JP4647817B2 - Electronic endoscope - Google Patents

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JP4647817B2
JP4647817B2 JP2001107527A JP2001107527A JP4647817B2 JP 4647817 B2 JP4647817 B2 JP 4647817B2 JP 2001107527 A JP2001107527 A JP 2001107527A JP 2001107527 A JP2001107527 A JP 2001107527A JP 4647817 B2 JP4647817 B2 JP 4647817B2
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frame
optical
lens
imaging
lens frame
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JP2002301012A (en
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勝 都築
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Olympus Corp
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Olympus Corp
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【0001】
【発明の属する技術分野】
本発明は、撮像素子枠とレンズ枠とで撮像ユニットを構成した電子内視鏡に関する。
【0002】
【従来の技術】
近年、細長の挿入部を体腔内に挿入することにより、体腔内臓器などを観察したり、必要に応じて処置具チャンネル内に挿通した処置具を用いて各種治療・処置のできる内視鏡が広く利用されている。また、内視鏡は、医療用のみならず工業用においてもボイラや機械及び化学プラントなどの管内、或いは、エンジン内部の観察及び検査などに用いられている。
【0003】
上述のように用いられる内視鏡には挿入部の先端部に電荷結合素子(以下CCDと記載)などの固体撮像素子を配設し、このCCDに結像した内視鏡像をモニタ画面に表示させて観察を行う電子内視鏡がある。
【0004】
この電子内視鏡では挿入部の先端部にCCDを配設した撮像素子枠と、光学レンズを配設したレンズ枠とを一体に構成した撮像ユニットが内蔵されている。この撮像ユニットでは撮像素子枠とレンズ枠との光軸方向の位置調整を行って、撮像素子枠に設けられているCCDの撮像面に、レンズ枠に固設されている光学レンズを通過した光学像がはっきりと結像するようにしてある。
【0005】
そして、撮像素子枠とレンズ枠との光軸方向の位置調整を図5(a)、(b)に示すように行っていた。
図5(a)に示すように撮像素子枠101とレンズ枠102とを螺合して構成する撮像ユニット100Aでは、光軸方向の位置調整を行う際、撮像素子枠101とレンズ枠102との螺合部103の螺合状態を変化させて行う。
【0006】
一方、図5(b)に示すように撮像素子枠101とレンズ枠102とに嵌合部104を設けて構成する撮像ユニット100Bでは、光軸方向の位置調整を行う際、撮像素子枠101とレンズ枠102との嵌合長を変化させて行う。
【0007】
【発明が解決しようとする課題】
しかしながら、図5(a)で示したように螺合部103の螺合状態を変化させてピント調整を行う撮像ユニット100Aでは、ネジとネジ山との間にクリアランスがあるので、回転させながらの調整が難しく、ピント調整後に接着剤を塗布して接着剤を乾燥固化させた際、接着剤が収縮することによってクリアランスの分だけ位置ずれが発生するおそれがあった。また、レンズ枠102を回転させるために例えばかに目レンチ等を配置するためのスペースが必要になって太径化の要因になっていた。
【0008】
これに対して、図5(b)で示したように嵌合部104の嵌合長を変化させてピント調整を行う撮像ユニット100Bでは、撮像素子枠101とレンズ枠102とを一点鎖線で示すようにビス105で図示しないピント調整治具に固定しなければならないので、このビス105の固定代分だけ嵌合長を短くなって撮像素子枠101とレンズ枠102とががたついてしまったり、軸ずれが発生するおそれがあった。
【0009】
そして、この嵌合長を短くすることによって発生する不具合を解消するために嵌合長を十分にとると、その分レンズ枠102の長さが長くなって、内視鏡の硬質長が増加する要因になるという不具合があった。
【0010】
本発明は上記事情に鑑みてなされたものであり、硬質長を長くすることや、外形寸法を太径にすることなく、光学性能の良好な撮像ユニットを備えた電子内視鏡を提供することを目的にしている。
【0011】
【課題を解決するための手段】
本発明の電子内視鏡は、撮像光学系を構成する固体撮像素子を固設した撮像素子枠と、前記固体撮像素子の撮像面に光学像を結像させる対物光学系を構成する光学レンズを固設したレンズ枠とで撮像ユニットを構成する電子内視鏡であって、
前記レンズ枠の外周を、前記撮像素子枠が外嵌配置される嵌合部と、先端部に位置して外周面に雄ネジを形成した凸部とで構成している。
【0012】
この構成によれば、凸部に設けた雄ネジをピント出し治具への取付け部にすることにより、凸部の基端からレンズ枠の基端までの外周が嵌合部になる。
【0013】
【発明の実施の形態】
以下、図面を参照して本発明の実施の形態を説明する。
図1ないし図4は本発明の一実施形態に係り、図1は電子内視鏡を構成する撮像ユニットを説明する図、図2は撮像ユニットに設けられる回路基板を説明する図、図3はピント調整治具によるピント調整を説明する図、図4は撮像ユニットを配置した内視鏡の構成例を説明する図である。
【0014】
なお、図2(a)は図1のA−A線断面図、図2(b)は図1のB−B線断面図、図2(c)は図1のC−C線断面図、図3(a)はピント調整治具に撮像ユニットを構成する撮像素子枠とレンズ枠とを取り付けた状態を示す図、図3(b)は図3(a)のA部拡大図である。
【0015】
図1に示すように本実施形態の電子内視鏡を構成する撮像ユニット1は、例えば被検部位の観察画像を得るための固体撮像素子であるCCD11を有する撮像光学系10と、前記CCD11の撮像面に光学像を結像させる複数の光学レンズ21を有する対物光学系20とで主に構成されている。
【0016】
前記CCD11は撮像素子枠12に固定されている。このCCD11の撮像面の前面には光透過性の被覆部材であるCCDカバーガラス(以下カバーガラスと略記する)13が配設され、このカバーガラス13の前面には光学レンズ14が配設されている。
【0017】
また、図1及び図2(a)、(b)、(c)に示すように前記CCD11の反撮像面側にはこのCCD11に電気的に接続された第1回路基板15及び第2回路基板16が配設されている。この第1回路基板15の一面であるCCD側面には電子部品17が実装され、前記第2回路基板16の両面には電子部品17が実装されている。これは、回路基板15、16間に電子部品17を配置させて基板間のデッドスペースをなくすためである。そして、各回路基板15、16に設けられた電気接点部15a、16aには信号ケーブル18内に挿通された複数の信号線19、…、19の中から対応する信号線19a、19b、19cが接続されている。
【0018】
前記信号ケーブル18内に挿通される信号線19a、19b、19cは、前記信号ケーブル18の外径の細径化を図るため各信号線19a、19b、19cの径寸法を必要に応じて変えている。つまり、信号線19a、信号線19b、信号線19cの順に線径が細径になっている。そして、信号線19を電気接点部に接続する際には径寸法が太径な信号線19aから信号線19b、信号線19cと半田付け等の接続を行う。このことにより、信号線19の芯線の断線が防止されるとともに、接続作業を安定的に行える。
【0019】
一方、前記対物光学系20を構成する複数の光学レンズ21は、レンズ枠22の内孔に例えば接着によって固設されている。このレンズ枠22の外周面には前記撮像素子枠12が外嵌配置される嵌合部23と、先端部で所定の幅寸法で突設した凸部24とが設けられている。この凸部24の外周面には雄ネジ25が形成してある。
【0020】
したがって、前記撮像素子枠12をレンズ枠22に外嵌配置させていくと、撮像素子枠12の先端が前記凸部24の基端側に当接する。このとき、前記凸部24の雄ネジ25は、撮像素子枠12の先端外周面より外側に突出しない。
【0021】
なお、本実施形態においては前記第2回路基板16の両面に電子部品17を実装させて基板間のデッドスペースをなくすようにしているが、第1回路基板15の両面に電子部品17を実装して基板間のデッドスペースをなくすようにしてもよい。
【0022】
また、実装させる電子部品17の数が少ない場合には基板どうしが対向する面とは反対側に電子部品17を実装する。このことによって、両回路基板15、16の電子部品17の実装されていない面どうしを略密着させて撮像ユニット1の硬質長の短縮化を図れる。
【0023】
さらに、前記電子部品17及び信号線19は第1の封止樹脂41で覆われるとともに、第2の封止樹脂42で覆われて撮像ユニット1の硬質部43を構成している。
【0024】
又、前記撮像素子枠12の基端部には前記カバーガラス13と光学レンズ14との接合面の外周を覆って、カバーガラス13と光学レンズ14との接合強度の向上を図るための補強部12aが設けてある。
【0025】
ここで、図3(a)、(b)を参照して撮像素子枠12とレンズ枠22とを一体にして撮像ユニット1を構成する際のピント調整について説明する。
前記撮像素子枠12と前記レンズ枠22とを一体にして撮像ユニット1を構成する際には図3(a)に示すピント調整治具50を使用する。このピント調整治具50は、台部材51に対して進退移動が可能な移動台52と、台部材51に固設された固定台53とで構成されている。
【0026】
図3(b)に示すように前記移動台52には撮像ユニット1を構成する前記CCD11や回路基板15、16等が固設された撮像素子枠12がビス54によって取り付けられ、前記固定台53には光学レンズ21を固設したレンズ枠22が取り付けられている。
【0027】
前記レンズ枠22は、前記固定台53にビス55によって固定されたレンズ枠固定具56の基端部に形成されている雌ネジ56aに、前記凸部24に形成した雄ネジ25を螺合させて取り付けられている。この螺合状態のとき、前記凸部24の先端面が前記レンズ枠固定具56内に配置されている間隔管57の基端面に当接して安定した固定状態になる。
【0028】
予め、前記レンズ枠22の嵌合部23に早乾性ではない接着剤を塗布し、前記移動台52を固定台53側に移動させてレンズ枠22に撮像素子枠12を外嵌させる。この状態で、前記撮像素子枠12のCCD11で観察されたCCD画像を図示しない検査用モニタの画面上に表示させる。そして、この検査用モニタの画面上に前記CCD画像がはっきりと表示されるようにピント調整を行う。その際、ピント調整治具50に配置されているマイクロメータ58に設けられているシンブル58aを回転させる。
【0029】
前記シンブル58aの回転に伴って移動台52が回転方向に対する方向に移動することによって、レンズ枠22の嵌合部23に外嵌している撮像素子枠12が移動し、この撮像素子枠12のCCD11とレンズ枠22の光学レンズ21との間隔を変化させてピント調整が行われる。
【0030】
そして、ピント調整が完了したなら、撮像素子枠12とレンズ枠22とを、このレンズ枠22に予め塗布しておいた接着剤を硬化させることで一体的に固定する。このことによって、撮像素子枠12とレンズ枠22とが一体になったピント調整済みの撮像ユニット1が完成する。そして、このピント調整済みの撮像ユニット1を所定の部材と組み合わせて内視鏡を構成する。
【0031】
このように、レンズ枠の先端部に雄ネジを形成した凸部を設け、この雄ネジをレンズ枠固定具に螺合したとき、この凸部の先端面が間隔管の基端面に当接させることによって、レンズ枠を安定的にピント調整治具に固定することができる。このことによって、ピント調整をスムーズに行える。
【0032】
また、凸部の先端面が間隔管の基端面に当接させることによって安定した固定力を得られるので凸部の幅寸法を大きくすることなく、雄ネジを形成した凸部の基端からレンズ枠の基端までの全面を撮像素子枠との嵌合部にすることができる。このため、枠どうしががたつかない十分な長さの嵌合部を設けた場合でもレンズ枠の長さを所定寸法内に収められるので、硬質長の短縮化を図れる。
【0033】
これらのことによって、硬質長を長くしたり、外径を太径にすることなく、光学特性の安定した品質が良好な撮像ユニットを提供することができる。
【0034】
前記撮像ユニット1を内蔵した内視鏡として、例えば図4に示すように光学アダプタ60が装着可能なように先端部を構成する先端構成部材71に凸部72を設けた工業用の内視鏡70がある。
【0035】
ところで、上述のように構成された前記撮像ユニット1は、撮像素子枠12の先端側を先端構成部材71に形成されたユニット配置孔に配置されて、図示しないビスによって先端構成部材71と一体的に固定される。
【0036】
前記先端構成部材71に固定された撮像ユニット1の中央部及び基端側は、この先端構成部材71の内孔に位置しており、先端構成部材71の内周面と撮像ユニット中央部との隙間にはシリコーン系の軟らかな第1樹脂73aが充填され、前記内周面と撮像ユニット基端側との隙間にはエポキシ系の硬い第2樹脂73bが充填されている。
【0037】
さらに、前記撮像ユニット1の硬質部43の基端には固定部材74が当接している。この固定部材74は、前記先端構成部材71の内周面に螺合固定された筒状部材75に嵌合接着されている。この構造をとることによって、撮像ユニット1に信号線19からの引張力やあおりの力による負荷がかからないようにしている。
【0038】
ここで、光学アダプタ60の構成例を説明する。
前記光学アダプタ60は、内視鏡2の先端部を構成する先端構成部材71に着脱自在であり、種類毎にアダプタ側撮像光学系の仕様が異なっている。本図の光学アダプタ60は、対物光学系を構成する第1の光学レンズ61及び第2の光学レンズ62と、このレンズ61、62間に配置される薄板部材63と、これら光学レンズ61、62及び薄板部材63を保持する枠体64と、内視鏡70との連結部材となる前記枠体64に回動自在に配置された止めネジ65と、前記枠体64の外装部材であるカバー部材66と、前記内視鏡70のライトガイドファイバ76から出射される照明光を伝達するライトガイド又はロッドレンズで構成した照明光伝達部材67とで構成されている。この照明光伝達部材67の先端部は照明レンズ68に対向している。
【0039】
本実施形態の光学アダプタ60においては上述したように第1の光学レンズ61と第2の光学レンズ62との間に配置した薄板部材63を増減させてピント出し調整を行える構成にしている。
【0040】
したがって、光学アダプタ60を構成する第1の光学レンズ61及び第2の光学レンズ62の厚み寸法や枠体64の外形寸法や穴深さ寸法等がそれぞれ公差範囲で形成されていた場合でも各寸法のバラツキにより、組立て調整段階時にピント不良のおそれがあると判定されたときには薄板部材63を増減させてピント調整を行う。
【0041】
なお、この薄板部材はフレア絞り用の所定厚みのマスク部材や開口を有する所定厚さに形成されたピント調整板である。また、薄板部材を配置する第1の光学レンズ61と第2の光学レンズ62との間はピント調整に最も有効な位置である。
【0042】
このように、第1の光学レンズと第2の光学レンズとの間に薄板を増減させて光学アダプタを構成することによって、光学アダプタを長大させてピント出し調整機構を設けることなく、つまり、光学アダプタの構造を変えることなく光学アダプタの対物光学系のピント調整を行うことができる。
【0043】
このことによって、光学アダプタを内視鏡に組み合わせたとき、良好な光学特性を得られる。なお、前記光学アダプタに予め調整代を設けて構成するようにしてもよい。
【0044】
尚、本発明は、以上述べた実施形態のみに限定されるものではなく、発明の要旨を逸脱しない範囲で種々変形実施可能である。
【0045】
[付記]
以上詳述したような本発明の上記実施形態によれば、以下の如き構成を得ることができる。
【0046】
(1)撮像光学系を構成する固体撮像素子を固設した撮像素子枠と、前記固体撮像素子の撮像面に光学像を結像させる対物光学系を構成する光学レンズを固設したレンズ枠とで撮像ユニットを構成する電子内視鏡において、
前記レンズ枠の外周を、前記撮像素子枠が外嵌配置される嵌合部と、先端部に位置して外周面に雄ネジを形成した凸部とで構成した電子内視鏡。
【0047】
(2)前記レンズ枠をピント調整治具に固定するとき、前記レンズ枠の凸部の雄ネジをピント調整治具の雌ネジに螺合して行う付記1記載の電子内視鏡。
【0048】
(3)内視鏡の先端部に着脱自在に取り付けられる光学アダプタにおいて、前記光学アダプタを構成する対物光学系の光学レンズ間に増減可能に薄板部材を設けた光学アダプタ。
【0049】
(4)前記薄板部材は所定厚みに形成したフレア絞り用のマスク部材である付記3記載の光学アダプタ。
【0050】
(5)前記薄板部材は開口を有する所定厚さに形成したピント調整板である付記3記載の光学アダプタ。
【0051】
【発明の効果】
以上説明したように本発明によれば、硬質長を長くすることや、外形寸法を太径にすることなく、光学性能の良好な撮像ユニットを備えた電子内視鏡を提供することができる。
【図面の簡単な説明】
【図1】図1ないし図4は本発明の一実施形態に係り、図1は電子内視鏡を構成する撮像ユニットを説明する図
【図2】撮像ユニットに設けられる回路基板を説明する図
【図3】ピント調整治具によるピント調整を説明する図
【図4】撮像ユニットを配置した内視鏡の構成例を説明する図
【図5】撮像素子枠とレンズ枠とで構成される撮像ユニットのピント調整機構の従来例を説明する図
【符号の説明】
1…撮像ユニット
10…撮像光学系
11…CCD
12…撮像素子枠
20…対物光学系
21…光学レンズ
22…レンズ枠
23…嵌合部
24…凸部
25…雄ネジ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic endoscope in which an imaging unit is constituted by an imaging element frame and a lens frame.
[0002]
[Prior art]
2. Description of the Related Art In recent years, endoscopes capable of observing organs in a body cavity by inserting an elongated insertion portion into a body cavity or performing various treatments and treatments using a treatment instrument inserted into a treatment instrument channel as necessary. Widely used. Endoscopes are used not only for medical purposes but also for industrial purposes, such as observation and inspection inside boilers, machines and chemical plants, or inside engines.
[0003]
The endoscope used as described above is provided with a solid-state imaging device such as a charge coupled device (hereinafter referred to as CCD) at the distal end of the insertion portion, and the endoscope image formed on this CCD is displayed on the monitor screen. There are electronic endoscopes that perform observation.
[0004]
This electronic endoscope incorporates an image pickup unit in which an image pickup element frame in which a CCD is disposed at a distal end portion of an insertion portion and a lens frame in which an optical lens is disposed are integrated. This imaging unit adjusts the position of the imaging element frame and the lens frame in the optical axis direction, and passes through an optical lens fixed to the lens frame on the CCD imaging surface provided in the imaging element frame. The image is clearly formed.
