JP4489560B2 - Ultrasonic probe, ultrasonic imaging apparatus, and ultrasonic probe manufacturing method - Google Patents

Description

  The present invention relates to an ultrasonic probe, an ultrasonic imaging apparatus, and an ultrasonic probe manufacturing method in which a print plate is connected to a piezoelectric plate made of a piezoelectric element.

  In recent years, ultrasonic probes have been further improved in order to improve the image quality of ultrasonic imaging apparatuses. The ultrasonic probe is composed of a piezoelectric plate in which a plurality of piezoelectric plate blocks (blocks) are arranged in an array, and each piezoelectric plate block has a cable (transmission / reception of electrical signals accompanying transmission / reception of ultrasonic waves) cable) is electrically connected (see, for example, Non-Patent Document 1).

  However, the array of piezoelectric plate blocks has a repetition pitch (pitch) of about several tens of μm to several hundreds of μm, so it is not easy to connect a cable to each piezoelectric plate block forming the array. Even if connected, an ultrasonic probe having a remarkable multi-channel configuration has a large number and volume of cables, and is impractical.

Here, the array of piezoelectric plate blocks is connected to a cable via an FPC plate (Flexible Printed Circuit). The FPC board can easily form a copper pattern having a pitch of about several hundreds of μm on a polyimide film by etching. In the FPC board, the pitch of the copper pattern at the connection portion with the piezoelectric board is made the same as the array pitch of the piezoelectric board block, and the piezoelectric board block is arranged on this copper pattern, so that the electrical connection between the piezoelectric board and the cable is achieved. Connection.
Edited by Japan Electronic Machinery Manufacturers Association, "Medical Ultrasound Equipment Handbook" Corona, April 20, 1985, p185-187

  However, according to the above background art, the acoustic characteristics of the ultrasonic probe are deteriorated. That is, the FPC plate is located on the surface of the piezoelectric plate or the piezoelectric plate block that transmits and receives ultrasonic waves, and the acoustic impedance (impedance) matching is performed on either the matching layer side in contact with the subject or the side where the acoustic absorbent is present. (Matching) decreases.

  In addition, on the surface of the piezoelectric plate that transmits and receives ultrasonic waves, the area between the FPC plate and the ground side electrode has an effective opening area. In the configuration in which the piezoelectric plate is placed on the FPC board, the effective opening area is small. It will be a thing.

  The reduction in acoustic impedance matching and the reduction in effective aperture area result in a reduction in acoustic power transmitted to the subject, and reflection of unwanted sound waves from the back side of the piezoelectric plate in the direction opposite to the subject. As a result, the image quality of the ultrasound imaging apparatus is degraded.

  From these facts, how to realize an ultrasonic probe, an ultrasonic imaging apparatus, and an ultrasonic probe manufacturing method for connecting a piezoelectric plate and an FPC plate without deterioration of the acoustic characteristics of the ultrasonic probe. Is important.

  The present invention has been made in order to solve the above-described problems caused by the background art, and an ultrasonic probe that connects a piezoelectric plate and an FPC plate without deterioration of acoustic characteristics of the ultrasonic probe, An object is to provide an ultrasonic imaging apparatus and an ultrasonic probe manufacturing method.

  In order to solve the above-described problems and achieve the object, an ultrasonic probe according to the first aspect of the invention transmits a piezoelectric plate made of a piezoelectric element that transmits or receives ultrasonic waves and the ultrasonic waves. A printed board including a conductor pattern that transmits a drive signal of the piezoelectric element or an induced signal induced in the piezoelectric element by receiving the ultrasonic wave, and a board surface that transmits or receives the ultrasonic wave of the piezoelectric board And a connecting portion having a micro pin including a metal rod that electrically connects the piezoelectric element and the conductor pattern.

According to the first aspect of the invention, the piezoelectric plate and the conductor pattern are electrically connected by the metal rod included in the micro pin on the side surface of the piezoelectric plate.
The ultrasonic probe according to the invention of the second aspect is the ultrasonic probe according to the invention of the first aspect, wherein the connection portion includes a plurality of piezoelectric plates arranged in an array in the scanning direction along the side surface. When the piezoelectric plate block is formed, each of the piezoelectric plate blocks includes the micro pin.

  The ultrasonic probe according to the invention of the third aspect is the ultrasonic probe according to the invention of the second aspect, wherein the plurality of electrical probes are individually electrically connected to the printed board via the piezoelectric plate block and the metal rod. A conductive pattern is provided.

The ultrasonic probe according to the invention of the fourth aspect is characterized in that, in the invention of the third aspect, the micro pin has a structure in which the metal rod is bent.
The ultrasonic probe according to the fifth aspect of the invention is characterized in that, in the invention of the third or fourth aspect, the micropin has a structure in which the metal rod is curved.

  An ultrasonic probe according to a sixth aspect of the invention is the ultrasonic probe according to any one of the third to fifth aspects, wherein the printed board is adjacent to the conductor pattern at the connection position with the metal rod. Each piezoelectric plate block is different in the plate surface direction.

The ultrasonic probe according to the seventh aspect of the invention is characterized in that, in any one of the first to sixth aspects, the piezoelectric element is made of a composite piezoelectric material.
An ultrasonic imaging apparatus according to an eighth aspect of the invention includes an ultrasonic probe that transmits and receives ultrasonic waves to and from a subject, a transmission and reception unit that transmits and receives electrical signals to and from the ultrasonic probe, An ultrasonic imaging apparatus comprising: an image processing unit that generates image information from a received ultrasonic echo of a transmission / reception unit; and a display unit that displays the image information, wherein the ultrasonic probe A piezoelectric plate comprising a piezoelectric element for transmitting and receiving; a printed board for transmitting the electrical signal; and a connecting portion having a micro pin including a metal rod for electrically connecting the piezoelectric element and the printed board, and the connection The unit includes the micro pin on a side surface orthogonal to a plate surface of the piezoelectric plate that transmits and receives the ultrasonic waves.

  According to a ninth aspect of the invention, there is provided an ultrasonic probe manufacturing method comprising: a micro-plate including a metal rod on a side surface orthogonal to a plate surface for transmitting / receiving ultrasonic waves, of a piezoelectric plate comprising a piezoelectric element for transmitting / receiving ultrasonic waves. The metal is applied to a conductor pattern on a printed board that is attached with a pin and transmits at least one of a drive signal of the piezoelectric element that transmits the ultrasonic wave and an induced signal that is induced in the piezoelectric element by receiving the ultrasonic wave Connect the bars electrically.

  The ultrasonic probe manufacturing method according to the invention of the tenth aspect is characterized in that, in the invention of the ninth aspect, the micropin is attached to the side surface using an adhesive.

  As described above, according to the present invention, the piezoelectric plate and the conductor pattern are electrically connected by the metal rod of the micro pin on the side surface of the piezoelectric plate, so that the ultrasonic wave of the piezoelectric plate is transmitted and received. The FPC board is not disposed on the plate surface on the specimen side or the sound absorbing material side, the deterioration of the acoustic characteristics can be suppressed, the effective aperture area can be increased, and the image quality of the ultrasonic imaging apparatus is improved. be able to.

Exemplary embodiments for carrying out an ultrasonic probe, an ultrasonic imaging apparatus, and an ultrasonic probe manufacturing method according to the present invention will be described below with reference to the accompanying drawings. Note that the present invention is not limited thereby.
(Embodiment 1)
First, the overall configuration of the ultrasound imaging apparatus according to the first embodiment will be described. FIG. 1 is a block diagram showing the overall configuration of the ultrasound imaging apparatus according to the first embodiment. The ultrasound imaging apparatus includes an ultrasound probe 101, a transmission / reception unit 102, an image processing unit 103, a cine memory unit 104, an image display control unit 105, a display unit 106, an input unit 107, and a control unit 108. ing.

  The ultrasonic probe 101 transmits and receives ultrasonic waves. That is, an ultrasonic wave is irradiated at a specific position on the imaging cross section of the subject 1 and an ultrasonic echo (echo) reflected from the living body is received as a time-series sound ray, while sequentially switching the ultrasonic wave irradiation position. Scan electronically.

  The transmission / reception unit 102 is connected to the ultrasonic probe 101 through a coaxial cable, generates an electrical signal for driving the piezoelectric element of the ultrasonic probe 101, and performs first-stage amplification of the received ultrasonic echo signal. Part.

  The image processing unit 103 extracts real-time (real time) generation of a B-mode image or phase change information of the ultrasonic echo signal from the ultrasonic echo signal amplified by the transmission / reception unit 102, and performs the speed change in real time. This is a part for calculating flow information associated with each point of the imaging section such as power value and variance. Specific processing contents include, for example, delay addition processing of received ultrasonic echo signals, A / D (analog / digital) conversion processing, and processing of writing the converted digital information in a cine memory unit 104 described later as B-mode image information Etc.

