JP4571329B2 - Electronics - Google Patents

Electronics Download PDF

Info

Publication number
JP4571329B2
JP4571329B2 JP2001107513A JP2001107513A JP4571329B2 JP 4571329 B2 JP4571329 B2 JP 4571329B2 JP 2001107513 A JP2001107513 A JP 2001107513A JP 2001107513 A JP2001107513 A JP 2001107513A JP 4571329 B2 JP4571329 B2 JP 4571329B2
Authority
JP
Japan
Prior art keywords
case
circuit board
shield plate
nameplate
nameplate display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001107513A
Other languages
Japanese (ja)
Other versions
JP2002305386A (en
Inventor
武司 水野
Original Assignee
サンクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サンクス株式会社 filed Critical サンクス株式会社
Priority to JP2001107513A priority Critical patent/JP4571329B2/en
Publication of JP2002305386A publication Critical patent/JP2002305386A/en
Application granted granted Critical
Publication of JP4571329B2 publication Critical patent/JP4571329B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、ケース内に電子回路を収容した電子機器に関する。
【0002】
【従来の技術】
電子機器においては、その型番などの情報を表示するために銘板が使用され、これは一般にケースの外表面に貼り付けて固定される。ところが、このようにケースの外表面に銘板を貼り付ける構成では、薬品に浸される雰囲気や腐食性雰囲気中で使用される場合には、銘板自体やその上の印刷部が腐食されないような特殊な材料としたり、特殊な構造としなくてはならず、高価になる。しかも、ケースの外表面に凹凸があったり、ケースの材質がポリプロピレン樹脂やフッ素樹脂等の接着性に欠けるものである場合には、ケースの外表面に銘板を貼り付けること自体が困難になる。
そこで、例えば実開平2−13278号公報に示すように、ケースを透明又は半透明の樹脂製とし、そのケース内に銘板を挿入する構成が提案されている。このようにすれば、銘板が外部に露出しないから腐食のおそれはなく、また、ケースへの接着性も考慮する必要がない。
【0003】
【発明が解決しようとする課題】
しかしながら、上記公報に記載の考案では、本来の回路部品とは別に銘板も併せてケース内に収容しなくてはならないから、銘板の分だけケースを大きくしなくてはならず、また、本来的に部品点数が多いという問題があった。
【0004】
本発明は上記のような事情に基づいて完成されたものであって、ケース表面に銘板を貼り付けたものと同等の機能を有しながら、ケースの大型化を招くことなく、しかも、加えて部品点数を削減できる電子機器を提供することを目的とする。
【0005】
【課題を解決するための手段】
上記の目的を達成するための手段として、請求項1の発明は、ケース内に回路基板とこの回路基板に沿わせたシールド板とを併せて収容してなるものにおいて、前記ケースを半透明部材にて形成すると共に、前記シールド板に前記ケースを通して視認可能な銘板表示部が印刷されてなり、前記シールド板は弾性を有した導電シートを前記回路基板を取り囲むように折り曲げて構成されており、その一端部が前記回路基板のグランドラインに半田付けされて固定され、それ以外が前記回路基板から自由となって弾発力により前記ケースの内面に接する状態となっていることを特徴とする電子機器。
【0007】
【発明の作用及び効果】
<請求項1の発明>
請求項1の発明の構成によれば、ケースが半透明であるから、これを透かして内部の銘板表示部を視認することができ、銘板がケースの外表面に貼り付けてあるものと同様に型番等を容易に確認できる。しかも、銘板表示部はケース内に位置するから、腐食等に配慮する必要はない。さらには、銘板表示部は、ケース内の回路基板を覆うために本来的に設けられているシールド板に印刷して設ける構成であるから、シールド板とは別部品である銘板をケース内に収容する構成とは異なり、ケースを大型化する必要がなく、また、部品数が増大することはない。そして、シールド板の一端部は回路基板に半田付けされ、他は自由とされて回路基板を包囲するように折り曲げられている。このため、シールド板はその弾発力によって膨らむような力を作用させており、ケースの内面に接した状態となる。この結果、銘板表示部とケースの内面との距離が最小になるため、自ずと銘板表示部の視認性が大きく高まる。
【0008】
【発明の実施の形態】
以下、本発明を漏液センサに適用した一実施形態について図面を参照して説明する。
10は漏液センサのケースであり、箱形の一面を開放したケース本体11とその開放面を覆う蓋部12とからなる。このケース本体11及び蓋部12は共に例えばフッ素樹脂製であり、僅かに白濁した透明な材質であって、外から内部を透かして見ることができる。なお、ケース本体11の側面部には漏液センサを図示しない取付ポストに取り付けるための一対の係合腕13と、内部の電子回路から導出された電線14を液密に貫通させるための電線導出筒15が突設されている。
【0009】
このケース10の内部には、図3に示すように回路基板20が収容され、その回路基板20を包囲するようにシールド板30が位置している。回路基板20は矩形をなしており、その表裏両面には図3に示すように多数の電子部品21が実装されると共に、所定のランドに前記電線14の芯線が半田付けされている。
【0010】
一方、シールド板30は、例えばポリエステルフィルムに銅箔を貼り付けて構成されていて弾性変形可能であり、所要の形状に打ち抜き形成され、一端部に導通片部31が延出している。このシールド板30は、上記導通片部31が前記回路基板20のグランドラインに連なるランドに半田付けによって接続され、残りの部分は回路基板20からは自由になっており、その回路基板20の全周を取り囲むように折り曲げられて角筒状となっている。このシールド板30には、図2に示すように銅箔表面のうち前記導通片部31を先端を残して黒色インクをほぼ全面に印刷してあり、所定位置に銀色文字で製造メーカー名、型番、ロット番号が印刷された銘板表示部32が形成されている。なお、この銘板表示部32の隣には、銅箔を小さな円形に打ち抜くと共に、その部分に黒色インクが塗布されないようにした2つの窓部33が形成され、これらは回路基板20に実装した2つのLED22に対応している。
【0011】
次に、上記シールド板30の装着手順についてより詳細に説明する。
