JP4470046B2 - Optical pickup - Google Patents

Optical pickup Download PDF

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JP4470046B2
JP4470046B2 JP2005026144A JP2005026144A JP4470046B2 JP 4470046 B2 JP4470046 B2 JP 4470046B2 JP 2005026144 A JP2005026144 A JP 2005026144A JP 2005026144 A JP2005026144 A JP 2005026144A JP 4470046 B2 JP4470046 B2 JP 4470046B2
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base body
wiring board
flexible wiring
area
element mounting
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JP2006216131A (en
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一弥 須藤
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Description

本発明は、光学式ピックアップ、特に、光学系の光路に介在される光学素子を、仮止め後に接着剤を用いてベース体に固定保持させてある光学式ピックアップに関する。   The present invention relates to an optical pickup, and more particularly to an optical pickup in which an optical element interposed in an optical path of an optical system is fixed and held on a base body using an adhesive after temporary fixing.

光学式ピックアップは、DVD装置などに組み込まれて記録媒体としてのディスクの記録面を光学的に走査することなどに用いられている。この種の光学式ピックアップでは、ディスクの径方向に走行駆動されるベース体に光学系が搭載されている。図6はこの光学系の説明図である。図6において、1は光源としての光学素子である発光ダイオード(発光素子)、2は回折格子、3はハーフミラー、4はコリメータレンズ、5は対物レンズ、6は受光素子、7は光強度検出センサーをそれぞれ示していて、これらの光学素子のうち、発光ダイオード1、回折格子2、ハーフミラー3、コリメータレンズ4及び受光素子6がベース体10の定位置に固定されているのに対し、対物レンズ5はディスクDに対するフォーカス方向及びトラッキング方向に変位制御されるようになっている。   An optical pickup is incorporated in a DVD device or the like and used for optically scanning a recording surface of a disk as a recording medium. In this type of optical pickup, an optical system is mounted on a base body that is driven to run in the radial direction of the disk. FIG. 6 is an explanatory diagram of this optical system. In FIG. 6, 1 is a light emitting diode (light emitting element) which is an optical element as a light source, 2 is a diffraction grating, 3 is a half mirror, 4 is a collimator lens, 5 is an objective lens, 6 is a light receiving element, and 7 is light intensity detection. A sensor is shown, and among these optical elements, a light emitting diode 1, a diffraction grating 2, a half mirror 3, a collimator lens 4 and a light receiving element 6 are fixed at fixed positions of the base body 10, whereas The displacement of the lens 5 is controlled in the focus direction and the tracking direction with respect to the disk D.

この光学系では、発光素子1からの投射光が、回折格子2、ハーフミラー3、コリメータレンズ4及び対物レンズ5を経て記録媒体としてのディスクDの記録面に照射され、その反射光が、コリメータレンズ4及びハーフミラー3を経て受光素子6に導かれる。また、光強度検出センサー7は光学素子としての受光素子によって構成されていて、発光ダイオード1から投射された光がその光強度検出センサー7によって検知されると、その検知信号が図示していない制御回路で処理され、その制御回路からの出力信号によって発光ダイオード1からの投射光の強度が適切にフィードバック制御されるようになっている。   In this optical system, the projection light from the light emitting element 1 is irradiated on the recording surface of the disk D as a recording medium via the diffraction grating 2, the half mirror 3, the collimator lens 4 and the objective lens 5, and the reflected light is reflected on the collimator. The light is guided to the light receiving element 6 through the lens 4 and the half mirror 3. Further, the light intensity detection sensor 7 is constituted by a light receiving element as an optical element, and when the light projected from the light emitting diode 1 is detected by the light intensity detection sensor 7, the detection signal is not illustrated. The intensity of the projection light from the light emitting diode 1 is appropriately feedback controlled by an output signal from the control circuit.

従来の光学式ピックアップにおいて、上記光強度検出センサー7は図7に示した構造でベース体10に固着されていた。すなわち、図7はベース体10に対する光強度検出センサー7の取付け部分の構造を示した平面図である。図7において、50はフレキシブル配線基板(FPC)を示し、このフレキシブル配線基板50には引廻し領域51と素子取付領域52とが連続して区画形成されていて、補強プレート53によって補強された素子取付領域52に光強度検出センサー7が重なり状に搭載されている。また、同図のベース体10は開口11を備えていて、その開口11の相対向する一対の辺部12,13のうち、片側辺部12に凹所14を備える取付部15が形成されていて、その取付部15の凹所14に上記光強度検出センサー7を嵌合した状態で、フレキシブル配線基板50の素子取付領域52が図示していない接着剤によってその取付部15に接合固定されている。   In the conventional optical pickup, the light intensity detection sensor 7 is fixed to the base body 10 with the structure shown in FIG. That is, FIG. 7 is a plan view showing a structure of a portion where the light intensity detection sensor 7 is attached to the base body 10. In FIG. 7, reference numeral 50 denotes a flexible wiring board (FPC). In this flexible wiring board 50, a routing area 51 and an element mounting area 52 are continuously formed and are reinforced by a reinforcing plate 53. The light intensity detection sensor 7 is mounted on the attachment region 52 in an overlapping manner. Moreover, the base body 10 of the same figure is provided with the opening 11, and the attachment part 15 which has the recess 14 in the one side part 12 among the pair of side parts 12 and 13 which the opening 11 opposes is formed. Then, in a state where the light intensity detection sensor 7 is fitted in the recess 14 of the mounting portion 15, the element mounting region 52 of the flexible wiring board 50 is bonded and fixed to the mounting portion 15 with an adhesive (not shown). Yes.

このような従来の光学式ピックアップでは、光強度検出センサー7をベース10の取付部15に取り付ける工程において、フレキシブル配線基板50の引廻し領域51の中間部イを図示のように折り曲げて素子取付領域52をベース10の開口11に嵌めること、開口11に嵌まった素子取付領域52に搭載されている光強度検出センサー7を取付部15の凹所14に嵌合させること、取付部15の凹所14に嵌合させた光強度検出センサー7がフレキシブル配線基板50の折曲り箇所の復元力によって凹所14から跳ね出ないように押さえ付けた仮止め状態を保って素子取付領域52を取付部15に接着剤で接合固定すること、などが行われていた。   In such a conventional optical pickup, in the step of attaching the light intensity detection sensor 7 to the attachment part 15 of the base 10, the intermediate part A of the routing area 51 of the flexible wiring board 50 is bent as shown in the figure. 52 is fitted into the opening 11 of the base 10, the light intensity detection sensor 7 mounted in the element mounting region 52 fitted into the opening 11 is fitted into the recess 14 of the mounting portion 15, and the mounting portion 15 is recessed. The light intensity detection sensor 7 fitted in the place 14 is held in a temporarily fixed state so that it does not jump out of the recess 14 by the restoring force of the bent portion of the flexible wiring board 50, and the element attachment region 52 is attached to the attachment portion. 15 is bonded and fixed with an adhesive.

一方、制御信号をフレキシブル配線基板を介して伝達するようになっている光学式ピックアップ装置において、フレキシブル配線基板の曲り剛性を高めるためにそのフレキシブル配線基板を幅方向において湾曲させ、その湾曲させた部分を固定フレームの座面に固定するという技術が従来公知である(たとえば特許文献1参照)。   On the other hand, in an optical pickup device configured to transmit a control signal via a flexible wiring board, the flexible wiring board is bent in the width direction in order to increase the bending rigidity of the flexible wiring board, and the curved portion A technique for fixing the frame to the seating surface of the fixed frame is conventionally known (see, for example, Patent Document 1).

実用新案登録第3089877号公報Utility Model Registration No. 3089877

図7を参照して説明した従来の光ピックアップでは、上記したように、光強度検出センサー7の取付工程において、ベース体10の取付部15の凹所14に嵌合させた光強度検出センサー7を仮止めするときに、その光強度検出センサー7がフレキシブル配線基板50の中間部イの折曲り箇所の復元力によって凹所14から跳ね出ないように押さえ付けておくことが要求されるため、そのような仮止めを経て接着剤でフレキシブル配線基板50の素子取付領域52を取付部15に接合固定するまでの工程が煩雑で熟練を必要とするという問題があった。また、これに加えて、接着剤で接合固定して取付工程を終了した後においても、凹所14から光強度検出センサー7を跳ね出そうとする方向の力Fが、フレキシブル配線基板50の折曲り箇所の復元力によってその接合固定箇所に加わったままになっているので、経時などの要因で接着剤が劣化した場合などにフレキシブル配線基板50の素子取付領域52が取付部15から剥がれて光強度検出センサー7が位置ずれしたり、場合によっては凹所14から外れてしまったりするというおそれがあった。   In the conventional optical pickup described with reference to FIG. 7, as described above, the light intensity detection sensor 7 fitted in the recess 14 of the attachment portion 15 of the base body 10 in the attachment process of the light intensity detection sensor 7. Is temporarily pressed so that the light intensity detection sensor 7 does not jump out of the recess 14 due to the restoring force of the bent portion of the intermediate portion A of the flexible wiring board 50. There is a problem that the process from such temporary fixing to bonding and fixing the element mounting region 52 of the flexible wiring board 50 to the mounting portion 15 with an adhesive is complicated and requires skill. In addition to this, even after the attachment process is completed by bonding and fixing with an adhesive, the force F in the direction of jumping out the light intensity detection sensor 7 from the recess 14 causes the flexible wiring board 50 to bend. Since the bent portion is restored by the restoring force of the bent portion, the element mounting region 52 of the flexible wiring board 50 is peeled off from the mounting portion 15 when the adhesive deteriorates due to factors such as aging. There is a possibility that the intensity detection sensor 7 may be displaced or may be detached from the recess 14 in some cases.

そこで、この点を改善するために、接着剤の使用量を増やすという対策を講じることがあったけれども、そのような対策は根本的な解決策とはなり得なかった。また、フレキシブル配線基板をビス止めしたり他の部品を追加して固定したりすることも従来行われていたけれども、それらのビスや他の部品が余分に必要になって構造の複雑化や部品コストの上昇を伴うので好ましくない。   Thus, in order to improve this point, there has been a measure of increasing the amount of adhesive used, but such a measure cannot be a fundamental solution. In addition, it has been conventional to fix the flexible wiring board with screws or add other parts, but these screws and other parts are necessary and the structure becomes complicated and the parts This is not preferable because it increases costs.

一方、上掲の特許文献1によって提案されている技術を利用してフレキシブル配線基板50の曲り剛性を高め、そうすることによって、凹所14から光強度検出センサー7を跳ね出そうとする方向の力Fを発生させないようにすることが考えられるけれども、光強度検出センサー7を搭載したフレキシブル配線基板50ではその引廻しスペースがきわめて狭く制限されていることなどを勘案するとそれには無理がある。   On the other hand, the bending strength of the flexible wiring board 50 is increased by using the technique proposed by the above-mentioned Patent Document 1, and by doing so, the light intensity detection sensor 7 is urged to jump out of the recess 14. Although it is conceivable that the force F is not generated, the flexible wiring board 50 on which the light intensity detection sensor 7 is mounted cannot be considered in view of the fact that the routing space is extremely narrow.

本発明は以上の問題や状況に鑑みてなされたものであり、接着剤の使用量を増やしたり、ビスや他の部品を追加したりすることなく、光強度検出センサーなどの光学素子の仮止めが容易かつ確実に行われるようになり、しかも、取付工程を終了した後においては、接着剤の劣化などに起因する光学素子の剥がれや脱落が生じにくくなる光学式ピックアップを提供することを目的とする。   The present invention has been made in view of the above problems and circumstances, and temporarily fixing an optical element such as a light intensity detection sensor without increasing the amount of adhesive used or adding screws or other parts. It is an object of the present invention to provide an optical pickup that can be easily and reliably performed, and that is less likely to peel off or drop off of an optical element due to deterioration of an adhesive after the attachment process is completed. To do.

また、本発明は、特に光学素子としての光強度検出センサーの仮止めを容易に行うことができ、また、光強度検出センサーが取付け後に剥がれたり脱落したりすることを防ぐことのできる光学式ピックアップを提供することを目的とする。   Further, the present invention is an optical pickup that can easily temporarily fix a light intensity detection sensor as an optical element in particular and can prevent the light intensity detection sensor from being peeled off or dropped after being attached. The purpose is to provide.

本発明に係る光学式ピックアップでは、ベース体に取り付けられたフレキシブル配線基板に引廻し領域と素子取付領域とが連続して区画形成されていて、その素子取付領域に、上記ベース体の取付部に配置されて光学系の光路に介在されている光学素子が搭載されている。そして、上記取付部に、フレキシブル配線基板の素子取付領域に重なり状に取り付けられた上記光学素子が嵌合する凹所と、その凹所の周囲に位置する平坦な門形の受面とが備わり、上記フレキシブル配線基板の素子取付領域を引廻し領域側に折り返してその引廻し領域に間隔を隔てて対向させていると共に、その引廻し領域の上記素子取付領域との対向箇所に上記ベース体に設けたバックアップ部を当接させることにより、フレキシブル配線基板の折返し箇所の復元力で上記素子取付領域を上記ベース体の取付部の上記受面に弾圧させてあると共に、上記受面に弾圧されている上記素子取付領域に補強プレートが重なり状に接合され、かつ、上記素子取付領域が接着剤で上記取付部に接合固定されるようになっている。 In the optical pickup according to the present invention, the routing area and the element mounting area are continuously formed on the flexible wiring board attached to the base body, and the element mounting area includes the mounting portion of the base body. An optical element that is disposed and interposed in the optical path of the optical system is mounted. The mounting portion includes a recess in which the optical element mounted in an overlapping manner on the element mounting region of the flexible wiring board is fitted, and a flat gate-shaped receiving surface positioned around the recess. , together are the lead-to are opposed at intervals in the region folded element mounting region of the flexible wiring board to the lead-to area side, to the base body in opposite positions between the element attachment area of the lead-to region By abutting the provided backup part, the element mounting region is elastically pressed against the receiving surface of the mounting part of the base body by the restoring force of the folded portion of the flexible wiring board, and is also pressed by the receiving surface. A reinforcing plate is joined in an overlapping manner to the element attachment region, and the element attachment region is joined and fixed to the attachment portion with an adhesive.

この構成であれば、フレキシブル配線基板の素子取付領域を引廻し領域側に折り返すことによって形成される折返し箇所の復元力がその素子取付領域をベース体の取付部に弾圧させることに利用され、その復元力によって素子取付領域に搭載されている光学素子がベース体の取付部に外れないように保持される。そのため、光学素子がベース体の取付部にビスや別の部品を用いずに確実に仮止めされる。また、仮止め後に接着剤を塗布して上記素子取付領域をベース体の取付部に接合固定した後において、経時的要因などによって接着剤が劣化したとしても、光学素子がベース体の取付部から剥がれたり脱落したりしにくくなる。   With this configuration, the restoring force of the folded portion formed by turning the element mounting area of the flexible wiring board and folding it back to the area side is used to compress the element mounting area on the mounting portion of the base body. The optical element mounted in the element attachment region is held by the restoring force so as not to be detached from the attachment portion of the base body. Therefore, the optical element is securely temporarily fixed to the mounting portion of the base body without using screws or other parts. In addition, after applying the adhesive after temporary fixing and bonding and fixing the element mounting area to the mounting portion of the base body, even if the adhesive deteriorates due to factors over time, the optical element is removed from the mounting portion of the base body. It becomes difficult to peel off or fall off.

本発明では、上記ベース体に具備された開口の相対向する一対の辺部のうちの片側辺部に上記取付部が、他側辺部に上記バックアップ部が、それぞれ設けられていて、それらの取付部とバックアップ部との対向空間に、上記フレキシブル配線基板の素子取付領域と引廻し領域の素子取付領域との対向箇所とが収容されていることが望ましい。これによれば、フレキシブル配線基板の素子取付領域と引廻し領域の素子取付領域との対向箇所とをベース体の開口に嵌め込んで取付部とバックアップ部との間に収容するという作業を行うだけで、フレキシブル配線基板の折返し箇所の復元力でバックアップ部がフレキシブル配線基板の上記対向箇所に当接し、上記素子取付領域が上記ベース体の取付部に弾圧して光学素子が仮止めされる。したがって光学式ピックアップの量産性を高めることに役立つ。   In the present invention, the mounting portion is provided on one side of the pair of opposing sides of the opening provided in the base body, and the backup portion is provided on the other side, respectively. It is desirable that an opposing space between the mounting portion and the backup portion accommodates a portion where the element mounting region of the flexible wiring board faces the element mounting region of the routing region. According to this, only the operation of fitting the element mounting area of the flexible wiring board and the element mounting area of the routing area into the opening of the base body and accommodating between the mounting part and the backup part is performed. Thus, the back-up portion comes into contact with the opposing portion of the flexible wiring substrate by the restoring force of the folded portion of the flexible wiring substrate, and the element mounting region is pressed against the mounting portion of the base body to temporarily fix the optical element. Therefore, it helps to increase the mass productivity of the optical pickup.

本発明に係る光学式ピックアップは、ベース体に取り付けられたフレキシブル配線基板に引廻し領域と素子取付領域とが連続して区画形成されていて、その素子取付領域に、上記ベース体の取付部に配置されて光学系の光路に介在されている光学素子が搭載されている光学式ピックアップにおいて、上記ベース体に具備された開口の相対向する一対の辺部のうちの片側辺部に、フレキシブル配線基板の素子取付領域に重なり状に取り付けられた上記光学素子が嵌合する門形の凹所とその凹所の周囲に位置して上記素子取付領域が弾圧される平坦な受面とを備える上記取付部が設けられているのに対し、他側辺部に上記片側辺部に向けて円弧状に張り出したバックアップ部が設けられ、上記フレキシブル配線基板の引廻し領域側に折り返されてその引廻し領域に間隔を隔てて対向させた上記素子取付領域と上記引廻し領域の素子取付領域との対向箇所とを上記ベース体の取付部とパックアップ部との対向空間に収容させることによって上記取付部の凹所に上記光学素子を嵌合し、かつ、上記対向箇所に上記バックアップ部を当接させることによりフレキシブル配線基板の折返し箇所の復元力で上記素子取付領域を上記取付部の受面に弾圧させてあると共に、上記素子取付領域に補強プレートが重なり状に接合されており、上記光学素子が光学系の光源としての発光ダイオードから出た光ビームの強度を検出することに用いられる受光素子である、という構成を採用することによっていっそう具体化される。この発明の作用は後述する実施形態を参照して詳細に説明する。   In the optical pickup according to the present invention, a routing area and an element mounting area are continuously formed on the flexible wiring board attached to the base body, and the element mounting area includes a mounting portion of the base body. In an optical pickup in which an optical element disposed and interposed in an optical path of an optical system is mounted, flexible wiring is provided on one side of a pair of opposing sides of the opening provided in the base body. A gate-shaped recess in which the optical element mounted in an overlapping manner on the element mounting region of the substrate fits, and a flat receiving surface positioned around the recess and pressed against the element mounting region. Whereas the mounting part is provided, the other side part is provided with a backup part projecting in an arc shape toward the one side part, and is folded back to the routing area side of the flexible wiring board. By accommodating the element mounting area opposed to the routing area of the wiring body at a distance and the facing portion of the routing area between the element mounting area and the mounting area of the base body and the pack-up section. By fitting the optical element into the recess of the mounting part and bringing the backup part into contact with the opposite part, the element mounting area is received by the mounting part with the restoring force of the folded part of the flexible wiring board. The surface is elastically pressed and a reinforcing plate is joined to the element mounting region in an overlapping manner, and the optical element is used to detect the intensity of a light beam emitted from a light emitting diode as a light source of an optical system. The present invention is further embodied by adopting the configuration of being a light receiving element. The effect | action of this invention is demonstrated in detail with reference to embodiment mentioned later.

本発明によれば、光強度検出センサーなどの光学素子の取付工程において、フレキシブル配線基板を折り返すことによって形成される折返し箇所の復元力を利用して、光学素子、たとえば光強度検出センサーを搭載したフレキシブル配線基板の素子取付領域がベース体の取付部の平坦な受面に弾圧され、上記受面に弾圧されている上記素子取付領域に補強プレートが重なり状に接合され、かつ、上記素子取付領域が接着剤で上記取付部に接合固定されるようになっているので、光強度検出センサーの仮止めのためにビスや別の部品を用いる必要がないだけでなく、接着剤によって接合固定した後においても上記復元力が光強度検出センサーを初期の位置に留めようとする作用を発揮するので、経時による接着剤の劣化が生じたとしても光強度検出センサーが容易に早期に位置ずれしたり脱落したりするという事態が起こらなくなる。そのため、初期の光学性能が長期に亘って維持される光学式ピックアップを安価に提供することができるようになり、このことはユーザにとっても有益である。 According to the present invention, in the process of attaching an optical element such as a light intensity detection sensor, an optical element, for example, a light intensity detection sensor, is mounted by utilizing the restoring force of the folded portion formed by folding the flexible wiring board. The element mounting area of the flexible wiring board is elastically pressed against the flat receiving surface of the mounting portion of the base body, and a reinforcing plate is joined to the element mounting area pressed against the receiving surface in an overlapping manner, and the element mounting area Since it is designed to be bonded and fixed to the mounting part with an adhesive, it is not necessary to use screws or other parts to temporarily fix the light intensity detection sensor, but also after bonding and fixing with an adhesive In this case, the restoring force exerts an action to keep the light intensity detection sensor in the initial position, so even if the adhesive deteriorates over time, the light intensity Situation that out sensor is easily or fall off or displaced in the early stage will not occur. Therefore, an optical pickup whose initial optical performance can be maintained for a long time can be provided at a low cost, which is also beneficial for the user.

図1は本発明の実施形態に係る光学式ピックアップの外観斜視図、図2は図1の光学式ピックアップのベース体10を下側から見て示した部分斜視図、図3はフレキシブル配線基板50の展開図、図4は図2に示したベース体10に取り付けられる形態のフレキシブル配線基板50を示した斜視図、図5は図1の光学式ピックアップを上側から見て示した部分平面図である。   1 is an external perspective view of an optical pickup according to an embodiment of the present invention, FIG. 2 is a partial perspective view of a base body 10 of the optical pickup of FIG. 1 viewed from below, and FIG. FIG. 4 is a perspective view showing a flexible wiring board 50 attached to the base body 10 shown in FIG. 2, and FIG. 5 is a partial plan view showing the optical pickup shown in FIG. is there.

図1のように、この光学式ピックアップでは、主軸101と副軸102とによってディスクの径方向に走行が案内されるベース体10に、図6を参照して説明したものと同様の光学系が装備されている。なお、図6の対物レンズ5を備えるアクチュエータは図1では図示省略してある。   As shown in FIG. 1, in this optical pick-up, an optical system similar to that described with reference to FIG. 6 is provided on a base body 10 whose travel is guided in the radial direction of the disk by a main shaft 101 and a sub shaft 102. Equipped. Note that the actuator including the objective lens 5 of FIG. 6 is omitted in FIG.

ベース体10には、対物レンズ5(図6参照)に臨む光通過孔16が開設されているほか、基本形状が矩形の開口20が開設されていて、この開口20の相対向する一対の辺部のうちの片側辺部21に、光学素子としての光強度検出センサー7が取り付けられる取付部22が備わっているのに対し、他側辺部26の中央に、上記片側辺部21に向けて円弧状に張り出したバックアップ部27が備わっている。そして、ベース体10を下側から見て示した図2によって判るように、上記取付部22は門形に形成された凹所23とその凹所23の周囲に位置する平坦な門形の受面24とを備えている。   The base body 10 is provided with a light passage hole 16 facing the objective lens 5 (see FIG. 6), and an opening 20 having a rectangular basic shape, and a pair of opposite sides of the opening 20. One side part 21 of the part is provided with a mounting part 22 to which the light intensity detection sensor 7 as an optical element is attached, whereas the other side part 26 is centered toward the one side part 21. A backup unit 27 that projects in an arc shape is provided. As can be seen from FIG. 2 showing the base body 10 as viewed from below, the mounting portion 22 has a recess 23 formed in a gate shape and a flat gate-shaped receiving portion positioned around the recess 23. Surface 24.

図3のように、展開状態のフレキシブル配線基板50は、制御回路を搭載している主部55と、この主部55から延び出た略L字形の引廻し領域51と、この引廻し領域51の先端に連続する素子取付領域52とに区画形成されていて、素子取付領域52の表側に光強度検出センサー7が搭載され、その裏側に補強プレート53が装着されている。   As shown in FIG. 3, the unfolded flexible wiring board 50 includes a main portion 55 on which a control circuit is mounted, a substantially L-shaped routing area 51 extending from the main portion 55, and the routing area 51. The light intensity detection sensor 7 is mounted on the front side of the element mounting region 52, and the reinforcing plate 53 is mounted on the back side thereof.

光強度検出センサー7の取付工程において、その光強度検出センサー7をベース体10の取付部22に仮止めする工程は次の手順で行われる。すなわち、図4のように、フレキシブル配線基板50の引廻し領域51の基部51aを主部55に対して略直角に折り曲げてその主部55を図2に示したベース体10の制御回路装着部17に固定した状態で、引廻し領域51を湾曲形状に折り曲げてベース体10の下側に引き廻す。また、図4によって類推することができるように、素子取付領域52をその根元52aで引廻し領域51側に折り返して引廻し領域51に対向させ、その状態で、図5のように、素子取付領域52と引廻し領域51の素子取付領域52との対向箇所51’とのそれぞれの上端部(図4では下側の端部)を上記開口20に下側から嵌合してそれらを上記取付部22とバックアップ部27との対向空間に収容させる。併せて、光強度検出センサー7を門形の取付部22の凹所23に嵌め込んで位置決めすると共に、その光強度検出センサー7が搭載されているフレキシブル配線基板50の素子取付領域52の表面を上記取付部22の平坦な受面24に重ね合わせる。   In the step of attaching the light intensity detection sensor 7, the step of temporarily fixing the light intensity detection sensor 7 to the attachment portion 22 of the base body 10 is performed according to the following procedure. That is, as shown in FIG. 4, the base portion 51a of the routing area 51 of the flexible wiring board 50 is bent at a substantially right angle with respect to the main portion 55, and the main portion 55 is bent to the control circuit mounting portion of the base body 10 shown in FIG. In a state of being fixed to 17, the drawing area 51 is bent into a curved shape and drawn to the lower side of the base body 10. Further, as can be inferred from FIG. 4, the element mounting region 52 is routed at its root 52a, folded back toward the region 51, and opposed to the routing region 51. In this state, as shown in FIG. The upper end portions (the lower end portions in FIG. 4) of the region 52 and the portion 51 ′ facing the element mounting region 52 of the routing region 51 are fitted into the opening 20 from the lower side, and they are mounted as described above. The unit 22 is accommodated in a facing space between the backup unit 27 and the backup unit 27. At the same time, the light intensity detection sensor 7 is fitted and positioned in the recess 23 of the gate-shaped attachment portion 22, and the surface of the element attachment region 52 of the flexible wiring board 50 on which the light intensity detection sensor 7 is mounted. It overlaps with the flat receiving surface 24 of the mounting portion 22.

ところで、フレキシブル配線基板50は、それ本来の特性として折曲り箇所や折返し箇所を形成した場合にその折曲り箇所や折返し箇所が復元力によって開く性質を有している。したがって、上記のように、素子取付領域52と上記対向箇所51’とを取付部22とバックアップ部27との対向空間に収容させた場合には、素子取付領域52の根元52aの折返し箇所ロが復元力で開いて上記対向箇所51’にバックアップ部27が当接するので、その反作用によって素子取付領域52が図5矢印F1のように弾性的に付勢されて取付部22の受面24に弾圧する。このため、素子取付領域52に搭載されている光り強度検出センサー7が取付部22の凹所14に嵌まり込んで位置決めされている状態がそのまま維持されるようになる。   By the way, the flexible wiring board 50 has a property that when a bent part or a folded part is formed, the bent part or the folded part is opened by a restoring force. Therefore, as described above, when the element mounting region 52 and the facing portion 51 ′ are accommodated in the facing space between the mounting portion 22 and the backup portion 27, the folded portion b of the root 52 a of the element mounting region 52 is reduced. Since the backup portion 27 is brought into contact with the facing portion 51 ′ by opening with the restoring force, the element mounting region 52 is elastically biased by the reaction as shown by the arrow F1 in FIG. 5 and is elastically pressed against the receiving surface 24 of the mounting portion 22. To do. For this reason, the state where the light intensity detection sensor 7 mounted in the element attachment region 52 is fitted and positioned in the recess 14 of the attachment portion 22 is maintained as it is.

上記のように、フレキシブル配線基板50の折返し箇所ロの復元力により素子取付領域52が取付部22の平坦な受面24に弾圧されて光強度検出センサー7が凹所23に嵌まり込んで位置決めされていると、次工程で接着剤を塗布して素子取付領域52を取付部22に接合固定するときに、素子取付領域52を人為的に位置決めするという煩わしい操作を行う必要がなくなって接着剤を塗布する作業を容易にかつ熟練をそれほど必要とせずに正確に行うことができるようになる。また、接着剤を塗布して光強度検出センサー7の取付工程が終了した後においても、上記折返し箇所ロの復元力によって素子取付領域52が取付部22の平坦な受面24に弾圧されているという状態がそのまま維持されるので、仮に経時的な要因によって接着剤が劣化したとしても、素子取付領域52が取付部22から剥がれて光強度検出センサー7が位置ずれしたり凹所23から脱落したりするという事態が起こりにくくなり、光強度検出センサー7の初期の性能が長期に亘って保たれ、当該光学式ピックアップによる初期の書込み精度や読込み精度が低下しなくなる。このことにより、ユーザにとっては、DVD装置などで高品質の画像を長期に亘って楽しむことが可能になる。   As described above, the element mounting region 52 is elastically pressed against the flat receiving surface 24 of the mounting portion 22 by the restoring force of the folded portion B of the flexible wiring board 50, and the light intensity detection sensor 7 is fitted into the recess 23 for positioning. In this case, it is not necessary to perform the troublesome operation of artificially positioning the element attachment region 52 when the element attachment region 52 is bonded and fixed to the attachment portion 22 by applying an adhesive in the next step. The application | coating operation | work can be accurately performed easily and without requiring much skill. In addition, even after the adhesive is applied and the mounting process of the light intensity detection sensor 7 is completed, the element mounting region 52 is pressed against the flat receiving surface 24 of the mounting portion 22 by the restoring force of the folded portion b. Therefore, even if the adhesive deteriorates due to factors over time, the element attachment region 52 is peeled off from the attachment portion 22 and the light intensity detection sensor 7 is displaced or falls out of the recess 23. The initial performance of the light intensity detection sensor 7 is maintained over a long period of time, and the initial writing accuracy and reading accuracy by the optical pickup are not lowered. As a result, the user can enjoy high-quality images over a long period of time on a DVD device or the like.

この実施形態では、ベース体10側に設けられるバックアップ部27を円弧状に張り出す形状に形成してあるので、そのバックアップ部27の両側に、取付部22とバックアップ部27との対向空間の広さに比べて比較的広い空間が確保されている。そのため、光強度検出センサー7を仮止めするために素子取付領域52と上記対向箇所51’とを取付部22とバックアップ部27との対向空間に収容させる作業を行うときに、素子取付領域52と上記対向箇所51’とをバックアップ部27の両側の広い空間を活用して取付部22とバックアップ部27との対向空間に導き入れることができるようになってそれだけ仮止め作業が容易になるという利点がある。   In this embodiment, since the backup portion 27 provided on the base body 10 side is formed in a shape projecting in an arc shape, the opposing space between the mounting portion 22 and the backup portion 27 is wide on both sides of the backup portion 27. A relatively wide space is secured. Therefore, when the work for housing the element mounting region 52 and the facing portion 51 ′ in the facing space between the mounting portion 22 and the backup portion 27 to temporarily fix the light intensity detection sensor 7 is performed, The advantage that the facing portion 51 ′ can be introduced into the facing space between the mounting portion 22 and the backup portion 27 using the wide space on both sides of the backup portion 27, and the temporary fixing work is facilitated accordingly. There is.

なお、図1〜図5では、図6又は図7について説明した要素と同一又は相応する要素に同一符号を付してある。   1 to 5, the same reference numerals are given to elements that are the same as or correspond to the elements described with reference to FIG. 6 or FIG. 7.

本発明の実施形態に係る光学式ピックアップの外観斜視図である。1 is an external perspective view of an optical pickup according to an embodiment of the present invention. 図1の光学式ピックアップのベース体を下側から見て示した部分斜視図である。It is the fragmentary perspective view which looked and showed the base body of the optical pick-up of FIG. 1 from the lower side. フレキシブル配線基板の展開図である。It is an expanded view of a flexible wiring board. 図2に示したベース体に取り付けられる形態のフレキシブル配線基板を示した斜視図である。It is the perspective view which showed the flexible wiring board of the form attached to the base body shown in FIG. 図1の光学式ピックアップを上側から見て示した部分平面図である。FIG. 2 is a partial plan view showing the optical pickup of FIG. 1 as viewed from above. 光学系の説明図である。It is explanatory drawing of an optical system. 従来例についてのベース体に対する光強度検出センサーの取付け部分の構造を示した平面図である。It is the top view which showed the structure of the attachment part of the light intensity detection sensor with respect to the base body about a prior art example.

1 発光ダイオード
7 光強度検出センサー(光学素子)
10 ベース体
20 開口
21 開口の片側辺部
22 取付部
23 凹所
24 受面
26 開口の他側辺部
27 バックアップ部
50 フレキシブル配線基板
51 引廻し領域
51’ 引廻し領域の素子取付領域との対向箇所
52 素子取付領域
53 補強プレート
ロ フレキシブル配線基板の折返し箇所
1 Light-emitting diode 7 Light intensity detection sensor (optical element)
DESCRIPTION OF SYMBOLS 10 Base body 20 Opening 21 One side part of opening 22 Mounting part 23 Recessed part 24 Receiving surface 26 Other side part of opening 27 Backup part 50 Flexible wiring board 51 Leading area 51 'Opposition to element attachment area Location 52 Element mounting area 53 Reinforcement plate B Flexible circuit board folded-back location

Claims (3)

ベース体に取り付けられたフレキシブル配線基板に引廻し領域と素子取付領域とが連続して区画形成されていて、その素子取付領域に、上記ベース体の取付部に配置されて光学系の光路に介在されている光学素子が搭載されている光学式ピックアップにおいて、
上記ベース体に具備された開口の相対向する一対の辺部のうちの片側辺部に、フレキシブル配線基板の素子取付領域に重なり状に取り付けられた上記光学素子が嵌合する門形の凹所とその凹所の周囲に位置して上記素子取付領域が弾圧される平坦な受面とを備える上記取付部が設けられているのに対し、他側辺部に上記片側辺部に向けて円弧状に張り出したバックアップ部が設けられ、
上記フレキシブル配線基板の引廻し領域側に折り返されてその引廻し領域に間隔を隔てて対向させた上記素子取付領域と上記引廻し領域の素子取付領域との対向箇所とを上記ベース体の取付部とパックアップ部との対向空間に収容させることによって上記取付部の凹所に上記光学素子を嵌合し、かつ、上記対向箇所に上記バックアップ部を当接させることによりフレキシブル配線基板の折返し箇所の復元力で上記素子取付領域を上記取付部の受面に弾圧させてあると共に、上記受面に弾圧されている上記素子取付領域に補強プレートが重なり状に接合され、かつ、上記素子取付領域が接着剤で上記取付部に接合固定されるようになっていて、
上記光学素子が光学系の光源としての発光ダイオードから出た光ビームの強度を検出することに用いられる光強度検出センサーであることを特徴とする光学式ピックアップ。
A routing area and an element mounting area are continuously formed on the flexible wiring board mounted on the base body, and the element mounting area is disposed at the mounting portion of the base body and is interposed in the optical path of the optical system. In the optical pickup on which the optical element is mounted,
A gate-shaped recess into which the optical element mounted in an overlapping manner on the element mounting region of the flexible wiring board is fitted to one side of a pair of opposing sides of the opening provided in the base body. And the flat receiving surface on which the element mounting area is pressed against the recess, the mounting portion is provided on the other side, and the circle is directed toward the one side. A back-up part projecting in an arc is provided,
The mounting portion of the base body includes the element mounting region which is folded back to the routing region side of the flexible wiring board and is opposed to the routing region with an interval, and the facing portion of the routing region to the element mounting region. And the back-up portion of the flexible wiring board by fitting the optical element into the recess of the mounting portion and bringing the backup portion into contact with the facing portion. The element mounting region is elastically pressed against the receiving surface of the mounting portion by a restoring force, a reinforcing plate is joined to the element mounting region pressed against the receiving surface in an overlapping manner , and the element mounting region is It is designed to be bonded and fixed to the mounting part with an adhesive,
An optical pickup, wherein the optical element is a light intensity detection sensor used for detecting the intensity of a light beam emitted from a light emitting diode as a light source of an optical system.
ベース体に取り付けられたフレキシブル配線基板に引廻し領域と素子取付領域とが連続して区画形成されていて、その素子取付領域に、上記ベース体の取付部に配置されて光学系の光路に介在されている光学素子が搭載されている光学式ピックアップにおいて、
上記取付部に、フレキシブル配線基板の素子取付領域に重なり状に取り付けられた上記光学素子が嵌合する凹所と、その凹所の周囲に位置する平坦な門形の受面とが備わり、
上記フレキシブル配線基板の素子取付領域を引廻し領域側に折り返してその引廻し領域に間隔を隔てて対向させていると共に、その引廻し領域の上記素子取付領域との対向箇所に上記ベース体に設けたバックアップ部を当接させることにより、フレキシブル配線基板の折返し箇所の復元力で上記素子取付領域を上記ベース体の取付部の上記受面に弾圧させてあると共に、上記受面に弾圧されている上記素子取付領域に補強プレートが重なり状に接合され、かつ、上記素子取付領域が接着剤で上記取付部に接合固定されるようになっていることを特徴とする光学式ピックアップ。
A routing area and an element mounting area are continuously formed on the flexible wiring board mounted on the base body, and the element mounting area is disposed at the mounting portion of the base body and is interposed in the optical path of the optical system. In the optical pickup on which the optical element is mounted,
The mounting portion is provided with a recess in which the optical element mounted in an overlapping manner on the element mounting region of the flexible wiring board is fitted, and a flat gate-shaped receiving surface located around the recess,
The element mounting area of the flexible wiring board is routed back to the area side and is opposed to the routing area with an interval, and provided in the base body at a position facing the element mounting area of the routing area. By bringing the back-up portion into contact, the element mounting region is pressed against the receiving surface of the mounting portion of the base body by the restoring force of the folded portion of the flexible wiring board, and is also pressed against the receiving surface. An optical pickup characterized in that a reinforcing plate is joined to the element attachment area in an overlapping manner, and the element attachment area is joined and fixed to the attachment portion with an adhesive .
上記ベース体に具備された開口の相対向する一対の辺部のうちの片側辺部に上記取付部が、他側辺部に上記バックアップ部が、それぞれ設けられていて、それらの取付部とバックアップ部との対向空間に、上記フレキシブル配線基板の素子取付領域と引廻し領域の素子取付領域との対向箇所とが収容されている請求項2に記載した光学式ピックアップ。   Of the pair of opposing sides of the opening provided in the base body, the attachment portion is provided on one side portion and the backup portion is provided on the other side portion, and the attachment portion and the backup portion are provided. The optical pickup according to claim 2, wherein a portion facing the element mounting region of the flexible wiring board and a device mounting region of the routing region are accommodated in a space facing the portion.
JP2005026144A 2005-02-02 2005-02-02 Optical pickup Expired - Fee Related JP4470046B2 (en)

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JP5213465B2 (en) * 2008-01-22 2013-06-19 キヤノン株式会社 Lens barrel and imaging apparatus using the same
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