JP4520425B2 - Element mounting method and element mounting apparatus - Google Patents

Description

  The present invention relates to an element mounting method and an element mounting apparatus, and more particularly to an element mounting method for mounting an element on a substrate and an element mounting apparatus used in the method.

  As a prior art relating to this invention, a heating means for heating and melting a solder paste by light energy and an image of reflected light from the solder paste are imaged and output in comparison with a preset level of reflected light. 2. Description of the Related Art There is known a soldering apparatus including a control unit that controls light energy (see, for example, Patent Document 1).

In addition, a mounting position display mark indicating a normal mounting position and a positional deviation amount display mark indicating an amount of positional deviation from the normal mounting position are provided on a substrate on which the surface mounting component is mounted, and solder on the electrode on the component side The ball is welded in advance, and is mounted on the substrate in a state where it is intentionally displaced by about half the diameter of the solder ball and then heated, and the component moves due to the surface tension of the molten solder. Thus, there is known a surface mount component substrate for confirming that the soldering has been normally performed when the mounting position display mark covered with the component can be visually checked (for example, Patent Document 2). reference).
Japanese Patent Laid-Open No. 7-7251 JP 2002-353578 A

With the further development and spread of electronic devices, there is a strong demand at production sites to reduce production costs as much as possible. For this purpose, it is very important to simplify the production process and reduce the tact time and man-hours as much as possible. However, since electronic devices are precision instruments, high precision is required for their production, and sufficient inspection processes are necessary to ensure reliability.
Under such circumstances, simplification and high accuracy, satisfying these conflicting conditions at a high level, and ensuring high reliability are major issues at the production site of electronic equipment.

Looking at the conventional technology from this point of view, for example, in the technology according to Patent Document 1, the energy to be output is controlled by the level of the reflected light of the solder paste at the joint (soldered portion). It is necessary to set a proper reflected light level in advance. Subsequently, in order to control the light energy to be output while comparing with the set reflected light level, it is also necessary to accurately irradiate light, receive the reflected light, and perform high-accuracy image recognition. .
In the technique according to Patent Document 2, first, a separate process is required in which a solder ball is previously welded to a predetermined position on the component side, and a highly accurate welding technique is required for this process. . In addition, even if it is intended to be mounted with its position shifted, its allowable range is limited to about half the diameter of the solder ball, specifically within about 0.2 mm. There is no change in the need for highly accurate positioning.
In addition, in the technology according to Patent Document 2, it is confirmed that the soldering is normally performed by visually observing the mounting position display mark covered with the surface mounting component, so that the target surface mounting component is naturally compared. It will be limited to what has a large dimension.

  The present invention has been made in consideration of the above-described circumstances. Even if it is a small element that is difficult to visually observe without using a special substrate, the element is accurately aligned with the substrate by a simple method. An element mounting method that can be soldered well is provided.

This invention includes a placing step of placing the surface into a solid solder of at least one electrode on a substrate, a mounting step of mounting at least one surface mount device on the solder is melted by heating the solder A heating step; a detection step for detecting that the element is located at a predetermined position on the electrode; and a cooling step for cooling the molten solder, wherein the substrate is covered with an insulating material that repels the solder. In the mounting process, the element is mounted so as to be partially displaced with the electrode or the solid solder, and the detection process is performed by the surface tension of the solder melted in the heating process. The element mounting method is characterized in that it is a process of detecting that the element has moved to a predetermined location on the electrode and terminating the heating in the heating process.

According to the present invention, in the mounting process, the surface-mounted element is mounted so as to partially overlap the electrode on the substrate or the solder placed on the electrode, and in the detection process, the surface of the solder melted in the heating process Since it is detected that the element has moved to a predetermined location on the electrode due to tension, even if it is a small element that is difficult to see without using a special substrate, the element is aligned with the substrate using a simple method. Can be soldered accurately.
In addition, when it is detected that the surface-mounted element has moved to a predetermined location on the electrode, the heating is terminated, so that it is possible to perform solder bonding without unevenness and without occurrence of overheating and bubbles.

  An element mounting method according to the present invention includes a mounting step of mounting solder on a surface of at least one electrode on a substrate, a mounting step of mounting at least one surface mount element on the solder, and heating the solder. A heating step for melting, a detection step for detecting that the element is located at a predetermined position on the electrode, and a cooling step for cooling the solder, wherein the substrate is covered with an insulating material that repels the solder. In the mounting process, the element is mounted so as to be partially displaced so as to partially overlap the electrode or the solder. In the detection process, the element is moved to a predetermined position on the electrode by the surface tension of the solder melted in the heating process. It is a process of detecting and detecting the heating in the heating process.

