JP4667670B2 - Alloy plating apparatus and alloy plating method using the same - Google Patents

Description

【００３３】
【表２】

【００３４】
表１から明らかなように、実施例装置を運転した場合には、通電前後においてめっき液の組成はほとんど変化していない。また析出物におけるＢｉ含有量は５.０質量％であり、めっき液の組成と同じである。
ただし、陰極室８₂の陰極１１の表面にやや曇りが認められ、微量のＳｎが検出されたが、陽極１０の溶解で生成したＳｎイオンのほとんどはめっき液２に供給されていた。
これに反し、比較例の場合は、通電前後でめっき液からＢｉ成分が多量に失われており、析出物は目的の組成になっていない。そして、陽極３の表面は黒色のスポンジ状となり、Ｂｉの置換析出が起こっていることが観察された。
【００３５】
実施例２，比較例２
めっき液として、Ｓｎ濃度５５.０ｇ／Ｌ，Ｃｕ濃度１.０ｇ／Ｌのメタンスルホン酸めっき液を用いたこと、めっき装置Ａの陽極３としてＣｕ板を用いたこと、整流器ａ₁，ａ₂，ａ₃の通電量が、それぞれ、０.４Ａ，１０.５Ａ，１０.５Ａであったこと、通電時間は１時間であったことを除いては、実施例１と同様の条件で装置を運転した。
【００３６】
比較のために、電解装置Ｂと不溶性陽極を用いることなく、陽極としてＳｎ−２％Ｃｕ合金板を用い、通電量１０.９Ａで１時間通電して合金めっきを行った。
得られた析出物につき、実施例１と同様の分析を行った。その結果を表２に示した。
【００３７】
表２から明らかなように、実施例装置を運転した場合には、通電前後においてめっき液の組成はほとんど変化していない。また析出物におけるＣｕ含有量は２.０質量％であり、めっき液の組成と同じである。
ただし、陰極室８₂の陰極１１の表面にやや曇りが認められ、微量のＳｎが検出されたが、陽極１０の溶解で生成したＳｎイオンのほとんどはめっき液２に供給されていた。
【００３８】
これに反し、比較例の場合は、通電前後でめっき液からＢｉ成分が多量に失われており、析出物は目的の組成になっていない。そして、陽極の表面は赤みがかった粗面になり、Ｃｕの置換析出が起こっていることが観察された。
【００３９】
【発明の効果】
以上の説明で明らかなように、本発明の合金めっき装置は、構成金属のうちイオン化電位が貴な金属と卑な金属との間で起こる置換析出を防止できる構造になっているので、多種多様な多元合金の電気めっきを行うことができ、その工業的価値は大である。
【図面の簡単な説明】
【図１】２元合金の電気めっきを行う本発明の合金めっき装置例を示す模式図である。
【図２】３元合金の電気めっきを行う本発明の合金めっき装置例を示す模式図である。
【図３】３元合金の電気めっきを行う本発明の別の合金めっき装置例を示す模式図である。
【符号の説明】
Ａ めっき装置
Ｂ，Ｂ₁，Ｂ₂ 電解装置
Ｃ めっき液供給装置
１ めっき槽
２ めっき液
３，３Ａ 陽極
４ 不溶性陽極
５ 被めっき材
６ 電解槽
７₁，７₁Ａ，７₁Ｂ，７₂ 隔壁部
８₁，８₁Ａ，８₁Ｂ 陽極室
８₂ 陰極室
９ めっき液室
１０，１０Ａ，１０Ｂ 陽極
１１ 陰極
ａ₁，ａ₂，ａ₃，ａ₃Ａ，ａ₃Ｂ 整流器[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an alloy plating apparatus and an alloy plating method using the same, and more particularly to an apparatus for electroplating a multi-component alloy and a plating method using the same.