シールド板30は上述したようにポリエステルフィルムに銅箔を貼り付けて形成されているが、ポリエステルフィルムのうち銅箔とは反対側の面に粘着剤が部分的に塗布されている。このシールド板30は、粘着剤側の面に剥離性台紙が貼り付けられた状態で、黒色インク及び銘板表示部32の印刷工程ならびに打ち抜き工程に供給される。漏液センサの組み立て工程では、図6に示すように、ケース10内に収容されるべき回路基板20に電線導出筒15を通して引き込んだ電線14を接続し、その回路基板20をケース10の外側に位置させた状態で回路基板20にシールド板30が巻き付けられる。
【0012】
それには、まずシールド板30の導通片部31がグランドラインのランドに半田付けされ、その状態でシールド板30の一部を裏面の粘着剤によって電子部品21の平坦面に貼り付ける(図5参照)。このようにシールド板30を回路基板20に貼り付けて仮保持できるため、この後の折り曲げ作業を容易に行うことができるようになる。そこで、このシールド板30を、前記打ち抜き工程において予め形成された複数本のミシン目30Aに沿って順次折り曲げ、最終的に回路基板20の全体を角筒状に取り巻くようにする(図6参照)。このとき、シールド板30は上記した導通片部31のみの一カ所によって回路基板20に固定され、他の部分は自由になっているから、シールド板30自体の弾発力によって元の平坦なシート形状に戻ろうとするが、これを押さえ込んだままケース10のケース本体11内に押し込む。そして、蓋部12を装着して例えば超音波溶着によって固定すれば、組み立て作業が完了する。
【0013】
組立完了状態で、シールド板30は上述したように角筒状の状態から弾発力によって膨らむ方向に変形しようとしており、かつ、回路基板20に対して自由にされているから、ケース10内に収容された状態では一部がケース10の内面に接触した状態となる。この結果、シールド板30の銘板表示部32部分もケース10の内面に自ずと最も近い状態となり、ケース10の透明度が低い場合でもケース10の外部から確実に銘板表示部32を視認することができる。
【0014】
このように本実施形態によれば、ケース10が透明であるから、これを透かして内部のシールド板30に形成した銘板表示部32を確実に視認することができる。もちろん、銘板表示部32はケース10内に位置するから、腐食等に配慮する必要はなく、薬品等が付着する可能性がある箇所にも自由に設置することができる。さらには、銘板表示部32は、ケース10内の回路基板20を覆うために本来的に設けられているシールド板30に印刷して設ける構成であるから、シールド板30とは別部品である銘板をケース内に収容する構成とは異なり、ケース10を大型化する必要がなく、また、部品数が増大することはない。
【0015】
しかも、特に本実施形態の構成によれば、シールド板30の一端部に設けた導通片部31は回路基板20に半田付けされ、他は自由とされて回路基板20を包囲するように折り曲げられている。このため、シールド板30はその弾発力によって膨らむような力を作用させており、少なくとも一部がケース10の内面に接した状態となり、この結果、銘板表示部32とケース10の内面との距離が最小になるため、自ずと銘板表示部32の視認性が大きく高まる
【0016】
<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも要旨を逸脱しない範囲内で種々変更して実施することができる。
【0017】
(1)上記実施形態では、漏液センサに適用した例を示したが、勿論これに限られず、ケース内に回路基板とシールド板とを収容するタイプの電子機器一般に広く適用することができる。
【0018】
(2)上記実施形態では、ケース10をフッ素樹脂製としたが、これに限られず、例えばポリプロピレン樹脂等であってもよく、要するところ半透明の樹脂であれば、いかなる樹脂も使用することができる。
【図面の簡単な説明】
【図1】本発明の一実施形態を示す外部からの斜視図
【図2】蓋部を取り外した状態の平面図
【図3】図1のIII−III線に沿う断面図
【図4】図1のIV−IV線に沿う断面図
【図5】組み立て工程の途中を示す斜視図
【図6】組み立て工程の途中を示す斜視図
【符号の説明】
10…ケース
11…ケース本体
12…蓋部
14…電線
20…回路基板
21…電子部品
30…シールド板
31…導通片部
32…銘板表示部
33…窓部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device in which an electronic circuit is accommodated in a case.
[0002]
[Prior art]
In an electronic device, a nameplate is used to display information such as the model number, and this is generally fixed by being attached to the outer surface of the case. However, with the structure in which the nameplate is attached to the outer surface of the case in this way, when used in an atmosphere immersed in chemicals or in a corrosive atmosphere, the nameplate itself and the printed part on it are not specially corroded. It must be made of a new material or have a special structure, which is expensive. In addition, when the outer surface of the case is uneven or the case material is not adhesive such as polypropylene resin or fluorine resin, it is difficult to attach the nameplate to the outer surface of the case.
Therefore, for example, as shown in Japanese Utility Model Laid-Open No. 2-13278, a configuration has been proposed in which a case is made of a transparent or translucent resin and a nameplate is inserted into the case. In this way, there is no risk of corrosion because the nameplate is not exposed to the outside, and there is no need to consider the adhesion to the case.
[0003]
[Problems to be solved by the invention]
However, in the device described in the above publication, since the nameplate must be accommodated in the case separately from the original circuit parts, the case must be enlarged by the nameplate. However, there was a problem that the number of parts was large.
[0004]
The present invention has been completed on the basis of the above circumstances, and has the same function as that obtained by pasting the nameplate on the case surface, without causing an increase in the size of the case. An object is to provide an electronic device capable of reducing the number of parts.
[0005]
[Means for Solving the Problems]
As a means for achieving the above object, the invention of claim 1 is characterized in that a case in which a circuit board and a shield plate along the circuit board are accommodated in a case, the case is a translucent member. The nameplate display portion visible through the case is printed on the shield plate, and the shield plate is formed by bending a conductive sheet having elasticity to surround the circuit board, One end thereof is soldered and fixed to the ground line of the circuit board, and the other end is free from the circuit board and is in contact with the inner surface of the case by an elastic force. machine.
[0007]
[Action and effect of the invention]
<Invention of Claim 1>
According to the configuration of the invention of claim 1, since the case is translucent , the internal nameplate display portion can be visually recognized through this case, as in the case where the nameplate is attached to the outer surface of the case. The model number can be easily confirmed. Moreover, since the nameplate display is located in the case, it is not necessary to consider corrosion. Furthermore, the nameplate display unit is configured to be printed on a shield plate that is originally provided to cover the circuit board in the case, so a nameplate that is a separate component from the shield plate is accommodated in the case. Unlike the configuration, the case does not need to be increased in size and the number of parts does not increase. One end portion of the shield plate is soldered to the circuit board, the other is bent to surround the freedom and to a circuit board. For this reason, the shield plate exerts a force that swells due to its elastic force and is in contact with the inner surface of the case. As a result, since the distance between the nameplate display portion and the inner surface of the case is minimized, the visibility of the nameplate display portion is naturally greatly increased.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment in which the present invention is applied to a liquid leakage sensor will be described with reference to the drawings.
Reference numeral 10 denotes a case of a liquid leakage sensor, which includes a case body 11 having one box-shaped surface opened and a lid 12 covering the open surface. Both the case main body 11 and the lid portion 12 are made of, for example, a fluororesin, and are made of a transparent material that is slightly clouded, so that the inside can be seen through from the outside. A pair of engagement arms 13 for attaching a leak sensor to a mounting post (not shown) and a wire lead-out for liquid-tightly penetrating the wire 14 led out from the internal electronic circuit are provided on the side surface of the case body 11. A tube 15 is projected.
[0009]
As shown in FIG. 3, a circuit board 20 is accommodated in the case 10, and a shield plate 30 is positioned so as to surround the circuit board 20. The circuit board 20 has a rectangular shape. A large number of electronic components 21 are mounted on both the front and back surfaces of the circuit board 20 as shown in FIG. 3, and the core wire of the wire 14 is soldered to a predetermined land.
[0010]
On the other hand, the shield plate 30 is formed by attaching a copper foil to a polyester film, for example, and can be elastically deformed. The shield plate 30 is formed by punching into a required shape, and a conductive piece 31 extends at one end. The shield plate 30 has the conductive piece 31 connected to a land connected to the ground line of the circuit board 20 by soldering, and the remaining part is free from the circuit board 20. It is bent so as to surround the periphery, and has a rectangular tube shape. As shown in FIG. 2, the shield plate 30 has black ink printed on the entire surface of the copper foil surface, with the conductive piece 31 remaining at the tip, in silver letters at a predetermined position. A nameplate display 32 on which the lot number is printed is formed. Next to the nameplate display portion 32, two window portions 33 are formed so that the copper foil is punched into a small circle and black ink is not applied to the portion, and these are mounted on the circuit board 20. It corresponds to two LEDs 22.
[0011]
Next, the mounting procedure of the shield plate 30 will be described in more detail.
As described above, the shield plate 30 is formed by attaching a copper foil to a polyester film, and a pressure-sensitive adhesive is partially applied to the surface of the polyester film opposite to the copper foil. The shield plate 30 is supplied to the printing process and the punching process of the black ink and the nameplate display unit 32 in a state where the peelable mount is attached to the surface on the adhesive side. In the assembly process of the leak sensor, as shown in FIG. 6, the electric wire 14 drawn through the electric wire outlet tube 15 is connected to the circuit board 20 to be accommodated in the case 10, and the circuit board 20 is placed outside the case 10. The shield plate 30 is wound around the circuit board 20 in the positioned state.
[0012]
For this purpose, first, the conductive piece 31 of the shield plate 30 is soldered to the land of the ground line, and in this state, a part of the shield plate 30 is attached to the flat surface of the electronic component 21 with the adhesive on the back surface (see FIG. 5). ). Since the shield plate 30 can be temporarily attached to the circuit board 20 in this way, the subsequent folding operation can be easily performed. Therefore, the shield plate 30 is sequentially bent along a plurality of perforations 30A formed in advance in the punching step, so that the entire circuit board 20 is finally wrapped in a rectangular tube shape (see FIG. 6). . At this time, since the shield plate 30 is fixed to the circuit board 20 only by the above-described conductive piece portion 31 and the other portions are free, the original flat sheet is obtained by the elastic force of the shield plate 30 itself. Although it tries to return to the shape, it is pushed into the case main body 11 of the case 10 while being held down. And if the cover part 12 is mounted | worn and it fixes by ultrasonic welding, an assembly operation will be completed.
