JP4529275B2 - Electrostatic actuator manufacturing method, electrostatic actuator, and electrostatically driven inkjet head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrostatic actuator that operates by an electrostatic force generated by applying a driving voltage between opposed electrodes, and an electrostatically driven ink jet head that uses the electrostatic actuator as an ink droplet ejection mechanism. .
[0002]
More particularly, the present invention relates to an electrostatic actuator and an ink jet head that are advantageous in reducing the number of wires between an electrostatic actuator and its driving device and the number of wires between an ink jet head and its head driving device. The present invention also relates to an electrostatic actuator and an inkjet head that can be driven with low impedance regardless of the shape of the drive voltage waveform.
[0003]
[Prior art]
An electrostatic drive type inkjet head having an electrostatic actuator as a drive mechanism for discharging ink droplets includes a diaphragm as a common electrode formed on the bottom surface of an ink pressure chamber communicating with an ink nozzle, It has an electrode plate as an individual electrode facing each other with a slight gap. The volume of the ink pressure chamber is changed by applying a driving voltage between these counter electrodes and applying an electrostatic force to bend the diaphragm, and the ink pressure fluctuation caused thereby is communicated with the ink pressure chamber. Recording is performed by discharging ink droplets from the ink nozzles.
[0004]
In an electrostatic drive type ink jet head, in order to improve the quality of an output image, it is necessary to arrange a large number of ink nozzles at a high density. When the density of ink nozzles is increased, the number of electrode terminals for supplying drive voltage to individual electrodes increases, and the number of wires between the inkjet head and the head drive device that supplies the drive voltage to this increases. As a result, the wiring occupation area, the connection area, and the connection density increase, the dimensions of the inkjet head increase, the wiring connection becomes difficult, and the reliability of the wiring connection decreases.
[0005]
Here, JP-A-11-170512 discloses an inkjet head using piezoelectric elements as a driving mechanism, and circuit elements having a structure in which a diode is connected in series to each piezoelectric element are connected in a matrix. A configuration in which a switching transistor for driving each piezoelectric element is mounted on the inkjet head side has been proposed.
[0006]
[Problems to be solved by the invention]
However, the configuration described in the above publication is for driving a piezoelectric element and is not suitable for an electrostatic actuator or an electrostatically driven ink jet head. For example, the piezoelectric element may be simply driven on and off using a diode matrix, but the electrostatic actuator accurately controls the rise and fall of the drive voltage waveform, in other words, the charge / discharge control between the electrodes. There is a need.
[0007]
In view of the above, an object of the present invention is to propose an electrostatic actuator and an electrostatically driven ink jet head that can reduce the number of wirings with a drive circuit that supplies a drive voltage.
[0008]
Another object of the present invention is to propose an electrostatic actuator and an electrostatically driven ink jet head provided with a switching element capable of accurately controlling charging / discharging of a driving voltage applied between opposing electrodes.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a first substrate on which a common electrode is formed, and a second substrate on which an individual electrode facing the common electrode with a certain gap is formed. An electrostatic actuator having a switching element for controlling supply of a driving voltage to the individual electrode is characterized in that the switching element is formed on the second substrate.
[0010]
By arranging the switching element on the substrate side, it is possible to reduce the number of wiring connections between the electrostatic actuator and a driving device that generates a driving voltage to be applied between the common electrode and the individual electrodes. Therefore, it is advantageous when a large number of individual electrodes are arranged at high density.
[0011]
Here, it is preferable that the switching element is a bidirectional analog switch including an inverter and a transmission gate formed of a MOS • FET. When such an element is used, low-impedance driving is possible regardless of the shape of the driving voltage waveform applied between the counter electrodes. Therefore, charge / discharge between the counter electrodes can be precisely controlled.
[0012]
Further, when a plurality of the individual electrodes and the number of the switching elements corresponding to the individual electrodes are formed on the second substrate, it is desirable that a matrix circuit is configured by these switching elements. . In this way, the row and column selection lines may be drawn from the matrix circuit and connected to the side of the driving device that generates the driving voltage applied between the counter electrodes. Therefore, compared to the number of individual electrodes, the number of connection wires between the electrostatic actuator and its driving device can be greatly reduced.
[0013]
Next, the present invention relates to an electrostatic drive type ink jet head that uses the electrostatic actuator having the above configuration as a drive mechanism for discharging ink. That is, in the present invention, the first substrate on which the diaphragm is formed as a common electrode that gives pressure fluctuation to the ink pressure chamber communicating with the ink nozzle is opposed to the common electrode with a certain gap. An electrostatic drive type having a second substrate on which a plurality of individual electrodes are formed, and a switching element group for controlling the supply of a drive voltage to the individual electrodes corresponding to the ink nozzles to which ink droplets are to be ejected. In the inkjet head, each switching element of the switching element group is a bidirectional analog switch including an inverter and a transmission gate made of MOS / FET, and a matrix circuit is configured by these analog switches. Yes.
[0014]
According to this configuration, it is possible to reduce the number of wirings between the inkjet head and a head drive circuit for supplying a drive voltage between the common electrode and each individual electrode in the inkjet head. In addition, since a bidirectional analog switch comprising a transmission gate is used, switching can be performed with low impedance regardless of the shape of the drive voltage waveform. Therefore, it is possible to appropriately perform charge / discharge control of the drive voltage applied between the electrodes.
[0015]
When a matrix circuit is configured by the switching element group, one of the row selection line group and the column selection line group is a data line, and the other is a drive voltage line.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an electrostatic drive type inkjet head to which the present invention is applied will be described with reference to the drawings.
[0017]
(Electrostatically driven inkjet head)
First, with reference to FIG. 1 and FIG. 2, the structure of the electrostatic drive type inkjet head of this example is demonstrated. FIG. 1 is a cross-sectional view of the electrostatically driven ink jet head of this example, and FIG. 2 is an exploded perspective view thereof.
[0018]
As shown in these drawings, the electrostatic drive type ink jet head 1 has an electrode glass made of borosilicate glass having a silicon substrate 2 sandwiched therebetween, a silicon nozzle substrate 3 on the upper side, and a thermal expansion coefficient close to that of silicon on the lower side. It has a three-layer structure in which the substrates 4 are laminated.
[0019]
The surface of the central silicon substrate 2 is anisotropically etched to provide a plurality of independent elongated ink pressure chambers 5, one common ink chamber 6, and the common ink chamber 6. Grooves that function as the ink supply ports 7 communicating with each other are processed. These grooves are closed by the nozzle substrate 3, and the portions 5, 6, and 7 are partitioned. Each ink pressure chamber 5 is partitioned by an isolation wall.
[0020]
Further, an ink intake port 12 is formed at a portion defining the upper surface of the common ink chamber 6 so as to communicate with the ink supply port 7. Accordingly, the ink is supplied from an external ink tank (not shown) to the common ink chamber 6 through the ink intake port 12, and from here to each independent ink pressure chamber 5 through each ink supply port 7. Supplied.
[0021]
In the nozzle substrate 3, ink nozzles 11 are formed at positions corresponding to the tip side portions of the respective ink pressure chambers 5, that is, at positions opposite to the ink supply ports 7. It communicates with each pressure chamber 5. The bottom surface of each independent ink pressure chamber 5 is thin so as to function as a diaphragm 51 that can be elastically displaced in the out-of-plane direction, that is, in the vertical direction in FIG.
[0022]
Next, in the glass substrate 4 positioned on the lower side of the silicon substrate 2, each vibration plate 51 that defines the bottom surface of each pressure chamber 5 of the silicon substrate 2 is formed on the upper surface to be bonded to the silicon substrate 2. Recesses 9 that are etched shallowly are formed at positions facing each other. Individual electrodes 10 corresponding to the diaphragms 51 are formed on the bottom surface of each recess 9. Each individual electrode 10 has a segment electrode 10a made of ITO and a terminal portion 10b drawn out from the segment electrode 10a.
[0023]
By bonding the glass substrate 4 to the silicon substrate 2, the diaphragm 51 defining the bottom surface of each ink pressure chamber 5 and the segment electrode 10a in the corresponding individual electrode face each other with a very narrow gap therebetween. ing. This gap is sealed with a sealant 60 disposed between the silicon substrate 2 and the glass substrate 4 and is in a sealed state.
[0024]
A common electrode terminal 22 is formed on the silicon substrate 2 by adhering a noble metal thin film such as platinum to the surface on the nozzle substrate 3 side. Between this and each individual electrode 10, a drive device described later is provided. A driving voltage pulse supplied from the side is applied. Since the silicon substrate 2 is conductive, each diaphragm 51 functions as a common electrode.
