JP4650936B2 - Method of fixing semiconductor element fixing clip - Google Patents

Method of fixing semiconductor element fixing clip Download PDF

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JP4650936B2
JP4650936B2 JP2005194268A JP2005194268A JP4650936B2 JP 4650936 B2 JP4650936 B2 JP 4650936B2 JP 2005194268 A JP2005194268 A JP 2005194268A JP 2005194268 A JP2005194268 A JP 2005194268A JP 4650936 B2 JP4650936 B2 JP 4650936B2
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semiconductor element
clip
fixing
fixed object
leg
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JP2007013008A (en
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正男 加藤岡
修二 横山
良正 川島
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Sansha Electric Manufacturing Co Ltd
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Sansha Electric Manufacturing Co Ltd
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Description

本発明は，半導体素子を放熱体あるいは筐体へ固定する方法に関する。   The present invention relates to a method for fixing a semiconductor element to a radiator or a housing.

従来，半導体素子を放熱体あるいは筐体へ固定する方法として，金属板の弾性を利用したクリップ方式が採用され，特許文献１〜４にその方法が開示されている。   Conventionally, as a method of fixing a semiconductor element to a heat radiating body or a casing, a clip method using the elasticity of a metal plate has been adopted, and Patent Documents 1 to 4 disclose the method.

図４に従来のクリップ１を使って半導体素子４の固定を行っている一例を示す。図４において、プリント基板６に実装されている半導体素子４は概Ｕ字型に折曲加工した金属性のクリップ１によって、固定物である筐体５のクリップ装着スペース５ｂを使って、筐体５と一体に形成された筐体放熱壁５ａに固定されている。図に示すように、筐体壁面内側にはクリップ装着スペース５ｂが設けられ、このクリップ装着スペース５ｂにクリップ１の固定物側の２脚が挿入配置される。
FIG. 4 shows an example in which the semiconductor element 4 is fixed using the conventional clip 1. In FIG. 4, a semiconductor element 4 mounted on a printed circuit board 6 has a metal clip 1 bent into a substantially U shape, and uses a clip mounting space 5b of the casing 5 which is a fixed object. 5 is fixed to a housing heat radiating wall 5 a formed integrally with the housing 5. As shown in the figure, a clip mounting space 5b is provided on the inner wall surface of the housing, and two legs on the fixed object side of the clip 1 are inserted into the clip mounting space 5b.

前記のクリップ１は，半導体素子４を固定するというその目的から，クリップ１の両脚２間の挟み強度は強く，又サイズは小さいため，クリップ１の脚２を開き，半導体素子４と筐体放熱壁５ａなどの固定物とを挟む作業は困難であった。
特開平９―１０２６８２号公報 実開平３―０７１６９６号公報 実開平１―１６２２４９号公報 特開昭６１―２１２１００号公報 For the purpose of fixing the semiconductor element 4, the clip 1 has a strong pinch strength between the legs 2 of the clip 1 and is small in size. It was difficult to sandwich a fixed object such as the wall 5a.
JP-A-9-102682 Japanese Utility Model Publication No. 3-071696 Japanese Utility Model Publication No. 1-162249 JP 61-212100 A

半導体素子４を固定するクリップ１の挟み強度が強く，前記のクリップ１の脚２を開き，半導体素子４と放熱体あるいは筐体とを挟み込む作業が困難な点である。   The clip 1 for fixing the semiconductor element 4 has a strong pinching strength, and it is difficult to open the leg 2 of the clip 1 and sandwich the semiconductor element 4 and the radiator or the housing.

第一の発明は、半導体素子４を放熱体あるいは筐体５からなる固定物にクリップ１を用いて固定する作業において、クリップ１の半導体素子側の脚２ａの先端部２ｃに穴３を開け、クリップ１の固定物側脚２ｂを固定物の先端へ引っ掛けた状態で、この穴３に例えば細いネジ回し７を差し入れて容易にクリップ１の脚２を開き、固定物側脚２ｂをクリップ装着スペース５ｂに挿入し、これと半導体側の脚２ａで半導体素子４を固定するクリップの固定方法を提供するものである。
In the first invention, in the operation of fixing the semiconductor element 4 to a fixed object composed of a heat radiating body or a housing 5 using the clip 1, a hole 3 is formed in the tip 2c of the leg 2a on the semiconductor element side of the clip 1, With the fixed object side leg 2b of the clip 1 hooked to the tip of the fixed object, for example, a thin screwdriver 7 is inserted into the hole 3 to easily open the leg 2 of the clip 1, and the fixed object side leg 2b is opened to the clip mounting space. A clip fixing method is provided in which the semiconductor element 4 is fixed with the leg 2a on the semiconductor side by inserting it into 5b.

第二の発明は、クリップ１の半導体素子側の脚２ａの先端部２ｃを外側へほぼ一周カール９させて略円筒形状部１０を形成し、半導体素子４を放熱体あるいは筐体５にクリップ１を用いて固定する作業において、クリップ１の固定物側脚２ｂを固定物の先端へ引っ掛けた状態で、例えば細いネジ回し７を略円筒形状部に差し入れて容易にクリップウ１の脚２を開き、固定物側脚２ｂをクリップ装着スペース５ｂに挿入し、これと半導体側の脚２ａで半導体素子４を固定するクリップの固定方法を提供するものである。
In the second invention, the tip 2c of the leg 2a on the side of the semiconductor element of the clip 1 is curled almost once around the outer side 9 to form a substantially cylindrical portion 10, and the semiconductor element 4 is attached to the radiator 1 or the housing 5 by the clip 1. In the operation of fixing using the screw, with the fixed object side leg 2b of the clip 1 hooked to the tip of the fixed object, for example, a thin screwdriver 7 is inserted into the substantially cylindrical portion to easily open the leg 2 of the clip 1 The fixed object side leg 2b is inserted into the clip mounting space 5b, and the clip fixing method for fixing the semiconductor element 4 with the leg 2a on the semiconductor side is provided.

半導体素子４を放熱体あるいは筐体５に固定する作業が容易になり，作業性が改善される。   The work of fixing the semiconductor element 4 to the heat radiating body or the housing 5 is facilitated, and the workability is improved.

クリップ１を用いて半導体素子４を放熱体あるいは筐体５へ固定する作業において，容易に固定の作業を行うという目的をクリップ１の基本形状・機能を変えることなく実現した。   In the operation of fixing the semiconductor element 4 to the heat radiating body or the housing 5 using the clip 1, the object of performing the fixing operation easily is realized without changing the basic shape and function of the clip 1.

図１に第一の発明による半導体素子固定用クリップ１を示す。金属製半導体素子固定用クリップ１の半導体素子側の脚２ａの先端部２ｃに，ネジ回し７などの道具を差し込むための穴３を開けた。   FIG. 1 shows a semiconductor element fixing clip 1 according to the first invention. A hole 3 for inserting a tool such as a screwdriver 7 was made in the tip 2c of the leg 2a on the semiconductor element side of the metal semiconductor element fixing clip 1.

図２にネジ回し７を使って，第一の発明であるのクリップ１の脚２を開く動作を示す。図示しているように，クリップ１の固定物側の脚２ｂの一部を筐体放熱壁５ａなどの固定物に引っ掛け，クリップ１を支えた状態で脚２を開く操作を行う。   FIG. 2 shows an operation of opening the leg 2 of the clip 1 according to the first invention using the screwdriver 7. As shown in the drawing, a part of the leg 2b on the fixed object side of the clip 1 is hooked on a fixed object such as the housing heat radiating wall 5a, and the leg 2 is opened while the clip 1 is supported.

図３に第一の発明のクリップ１を用いて，半導体素子４を筐体放熱壁５ａに固定する作業を説明する。
図３において，プリント基板６に実装されている半導体素子４は概Ｕ字型に折り曲げ加工した金属製のクリップ１によって，筐体５のクリップ装着スペース５ｂを使って，クリップ１の固定物側の脚２ｂの一部を筐体放熱壁５ａの先端へ引っ掛けた状態で，ネジ回し７のように先端が細くなった道具を用いて，図２に示したように脚２を開き，筐体５と一体に形成された筐体放熱壁５ａと半導体素子４をクリップ１で挟み，半導体素子４の固定を行っている。 An operation of fixing the semiconductor element 4 to the housing heat radiating wall 5a using the clip 1 of the first invention will be described with reference to FIG.
In FIG. 3, the semiconductor element 4 mounted on the printed circuit board 6 is formed on the fixed object side of the clip 1 by using a clip mounting space 5 b of the housing 5 by a metal clip 1 bent into a substantially U shape. With a part of the leg 2b hooked to the tip of the casing heat radiating wall 5a, the leg 2 is opened as shown in FIG. The semiconductor heat radiating wall 5a formed integrally with the semiconductor element 4 is sandwiched between the clips 1, and the semiconductor element 4 is fixed.

前記の実施例はネジ回し７のような棒状の道具を使ってクリップ１の脚２を開き、半導体素子４を固定する実施例を説明したが、以下に参考例について、説明をする。
Examples of the open legs 2 of the clip 1 with a rod-shaped tool such as a screwdriver 7 has been described an embodiment for fixing the semiconductor element 4, reference example will now be described.

図５に第一の参考例を示す。クリップ１の両脚２の先端部２ｃそれぞれに穴３を開け、スナップリングプライヤー８の先端を穴に差し入れ、クリップ１の脚２を開くようにする。この場合は、前述の実施例のように、クリップ１を開く前にクリップ１の固定物側の脚２ｂの一部を筐体放熱壁５ａの先端へ引っ掛けて、クリップ１を支えることはない。クリップ１の形状に合わせて、スナップリングプライヤー８の形状は、先端がストレートタイプや、先曲がりタイプ１１を選定して、使用することができる。
FIG. 5 shows a first reference example . A hole 3 is formed in each of the tip portions 2c of both legs 2 of the clip 1, and the tip of the snap ring pliers 8 is inserted into the hole so that the leg 2 of the clip 1 is opened. In this case, unlike the above-described embodiment , the clip 1 is not supported by hooking a part of the leg 2b on the fixed object side of the clip 1 to the tip of the housing heat radiating wall 5a before opening the clip 1. According to the shape of the clip 1, the snap ring pliers 8 can be used by selecting the straight type or the forward bending type 11 as the tip.

図６に第二の発明によるクリップの実施例を示す。第一の発明によるクリップ１と共通する部位は同一の番号を用いている。第一の発明によるクリップ１と異なる部分について説明をする。クリップ１の半導体素子側の脚２ａの先端部２ｃを外側へほぼ一周カールさせて，ネジ回し７などの道具を差し込むための略円筒形状部１０を形成する。   FIG. 6 shows an embodiment of a clip according to the second invention. The parts common to the clip 1 according to the first invention use the same numbers. A different part from the clip 1 by 1st invention is demonstrated. The tip 2c of the leg 2a on the semiconductor element side of the clip 1 is curled almost once outward to form a substantially cylindrical portion 10 into which a tool such as a screwdriver 7 is inserted.

ネジ回しなどの道具を使って，第二の発明であるクリップ１の脚２を開く操作を説明する。第一の発明であるクリップ１の脚２を開く操作と同様に，クリップ１の固定物側の脚２ｂの一部を筐体放熱壁５ａなどの固定物に引っ掛け，クリップ１を支えた状態で前記の略円筒形状部１０にネジ回し７などの道具を指し込み，クリップ１の脚２を開く。   The operation of opening the leg 2 of the clip 1 according to the second invention using a tool such as a screwdriver will be described. Similarly to the operation of opening the leg 2 of the clip 1 according to the first invention, a part of the leg 2b on the fixed object side of the clip 1 is hooked on a fixed object such as the housing heat radiating wall 5a and the clip 1 is supported. A tool such as a screwdriver 7 is inserted into the substantially cylindrical portion 10 and the leg 2 of the clip 1 is opened.

図７に第二の参考例を示す。クリップ１の両脚２の先端部２ｃをそれぞれ外側へほぼ一周カールさせて、略円筒形状部１０を形成する。スナップリングプライヤー８の先端を前記の略円筒形状部１０に差し入れ、クリップ１の脚２を開くようにする。
FIG. 7 shows a second reference example . The tip portions 2c of the legs 2 of the clip 1 are each curled almost once outward to form a substantially cylindrical portion 10. The tip of the snap ring pliers 8 is inserted into the substantially cylindrical portion 10 so that the leg 2 of the clip 1 is opened.

半導体素子固定用クリップ１と類似した目的と形状を有し，市販され一般に利用されているものに，書類などを綴じるためのクリップが有る。前記の書類用のクリップに対し専用の綴じ具は有るが，前記の綴じ具を使用せずに書類などを直接手で綴じようとする場合は，半導体素子固定用クリップ１の場合と同様に，綴じる作業は困難である。前記の書類などを綴じるクリップに対しても，本発明を応用すれば，使用する道具はねじ回しでなくとも，例えばボールペンのペン先や挟みなどの手近な文具を使用して，書類を容易に綴じることが可能である。   A clip for binding a document or the like is one that has a similar purpose and shape as the semiconductor element fixing clip 1 and is commercially available. Although there is a binding tool dedicated to the document clip, when the document is directly bound by hand without using the binding tool, as in the case of the semiconductor element fixing clip 1, Stitching is difficult. Even if the present invention is applied to the clip for binding the document etc., it is easy to use the stationery such as a pen of a ballpoint pen or a pinch, even if the tool to be used is not a screwdriver. It is possible to bind.

第一の発明によるクリップの図Illustration of clip according to the first invention 第一の発明によるクリップの脚を広げる操作を示す図The figure which shows operation which expands the leg of the clip by 1st invention 第一の発明によるクリップを使用した半導体の固定方法を示す図The figure which shows the fixing method of the semiconductor which uses the clip by 1st invention 従来のクリップを用いた半導体固定の構造を示す図The figure which shows the structure of semiconductor fixation using the conventional clip 第一の参考例によるクリップの図Illustration of clip according to the first reference example 第二の発明によるクリップの図Illustration of the clip according to the second invention 第二の参考例によるクリップの図Illustration of clip according to the second reference example

符号の説明Explanation of symbols

１ クリップ
２ 脚
２ａ 半導体素子側の脚
２ｂ 固定物側の脚
２ｃ 脚の先端部
３ 穴
４ 半導体素子
５ 筐体
５ａ 筐体放熱壁（固定物）
５ｂ クリップ装着スペース
６ プリント基板
７ ネジ回し
８ スナップリングプライヤー
９ カール
１０ 略円筒形状部
１１ 先曲がりタイプ 1 Clip 2 Leg 2a Semiconductor Element Side Leg 2b Fixed Object Side Leg 2c Leg Tip 3 Hole 4 Semiconductor Element 5 Housing 5a Housing Radiation Wall (Fixed Object)
5b Clip mounting space 6 Printed circuit board 7 Screwdriver 8 Snap ring pliers 9 Curl 10 Substantially cylindrical part 11 Pre-curved type

Claims (2)

金属板を概Ｕ字型に折り曲げ加工し、放熱体あるいは筐体からなる固定物側に配置される固定物側脚と、半導体素子側に配置される半導体素子側脚とを有し、前記固定側脚と前記半導体素子側脚とで半導体素子と前記固定物とを挟み込み、前記金属板の弾性を利用して前記固定物に前記半導体素子を固定する半導体素子固定用のクリップにおいて、前記半導体素子側脚の先端部に穴を開け、前記固定物側脚の一部を前記固定物の先端へ引っ掛けた状態で、前記穴に棒状の道具を差し込み、前記半導体素子側脚を前記固定物側脚に対して開けるように構成したことを特徴とする半導体素子固定用クリップの固定方法。 The metal plate is bent into a substantially U-shape, and has a fixed object side leg disposed on the fixed object side composed of a radiator or a housing, and a semiconductor element side leg disposed on the semiconductor element side, and the fixing In a semiconductor element fixing clip for sandwiching a semiconductor element and the fixed object between a side leg and the semiconductor element side leg, and fixing the semiconductor element to the fixed object using elasticity of the metal plate, the semiconductor element A hole is made in the tip of the side leg, and a part of the fixed object side leg is hooked on the tip of the fixed object, and a rod-like tool is inserted into the hole, and the semiconductor element side leg is connected to the fixed object side leg. A method for fixing a semiconductor element fixing clip , wherein the clip is configured to be opened with respect to the semiconductor element. 金属板を概Ｕ字型に折り曲げ加工し、放熱体あるいは筐体からなる固定物側に配置される固定物側脚と、半導体素子側に配置される半導体素子側脚とを有し、前記固定側脚と前記半導体素子側脚とで半導体素子と前記固定物とを挟み込み、前記金属板の弾性を利用して前記固定物に前記半導体素子を固定する半導体素子固定用のクリップにおいて、前記半導体素子側脚の先端部を外側へほぼ一周カールさせて略円筒形状部を形成し、前記固定物側脚の一部を前記固定物の先端へ引っ掛けた状態で、前記略円筒形状部に棒状の道具を差し込み、前記半導体素子側脚を前記固定物側脚に対して開けるように構成したことを特徴とする半導体素子固定用クリップの固定方法。 The metal plate is bent into a substantially U-shape, and has a fixed object side leg disposed on the fixed object side composed of a radiator or a housing, and a semiconductor element side leg disposed on the semiconductor element side, and the fixing In a semiconductor element fixing clip for sandwiching a semiconductor element and the fixed object between a side leg and the semiconductor element side leg, and fixing the semiconductor element to the fixed object using elasticity of the metal plate, the semiconductor element A substantially cylindrical portion is formed by curling the distal end portion of the side leg substantially once around the outside, and a rod-like tool is formed on the substantially cylindrical portion with a part of the fixed leg being hooked on the distal end of the fixed object. A method of fixing a semiconductor element fixing clip, wherein the semiconductor element side leg is opened with respect to the fixed object side leg.
JP2005194268A 2005-07-01 2005-07-01 Method of fixing semiconductor element fixing clip Active JP4650936B2 (en)

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Publication number Priority date Publication date Assignee Title
TWI396495B (en) * 2009-12-24 2013-05-11 Qisda Corp Fixing frame and electronic apparatus
CN103545274B (en) * 2013-06-28 2017-08-01 青岛美奂电子科技有限公司 Radiate clamp fixed structure and the instrument for dismounting the radiating clamp
JP6134823B2 (en) * 2016-01-22 2017-05-24 アトムメディカル株式会社 Release tool for identification wristband

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208762A (en) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Device for contacting under pressure solid state unit with heat sink member
JPH0493200U (en) * 1990-12-25 1992-08-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208762A (en) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Device for contacting under pressure solid state unit with heat sink member
JPH0493200U (en) * 1990-12-25 1992-08-13

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