor deposition in a magnetized sheet plasma source | |
Rosaz et al. | Development of Nb $ _3 $ Sn coatings by magnetron sputtering for SRF cavities | |
Vargheese et al. | Electron cyclotron resonance plasma source for ion assisted deposition of thin films | |
Christen et al. | Pulsed electron deposition of fluorine-based precursors for YBa2Cu3O7− x-coated conductors | |
Chen et al. | Evaluating substrate bias on the phase-forming behavior of tungsten thin films deposited by diode and ionized magnetron sputtering | |
Gotoh et al. | Formation and control of stoichiometric hafnium nitride thin films by direct sputtering of hafnium nitride target | |
Arif et al. | Characterization of aluminum and titanium nitride films prepared by reactive sputtering under different poisoning conditions of target | |
Sethi et al. | Influence of reactive sputter deposition conditions on crystallization of zirconium oxide thin films | |
JP3837498B2 (ja) | 酸化銅薄膜の成膜方法 | |
Wang et al. | Reactive‐sputter deposition and structure of RuO2 films on sapphire and strontium titanate | |
Han et al. | Surface scaling evolution and dielectric properties of sputter-deposited low loss Mg2SiO4 thin films | |
Sung et al. | Optimum substrate bias condition for TiN thin film deposition using an ECR sputter system | |
Van Hattum et al. | Distinct processes in radio-frequency reactive magnetron plasma sputter deposition of silicon suboxide films | |
Bernstein et al. | Comparison of the temperature dependence of the properties of ion beam and magnetron sputtered Fe films on (100) GaAs | |
Wilde | Development of superconducting thin films for use in SRF cavity applications | |
Wang et al. | Growth of SrTiO3 thin films on LaAlO3 (001) substrates; the influence of growth temperature on composition, orientation, and surface morphology | |
Grafouté et al. | Structural properties of iron oxynitride films obtained by reactive magnetron sputtering | |
Di Giulio et al. | Rf‐sputtering growth of stoichiometric amorphous TeO2 thin films |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070409 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070410 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100803 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101004 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110201 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110214 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140218 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4686360 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140218 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |