JP4451736B2 - Micro resonance device, micro filter device, micro oscillator, and wireless communication device - Google Patents

Description

  The present invention relates to a microresonance device that can be incorporated as a part of an integrated circuit on a substrate, for example, and more particularly to a microfilter device and microoscillator using a microelectromechanical system, and a wireless communication device.

  For example, Non-Patent Document 1 (FDBannon, III, JRClark, and CT-C. Nguyen, IEEE J. Solid-State Circuits, vol. 35, No. .4, pp.512-526, April 2000), using its inherent resonant frequency to accurately pass only that frequency signal and attenuate other frequency signals and noise. Can do. Compared to the case of using other passive elements (capacitors and inductors) or active elements, an extremely narrow band filter (high Q filter) can be realized with an ultra-small size that can be incorporated into an integrated circuit. Yes.

  FIG. 13 shows an example of a microfilter including a microresonator 110 formed of a polysilicon film on a silicon substrate according to the prior art. When the frequency of the AC signal is similar to the resonance frequency of the microresonator 110 due to the AC signal applied to the input end 111, the microresonator 110 vibrates and the selected AC signal is transmitted from the output end 112.

The resonance frequency of the resonator as shown in FIG. 13 is substantially expressed by the following (Equation 1) as shown in Non-Patent Document 1.

Here, k is a constant, ρ is the density of the resonator material, E is the Young's modulus of the resonator material, Lr is the effective length of the resonator, and h is the thickness of the resonator. If polysilicon (E = 150 GPa) is used as the resonator material and the resonator film thickness is 2 μm, a resonator having a resonator length of several tens to several μm can be used, as is apparent from this equation. For example, it can be seen that a frequency in the range of several hundred MHz to GHz is obtained. Here, k is a constant, ρ is the density of the resonator material, E is the Young's modulus of the resonator material, Lr is the effective length of the resonator, and h is the thickness of the resonator. If polysilicon (E = 150 GPa) is used as the resonator material and the resonator film thickness is 2 μm, a resonator having a resonator length of several tens to several μm can be used, as is apparent from this equation. For example, it can be seen that a frequency in the range of several hundred MHz to GHz is obtained.
FDBannon, III, JRClark, and CT-C.Nguyen, IEEE J.Solid-State Circuits, vol.35, No.4, pp.512-526, April 2000

  However, when a resonator having a desired resonance frequency is actually obtained on a substrate by an LSI process, there is a margin of processing accuracy that must be allowed in design even in the LSI process, and resonance occurs according to the margin. There will be variations in the length of the children. Therefore, the inaccuracy of the resonance frequency that cannot be controlled by the processing technique is unavoidable in the completed resonator. This is a serious drawback in fabricating MEMS.

  Furthermore, in polysilicon conventionally used as a MEMS material, it is difficult to make the resonator size smaller than the crystal grain size, and unevenness is formed on the surface of the resonator, resulting in variations in the thickness of the resonator. In addition, since many grain boundaries exist in the resonator and the crystal orientation is not uniform, accurate mechanical characteristics (Young's modulus) cannot be obtained. The internal stress also becomes non-uniform and causes warpage and shrinkage. These non-uniform film thicknesses, variations in mechanical properties, and warp and shrinkage due to stress all cause inaccuracy in the resonance frequency. If it can be measured in a non-destructive manner like the length of the resonator, the finished dimensions can be confirmed with a certain degree of accuracy by the high-performance length measurement technology used in the LSI manufacturing process. Internal stress and non-uniform warpage and shrinkage cannot be accurately confirmed by a non-destructive measurement method in a plane, so that it is difficult to inspect and correct during the manufacturing process.

  Further, in the surface MEMS formed by laminating on the substrate surface, as shown in FIG. 13, the resonator is bent (curvature) or indented 114 by the influence of the support portion of the resonator and the lower electrode, the depression 114, and the convex portion 115. Is formed. These differ in shape depending on the mask alignment shift in the manufacturing process, variations in the processing shape and the deposited film thickness, and the like, which causes variations in the resonance frequency.

  Therefore, an object of the present invention is a microresonance device that can be incorporated as a part of an integrated circuit on a substrate, and even after the resonator is sealed, fluctuations due to variations in processing accuracy of the resonator and variations in sealing pressure are caused. An object of the present invention is to provide a microresonance device that can compensate and adjust a resonance frequency, in particular, a variable frequency microfilter device, a micro oscillator, and a wireless communication device.

In order to solve the above problems, a microresonance device of the present invention changes a frequency response characteristic of a microresonator by mechanically acting on the substrate, a microresonator provided on the substrate, and the microresonator. At least one micro movable part, and a connection part for connecting the micro resonant body and the micro movable part, wherein the micro resonant body, the micro movable part and the connection part are integrally formed at the same time, The connection portion has a frequency response characteristic different from that of the microresonator, and the connection portion is not substantially displaced and hardly vibrates when the microresonator vibrates at a specific resonance frequency. In addition, the connection portion is characterized in that, when the microresonator vibrates at a specific resonance frequency, it does not substantially move in synchronization with the displacement of the microresonator. That.

  According to the microresonance device of the present invention, the micro movable part mechanically acts on the microresonator through the connection part, and the connection part has a frequency response characteristic different from that of the microresonator. Therefore, the connection portion hardly follows the microresonator, and there is no need to consider the displacement and friction of the connection portion acting on the microresonator, and even after the resonator is sealed, It has become possible to provide a micro-resonance device that can compensate for the uncertainty of the resonance frequency due to variations in processing accuracy with good reproducibility and adjust the frequency response characteristic or the inherent resonance frequency.

In addition , when the microresonator vibrates at a specific resonance frequency, the connection portion hardly vibrates. Therefore, the sub-peak in the frequency response characteristic of the microresonator is suppressed, and a decrease in the amplitude of the resonance peak is prevented. Can do.

In addition , the portion that moves when the microresonator resonates is substantially limited to the microresonator, and an increase in the mass of the portion that moves during resonance can be prevented. By these, it is possible to prevent an increase in the stiffness of the resonance structure necessary for obtaining a desired resonance frequency.

  In one embodiment of the microresonance device, the micro movable portion is not substantially displaced and hardly vibrates when the microresonator vibrates at a specific resonance frequency.

  According to the microresonance device of this embodiment, a portion that moves when the microresonator resonates is substantially limited to the microresonator, and an increase in mass of the portion that moves during resonance can be prevented. By these, it is possible to prevent an increase in the stiffness of the resonance structure necessary for obtaining a desired resonance frequency.

  In one embodiment of the microresonance device, the micro movable unit does not substantially move in synchronization with the displacement of the microresonator when the microresonator vibrates at a specific resonance frequency. Features.

  According to the microresonance device of this embodiment, a portion that moves when the microresonator resonates is substantially limited to the microresonator, and an increase in mass of the portion that moves during resonance can be prevented. As a result, the micro movable part can be driven at a low voltage by saving space or making effective use of the space, because the design freedom is high in size and shape regardless of the resonance frequency and stiffness inherent in the microresonator. Is achieved.

  In one embodiment, the micro movable unit includes a piezoelectric actuator, and the piezoelectric actuator includes a piezoelectric element and a drive electrode for applying displacement to the piezoelectric element. .

  According to the microresonance device of this embodiment, it can be easily formed on the substrate, and an increase in occupied area can be suppressed.

  In one embodiment of the present invention, the frequency response characteristic of the microresonator is changed by controlling the voltage applied to the drive electrode of the piezoelectric actuator.

  According to the microresonance device of this embodiment, it is possible to directly or mechanically act on the microresonator via the connection portion, and there is no displacement or friction of the action portion, and the displacement of the micro movable portion is effective. Therefore, it can be applied to the microresonator and can be adjusted stably and with high reproducibility.