  In the element mounting method according to the present invention, the electrode on the substrate means an electrode on which a surface mount element is mounted on the substrate. A plurality of electrodes may be provided on the substrate.

The solder placed on the electrode in the placing step is not particularly limited, but for example, solid solder is used.
By using solid solder, it becomes possible to place the solder on the substrate electrode by using a transfer device such as a known chip mounter used in the mounting process for mounting the element. As the solder, it is preferable to use lead-free solder that does not adversely affect the environment.

  A surface-mount element means an element having an electrode joined to an electrode on a substrate via solder, and examples thereof include an element such as a solar cell and a diode.

The heating method used in the heating step may be any method that can heat and melt the solder to a melting point or higher. Therefore, various methods such as a method of radiating heat to the solder, a method of heating the solder by heat conduction through some medium, and a method of blowing a high-temperature gas or gas can be used as the heating method. Here, the heating method may be a method of gradually heating the solder, or a method of heating rapidly.
The heating temperature is preferably near the melting point of the solder, but the specific temperature differs depending on the type of solder.

  The detection method used in the detection step may be any method that can detect that the surface-mounted element is located at a predetermined location on the electrode. Therefore, the detection method includes imaging the surface mount element and judging by image recognition that it has moved to a predetermined location, detecting the electric resistance that changes as the surface mount element moves, and comparing it with a predetermined threshold value. Various optical, electrical, or electromagnetic methods are used, such as a method for determining that a surface-mounted device has moved to a predetermined location by a method, a method for inspecting the overlap between the device and the substrate electrode by irradiating X-rays, etc. it can.

  The method used in the cooling step may be any method that can take heat from the molten solder or release it to solidify the solder. Therefore, various methods such as a method of radiating and cooling using heat conduction through some medium or a method of contacting with a gas or a liquid having a temperature suitable for cooling can be used as the cooling method. Further, here, the cooling method may be either slow cooling or rapid cooling.

  The insulating material that repels solder is not particularly limited as long as it is an insulating material that has a property that the molten solder does not spread and becomes granular and difficult to adhere, and examples thereof include a solder resist. . On such an insulating material, the molten solder becomes granular and it is difficult to stay in one place.

In the element mounting method according to the present invention, the substrate may include a heat radiating portion larger than the electrode.
According to such a configuration, in the step of heating and melting the solder, the substrate is heated to conduct heat to the electrode of the substrate through the heat radiating portion, so that the electrode is entirely uniform above the melting point temperature of the solder. Therefore, it is possible to solder the surface mount element on the electrode in a good state without generating bubbles or the like in the melted solder.

The element mounting method according to the present invention may further include a step of applying a flux to at least one of the substrate electrode and the surface mount element electrode.
According to such a configuration, the solder is easily adapted to at least one of the electrode of the substrate and the electrode of the surface mount element, and the soldering can be surely performed.
Here, the flux may be any material that dissolves the oxide on the metal surface when soldering, and at the same time prevents oxidation and lowers the interfacial tension of the solder, and the specific type is particularly limited. is not.

In the element mounting method according to the present invention, at least one of the surface mount elements may be a solar cell element.
According to such a configuration, the solar cell element can be soldered onto the electrode of the substrate with a simple method with a simple method, and a concentrating solar cell substrate can be produced with a high yield by a simple method. become.

In the element mounting method according to the present invention, the substrate may be provided with a plurality of electrodes, and the mounting step may be a step of simultaneously mounting a plurality of surface mount elements on the plurality of electrodes of the substrate.
According to such a configuration, it becomes possible to solder a plurality of surface mount elements to a plurality of electrodes in a single heating process using the surface tension of the melted solder, Since the cooling process and the like can be performed only once regardless of the number of electrodes and surface mount elements, production efficiency can be improved.

  Further, according to another aspect of the present invention, a mounting portion for mounting solder on the surface of at least one electrode on the substrate, a mounting portion for mounting at least one surface mount element on the solder, A heating unit that heats and melts the solder, a detection unit that detects that the element is located at a predetermined position on the electrode, and a cooling unit that cools the solder are provided, and the substrate has a region other than the electrode that repels the solder. Covered with an insulating material, the mounting portion mounts the element so that it partially overlaps the electrode or the solder, and the detection portion is mounted on the electrode by the surface tension of the solder melted by the heating portion. It is an object of the present invention to provide an element mounting device characterized in that it is detected that it has moved to a predetermined location and heating by a heating unit is terminated.

  In the element mounting apparatus according to the present invention, the mounting portion may be any device having a function capable of mounting solder on the surface of the electrode on the substrate. For the mounting part, a known mounter having a function of gripping the solder from a predetermined place, transporting the gripped solder to the vicinity of the electrode on the substrate, and mounting the transported solder on the electrode surface is used. Also good.

The mounting portion only needs to have a function capable of mounting a surface mount element on solder mounted on the surface of an electrode on a substrate. The mounting part grips the surface mount device from a predetermined location, transports the gripped surface mount device to the vicinity of the electrode on the board, and mounts the transported surface mount device on the solder placed on the electrode surface A known mounter or the like having a function to perform may be used.
Moreover, the mounter etc. used for a mounting part may be combined with what is used in the above-mentioned mounting part. Therefore, the mounting part may also serve as the mounting part.

  What is necessary is just to have a function in which a heating part can be made to heat and melt solder more than melting point. Accordingly, the heating unit is not particularly limited, and various devices such as a known hot plate, oven, and reflow device can be used.

  What is necessary is just to have a function which can detect that the surface mounting element was located in the predetermined location on an electrode with a detection part. Therefore, the sensing unit picks up the surface-mounted element, detects the movement to a predetermined location by image recognition, detects the electric resistance that changes with the movement of the surface-mounted element, and compares it with a predetermined threshold value. Various functions that have optical, electrical, or electromagnetic functions, such as a function for determining that a surface-mounted element has moved to a predetermined position, a function for inspecting the overlap between a surface-mounted element and a substrate by irradiating X-rays, etc. Devices are available.

  The cooling unit may have any function that can remove heat from the molten solder or release it to solidify the solder. Accordingly, the cooling unit is not particularly limited, and various devices such as a known cold plate, an air cooling fan, and a cooling gas injection device can be used.

The element mounting apparatus according to the present invention may further include an application unit that applies a flux to at least one of the substrate electrode and the surface mount element electrode.
According to such a configuration, the solder is easily adapted to at least one of the electrode of the substrate and the electrode of the surface mount element, and the soldering can be surely performed.
In addition, although it does not specifically limit for an application part, For example, a well-known dispenser etc. may be used.

In the element mounting apparatus according to the present invention, the detection unit may detect that the surface mount element is located at a predetermined position on the electrode using image recognition.
According to such a configuration, it is possible to detect that the surface-mounted element has moved to a predetermined location on the substrate electrode by a relatively simple means using a known image recognition device or the like.
Here, the image recognition device is not particularly limited, but may be configured of, for example, an imaging device, an image analysis device, and a data storage device. More specifically, a CCD camera is used as an imaging device, and a CPU, a ROM storing a control program, a RAM storing various setting conditions, and a computer having an I / O port are used as an image analysis device and a data storage device. May be.

  Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

  FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus (element mounting apparatus) according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a receiver substrate on which solar cells (surface mounted elements) are mounted. FIG. 3 is an explanatory view showing a situation in which solid solder, solar cells and diodes are mounted on the receiver substrate shown in FIG. 2, and FIG. 4 is a concentrating solar cell substrate by an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is an explanatory diagram for explaining a process of detecting that the solar battery cell has moved to the solar battery mounting part.

An electronic component mounting apparatus 100 shown in FIG. 1 includes a substrate receiving stage 1, a flux application stage 2, a dispenser (application section) 3, a parts mounting stage 4, a parts stocker 5, a hot plate (heating section) 6, an image recognition apparatus ( It is mainly composed of a detection unit 7, a cold plate (cooling unit) 8, a transfer robot (mounting unit, mounting unit) 9, a substrate take-out stage 10, and an operation unit 11.
The receiver substrate (substrate) 12 shown in FIGS. 2 to 4 includes a substrate (heat dissipating part) 13, a surface insulating coating 14, a solar cell mounting part (electrode) 15, a diode mounting part (electrode) 16, and a back electrode extraction terminal. 17. It is comprised from the wiring pattern 23 formed on the surface insulation coating.
The board | substrate 13 is formed with the metal excellent in electrical conductivity and heat conductivity, such as copper.
In addition, the surface insulating coating 14 is formed of a solder resist having a high electrical resistance and high withstand voltage and poor solder wettability.
In addition, the solar cell mounting part 15 and the diode mounting part 16 do not have the surface insulating coating 14 formed, and the surface of the substrate 13 is exposed and functions as an electrode.
Further, the solar cell mounting portion 15 and the diode mounting portion 16 are respectively formed with depressions 24.
Hereinafter, a process in which components are mounted on the receiver substrate 12 using the electronic component mounting apparatus 100 and soldered will be described with reference to FIGS. 1 and 4.

When the operator presses the work start button of the operation unit 11, the receiver substrate 12 is set on the substrate receiving stage 1 of the electronic component mounting apparatus 100 as shown in FIG.
Next, the receiver substrate 12 is transported from the substrate receiving stage 1 to the flux application stage 2 by the transport robot 9.

  The transfer robot 9 used in the electronic component mounting apparatus 100 includes a suction device by vacuum suction, and a desired size on the electronic component mounting apparatus 100 from a size such as an element or a solid solder to a size about a substrate. In addition, it has a function of sucking from the above-mentioned place and further transporting and placing the sucked thing to a desired place on the electronic component mounting apparatus 100. Therefore, the transfer robot 9 can freely move along the track between the substrate receiving stage 1 and the substrate take-out stage 10 on the electronic component mounting apparatus 100, and the suction portion is in the depth direction and the vertical direction perpendicular to the track. You can move freely.

The receiver substrate 12 conveyed to the flux application stage 2 is applied with 6 mg of flux on the solar cell mounting portion 15 and 1.5 mg of flux on the diode mounting portion 16 by the dispenser 3 (FIG. 4A) (applied) The flux is not shown).
By applying the flux, the solder can be easily adapted to the solar cell mounting portion 15 and the diode mounting portion 16, and solder bonding can be reliably performed.

Next, the receiver substrate 12 is transferred from the flux application stage 2 to the parts mounting stage 4 by the transfer robot 9.
After the receiver substrate 12 is transported onto the parts mounting stage 4, the transport robot 9 takes out the solid solder 18 (8 mm × 6 mm × 0.2 mm) for solar cell bonding from the parts stocker 5 and places it on the solar cell mounting portion 15. To do. Similarly, the diode joining solid solder 20 is taken out of the parts stocker 5 and placed on the diode mounting portion 16. (FIG. 4B).
Since both the solar cell bonding solid solder 18 and the diode bonding solid solder 20 are solid solders, they can be sucked and placed by the transfer robot 9.
Thereby, in the electronic component mounting apparatus 100 of the present embodiment, all processes other than the flux application can be performed by the transfer robot 9.
Both the solar cell bonding solid solder 18 and the diode bonding solid solder 20 are preferably lead-free solders that do not adversely affect the environment.

Subsequently, the transfer robot 9 takes out the solar battery cell 19 from the parts stocker 5, and on the solar battery joining solid solder 18 placed on the solar battery mounting part 15 from the solar battery mounting part 15 in the X axis direction and the Y axis. In the direction, each is displaced by about 50% (FIG. 4C).
Similarly, the diode 21 is taken out from the parts stocker 5 and is displaced from the diode mounting portion 16 by about 50% in the X-axis direction and the Y-axis direction on the diode bonding solid solder 20 on the diode mounting portion 16. (FIG. 4D).

When the mounting of all the parts is completed, the receiver substrate 12 is transferred to the hot plate 6 by the transfer robot 9.
The receiver substrate 12 conveyed on the hot plate 6 is heated to the solder melting point. The solder melting point varies depending on the type of solder, but in this embodiment, it is heated to 230 ° C.
Since the substrate 13 of the receiver substrate 12 is made of a metal having excellent electrical and thermal conductivity such as copper, the heat of the hot plate 6 is passed through the substrate 13 and the solar cell mounting portion on the surface of the receiver substrate 12. 15 and the diode mounting part 16 are quickly conducted.
Due to the above-described heat conduction, the surface temperatures of the solar cell mounting portion 15 and the diode mounting portion 16 reach the solder melting point in a short time, and the solders 18 and 20 mounted on the solar cell mounting portion 15 and the diode mounting portion 16 respectively. Melts immediately.
Thus, using heat conduction using the substrate 13 as a medium, heat is conducted to the entire area of the solar cell mounting portion 15 and the diode mounting portion 16, thereby heating the solder placed on each mounting portion, Since it melts, there is no underheating or overheating, and uniform soldering that does not generate bubbles is possible.
Moreover, since elements such as the solar battery cell 19 and the diode 21 have a thin back surface, they may be damaged by local heating, and such a heating method in which a heat source does not directly touch the element prevents damage to the element. It also contributes to that.

When the solder melts, a so-called self-alignment function due to the surface tension of the solder 18 acts on the solar cells 19 mounted on the melted solder 18 and moves to the solar cell mounting portion 15 on the receiver substrate 12 (FIG. 4 ( e)).
The poor solder wettability of the surface insulating coating 14 also has a synergistic effect, and the melted solder does not spread on the receiver substrate 12 other than the solar cell mounting part 15 to which the solder wettability is improved by applying the flux. It becomes granular and moves to the solar cell mounting portion 15. The solar battery cell 19 mounted on the solder before melting also moves to the solar battery mounting portion 15 according to the movement of the solder when the solder melts.
The moved solder spreads uniformly over the entire area of the solar cell mounting part 15 around the depression 24 on the solar cell mounting part 15 having good solder wettability, so that the solar cells 19 on the solder are on the solar cell mounting part 15. It is arranged accurately at a predetermined location.
In the same process, the diode 21 is also moved to a predetermined location on the diode mounting portion 16 and accurately arranged (FIG. 4E).

As described above, in the process in which the solar battery cell 19 and the diode 21 move to the predetermined locations on the solar battery mounting part 15 and the diode mounting part 16, respectively, the image recognition device 7 performs the solar battery cell 19 and the It is detected that the diode 21 has moved to a predetermined location on the solar cell mounting portion 15 and the diode mounting portion 16.
Specifically, as shown in FIG. 5, the sensor unit 22 of the image recognition device 7 is preliminarily aligned with the corner of the solar cell mounting unit 15, and a change in contrast in the sensor unit 22 is sensed, whereby the image recognition device 7. Detects that the target has entered the sensor unit 22.
Before the solder is melted, the solar cells 19 are set so as to be displaced from each other by about 50% in the X-axis direction and the Y-axis direction, so that the solar cells 19 cover the corner portions of the solar cell mounting portion 15. The corners of the solar cell mounting unit 15 are not included in the sensor unit 22 of the image recognition device 7.
When the solder is melted, the solar battery cell 19 on the solder melted by the self-alignment function moves to the solar battery mounting portion 15.
When the corner of the solar battery cell 19 enters the sensor unit 22 of the image recognition device 7 so as to overlap with the corner of the solar battery mounting unit 15, the difference in contrast between the corner portion and the other portion is large. By the change, the image recognition device 7 can detect that the corner of the solar battery cell 19 has moved so as to coincide with the corner of the solar battery mounting portion 15.
Thereby, it is detected that the solar battery cell 19 has been accurately arranged at a predetermined location on the solar battery mounting portion 15, and is recognized as a timing to end the heating of the solder.
The detection means by the image recognition device 7 can achieve the initial purpose by setting the target position at the corner portion of the solar cell mounting portion 15. Therefore, it is not necessary to separately provide a reference mark or the like as a target location on the substrate, and the number of work steps for detection and inspection is not increased.
The same applies to the detection of the diode 21 moving to a predetermined location on the diode mounting portion 16.

When the above detection is made, the heating of the hot plate 6 is finished, and in order to stabilize the joining state, the receiver substrate 12 obtained after finishing the above steps is held in that state for about 10 seconds. Thereafter, the receiver substrate 12 is transported from the hot plate 6 to the cold plate 8 by the transport robot 9.
When the image recognition device 7 detects that the solar battery cell 19 has moved to a predetermined location on the solar battery mounting portion 15, heating by the hot plate 6 is terminated, so that there is no excessive heating or generation of bubbles. , Non-uniform solder bonding becomes possible.
The receiver substrate 12 transported on the cold plate 8 is held for about 60 seconds, and when the temperature becomes 40 ° C. or lower, it is transported to the substrate take-out stage 10 by the transport robot 9.
Finally, the series of operations is completed when the receiver substrate 12 transported onto the substrate extraction stage 10 is extracted.

  As shown in the above work process, the self-alignment function based on the surface tension of the molten solder is used even when a small element such as the solar battery cell 19 or the diode 21 that is difficult to see is mounted on the substrate. With a simple method, the element can be soldered to the substrate with high alignment accuracy.

