JP4633147B2 - Surface light source device - Google Patents

Surface light source device Download PDF

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JP4633147B2
JP4633147B2 JP2008188439A JP2008188439A JP4633147B2 JP 4633147 B2 JP4633147 B2 JP 4633147B2 JP 2008188439 A JP2008188439 A JP 2008188439A JP 2008188439 A JP2008188439 A JP 2008188439A JP 4633147 B2 JP4633147 B2 JP 4633147B2
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led
guide plate
light guide
display
light
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JP2008311234A (en
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博志 満田
俊之 米田
博司 大川
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Mitsubishi Electric Lighting Corp
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Description

本発明は、導光板を用いたエッジライト式の面光源装置に関するものである。   The present invention relates to an edge light type surface light source device using a light guide plate.

従来、LEDを光源とした面光源装置使用の誘導灯装置等の表示装置には、次のようなものがある。
青色光を発する複数のLEDを並べた光源と、一側面から入射した光源の光を面発光させる導光板と、光源の発光色を異なる色に変換する色変換部材と、背面からの照明により表示される図柄や文字等の表示パターンが形成された表示パネルとを組合せ、色変換部材により青色光を白色光あるいは緑、黄、赤色等他の光スペクトル成分をもつ光に変換することによって、表示パネルの表示に必要な白色光あるいは他の異なる色に変換され、表示パターンを表示する。
そして、複数のLEDは基板に一定の間隔のピッチで実装され、この基板は、導光板の一側面に近接するようにホルダーに着脱可能に取り付けられており、LEDの側方に出射された光を導光板に反射させるための反射板が基板の両側に配設されている(例えば、特許文献1参照)。
特開平9−179512号公報(第3頁、第4頁、図1、図2)
Conventional display devices such as guide light devices using a surface light source device using LEDs as light sources include the following.
Displayed by a light source in which a plurality of LEDs emitting blue light are arranged, a light guide plate that emits light from the light source incident from one side, a color conversion member that converts the light emission color of the light source into a different color, and illumination from the back Display by combining a display panel on which a display pattern such as symbols and characters is formed, and converting blue light into white light or light having other light spectrum components such as green, yellow, and red by a color conversion member. It is converted into white light or other different colors necessary for the display of the panel to display the display pattern.
The plurality of LEDs are mounted on the substrate at a constant pitch, and this substrate is detachably attached to the holder so as to be close to one side surface of the light guide plate, and light emitted to the side of the LED Reflecting plates for reflecting the light to the light guide plate are disposed on both sides of the substrate (see, for example, Patent Document 1).
JP-A-9-179512 (page 3, page 4, FIG. 1, FIG. 2)

光源としてLED使用の場合LEDは特性上、電流を多く流すと、多くの熱が発生して高温になる。従来の表示装置では、LEDの放熱が十分でないため、発生熱によりLEDの光出力が低下するなどLED自体の特性が損なわれる問題があった。
このため、LED自体の特性維持のためには、発熱を抑えるために電流値を下げなければならず、表示装置として十分な光量を得ることができなかった。さらに、光量を得るためにLEDの数を増やせば、LEDの発熱量が増えるのに加えて、コストも上昇するという問題があった。
In the case of using an LED as a light source, due to the characteristics of an LED, if a large amount of current is passed, a lot of heat is generated and the temperature becomes high. In the conventional display device, since the heat radiation of the LED is not sufficient, there is a problem that the characteristics of the LED itself are impaired, for example, the light output of the LED is reduced by generated heat.
For this reason, in order to maintain the characteristics of the LED itself, the current value must be lowered in order to suppress heat generation, and a sufficient amount of light as a display device cannot be obtained. Furthermore, if the number of LEDs is increased in order to obtain a light amount, there is a problem in that, in addition to an increase in the amount of heat generated by the LEDs, the cost also increases.

本発明は、上記のような問題点を解消するためになされたもので、LEDの発熱を効率良く放熱し、LEDの性能を損うことなく明るい面光源装置を得ることを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a bright surface light source device that efficiently dissipates heat generated by an LED and does not impair the performance of the LED.

本発明の面光源装置は、光源である複数のLEDと、該LEDを実装するLED基板と、側面の入射面から入射した光源の光を前面の照射面から面光源とし照射する導光板と、LED、LED基板及び導光板を収容するとともに、表示パネルを導光板の前面側に収容し、導光板と接する面は導光板と略同じ大きさとなる背面と背面を延設する延設背面を有する表示板ケースと、全面に渡り断面形状が略L字状を形成する2つの平面と、この2つの面の両側面とで囲まれて成る空間の内面に反射面を設け、空間内にLED基板のLEDを実装する面と対向する面が内面と密着するようにLED基板を収容し、LED基板に実装されたLEDが表示板ケースに収容された導光板の側面の入射面に対向する位置に着脱可能に取り付けられて、LEDが発熱する熱を放熱するLEDカバーと、上下方向に導光板より長く、表示板ケースに導光板とともにその背面に収容され、さらにLEDカバーを表示板ケースに取り付けたとき、LED基板と近接して配置される反射板と、を備え、導光板の上下方向の長さは表示パネルのそれより長く、LEDカバーと表示パネルは少なくともラップしない部分を有するものである。 The surface light source device of the present invention includes a plurality of LEDs that are light sources, an LED substrate on which the LEDs are mounted, a light guide plate that irradiates light from a light source incident from an incident surface on a side surface as a surface light source from an irradiation surface on the front surface, The LED, the LED substrate, and the light guide plate are accommodated, the display panel is accommodated on the front side of the light guide plate, and the surface in contact with the light guide plate has a back surface that is substantially the same size as the light guide plate and an extended back surface that extends the back surface. A reflective surface is provided on the inner surface of the space surrounded by the display panel case, two flat surfaces having a substantially L-shaped cross section over the entire surface, and both side surfaces of the two surfaces, and the LED substrate in the space. position the LED mounting surfaces and opposing surfaces of the housing the LED substrate so as to be in close contact with the inner surface, L ED LED mounted on the substrate is opposed to the incident surface side of the contained light guide plate panel case Removably attached to the LED LED cover that dissipates heat, and longer than the light guide plate in the vertical direction, is housed in the display plate case together with the light guide plate on the back, and when the LED cover is attached to the display plate case, it is close to the LED substrate and a reflecting plate disposed, the vertical length of the light guide plate rather longer than that of the display panel, LED cover and the display panel is one having a portion not least wrap.