The cine memory unit 104 is an image memory for storing B-mode image information and flow information generated by the image processing unit 103.
The image display control unit 105 is a part for performing display frame rate conversion of the B-mode image information and flow information generated by the image processing unit 103 and controlling the shape and position of the image display.

  The display unit 106 converts the display frame rate by the image display control unit 105 and displays information on the shape and position of the image display to the operator, such as a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display). It is a part consisting of

  The input unit 107 is a part that provides the control unit 108 with an operation input signal for selecting whether to perform an operation input signal by an operator, for example, whether to perform display in the B mode or to display a result of Doppler processing.

  The control unit 108 is a unit for controlling the operation of each unit of the above-described ultrasonic imaging apparatus based on the operation input signal given from the input unit 107 and the program (program) and data (data) stored in advance.

  FIG. 2 is a block diagram showing a configuration of a linear type ultrasonic probe 101. The ultrasonic probe 101 includes a piezoelectric plate 10, a connection unit 20, an FPC plate 30, a switching circuit 40 and a cable 50. The piezoelectric plate 10 is a plate-shaped ceramic made of a piezoelectric material, and a plurality of rectangular parallelepiped piezoelectric plate blocks are arranged in an array, forming a plate shape as a whole. These piezoelectric plate blocks are electrically connected to the FPC plate 30 via the connecting portion 20.

  The FPC board 30 is a flexible printed board in which a conductor pattern is formed on a film of polyimide or the like by etching or the like. The FPC plate 30 electrically connects the piezoelectric plate block constituting the piezoelectric plate 10 and the switching circuit 40. The configurations of the piezoelectric plate 10 and the FPC plate 30 with the connecting portion 20 as the center will be described in detail later.

  The switching circuit 40 is composed of a high withstand voltage, high speed switch, and selects a piezoelectric plate block that transmits / receives ultrasonic waves from among the piezoelectric plate blocks connected via the FPC plate 30, and the selected piezoelectric plate. Only the block is electrically connected to the transmitting / receiving unit 102. The cable 50 is composed of the same number of coaxial cables as the transmission / reception circuits included in the transmission / reception unit 102, electrically connects the switching circuit 40 and the transmission / reception unit 102, and transmits the drive waveform and reception waveform of the piezoelectric plate block. The cable 50 also transmits a control signal for the switching circuit 40.

  FIG. 3 is a diagram illustrating the configuration of the piezoelectric plate 10 and the connecting portion 20. FIG. 3A is a view of the piezoelectric plate 10 and the connection portion 20 as viewed from the direction of the plate surface of the piezoelectric plate 10, that is, from the subject 1 side. The piezoelectric plate 10 is composed of a plurality of piezoelectric plate blocks 70, and the connecting portion 20 has the same number of micropins 60 as the piezoelectric plate blocks 70 on two side surfaces in the thickness direction orthogonal to the piezoelectric plate surface. Here, the thickness direction is the major axis direction of the piezoelectric plate block 70 having a rectangular parallelepiped shape. The direction in which the piezoelectric plate blocks 70 are arranged in an array is the scanning direction and is orthogonal to the thickness direction.

  FIG. 3B is a view of the piezoelectric plate 10 and the connecting portion 20 as viewed from the thickness direction. The piezoelectric plate 10 includes a plurality of piezoelectric plate blocks 70 arranged in a flat plate shape. FIG. 3C is a diagram showing a cross section of the piezoelectric plate block 70 in the thickness direction orthogonal to the plate surface of the piezoelectric plate 10. Electrodes 82 and 83 exist on the surface of the piezoelectric plate block 70, and the micropin 60 is electrically connected to the electrodes 82 and 83. The electrodes 82 and 83 are conductive thin films formed on the piezoelectric plate block 70 by sputtering or baking.

  The micro pin 60 has a metal bar portion 80 and a pedestal portion 81 which are projections connected to the FPC board 30. The micro pin 60 is made of a metal rod by MIM (Metal Injection Mold) technology in which metal powder such as iron, nickel, molybdenum, or copper is pressed into a mold (Mold) and molded under high temperature and high pressure. The portion 80 has a diameter of about several tens of μm. The micro pin 60 is fixed to the piezoelectric plate block 70 with, for example, an epoxy adhesive. In the example of FIG. 3C, the electrode 83 is a ground electrode, and the electrode 82 is a signal electrode.