[0013]
In the assembled state, the shield plate 30 is about to be deformed in a direction in which it is expanded from the square tube-like state by the elastic force as described above, and is free from the circuit board 20. In the accommodated state, a part is in contact with the inner surface of the case 10. As a result, the nameplate display portion 32 portion of the shield plate 30 is naturally closest to the inner surface of the case 10, and the nameplate display portion 32 can be reliably viewed from the outside of the case 10 even when the transparency of the case 10 is low.
[0014]
Thus, according to this embodiment, since the case 10 is transparent, the nameplate display part 32 formed on the internal shield plate 30 through this can be reliably recognized. Of course, since the nameplate display part 32 is located in the case 10, it is not necessary to consider corrosion etc., and it can be freely installed in a place where chemicals or the like may adhere. Furthermore, since the nameplate display 32 is configured to be printed on the shield plate 30 that is originally provided to cover the circuit board 20 in the case 10, the nameplate is a separate component from the shield plate 30. Unlike the configuration in which the case is housed in the case, the case 10 does not need to be enlarged and the number of parts does not increase.
[0015]
Moreover, in particular, according to the configuration of the present embodiment, the conductive piece portion 31 provided at one end portion of the shield plate 30 is soldered to the circuit board 20 and the others are freed and bent so as to surround the circuit board 20. ing. For this reason, the shield plate 30 exerts a force that swells due to its elastic force, and at least part of the shield plate 30 is in contact with the inner surface of the case 10. As a result, the nameplate display 32 and the inner surface of the case 10 Since the distance is minimized, the visibility of the nameplate display 32 is naturally greatly increased.
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
[0017]
(1) Although the example applied to the liquid leakage sensor has been described in the above embodiment, the present invention is of course not limited to this, and can be widely applied to general electronic devices in which a circuit board and a shield plate are accommodated in a case.
[0018]
(2) In the above embodiment, the case 10 is made of a fluororesin. However, the case 10 is not limited to this. For example, a polypropylene resin or the like may be used. In short, any resin can be used as long as it is a translucent resin. it can.
[Brief description of the drawings]
FIG. 1 is a perspective view from the outside showing an embodiment of the present invention. FIG. 2 is a plan view with a lid part removed. FIG. 3 is a cross-sectional view taken along line III-III in FIG. Sectional view along line IV-IV in Fig. 1 [Fig. 5] Perspective view showing the middle of the assembly process [Fig. 6] Perspective view showing the middle of the assembly process [Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Case 11 ... Case main body 12 ... Cover part 14 ... Electric wire 20 ... Circuit board 21 ... Electronic component 30 ... Shield plate 31 ... Conduction piece part 32 ... Nameplate display part 33 ... Window part