LEDの発生熱が、LED基板と表示板ケースを密着させることにより表示板ケースから外部に効率良く放熱されるので、LEDが高温となるのが防止でき、性能が損われることがなく、明るい表示の表示装置を得ることができる。   The heat generated by the LED is efficiently dissipated from the display panel case to the outside by bringing the LED substrate and the display panel case into close contact with each other. Display device can be obtained.

図1は、誘導灯装置である表示装置の分解斜視図であり、図2は、図1のA−A線断面図であり、図3は、図1の表示装置を壁に取付けた状態を示す図である。
図1、2に示すように、表示装置は、表示部と点灯制御部とから成る。
表示部は、光源であるLED1と、入射面4aである一側面から入射するLED1の光を面光源化させ、照射面4bである前面から面発光させる導光板4と、導光板4の背面側に配設され、導光板4から外部に出る光を導光板4に反射する反射板5と、表示特性向上のために導光板4からの光を散乱させて指向性を均一にする拡散板6と、図柄や文字等の表示パターンが形成され、背面の拡散板6からの照射により表示パターンを表示する表示板7と、表示板ケース8とを備えている。
但し、反射板5及び拡散板6は適宜省いてもよく、また、表示特性向上のためには、拡散板6の替わりに表示面輝度向上にプリズム板を設けてもよい。
FIG. 1 is an exploded perspective view of a display device that is a guide light device, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 shows a state in which the display device of FIG. FIG.
As shown in FIGS. 1 and 2, the display device includes a display unit and a lighting control unit.
The display unit includes an LED 1 that is a light source, a light guide plate 4 that causes light of the LED 1 that is incident from one side surface that is the incident surface 4 a to be a surface light source, and that emits surface light from the front surface that is the irradiation surface 4 b, and the back side of the light guide plate 4 And a reflection plate 5 that reflects light emitted from the light guide plate 4 to the light guide plate 4 and a diffusion plate 6 that scatters the light from the light guide plate 4 to improve display characteristics and makes the directivity uniform. And a display pattern 7 for displaying a display pattern by irradiation from the rear diffusion plate 6 and a display plate case 8.
However, the reflecting plate 5 and the diffusing plate 6 may be omitted as appropriate, and a prism plate may be provided to improve display surface brightness instead of the diffusing plate 6 in order to improve display characteristics.

ここで、LED1は、LED基板2に実装され、LED1とLED基板2はLEDカバー3で覆われている。LEDカバー3は、背面(表示板7側と反対側の面で、表示板ケース8との嵌合により表示板ケース8の背面で塞がれる面)及び下面(表示板ケース8に嵌合させる側の面)が開口した六面体状の箱体であり、LED基板2は、LED1の実装面に対して裏面である背面がLEDカバー3の上面(下面に対向する面)の内面に密着するように取付けられる。
LED基板2は、紙フェノール基板、ガラスエポキシ基板、アルミ等の金属基板、セラミック基板等である。このうち、LED1の発熱による高温化を防止するために、熱伝導性の良い金属基板、セラミック基板等が望ましい。
LEDカバー3の内面に反射板を貼り付ける、又は反射塗料を塗る等して内面を反射面とすることにより、LED1の光を有効に活用できる。
導光板4は、アクリルやポリカーボネート等の透明樹脂からなる板状体であり、その一側面にLED1が対向するようにLED基板2が配設され、入射面4aが形成される。また、導光板4は、前面の照射面4b又は背面のうち少なくともいずれか一方に、導光板4中を伝播する光を拡散する光拡散機能を有している。この光拡散機能は白色ドット印刷を施すこと、粗面化すること、又はプリズムを設けること等により付与される。
Here, the LED 1 is mounted on the LED substrate 2, and the LED 1 and the LED substrate 2 are covered with the LED cover 3. The LED cover 3 has a back surface (a surface opposite to the display plate 7 side and a surface closed by the back surface of the display plate case 8 by fitting with the display plate case 8) and a lower surface (fitted to the display plate case 8). The LED substrate 2 has a back surface that is the back surface with respect to the mounting surface of the LED 1 so that the back surface is in close contact with the inner surface of the upper surface of the LED cover 3 (the surface facing the lower surface). Mounted on.
The LED substrate 2 is a paper phenol substrate, a glass epoxy substrate, a metal substrate such as aluminum, a ceramic substrate, or the like. Among these, in order to prevent high temperature due to heat generation of the LED 1, a metal substrate, a ceramic substrate, or the like having good thermal conductivity is desirable.
The light of the LED 1 can be effectively used by attaching a reflecting plate to the inner surface of the LED cover 3 or applying a reflective paint to make the inner surface a reflecting surface.
The light guide plate 4 is a plate-like body made of a transparent resin such as acrylic or polycarbonate, and the LED substrate 2 is disposed on one side surface of the light guide plate 4 so as to face the LED 1 to form an incident surface 4a. The light guide plate 4 has a light diffusion function for diffusing light propagating through the light guide plate 4 on at least one of the front irradiation surface 4b and the back surface. This light diffusing function is given by printing with white dots, roughening, or providing a prism.