  FIG. 4 is a development view showing the connection between the piezoelectric plate 10 and the FPC plate 30 with the connecting portion 20 as the center. The FPC board 30 has conductor patterns 31 having the same repetitive pitch as the piezoelectric board block 70 in the scanning direction. A pad (pad) 29 is present at the tip of the conductive pattern 31 on the piezoelectric plate block 70 side. The pad 29 has a through hole, the metal rod 80 of the micro pin 60 is inserted and soldered, and the conductor pattern 31 and the electrode 82 or 83 of the piezoelectric plate block 70 are electrically connected. The Further, the side of the conductor pattern 31 on the side of the switching circuit 40 is connected to the switching circuit 40 by enlarging the distance between the conductor patterns 31. Further, the micro pin 60 on the side where the FPC board 30 does not exist of the piezoelectric plate 10 is grounded by a conductor foil or the like on the FPC board (not shown).

  In FIG. 4, the matching layer 72 is illustrated on the subject 1 side of the piezoelectric plate block 70, and the backing material 71 is illustrated on the opposite side of the piezoelectric plate block 70 from the subject 1. The matching layer 72 is for matching the acoustic impedance between the subject 1 and the piezoelectric plate block 70, and the backing material 71 absorbs ultrasonic waves radiated opposite to the subject 1 of the piezoelectric plate block 70. Is for.

  Next, an outline of the operation of the piezoelectric plate 10 and the FPC plate 30 centering on the connecting portion 20 will be described. The driving waveform of the piezoelectric element is generated by the transmission / reception unit 102 and is input to the conductor pattern of the FPC board 30 to which the driving piezoelectric element is connected via the switching circuit 40. This drive waveform is applied to the piezoelectric plate block 70 from the conductor pattern 31 via the micro pin 60. Here, the piezoelectric plate block 70 excites ultrasonic vibrations and transmits ultrasonic waves in the direction of the subject 1.

  Further, when the reflected ultrasonic wave from the subject 1 enters the piezoelectric plate block 70, an induced voltage is generated in the piezoelectric plate block 70, and this induced voltage is transmitted to the conductor pattern 31 via the micro pin 60, and the conductor The received waveform is received by the transmission / reception unit 102 via the pattern 31 and the switching circuit 40.

  As described above, in the first embodiment, the FPC plate 30 and the piezoelectric plate block 70 of the piezoelectric plate 10 are connected to the FPC plate 30 via the micro pins 60 on the side surface of the piezoelectric plate block 70. Therefore, the FPC plate 30 and the piezoelectric plate 10 are electrically connected without arranging the FPC plate between the matching layer 72 or the backing material 71 and the piezoelectric plate block 70, so that the ultrasonic probe 101 can be connected. It is possible to prevent the deterioration of the acoustic characteristics and improve the image quality of the ultrasonic imaging apparatus.

  In the first embodiment, the linear ultrasonic probe 101 is used as an example. However, a sector type or convex type ultrasonic probe is used in exactly the same manner. You can also.

  In the first embodiment, the case where a piezoelectric element having a uniform structure such as PZT is used is shown. However, a non-uniform material such as a composite piezoelectric material can also be used for the piezoelectric element. The composite piezoelectric material includes a piezoelectric member such as PZT that is periodically arranged in the scanning direction and the thickness direction of the piezoelectric plate 10 and a filler such as an epoxy resin that is filled in the gap between the piezoelectric members. In this case, the repetition pitch and position of the piezoelectric plate block 70 in the scanning direction coincide with the period and position of the piezoelectric member. Therefore, by arranging the micro pins so as to coincide with the period and position of the piezoelectric member, it is possible to easily mount the FPC board 30 that coincides with the period and position of the composite piezoelectric material.

In the first embodiment, the electrodes 82 and 83 shown in FIG. 3C can be arranged up to a position near the micro pin 60 located on the opposite side surface. As a result, the overlapping portions of the electrodes 82 and 83 existing between the piezoelectric plate block 70 in the direction of the subject 1 are increased, and as a result, the effective opening area can be increased.
(Embodiment 2)
In the first embodiment, the pads 29 of the FPC board 30 are arranged in a line in the scanning direction. It has become. Therefore, the second embodiment shows a case where the conductor patterns are wired with high density by arranging adjacent pads on the FPC board at different positions in the pattern running direction.

  FIG. 5 is a development view showing the configuration of the piezoelectric plate 10 and the FPC plate 90 with the connecting portion 21 as the center, according to the second embodiment. Here, connecting portion 21 and FPC board 90 correspond to connecting portion 20 and FPC board 30 in the first embodiment, and other configurations and operations are exactly the same as those in the first embodiment, and thus detailed description thereof will be made. Is omitted.

  The FPC board 90 has conductor patterns 91 to 93 having the same repetition pitch as that of the piezoelectric plate block 70 in the scanning direction. Pads (Pad) 32 to 34 are present at the tip portions of the conductive patterns 91 to 93 on the piezoelectric plate block 70 side. The pads 32 to 34 are arranged at a predetermined distance in the running direction of the conductor patterns 91 to 93. In the example of FIG. 5, three conductor patterns 91 to 93 whose pad positions are different in the running direction of the conductor pattern are repeatedly formed on the FPC board 90. Thereby, the conductor patterns 91 can be arranged with high density at the same pitch as the repetition pitch of the piezoelectric plate block 70 without overlapping the pads 32 to 34 having a large exclusive area in the scanning direction.

  Each time the connection unit 21 repeats the three piezoelectric plate blocks 70 in the scanning direction, the micro pins 62 to 64 are repeatedly arranged. The micro pin 62 has exactly the same shape as the micro pin 60 and is matched with the through hole of the pad 32. The micro pin 63 has a saddle-shaped bent structure of a metal rod, and the tip portion thereof is matched with the through hole of the pad 33 moved in the running direction of the conductor pattern. The micro pin 64 has a saddle-shaped bent structure with a longer metal rod, and the tip portion is matched with the through hole of the pad 34 moved in the running direction of the conductor pattern. Note that the metal rod and the pads 32 to 34 are joined by, for example, soldering.

The operations of the piezoelectric plate block 70 and the FPC plate 90 centering on the connecting portion 21 are the same as those in the first embodiment, and a description thereof will be omitted.
As described above, in the second embodiment, the piezoelectric plate block 70 and the FPC plate 30 are formed using the micro pins 62 and the micro pins 63 to 64 having metal rod portions bent into a bowl shape. Since it is supposed to be joined to the pads 32 to 34 disposed at a predetermined interval in the running direction of the conductor pattern, the conductor pattern 91 of the FPC board 90 is not affected by the pads 32 to 34 having a large occupied area. The repetition pitch can be the same high density as the repetition pitch of the piezoelectric plate block 70 in the scanning direction.

In the second embodiment, as shown by the micro pins 62 to 64 and the pads 32 to 34, the same micro pins and pads are repeatedly used for each of the three piezoelectric plate blocks 70 arranged in the scanning direction. The same micro pins and pads may be used repeatedly for every two piezoelectric plate blocks 70 arranged in the scanning direction or every four or more piezoelectric plate blocks 70 arranged in the scanning direction.
(Embodiment 3)
In the first and second embodiments, the pad portion of the FPC board and the metal rod portion of the micro pin are joined by soldering or the like, but the pad is pressed by the elastic metal rod portion. Thus, the pad and the metal bar can be electrically joined. Therefore, in the third embodiment, when the metal pin portion of the micropin is made elastic, the electrical connection between the pad of the FPC board and the metal rod portion of the micropin is achieved regardless of soldering or the like. Will be shown.

  FIG. 6A is a diagram illustrating the configuration of the micro pins 66 and the pads 201 according to the third embodiment. Here, the micro pin 66 corresponds to the micro pin 60 and the micro pins 62 to 64 in the first or second embodiment, and the pad 201 corresponds to the pad 32 to 34 in the first or second embodiment. The FPC board 99 corresponds to the FPC boards 30 and 90 in the first or second embodiment, and other configurations and operations are exactly the same as those in the first or second embodiment, and thus detailed description thereof is omitted. .

  The micro pin 66 includes a pedestal portion 68, a bending portion 67, and a contact portion 69. The micro pins 66 are fixed to the piezoelectric plate block 70 by adhesion of the pedestal portion 68 or the like. The micropin 66 has a curved portion 67 made of a curved metal rod, and has a contact portion 69 made of a substantially spherical metal at the tip of the curved portion 67. Here, the curved portion 67 made of metal has elasticity, and performs a reproducible elastic response to the compression between the pedestal portion 68 and the contact portion 68.

  FIG. 6B shows a cross section orthogonal to the contact surface where the pad 201 contacts the micropin 66. The pad 201 has a mortar-shaped through-hole 202 in the metal portion that contacts the contact portion 69 of the micro pin 66. Here, by pressing the FPC plate 99 in the direction of the piezoelectric plate block 70, the contact portion 69 is captured by the mortar-shaped through hole 202, the bending portion 67 is bent, and the contact portion 69 holds the pad 201. Pressed down. This state causes a stable electrical conduction state between the contact portion 69 and the pad 201.

  As described above, in the third embodiment, the contact portion 69 is pressed against the mortar-shaped pad 201 by providing the micropin 66 with the curved portion 67 and pressing the FPC plate 99 toward the piezoelectric plate block 70. In this state, without causing soldering or the like, a stable electrical conduction state is generated between the contact portion 69 and the pad 201. As a result, the piezoelectric plate 10 including the FPC plate 99 or the piezoelectric plate block 70 is replaced alone. These parts can be repaired as a single unit.

1 is a block diagram showing the overall configuration of an ultrasound imaging apparatus. It is a block diagram which shows the electrical structure of an ultrasonic probe. It is a block diagram which shows the piezoelectric plate and connection part of an ultrasonic probe. It is an expanded view which shows the connection of the piezoelectric plate and FPC board of an ultrasonic probe. FIG. 6 is a development view showing a connection portion of an ultrasonic probe, an FPC board, and their connection according to a second embodiment. FIG. 10 is an explanatory diagram showing micro pins and pads according to a third embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Subject 10 Piezoelectric plate 20, 21 Connection part 30, 90, 99 FPC board 31, 91 Conductor pattern 29, 32, 33, 34, 201 Pad 40 Switching circuit 50 Cable 60, 62-64, 66 Micro pin 67 Bending part 68, 81 Pedestal part 69 Contact part 70 Piezoelectric plate block 71 Backing material 72 Matching layer 80 Metal rod part 82, 83 Electrode 101 Ultrasonic probe 102 Transmission / reception part 103 Image processing part 104 Cine memory part 105 Image display control part 106 Display part 107 Input unit 108 Control unit 202 Through hole

Claims (10)

A piezoelectric plate made of a piezoelectric element that transmits or receives ultrasonic waves;
A printed circuit board including a conductor pattern that transmits a drive signal of the piezoelectric element that transmits the ultrasonic wave or an induced signal that is induced in the piezoelectric element by receiving the ultrasonic wave;
A connecting portion having a micro pin including a metal rod for electrically connecting the piezoelectric element and the conductor pattern on a side surface orthogonal to a plate surface that transmits or receives the ultrasonic wave of the piezoelectric plate;
Ultrasound probe equipped with.   The connection portion includes the micro pin for each of the piezoelectric plate blocks when the piezoelectric plate includes a plurality of piezoelectric plate blocks arranged in an array in a scanning direction along the side surface. Item 2. The ultrasonic probe according to Item 1.   The ultrasonic probe according to claim 2, wherein the printed board includes the plurality of conductor patterns that are individually electrically connected to the piezoelectric plate block via the metal rod.   The ultrasonic probe according to claim 3, wherein the micropin has a structure in which the metal rod is bent.   The ultrasonic probe according to claim 3, wherein the micro pin has a structure in which the metal rod is curved.   The superposition according to any one of claims 3 to 5, wherein a connection position of the conductive pattern with the metal rod of the printed board differs in the plate surface direction for each adjacent piezoelectric plate block. Sonic probe.   The ultrasonic probe according to claim 1, wherein the piezoelectric element is made of a composite piezoelectric material. An ultrasound probe that transmits and receives ultrasound with the subject;
A transmitting / receiving unit that transmits and receives electrical signals to and from the ultrasonic probe;
An image processing unit that generates image information from the received ultrasonic echoes of the transceiver unit;
Display means for displaying the image information;
An ultrasound imaging apparatus comprising:
The ultrasonic probe includes a piezoelectric plate made of a piezoelectric element that transmits and receives the ultrasonic waves, a printed board that transmits the electrical signal, and a metal rod that electrically connects the piezoelectric element and the printed board. Having a connection with micro pins,
The ultrasonic imaging apparatus, wherein the connection unit includes the micro pin on a side surface orthogonal to a plate surface of the piezoelectric plate that transmits and receives the ultrasonic wave. A micro pin including a metal rod is attached to a side surface perpendicular to the plate surface for transmitting and receiving ultrasonic waves of a piezoelectric plate made of a piezoelectric element for transmitting and receiving ultrasonic waves,
The metal rod is electrically connected to a conductor pattern on a printed board that transmits at least one of a drive signal of the piezoelectric element that transmits the ultrasonic wave and an induced signal that is induced in the piezoelectric element by receiving the ultrasonic wave. An ultrasonic probe manufacturing method to be connected.   The ultrasonic probe manufacturing method according to claim 9, wherein the micro pin is attached to the side surface using an adhesive.

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