In addition, the tolerance | permissible_range of the positional offset between the solar cell mounting part 15, the solid solder 18, and the photovoltaic cell 19 for making the self-alignment function utilized in a present Example work effectively is the solar cell mounting part 15 and solid. It is only necessary that the solder 18 and the solid solder 18 and the solar battery cell 19 overlap each other.
In the present embodiment, for the convenience of setting the sensor unit 22 of the image recognition device 7, the X-axis direction and the Y-axis direction are mounted with a displacement of about 50%, but at the experimental level, on the solar cell mounting unit 15. As long as the solar cells 19 are stacked on the solid solder 18 by an area of about 1% of the area, the self-alignment function can be activated.

Further, as shown in FIG. 6, the solid solder 18 is placed with a displacement of 90% of the area with respect to the solar cell mounting portion 15, and with respect to the solid solder 18 placed with a displacement. The self-alignment function can be activated even when the solar battery cell 19 is mounted with a position shifted by 90% of its area. In this case, the misalignment between the solar battery mounting portion 15 and the solar battery cell 19 is about 180% in total in area, and the self-alignment due to the surface tension of the molten solder is not directly overlapped at all. The solar battery cell 19 can be moved to a predetermined location on the solar battery mounting portion 15 by the alignment function.
In addition, in order to realize simple and accurate solder bonding by the self-alignment function, the area relationship between the electrode of the element such as the solar battery cell 19 and the electrode of the substrate such as the solar battery mounting portion 15 is in the following range. It is desirable to become.
Element electrode area × 0.01 <Substrate electrode area <Element electrode area × 2

1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus according to an embodiment of the present invention. It is a perspective view which shows the receiver board | substrate which mounts a photovoltaic cell. It is explanatory drawing which shows the condition where solid solder, a photovoltaic cell, and a diode are mounted in a receiver board | substrate. It is process drawing which shows the process of manufacturing a concentrating solar cell board | substrate with the electronic component mounting apparatus by the Example of this invention. It is explanatory drawing explaining the process of detecting that the photovoltaic cell moved to the solar cell mounting part. It is explanatory drawing which shows the mounting state before a movement of an example which the photovoltaic cell moved to the solar cell mounting part with the surface tension of the melt | dissolved solder.

Explanation of symbols

1 .... Substrate receiving stage 2 .... Flux application stage 3 .... Dispenser 4 .... Parts loading stage 5 .... Parts stocker 6 .... ················································································· 8 Section 12: Receiver board 13: Board 14: Surface insulation coating 15 ... Solar cell mounting section 16 ... Diode mounting section 17 ... Back electrode lead terminal 18... Solid solder for solar cell bonding 19... Solar cell 20... Solid solder for diode junction 21. Part 23: Allocation Line pattern 24 ... Dimple 100 ... Electronic component mounting device

Claims (8)

A placing step of placing the surface into a solid solder of at least one electrode on a substrate, a mounting step of mounting at least one surface mount device on the solder, the heating step of melting and heating the solder, a detection step of the device detects that it has located a predetermined position on the electrode, and a cooling step of cooling the molten solder, the substrate region other than the electrode is covered with an insulating material to play the solder, the electrodes A depression is formed in a part thereof, and in the mounting process, the element is mounted so as to be partially displaced so as to partially overlap the electrode or solid solder. In the detection process, the element is electroded by the surface tension of the solder melted in the heating process. An element mounting method comprising detecting a movement to a predetermined position and ending heating in a heating process.   The element mounting method according to claim 1, wherein the substrate includes a heat dissipation portion having a surface area larger than that of the electrode.   3. The element mounting method according to claim 1, further comprising a coating step of applying a flux to at least one of the substrate electrode and the surface mount element electrode.   The element mounting method according to claim 1, wherein at least one of the surface mounted elements mounted in the mounting step is a solar cell element.   5. The element according to claim 1, wherein the substrate includes a plurality of electrodes, and the mounting step is a step of simultaneously mounting a plurality of surface mount elements on the plurality of electrodes of the substrate. Mounting method. It is an apparatus used for the element mounting method of Claim 1, Comprising: The mounting part which mounts solid solder on the surface of the at least 1 electrode on a board | substrate, and at least 1 surface mount element on the said solder | pewter a mounting portion for mounting a heating unit for heating to melt the solder, and a detection unit for detecting that the device is positioned in a predetermined position on the electrode, that obtain Bei and a cooling unit for cooling the molten solder An element mounting device.   The element mounting apparatus according to claim 6, further comprising an application unit that applies a flux to at least one of the electrode of the substrate and the electrode of the surface mount element.   8. The element mounting apparatus according to claim 6, wherein the detection unit detects that the surface mount element is located at a predetermined position on the electrode by using image recognition.

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