JP4586396B2 - Light source device and projector using the same - Google Patents

Description

  The present invention relates to a light source device including a solid light source element and a projector using the same.

  A projector that projects an image on a screen or the like includes a light source, a light modulation element such as a liquid crystal panel that modulates light emitted from the light source to form an image, a projection lens that projects the modulated light onto a screen, or the like. It has.

  In recent years, there has been a strong demand for miniaturization and high brightness of projectors, and in response to this, the adoption of small liquid crystal panels is progressing. On the other hand, discharge light source lamps such as metal halide lamps, ultra-high pressure mercury lamps, and halogen lamps are generally used as light sources, and the light sources have also been reduced in size and brightness. Originally, these light sources generate heat during light emission. Since the heat generated from the light source changes the characteristics of the light source itself and degrades the liquid crystal panel and other optical components, various cooling means and heat dissipation means are provided. However, the heat generation from the light source is increasing as the size of the light source lamp is reduced and the brightness is increased, and it is difficult to achieve sufficient cooling and heat dissipation by the forced air cooling method using a generally adopted fan. . Therefore, a method of forcibly cooling the light source lamp using a liquid has been proposed (for example, Patent Document 1). According to this liquid cooling method, an effect is also expected to eliminate noise accompanying the rotation of the fan in the forced air cooling method.

JP 2002-107825 A

  In Patent Document 1, a heat collecting member is provided in a high-pressure mercury lamp that is a light source, and the heat of the light source is absorbed by the liquid via the heat collecting member and cooled. That is, the heat of the light source is indirectly cooled, which is not sufficient in terms of cooling efficiency.

  On the other hand, the discharge type light source lamp has problems to be improved other than heat generation. For example, the fact that the size of the lamp and the power source is necessarily large and heavy, and that it is difficult to turn on / off instantaneously has been required to improve the size and performance of the projector.

  As a means for solving the problems of the discharge type light source lamp as described above, a light emitting diode (hereinafter referred to as LED) light source has been proposed. The LED light source has many advantages as a light source for a projector, such as being able to be miniaturized including a power source, being capable of instantaneous lighting / extinguishing, and having a wide color reproducibility and long life. . Further, since it does not contain harmful substances such as mercury, it is preferable from the viewpoint of environmental protection.

  However, a countermeasure against heat generation is required for the LED light source as well as the discharge type light source lamp. Current LED light sources have low quantum efficiency, and most of the injected electrical energy is released as heat. For this reason, as the current flowing through the LED chip increases, the amount of emitted light increases while the amount of heat generation also increases significantly. For this reason, while the temperature of an LED chip rises and luminous efficiency falls, LED chip itself may be thermally destroyed. As a result, the current LED light source cannot flow a very large current, and the amount of emitted light is insufficient as a light source for a projector.

  Furthermore, with the miniaturization of the liquid crystal panel, it is necessary to reduce the etendue of the light source. Etendue is a numerical value representing the spatial extent in which the luminous flux exists as a product of the light emitting area and the solid angle, and is optically stored. If a light source having a large etendue is used for a small liquid crystal panel (light modulation element), a large amount of light flux cannot be taken into the liquid crystal panel, resulting in a decrease in light use efficiency. For this reason, when a large LED chip is employed in order to obtain a large light emission amount, there are problems that it becomes a barrier to miniaturization and that the etendue becomes large and it is difficult to obtain sufficient luminance.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a compact and high-luminance light source device and a projector using the same.

  The light source device of the present invention includes a mounting substrate including a connection terminal, a solid light source element mounted on the mounting substrate, and a sealed container containing the solid light source element and a liquid, and the sealed container includes the solid It has a light transmission part which permeate | transmits the light which a light source element inject | emits, and the board | substrate support part which supports the said mounting board | substrate.

  According to this, since the solid light source element is directly cooled by the liquid, it is possible to suppress an increase in temperature of the solid light source element even if the power for driving the solid light source element is increased. As a result, a light source device that is small and has high brightness can be realized. Furthermore, according to this, since the board | substrate support part which supports the mounting substrate which mounted the solid light source element in an airtight container is provided, it becomes easy to arrange | position a solid light source element in a liquid.

  In this light source device, it is preferable that the mounting substrate is provided so that the connection terminal is exposed to the outside of the sealed container.

  According to this, since the connection terminal that is electrically connected to the solid light source element is exposed to the outside of the sealed container, it is easy to electrically drive the solid light source element accommodated in the sealed container. .

  In this light source device, it is preferable that the sealed container has a cooling unit for cooling the liquid.

  According to this, since the sealed container has a cooling unit for cooling the liquid, it is possible to suppress the temperature rise of the liquid due to heat absorption from the solid light source element, and the cooling capacity can be increased for a long time. Can be maintained.

  In this light source device, it is desirable that a plurality of the solid light source elements are accommodated in the sealed container in a stacked state.

  According to this, compared with the case where a plurality of solid light source elements are arranged on the same plane, or when one solid light source element having the same light emitting area as the plurality of solid light source elements is used, it is apparent. In addition to reducing the surface area, the etendue of the light source can be reduced without significantly reducing the amount of emitted light. As a result, a light source device that is small and has high brightness can be realized.

  In this light source device, it is preferable that the sealed container includes a light reflecting portion that reflects light emitted from the solid light source element.

  According to this, since the sealed container includes the light reflecting portion, it is possible to more effectively use the light emitted from the solid light source element. For example, when the solid-state light source element can emit light to both sides of the mounting substrate, it is possible to increase the amount of light emitted to the other side by reflecting the light on one side with the light reflecting portion. Become.

  In this light source device, it is preferable that the light reflecting portion is formed on an inner wall surface of the sealed container.

  When the airtight container is formed of a light-transmitting material and a light reflecting portion is provided outside the airtight container, the light emitted from the light source in the airtight container toward the light reflecting portion is Through the wall part, reflected by the light reflecting part, and again through the wall part, toward the projection direction. As a result, a large amount of light may be lost due to scattering or the like when light passes through the wall.

  However, according to this configuration, since the light reflecting portion is formed on the inner wall surface of the sealed container, the light emitted from the solid light source element toward the light reflecting portion is reflected without passing through the wall portion of the sealed container. It becomes possible to do. As a result, it is possible to suppress loss due to scattering or the like when light passes through the wall of the sealed container.

  In this light source device, an inner wall surface of the sealed container in which the light reflecting portion is formed, a surface facing the light projection direction is curved or bent so as to surround the solid light source element in the vicinity of the solid light source element. It is desirable that

  According to this, by providing the light reflecting portion on the inner wall surface of the curved container that is curved or bent, it becomes possible to suppress the divergence of the reflected light and to improve the light utilization efficiency.

  In this light source device, it is preferable that the sealed container includes a lens for suppressing divergence of light emitted from the solid light source element.

  According to this, it becomes possible to suppress the divergence of the emitted light from the solid light source element and the reflected light by the light reflecting portion by the lens, and it is possible to improve the light utilization efficiency.

  In this light source device, the sealed container preferably has a liquid circulation part for circulating the liquid, and the solid light source element is preferably provided in a flow path through which the liquid circulates by the liquid circulation part. .

  According to this, since the solid light source element is provided in the flow path through which the liquid circulates, heat generated from the solid light source element can be efficiently transferred to the liquid.

  In this light source device, it is preferable that the flow path has a narrow cross section around the solid light source element.

  According to this, since the circulating liquid passes in the vicinity of the solid light source element that generates heat, most of the liquid can contribute to heat absorption from the solid light source element, and heat generated from the solid light source element. Can be more efficiently transferred to the liquid.

  The projector of the present invention includes the light source device described above, a light modulation unit that modulates the light emitted from the light source device, and a projection unit that projects the modulated light modulated by the light modulation unit to a distant position. It is characterized by having.

  According to this, since a solid-state light source element that can be miniaturized is used as a light source and the light source device that can suppress the temperature rise of the solid-state light source element is provided, a small and high-brightness projector can be realized. .

(First embodiment)
The light source device according to the first embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a schematic diagram illustrating a schematic configuration of a light source device according to the present embodiment.

  As shown in FIG. 1, the light source device 10 includes an annular sealed container 20, and an annular channel 21 filled with a liquid L is formed inside the sealed container 20. In a predetermined position of the sealed container 20, a light emitting unit 50 including a mounting substrate 40 on which the LED chip 30 is mounted, a cooling unit 60 that cools the liquid L, and a liquid circulation that circulates the liquid L along the flow path 21. A circulation pump 70 is arranged as a part. The light emitting unit 50, the cooling unit 60, and the circulation pump 70 are coupled so that the channel 21 provided in each communicates, and each unit including the channel 21 constitutes the sealed container 20. Moreover, each part which comprises the airtight container 20 is couple | bonded through the sealing member which is not shown in figure, and it suppresses that the liquid L leaks from a slight clearance gap. In addition, each part which comprises the airtight container 20 may be integrally formed.

  The liquid L is a translucent liquid, and is preferably selected from liquids that are electrically insulating and are non-corrosive to each member provided in the light source device 10. More preferably, a liquid having a low vapor pressure, a low freezing point, excellent thermal stability, and high thermal conductivity is desired. Examples of liquids applicable to the present invention include organic heat transfer media such as biphenyl diphenyl ether, alkyl benzene, alkyl biphenyl, triaryl dimethane, alkyl naphthalene, hydrogenated terphenyl, and diaryl alkane. The ones that are used in Silicone and fluorine liquids are also applicable. From among these, the light source device 10 may be selected in consideration of the application, required performance, environmental conservation, and the like.

  The cooling unit 60 constitutes a part of the sealed container 20 and the flow path 21, and is formed of, for example, a metal such as Fe, Cu, Al, Mg, or a material having excellent thermal conductivity including them. The heat of the liquid L in the flow path 21 can be released to the outside. As shown in FIG. 1, the cooling unit 60 is provided with a large number of fins 61 to increase the surface area and to increase the heat dissipation capability to the outside. In the present embodiment, the cooling unit 60 is provided at a predetermined position of the sealed container 20, but the number thereof is not limited to one, and may be provided in a wider range of the sealed container 20. Further, if the heat radiating is not sufficient only by the natural convection of the air flowing between the fins 61, it is possible to forcibly cause air convection by providing an external air-cooling fan to enhance the heat radiating capability.

  Here, the light emitting unit 50 will be described with reference to FIGS. 2A and 2B are diagrams showing the LED chip 30 and the mounting substrate 40 provided in the light emitting unit 50. FIG. 2A is a front view of the LED chip 30, and FIG. 2B is a front view of the mounting substrate 40. FIG. 2 and FIG. 2C are front views showing a state where the LED chip 30 is mounted on the mounting substrate 40, and FIG. 2D is a side sectional view thereof. 3A is a front view of the light emitting unit 50, FIG. 3B is a plan view thereof, FIG. 3C is a side view of the light emitting unit 50, and FIG. FIG.

  In the LED chip 30 of this embodiment, a light emitting region (not shown) is formed on a transparent sapphire substrate, and as shown in FIG. An electrode 31 for flowing a current is formed. The four electrodes 31 include an anode electrode, a cathode electrode, and two dummy electrodes, but two anode electrodes and two cathode electrodes may be provided.

  As shown in FIG. 2B, the mounting substrate 40 has a cross-shaped opening 41 at the approximate center thereof, and an anode connection terminal 42 and an upper side of the opening 41, respectively. The cathode connection terminals 43 are formed on both surfaces of the mounting substrate 40. Moreover, the convex part 44 is formed in the right-and-left both sides of the opening part 41, and the width | variety b of the convex part 44 is substantially the same dimension as the height a (refer Fig.3 (a)) of the flow path 21. FIG.

  As shown in FIGS. 2C and 2D, the LED chips 30 are mounted on both surfaces of the mounting substrate 40 via bumps 32 formed on the electrodes 31. The two LED chips 30 are stacked and provided so as to close the opening 41 of the mounting substrate 40 from both sides. At this time, the four electrodes 31 of the LED chip 30 and the four regions 45 protruding from the openings 41 of the connection terminals 42 and 43 are connected, and the LED chip 30 is driven via the connection terminals 42 and 43. be able to.

  Since the light emitting region of the LED chip 30 is formed on a transparent sapphire substrate, when an electric current is passed through the LED chip 30, each LED chip 30 emits light in both directions on the front surface side and the back surface side (mounting substrate side). Is injected. Further, the light emitted from the back side of one LED chip 30 passes through the other LED chip 30 and is emitted to the front side of the other LED chip 30.

  As shown in FIG. 3, the mounting substrate 40 is provided in a box 51 that forms part of the sealed container 20 and the flow path 21. Since the mounting substrate 40 is fixed to the box 51 so that the LED chip 30 is positioned in the flow path 21 formed in the box 51, the LED chip 30 is directly exposed to the liquid L flowing through the flow path 21. Will be. Further, the upper and lower end portions of the mounting substrate 40 protrude from the box 51 to the outside, and can be electrically connected to the connection terminals 42 and 43 from the outside.

  As shown in FIG. 3A, a transparent window 52 as a light transmission part for projecting light emitted from the LED chip 30 to the outside is provided on the front surface of the box body 51. Part of it. The transparent window 52 is formed using a chemically stable material with respect to the liquid L, such as glass or transparent plastic (for example, acrylic resin or polycarbonate). Further, the transparent window 52 is fixed to the box 51 by using means such as adhesive fixing so that liquid leakage does not occur. In the case where the box 51 is formed of a light-transmitting material such as glass or transparent plastic, the box 51 itself functions as a light transmitting portion, and thus the transparent window 52 is not necessarily required.

  As shown in FIG. 3C, a reflecting plate 22 as a light reflecting portion is provided on three surfaces including a side surface of the channel 21 facing the transparent window 52 and the upper and lower surfaces of the channel 21. In addition, light emitted from the LED chip 30 in a direction different from the direction of the projection A can be taken out through the transparent window 52.

  Here, a procedure for attaching the mounting substrate 40 to the box 51 will be described. As shown in FIG. 4, the box body 51 includes two members 51 a and 51 b that divide the box body 51 and the flow path 21 in parallel with the flow path 21 from the vertical direction, and each joint surface 53 a and 53 b. The box body 51 and the flow path 21 are formed by joining.

  On the joint surface 53a of the first member 51a, a recess 54 that is recessed in the Y direction is formed from the upper surface to the lower surface of the box approximately at the center in the X direction (flow channel direction). Here, the depth (Y direction) of the recess 54 is substantially the same as the thickness of the mounting substrate 40, and the width (X direction) of the recess 54 is substantially the same as the width c (see FIG. 2) of the mounting substrate 40. It has become. As shown in FIG. 4B, when the mounting substrate 40 is mounted in the recess 54, the mounting substrate 40 is supported by the side surface of the recess 54 and positioned with respect to the box 51 in the X direction. Furthermore, as described above, the width b of the protrusion 44 protruding in the left-right direction of the mounting substrate 40 is substantially the same as the height a of the flow path 21 (see FIG. 3A). The mounting substrate 40 is positioned in the Z direction with respect to the box body 51 by supporting the portion 44 on the upper and lower surfaces of the flow path 21. Thereafter, as shown in FIG. 4C, when the joining surface 53a of the first member 51a and the joining surface 53b of the second member 51b are joined, the light emitting unit 50 is completed, and the mounting substrate 40 is The first member 51a is supported by the bottom surface of the recess 54 and the joint surface 53b of the second member 51b, and is positioned with respect to the box 51 in the Y direction. That is, the concave portion 54, the bonding surface 53b, and the upper and lower surfaces of the flow path 21 function as a substrate support portion that supports the mounting substrate 40, and the mounting substrate is positioned in each of the XYZ directions. The first member 51a, the second member 51b, and the mounting substrate 40 are joined via a seal member (not shown) to prevent the liquid L from leaking from a slight gap.