[0025]
When each diaphragm 51 is attracted to the individual electrode side by electrostatic force generated by applying a drive voltage between the diaphragm 51 and the individual electrode 10, the diaphragm 51 is elastically displaced and bent toward the segment electrode 10a side. Adsorbed on the surface of the segment electrode 10a. As a result, the volume of the ink pressure chamber 5 is expanded, and ink is supplied from the ink supply port 7 to the ink pressure chamber 5.
[0026]
When the electrostatic attraction force is released, the vibration plate 51 is separated from the surface of the segment electrode 10a by the elastic force and returns to the initial state, and the volume of the ink pressure chamber 5 is rapidly reduced. At this time, a part of the ink in the ink pressure chamber is ejected as an ink droplet from the ink nozzle 11 communicating with the ink pressure chamber 5 by the ink pressure vibration generated in the ink pressure chamber.
[0027]
Here, in the inkjet head 1 of this example, the rear end portion of the glass substrate 4 extends rearward from the silicon substrate 2, and the application of drive voltage pulses to the individual electrodes 10 is controlled on the surface of this portion. An active matrix circuit section 14 is formed by connecting and arranging switching element groups in a matrix. As will be described later, each switching element of the present example is formed of a bidirectional analog switch including an inverter and a transmission gate configured by MOS • FETs. The active matrix circuit portion 14 is laminated on a protective film 16 that covers the equipotential wiring pattern 15 disposed on the surface of the glass substrate 4. The active matrix circuit portion 14 is connected to the terminal portions 10b of the individual electrodes 10 and to the input terminal portion 17 for external connection. The input terminal portion 17 and the common electrode terminal portion 22 are connected to a head driving device (see FIG. 3) described later via the flexible wiring board 18.
[0028]
The ink jet head 1 of this example is a face eject type in which ink droplets are ejected from the nozzle holes provided on the upper surface of the substrate 3, but an edge for ejecting ink droplets from the nozzle holes provided at the end of the substrate. Of course, the present invention can also be applied to the eject type.
[0029]
(Head drive device)
Next, FIG. 3 is a schematic block diagram showing an example of a head drive device for driving an electrostatic drive type ink jet head. The head driving device 100 of this example has an ink jet head control unit 102, and the ink jet head control unit 102 is configured around a CPU, and print information is supplied to the CPU from an external device 103 via a bus. . The CPU is connected to the ROM, RAM, and character generator 104 via an internal bus, and executes a control program stored in the ROM using the storage area in the RAM as a work area. Based on the character information generated from the character generator 104, a control signal for driving the inkjet head is generated. The logic gate array 105 supplies a drive control signal corresponding to the print information to the active matrix circuit unit 14 which is a head driver based on a control signal from the CPU, and generates a drive voltage pulse to the drive voltage pulse generation circuit 106. The control signal is supplied.
[0030]
The drive voltage pulse generation circuit 106 is supplied with a control signal from the logic gate array 106, generates a drive voltage pulse, and supplies the drive voltage pulse Vp to the active matrix circuit unit 14 which is a head driver. In the drive voltage pulse generation circuit 106, a control signal as digital information is converted into an analog drive voltage pulse waveform by a D / A (digital-analog) converter. That is, the drive voltage pulse generation circuit 106 generates a drive pulse waveform from control signals related to pulse signal generation conditions such as the pulse length, voltage, and pulse rise time and fall time of the drive voltage pulse.
[0031]
In order to generate the drive voltage pulse waveform with high accuracy by configuring the drive voltage pulse generation circuit 106 with a D / A converter, only increase the number of bits of the D / A converter used to increase the resolution of the waveform. Therefore, it is possible to easily improve the accuracy of the drive voltage pulse waveform. The drive voltage pulse generation circuit 106 may be constituted by a CR circuit. If the drive voltage pulse generation circuit 106 is configured by a CR circuit, it is possible to make the circuit configuration cheaper than when configured by a D / A converter.
[0032]
The drive control signal and the drive voltage pulse are supplied to the active matrix circuit unit 14 formed on the electrode glass substrate 4 of the inkjet head 1 via the connector 107. The active matrix circuit 14 operates by being supplied with a high-voltage drive power supply Vh and a logic circuit drive voltage Vcc from the power supply circuit 110, and generates a drive voltage pulse and a ground potential GND in accordance with the supplied drive control signal. Switching is applied between the counter electrodes corresponding to each ink nozzle of the inkjet head 1. As a result, the diaphragm 51 in which a potential difference is generated between the counter electrodes due to the applied drive voltage pulse is attracted to the individual electrodes. Between the counter electrodes in which the potential difference is held, the diaphragm 51 is sucked by the individual electrode 10 and held in a state of being attracted thereto. When the potential difference is suddenly released, the vibration plate 51 vibrates and ink droplets are ejected from the corresponding ink nozzles 11.