[0002]
[Prior art]
Regarding the electroplating of alloys, the following methods are conventionally known. For example, when the alloy is a Sn—Pb alloy (solder), the Sn—Pb alloy itself prepared in a predetermined composition is used as an anode, the material to be plated is used as a cathode, and these are placed in a plating solution in a plating tank. Electroplating method, producing separate anodes for Sn and Pb, and applying current corresponding to the target alloy composition to each anode to reduce the amount of Sn and Pb dissolved in the plating solution There is a method of controlling and performing electroplating.
[0003]
In this case, since the ionization potentials of Sn and Pb are very similar, alloy plating by the method as described above is possible.
However, for most alloys, each of the constituent metals has a different ionization potential. Therefore, when a method such as electroplating of the Sn—Pb alloy described above is adopted, a metal that is easily ionized among the constituent metals is preferentially dissolved in the plating solution, whereas a metal that is difficult to ionize is deposited on the anode. The problem occurs. That is, among the constituent metals of the alloy, the former substitutional precipitation occurs based on the contact between a metal having a low (low) ionization potential and a metal having a high (high) ionization potential in the plating solution. Plating cannot be realized.
[0004]
In addition, regarding the electroplating of the alloy, an insoluble anode made of, for example, an Au-Co alloy and a material to be plated are arranged in the plating solution of the plating tank, and the constituent metal of the alloy for plating is a metal soluble in the plating solution. There is also a method of supplying the plating solution in the form of a compound.
In this method, the above substitutional precipitation does not occur. However, in this method, since it is necessary to prepare the constituent metal of the alloy once in the form of a metal compound soluble in the plating solution, the cost increases. In particular, when the constituent metal is a noble metal, the chemical cost for preparing the above metal compound becomes very expensive.
[0005]
In the case of this method, most of the metal compound used is an ionic compound, and the anionic species of the metal compound is accumulated in the plating solution without being consumed during the electroplating process. There is also a problem that the balance is lost.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to solve the above-described problems in conventional alloy plating, to provide an alloy plating apparatus that prevents substitution deposition during plating and does not require the use of expensive chemicals, and an alloy plating method using the same. And
[0007]
[Means for Solving the Problems]
To achieve the above object, in the present invention, the alloy plating apparatus for electroplating a plating alloy in the plated material, deposition apparatus encounters depositing a metal constituting the plating alloy said to be plated material A plating solution containing a cation of the first metal having the highest ionization potential among the metals constituting the plating alloy and a cation of a metal other than the first metal among the metals constituting the plating alloy, a plating tank to the material to be plated is arranged to be the first cathode, and disposed respectively on the plating bath, the main cause cations formed Ri before Symbol first metal from the first metal anode, said precipitation and a insoluble anode which does not dissolve in the plating solution system, and includes an electrolytic device for preparing a plating solution containing a cation of the other metal, the electrolysis device is connected before Symbol plating tank The other metals in the plating solution chamber accumulated a plating solution containing a cation, at least one auxiliary anode cell unit to generate positive ions before Symbol other metals, one in the cathode chamber electrolytic solution stored, the the second negative electrode disposed in the cathode chamber, and a partition between said cathode compartment and said plating liquid chamber, the transmission of the other metal cation containing at least cations to the cathode chamber from the plating solution chamber includes a cathode side septal wall to prevent the sub-anode cell unit is partitioned by the anode-side partition wall, auxiliary anode chamber electrolytic solution stored, and the arranged sub anode compartment, one of said other metals has a secondary anode to generate positive ions of the other metal consists, the anode-side partition wall, in between the auxiliary anode chamber and the plating solution chamber, wherein the auxiliary anode chamber to the plating solution chamber to allow transmission of other metal cations, the auxiliary anode Soyu The cation generated in the plating is added to the plating solution chamber to prepare a plating solution containing the cation of the other metal, and the plating solution containing the cation of the other metal in the plating solution chamber is supplied to the plating tank. alloy plating apparatus is provided, characterized in that the.
Moreover, it is preferable that the electrolyzer includes two sub anode tank units in which other metals forming the sub anode are different from each other.
Furthermore, the electrolytic apparatus is preferably configured to include three sub-anode cell unit with different other metal forming said auxiliary anode to each other.
More preferably, the apparatus further includes a supply device that is disposed between the plating tank and the plating solution chamber and supplies a plating solution containing a cation of the other metal from the plating solution chamber to the plating bath.
[0008]
Further, in the present invention, during operation of the above-described alloy plating apparatus, a plating solution containing a cation of the other metal in the plating solution chamber of the electrolytic device is forcibly applied to the plating tank of the deposition device by the supply device. In addition, an alloy plating method is provided in which electroplating is performed on the material to be plated by the deposition apparatus.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is applicable to electroplating of binary and multi-component alloys. First, an apparatus and method for electroplating a binary alloy will be described with reference to FIG. Prior to the description, the alloy to be plated is indicated by MxNy (M and N are constituent metals, x and y are composition ratios), and the constituent metal M has a higher ionization potential than the constituent metal N. And
[0010]
First, as shown in FIG. 1, the apparatus of the present invention includes a plating apparatus A (deposition apparatus), an electrolysis apparatus B, and a plating solution supply apparatus C.
In the plating apparatus A, a plating solution 2 produced by an electrolysis apparatus B described later is accommodated in a plating tank 1, and an anode 3 made of metal M, an insoluble anode 4 and a material to be plated 5 are contained therein. The rectifiers a ₁ and a ₂ are arranged independently between the anode 3 and the material to be plated 5 and between the insoluble anode 4 and the material to be plated 5.
[0011]
The material of the insoluble anode 4 used at this time may be any material that does not dissolve in the plating solution 2, and examples thereof include a material in which a Ti plate or a Zr plate is covered with Pt or IrO _2. Can do.
Next, the electrolysis apparatus B will be described.
In the electrolyzer B, the inside of the electrolytic cell 6 is fractionated by _two partition walls 7 ₁ and 7 ₂ which will be described later, and three chambers 8 ₁ , 8 ₂ and 9 are formed.
[0012]
Then, in the room 8 ₁ consists anode 10 is disposed anode chamber comprising a constituent metal N, in the room ₈₂ is arranged a cathode 11 made of a material that does not dissolve in an acid, such as stainless steel cathode chamber The rectifier a ₃ is arranged between the anode 10 and the cathode 11.
The chamber 9 located between the anode chamber 8 ₁ and the cathode chamber 8 ₂ is a plating solution chamber in which the plating solution 2 having a desired composition is produced.
[0013]
Here, the partition wall portion ₇₁ which fraction the anode chamber ₈₁ is configured metal M, but cationic species N is permeable, however, possible to prevent the liquid in each room are mixed with each other for example a cation exchange membrane, etc. It consists of Further, partition wall 7 ₂ for fractions a cathode chamber 8 _2, constituent metal M, cationic species N is composed of not penetrate, for example, hydrogen ion permselective membrane and anion exchange membrane.
[0014]
The plating solution chamber 9 of the electrolytic device B and the plating device A are connected by a plating solution supply device C including, for example, a pipe, a pump, and a valve mechanism.
The plating solution 2 produced in the plating solution chamber 9 as described later is supplied to the plating apparatus A by a pump, for example. Then, by operating the rectifiers a ₁ and a ₂ and conducting electroplating by passing a predetermined current between the anode 3 and the material to be plated 5, the surface of the material to be plated 5 is coated with an alloy plating having a predetermined composition. The
[0015]
Next, operation and effects of the apparatus shown in FIG. 1 will be described.
The plating apparatus A and the electrolysis apparatus B contain, for example, an acidic plating solution having a predetermined composition containing the cation species of the constituent metals M and N, operate the rectifiers a ₁ , a ₂ , and a ₃ to energize the electrodes. Then, the plating apparatus A and the electrolysis apparatus B are operated simultaneously. Further, the plating solution supply device C is also operated at the same time to connect the plating device A and the electrolysis device B with the plating solution.
[0016]
Operation start device at the same time, the plating apparatus A, the process proceeds dissolution of the anode 3, constituent metal cation species generated by the M, also electrolyzer anode chamber 8 ₁ In configuration progressed dissolution of the anode 10 a metal N of B Cation species are produced and an anolyte (N) is produced.
At this time, the amount of cation species of the constituent metal M and the amount of cation species of the constituent metal N are controlled by controlling the energization amounts of the anode 3 and the anode 10, respectively. It is preferable to adjust to an amount corresponding to the composition ratio x, y of M and N.
[0017]
Cationic species constituting the metal N generated in the anode chamber 8 ₁ moves through the partition wall ₇₁ into the plating solution chamber 9, also cationic species constituting the metal M generated by the plating apparatus A plating solution supply device It moves to the plating solution chamber 9 via C, and both ionic species merge in this plating solution chamber 9.
At this time, the anode solution in the plating solution and an anode chamber 8 in the _first plating liquid chamber 9 (N), not be mixed with one another by the action of the partition wall _71. Therefore, the constituent metal M is not deposited on the anode 10 by substitution.
[0018]
Although it is possible that the cationic species of the constituent metal M moves through the partition wall ₇₁ to the anode chamber 8 _1, is always biased during operation of the electrolysis apparatus B is applied, constituting the metal M The above-mentioned movement hardly occurs, and the amount of movement is virtually negligible.
On the other hand, since the cation species of the constituent metals M and N supplied to the plating solution chamber 9 are prevented from moving to the cathode chamber 8 ₂ in the partition wall portion 7 ₂ in the above-described operation process, the cathode chamber 8 ₂ contains only the catholyte that does not contain the cation species, so that the constituent metals M and N are not deposited on the cathode 11. Then, in the cathode chamber _82, an anion species are produced exclusively hydrogen is generated, which moves through the partition wall 7 ₂ into the plating liquid chamber 9.
[0019]
In this way, a plating solution having a predetermined concentration is produced in the plating solution chamber 9 without causing substitution deposition between the constituent metals M and N. Then, the plating solution is supplied to the plating apparatus A via the plating solution supply apparatus C and is electroplated on the material 5 to be plated.
Note that, in the apparatus shown in FIG. 1, as described above, since anionic species generated in the cathode chamber ₈₂ moves to the plating solution chamber 9, the anionic species in the plating solution chamber 9 unilaterally increased amount To go. To prevent such problems, it is preferable that the partition wall 7 ₂ hydrogen ion permselective membrane. This is because the movement of the generated anion species to the plating solution chamber 9 can be prevented. Incidentally, in this case, hydrogen ions of the plating solution in the plating liquid chamber 9 is to continue to move to the cathode chamber 8 _2.
[0020]
Next, FIG. 2 shows an example of a ternary alloy plating apparatus.
Here, the ternary alloy is represented by MxNyRz, and the ionization potential of the constituent metal is assumed that the metal R is the lowest and the metal M is the highest. An example of such a ternary alloy is an Ag—Cu—Sn alloy.
This apparatus is composed of a plating apparatus, an electrolysis apparatus, and a plating solution supply apparatus as in the case of the apparatus shown in FIG.
[0021]
Specifically, the electrolysis apparatus has a configuration described later, and in the plating apparatus A, the anode 3A is composed of the constituent metal M having the highest ionization potential. The same.
Here, the electrolysis apparatus B ₁ will be described with reference to FIG.
In the case of this electrolysis apparatus B ₁ , anode chambers 8 ₁ A and 8 ₁ B are continuously arranged inside the electrolytic cell 6. That is, one anode chamber 8 ₁ in the electrolysis apparatus B shown in FIG. 1 is composed of two anode chambers 8 ₁ A and 8 ₁ B via partition walls 7 ₁ A. A cathode chamber 8 ₂ having the same configuration as that of the apparatus of FIG. 1 is provided, and a plating solution chamber 9 is located between the anode chamber 8 ₁ B and the cathode chamber 8 ₂ .
[0022]
Anode chamber 8 ₁ A and an anode chamber 8 ₁ B to be fractions partition wall 7 ₁ A, and an anode chamber 8 ₁ B and the partition wall 7 ₁ B which fractions the plating liquid chamber 9, both, constituent metal M, The cation species of N and R are permeated, but are composed of, for example, a cation exchange membrane capable of preventing mixing of liquids in each room.