  Since the light source device 10 is configured as described above, the connection terminals 42 exposed from the upper and lower surfaces of the light emitting unit 50 in a state where the circulation pump 70 is driven to circulate the liquid L in the flow path 21. When an electric current is passed through 43 to cause the LED chip 30 to emit light, the heat generated from the LED chip 30 is absorbed by the liquid L, and the LED chip 30 is cooled. Here, each LED chip 30 is effectively cooled from both the front and back sides of each LED chip 30 because the opening 41 is formed in the mounting substrate 40 on the back side. The liquid L that has absorbed heat is sent to the cooling unit 60 by circulation. The cooling unit 60 absorbs the heat of the liquid L, and cools the liquid L by exchanging heat with the outside, for example, air. The cooled liquid L reaches the light emitting unit 50 again by circulation, and thereafter repeats the above operation.

  As described above, according to the light source device 10 of the present embodiment, the following effects can be obtained.

  (1) According to the present embodiment, since the LED chip 30 is directly cooled from the front and back surfaces by the liquid L, even if the power for driving the LED chip 30 is increased, the temperature rise of the LED chip 30 is suppressed. It becomes possible. As a result, the light source device 10 that is small and has high brightness can be realized.

  (2) According to the present embodiment, the concave portion 54, the joint surface 53 b, and the upper and lower surfaces of the flow path 21 formed in the light emitting unit 50 function as a substrate support unit that supports the mounting substrate 40 on which the LED chip 30 is mounted. Therefore, it becomes easy to arrange the LED chip 30 in the flow path 21.

  (3) According to the present embodiment, since the connection terminals 42 and 43 that are electrically connected to the electrode 31 of the LED chip 30 are exposed to the outside of the sealed container 20, the LEDs housed in the sealed container 20 It becomes easy to electrically drive the chip 30.

  (4) According to this embodiment, since the airtight container 20 has the cooling part 60 that cools the liquid L, it is possible to suppress the temperature rise of the liquid L due to heat absorption from the LED chip 30. It becomes possible to maintain the cooling capacity over time.

  (5) According to the present embodiment, since the plurality of LED chips 30 are provided by being stacked, when the plurality of LED chips 30 are arranged on the same plane, or the same light emitting area as the plurality of LED chips 30 The apparent surface area can be reduced as compared with the case of using a single LED chip having, and the etendue of the light source can be reduced without significantly reducing the amount of emitted light. As a result, a light source device that is small and has high brightness can be realized.

  (6) According to the present embodiment, since the light emitting unit 50 includes the reflection plate 22, out of the light emitted to both surfaces of the mounting substrate 40, the light emitted to one surface is reflected to the other surface. Thus, the amount of light emitted to the other surface side can be increased. As a result, the light utilization efficiency can be improved.

  (7) According to this embodiment, since the reflecting plate 22 is formed on the inner wall surface of the flow path 21, the light emitted from the LED chip 30 is reflected without passing through the wall portion of the sealed container 20. It becomes possible. As a result, it is possible to suppress loss due to scattering or the like when light passes through the wall portion of the sealed container 20.

  (8) According to this embodiment, since the LED chip 30 is provided in the flow path 21 in which the liquid L circulates by the circulation pump 70, heat generated from the LED chip 30 is efficiently transferred to the liquid L. It becomes possible.

  (9) According to the present embodiment, the LED chip 30 in which the light emitting region is formed on the transparent substrate is mounted on the opening 41 of the mounting substrate 40. For this reason, it becomes possible to emit light to both sides of the mounting substrate 40, and out of the light emitted from the LED chip 30 to both sides of the mounting substrate 40, the light emitted to one side is reflected by the reflection plate 22. After being reflected at, the LED chip 30 can be transmitted and projected to the other surface side, and the amount of light emitted to the other surface side can be increased. Furthermore, when a plurality of LED chips 30 are stacked, light emitted from one LED chip 30 can be projected through the other LED chips 30 and light utilization efficiency can be improved. It becomes possible.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the component same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 5 is a schematic diagram illustrating a schematic configuration of the light source device according to the second embodiment. 6 and 7 are views showing a light emitting unit of the light source device according to the second embodiment. FIG. 6A is a plan view thereof, FIG. 6B is a front view thereof, and FIG. ) Is a side view thereof, and FIG. 7B is a sectional view thereof.

  As shown in FIG. 5, the light source device 10 includes an annular sealed container 20 including a light emitting unit 50, a cooling unit 60, and a circulation pump 70 as a liquid circulation unit at predetermined positions, as in the first embodiment. ing.

  Here, the light emitting unit 50 will be described in detail with reference to FIGS. 6 and 7. Note that the light emitting unit 50 of the present embodiment is not provided with the transparent window 52 because the box 51 is formed of a light transmissive member such as transparent plastic.

  As shown in FIG. 6A, the flow path 21 that penetrates the light emitting unit 50 is such that the inner wall surface facing the light projection direction A surrounds the LED chip 30 around the position where the mounting substrate 40 is mounted. It is bent and formed. Furthermore, as shown in FIG. 6A and FIG. 7B, the light reflecting portion is provided on the inner wall surface of the bent portion 21a of the flow path 21 and on the side surface facing the light projection direction A and its upper and lower surfaces. The reflecting plate 22 is provided. Further, as shown in FIG. 6B, the flow path 21 is narrowed in the vicinity of the LED chip 30 with its height reduced.

  Further, as shown in FIGS. 6 and 7, a lens 55 is provided on the outer wall surface of the box 51 on the light projection direction A side, and the light emitted from the LED chip 30 and the reflection plate The light reflected by the light 22 is condensed or collimated toward the projection direction A.

  As shown in FIG. 6 and FIG. 7, flanges 56 are provided at both ends of the light emitting unit 50, and connection with other components constituting the sealed container 20 is easy.

  As described above, according to the light source device 10 of the present embodiment, the following effects can be obtained in addition to the effects of the first embodiment.

  (1) According to the present embodiment, the flow path 21 is bent in the vicinity of the LED chip 30 so that the inner wall surface facing the light projection direction A surrounds the LED chip 30. Since the reflecting plate 22 is provided on the inner wall surface of the bent portion 21a and the side surface facing the light projection direction A and the upper and lower surfaces thereof, it is possible to suppress the divergence of the reflected light by the reflecting plate 22. It becomes possible to improve utilization efficiency.

  (2) According to this embodiment, since the lens 55 is provided on the outer wall surface on the projection direction A side of the light emitting unit 50, the emission of light emitted from the LED chip 30 or the reflection of light reflected by the reflecting plate 22 is suppressed. Is possible.

  (3) According to the present embodiment, the flow path 21 is narrowed in the vicinity of the LED chip 30 by reducing its height. Therefore, since the circulating liquid L passes through the vicinity of the LED chip 30 that generates heat, most of the liquid L can contribute to heat absorption from the LED chip 30. As a result, the heat generated from the LED chip 30 can be more efficiently transferred to the liquid L.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic diagram illustrating a schematic configuration of a projector including the light source device according to the first or second embodiment.

  The projector 100 includes three light source devices 110R, 110G, and 110B each including an LED chip that emits red (R), green (G), and blue (B) light.

  The red light beam emitted from the light source device 110R passes through the condenser lens 120R, is reflected by the reflection mirror 130R, and enters the liquid crystal light valve 140R for red light. The green light beam emitted from the light source device 110G passes through the condenser lens 120G and enters the liquid crystal light valve 140G for green light. The blue light beam emitted from the light source device 110B passes through the condenser lens 120B, is reflected by the reflection mirror 130B, and enters the liquid crystal light valve 140B for blue light.

  The liquid crystal light valves 140R, 140G, and 140B function as a light modulator that modulates each color light according to image data sent from a liquid crystal light valve driving circuit (not shown). Here, polarizing plates (not shown) are arranged on the incident side and the emission side of each liquid crystal light valve 140R, 140G, 140B. Therefore, only linearly polarized light in a predetermined direction among the light beams emitted from the light source devices 110R, 110G, and 110B is transmitted through the incident side polarizing plate and is incident on the liquid crystal light valves 140R, 140G, and 140B.

  The three color lights modulated by the liquid crystal light valves 140R, 140G, and 140B are incident on the cross dichroic prism 150. The cross dichroic prism 150 is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged in a cross shape on the bonding surface. These dielectric multilayer films combine the three color lights to form light representing a color image. The combined light is projected onto the projection screen SC by the projection lens 160 as a projection unit, and an enlarged image is displayed.

  As described above, according to the present embodiment, the LED chip 30 that can be miniaturized is used as the light source, and the light source device 10 that can suppress the temperature rise of the LED chip 30 is provided. 100 can be realized.

(Modification)
In addition, you may change embodiment of this invention as follows.

  The mounting substrate 40 used in the above embodiment may have a curved surface as shown in FIG. FIG. 9A is a front view of the mounting board 40 according to this modification, and FIG. 9B is a cross-sectional view taken along the line AA. Since the cross-sectional shape of both end portions 46 in the left-right direction (flow direction of the liquid L) of the opening 41 formed in the approximate center of the mounting substrate 40 is a streamline shape, the liquid L is open to the opening of the mounting substrate 40. It becomes possible to smoothly flow into the portion 41. Further, since the opening 41 a in the left-right direction of the opening 41 is enlarged, the liquid L can be easily guided to the opening 41 of the mounting substrate 40.

  In the above embodiment, an example in which a total of two LED chips 30 are mounted on both surfaces of one mounting substrate 40 has been described. However, a mounting substrate 40 in which one LED chip 30 is mounted on only one surface may be used. .

  On the other hand, a plurality of mounting boards 40 may be provided so that a larger amount of light can be obtained. In this case, when the LED chip 30 is disposed in the flow path 21, as shown in FIG. 10, the plurality of LED chips 30 mounted on the plurality of mounting substrates 40 are liquidated between the LED chips 30. It is preferable to arrange so as to be stacked with a distance allowing smooth movement.

  According to this, it is possible to increase the amount of light approximately N times (N is the number of LED chips 30 to be stacked) while the light emitting area is substantially the same as in the case of one LED chip 30. Further, since the stacked LED chips 30 are continuously directly cooled by the liquid L circulated by the circulation pump 70 and cooled by the cooling unit 60, the temperature rise of each stacked LED chip 30 is efficiently performed. Can be suppressed. Furthermore, in this modification, the stacked LED chips 30 are stacked and spaced apart from each other at an appropriate interval, and the liquid L always comes into direct contact with the front and back surfaces of the LED chip 30, The LED chip 30 is reliably and efficiently cooled. As a result, the input power to each LED chip 30 can be significantly increased, and the amount of light can be further increased.

  In this case, the box body 51 includes third and fourth members 51c and 51d between the mounting boards 40 in addition to the first and second members 51a and 51b. The flow path 21 between the substrates 40 is configured, and each mounting substrate 40 is positioned.

  In the second embodiment, the flow path 21 is bent in the vicinity of the LED chip 30 so that the inner wall surface facing the light projection direction A surrounds the LED chip 30. It may be formed to be curved so as to surround.

  In the above-described embodiment, the LED chip 30 is used as the solid light source element. However, the solid state light source element can be applied to other solid light source elements such as a semiconductor laser.

  In the above-described embodiment, an example in which heat is radiated through the member provided with the fins 61 as the cooling unit 60 has been described, but other means such as a Peltier element may be used.

  In the third embodiment, a transmissive liquid crystal light valve is used as the light modulation element, but a reflective liquid crystal light valve (LCOS), a digital micromirror device (DMD, registered trademark), or the like is used. It can also be applied to projectors that have been used.

  Next, technical ideas that can be grasped from the embodiment and the modified examples will be described below together with their effects.

  (1) In the light source device according to any one of claims 1 to 10, a light emitting region of the solid light source element is light transmissive, and the mounting substrate has a light transmitting region (for example, an opening). And the solid state light source element is mounted such that a light emitting region thereof is positioned on a region through which light of the mounting substrate is transmitted.

  According to this, it becomes possible to emit light to both sides of the mounting substrate, and among the light emitted from the solid light source element to both sides of the mounting substrate, the light emitted to one surface is reflected. Thereafter, the solid light source element can be transmitted and projected to the other surface side, and the amount of light emitted to the other surface side can be increased.

  Furthermore, according to this, when a plurality of solid light source elements are stacked, it is possible to project light emitted from one solid light source element through another solid light source element, thereby improving light utilization efficiency. Can be improved.

  (2) In the light source device according to any one of claims 1 to 10 or the technical idea (1), the mounting substrate is accommodated in the sealed container in a state where a plurality of the solid light source elements are stacked. As described above, the light source device is supported by the sealed container in a state in which a plurality of layers are stacked.

  According to this, compared with the case where a plurality of solid light source elements are arranged on the same plane, or when one solid light source element having the same light emitting area as the plurality of solid light source elements is used, it is apparent. In addition to reducing the surface area, the etendue of the light source can be reduced without significantly reducing the amount of emitted light. As a result, a light source device that is small and has high brightness can be realized.

The schematic diagram which shows schematic structure of the light source device which concerns on 1st Embodiment of this invention. It is a figure which shows the LED chip and mounting board | substrate with which a light emission part is equipped, (a) is a front view of a LED chip, (b) is a front view of a mounting board, (c) is a mounting board. The front view which shows the mounted state, (d) is the sectional side view. (A) is the front view of a light emission part, (b) is the top view, (c) is the side view. The perspective view which shows a mode that a light emission part is assembled. The schematic diagram which shows schematic structure of the light source device which concerns on 2nd Embodiment of this invention. It is a figure which shows a light emission part, (a) is the top view, (b) is the front view. (A) is a side view of a light emission part, (b) is the sectional drawing. 1 is a schematic diagram showing a schematic configuration of a projector provided with a light source device according to the present invention. (A) is a front view of the mounting substrate which concerns on the modification of this invention, (b) is the AA sectional drawing. The side view of the light emission part which concerns on the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,110R, 110G, 110B ... Light source device, 20 ... Sealed container, 21 ... Flow path, 21a ... Bending part, 22 ... Reflecting plate as light reflecting part, 30 ... LED chip as solid light source element, 31 ... Electrode, 32 ... Bump, 40 ... Mounting substrate, 41 ... Opening portion, 42, 43 ... Connection terminal, 44 ... Convex portion, 50 ... Light emitting portion, 51 ... Box, 52 ... Transparent window as a light transmitting portion, 54 ... Concavity, DESCRIPTION OF SYMBOLS 55 ... Lens, 56 ... Flange, 60 ... Cooling part, 61 ... Fin, 70 ... Circulation pump as liquid circulation part, 100 ... Projector, 140R, 140G, 140B ... Liquid crystal light valve as light modulation part, 160 ... Projection part As a projection lens.

Claims (9)

A mounting board with connection terminals;
An LED chip mounted on the mounting substrate via bumps;
A sealed container containing the LED chip and liquid;
The sealed container includes a light transmission portion that transmits light emitted from the LED chip, and a substrate support portion that supports the mounting substrate.
2. The light source device according to claim 1, wherein the two LED chips are stacked so as to close openings provided in the mounting substrate from both sides of the mounting substrate via the bumps.   The light source device according to claim 1, wherein the mounting substrate is provided such that the connection terminal is exposed to the outside of the sealed container.   3. The light source device according to claim 1, wherein the sealed container has a cooling unit for cooling the liquid. 4. The light source device according to claim 1, wherein the sealed container includes a light reflecting portion that reflects light emitted from the LED chip . 5.   The light source device according to claim 4, wherein the light reflecting portion is formed on an inner wall surface of the sealed container. The light source device according to claim 1, wherein the sealed container includes a lens for suppressing divergence of light emitted from the LED chip . The light source device according to claim 1, wherein the sealed container has a liquid circulation part for circulating the liquid, and the LED chip circulates the liquid through the liquid circulation part. A light source device provided in a flow path. The light source device according to claim 7, wherein the flow path has a narrow cross section around the LED chip .   The light source device according to claim 1, a light modulation unit that modulates light emitted from the light source device, and the modulated light modulated by the light modulation unit are projected to a distant position. A projector having a projection unit.

Images