[0005]
And the position adjustment of the optical element direction of an image pick-up element frame and a lens frame was performed as shown to Fig.5 (a), (b).
As shown in FIG. 5A, in the imaging unit 100A configured by screwing the imaging element frame 101 and the lens frame 102, when the position adjustment in the optical axis direction is performed, the imaging element frame 101 and the lens frame 102 are arranged. This is performed by changing the screwing state of the screwing portion 103.
[0006]
On the other hand, as shown in FIG. 5B, in the image pickup unit 100B configured by providing the fitting portion 104 between the image pickup device frame 101 and the lens frame 102, when the position adjustment in the optical axis direction is performed, the image pickup device frame 101 and This is done by changing the fitting length with the lens frame 102.
[0007]
[Problems to be solved by the invention]
However, in the imaging unit 100A that adjusts the focus by changing the screwing state of the screwing portion 103 as shown in FIG. 5A, there is a clearance between the screw and the screw thread. Adjustment is difficult, and when the adhesive is applied after focus adjustment and the adhesive is dried and solidified, there is a possibility that the positional contraction may occur due to the clearance due to the shrinkage of the adhesive. Further, in order to rotate the lens frame 102, for example, a space for arranging a crescent wrench or the like is required, which is a factor in increasing the diameter.
[0008]
On the other hand, in the imaging unit 100B that performs focus adjustment by changing the fitting length of the fitting portion 104 as shown in FIG. 5B, the imaging element frame 101 and the lens frame 102 are indicated by a one-dot chain line. In this way, the screw 105 must be fixed to a focus adjustment jig (not shown), so that the fitting length is shortened by the fixing amount of the screw 105, and the imaging element frame 101 and the lens frame 102 are rattled. There was a risk of misalignment.
[0009]
Then, if the fitting length is sufficiently taken to eliminate the problems caused by shortening the fitting length, the length of the lens frame 102 is increased correspondingly, and the rigid length of the endoscope is increased. There was a problem that became a factor.
[0010]
The present invention has been made in view of the above circumstances, and provides an electronic endoscope including an imaging unit with good optical performance without increasing the length of a hard length and without increasing the outer dimension of the outer diameter. Is aimed at.
[0011]
[Means for Solving the Problems]
An electronic endoscope according to the present invention includes an imaging element frame in which a solid-state imaging element constituting an imaging optical system is fixed, and an optical lens constituting an objective optical system that forms an optical image on an imaging surface of the solid-state imaging element. An electronic endoscope that forms an imaging unit with a fixed lens frame,
The outer periphery of the lens frame is composed of a fitting portion on which the imaging element frame is fitted and disposed, and a convex portion that is located at the tip and has an external thread formed on the outer peripheral surface.
[0012]
According to this configuration, the outer periphery from the base end of the convex portion to the base end of the lens frame becomes the fitting portion by using the male screw provided on the convex portion as the attachment portion to the focusing tool.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 relate to an embodiment of the present invention, FIG. 1 is a diagram illustrating an imaging unit constituting an electronic endoscope, FIG. 2 is a diagram illustrating a circuit board provided in the imaging unit, and FIG. FIG. 4 is a diagram for explaining focus adjustment by a focus adjustment jig, and FIG. 4 is a diagram for explaining a configuration example of an endoscope in which an imaging unit is arranged.
[0014]
2A is a cross-sectional view taken along line AA in FIG. 1, FIG. 2B is a cross-sectional view taken along line BB in FIG. 1, and FIG. 2C is a cross-sectional view taken along line CC in FIG. FIG. 3A is a diagram showing a state in which the imaging element frame and the lens frame constituting the imaging unit are attached to the focus adjustment jig, and FIG. 3B is an enlarged view of a portion A in FIG.
[0015]
As shown in FIG. 1, the imaging unit 1 constituting the electronic endoscope of the present embodiment includes, for example, an imaging optical system 10 having a CCD 11 that is a solid-state imaging device for obtaining an observation image of a region to be examined, and the CCD 11. The objective optical system 20 includes a plurality of optical lenses 21 that form an optical image on the imaging surface.
[0016]
The CCD 11 is fixed to the image sensor frame 12. A CCD cover glass (hereinafter abbreviated as a cover glass) 13 that is a light-transmitting covering member is disposed on the front surface of the imaging surface of the CCD 11, and an optical lens 14 is disposed on the front surface of the cover glass 13. Yes.
[0017]
Further, as shown in FIGS. 1 and 2A, 2B, and 2C, the first circuit board 15 and the second circuit board that are electrically connected to the CCD 11 are provided on the side opposite to the imaging surface of the CCD 11. 16 is disposed. An electronic component 17 is mounted on the side surface of the CCD, which is one surface of the first circuit board 15, and the electronic component 17 is mounted on both surfaces of the second circuit board 16. This is because the electronic component 17 is arranged between the circuit boards 15 and 16 to eliminate a dead space between the boards. The electrical contact portions 15a, 16a provided on the circuit boards 15, 16 have corresponding signal lines 19a, 19b, 19c among a plurality of signal lines 19, ..., 19 inserted into the signal cable 18. It is connected.
[0018]
The signal lines 19a, 19b, and 19c inserted into the signal cable 18 are formed by changing the diameters of the signal lines 19a, 19b, and 19c as necessary in order to reduce the outer diameter of the signal cable 18. Yes. That is, the wire diameters become narrower in the order of the signal line 19a, the signal line 19b, and the signal line 19c. When the signal line 19 is connected to the electrical contact portion, the signal line 19a having a large diameter is connected to the signal line 19b and the signal line 19c by soldering or the like. As a result, disconnection of the core wire of the signal line 19 is prevented and connection work can be performed stably.
[0019]
On the other hand, the plurality of optical lenses 21 constituting the objective optical system 20 are fixed to the inner hole of the lens frame 22 by, for example, adhesion. On the outer peripheral surface of the lens frame 22, there are provided a fitting portion 23 on which the image pickup device frame 12 is fitted and disposed, and a convex portion 24 protruding at a tip portion with a predetermined width dimension. A male screw 25 is formed on the outer peripheral surface of the convex portion 24.
[0020]
Therefore, when the imaging element frame 12 is externally fitted to the lens frame 22, the distal end of the imaging element frame 12 comes into contact with the proximal end side of the convex portion 24. At this time, the male screw 25 of the convex portion 24 does not protrude outward from the outer peripheral surface of the front end of the imaging element frame 12.
[0021]
In the present embodiment, the electronic components 17 are mounted on both surfaces of the second circuit board 16 so as to eliminate the dead space between the boards. However, the electronic components 17 are mounted on both surfaces of the first circuit board 15. Thus, the dead space between the substrates may be eliminated.
[0022]
When the number of electronic components 17 to be mounted is small, the electronic components 17 are mounted on the side opposite to the surface where the substrates face each other. As a result, the surfaces of the circuit boards 15 and 16 where the electronic components 17 are not mounted can be brought into close contact with each other to shorten the rigid length of the imaging unit 1.
[0023]
Further, the electronic component 17 and the signal line 19 are covered with the first sealing resin 41 and are covered with the second sealing resin 42 to constitute the hard portion 43 of the imaging unit 1.
[0024]
A reinforcing portion for covering the outer periphery of the joint surface between the cover glass 13 and the optical lens 14 at the base end portion of the imaging element frame 12 to improve the joint strength between the cover glass 13 and the optical lens 14. 12a is provided.
[0025]
Here, with reference to FIGS. 3A and 3B, focus adjustment when the image pickup unit frame 12 and the lens frame 22 are integrated to form the image pickup unit 1 will be described.
When the imaging unit 1 is configured by integrating the imaging element frame 12 and the lens frame 22, a focus adjustment jig 50 shown in FIG. 3A is used. The focus adjustment jig 50 includes a moving table 52 that can move forward and backward with respect to the table member 51, and a fixed table 53 that is fixed to the table member 51.
[0026]
As shown in FIG. 3B, an image pickup element frame 12 to which the CCD 11, the circuit boards 15, 16, etc. constituting the image pickup unit 1 are fixed is attached to the movable stand 52 by screws 54, and the fixed stand 53 A lens frame 22 to which an optical lens 21 is fixed is attached.
[0027]
The lens frame 22 is formed by screwing a male screw 25 formed on the convex portion 24 into a female screw 56a formed on a base end portion of a lens frame fixing tool 56 fixed to the fixing base 53 with screws 55. Attached. In this screwed state, the distal end surface of the convex portion 24 comes into contact with the proximal end surface of the spacing tube 57 disposed in the lens frame fixture 56 to be in a stable fixed state.
[0028]
In advance, an adhesive that is not quick-drying is applied to the fitting portion 23 of the lens frame 22, and the moving base 52 is moved to the fixed base 53 side so that the imaging element frame 12 is externally fitted to the lens frame 22. In this state, the CCD image observed by the CCD 11 of the image sensor frame 12 is displayed on the screen of an inspection monitor (not shown). Then, focus adjustment is performed so that the CCD image is clearly displayed on the screen of the inspection monitor. At that time, the thimble 58a provided in the micrometer 58 disposed in the focus adjustment jig 50 is rotated.
[0029]
With the rotation of the thimble 58a, the moving base 52 moves in the direction with respect to the rotation direction, so that the imaging element frame 12 that is externally fitted to the fitting portion 23 of the lens frame 22 moves. Focus adjustment is performed by changing the distance between the CCD 11 and the optical lens 21 of the lens frame 22.
[0030]
When the focus adjustment is completed, the imaging device frame 12 and the lens frame 22 are integrally fixed by curing an adhesive previously applied to the lens frame 22. As a result, the image pickup unit 1 that has been adjusted in focus, in which the image pickup device frame 12 and the lens frame 22 are integrated, is completed. The imaging unit 1 that has been adjusted in focus is combined with a predetermined member to form an endoscope.
[0031]
Thus, when the convex part which formed the external thread in the front-end | tip part of a lens frame is provided and this external thread is screwed together with a lens frame fixing tool, the front end surface of this convex part is made to contact | abut to the base end surface of a space | interval pipe. Thus, the lens frame can be stably fixed to the focus adjustment jig. This makes it possible to adjust the focus smoothly.
[0032]
In addition, since a stable fixing force can be obtained by bringing the front end surface of the convex portion into contact with the base end surface of the spacing tube, the lens is formed from the base end of the convex portion on which the male screw is formed without increasing the width dimension of the convex portion. The entire surface up to the base end of the frame can be a fitting portion with the imaging element frame. For this reason, since the length of the lens frame can be accommodated within a predetermined dimension even when a sufficiently long fitting portion is provided in which the frames do not rattle, the hard length can be shortened.
[0033]
Accordingly, it is possible to provide an imaging unit having a stable quality of optical characteristics and a good quality without increasing the hard length or increasing the outer diameter.
[0034]
As an endoscope incorporating the imaging unit 1, for example, as shown in FIG. 4, an industrial endoscope in which a convex portion 72 is provided on a distal end constituting member 71 that constitutes a distal end portion so that an optical adapter 60 can be attached. There are 70.
[0035]
By the way, the imaging unit 1 configured as described above is disposed in the unit arrangement hole formed in the distal end component member 71 on the distal end side of the imaging element frame 12 and integrated with the distal end component member 71 by a screw (not shown). Fixed to.
[0036]
The central portion and the base end side of the imaging unit 1 fixed to the distal end constituent member 71 are located in the inner hole of the distal end constituent member 71, and the inner peripheral surface of the distal end constituent member 71 and the central portion of the imaging unit are located. The gap is filled with a soft silicone-based first resin 73a, and the gap between the inner peripheral surface and the imaging unit base end is filled with a hard epoxy-based second resin 73b.
[0037]
Further, a fixing member 74 is in contact with the base end of the hard portion 43 of the imaging unit 1. The fixing member 74 is fitted and bonded to a cylindrical member 75 that is screwed and fixed to the inner peripheral surface of the tip constituting member 71. By adopting this structure, the imaging unit 1 is prevented from being loaded by the tensile force or tilting force from the signal line 19.
[0038]
Here, a configuration example of the optical adapter 60 will be described.
The optical adapter 60 is detachably attached to a distal end constituting member 71 constituting the distal end portion of the endoscope 2, and the specifications of the adapter side imaging optical system are different for each type. The optical adapter 60 in this figure includes a first optical lens 61 and a second optical lens 62 constituting an objective optical system, a thin plate member 63 disposed between the lenses 61 and 62, and the optical lenses 61 and 62. And a frame body 64 that holds the thin plate member 63, a set screw 65 that is rotatably disposed on the frame body 64 that is a connecting member to the endoscope 70, and a cover member that is an exterior member of the frame body 64 66, and an illumination light transmission member 67 composed of a light guide or rod lens that transmits illumination light emitted from the light guide fiber 76 of the endoscope 70. The front end portion of the illumination light transmission member 67 faces the illumination lens 68.
[0039]
In the optical adapter 60 of the present embodiment, as described above, the thin plate member 63 disposed between the first optical lens 61 and the second optical lens 62 is increased or decreased to adjust the focus adjustment.
[0040]
Accordingly, even when the thickness dimension of the first optical lens 61 and the second optical lens 62 constituting the optical adapter 60, the outer dimension of the frame body 64, the hole depth dimension, etc. are each formed within the tolerance range, the respective dimensions. If it is determined that there is a risk of focus failure during the assembly adjustment stage, the thin plate member 63 is increased or decreased to adjust the focus.
[0041]
The thin plate member is a mask member having a predetermined thickness for flare drawing or a focus adjusting plate formed to have a predetermined thickness having an opening. Further, the position between the first optical lens 61 and the second optical lens 62 on which the thin plate member is disposed is the most effective position for focus adjustment.