  In one embodiment of the present invention, the inherent resonance frequency of the microresonator is changed by controlling the voltage applied to the drive electrode of the piezoelectric actuator.

  According to the microresonance device of this embodiment, it is possible to directly and mechanically act on the microresonator via the connection portion, and there is no displacement or friction of the action portion, and the displacement of the micro movable portion is effective. Therefore, it can be applied to the microresonator and can be adjusted stably and with high reproducibility.

  In one embodiment of the present invention, the micro movable unit includes an electrostatic actuator, and the electrostatic actuator is stationary with respect to the first electrode and a predetermined interval with respect to the first electrode. And a second electrode movable relative to the first electrode.

  According to the microresonance device of this embodiment, since the piezoelectric material is not used, the process can be simplified and the cost can be reduced.

  In one embodiment of the microresonance device, the frequency response characteristic of the microresonator is controlled by controlling a voltage difference applied between the first electrode and the second electrode of the electrostatic actuator. It is characterized by being changed.

  According to the microresonance device of this embodiment, it is possible to directly and mechanically act on the microresonator via the connection portion, and there is no displacement or friction of the action portion, and the displacement of the micro movable portion is effective. Therefore, it can be applied to the microresonator and can be adjusted stably and with high reproducibility.

  In one embodiment of the microresonance device, the inherent resonance frequency of the microresonator is controlled by controlling a voltage difference applied between the first electrode and the second electrode of the electrostatic actuator. It is characterized by being changed.

  According to the microresonance device of this embodiment, it is possible to directly and mechanically act on the microresonator via the connection portion, and there is no displacement or friction of the action portion, and the displacement of the micro movable portion is effective. Therefore, it can be applied to the microresonator and can be adjusted stably and with high reproducibility.

  In one embodiment, the microresonator includes a plurality of the piezoelectric actuators, and the frequency response characteristics of the microresonator are changed by individually driving the piezoelectric actuators.

  According to the microresonance device of this one embodiment, the frequency response characteristics of the microresonator can be adjusted with high accuracy over a wide range and with good reproducibility.

  In one embodiment of the present invention, the microresonator includes a plurality of electrostatic actuators, and the frequency response characteristics of the microresonator are changed by individually driving the electrostatic actuators. .

  According to the microresonance device of this one embodiment, the frequency response characteristics of the microresonator can be adjusted with high accuracy over a wide range and with good reproducibility.

  In one embodiment of the present invention, the microresonator includes a plurality of the piezoelectric actuators, and the unique resonance frequency of the microresonator is changed by individually driving the piezoelectric actuators.

  According to the microresonance device of this embodiment, the inherent resonance frequency of the microresonator can be adjusted with high accuracy over a wide range and with good reproducibility.

  In one embodiment of the present invention, the microresonator includes a plurality of electrostatic actuators, and the inherent resonance frequency of the microresonator is changed by individually driving the electrostatic actuators. To do.

  According to the microresonance device of this embodiment, the inherent resonance frequency of the microresonator can be adjusted with high accuracy over a wide range and with good reproducibility.

  In one embodiment, when driving the plurality of electrostatic actuators, in the at least one electrostatic actuator, the first electrode and the second electrode are in a pull-in state. It is characterized by.

  According to the microresonance device of this embodiment, the frequency response characteristic of the microresonator or the specific resonance frequency can be adjusted with high accuracy over a wide range and with good reproducibility.

  In one embodiment of the microresonance device, the microresonator, the micro movable part, and the connection part are made of a material containing at least two elements in the composition, and one of these elements has a high melting point. It is a metal element.

  According to the microresonance device of this embodiment, the film composition and the film quality can be easily controlled even when deposited at a low temperature of about room temperature, and it is possible to prevent destruction such as film peeling during film deposition. In addition, it is possible to improve resistance to deformation and destruction of the microstructure due to a load such as stress.

  In one embodiment of the present invention, the refractory metal material is any one of tungsten, tantalum, molybdenum, and titanium.

  According to the microresonance device of this embodiment, a microstructure having a high Young's modulus can be obtained even if nitrogen or the like is contained.

  In one embodiment of the microresonance device, the microresonator, the micro movable part, and the connection part are made of a material containing at least two elements in the composition, and the material includes a refractory metal element, It contains at least any element of nitrogen, oxygen, and carbon.

  According to the microresonance device of this embodiment, the film composition and the film quality can be easily controlled even when deposited at a low temperature of about room temperature, and it is possible to prevent destruction such as film peeling during film deposition. In addition, it is possible to improve resistance to deformation and destruction of the microstructure due to a load such as stress.

  The microfilter device of the present invention includes the microresonator, an input electrode capacitively coupled to the microresonator, an output electrode for extracting a frequency signal selected by the microresonator, and the micro movable portion. It has the input electrode for operating this.

  According to the microfilter device of the present invention, since the resonance frequency of the microresonance device (center frequency of the microfilter device) can be stably adjusted with good reproducibility over a wide range by controlling the micro movable part after manufacture, For the uncertainties of the resonance frequency of the microresonance device (center frequency of the microfilter device) due to variations in processing during manufacturing and variations in sealing pressure, the desired (design) value is corrected stably and with good reproducibility.・ Adjustment is possible. Furthermore, the yield can be obtained even if a manufacturing apparatus and a manufacturing process having a processing accuracy within a range in which the yield cannot be obtained by the conventional method. In addition, since the deviation of the center frequency of the microfilter device can be corrected by controlling the micro movable part after encapsulation, the external environment (temperature) changes during use and the microresonance device itself deteriorates over time (degradation of encapsulation pressure and The output of the filter can be corrected and optimally adjusted with good reproducibility, even when the mechanical characteristics of the microresonator material are degraded, etc., extending the range of environmental conditions that can be used as a filter, and extending the product life. be able to.

  The microfilter device according to an embodiment further includes a micro movable unit control circuit connected to an output of the micro resonant device and an input for driving the micro movable unit, and the micro movable unit control circuit should be selected. The micro movable portion is adjusted so that a desired frequency signal is output from the micro resonant device when there is a difference between the desired frequency and the frequency of the signal selected and output by the micro resonant device. To do.

  According to the microfilter device of this embodiment, stable and reproducible adjustment of the microfilter device can be performed on the spot according to the actual change in the use environment and the state of the microresonance device at the time of use.

  In one embodiment, the microfilter device includes a memory element connected to the micro movable unit control circuit, and the memory element is adjusted to correct a difference from the desired frequency to be selected. The micro movable part control circuit controls and outputs the micro movable part based on the control value of the micro movable part stored in the storage element during the starting operation. Adjusting the frequency signal.

  According to the microfilter device of this embodiment, the adjustment time can be greatly shortened stably and with good reproducibility, compared with the case of adjusting from a completely initial value.

  The micro oscillator of the present invention includes the micro resonance device, an input electrode capacitively coupled to the micro resonance body, an output electrode for extracting a frequency signal selected by the micro resonance device, and the micro movable portion. And an input electrode for operating.

  According to the micro oscillator of the present invention, the frequency output from the microresonator can be adjusted stably and with good reproducibility over a wide range by controlling the micro movable part after manufacturing. The uncertainty of the output frequency of the micro-oscillator due to variations in processing and sealing pressure can be corrected and adjusted stably to a desired (design) value with good reproducibility. Furthermore, the yield can be obtained even if a manufacturing apparatus and a manufacturing process having a processing accuracy within a range in which the yield cannot be obtained by the conventional method. Moreover, since the deviation of the output frequency of the micro oscillator can be corrected by controlling the micro movable part after encapsulation, the external environment (temperature) changes during use and the microresonator itself deteriorates over time (degradation of encapsulation pressure and micro The filter output can be corrected and optimally adjusted with good reproducibility even when the mechanical properties of the resonator material are deteriorated, etc., and the range of environmental conditions that can be used as an oscillator is expanded to extend the product life. Can do.

  In one embodiment, the micro oscillator includes a micro movable part control circuit connected to an output of the micro resonant apparatus and an input for driving the micro movable part, and the micro movable part control circuit is connected to the micro resonant apparatus. The micro movable portion is adjusted while detecting the output so as to correct or optimize the fluctuation of the frequency output by the above.

  According to the micro oscillator of this embodiment, stable and reproducible adjustment of the micro oscillator can be performed on the spot in accordance with the actual change of the use environment and the state of the micro resonance device at the time of use.

  In one embodiment, the micro oscillator includes a storage element connected to the micro movable unit control circuit, and the storage element corrects or optimizes a difference between a desired frequency to be output and an actual frequency. The control value of the micro movable part adjusted as described above is stored, and the micro movable part control circuit stores the micro movable part based on the control value of the micro movable part stored in the storage element during start-up operation. It is characterized by controlling and adjusting the output frequency signal.

  According to the micro oscillator of this embodiment, the adjustment time can be greatly shortened stably and with good reproducibility, compared with the case of adjusting from a completely initial value.

  The wireless communication device of the present invention transmits a transmission unit, a reception unit, a duplexer that separates a transmission signal from the transmission unit and a reception signal to the reception unit, and transmits the transmission signal as a radio wave. An antenna that receives a reception signal as a radio wave, and at least the transmission unit and the microfilter device connected to the reception unit.

  According to the wireless communication device of the present invention, since the microfilter device is provided, even if the frequency characteristics of the microfilter device change due to the change of the external environment or the internal change of the microresonance device itself, it is compared with the communication state. While controlling the micro movable part while adjusting the frequency characteristics, the communication state can be stably kept optimal with good reproducibility.

  The wireless communication device of the present invention transmits a transmission unit, a reception unit, a duplexer that separates a transmission signal from the transmission unit and a reception signal to the reception unit, and transmits the transmission signal as a radio wave. An antenna that receives a received signal as a radio wave, and at least the transmitter and the micro oscillator connected to the receiver.

  According to the wireless communication device of the present invention, since the micro oscillator is provided, even if the output frequency of the micro oscillator changes due to the change of the external environment or the internal change of the micro resonance device itself, it is compared with the communication state. By controlling the micro movable part, the frequency characteristics can be adjusted, and the communication state can be kept stable and optimal with good reproducibility.

  According to the microresonance device of the present invention, the micro movable part mechanically acts on the microresonator through the connection part, and the connection part has a frequency response characteristic different from that of the microresonator. Therefore, the connection portion hardly follows the microresonator, and there is no need to consider the displacement and friction of the connection portion acting on the microresonator, and even after the resonator is sealed, It has become possible to provide a micro-resonance device that can compensate for the uncertainty of the resonance frequency due to variations in processing accuracy with good reproducibility and adjust the frequency response characteristic or the inherent resonance frequency.

  In addition, according to the microfilter device of the present invention, since the microresonator is provided, the microresonator can be stabilized to a desired value against the uncertainty of the resonance frequency of the microresonator due to processing variations during manufacture and variations in sealing pressure. Correction and adjustment with high reproducibility. In addition, the output of the filter can be corrected and optimally adjusted with good reproducibility, and the range of environmental conditions that can be used as a filter has been expanded, even with changes in the external environment during use and deterioration over time of the microresonator itself. In addition, the product life can be extended.

  Moreover, according to the micro oscillator of the present invention, since the micro resonance device is provided, the uncertainty of the resonance frequency of the micro oscillator due to processing variations during manufacturing and variations in sealing pressure is stably reproduced to a desired value. It becomes possible to correct and adjust with good performance. In addition, the filter output can be corrected and optimally adjusted with good reproducibility and changes in the external environment during use and deterioration over time of the microresonator itself, expanding the range of environmental conditions that can be used as an oscillator. In addition, the product life can be extended.

  In addition, according to the wireless communication device of the present invention, since the microfilter device or the micro oscillator is provided, the frequency characteristics of the micro filter device or the micro oscillator are affected by a change in the external environment or an internal change in the micro resonance device itself. Even if fluctuations occur, the movable micro part can be controlled while contrasting with the communication state, the frequency characteristics can be adjusted, and the communication state can be kept stable and optimal with good reproducibility.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

(First embodiment)
FIG. 1 is a configuration diagram showing a first embodiment of a microresonance device according to the present invention. The microresonance device includes a substrate 10, a microresonator 11 that is provided on the substrate 10 and vibrates in response to a change in a selected parameter, a micro movable unit 12, the microresonator 11, and a micro movable unit. The connection part 13 which connects 12 is provided.

  In the first embodiment, a silicon single crystal substrate is used for the substrate 10 and polycrystalline silicon doped with impurities is used for the microresonator 11 and the connection portion 13. The material and form of the microresonator are not limited, and an SOI substrate, a GaAs substrate, a glass substrate, a resin substrate, or the like may be used instead of the silicon single crystal substrate. Also, instead of polycrystalline silicon doped with impurities, single-crystal silicon film doped with impurities or amorphous silicon, SiGe film, SiC film, Ni, tungsten, high melting point such as tungsten nitride, tantalum nitride, etc. It is also possible to use a microresonator having a form as in the conventional example shown in FIG. 13 using metal nitride.

  In the first embodiment, a fixed potential is applied to the microresonator 11 from the electrode 16 and a high-frequency signal is applied from the input electrode 17. Of these high-frequency electrical signals, the microresonator 11 vibrates mainly in the direction indicated by the arrow 14 in response to a frequency signal in the vicinity of the unique resonance frequency of the microresonator 11, but the input method and input signal are However, the present invention is not limited to this, and it can be selected in the same manner by designing the structure so that the specific resonance frequency of the microresonator 11 that may give a low-frequency pressure fluctuation, acoustic signal, or mechanical vibration becomes a desired frequency. Can respond. Needless to say, the substrate and the input signal are the same for the other embodiments of the present invention. In the first embodiment, Au is used as the electrode material, but the electrode material is not limited to this.

  In the first embodiment, the connection portion 13 and a part of the micro movable portion 12 connected to the connection portion 13 are formed integrally with the microresonator 11. Then, at least the local resonance frequency of the connecting portion 13 in direct contact with the microresonator 11 is designed to be higher than the resonance frequency of the microresonator 11 and to have different frequency response characteristics. Here, as shown in FIG. 2, the width 20 of the connecting portion 13 is made smaller than the width 22 of the microresonator 11, and the length 21 of the connecting portion 13 is also sufficiently shorter than the length 23 of the microresonator 11. is doing. In the example shown in FIG. 1 in which a polycrystalline silicon film is used for the microresonator 11 and the connection portion 13, the dimensions of the microresonator 11 are 7.4 μm in length, 1.0 μm in thickness, and 4.0 μm in width. If the dimensions of the connecting portion 13 are 1.0 μm in length, 4.0 μm in width, and 1.0 μm in thickness, when the microresonator 11 vibrates, the connecting portion 13 also vibrates. The frequency response characteristics of the microresonator 11 are affected, and a decrease in the amplitude of the resonance peak and a sub-resonance peak are observed. However, as shown in FIG. By making the local resonance frequency (eigenvalue) of the portion 13 sufficiently larger than that of the microresonator 11, the connection portion 13 hardly vibrates even when the microresonator 11 vibrates at the inherent resonance frequency. Resonator 11 Can be made to the sub-resonance peak is hardly seen in the frequency response characteristic. In addition, when the microresonator 11 vibrates at a specific resonance frequency, the connecting portion 13 does not move substantially in synchronization with the displacement of the microresonator 11, so that the structure of the movable portion at the time of resonance is obtained. Substantially limited to the range of the microresonator 11, it is possible to prevent an increase in mass of a portion that moves during resonance. By these, it is possible to prevent an increase in the stiffness of the resonance structure necessary for obtaining a desired resonance frequency, and to manufacture the microresonator 11 that vibrates at a high frequency and to reduce the drive voltage of the microresonator 11. it can.

  Further, the presence of the connecting portion 13 can prevent the vibration from spreading toward the micro movable portion 12 via the connecting portion 13 when the micro resonant body 11 vibrates at a specific resonance frequency. Hardly vibrates. In addition, since substantial movement in synchronization with the displacement of the microresonator 11 is not performed, it is possible to prevent an increase in the mass of the movable portion at the time of resonance, and the stiffness of the resonance structure necessary to obtain a desired resonance frequency. An increase can be prevented. Thereby, since the micro movable part 12 can obtain a high degree of design freedom in size and shape regardless of the inherent resonance frequency and stiffness of the microresonator 11, a low voltage can be achieved by space saving or effective use of space. Driving is achieved.

  In the first embodiment, the micro movable unit 12 includes a piezoelectric actuator 15, and the piezoelectric actuator 15 includes a piezoelectric element and a drive electrode for applying displacement to the piezoelectric element. Preferably, as shown in FIG. 3A, a thickness-deformable piezoelectric member (piezoelectric element) 31 is provided. By applying a potential difference to the control electrodes (drive electrodes) 32 and 33 of the thickness-deformation type piezoelectric element, as shown in FIG. 3B, it is deformed in the thickness direction as shown by an arrow 39 and connected to the microresonator 11. The upper layer portion 30 integrated with the microresonator 11 can be moved mechanically or mechanically via the connection portion 13. In the first embodiment, the microresonator 11, the connection part 13, and the upper layer part 30 that is a part of the micro movable part 12 are integrally formed at the same time. Compared to pressing, there is no deviation or friction, and the displacement of the micro movable part 12 can be effectively applied to the microresonator 11, and a stable and highly reproducible operation can be performed. According to the first embodiment, the thickness-deformation type piezoelectric element can be formed by simply laminating the electrode layer and the piezoelectric layer, so that it can be easily formed on the substrate, and an increase in the occupied area can be suppressed.

  The effect of applying the displacement of the micro movable part 12 to the microresonator 11 mechanically or mechanically will be described. The microresonator 11 as shown in FIG. 1 vibrates as indicated by the upper broken line 18 and the lower wavy line 19, but the upper part has a higher degree of freedom than the lower part of the microresonator 11, and the vibration region of the microresonator 11 is The upper part is longer than the lower part. In any form of resonator, in order to vibrate the resonator, it is necessary to support at least the resonator. However, it is practically difficult to support or fix the resonator on a substrate ideally with a point or a plane. is there. Inevitably, it is impossible to completely eliminate the participation of the support portion that contacts the microresonator in three dimensions (three-dimensionally). In particular, as the microresonator 11 becomes finer, there is a limit in the manufacturing process, and the ratio of the region in contact with the support structure becomes relatively large. In view of the structure, the involvement of the support portion in vibration cannot be ignored. Therefore, when mechanical or mechanical deformation is applied to the end of the microresonator 11 via the connection portion 13 using the micro movable portion 12, the degree of freedom near the end of the microresonator 11 changes, and the microresonator 11 The vibration region and the amplitude distribution shape change. As a result, the frequency response characteristics such as the resonance frequency of the microresonator 11 can be changed.

  Here, in Japanese Patent Laid-Open No. 2001-94062, a silicon-on-insulator (SOI) substrate is used to form a single crystal silicon resonator. Although a technique for solving the problem of variation in mechanical characteristics has been disclosed, it does not essentially solve the inaccuracy of the resonance frequency due to variation in processing accuracy. Japanese Patent Laid-Open No. 2001-94062 discloses a method of controlling the resonance frequency of a resonator by changing the density of the resonator by ion implantation in the manufacturing process. Unless the mechanical characteristics can be accurately measured and the resonance frequency before injection can be accurately estimated, the dose for obtaining the desired resonance frequency cannot be determined. In other words, it is difficult to completely grasp the measurement error of the inspection apparatus used for measuring the dimensions of the resonator and the concentration distribution after ion implantation in the resonator having a thickness of about 2 μm and a length of several μm or more. Therefore, it is difficult to accurately predict the variation in mechanical characteristics of the resonator after injection, and this method essentially solves the inaccuracy of the resonance frequency caused by the manufacturing process. It is difficult. In addition, the resonance frequency of the resonator and the amplitude amplification factor (Q value) of the resonance peak are sealed in the resonator as disclosed in the literature (YTCheng et al., Proceedings of MEMS Conf. P18, 2001). Since it strongly depends on the pressure in the cavity, even if the resonance characteristics of the resonator are adjusted during the manufacturing process, the final resonance characteristics will fluctuate due to variations in the sealing pressure. However, according to the first embodiment, the micro movable part 12 can be controlled after manufacture to change the resonance frequency of the microresonator 11, so that the resonance frequency caused by the manufacturing process and the sealing process is reduced. Even if there is accuracy, it is possible to adjust to a desired resonance frequency.

  More preferably, a slip deformation type piezoelectric member (piezoelectric element) 34 is provided as shown in FIG. 3A. By applying a potential difference to the electrode layers (drive electrodes) 33 and 35 on both sides of the sliding deformation type piezoelectric member 34, the deformation is made as indicated by an arrow 40 shown in FIG. 3B, and the micro movable portion integrated with the microresonator 11 and the connecting portion 13 is obtained. The 12 upper layer portions 30 can be moved in the horizontal direction. The frequency response characteristics such as the resonance frequency of the microresonator 11 can be changed by mechanically or mechanically acting on the microresonator 11 via the connection portion 13 only by this operation. As shown in FIGS. 3A and 3B, when the thickness deformation type and the slip deformation type are used in combination, the resonance frequency can be changed without greatly changing the amplitude, or the pass bandwidth can be changed without changing the resonance frequency. The frequency response characteristics can be controlled more precisely and more precisely.

  More preferably, if the micro movable part 12 is provided on both sides of the microresonator 11 via the connection part 13, the control range of the frequency response characteristic of the microresonator 11 can be further expanded. In addition, when the connection parts 13 with different shapes (width, length, thickness) are connected to both sides, the operation side of the micro movable part 12 is switched or combined, for example, the resonance peak intensity and resonance peak Control that is used properly when the resonance frequency is changed without significantly reducing the amplitude amplification factor (Q value) and when the resonance frequency is changed by lowering the resonance peak intensity and the amplitude amplification factor (Q value) of the resonance peak to some extent. Is possible.

  Non-Patent Document 1 discloses a method of changing the resonance frequency according to the bias potential applied to the resonator (resonance frequency of about 10 MHz). However, in this method, static caused by the potential difference between the input electrode and the resonator is disclosed. The power attracts the resonator toward the input electrode, and changes the resonance frequency of the resonator. Therefore, by relatively increasing the strength of the electrostatic force with respect to the spring force of the resonator, the resonator is closer to the input electrode and the change in the resonance frequency can be increased. However, if applied to a resonator having a higher resonance frequency, the length of the resonator is shortened, and the size of the input electrode is also reduced accordingly, so that the electrostatic force is inevitably reduced. Furthermore, since the spring force of the resonator becomes stronger as the length of the resonator becomes shorter, the magnitude of the relative electrostatic force suddenly decreases, and the fluctuation range of the resonance frequency due to the bias potential can hardly be confirmed. descend. In other words, the method using the bias potential can achieve control that only compensates for the inaccuracy of the resonance frequency due to the variation in the processing accuracy and the variation in the sealing pressure for the resonator having the resonance frequency in the high frequency region. Disappear. Further, as shown in Non-Patent Document 1, the control by the bias potential decreases the resonance frequency and decreases the amplitude amplification factor (Q value) at the resonance peak as the bias voltage is increased. In an actual use environment, the resonance frequency is lowered in any case such as deterioration of the sealing pressure (pressure increase) and temperature rise. Therefore, it is necessary to control the resonance frequency to be increased. However, since the bias voltage is proportional to the output of the MEMS, the bias potential cannot be lowered more than necessary, and there is a problem that it is not basically a technique that can be controlled to increase the frequency. Japanese Patent Publication No. 11-50841 is provided with a comb-shaped electrode that is movable by being connected to a movable part of a resonance structure, and a fixed comb-shaped electrode that is opposed to the movable comb-shaped electrode at a predetermined interval. A microresonator capable of controlling the stiffness of the movable structure by generating an electrostatic field between the two comb-shaped electrodes and changing the resonance frequency of the resonant structure including the movable comb-shaped electrode to a higher side. It is disclosed. However, since the comb electrode is included in the resonance structure (moves together), the resonance structure has a large mass, and it is difficult to realize a resonator having a high resonance frequency that can be practically adjusted by this method. In order to obtain a high resonance frequency, a higher stiffness is required, so to adjust the resonance frequency (change the stiffness) requires a larger comb electrode that forms a strong electrostatic field and a higher tuning voltage. Thus, it becomes difficult to design a microresonator having a fine structure at a practical level.

  However, according to the first embodiment, since the micro movable portion 12 hardly vibrates together with the microresonator 11, the micro movable portion 12 does not affect the mass of the vibrating portion of the microresonator 11. In addition to the microresonator 11, the micro movable portion 12 can be designed to have an arbitrary size, and the control voltage can be suppressed to a low voltage. Furthermore, it is possible to cope with downsizing the microresonator 11 and increasing the resonance frequency. Further, since the micro movable portion 12 can apply stress to the microresonator 11 by either compression or tension, the micro movable portion 12 can be adjusted to both increase and decrease the resonance frequency.

(Second Embodiment)
FIG. 4 is a block diagram showing a second embodiment of the microresonance device according to the present invention. The microresonance device includes a substrate 10, a microresonator 41 that is provided on the substrate 10 and vibrates in the direction of an arrow 44 in response to a change in a selected parameter, the micro movable unit 12, and the microresonator 41. And a connecting portion 13 for connecting the micro movable portion 12 to each other. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the second embodiment, the connection portion 13 and the micro movable portion 12 are the same as those in the first embodiment, but the side that is integral with the connection portion 13 of the microresonator 41 is fixed to the substrate 10. It is possible to move. In the second embodiment, when the microresonator 41 is vibrated, the micro movable portion 12 is moved downward, and the side of the microresonator 41 that is not fixed to the substrate is supported on the substrate 46. However, since the microresonator 41 can be pressed against the support 46 after the micro movable portion 12 is moved in the lateral direction, the variable range of the inherent resonance frequency of the microresonator 41 is widened. be able to.

(Third embodiment)
FIG. 5 is a block diagram showing a third embodiment of the microresonance device according to the present invention. The microresonance device includes a substrate 10, a microresonator 11 that is provided on the substrate 10 and vibrates in response to a change in a selected parameter, a micro movable unit 52, and the microresonator 11 and the micro movable unit. The connection part 13 which connects 52 is provided. In the third embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the third embodiment, the connection portion 13 and the microresonator 11 are the same as those in the first embodiment, but the micro movable portion 52 includes an electrostatic actuator 55, and the electrostatic actuator 55 is a substrate. A first electrode 57 formed on the substrate 10 that is stationary, and a second electrode that is spaced apart from the first electrode 57 by a predetermined distance and is relatively movable with respect to the first electrode 57. The electrostatic actuator 55 is provided with the electrode 56. By applying a potential difference between the first electrode 57 and the second electrode 56, the electrostatic actuator 55 operates and the microresonator 11 is deformed via the connection portion 13, so that the same as in the first embodiment. The frequency response characteristic of the microresonator 11 or the inherent resonance frequency can be changed. In the third embodiment, the microresonator 11, the connection part 13, and a part 51 of the micro movable part 52 that is integrated with the connection part are integrally formed of a conductive material. Since the potential can be fixed, the second electrode 56 can be omitted. Further, since the piezoelectric material is not used as in the first embodiment and the second embodiment, the process can be simplified and the cost can be reduced.

  Also in the third embodiment, as shown in the second embodiment, it is needless to say that a structure in which the connecting portion of the microresonator is not fixed to the substrate can be obtained, and similar effects can be obtained.

(Fourth embodiment)
FIG. 6 is a block diagram showing a fourth embodiment of the microresonance device according to the present invention. The microresonance device includes a substrate 10, a microresonator 11 that is provided on the substrate 10 and vibrates in response to a change in a selected parameter, a micro movable unit 62, and the microresonator 11 and the micro movable unit. The connection part 13 which connects 62 is provided. Note that in the fourth embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the fourth embodiment, the micro movable unit 62 includes a plurality of electrostatic actuators 63, 64, and 65, which can be individually operated. Therefore, compared to the third embodiment, the microresonator is used. The frequency response characteristic of 11 or the inherent resonance frequency can be adjusted over a wide range with higher accuracy.

  More specifically, the first electrostatic actuator 63 includes a first electrode 67 and a second electrode 66, and the second electrostatic actuator 64 includes a first electrode 69 and a second electrode 68. The third electrostatic actuator 65 includes a first electrode 71 and a second electrode 70.

  In the fourth embodiment, the three electrostatic actuators 63, 64, 65 are arranged vertically, but the number is not limited to this, and the size of the micro movable portion 62 is not limited to this. The number of electrostatic actuators can be increased in accordance with the adjustment range, and a force acting in different directions can be applied to the microresonator by arranging it two-dimensionally.

  More preferably, as shown in FIG. 7, the electrostatic actuator is operated by being pulled in. Among the plurality of actuators, the degree of action on the microresonator 11 can be controlled by the position and number of actuators to be pulled in, and the frequency response characteristic or resonance frequency of the microresonator 11 can be changed. Unlike the case of changing with the electrode interval, the electrode interval (position) is stable, and control with high reproducibility becomes possible. In the pull-in state, since a very strong attractive force acts between the electrodes, it can be applied to the microresonator 11 with a strong force, and the control range can be expanded. In addition, it is possible to provide a plurality of piezoelectric actuators as shown in the first and second embodiments, and the actuators can be operated by changing the position and number individually, so that more precise and wide range adjustment is possible. become.

(Fifth embodiment)
FIG. 8 is a configuration diagram showing a fifth embodiment of the microresonance device according to the present invention. The microresonance device includes a substrate 10, a microresonator 81 that is provided on the substrate 10 and vibrates in response to a change in a selected parameter, a micro movable unit 82, the microresonator 81, and a micro movable unit. 82 is provided. In the fifth embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the fifth embodiment, the cross-sectional shape of the connection portion 83 is bent into a V shape, and thereby the local resonance frequency of the connection portion 83 is higher than that of the microresonator 81. The microresonator 81 has different frequency response characteristics. Furthermore, when the microresonator 81 is vibrated, the micro movable portion 82 is moved downward and the connecting portion 83 is pressed against the substrate 10. 82 can hardly be vibrated or moved, and the frequency response characteristic or resonance frequency of the microresonator 81 can be changed by operating the micro movable portion 82.

In the fifth embodiment, the support portion 46 (FIG. 4) is not required as in the second embodiment, the structure is simple, and the microresonator 81, the connection portion 83, and a part 90 of the micro movable portion are masked. Since they can be formed integrally in one step, simplification and cost reduction of the process can be achieved. As a material having a structure integrally formed with the microresonator 82 and the connection portion 83, a polycrystalline silicon film doped with impurities can be used as before, but the conductive material of the present invention is not limited to this. In addition, a metal material such as amorphous silicon, SiGe film, SiC film, Ni, or tungsten can be applied to the conductive layer. Here, as a more preferred embodiment, a case where a material containing nitrogen in a refractory metal such as tungsten is applied to a microresonator as shown in FIG. 8 will be described as an example. Tungsten containing nitrogen is deposited to 200 nm by reactive sputtering on the substrate 10 on which an insulating layer has been deposited in advance. The deposition conditions are a sputtering pressure of 2 Pa, an RF power of 300 W, an Ar flow rate of 33.6 sccm, an N ₂ flow rate of 8.4 sccm, and a substrate temperature of room temperature. Next, the resist mask is patterned by a normal lithography method, the tungsten nitride film is patterned by anisotropic dry etching, and the electrode 16 that is electrically connected to the microresonator 81, the fixed electrodes 17, 88, 89, 90, etc. And a first conductive layer is formed. Next, a silicon oxide film having a thickness of 2.0 μm is deposited on the first conductive layer to form a sacrificial layer. The sacrificial film is processed to expose a necessary first conductive layer such as the electrode 16. As a second conductive layer, a tungsten layer containing nitrogen is first deposited at a sputtering pressure of 2 Pa, an RF power of 300 W, an Ar flow rate of 33.6 sccm, an N ₂ flow rate of 8.4 sccm, a substrate temperature of 0.5 μm at room temperature, Next, the sputtering pressure is changed to 2.4 Pa, and tungsten containing nitrogen is further deposited by 1.2 μm. The sputtering pressure is also returned to 2 Pa, and tungsten containing nitrogen is deposited by 0.3 μm. The tungsten film containing nitrogen formed in a plurality of layers is patterned by anisotropic dry etching to form a second conductive layer including the microresonator 81, the micro movable part 82, and the connection part 83. Here, for dry etching of a tungsten film containing nitrogen, a plasma etching apparatus and processing conditions used for normal anisotropic etching of a tungsten film are used. Next, the sacrificial film is removed to expose the microresonator 81, the micro movable part 82, and the connection part 83. For removing the sacrificial layer, a dry etching method using hydrogen fluoride gas can be applied. Thereby, the micro movable portion 82 can be formed of only two conductive layers simultaneously with the microresonator 81, and the micro movable portion 82 can be formed without increasing the number of conductive layers.

Here, in US Pat. No. 6,210,998, by using a SiGe film formed by the LPCVD method, it is possible to form a microstructure in which the residual stress is controlled at about 550 ° C., which is lower than that of a polysilicon film. However, in the case of tungsten containing nitrogen used here, it is possible to lower the temperature to about room temperature because the sputtering method is used, and only on an LSI fabricated on a Si substrate by a CMOS process. In addition, the present invention can be applied to a substrate that has undergone a low heat resistance process such as a Cu wiring or a low dielectric constant organic insulating film such as a glass substrate or a resin substrate. Compared to other metal materials, for example, when only tungsten material is used, it is difficult to control the film quality in the growth direction, so it is difficult to control internal stress, and cracking is applied when a load such as stress is applied. It was difficult to ensure the reliability of the micro structure due to the occurrence of defects such as deformation and destruction, but when nitrogen was included, the film composition etc. could be easily changed by N ₂ partial pressure, sputtering pressure, etc. it can. When measured with an indentation type thin film tester, the Young's modulus decreases from 360 GPa to about 250 GPa by increasing the nitrogen content from 0% to about 60%, but a higher Young's modulus than that of polysilicon or SiGe film is obtained. It was. The residual stress in the film could be changed from tensile stress to compressive stress by changing the sputtering pressure. For this reason, layers having different residual stress and composition can be grown continuously or intermittently, and the residual stress in the film can be almost eliminated. In addition, since films having different compositions and grain states can be stacked in the growth direction, it is difficult to penetrate the film easily even if a defect occurs due to stress or the like, and resistance to deformation or breakage due to cracking or the like can be improved. Nitrogen is included here, but this effect is not limited to this, and it can be easily implemented by reactive sputtering, including not only nitrogen but also carbon and oxygen, and the same effect is expected. Obviously we can do it. The same effect can be expected by using not only tungsten but also other metals such as tantalum, molybdenum, titanium, nickel, and aluminum. Is preferred.

  In the fifth embodiment, the micro movable portion 82 includes a plurality of electrostatic actuators 85, 86, 87. However, the type and number of actuators are not limited to this, and a piezoelectric actuator may be used.

(Sixth embodiment)
FIG. 9 is a configuration diagram showing a sixth embodiment of the microresonance device according to the present invention. In the sixth embodiment, the fact that the present invention can be easily applied to a microresonator that vibrates in a direction parallel to the substrate will be described with reference to the drawings. A microresonator 91 that vibrates in response to a change in the selected parameter, a micro movable part 92, and a connection part 93 that connects the microresonator 91 and the micro movable part 92 are provided. In the sixth embodiment, the connection portion 93 is coupled to the support region 98 of the microresonator 91. As a result, the local resonance frequency of the connecting portion 93 becomes higher than the resonance frequency of the microresonator 91, and has a frequency response characteristic different from that of the microresonator 91, and the microresonator 91 is indicated by an arrow 94. Even when vibrating in the direction, the connecting portion 93 and the micro movable portion 92 hardly vibrate or move, and the frequency response characteristic or resonance frequency of the microresonator 91 can be controlled by operating the micro movable portion 92. Can be changed. A fixed potential is applied from the electrode 96 to the microresonator 91 via the support region 98, and a high frequency signal is applied from the input electrode 97 to the microresonator 91. The micro movable portion 92 includes an electrostatic actuator 95.

  The connection position of the connection portion 93 is not limited to this, but by arranging the connection portion 93 at a position facing the support region 98, the microresonator 91 can be operated so as to give a twisting force. In the sixth embodiment, the micro movable portion 92 is disposed at opposite positions on both ends of the micro resonator 91, but the present invention is not limited to this. However, the reverse arrangement is effective in increasing the change in frequency response characteristics. Thus, it is apparent that the present invention can be applied to the microresonator 91 having a different structure and vibration mode by providing the connection portion 93 near the end portion or the support region 98.

(Seventh embodiment)
A microfilter device will be described as a seventh embodiment. In the preferred embodiment, as shown in FIG. 10, the input electrode 101 includes the microresonator 100 of the present invention shown in any one of the first to sixth embodiments and is capacitively coupled to the microresonator. And an output electrode 102 for extracting a frequency signal selected by the microresonator, and input electrodes 103 and 104 for a driving mechanism for moving the micro movable part. Here, the first and second micro movable parts are provided. However, the present invention is not limited to this, and one micro movable part may be used.

  With the configuration of the seventh embodiment, a control voltage is applied to the input electrodes 103 and 104 of the driving mechanism of the micro movable part after manufacturing, so that the resonance frequency of the micro resonance device 100 (center frequency of the micro filter device) is widened. Because it can be adjusted, the desired (design) against the uncertainty of the resonant frequency of the microresonator (center frequency of the microfilter device) due to processing variations during manufacture and variations in sealing pressure, which was not possible with the conventional method It becomes possible to use it after correcting and adjusting the value. In addition, since the micro-resonance device 100 of the present invention has the micro movable part and the micro-resonator integrated through the connection part, the reproducibility can be adjusted stably. Furthermore, since the adjustment range after manufacturing is greatly improved as compared with the conventional method, the yield can be obtained even by using a manufacturing apparatus and a manufacturing process having a processing accuracy within a range in which the yield cannot be obtained by the conventional method. In addition, since the deviation of the center frequency of the microfilter device can be corrected on the spot by controlling the micro movable part after encapsulation, the external environment (temperature) changes during use and the microresonance device itself deteriorates over time (sealing) Filter output can be corrected and optimally adjusted for pressure degradation and degradation of mechanical properties of microresonator materials, etc., extending the range of environmental conditions that can be used as a filter and extending the product life it can.

  In a more preferred embodiment of the microfilter device, a micro movable part control circuit 105 that controls the operation of the micro movable part is provided. This micro movable part control circuit 105 is connected to the input electrodes 103 and 104 to the drive mechanism of the micro movable part, and to the output electrode 102 of the micro resonant apparatus so that the output from the micro resonant apparatus 100 is input. They are connected via the wiring 106. As a result, when there is a difference between the desired center frequency to be selected by the microfilter device and the frequency of the signal output from the microresonator device 100 to the output electrode 102, the micro movable unit control circuit 105, for example, An adjustment knob or switch is provided to control the output voltage to the driving mechanism of the micro movable part and to adjust the frequency deviation stably and with good reproducibility so that a desired frequency signal is output from the micro resonance device 100. It becomes possible. This makes it possible to adjust the frequency output of the microfilter device on the spot according to the actual change in the use environment and the state of the microresonance device 100 during use.

  In a further preferred embodiment, the microfilter device includes a storage element 107, and the micro movable device adjusted so as to correct a deviation from a desired (designed) frequency to be selected at the time of shipment or previous adjustment. The control value (output voltage or set value for voltage output) of the unit control circuit 105 is stored in the storage element 107, and the micro movable unit control circuit stored in the storage element 107 at the start-up operation of the microfilter device The micro movable portion is controlled based on the control value 105, and is adjusted to the desired center frequency to be selected stably and with good reproducibility.

(Eighth embodiment)
Next, a micro oscillator will be described as an eighth embodiment. In the preferred embodiment, as shown in FIG. 11, the input electrode 121 includes the microresonator 120 of the present invention shown in any one of the first to sixth embodiments and is capacitively coupled to the microresonator. And an output electrode 122 for extracting a frequency signal selected by the microresonator, and input electrodes 123 and 124 for a driving mechanism for moving the micro movable part. Here, the first and second micro movable parts are provided. However, the present invention is not limited to this, and one micro movable part may be used.

  With the configuration of the eighth embodiment, the control voltage is applied to the input electrodes 123 and 124 of the driving mechanism of the micro movable part after manufacture, so that the resonance frequency of the micro resonance device 120 (oscillation frequency of the micro oscillator) is adjusted over a wide range. As a result, the desired (design) value can be achieved against the uncertainty of the resonance frequency of the microresonator (oscillation frequency of the micro-oscillator) due to processing variations during manufacturing and variations in sealing pressure, which was not possible with the conventional method. Correction and adjustment can be used. In addition, since the micro-resonance device 120 of the present invention has the micro movable part and the micro-resonator integrated with each other through the connection part, the reproducibility can be adjusted stably. Furthermore, since the adjustment range after manufacturing is greatly improved as compared with the conventional method, the yield can be obtained even by using a manufacturing apparatus and a manufacturing process having a processing accuracy within a range in which the yield cannot be obtained by the conventional method. In addition, since the deviation of the oscillation frequency of the micro oscillator can be corrected on the spot by controlling the micro movable part after encapsulation, changes in the external environment (temperature) during use and deterioration over time of the micro resonance device itself (sealing pressure) The frequency output can be corrected and optimally adjusted for the deterioration of the mechanical characteristics of the microresonator material and the mechanical characteristics of the microresonator material, and the range of environmental conditions that can be used as an oscillator can be expanded and the product life can be extended. .

  The micro oscillator shown in the eighth embodiment has the same basic configuration as the micro filter device shown in the seventh embodiment, and the eighth embodiment also provides the seventh embodiment. As in the embodiment, it is obvious that the same effect can be obtained by connecting to the micro movable part control circuit 125 and the storage element 127.

(Ninth embodiment)
Next, as a ninth embodiment, a wireless communication device using the microfilter device of the present invention as shown in the seventh embodiment and the micro oscillator of the present invention as shown in the eighth embodiment. explain.

  As shown in FIG. 12, the wireless communication device includes a transmission unit 650, a reception unit 651, a duplexer 652 that separates a transmission signal from the transmission unit 650 and a reception signal to the reception unit 651, and the transmission An antenna 653 that transmits a signal as a radio wave and receives the reception signal as a radio wave, the microfilter device 600 and the micro oscillator 601 connected to the transmitter 650 and the receiver 651 are provided.

  The transmission unit 650 includes a mixer 602, an amplifier 603, and a PA (Power Amplifier; power amplifier circuit) 604 in order from the upstream side to the downstream side where the transmission signal flows, and between the amplifier 603 and the PA 604, A microfilter device 600 is connected.

  The receiving unit 651 includes an LNA (Low Noise Amplifier) 605, a mixer 606, and an amplifier 607 in order from the upstream side to the downstream side where the received signal flows, and between the LNA 605 and the mixer 606. The micro filter device 600 is connected.

  The micro oscillator 601 is connected to both the mixer 602 of the transmitter 650 and the mixer 606 of the receiver 651. The micro oscillator 601 is connected to, for example, a VCO (Voltage Controlled Oscillator).

  In this way, by using the micro filter device 600 having a high Q value as a band pass filter of the transmission / reception units 650 and 651 of the wireless communication device, non-linear components that cause noise are removed or only a desired frequency signal is passed. It is possible to select a channel that removes all other frequency signals. Further, by using the micro oscillator 601 having a high Q value as a local (local) oscillator of the transmission / reception units 650 and 651 of the wireless communication device, effects such as phase noise reduction can be obtained.

  Therefore, in the present invention, it becomes possible to mount the micro filter device 600 and the micro oscillator 601 that can be adjusted after manufacture in a wireless communication device. Even if fluctuations occur in the frequency characteristics of the filter device 600 and the micro oscillator 601, the frequency characteristics of the microfilter can be adjusted by controlling the micro movable part while contrasting with the communication state, so that the communication state can be kept optimal. .

  In short, with the conventional technology, due to variations in processing accuracy and sealing pressure accuracy, it is not possible to produce a microfilter device and a micro oscillator that match the center frequency to the design value with high accuracy, and not only to obtain a yield, Even if it is mounted on a wireless device, the adjustment range after manufacture is narrow, so there is a problem that it cannot cope with changes in the external environment and deterioration over time of the microfilter device and the micro oscillator itself.

  Although not shown, the microfilter device 600 or the micro oscillator 601 may be used individually for a wireless communication device, and in this case, the individual effects are achieved.

It is a block diagram which shows the micro resonance apparatus of the 1st Embodiment of this invention. It is a top view which shows the dimension of a microresonator and a connection part. It is a block diagram which shows the state before operating a piezoelectric actuator while showing the structure of a piezoelectric actuator. It is a block diagram which shows the state after operating the piezoelectric actuator while showing the structure of a piezoelectric actuator. It is a block diagram which shows the micro resonance apparatus of the 2nd Embodiment of this invention. It is a block diagram which shows the micro resonance apparatus of the 3rd Embodiment of this invention. It is a block diagram which shows the micro resonance apparatus of the 4th Embodiment of this invention. It is a block diagram which shows an example when an electrostatic actuator is operated. It is a block diagram which shows the micro resonance apparatus of the 5th Embodiment of this invention. It is a block diagram which shows the micro resonance apparatus of the 6th Embodiment of this invention. It is a block diagram which shows the microfilter apparatus of the 7th Embodiment of this invention. It is a block diagram which shows the micro oscillator of the 8th Embodiment of this invention. It is a block diagram which shows the radio | wireless communication apparatus of the 9th Embodiment of this invention. It is a block diagram which shows the conventional micro resonance apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 11,41,81,91 Microresonator 12,52,62,82,92 Micro movable part 13,83,93 Connection part 15 Piezoelectric actuator 31,34 Piezoelectric element 32,33,35 Drive electrode 55,63, 64, 65, 85 Electrostatic actuators 57, 67, 69, 71 First electrode 56, 66, 68, 70 Second electrode 100 Micro resonance device 101 Input electrode 102 Output electrode 103, 104 Input electrode 105 Micro movable part control Circuit 107 Memory element 120 Micro resonance device 121 Input electrode 122 Output electrode 123, 124 Input electrode 125 Micro movable part control circuit 127 Memory element 650 Transmitter 651 Receiver 652 Duplexer 653 Antenna 600 Microfilter device 601 Micro oscillator

Claims (25)

A substrate,
A microresonator provided on the substrate;
At least one micro movable part that mechanically acts on the microresonator to change the frequency response characteristics of the microresonator;
A connection portion for connecting the microresonator and the micro movable portion;
The microresonator, the micro movable part, and the connection part are integrally formed at the same time,
The connection portion has a frequency response characteristic different from that of the microresonator,
When the micro-resonator vibrates at a natural resonance frequency, the connection part is not substantially displaced and hardly vibrates, and the connection part vibrates at the natural resonance frequency of the micro-resonator. In this case, the microresonance device does not perform substantial movement synchronized with the displacement of the microresonator. The microresonance device according to claim 1,
The micro-resonant device is characterized in that the micro-movable part is not substantially displaced and hardly vibrates when the micro-resonator vibrates at a specific resonance frequency. The microresonance device according to claim 1,
The micro-resonator according to claim 1, wherein the micro-movable part does not substantially move in synchronization with the displacement of the micro-resonator when the micro-resonator vibrates at a specific resonance frequency. The microresonance device according to claim 1,
The micro movable part includes a piezoelectric actuator,
The piezoelectric actuator includes a piezoelectric element and a drive electrode for applying displacement to the piezoelectric element. The microresonance device according to claim 4 , wherein
The microresonator according to claim 1, wherein the frequency response characteristic of the microresonator is changed by controlling a voltage applied to the drive electrode of the piezoelectric actuator. The microresonance device according to claim 4 , wherein
The microresonance device characterized in that the inherent resonance frequency of the microresonator is changed by controlling a voltage applied to the drive electrode of the piezoelectric actuator. The microresonance device according to claim 1,
The micro movable part includes an electrostatic actuator,
The electrostatic actuator includes a first electrode that is stationary and a second electrode that is spaced apart from the first electrode by a predetermined distance and is relatively movable with respect to the first electrode. A microresonance device comprising an electrode. The microresonance device according to claim 7 ,
The frequency response characteristic of the microresonator is changed by controlling a voltage difference applied between the first electrode and the second electrode of the electrostatic actuator. . The microresonance device according to claim 7 ,
The microresonance characteristic of the microresonator is changed by controlling a voltage difference applied between the first electrode and the second electrode of the electrostatic actuator. apparatus. The microresonance device according to claim 4 , wherein
There are multiple piezoelectric actuators,
A frequency response characteristic of the microresonator is changed by individually driving the piezoelectric actuators. The microresonance device according to claim 7 ,
There are multiple electrostatic actuators,
A frequency response characteristic of the microresonator is changed by individually driving the electrostatic actuators. The microresonance device according to claim 4 , wherein
There are multiple piezoelectric actuators,
The microresonance device characterized in that the inherent resonance frequency of the microresonator is changed by individually driving the piezoelectric actuators. The microresonance device according to claim 7 ,
There are multiple electrostatic actuators,
The microresonance device characterized in that the inherent resonance frequency of the microresonator is changed by individually driving the electrostatic actuators. The microresonance device according to claim 11 or 13 ,
The microresonance device, wherein when driving the plurality of electrostatic actuators, in at least one of the electrostatic actuators, the first electrode and the second electrode are in a pull-in state. The microresonance device according to claim 1,
The microresonator, the micro movable portion, and the connection portion are made of a material containing at least two elements in the composition, and one of the elements is a refractory metal element. apparatus. The microresonance device according to claim 15 ,
The microresonance device, wherein the refractory metal element is any one of tungsten, tantalum, molybdenum, and titanium. The microresonance device according to claim 1,
The microresonator, the micro movable portion, and the connection portion are made of a material containing at least two elements in the composition, and the material includes a refractory metal element and at least one of nitrogen, oxygen, and carbon. And a microresonance device. A microresonance device according to claim 1;
An input electrode capacitively coupled to the microresonator;
An output electrode for extracting a frequency signal selected by the microresonator;
A microfilter device comprising: an input electrode for operating the micro movable portion. The microfilter device according to claim 18 , wherein
A micro movable part control circuit connected to an output of the micro resonant device and an input for driving the micro movable part;
When there is a difference between the desired frequency to be selected and the frequency of the signal selected and output by the microresonance device, the micro movable unit control circuit is configured to output the desired frequency signal from the microresonance device. A microfilter device characterized by adjusting the micro movable portion. The microfilter device according to claim 19 ,
Comprising a storage element connected to the micro movable part control circuit;
This storage element stores the control value of the micro movable part adjusted to correct the difference from the desired frequency to be selected,
The micro movable portion control circuit controls the micro movable portion based on a control value of the micro movable portion stored in the storage element and adjusts an output frequency signal during a starting operation. A characteristic microfilter device. A microresonance device according to claim 1;
An input electrode capacitively coupled to the microresonator;
An output electrode for extracting a frequency signal selected by the microresonator;
A micro oscillator having an input electrode for operating the micro movable portion. The micro oscillator according to claim 21 , wherein
A micro movable part control circuit connected to an output of the micro resonant device and an input for driving the micro movable part;
The micro movable part control circuit adjusts the micro movable part while detecting the output so as to correct or optimize the fluctuation of the frequency output by the micro resonance apparatus. The micro oscillator according to claim 22 , wherein
Comprising a storage element connected to the micro movable part control circuit;
The storage element stores the control value of the micro movable unit adjusted to correct or optimize the difference between the desired frequency to be output and the actual frequency,
The micro movable portion control circuit controls the micro movable portion based on a control value of the micro movable portion stored in the storage element and adjusts an output frequency signal during a starting operation. A featured micro oscillator. A transmission unit;
A receiver,
A duplexer for separating a transmission signal from the transmission unit and a reception signal to the reception unit;
An antenna for transmitting the transmission signal as a radio wave and receiving the reception signal as a radio wave;
A wireless communication device comprising: the microfilter device according to claim 18 connected to at least the transmitter and the receiver. A transmission unit;
A receiver,
A duplexer for separating a transmission signal from the transmission unit and a reception signal to the reception unit;
An antenna for transmitting the transmission signal as a radio wave and receiving the reception signal as a radio wave;
A wireless communication device comprising: the micro oscillator according to claim 21 connected to at least the transmitter and the receiver.

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