[0033]
Next, FIG. 4 is a partial circuit block diagram showing a bidirectional analog switch constituting the active matrix circuit unit 14 which is a head driver. As shown in this figure, in this example, one switching element 140 for controlling the application of the drive voltage pulse to each individual electrode 10 is a C-MOS inverter composed of a P-MOS • FET and an N-MOS • FET. 141 and a bidirectional transmission gate 142 which is also made up of a P-MOS • FET and an N-MOS • FET. The switching elements 140 having such a configuration are connected in matrix, a plurality of data lines Dk are arranged as row selection lines, and a plurality of drive control signal lines Vn are arranged as column selection lines.
[0034]
(Example of drive voltage pulse waveform)
Here, FIGS. 5A and 5B are diagrams showing drive voltage waveforms input to the high breakdown voltage system drive voltage (Vn). FIG. 5A shows a basic waveform, and FIG. 5B shows another drive waveform. In these figures, the horizontal axis is time, and the vertical axis is voltage.
[0035]
In FIG. 5A, VH is a driving voltage, Pw is a driving pulse width, Pwc is a charging time, and Pwd is a discharging time. In the figure, charging and discharging are performed linearly, and values of VH, Pw, Pwc, and Pwd are set so that ink droplets are efficiently ejected at the timing of charging or discharging. For example, VH = 26V and Pw = 12 μsec.
[0036]
In FIG. 5B, VH1 is a drive voltage, VH2 is a holding voltage, Pw1 and Pw2 are drive pulse widths, Pwc is a charge time, and Pwd1 and Pwd2 are discharge times. In the figure, the drive pulse width Pw2 and the like for determining the holding time of the diaphragm 51 are set so that ink droplets can be stably ejected. By driving with the drive waveform shown in this figure, the amount and speed of ink droplets can be controlled more precisely than the basic waveform shown in FIG. In any case, it is necessary to precisely control the charging time, holding time, discharging time, and voltage to drive the vibration plate 51 to discharge ink droplets.
[0037]
Next, FIG. 6 is a timing chart showing an example of a method for driving the inkjet head 1. In the illustrated example, the parameters for matrix driving by the active matrix circuit unit 14 are set to n = k = 16. That is, by driving 256 switching elements of 16 rows and 16 columns in a matrix manner, the electrostatic actuators corresponding to the 256 ink nozzles 11, that is, the diaphragm 51 is controlled.
[0038]
In the timing chart of the figure, among the drive voltage lines Vn (n = 1 to 16) and the data lines Dk (k = 1 to 16) in the active matrix circuit unit 14 shown in FIG. This is a case where a driving voltage pulse is applied to the corresponding individual electrode 10 (a69) and individual electrode 10 (a85) by the data line D5 to drive the diaphragm 51 facing each other.
[0039]
A waveform output from the drive pulse generation circuit 106 is input to the drive voltage lines V5 and 6, and a data signal from the logic gate array 105 is input to the data line D5. When the data line D5 is at a high logic level, the potentials of the drive voltage lines V5 and 6 are output to the individual electrodes. Conversely, when the data line D5 is at a low logic level, the ground potential GND is output to the individual electrode.
[0040]
In this example, 256 wires for controlling the drive voltage are required for the 256 individual electrodes 10, but the number of input lines from the head drive device 100 side via the flexible wiring board 18 to this is Basically, a total of 32 lines of 16 data lines and 16 drive voltage lines are sufficient. Therefore, the number of connections between the flexible wiring board 18 and the input terminal portion 17 formed on the surface of the glass substrate 4 of the inkjet head can be reduced. Therefore, it is not necessary to perform narrow pitch wiring.
[0041]
In the timing chart shown in FIG. 6, the common electrode Com is controlled so as to be always at the ground potential. If the common electrode potential is also driven and matrix driving is performed, the potential reversal control of the inkjet head can be performed.