In the anode chamber 8 ₁ A provided at a position farthest from the cathode chamber 8 ₂ , the anode ₁₀ A made of the constituent metal R having the lowest ionization potential is disposed, and between this and the cathode 11. The rectifier a ₃ A is arranged, and the anode chamber 8 ₁ B adjacent to the anode chamber 8 ₁ A is arranged with the anode 10B made of the constituent metal N having an ionization potential between the constituent metals M and R. Another rectifier a ₃ B is arranged between the cathode 11 and the cathode 11.
[0023]
In operation of this apparatus, the rectifier a ₁ and the rectifier a so that M, N, and R in amounts corresponding to the composition ratios x, y, and z of the constituent metals M, N, and R in the target alloy plating are dissolved. _2, the energization amount of the rectifier a ₃ A, and the energization amount of the rectifier a ₃ B are controlled.
In the anode chamber 8 ₁ A of the electrolysis apparatus B ₁ , the anode 10 A is dissolved to produce a predetermined amount of cation species of the constituent metal R, and in the anode chamber 8 ₁ B, the anode 10 B is dissolved and the positive portion of the constituent metal N is positive. A predetermined amount of ionic species is generated. Then, the cation species of the constituent metal R sequentially pass through the partition wall portion 7 ₁ A and the partition wall portion 7 ₁ B and move to the plating solution chamber 9, and the cation species of the constituent metal N also pass through the partition wall portion 7 ₁ B. Then, they move to the plating solution chamber 9, which merges with the cation species of the constituent metal M generated by the plating apparatus A in this plating solution chamber 9.
[0024]
At this time, in the anode compartment of the device B _1, the more the anode chamber closer to the cathode chamber 8 _2, since the ionization potential constituent metal of the anode is located nobler, electrolysis current, anode 10A → anode 10B → It flows in the direction of the plating solution chamber 9 → the cathode 11. Accordingly, the constituent metal M of the plating solution chamber 9 cationic species to move toward the anode chamber 8 ₁ B, or the constituent metal N in the anode chamber 8 ₁ in B cation species in the anode chamber 8 ₁ A It is prevented from moving toward.
[0025]
Therefore, a plating solution for ternary alloy plating in which the cation species of the constituent metals M, N, and R are mixed in a predetermined amount is produced in the plating solution chamber 9.
Although the apparatus of FIG. 2 illustrates a ternary alloy plating apparatus, the electrolytic device B _1, and further continuously provided to the anode chamber through the partition wall, and the farthest position from the cathode chamber 8 ₂ ionization potential of the constituent metal of the anode arranged in the anode chamber is formed of a metal which is the most noble, thereafter, by sequentially ionization potential to form the anode of the continuously arranged anodes compartment with metal to become noble, quaternary It can deform | transform into alloy plating apparatuses, such as an alloy and a ternary alloy.
[0026]
FIG. 3 shows another example of a ternary alloy plating apparatus.
In this apparatus, the plating apparatus A and the plating solution supply apparatus C are the same as those in the apparatus shown in FIG. 2, except that the electrolysis apparatus B ₂ is configured as follows.
In this electrolyzer B ₂ , the anode chamber 8 ₁ A for generating the cation species of the constituent metal R and the anode chamber 8 ₁ B for generating the cation species of the constituent metal N are the same as those of the electrolyzer B ₁ shown in FIG. Unlike the case, they are formed independently without being connected to each other.
[0027]
In the case of this electrolysis apparatus B ₂ , there are two types of electrolysis currents: the direction of anode 10 A → plating solution chamber 9 → cathode 11 and the other direction of anode 10 B → plating solution chamber 9 → cathode 11. As a result of the electrolytic current, dissolution of the anode 10A and the anode 10B proceeds, and the respective cation species permeate through the partition walls 7 ₁ B and 7 ₁ A and join in the plating solution chamber 9.
Therefore, also in this electrolysis apparatus B ₂ , the cation species of the constituent metal M in the plating solution chamber 9 do not move to the anode chamber 8 ₁ A or the anode chamber 8 ₁ B, but in the plating solution chamber 9. A plating solution having a predetermined composition is produced.