表示板ケース8は、前面(表示板7側の面)と上面(導光板4の入射面4a側の面)とが開口した六面体状の箱体の背面(表示板7側と反対側の面)をLEDカバー3側に延設したものである。後述の点灯制御部を構成する器具本体9の一面(上面であり、表示板7側の面)上に固定される。また、表示板ケース8内には、前面方向(表示板7方向)に向かって、反射板5、導光板4及び拡散板6がこの順に配列、収容され、表示板ケース8の前面の開口部は上部を除いて、表示板7で塞がれる。さらに、断面L字状のLEDカバー3が嵌合されることにより、表示板ケース8の上面の開口部及び前面の開口部の上部が塞がれる。このとき、延設背面9aがLEDカバー3の背面を形成する。
そこで、LEDカバー3は、下面の開口部を表示板ケース8の上面の開口部に嵌合させ、表示板ケース8と合体することにより、表示板ケース8の上部の外壁となり、表示板ケース8の一部を形成する。
このように、LED基板2を取付けたLEDカバー3を表示板ケース8の開口部に嵌合により取付けているので、LEDカバー3の取付け、取外しが容易であり、LED1(又はLED基板2)の交換が容易となる。
特に、LEDカバー3と表示板ケース8との嵌合は、背面のないLEDカバー3と延設背面9aを持つ表示板ケース8とで行われるため、LEDカバー3の背面の嵌め合せがなく、LEDカバー3と表示板ケース8の着脱は、上面下面方向に限定されず、上面下面方向から前面背面方向まで広範囲に可能となり、極めて容易となる。即ち、着脱の自由度が増加する。そこで、LED1(又はLED1を実装したLED基板2)の交換が極めて容易となる。
The display panel case 8 has a rear surface (a surface on the opposite side to the display panel 7 side) of a hexahedron having an open front surface (a surface on the display plate 7 side) and an upper surface (a surface on the incident surface 4a side of the light guide plate 4). ) Is extended to the LED cover 3 side. It is fixed on one surface (the upper surface, the surface on the display board 7 side) of the appliance main body 9 constituting the lighting control section described later. In the display plate case 8, the reflection plate 5, the light guide plate 4, and the diffusion plate 6 are arranged and accommodated in this order toward the front surface direction (display plate 7 direction). Is closed by the display board 7 except for the upper part. Furthermore, by fitting the LED cover 3 having an L-shaped cross section, the opening on the upper surface of the display panel case 8 and the upper part of the opening on the front surface are closed. At this time, the extended back surface 9 a forms the back surface of the LED cover 3.
Therefore, the LED cover 3 is fitted into the opening on the upper surface of the display plate case 8 with the opening on the lower surface and united with the display plate case 8 to become an outer wall on the upper portion of the display plate case 8. Form a part of
Thus, since the LED cover 3 to which the LED board 2 is attached is attached to the opening of the display panel case 8 by fitting, the LED cover 3 can be easily attached and detached, and the LED 1 (or the LED board 2) can be easily attached. Exchange becomes easy.
In particular, the fitting of the LED cover 3 and the display plate case 8 is performed by the LED cover 3 without the back surface and the display plate case 8 having the extended back surface 9a, so there is no fitting on the back surface of the LED cover 3, The attachment / detachment of the LED cover 3 and the display panel case 8 is not limited to the upper surface lower surface direction, and can be performed in a wide range from the upper surface lower surface direction to the front surface rear surface direction, which is extremely easy. That is, the degree of freedom of attachment / detachment increases. Therefore, the replacement of the LED 1 (or the LED substrate 2 on which the LED 1 is mounted) is extremely easy.