[0042]
In this way, by configuring the optical adapter by increasing or decreasing the thin plate between the first optical lens and the second optical lens, the optical adapter is lengthened without providing a focus adjustment mechanism, that is, optical The focus adjustment of the objective optical system of the optical adapter can be performed without changing the structure of the adapter.
[0043]
This makes it possible to obtain good optical characteristics when the optical adapter is combined with an endoscope. The optical adapter may be configured by providing an adjustment allowance in advance.
[0044]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.
[0045]
[Appendix]
According to the embodiment of the present invention as described above in detail, the following configuration can be obtained.
[0046]
(1) An imaging element frame in which a solid-state imaging device constituting the imaging optical system is fixed; a lens frame in which an optical lens constituting an objective optical system that forms an optical image on the imaging surface of the solid-state imaging element is fixed; In the electronic endoscope constituting the imaging unit in
An electronic endoscope in which an outer periphery of the lens frame is configured by a fitting portion in which the imaging element frame is fitted and disposed, and a convex portion that is located at a tip portion and has an external thread formed on an outer peripheral surface.
[0047]
(2) The electronic endoscope according to appendix 1, wherein when fixing the lens frame to a focus adjustment jig, the male screw of the convex portion of the lens frame is screwed into the female screw of the focus adjustment jig.
[0048]
(3) An optical adapter provided with a thin plate member that can be increased and decreased between optical lenses of an objective optical system constituting the optical adapter in an optical adapter that is detachably attached to a distal end portion of an endoscope.
[0049]
(4) The optical adapter according to appendix 3, wherein the thin plate member is a mask member for flare drawing formed to have a predetermined thickness.
[0050]
(5) The optical adapter according to appendix 3, wherein the thin plate member is a focus adjustment plate formed to have a predetermined thickness having an opening.
[0051]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an electronic endoscope including an imaging unit with good optical performance without increasing the hard length and without increasing the outer dimension.
[Brief description of the drawings]
FIG. 1 to FIG. 4 relate to an embodiment of the present invention, and FIG. 1 is a diagram illustrating an imaging unit constituting an electronic endoscope. FIG. 2 is a diagram illustrating a circuit board provided in the imaging unit. FIG. 3 is a diagram illustrating focus adjustment by a focus adjustment jig. FIG. 4 is a diagram illustrating a configuration example of an endoscope in which an imaging unit is arranged. FIG. 5 is an image including an imaging element frame and a lens frame. Diagram explaining the conventional example of unit focus adjustment mechanism 【Explanation of symbols】
DESCRIPTION OF SYMBOLS 1 ... Imaging unit 10 ... Imaging optical system 11 ... CCD
DESCRIPTION OF SYMBOLS 12 ... Imaging device frame 20 ... Objective optical system 21 ... Optical lens 22 ... Lens frame 23 ... Fitting part 24 ... Convex part 25 ... Male screw

Claims (1)

撮像光学系を構成する固体撮像素子を固設した撮像素子枠と、前記固体撮像素子の撮像面に光学像を結像させる対物光学系を構成する光学レンズを固設したレンズ枠とで撮像ユニットを構成する電子内視鏡において、
前記レンズ枠の外周を、前記撮像素子枠が外嵌配置される嵌合部と、先端部に位置して外周面に雄ネジを形成した凸部とで構成したことを特徴とする電子内視鏡。
An imaging unit comprising an imaging element frame in which a solid-state imaging element constituting an imaging optical system is fixed and a lens frame in which an optical lens constituting an objective optical system for forming an optical image on the imaging surface of the solid-state imaging element is fixed In the electronic endoscope that constitutes
An electronic endoscope characterized in that an outer periphery of the lens frame is configured by a fitting portion on which the imaging element frame is fitted and disposed, and a convex portion which is located at a tip portion and has a male screw formed on an outer peripheral surface. mirror.
JP2001107527A 2001-04-05 2001-04-05 Electronic endoscope Expired - Fee Related JP4647817B2 (en)

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JP4503956B2 (en) * 2003-08-22 2010-07-14 オリンパス株式会社 Imaging device
JP5275541B2 (en) * 2005-07-25 2013-08-28 オリンパス株式会社 Endoscope device
JP2008125902A (en) * 2006-11-22 2008-06-05 Pentax Corp Endoscope scope and manufacturing method of endoscope scope
JP4928974B2 (en) * 2007-02-19 2012-05-09 Hoya株式会社 The tip of the electronic endoscope
CN104997478A (en) * 2015-05-29 2015-10-28 深圳开立生物医疗科技股份有限公司 Endoscope hard portion provided with stereo circuit component and endoscope
WO2022264337A1 (en) * 2021-06-16 2022-12-22 オリンパス株式会社 Imaging unit and endoscope

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