[0042]
(Production method)
Next, FIG. 7 is a schematic flowchart of the manufacturing process of the inkjet head 1 of this example, and FIG. 8 is a partial perspective view showing the glass substrate material in a state before cutting out the electrode glass substrate. With reference to these drawings, an example of the manufacturing procedure of the inkjet head 1 of this example will be described.
[0043]
First, FIG. 7A shows a manufacturing procedure of the ink jet head 1, and an electrode glass substrate material in which individual electrodes 10, transmission gates 142, etc. corresponding to a plurality of ink jet heads are partitioned and prepared is prepared (process). S1) Further, a silicon substrate material is prepared in which each groove for forming the ink flow path and the vibration plate 51 are similarly partitioned for each inkjet head by anisotropic etching of silicon (step S2).
[0044]
Next, these substrate materials are bonded by anodic bonding (step S3). The anodic bonding is performed so that the equipotential wiring patterns 15 provided on the respective surfaces of the silicon substrate material and the electrode glass substrate material have the same potential. Next, each inkjet head is cut out by dicing (step S4). For example, the dicing is performed using a 0.3 mm wide dicing blade, and at the same time as the dicing, the equipotential wiring pattern is cut and removed to make the individual electrodes of the inkjet head independent. Thereafter, the flexible printed circuit board 18 is connected to the input wiring 17 of each ink jet head by an anisotropic conductive adhesive (step S5).
[0045]
Before dicing the anodically bonded silicon substrate material and electrode glass substrate material, the surface of the silicon substrate material is superposed on the nozzle substrate material on which ink nozzle grooves and the like are formed, so that anodic bonding, adhesive bonding or The ink pressure chamber, the common ink chamber, and the like may be partitioned by bonding by a method such as fluorine bonding.
[0046]
Next, FIG. 7B shows a manufacturing procedure of the electrode glass substrate 4. Referring to FIGS. 7B and 8, first, an electrode for causing the individual electrode 10 to face the diaphragm 51 on the silicon substrate side with a predetermined gap on the surface of the electrode glass substrate material 4A. A glass groove (recess 9) is formed by isotropic etching (step 11). Next, an equipotential pattern (equipotential wiring 15 and equipotential wiring pad 15A) is sputtered with chromium (Cr) and etched with a second cerium nitrate aqueous solution (step S12).
[0047]
Next, SiO2 is deposited by TEOS-PECVD and patterned by HF (fluorine) to insulate and isolate equipotential patterns 15 and 15A from the MOS-FET group of switching element 140 formed in the next step. Therefore, the insulating film 16 is formed (step S13). The insulating film 16 functions as a passivation film for stabilizing the operation limit voltage Vth of the transistor group by eliminating the influence of alkali metal ions on the underlying electrode glass substrate when forming the transistor group.
[0048]
In the process of forming the transistor group (step S14), a low-temperature polysilicon TFT process can be applied. By applying the low-temperature polysilicon TFT process, it is possible to form a low-impedance transistor group that has higher current drive capability than the amorphous silicon TFT process, and is suitable for manufacturing a transistor group that switches driving of an electrostatic actuator. ing.
[0049]
Finally, the individual electrode 10 is sputtered by ITO, and is etched and patterned with a mixed solution of hydrochloric acid and nitric acid (aqua regia) (steps S15 and S16). At this time, the individual electrode 10 is a pattern electrically connected to the output of the above-described transistor group (140) and the equipotential pattern 15. In this step, the pattern of the input wiring to the transistor group (14) is simultaneously formed with the ITO pattern.
[0050]
By manufacturing the inkjet head 1 through such a process, the individual electrode 10 and the transmission gate 142 are formed on the same substrate material 4A, and the bending of the diaphragm 51 that occurs in the anodic bonding process is eliminated, so An electrostatic actuator having a uniform gap between the electrodes 10 can be manufactured. Furthermore, it is possible to prevent the active elements such as the transmission gate from being destroyed by static electricity generated in the manufacturing process, and to reduce the defects of the ink jet head 1.
[0051]
(Other embodiments)
In the above example, the present invention is applied to an electrostatic drive type ink jet head. However, the present invention can be similarly applied to electrostatic actuators other than the inkjet head, for example, electrostatic drive type sensors.
[0052]
【The invention's effect】
As described above, in the electrostatic actuator and the electrostatically driven ink jet head of the present invention, the switching element for controlling the driving voltage application to each individual electrode is arranged on the substrate (electrode glass substrate) on which the individual electrode is formed. The configuration is adopted. Accordingly, the number of wiring connections between the head driving device that generates a driving voltage applied between the common electrode and the individual electrodes and the inkjet head can be reduced, which is advantageous when a large number of individual electrodes are arranged at high density. .