点灯制御部は、光源であるLED1を点灯制御する点灯制御装置(図示省略)と、これを収容する器具本体9を備えている。
点灯制御部の器具本体9は、上記のように表示部の表示板ケース8及びLEDカバー3の背面側に配設される(図1、図3、図4(a)、(b))が、LEDカバー3を内部に収容して、表示板ケース8の上部(図4(c))等に配設される場合もある。
ここで、LED1、LED1を実装したLED基板2、反射板5、導光板4、拡散板6、LEDカバー3、表示板ケース8及び点灯制御部等で面光源装置を構成する。また、面光源装置に表示板7を加えて表示装置を構成する。
本表示装置は、表示板7の表示パターンを替えることにより種々のパターン表示が可能であるが、例えば、表示パターンを避難誘導のパターン(図柄)とすれば誘導灯装置となり、非常時に避難誘導の案内となる。また、表示板7は、液晶表示素子など映像信号に合せて表示内容(表示パターン)を可変できる表示素子としてもよい。
図3に示すようにこの表示装置(誘導灯装置)を壁に取付け(壁直付け型の例)使用する。
The lighting control unit includes a lighting control device (not shown) that controls lighting of the LED 1 that is a light source, and an appliance body 9 that accommodates the lighting control device.
The appliance main body 9 of the lighting control unit is arranged on the back side of the display plate case 8 and the LED cover 3 of the display unit as described above (FIGS. 1, 3, 4 (a) and (b)). In some cases, the LED cover 3 is accommodated inside and disposed on the upper part of the display panel case 8 (FIG. 4C).
Here, the surface light source device is configured by the LED 1, the LED substrate 2 on which the LED 1 is mounted, the reflection plate 5, the light guide plate 4, the diffusion plate 6, the LED cover 3, the display plate case 8, the lighting control unit, and the like. Further, the display device is configured by adding the display plate 7 to the surface light source device.
The display device can display various patterns by changing the display pattern of the display board 7. For example, if the display pattern is an evacuation guide pattern (design), the display device becomes a guide light device. It will be a guide. The display plate 7 may be a display element such as a liquid crystal display element that can change display contents (display pattern) in accordance with a video signal.
As shown in FIG. 3, this display device (guide light device) is mounted on a wall (an example of a wall-mounted type).

このような表示装置(誘導灯装置)は、点灯制御装置により光源のLED1が点灯し、導光板4により面照明とされ、拡散板6で均一な明るさとされ、表示板7を照明し、表示板7の表示パターンを表示する。
この際、LEDの点灯による発熱は、LEDのリード及び半田を介してLED基板2に伝わり、LED基板2に密着するLEDカバー3に伝わる。LEDカバー3は上面、側面及び前面が表示板ケース8の一部として、外部に露出しており、これを放熱フィンとして外部の空気で冷却される。また、嵌合部によりその他の表示板ケース8に伝わり放熱される。そこで、LED1の発熱は効率良く放熱され、LED1の温度上昇を防止でき、LED1の性能が損われるのを防止できる。
LEDカバー3とLED基板2とは、図1、図2に示すように、LED基板2の全面を密着するのが伝熱上望ましいが、少なくとも一部を密着することにより放熱効果を確保できる。
LEDカバー3と表示板ケース8は、ABS、ポリカーボネート等の樹脂板または金属板で形成される。樹脂板は意匠上優れ、金属板は放熱の点で優れる。
In such a display device (guide light device), the LED 1 of the light source is turned on by the lighting control device, the surface is illuminated by the light guide plate 4, the brightness is uniformed by the diffusion plate 6, and the display plate 7 is illuminated to display The display pattern of the board 7 is displayed.
At this time, heat generated by the lighting of the LED is transmitted to the LED substrate 2 via the LED lead and solder, and is transmitted to the LED cover 3 that is in close contact with the LED substrate 2. The LED cover 3 has an upper surface, side surfaces, and a front surface that are exposed to the outside as a part of the display panel case 8, and is cooled by external air using the heat radiation fins. Further, it is transmitted to the other display panel case 8 by the fitting portion and radiated. Therefore, the heat generated by the LED 1 can be efficiently dissipated, the temperature of the LED 1 can be prevented from rising, and the performance of the LED 1 can be prevented from being impaired.
As shown in FIGS. 1 and 2, the LED cover 3 and the LED substrate 2 are preferably in close contact with the entire surface of the LED substrate 2 in terms of heat transfer, but a heat dissipation effect can be ensured by adhering at least a part thereof.
The LED cover 3 and the display plate case 8 are formed of a resin plate such as ABS or polycarbonate or a metal plate. The resin plate is excellent in design, and the metal plate is excellent in terms of heat dissipation.

表示装置は、図3に示す壁直付け型の他に、図4に示すように種々取付けることができ、表示装置の用途、表示場所等により選択できる。
図4(a)は、壁埋め込み型で、表示板ケース8及び背面の器具本体9の全体を壁内に埋め込む。また、図4(b)は、天井直付け型であり、器具本体9を天井面に固定する。図4(c)は、天井埋め込み型であり、内部にLEDカバー3も併せて収容した器具本体9を表示板ケース8の上部に配設し、器具本体9及びLEDカバー3を天井内に埋め込み表示板ケース8の表示板7部分を天井面から突出させる。
なお、図示しないが、天井直付け型と天井埋め込み型には、前面及び背面の両面表示タイプの表示装置としてもよい。天井直付け型の両面表示タイプは、器具本体9を挟んで前後(両面)に表示部があり、天井埋め込み型の両面表示タイプは、導光板4の両面側に、拡散板6及び表示板7を配設するものもあれば、前後に表示部を配設するものもある。
In addition to the wall-mounted type shown in FIG. 3, the display device can be variously attached as shown in FIG. 4, and can be selected depending on the use of the display device, the display location, and the like.
FIG. 4A shows a wall-embedded type in which the entire display panel case 8 and the rear instrument body 9 are embedded in the wall. Moreover, FIG.4 (b) is a ceiling direct attachment type, and fixes the instrument main body 9 to a ceiling surface. FIG. 4 (c) shows a ceiling-embedded type in which an instrument body 9 that also houses an LED cover 3 is disposed in the upper part of the display panel case 8, and the instrument body 9 and the LED cover 3 are embedded in the ceiling. The display board 7 portion of the display board case 8 is protruded from the ceiling surface.
Although not shown in the drawing, the direct-ceiling type and the embedded-ceiling type may be a front and rear double-sided display type display device. The double-sided display type directly attached to the ceiling has display parts on the front and back sides (both sides) with the appliance main body 9 in between. The double-sided display type with a ceiling embedded type has a diffusion plate 6 and a display plate 7 on both sides of the light guide plate 4. Some have a display portion, and some have a display portion on the front and back.

これらの取付けの場合の表示装置の放熱は次のようである。
壁埋め込み型では、主としてLEDカバー3の前面から外部へ放熱される。天井直付け型では、主としてLEDカバー3の前面及び側面から外部へ放熱される。また、天井埋込み型では、LEDカバー3は、外部に露出していないが、器具本体9内に放熱する。
The heat dissipation of the display device in the case of these attachments is as follows.
In the wall-embedded type, heat is radiated mainly from the front surface of the LED cover 3 to the outside. In the direct ceiling type, heat is radiated from the front and side surfaces of the LED cover 3 to the outside. In the ceiling-embedded type, the LED cover 3 is not exposed to the outside, but dissipates heat into the instrument body 9.

LED1の発熱をLED基板2を介して放熱するのに、LED基板2を直接LEDカバー3に密着する替わりに、両者間に熱伝導部材10を介在させてもよい。図5にその例をいくつか示す。
図5(a)は、熱伝導部材10が平板でLEDカバー3の上面の内面に密着させ、LED基板2と熱伝導部材10とLEDカバー3を密着させる。
図5(b)は、熱伝導部材10が断面L字型で、一面をLEDカバー3の上面の内面に、他の一面を前面の内面に密着させ、図5(c)は、熱伝導部材10が断面L字型で、一面がLEDカバー3の上面の内面に、他の一面が表示ケース8の背面の外面に密着させ、図5(d)は、熱伝導部材10が断面コの字型で、一面がLEDカバー3の上面の内面に、他の一面が前面の内面に、更に他の一面が表示ケース8の背面の外面に密着させる。
In order to dissipate the heat generated by the LED 1 through the LED substrate 2, instead of directly attaching the LED substrate 2 to the LED cover 3, a heat conducting member 10 may be interposed therebetween. Some examples are shown in FIG.
In FIG. 5A, the heat conducting member 10 is a flat plate and is brought into close contact with the inner surface of the upper surface of the LED cover 3, and the LED substrate 2, the heat conducting member 10 and the LED cover 3 are brought into close contact with each other.
5B, the heat conducting member 10 has an L-shaped cross section, one surface is in close contact with the inner surface of the upper surface of the LED cover 3, and the other surface is in close contact with the inner surface of the front surface, and FIG. 10 is L-shaped in cross section, one surface is in close contact with the inner surface of the upper surface of the LED cover 3, and the other surface is in close contact with the outer surface of the back surface of the display case 8, and FIG. One surface is in close contact with the inner surface of the upper surface of the LED cover 3, the other surface is in close contact with the inner surface of the front surface, and the other surface is in close contact with the outer surface of the back surface of the display case 8.

これらはいずれも、LED基板2と熱伝導部材10間の少なくとも一部を密着させることにより、LED1の発熱をLED基板2を介して、熱伝導部材10に拡散させ、LED1が高温になるのを防止する。同時に、LED基板2と熱伝導部材10間、及び熱伝導部材10とLEDカバー3間、それぞれの間で少なくとも一部を密着させることにより、LED1の発熱をLED基板2及び熱伝導板10を介して、LEDカバー3と表示板ケース8から放熱するか(図5(a)、(b))、または、LED基板2を介して、熱伝導部材10とLEDカバー3と表示板ケース8から放熱する(図5(c)、(d))。
熱伝導部材10の材質は、鋼板、アルミニウム、ステンレス等の金属やセラミックスや熱伝導性の良いフィラー含有の樹脂を使用する。
また、熱伝導部材10は、LED基板2とは別部材として設けるのではなく、LED基板2を両面基板とし、実装面でない裏面の銅箔はパターニングせずに、銅箔をそのまま残し、この銅箔を熱伝導部材10としてもよい。両面基板を用いることにより、別部材として熱伝導部材10を設ける必要がなくなり、取付け等の加工上のメリットが大きい。この場合、熱伝導部材10の形状、大きさを変えることは、両面基板の形状、大きさを変えることとなる。
In any of these cases, the heat generated by the LED 1 is diffused to the heat conducting member 10 through the LED substrate 2 by bringing at least a part of the LED substrate 2 and the heat conducting member 10 into close contact with each other. To prevent. At the same time, at least part of the LED substrate 2 and the heat conducting member 10 and between the heat conducting member 10 and the LED cover 3 are brought into close contact with each other, whereby the heat generated by the LED 1 is transmitted through the LED substrate 2 and the heat conducting plate 10. Then, heat is radiated from the LED cover 3 and the display board case 8 (FIGS. 5A and 5B), or is radiated from the heat conducting member 10, the LED cover 3, and the display board case 8 through the LED substrate 2. (FIGS. 5C and 5D).
As the material of the heat conductive member 10, a metal such as a steel plate, aluminum, stainless steel, ceramics, or a filler-containing resin having good heat conductivity is used.
Further, the heat conducting member 10 is not provided as a separate member from the LED substrate 2, but the LED substrate 2 is a double-sided substrate, the copper foil on the back surface that is not the mounting surface is not patterned, and the copper foil is left as it is. A foil may be used as the heat conducting member 10. By using the double-sided substrate, it is not necessary to provide the heat conducting member 10 as a separate member, and there is a great merit in processing such as attachment. In this case, changing the shape and size of the heat conducting member 10 changes the shape and size of the double-sided substrate.