Claims (1)

ケース内に回路基板とこの回路基板に沿わせたシールド板とを併せて収容してなるものにおいて、
前記ケースを半透明部材にて形成すると共に、前記シールド板に前記ケースを通して視認可能な銘板表示部が印刷されてなり、
前記シールド板は弾性を有した導電シートを前記回路基板を取り囲むように折り曲げて構成されており、
その一端部が前記回路基板のグランドラインに半田付けされて固定され、それ以外が前記回路基板から自由となって弾発力により前記ケースの内面に接する状態となっていることを特徴とする電子機器。
In the case where the circuit board and the shield plate along the circuit board are housed together in the case,
The case is formed of a translucent member, and a nameplate display portion visible through the case is printed on the shield plate ,
The shield plate is formed by bending a conductive sheet having elasticity so as to surround the circuit board,
One end thereof is soldered and fixed to the ground line of the circuit board, and the other end is free from the circuit board and is in contact with the inner surface of the case by an elastic force. machine.
JP2001107513A 2001-04-05 2001-04-05 Electronics Expired - Fee Related JP4571329B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001107513A JP4571329B2 (en) 2001-04-05 2001-04-05 Electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001107513A JP4571329B2 (en) 2001-04-05 2001-04-05 Electronics

Publications (2)

Publication Number Publication Date
JP2002305386A JP2002305386A (en) 2002-10-18
JP4571329B2 true JP4571329B2 (en) 2010-10-27

Family

ID=18959824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001107513A Expired - Fee Related JP4571329B2 (en) 2001-04-05 2001-04-05 Electronics

Country Status (1)

Country Link
JP (1) JP4571329B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070012481A1 (en) * 2005-07-18 2007-01-18 Helmut Prager Circuit board/envelope compound structure
JP6733090B2 (en) * 2015-11-19 2020-07-29 北川工業株式会社 Conductive member

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0213278U (en) * 1988-07-11 1990-01-26
JPH0470794U (en) * 1990-10-30 1992-06-23
JPH04174924A (en) * 1990-06-15 1992-06-23 Fuji Electric Co Ltd Holding structure of photoelectric switch and case cover for photoelectric switch body

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0213278U (en) * 1988-07-11 1990-01-26
JPH04174924A (en) * 1990-06-15 1992-06-23 Fuji Electric Co Ltd Holding structure of photoelectric switch and case cover for photoelectric switch body
JPH0470794U (en) * 1990-10-30 1992-06-23

Also Published As

Publication number Publication date
JP2002305386A (en) 2002-10-18

Similar Documents

Publication Publication Date Title
JP3594500B2 (en) LCD display mounting connection device
CN101008753A (en) Display device
JP4571329B2 (en) Electronics
JP2001044506A (en) Fixation structure for light emitting diode
CN103188869B (en) Flexible print circuit board
JP5621647B2 (en) Liquid crystal display
JP2008032888A (en) Display device
JP3979615B2 (en) Liquid crystal display
JP3631926B2 (en) Electrical component sealing structure
JP2006030652A (en) Liquid crystal display
CN111954365A (en) FPC for backlight circuit board of vehicle-mounted LCM (liquid crystal module)
JP3724020B2 (en) Frame ground connection structure
JP2001044507A (en) Fixation structure for light emitting diode
CN210274668U (en) FPC for backlight circuit board of vehicle-mounted LCM (liquid crystal module)
CN215022219U (en) Heating element and electron moxibustion device
JPH0419571Y2 (en)
JP4930827B2 (en) Display device
JPH1130775A (en) Structure of liquid crystal display device with back light
JP2007127742A (en) Liquid crystal display device
JP3790139B2 (en) Display device
KR200146015Y1 (en) Sheet shaped light emitting display device
JP2010010395A (en) Connection structure of printed circuit board
JP2000091712A (en) Flexible wiring board
JPS58108516A (en) Liquid crystal display element
US20120055699A1 (en) Anti-deflection structure for flexible circuit board

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20070709

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20070710

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080124

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090924

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090924

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100514

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100520

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100720

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100805

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100812

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130820

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130820

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130820

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees