JP4448468B2 - Memory card connector - Google Patents

Description

  The present invention relates to a memory card connector for electrical connection with a memory card for electrical connection by exposing contacts on the surface.

  Memory cards are used in electronic devices such as digital cameras and mobile phones, but the memory card has a plurality of card PAD sections arranged in parallel on the card surface as contacts for external electrical connection. Things are common.

For example, in a miniSD card, as shown in FIG. 10, eleven card PAD parts are exposed on the card surface. Hereinafter, in the present invention, a miniSD card will be described as an example, and the miniSD card will be referred to as a memory card unless otherwise specified.
The structure of the memory card will be described based on FIG.
The memory card C is formed by arranging a plurality of card PAD portions C2 in parallel on one end of the card surface C1. The card PAD portion C2 is provided in a rectangular shape substantially flat with the surface C1 on the inner side of about 1 mm to several mm from the insertion side end of the memory card C. A portion from the end of the memory card C where the card PAD portion C2 is provided to the card PAD portion C2 is formed as a mold portion C3.
Various memory card connectors have been devised for electrical connection with the memory card C configured as described above, and general memory card connectors will be described below as conventional examples.

Reference numeral 100 denotes a conventional memory card connector. As shown in FIG. 10, the memory card connector 100 has a thickness of the memory card C, and a housing 101 into which the memory card C can be mounted forms a main body. Then, from both sides of the main body 101, a card guide is formed by arranging a card holding portion 102 having a U-shaped groove so that the U-shaped opening faces each other. Accordingly, the memory card connector 100 has a shape in which the card holding portion 102 protrudes in an arm shape from both sides of the housing 101.
The card is slid on the card holding portion 102 from the card PAD portion C2 side, and the memory card C is mounted on the housing 101.
In order to ensure this mounting, the slider 103 is provided in one of the card holders 102. The slider 103 is provided with a coil spring 104 on the housing 101 side. When the memory card C is inserted into the housing 101, the slider 103 gives a feeling of mounting by an urging force and releases the urging force when the mounting is completed at a predetermined position. Insert the memory card C. When releasing the memory card C, the slider 103 is pressed toward the housing 101 so that the memory card C is released from the housing 101 so that the memory card C is released by the urging force of the spring 104. Extrude C.
Various methods are conceivable for attaching and detaching the memory card C by the slider 103, and there is a space for pinching the memory card C when the memory card C is attached and detached, and it is not particularly necessary if it can be attached and detached by a finger.

The housing 101 is provided with a plurality of contacts 105 so as to be positioned at the card PAD portion C2 of the memory card C when the memory card C is attached to the memory card connector 100.
As shown in FIG. 11, the contact 105 is formed by bending a metal plate, which is a conductive member, and is plated to increase the electrical conductivity. The contact 105 has an elongated flat plate shape, and a connection portion 107 that is bent and protruded in an L shape extends from one end of the attachment portion 106 that is mounted and fixed to the housing 101. The tip of the connecting portion 107 is further bent and connected to an electronic board or the like incorporated in the electronic device by soldering or the like. Furthermore, the other end extended from the attachment part 106 of the contact 105 is provided with a contact part 108 curved in a loose round shape.
As shown in FIG. 10, a plurality of contacts 105 configured in this way are fixed in parallel so as to be positioned on the card PAD portion C2 of the loaded memory card C. The contact 105 is located below the surface of the memory card C when the memory card C is not mounted in order to obtain a contact pressure between the contact portion 108 and the card PAD portion C2. When C is attached, the contact portion 108 is bent upward against the mold portion C3 of the memory card C against the spring force, gets over the front end portion of the memory card C and contacts the surface of the mold portion C3. As the insertion of the memory card C further proceeds, the contact portion 108 of the contact 105 eventually gets over while rubbing against the surface of the mold portion C3, and comes into contact with the card PAD portion C2 so that the memory card C and the memory card connector 100 are connected. Electrical connection is made.

  However, in the structure of the conventional contact 105, when the memory card C is mounted on the memory card connector 100, the contact portion 108 of the contact 105 always gets over the mold portion C3 while rubbing against the mold portion C3 of the memory card C. As a result, the mold part C3 is scraped by friction with the contact part 108, and the shavings adhere to the contact part 108, which promotes the plating wear of the contact part 108 and the card PAD part C2.

  Then, the plating applied to the contact portion 108 of the contact 105 is worn by the wear of the plating 105, so that it is difficult to maintain a good connection state for a long time, and there is a problem that the contact reliability is reduced. .

  Therefore, in view of the above problems, the present invention has an object to provide a contact structure that reduces the plating wear of the contact portion when overcoming the mold portion and does not reduce the contact reliability generated by the contact with the mold portion. A memory card connector that solves this problem is provided.

The memory card connector according to the present invention includes: (a) a memory card having a card PAD portion on its surface and having guide protrusions on both sides, and slidingly fitting the guide protrusions of the memory card from a mounting start position to a mounting completion position. A housing having a guide portion for holding and guiding; and (b) a contact provided on the housing and electrically connected to the card PAD portion of the memory card that is positioned at the mounting completion position and has been mounted. The contact includes: (b1) an attachment portion for fixing to the housing; (b2) a first contact that contacts a surface of the memory card located at the mounting start position; and the first contact Projecting to the side facing the memory card guided by the guide portion at a location between the mounting portion and the mounting portion, and starting the mounting Contact pressure with which the card PAD positioned at the mounting completion position can be sufficiently contacted without contacting the surface of the memory card positioned between the card and the mounting completion position or with a low contact pressure. And (c) the guide portion is moved from the attachment start position to the attachment completion position as it is moved from the attachment start position to the attachment completion position. A step portion for guiding the memory card is provided to bring the card PAD portion closer to the contact portion.

In the memory card connector of the present invention, when a memory card is inserted into a housing into which the memory card can be inserted, the second contact of the contact provided on the housing gets over the mold part of the memory card and comes into contact with the card PAD part. When the second contact of the contact goes over the mold part of the memory card, the first contact provided in the contact part gets over the mold part, and then the second contact is located in the mold part. Since the first contact is in contact with the surface of the memory card, the second contact is made without contact with the mold part or with a low contact pressure, and the second contact is located in the card PAD part when the card insertion is completed. Sometimes it contacts the card PAD part of the memory card with sufficient contact pressure and is electrically connected. The low contact where the first contact is in contact with the surface of the memory card and the second contact is in contact with the surface of the memory card is a contact pressure lower than the contact pressure in contact with the card PAD when the memory card is completely inserted. If there is, wear of the second contact can be prevented .

In the present invention, the memory card is mounted while the guide portions guide both sides of the insertion width side of the memory card. Since the contact side of the guide portion is on the back side of the memory card and the side opposite to the contact is on the side opposite to the PAD portion for the memory card, the memory card is located on the back side at the start of insertion. The contact is moved while contacting the PAD part and the second contact is made without contact with the mold part or with a low contact pressure. As the memory card is inserted into the guide part, the first contact is moved. When the memory card is moved to the front side beyond the PAD portion, the second contact contacts the PAD portion with sufficient contact pressure to establish an electrically conductive state .

According to the present invention, the contact portion formed at the contact tip of the memory card connector is curved or bent to form the first contact and the second contact, and the first contact on the tip side is the memory card. After overcoming the mold part, the second contact, which is the contact on the other side, does not come into contact with the mold part when overcoming the mold part, so that the contact does not come into contact with the mold part and the mold part is shaved. There is an effect that the reliability of electrical contact can be improved without being worn and without promoting the wear of the plating of the contact.
Further, when the second contact is brought into contact with the memory card surface with a low contact pressure because the first contact is in contact with the surface of the memory card, the contact pressure of the second contact is Since the contact pressure is lower than the contact pressure at which a sufficient conduction state can be obtained in contact with the card PAD part, it is possible to reduce the wear of the mold part due to the second contact and to reduce the plating wear of the contact compared to the prior art. It has the effect.

The memory card connector has a housing in which a card holding portion having a U-shaped groove portion having a thickness of the memory card is disposed so that the U-shaped grooves face each other on both sides of the memory card. .
One card holding part is provided with a slider. The slider is provided with a coil spring on the base side of the housing, and when the memory card is inserted into the housing, it gives a feeling of mounting by an urging force and releases the urging force when the mounting is completed at a predetermined position. Put on. When releasing the memory card, the slider is pressed toward the base, and the memory card is pushed out to the side opposite to the base so as to release the memory card by the biasing force of the spring.
In addition, a plurality of contacts are provided on the base of the housing so as to be positioned in the card PAD portion of the memory card when the memory card is mounted on the memory card connector.
A base portion of the contact is fixed to the housing, and one end extending from the base portion is exposed to the outside of the housing to form a connection portion. The other end is bent or bent into a W shape to form a contact portion having a double contact. The contacts are plated to improve the electrical connection with the card PAD part.

The contact formed in this way and fixed to the housing is located on the inside of the memory card when the memory card is installed, and the contact is formed on the surface of the memory card when the memory card is installed. The contact pressure is obtained by the biasing force generated by the spring force of the card PAD portion and the contact.
Also, the contact part of the contact that has two W-shaped contacts must be in contact with the memory card surface when the contact part gets over the card PAD part of the memory card when the memory card is installed. Thus, the other contact is located in the card PAD part without contacting the mold part, and can be connected to the card PAD part.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective explanatory view showing an embodiment of the present invention, FIG. 2 is a perspective explanatory view showing parts of the embodiment of the present invention, and FIG. 3 is a partially enlarged explanatory view of FIG.

  Reference numeral 1 denotes a memory card connector according to an embodiment of the present invention. The memory card connector 1 is a connector that enables electrical connection with the inserted memory card C. As shown in FIG. 1, a housing 2 that holds the inserted memory card C, and both ends of the housing 2 The card holding part 3 that extends from the side and also holds the memory card C, and the contact 4 that makes electrical connection by contacting the memory card C inserted into the housing 2.

Here, the memory card C used in the description of this embodiment will be described in detail.
As described in the prior art, the memory card C has a card PAD portion exposed on the surface of a plurality of cards for electrical connection and information exchange or signal exchange with other devices as shown in FIG. For example, a miniSD card. Hereinafter, in the present invention, a miniSD card will be described as an example, and it is simply referred to as a memory card unless otherwise specified. Therefore, the structure of the memory card C will be described with reference to FIG.
The memory card C is formed by arranging a plurality of card PAD portions C2 in parallel on one end of the card surface C1. A plurality of the card PAD portions C2 are arranged in parallel with the end portion on the insertion side to the memory card connector 1, and are provided at 11 locations in this embodiment. The card PAD portion C2 is provided in a rectangular shape approximately flat with the surface C1 on the inner side of about 1 mm to several mm from the insertion side end portion of the memory card C, and the memory card provided with the card PAD portion C2 The mold portion C3 is formed from the C end to the card PAD portion C2.

Next, details of the memory card connector 1 will be described.
In the memory card connector 1, a housing 2 formed by molding an insulating material into a thin plate having a substantially rectangular shape forms a main body. Then, from both sides of the housing 2, card holding portions 3 capable of holding cards are respectively extended to face each other. The card holding unit 3 has a U-shaped groove 31 and is provided so as to face each other. The U-shaped groove 31 of the card holding part 3 constitutes a card guide. Accordingly, the memory card connector 1 has a shape in which the card holding portion 3 protrudes from both sides of the housing 2 in an arm shape, and the memory card C is inserted along the groove portion 31 as shown in FIG. It can be held.

  Further, a slider 32 is provided on one side of the card holding unit 3. The slider 32 is a mechanism for ensuring that the memory card C is attached to the memory card connector 1 when the memory card C is attached to the memory card connector 1. One of the card holders 3 (the left card holder 3 in FIG. 1). Provided. The slider 32 is provided with a coil spring 33 on the housing 2 side, and when the memory card C is inserted into the housing 2, the memory card is placed on the opposite side of the insertion side by the biasing force of the coil spring 33 so as to give a feeling of mounting. Energize C. Further, when the memory card C is inserted to a predetermined position of the housing 2 and the mounting is completed, the urging force is released and the memory card C is mounted. When releasing the memory card C, the slider 32 is pressed toward the housing 2 so that the memory card C can be released by the biasing force of the coil spring 33 so that the memory card C is released. Card C is pushed out.

Various methods are conceivable for attaching / detaching the memory card C by the slider 32. Further, if there is a space where the memory card C can be pinched when the memory card C is attached / detached, it may not be provided.
Further, the housing 2 has a plurality of contacts 4 facing the card PAD portion C2 of the inserted memory card C so that the housing 2 protrudes so as to come into contact with the card surface C1 on the side where the memory card C is inserted. Are arranged side by side.

As shown in FIG. 2, the contact 4 is formed by bending a long and narrow plate-like body, and the plate-like body is a good conductor and a metal plate having a spring force. This spring force enables a sufficient contact pressure to be obtained when the contact 4 comes into contact with the card PAD portion C2 of the memory card C. Further, the surface of the contact 4 is gold-plated so that a good conductive state can be maintained when contacting the card PAD portion C2.
The contact 4 is a central portion, and an elongated contact base portion 41 is formed so that the spring force can be sufficiently exerted. Further, the contact 4 forms an attachment portion 42 by bending one end of the contact base portion 41 into an L shape.

Further, the attachment portion 42 is bent at its tip into an L shape, and forms a soldering portion 43 for electrical connection with other electronic materials such as electronic equipment by soldering or the like.
Further, at the other end of the contact base portion 41, two mortar-shaped depressions curved in a round shape are continuously formed in two W-shapes to provide contact portions 44. In the contact portion 44, the rounded portion on the tip side is a dummy contact portion 45, and the rounded portion provided on the contact base 41 side is a contact contact portion 46.

  The contact 4 formed in this way has the mounting portion 42 in the housing so that the contact portion 44 protrudes from the surface of the housing 2 on the mold portion C3 side to the memory card C side when the memory card C is inserted into the housing 2. 2 is fixed. Thus, when the contact base 41 is fixed to the housing 2, the soldering portion 43, which is the tip of the mounting portion 42, protrudes from the back surface side of the housing 2 and the memory card C is inserted. In the absence, the contact portion 44 is lowered from the card surface C1 into the memory card C. In addition, by setting the contact portion 44 below the card surface C1, the contact base 41 is moved upward when the dummy contact portion 45 gets over the mold portion C3 when the memory card C is inserted into the memory card connector 1. Therefore, when the contact portion 44 comes into contact with the card PAD portion C2, a good contact pressure can be obtained by the spring force of the contact base portion 41. Further, as shown in FIG. 3, the dummy contact portion 45 and the contact contact portion 46 are shaped so that the dummy contact portion 45 gets over the mold portion C3 while rubbing against the mold portion C3. When moving over C3, the dummy contact portion 45 moves while contacting the card surface C1, so that the contact contact portion 46 can be positioned on the card PAD portion C2 without contacting the mold portion C3. Incidentally, the contact 4 in this embodiment is such that when the dummy contact portion 45 is in contact with the card surface C1, that is, between the time when the memory card C is inserted and the time when the memory card C is inserted, the contact contact portion 46 Although it is configured not to contact the surface C1, the contact contact portion 46 may be configured to contact the card surface C1 even during the insertion of the memory card C to the completion of the insertion. In this case, the contact contact portion 46 can suppress friction with the mold portion C3 by reducing the contact pressure between the contact portion 46 and the mold portion C3 of the memory card C as much as possible. Therefore, the lower the contact pressure, the more effective, and the non-contact effect is most effective. However, the contact pressure between the contact contact portion 46 and the card surface C1 when the dummy contact portion 45 is in contact with the card surface C1 maintains good electrical contact with the card PAD portion C2 when the card is installed. If the contact pressure is lower than the contact pressure, the wear of the plating of the mold part C3 and the contact contact part 46 can be reduced, so the low contact pressure is lower than the contact pressure maintaining good electrical contact with the card PAD part C2. Any contact pressure may be used. The contact by these low contact pressures is the same in Example 2 and Example 3 described later.

The memory card C is inserted into the thus configured memory card connector 1. That is, the memory card C is inserted into the groove portion 31 from the mold portion C3 side. Eventually, the leading end of the memory card C on the insertion side reaches the contact 4 provided on the housing 2. At this time, since the contact portion 44 of the contact 4 is located below the card surface C1, if the insertion of the memory card C is further continued, the dummy contact portion 45 of the contact portion 44 moves to the card surface C1 due to the rounded shape of the tip. Ride and move on the card surface C1 while making contact with the mold part C3.
When the insertion of the memory card C further proceeds, the contact contact portion 46 approaches the memory card C before long. However, since the dummy contact portion 45 moves while being in contact with the card surface C1, the contact contact portion 46 does not come into contact with the mold portion C3, that is, the contact contact portion 46 is not worn by friction. Get over part C3.

When the insertion of the memory card C further proceeds, the contact contact portion 46 moves to the position of the card PAD portion C2 of the memory card C. At this time, the contact contact portion 46 comes into contact with the memory card C for the first time due to the shape of the contact portion 44 of the contact 4, so that it comes into contact with the card PAD portion C 2.
In this way, a good contact pressure is obtained by biasing by the spring force of the contact 4 and the contact contact portion 46 and the card PAD portion C2 come into contact with each other, so that the electrical connection between the memory card connector 1 and the memory card C is achieved. The memory card C is electrically connected to the electronic member to which the memory card connector 1 is connected via the mounting portion 42 of the contact 4.

  In this embodiment, the memory card C is described as an example of a miniSD card. However, the memory card C that can be used in the present invention is not limited to a miniSD card, but a memory stick, an MS / Duo card, an XD / picture card, and a smart card. Any type of memory card may be used as long as it is a memory card having a card PAD portion C2 on the card surface, such as a media, SD memory card, or SIM card. Furthermore, the memory card C is not limited to a card containing a storage medium, but is provided for an electronic device that is connected in the same manner as the memory card C by providing an electrical connection portion similar to the card PAD portion of the card and inserting it into the connector. Of course, it can also be used for an adapter for connecting other electronic members having the shape of a miniSD card, for example, so that the memory card C includes these members.

  Next, Example 2 will be described with reference to the drawings. 4 is a perspective explanatory view showing the second embodiment, FIG. 5 is an explanatory view of the memory card D, FIG. 6 is an explanatory view of the card holding portion, and FIG. 7 is a contact between the memory card D and the contact 4. It is explanatory drawing showing a state.

As shown in FIG. 5, the memory card D used in the second embodiment is provided with a card PAD portion D2 on the card surface D1 in the same manner as the memory card C used in the first embodiment, and the card PAD portion D2 and the memory card D The mold part D3 is formed between the front end part of the mold. Unlike the memory card C, guide protrusions D4 for guiding the memory card D when the memory card D is inserted are provided on the left and right side surfaces of the memory card D inserted in the front-rear direction.
As shown in FIG. 4, the memory card connector 1 according to the second embodiment has a main body formed of a housing 2 formed by molding an insulating material into a substantially rectangular thin plate as in the first embodiment. Then, from both sides of the housing 2, card holding portions 3 capable of holding cards are respectively extended to face each other. The card holding unit 3 has a U-shaped groove 31 and is provided so as to face each other. In the first embodiment, the groove 31 is configured such that the entire end portion of the memory card C is inserted and guided. However, in the second embodiment, the guide protrusion D4 of the memory card D is inserted and guided. It is configured. The U-shaped groove 31 of the card holding part 3 constitutes a card guide. Therefore, the memory card connector 1 has a shape in which the card holding portion 3 protrudes in an arm shape from both sides of the housing 2, and the guide protrusion D4 of the memory card D shown in FIG. The memory card D can be guided. In addition, the contact 4 in Example 2 is provided similarly to Example 1.
Moreover, the groove part 31 provided in the card holding part 3 is configured by providing a step as shown in FIG. The groove portion 31 is provided so that the contact 4 side is located above the memory card D insertion side, that is, on the surface side of the memory card D, and the center portion forms a step portion 31a. Accordingly, the groove portion 31 is on the memory card D insertion side on the left side in the drawing and the contact 4 side on the right side, and the dummy contact portion 45 and the contact contact portion 46 of the contact 4 are formed on the memory card D from the upper right side in the drawing. It is desired to the surface D1 side.

  Further, a slider 32 is provided on one side of the card holding unit 3. The slider 32 is the same as that of the first embodiment, but is not shown because it is provided outside the card holding portion 3 that appears on the left side in the drawing. However, the function and configuration of the slider 32 are the same as those in the first embodiment.

Various methods are conceivable for attaching and detaching the memory card C by the slider 32. Further, if there is a space where the memory card D can be pinched when the memory card D is attached or detached, and it can be attached and detached by a finger, it may not be provided.
The housing 2 further has a plurality of contacts 4 facing the card PAD portion D2 of the inserted memory card D so that the housing 2 protrudes so as to come into contact with the card surface D1 on the side where the memory card D is inserted. Are arranged side by side.

The memory card D is inserted into the memory card connector 1 configured as described above. That is, the memory card D is inserted from the mold part D3 side, and the guide protrusion D4 is inserted into the groove part 31. As a result, the guide protrusion D4 is positioned at the step portion 31a immediately before the insertion-side end of the memory card D reaches the contact 4 provided on the housing 2, that is, as shown in FIG. 7A. It becomes. In this state, the dummy contact portion 45 of the contact 4 contacts the card surface D1, and the contact contact portion 46 is already positioned on the card surface D1 beyond the mold portion D3, but the dummy contact portion 45 is located on the card surface D1. The contact contact portion 46 is prevented from contacting the card surface D1. When the memory card D is further inserted, the stepped portion 31a is moved upward, and the memory card D is further inserted into the contact 4 side. As shown in FIG. 7B, the memory card moved to the contact 4 side. The card PAD portion D2 of D is connected to the contact contact portion 46 with sufficient contact pressure.
Therefore, when the memory card D is positioned at the stepped portion 31a, the contact contact portion 46 has already exceeded the mold portion D3, and the card PAD portion D2 comes into contact with further insertion, so the mold portion D3 of the contact contact portion 46 Wear due to contact with can be prevented.

  FIG. 8 is a perspective explanatory view showing a memory card used in the third embodiment of the third embodiment of the memory card connector 1 and FIG. 8 is an explanatory view of the contact state in the third embodiment. FIG. 9B shows a state before completion of card insertion, and will be described with reference to FIG.

The shape of the memory card is, for example, the shape of the memory card E used in the third embodiment in addition to the one described in the first and second embodiments.
That is, as shown in FIG. 8, the memory card E in the third embodiment is different from the cards shown in the first or second embodiment, and the card surface E1 on the opposite side to the mold portion E3 of the card PAD portion E2. Has a concave surface E4. Other than the memory card E in the third embodiment, a plurality of card PAD portions E2 are provided at one end of the card surface E1, like the memory card C in the first embodiment, and the end portion and the card PAD portion E2 are connected to each other. The space forms the mold part E3.
The third embodiment is an explanation of a memory card connector 1 effective for such a memory card E.

That is, in the memory card connector 1 in the third embodiment, the housing 2 and the card holding portion 3 are the same as those in the first embodiment.
The configuration of the contact 4 is the same as that of the first embodiment. However, the shape of the contact 4 in the first embodiment is such that the dummy contact portion 45 rides over the mold portion C3 while rubbing against the mold portion C3, but then when the contact contact portion 46 gets over the mold portion C3, the dummy contact portion 45 The contact contact portion 46 has a shape that can be positioned on the card PAD portion C2 without contacting the mold portion C3 by moving while contacting on the card surface C1, whereas in the third embodiment, the dummy contact is provided in the third embodiment. The contact contact portion 46 is configured so as not to contact the card surface C1 when the dummy contact portion 45 is in contact with the card surface C1 after the portion 45 gets over the card PAD portion C1 shown in the embodiment.

In the memory card connector 1 configured as described above, the memory card E is positioned at the contact 4 when the memory card E is inserted into the groove portion 31 of the card holding portion 3 and mounted. Then, when the mounting is further advanced, as shown in FIG. 9A, the dummy contact portion 45 gets over the end portion on the mold portion E3 side and slides on the mold portion E3, and then slides on the card PAD portion E2. It will be. At this time, the contact point 46 is not yet in contact with the surface of the memory card E due to the shape of the contact point 44.
When the memory card E is further mounted, the dummy contact portion 45 enters the surface recess E4 beyond the PAD portion E2. Then, the contact contact portion 46 of the contact 4 is brought into a pressure contact state with the card PAD portion E2 by the spring force of the contact 4 itself by releasing the contact with the card surface E1 of the dummy contact portion 45, and an electrical good contact is made. Will be done.

  In the third embodiment, the contact shape is different from that in the first embodiment. When the dummy contact portion 45 is over the card PAD portion C1 and the dummy contact portion 45 is in contact with the card surface, the contact contact portion 46 is used. However, even if the shape is the same as that of the first embodiment, there is no problem. Therefore, the memory card connector 1 according to the first embodiment is an embodiment that can be used in common for any of the memory cards C, D, and E.

  As described above, the memory card connector according to the present invention has a card PAD portion on the surface of a card such as a memory stick, an MS / Duo card, an XD / picture card, a smart / media card, an SD memory card, a SIM card, etc. Since the memory card connector is electrically connected to the memory card, it can be used in various electronic devices such as a mobile phone, a portable terminal, a digital camera, a personal computer, and a printer used in the computer.

FIG. 3 is an explanatory perspective view illustrating the first embodiment of the present invention. FIG. 3 is an explanatory perspective view showing parts of the first embodiment of the present invention. Partly enlarged explanatory view of FIG. An explanatory perspective view showing Embodiment 2 of the present invention. FIG. 7 is an explanatory perspective view showing a memory card used in the second embodiment. Explanatory drawing showing the operation | movement in Example 2. FIG. It is explanatory drawing of the contact state of the contact in Example 2, (a) represents the state before completion | finish of card | curd installation, (b) represents the time of completion | finish of attachment. FIG. 6 is an explanatory perspective view showing a memory card used in the third embodiment. It is explanatory drawing of the contact state of the contact in Example 3, (a) represents the state before completion | finish of card | curd installation, (b) represents the time of completion | finish of attachment. Explanatory drawing showing a conventional example Explanatory drawing showing parts of conventional example

Explanation of symbols

C Memory card C1 Card surface C2 Card PAD part C3 Mold part D Memory card D1 Card surface D2 Card PAD part D3 Mold part D4 Guide protrusion E Memory card E1 Card surface E2 Card PAD part E3 Mold part E4 Surface recess 1 Connector for memory card 2 Housing 3 Card holding part 31 Groove part 31a Step part 32 Slider 33 Coil spring 4 Contact 41 Contact base part 42 Mounting part 43 Solder part 44 Contact part 45 Dummy contact part 46 Contact contact part

Claims (1)

A housing having a guide portion for guiding the memory card from a mounting start position to a mounting completion position by slidingly fitting the guide protrusion of the memory card having a card PAD portion on the surface and having guide protrusions on both sides ;
Provided in the housing, and the contact connecting the card PAD section and the electrical to the memory card positioned mounting is completed to the mounting completion position,
With
The contact is
A mounting portion of the order is fixed to the housing,
A first contact point that contacts the surface of the memory card located at the mounting start position , and a side facing the memory card that is guided by the guide portion at a position between the first contact point and the mounting portion. to protrude, the contact with the memory card surface and the or a low contact pressure without contact located between the attachment start position and the attachment completing position, sufficient conduction and the card PAD positioned in the attachment completing position a contact portion for extending from the attachment portion to form the second contact you contact with the contact pressure obtained by the state, and
Have
The guide portion includes a step portion for guiding the memory card so that the card PAD portion is brought closer to the contact portion as it is moved from the attachment start position to the attachment completion position.
Connector for memory cards that feature a call.

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