ここで、図3、4に示す表示装置の取付け型と図5に示す熱伝導部材10の型との関係について説明する。
図3の壁直付け型は、主として、LEDカバー3の天面と前面から熱が外部に放熱される。そこで、熱伝導部材10は、図5(a)〜(d)の平板、前面L字、後面L字、コの字のいずれでもよい。図4(a)の壁埋込み型では、LEDカバー3の上面は埋込み状態にあるため、主として前面から放熱され、平板、前面L字、コの字がよい。図4(b)の天井直付け型では、LEDカバー3の上面は天井と密着、もしくは密着に近い状態となるので、主として前面から放熱され、平板、前面L字、コの字がよい。壁埋込み型及び天井直付け型では平板でもLEDカバー3の前面側に密着させるのが望ましい。図4(c)の天井埋込み型は、LED基板2及びLEDカバー3が共に器具本体9内にあり、外部に露出していないため器具本体内の放熱となる。この場合は、できるだけ熱伝導部材10を大きくするのがよく、最も大きくできるコの字がよい。また、この場合はLEDカバー3を金属板としても意匠上関係なく、放熱の点から望ましい。
基本的には、熱伝導部材10の大きさは、LED1の拡散すべき熱量、放熱すべき放熱量を考慮して変える。拡散すべき熱量、放熱量を増加させる場合は、大きくする。また、後面L字、コの字では、表示及び外観上問題を生じずに、熱伝導部材10を表示板ケース8の背面側に、最大として表示板ケース8の大きさまで延伸させることができる。
Here, the relationship between the mounting type of the display device shown in FIGS. 3 and 4 and the type of the heat conducting member 10 shown in FIG. 5 will be described.
In the wall-mounted type of FIG. 3, heat is radiated to the outside mainly from the top and front surfaces of the LED cover 3. Therefore, the heat conducting member 10 may be any of the flat plate, the front L shape, the rear L shape, and the U shape shown in FIGS. In the wall-embedded type of FIG. 4A, since the upper surface of the LED cover 3 is in the embedded state, heat is radiated mainly from the front surface, and a flat plate, a front L-shape, and a U-shape are good. 4B, the upper surface of the LED cover 3 is in close contact with or close to close to the ceiling, so heat is dissipated mainly from the front surface, and a flat plate, front L shape, and U shape are good. In the wall-embedded type and the ceiling-mounted type, it is desirable that a flat plate is in close contact with the front side of the LED cover 3. In the ceiling-embedded type in FIG. 4C, the LED substrate 2 and the LED cover 3 are both in the instrument main body 9 and are not exposed to the outside, so that heat is dissipated in the instrument main body. In this case, the heat conduction member 10 should be made as large as possible, and the U-shape that can be maximized is good. In this case, the LED cover 3 is preferably a metal plate from the viewpoint of heat dissipation regardless of the design.
Basically, the size of the heat conducting member 10 is changed in consideration of the heat amount to be diffused by the LED 1 and the heat radiation amount to be radiated. To increase the amount of heat to be diffused and the amount of heat released, increase it. Further, with the rear L-shape and the U-shape, the heat conduction member 10 can be extended to the size of the display plate case 8 at the maximum on the back side of the display plate case 8 without causing any problems in display and appearance.

LED基板2とLEDカバー3との密着方法、及びLED基板2と熱伝導部材10とLEDカバー3との密着方法は、ネジやリベットで密着固定する。また、ばねを利用したり、接着剤、両面テープにより密着固定してもよい。接着剤、両面テープ使用では、できるだけ厚さを薄くする、また、熱伝導性の良いサーマルグリースやシリコーン等を使ってもよい。放熱シート等を介在させてもよい。
密着させる位置は、LEDカバー3の上面の内面の他、前面の内面でもよい。
The close contact method between the LED substrate 2 and the LED cover 3 and the close contact method between the LED substrate 2, the heat conducting member 10, and the LED cover 3 are firmly fixed with screws or rivets. Further, a spring may be used, or the adhesive may be adhered and fixed with a double-sided tape. When using an adhesive or double-sided tape, the thickness may be made as thin as possible, or thermal grease or silicone having good thermal conductivity may be used. A heat dissipation sheet or the like may be interposed.
The close contact position may be the inner surface of the front surface in addition to the inner surface of the upper surface of the LED cover 3.