[0028]
【Example】
Example 1, Comparative Example 1
Bi-Sn alloy plating was performed using the alloy plating apparatus shown in FIG.
In the plating apparatus A of FIG. 1, a Pt-plated Ti plate is used as the insoluble anode 4, a stainless steel plate is used as the material 5 to be plated, a Bi plate is used as the anode 3, and the partition wall portion 7 ₁ is positively charged in the electrolytic unit B ₁ . ion-exchange membrane, using a hydrogen ion permselective membrane on the partition wall 7 _2, Sn plate as the anode 10, the cathode 11 was a stainless steel plate. Note that the area of all electrodes was kept constant at 0.01 m ² .
[0029]
First, 5 L of a methanesulfonic acid plating solution 2 having a Sn concentration of 45.0 g / L and a Bi concentration of 5.0 g / L is prepared, put into the plating tank 1, and the plating solution supply device C is operated to apply a plating device A And the plating solution chamber 9 are connected by the plating solution 2.
On the other hand, the anolyte of Sn concentration 50.0 g / L to the anode chamber 8 ₁ and 1L-up, the cathode chamber 8 ₂ and 1L charged catholyte only methanesulfonic acid.
[0030]
In this state, rectifier a ₁ was activated to energize 0.5A, rectifier a ₂ was activated to energize 11.3A, and rectifier a ₃ was energized to energize 11.3A.
After energizing for 50 minutes, the stainless steel plate 5 was taken out, the precipitate was peeled off, and bulk fluorescent X-ray analysis was performed to determine the Bi content. In addition, the composition of the plating solution in the plating apparatus A was also analyzed by the volume method.
[0031]
For comparison, electroplating was performed under the same conditions as in Example 1 except that the electrolysis apparatus B was not used and the insoluble anode 4 was not operated. Analysis was carried out. The above results are collectively shown in Table 1.
[0032]
[Table 1]

[0033]
[Table 2]

[0034]
As is apparent from Table 1, when the example apparatus was operated, the composition of the plating solution hardly changed before and after energization. The Bi content in the precipitate is 5.0% by mass, which is the same as the composition of the plating solution.
However, slightly cloudy was observed on the surface of the cathode chamber 8 ₂ of the cathode 11, but Sn traces were detected, most of the Sn ions generated by dissolution of the anode 10 was supplied to the plating liquid 2.
On the other hand, in the case of the comparative example, a large amount of Bi component is lost from the plating solution before and after energization, and the precipitate does not have the target composition. And it was observed that the surface of the anode 3 became black sponge-like and Bi substitutional precipitation occurred.
[0035]
Example 2 and Comparative Example 2
A methanesulfonic acid plating solution having a Sn concentration of 55.0 g / L and a Cu concentration of 1.0 g / L was used as the plating solution, a Cu plate was used as the anode 3 of the plating apparatus A, and rectifiers a ₁ and a ₂ , A ₃ energizing amounts were 0.4A, 10.5A, 10.5A, respectively, and the energizing time was 1 hour, and the apparatus was operated under the same conditions as in Example 1. Drove.
[0036]
For comparison, without using the electrolysis apparatus B and the insoluble anode, an Sn-2% Cu alloy plate was used as the anode, and the alloy was plated by energizing for 1 hour at an energization amount of 10.9 A.
The obtained precipitate was analyzed in the same manner as in Example 1. The results are shown in Table 2.
[0037]
As is apparent from Table 2, when the example apparatus was operated, the composition of the plating solution hardly changed before and after energization. Further, the Cu content in the precipitate is 2.0 mass%, which is the same as the composition of the plating solution.
However, slightly cloudy was observed on the surface of the cathode chamber 8 ₂ of the cathode 11, but Sn traces were detected, most of the Sn ions generated by dissolution of the anode 10 was supplied to the plating liquid 2.
[0038]
On the other hand, in the case of the comparative example, a large amount of Bi component is lost from the plating solution before and after energization, and the precipitate does not have the target composition. Then, it was observed that the surface of the anode became a reddish rough surface, and Cu precipitation was occurring.
[0039]
【The invention's effect】
As is clear from the above description, the alloy plating apparatus of the present invention has a structure that can prevent substitutional precipitation that occurs between a noble metal and a noble metal having an ionization potential among the constituent metals. The multi-component alloy can be electroplated, and its industrial value is great.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an example of an alloy plating apparatus of the present invention for performing electroplating of a binary alloy.
FIG. 2 is a schematic view showing an example of an alloy plating apparatus of the present invention for performing electroplating of a ternary alloy.
FIG. 3 is a schematic view showing another example of an alloy plating apparatus of the present invention for performing electroplating of a ternary alloy.
[Explanation of symbols]
A plating apparatus B, B ₁ , B ₂ electrolysis apparatus C plating solution supply apparatus 1 plating tank 2 plating solution 3, 3A anode 4 insoluble anode 5 material 6 electrolysis tank 7 ₁ , 7 ₁ A, 7 ₁ B, 7 ₂ Partition section 8 ₁ , 8 ₁ A, 8 ₁ B Anode chamber 8 ₂ Cathode chamber 9 Plating solution chamber 10, 10A, 10B Anode 11 Cathode a ₁ , a ₂ , a ₃ , a ₃ A, a ₃ B Rectifier

Claims (5)

In an alloy plating apparatus for electroplating a plating alloy on a material to be plated,
A deposition apparatus for precipitating a metal constituting the plating alloy on the material to be plated, the first metal cation having the highest ionization potential among the metals constituting the plating alloy and the metal constituting the plating alloy Among them, a plating solution containing a cation of a metal other than the first metal is stored, and a plating tank in which the material to be plated serving as a first cathode is to be disposed , and the first metal disposed in the plating tank, respectively. depositing device comprising a main anode which generates the formation Ri before Symbol first metal cation from the insoluble anode which does not dissolve in the plating solution, and
Electrolytic apparatus for preparing a plating solution containing a cation of another metal
With
The electrolyzer is
Is connected before Symbol plating tank, the plating solution chamber accumulated a plating solution containing a cation of the other metal,
At least one auxiliary anode cell unit for generating positive ions before Symbol other metals,
One cathode chamber in which the electrolyte is stored ,
The second negative electrode disposed in the cathode chamber, and a partition between said cathode compartment and said plating solution chamber, transmission from the plating solution chamber of the other metal cation containing at least cations to the cathode chamber to prevent the cathode side septal wall
It includes,
The sub-anode unit is
Partitioned by the anode-side partition wall, auxiliary anode chamber electrolytic solution stored, and the arranged sub anode chamber has an auxiliary anode for generating positive ions of the other metal consists one of the other metals ,
The anode-side partition wall is
At between the auxiliary anode chamber and the plating solution chamber, and allow transmission of the said other metal cations from the secondary anode chamber into the plating solution chamber,
A cation generated in the sub-anode tank unit is added to the plating solution chamber to prepare a plating solution containing a cation of the other metal,
An alloy plating apparatus, wherein a plating solution containing a cation of the other metal in the plating solution chamber is supplied to the plating tank .   2. The alloy plating apparatus according to claim 1, wherein the electrolysis apparatus includes two sub-anode tank units in which other metals forming the sub-anode are different from each other. The electrolysis apparatus, alloy plating apparatus according to claim 1, characterized in that it comprises three sub-anode cell unit with different other metal forming said auxiliary anode to each other. The apparatus further comprises a supply device that is disposed between the plating tank and the plating solution chamber and supplies a plating solution containing a cation of the other metal from the plating solution chamber to the plating vessel. The alloy plating apparatus in any one of -3. During the operation of the alloy plating apparatus according to claim 4, the precipitation is performed while forcibly adding a plating solution containing a cation of the other metal in the plating solution chamber of the electrolytic device to the plating tank of the deposition device by the supply device. An alloy plating method comprising performing electroplating on the material to be plated with an apparatus.

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