[0053]
In the present invention, since a bidirectional analog switch including a transmission gate is used as the switching element, low impedance driving is possible regardless of the shape of the driving voltage waveform applied between the counter electrodes. Therefore, charge / discharge between the counter electrodes can be controlled with high accuracy.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an example of an electrostatically driven inkjet head to which the present invention is applied.
2 is an exploded perspective view of the electrostatically driven inkjet head shown in FIG. 1. FIG.
3 is a schematic block diagram showing a drive control system of the electrostatic drive type inkjet head shown in FIG. 1;
4 is a circuit block diagram showing a part of a matrix circuit unit composed of analog switch groups mounted on the electrostatic drive type ink jet head of FIG. 1. FIG.
5 is a waveform diagram showing an example of a drive voltage waveform for driving the electrostatic drive type ink jet head of FIG. 1. FIG.
6 is a timing chart showing the operation of the matrix circuit section of FIG.
FIG. 7 is a schematic flowchart showing a manufacturing process of an ink jet head according to the present invention.
FIG. 8 is a partial perspective view showing a substrate material before cutting out an electrode glass substrate.
[Explanation of symbols]
1 Electrostatically driven inkjet head
2 Silicon substrate
3 Nozzle substrate
4 Glass substrate
5 Ink pressure chamber
6 Common ink chamber
7 Ink supply port
9 recess
10 Individual electrodes
10a Segment electrode
10b Terminal section
11 Ink nozzle
12 Ink outlet
14 Matrix circuit
15 Equipotential wiring
16 Insulating film
17 Input terminal
18 Flexible wiring board
22 Common electrode terminal
51 Diaphragm
60 Sealant
100 head drive device
102 Inkjet control unit
103 External device
106 Drive pulse generation circuit
140 Bidirectional analog switch
141 C-MOS inverter
142 Transmission Gate

Claims (3)

Preparing an electrode glass substrate material on which individual electrodes and switching elements respectively corresponding to a plurality of electrostatic actuators are formed;
  Preparing a silicon substrate material in which a diaphragm is formed for each of the corresponding electrostatic actuators;
  Bonding the electrode glass substrate material and the silicon substrate material by anodic bonding;
The anodic bonding is performed so that equipotential wiring patterns provided on the respective surfaces of the silicon substrate material and the electrode glass substrate material have the same potential. After the anodic bonding, each electrostatic Cutting out the actuator;
  Simultaneously with the dicing, the equipotential wiring pattern is cut, the individual electrodes of the electrostatic actuator are made independent, and the flexible printed circuit board is connected to the input wiring of each electrostatic actuator by an anisotropic conductive adhesive. , And a method of manufacturing an electrostatic actuator. Wherein controlling a first substrate on which common electrodes are formed, a second substrate the individual electrodes are opposed is formed with a constant gap with respect to the common electrode, the supply of the drive voltage to the individual electrodes an electrostatic actuator having a switching element,
The switching element is a bidirectional analog switch formed on the second substrate and composed of an inverter and a transmission gate made of MOS / FET,
A plurality of the individual electrodes and a number of the switching elements corresponding to the individual electrodes are formed on the second substrate,
The switching element has a matrix connection of a plurality of data signal lines and a plurality of drive control signal lines,
An electrostatic actuator manufactured by the method for manufacturing an electrostatic actuator according to claim 1 . A first substrate on which a diaphragm is formed as a common electrode that applies pressure fluctuation to an ink pressure chamber communicating with the ink nozzle, and a plurality of individual electrodes that are opposed to the common electrode with a certain gap are formed. a second substrate which is, an electrostatic drive type ink jet head having a switching element group for controlling the supply of the drive voltage to the individual electrode corresponding to the ink nozzles to eject ink droplets,
Each switching element of the switching element group is a bidirectional analog switch including an inverter and a transmission gate composed of a MOS-FET,
A plurality of the individual electrodes and a number of the switching elements corresponding to the individual electrodes are formed on the second substrate,
These switching elements have a matrix connection of a plurality of data signal lines and a plurality of drive control signal lines,
An electrostatic actuator electrostatically driven ink jet head manufactured by the method for manufacturing an electrostatic actuator according to claim 1 .

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