LED1を実装したLED基板2は、LEDカバー3の上面の内面に直接、又は熱伝導部材10を介して、LED1が導光板4の入射面4aに対向するように、即ち、LED1の発光頭部が導光板4の入射面4aに対向するように取付けたが(図1、図2、図5)、これに替えて、表示板ケース8の前面の内面又は背面の内面に、LED1が導光板4の入射面4aに対向するように、即ち、LED1の発光側部が導光板4の入射面4aに対向するように取付けてもよい(図示省略)。この場合、表示板ケース8の前面の内面又は背面の内面に直接又は熱伝導部材10を介して取付けるのは前記と同様であり、さらに、前記同様に表示板ケース8は、その一部を構成するLEDカバー3としてもよい。これらの場合、前面に取付けることにより、外部への放熱が有利となる。また、背面に取付ける場合、表示装置の構造及び取付け型により、背面からの放熱が可能であれば有効な放熱が可能となる。取付け型により選択できる。   The LED substrate 2 on which the LED 1 is mounted is arranged so that the LED 1 faces the incident surface 4a of the light guide plate 4 directly on the inner surface of the upper surface of the LED cover 3 or via the heat conducting member 10, that is, the light emitting head of the LED 1. Is mounted so as to face the incident surface 4a of the light guide plate 4 (FIGS. 1, 2, and 5). 4 may be mounted so as to face the light incident surface 4a, that is, so that the light emitting side portion of the LED 1 faces the light incident surface 4a of the light guide plate 4 (not shown). In this case, it is the same as the above that it is attached directly or via the heat conducting member 10 to the inner surface of the front surface of the display panel case 8 or the inner surface of the rear surface, and the display panel case 8 constitutes a part of the same. The LED cover 3 may be used. In these cases, it is advantageous to dissipate heat to the outside by attaching to the front surface. In addition, in the case of mounting on the back surface, effective heat dissipation is possible if the heat radiation from the back surface is possible due to the structure and mounting type of the display device. Can be selected according to the mounting type.

表示板ケース8は、その上部の外壁を、内面にLED基板2を固定したLEDカバー3で形成しているが、LEDカバー3の部分も表示板ケース8で形成し、LED基板2は表示板ケース8の内面に、少なくとも一部が密着するように固定し、表示板ケース8は、内部の部品取付け、LED基板2の交換等の部品交換、補修等の便宜を図って、適宜分割できるようにしてもよい。熱伝導部材10を使う場合は、LEDカバー3の場合と同様に、LED基板2を熱伝導部材10に密着させ、熱伝導部材10を、表示板ケース8の内面に密着させる。   The display board case 8 is formed with the LED cover 3 whose upper wall is fixed to the inner surface of the display board case 8. The LED cover 3 is also formed of the display board case 8. The display case 8 is fixed so that at least a part thereof is in close contact with the inner surface of the case 8, and the display panel case 8 can be divided as appropriate for the convenience of component replacement, repair such as replacement of the LED board 2, and the like. It may be. When the heat conducting member 10 is used, the LED substrate 2 is brought into close contact with the heat conducting member 10 and the heat conducting member 10 is brought into close contact with the inner surface of the display panel case 8 as in the case of the LED cover 3.

熱伝導部材10を使用する場合、LED基板2を熱伝導部材10に密着させ、かつ、熱伝導部材10を表示板ケース8(LEDカバー3)の内面に密着させるようにしたが、熱伝導部材10は表示板ケース8(LEDカバー3)と必ずしも密着しなくてもよい。LED基板2と熱伝導部材10とを少なくとも一部密着させることにより、LED1の発熱の熱拡散による冷却、及び放熱による冷却が可能である。例えば、図5において、LED基板2と熱伝導部材10とは密着させるが、熱伝導部材10とLEDカバー3とは密着させなくてもよい。この場合、LED基板2または熱伝導部材10のLEDカバー3への取付けは、公知の取付け方法で適宜行う。   When the heat conducting member 10 is used, the LED substrate 2 is brought into close contact with the heat conducting member 10 and the heat conducting member 10 is brought into close contact with the inner surface of the display panel case 8 (LED cover 3). 10 may not necessarily be in close contact with the display panel case 8 (LED cover 3). The LED substrate 2 and the heat conducting member 10 are at least partially in close contact with each other, so that the LED 1 can be cooled by heat diffusion of heat generation and cooled by heat dissipation. For example, in FIG. 5, the LED substrate 2 and the heat conducting member 10 are in close contact, but the heat conducting member 10 and the LED cover 3 may not be in close contact. In this case, the LED substrate 2 or the heat conducting member 10 is appropriately attached to the LED cover 3 by a known attachment method.

本発明の面光源装置は、誘導灯装置、非常灯装置、道路標識装置、広告灯装置等の表示装置に、エッジライト式の面発光型表示装置として使用される。   The surface light source device of the present invention is used as an edge light type surface emitting display device for display devices such as a guide light device, an emergency light device, a road sign device, and an advertising light device.

本発明の表示装置の一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of the display apparatus of this invention. 図1のA−A線断面図である。It is the sectional view on the AA line of FIG. 図1の表示装置を取付けた状態を示す図である。It is a figure which shows the state which attached the display apparatus of FIG. 図1の表示装置を別に取付けた状態を示す図である。It is a figure which shows the state which attached the display apparatus of FIG. 1 separately. 図1の熱伝導板使用の表示装置のA−A線断面図である。It is the sectional view on the AA line of the display apparatus using the heat conductive board of FIG.

符号の説明Explanation of symbols

1 LED、2 LED基板、3 LEDカバー、4 導光板、4a 入射面、4b 照射面、7 表示板、8 表示板ケース、10 熱伝導部材。   DESCRIPTION OF SYMBOLS 1 LED, 2 LED board, 3 LED cover, 4 Light-guide plate, 4a Incident surface, 4b Irradiation surface, 7 Display board, 8 Display board case, 10 Thermal conduction member.

Claims (2)

光源である複数のLEDと、
該LEDを実装するLED基板と、
側面の入射面から入射した前記光源の光を前面の照射面から面光源とし照射する導光板と、
前記LED、前記LED基板及び前記導光板を収容するとともに、表示パネルを前記導光板の前面側に収容し、前記導光板と接する面は前記導光板と略同じ大きさとなる背面と前記背面を延設する延設背面を有する表示板ケースと、を備えた面光源装置において、
全面に渡り断面形状が略L字状を形成する2つの平面と、この2つの面の両側面とで囲まれて成る空間の内面に反射面を設け、前記空間内に前記LED基板の前記LEDを実装する面と対向する面が前記内面と密着するように前記LED基板を収容し、前記LED基板に実装された前記LEDが前記表示板ケースに収容された前記導光板の側面の入射面に対向する位置に着脱可能に取り付けられて、前記LEDが発熱する熱を放熱するLEDカバーと、
前記表示板ケースに前記導光板とともにその背面に収容され、さらに前記LEDカバーを前記表示板ケースに取り付けたとき、前記LED基板と近接して配置される反射板と、
を備え、
前記導光板の上下方向の長さは前記表示パネルのそれより長く、LEDカバーと表示パネルは少なくともラップしない部分を有することを特徴とする面光源装置。
A plurality of LEDs as light sources;
An LED substrate on which the LED is mounted;
A light guide plate that irradiates the light of the light source incident from the incident surface of the side surface as a surface light source from the irradiation surface of the front surface;
The LED, the LED substrate, and the light guide plate are accommodated, the display panel is accommodated on the front side of the light guide plate, and a surface in contact with the light guide plate extends a back surface and the back surface that are substantially the same size as the light guide plate. In a surface light source device comprising a display panel case having an extended back surface to be installed,
A reflective surface is provided on the inner surface of a space surrounded by two planes having a substantially L-shaped cross-section over the entire surface and both side surfaces of the two surfaces, and the LED of the LED substrate is provided in the space. surface opposite the surface to be implemented to accommodate the LED substrate so as to be in close contact with the inner surface of the incident surface of the side of the front Symbol the light guide plate, wherein the LED mounted on the LED substrate is housed in the panel case An LED cover that is detachably attached at a position facing the LED, and dissipates heat generated by the LED; and
A reflector that is housed on the back surface of the display plate case together with the light guide plate, and is further disposed close to the LED substrate when the LED cover is attached to the display plate case;
With
The vertical length of the light guide plate rather longer than that of the display panel, the surface light source device characterized by having a partial LED cover and the display panel is not at least wrap.
光源である複数のLEDと、該LEDを実装するLED基板と、側面の入射面から入射した前記光源の光を前面の照射面から面光源とし照射する導光板と、前記LED、前記LED基板及び前記導光板を収容するとともに、表示パネルを前記導光板の前面側に収容し、前記導光板と接する面は前記導光板と略同じ大きさとなる背面と前記背面を延設する延設背面を有する表示板ケースと、を備えた面光源装置において、
全面に渡り断面形状が略L字状を形成する2つの平面と、この2つの面の両側面とで囲まれて成る空間の内面に反射面を設け、前記空間内に前記LED基板の前記LEDを実装する面と対向する面が前記内面と密着するように前記LED基板を収容し、前記LEDが発熱する熱を放熱するLEDカバーと、
前記表示板ケースに前記導光板とともにその背面に収容され、さらに前記LEDカバーを前記表示板ケースに取り付けたとき、前記LED基板と近接して配置される反射板と、を備え、
前記導光板の上下方向の長さは前記表示パネルのそれより長く、LEDカバーと表示パネルは少なくともラップしない部分を有し、
前記表示板ケースは分割可能であり、
前記表示板ケース内に熱伝導部材を設け、該伝導部材に前記LED基板の少なくとも一部が密着し、また、前記LEDが前記導光板の側面の入射面に対向するように、前記LED基板を配設し、
前記熱伝導部材の形状は、天井に直接取り付けられる場合には、上面を形成する平板、上面と前面を形成するL字状、または前面と上面と後面に跨るコ字状のいずれかを呈することを特徴とする面光源装置。
A plurality of LEDs that are light sources, an LED substrate on which the LEDs are mounted, a light guide plate that irradiates light from the light source incident from the incident surface of the side surface as a surface light source from an irradiation surface of the front surface, the LEDs, the LED substrate, and The light guide plate is housed, the display panel is housed on the front side of the light guide plate, and a surface in contact with the light guide plate has a back surface that is substantially the same size as the light guide plate and an extended back surface that extends the back surface. In a surface light source device comprising a display panel case,
A reflective surface is provided on the inner surface of a space surrounded by two planes having a substantially L-shaped cross-section over the entire surface and both side surfaces of the two surfaces, and the LED of the LED substrate is provided in the space. An LED cover that accommodates the LED substrate such that a surface facing the surface on which the LED is mounted is in close contact with the inner surface, and dissipates heat generated by the LED;
A reflector disposed in the back of the display plate case together with the light guide plate, and further disposed when the LED cover is attached to the display plate case;
The length of the light guide plate in the vertical direction is longer than that of the display panel , and the LED cover and the display panel have at least a portion that does not wrap,
The display board case is separable,
A heat conductive member is provided in the display plate case, and the LED substrate is mounted so that at least a part of the LED substrate is in close contact with the conductive member, and the LED is opposed to an incident surface on a side surface of the light guide plate. Arranged,
When the heat conducting member is directly attached to the ceiling, the heat conducting member has a flat plate that forms the upper surface, an L shape that forms the upper surface and the front surface, or a U shape that straddles the front surface, the upper surface, and the rear surface. A surface light source device.
JP2008188439A 2008-07-22 2008-07-22 Surface light source device Expired - Lifetime JP4633147B2 (en)

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