JP4446297B2 - Opening device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical aperture manufacturing apparatus. In particular, the present invention relates to an aperture manufacturing apparatus used in a near-field optical device that irradiates and detects near-field light.
[0002]
[Prior art]
A scanning probe microscope (SPM) typified by a scanning tunneling microscope (STM) or an atomic force microscope (AFM) is used to observe a minute region on the order of nanometers on the sample surface. SPM scans a sample surface with a probe with a sharpened tip, and observes the interaction between the probe and the sample surface, such as tunneling current and atomic force, with an image of resolution depending on the probe tip shape. However, restrictions on the sample to be observed are relatively severe.
[0003]
Therefore, the near-field optical microscope (SNOM), which enables observation of minute areas on the sample surface by focusing on the interaction between the near-field light generated on the sample surface and the probe, is drawing attention. Has been.
[0004]
In the near-field optical microscope, the surface of the sample is irradiated with near-field light from an opening provided at the tip of a sharpened optical fiber. The aperture has a size equal to or smaller than the diffraction limit of the wavelength of light introduced into the optical fiber, and has a diameter of about 100 nm, for example. The distance between the opening formed at the probe tip and the sample is controlled by the SPM technique, and the value is less than the size of the opening. At this time, the spot diameter of the near-field light on the sample is substantially the same as the size of the opening. Therefore, it is possible to observe the optical properties of the sample in a minute region by scanning near-field light irradiated on the sample surface.
[0005]
In addition to being used as a microscope, by introducing relatively high intensity light toward the sample through the optical fiber probe, near-field light having a high energy density is generated at the opening of the optical fiber probe, and the sample surface is generated by the near-field light. The present invention can also be applied as a high-density optical memory recording that locally changes the structure or physical properties. In order to obtain near-field light with high intensity, attempts have been made to increase the tip angle of the probe tip.
[0006]
In these devices using near-field light, the formation of openings is the most important. As one of the manufacturing methods of the opening, a method disclosed in Japanese Patent Laid-Open No. 5-21201 is known. In the method of manufacturing an opening disclosed in Japanese Patent Application Laid-Open No. 52-1201, a sample in which a light shielding film is deposited on a sharpened light wave guide is used as a sample for forming an opening. In the manufacturing method of the opening, the light shielding film at the tip is plastically deformed by pressing a sharpened light wave guide with a light shielding film against a hard flat plate with a very small pressing amount well controlled by a piezoelectric actuator.
[0007]
As a method for forming the opening, there is a method disclosed in JP-A-11-265520. In the method of manufacturing an opening disclosed in Japanese Patent Laid-Open No. 11-265520, an object for forming an opening is a projection tip formed by a focused ion beam (FIB) on a flat plate. The opening is formed by irradiating the light shielding film at the tip of the projection with FIB from the side surface and removing the light shielding film at the tip of the projection.
[0008]
[Problems to be solved by the invention]
However, according to the method of Japanese Patent Laid-Open No. 5-21201, an opening can be formed only one by one. In addition, according to the method of Japanese Patent Publication No. Hei 5-12201, it is necessary to control the pushing amount by a piezoelectric actuator having a moving resolution of several nanometers, so that the opening forming device is less influenced by vibrations from other devices and air. It must be smelled. In addition, it takes time to adjust the light propagating rod so that it is perpendicular to the flat plate. In addition to a piezoelectric actuator with a small amount of movement, a mechanical translation table with a large amount of movement is required. Furthermore, a control device is required to control the push-in amount using a piezoelectric actuator having a small moving resolution, and it takes several minutes to control and form the opening. Therefore, a large-scale device such as a high voltage power supply or a feedback circuit is required for manufacturing the opening. Further, there is a problem that the cost for forming the opening is increased.
[0009]
Further, according to the method of JP-A-11-265520, the object to be processed is a projection on a flat plate, but since the opening is formed using FIB, the time required for forming one opening is as long as about 10 minutes. . Also, in order to use FIB, the sample must be placed in a vacuum. Therefore, there is a problem that the manufacturing cost for the opening manufacturing becomes high.
[0010]
[Means for Solving the Problems]
The present invention has been made in view of the above problems, and in an opening forming apparatus for forming an optical opening at a tip of a cone-shaped chip, the chip is disposed in the vicinity of the chip, and is substantially the same as the chip. For a stopper having the same height and at least an opening forming body made of at least a light-shielding film formed on the chip, a pressing body having a substantially flat surface that covers at least a part of the chip and the stopper is fixed. An opening forming apparatus for forming an optical opening is characterized in that an optical opening is formed at the tip of the chip by displacing with a force having a component toward the chip by a load means controlled by a load of . Therefore, according to the opening forming apparatus for forming an optical opening of the present invention, since the displacement of the plane is controlled by the stopper having substantially the same height as the chip, it is only necessary to push the plane with a predetermined force. An optical aperture can be easily produced. In addition, the opening can be formed under various environments such as vacuum, liquid, and air. In addition, since no special control device is required when producing the optical aperture, the device for producing the optical aperture can be simplified. In addition, the time for applying the predetermined force can be easily shortened, and the time required for opening preparation can be shortened. Therefore, the cost required for opening preparation can be reduced.
[0011]
Further, the present invention has a position control means for controlling a relative position between a load target point located directly above the tip end portion of the pusher and a load point generated by the load means. An opening forming apparatus for forming an optical opening according to claim 1 is provided. Therefore, since the displacement amount of the pusher can be controlled by a constant load with respect to the heavy target point, the size is uniform and a minute optical opening can be easily produced. It is easy to improve the production yield of optical openings.
[0012]
3. The optical system according to claim 2, wherein the opening forming body includes a plurality of load control means that includes a plurality of the chips and the stoppers and can simultaneously load the plurality of load target points. An opening forming apparatus for forming a typical opening. Therefore,
4. The aperture forming apparatus for forming an optical aperture according to claim 1, further comprising automatic aperture forming means for automatically controlling the load means and the position control means. . Therefore, since the object to be opened is composed of a plurality of the chips and the stopper, it is possible to form optical openings in the plurality of chips at a time by applying the force collectively. The processing time per opening can be made extremely short, and as a result, the manufacturing cost of the optical opening can be reduced.
[0013]
4. The aperture forming apparatus for forming an optical aperture according to claim 1, further comprising automatic aperture forming means for automatically controlling the load means and the position control means. . Therefore, by automatically controlling the load means and the position control means, automation can be achieved, and as a result, the manufacturing cost of the optical aperture can be reduced.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a method for forming an opening according to the present invention will be described in detail with reference to the accompanying drawings.
(Embodiment 1)
1 to 3 are diagrams for explaining an opening forming apparatus for forming an optical opening according to Embodiment 1 of the present invention. . A workpiece 1000 shown in FIG. 1 includes a transparent layer 5 formed on a substrate 4, a weight-like chip 1 and a ridge-like stopper 2 formed on the transparent layer 5, a chip 1, a stopper 2, and a transparent layer 5. The light shielding film 3 is formed on the substrate. In the workpiece 1000, the transparent layer 5 is not always necessary. For example, the light shielding film 3 is formed on the chip 1, the stopper 2, and the substrate 4 as shown in FIG. Further, the light shielding film 3 may be deposited only on the chip 1.
[0015]
The height H1 of the chip 1 is several mm or less, and the height H2 of the stopper 2 is several mm or less. The difference between the height H1 and the height H2 is 1000 nm or less. The distance between the tip 1 and the stopper 2 is several mm or less. The thickness of the light shielding film 3 is several tens nm to several hundreds nm although it varies depending on the material of the light shielding film 3.
[0016]
The chip 1, the stopper 2 and the transparent layer 5 are made of a dielectric material having a high transmittance in the visible light region such as silicon dioxide or diamond, a dielectric material having a high transmittance in the infrared light region such as zinc selenium or silicon, or magnesium fluoride. A material having a high transmittance in the ultraviolet light region such as calcium fluoride or calcium fluoride is used. The material of the chip 1 can be any material as long as it transmits the chip 1 even in the wavelength band of light passing through the opening. Moreover, the chip | tip 1, the stopper 2, and the transparent layer 5 may be comprised with the same material, and may be comprised with a different material. For the light shielding film 3, for example, a metal such as aluminum, chromium, gold, platinum, silver, copper, titanium, tungsten, nickel, cobalt, or an alloy thereof is used.
[0017]
FIG. 2 is a view showing a state in which the light shielding film 3 on the chip 1 is plastically deformed in the method of forming the opening. A plate 6 that covers a part of the chip 1 and at least the stopper 2 and is flat on at least the chip 1 and the stopper 2 side is placed on the workpiece 1000 shown in FIG. 7 is put. By applying a force F to the pushing tool 7 in the direction of the central axis of the chip 1, the plate 6 moves toward the chip 1. Compared with the contact area between the chip 1 and the plate 6, the contact area between the stopper 2 and the plate 6 is several hundred to several tens of thousands of times larger. Therefore, the applied force F is distributed by the stopper 2, and as a result, the displacement amount of the plate 6 becomes small. Since the displacement amount of the plate 6 is small, the plastic deformation amount that the light shielding film 3 receives is very small. Further, the tip 1 and the stopper 2 are only subjected to very small elastic deformation. The method of applying force F includes a method of lifting a weight having a predetermined weight by a predetermined distance and allowing it to fall freely, or a method of attaching a spring having a predetermined spring constant to the pushing tool 7 and pressing the spring by a predetermined distance. is there. When the plate 6 is made of a material harder than the light shielding film and softer than the chip 1 and the stopper 2, the force received by the chip 1 and the stopper 2 is absorbed by the plate 6, so that the displacement amount of the plate 6 becomes smaller. It becomes easy to reduce the amount of plastic deformation of the light shielding film 3.
[0018]
FIG. 3 is a view showing a state in which the plate 6 and the pushing tool 7 are removed after the force F is applied. Since the plastic deformation amount of the light shielding film 3 is very small and the chip 1 and the stopper 2 are displaced only in the elastic deformation region, an opening 8 is formed at the tip of the chip 1. The size of the opening 8 is about the diffraction limit of the wavelength of light passing through the chip 1 from several nm. In the above description, the plate 6 is inserted between the pushing tool 7 and the workpiece 1000. However, it goes without saying that the opening 8 can be formed similarly by removing the plate 6 and pushing it directly with the pushing tool 7. Absent. In order to introduce light into the opening 8, the transparent body 5 or at least a part of the chip 1 is exposed by etching the substrate 4 from the side opposite to the formation surface of the chip 1, so that the light introduction port into the opening 8 is formed. Form. Needless to say, the step of forming the light inlet can be omitted by forming the substrate 4 from the transparent material 103.
[0019]
As described above, according to the opening manufacturing method of the present invention, the displacement amount of the plate 6 can be well controlled by the stopper 2 and the displacement amount of the plate 6 can be made very small. A uniform and small opening 8 can be easily produced at the tip of the chip 1. Further, near-field light can be generated from the opening 8 by irradiating light from the substrate side.
[0020]
Next, FIG. 9 (A) and FIG. 9 (B) are diagrams for explaining an opening forming apparatus for forming an optical opening according to Embodiment 1 of the present invention.
[0021]
FIG. 9A shows a configuration diagram of the opening forming apparatus, and FIG. 9B shows an observation image of the work 1000 and the plate 6 that is a transparent plane by the magnifying glass 402 from the upper part of the work 1000.
[0022]
FIG. 9A includes a stage 401, a load controller 300, and a magnifying glass 402. The stage 401 placed horizontally is placed in parallel with the work 1000 and a plate 6 that is a transparent plane superimposed. It has a structure and consists of a two-axis ball screw stage so that it can be operated in parallel in the plane direction.
[0023]
The load controller 300 is configured such that the weight 301 naturally falls in a circular arc shape from a certain angle with the fulcrum shaft 303 as a fulcrum. When the rotating gear 302 is rotated in a certain direction, the weight 301 is lifted to a certain angle. A clutch, a simultaneous gear, etc. are comprised so that the weight 301 may fall naturally when rotation is added.
[0024]
In addition, the stage 401 and the load controller 300 are positioned so that the load point 304 positioned at the tip of the stage 401 and the load controller 300 is perpendicular to the load target point after the weight 301 of the load controller 300 falls with respect to the load target point 201. Yes.
[0025]
The magnifying glass 402 is composed of a microscope or a CCD camera with a cross scale on the optical axis, and is laid out at a position relative to the support shaft 303 so that the load point 304 after the 301 is dropped is at the center of the cross scale.
[0026]
Therefore, after the workpiece 1000 is placed on the stage 401, the load target point 201 on the plate 6 and the magnifying glass 402 cross scale are matched by moving the stage 401. Next, by rotating the rotary gear 302 of the load controller 300, the weight 301 naturally falls from a certain angle, so that a certain load is applied to the load target point 201, and an optical opening is formed on the chip 1 on the workpiece 1000. Can be formed.
[0027]
Further, the load F applied to the load target point 201 is determined by the angle and the weight at which the weight 301 of the load controller 300 is dropped, and this depends on the opening size, the material of the plate 6 and the thickness of the light shielding film 3.・ Determined by the material. The tip of the weight 6 has a spherical shape and is configured so that the load point is as small as possible with respect to the load target point 201.
[0028]
As described above, according to the opening manufacturing method of the present invention,
Since a constant load can be applied to the load target point repeatedly with high accuracy, a stable optical opening can be formed. Further, the optical aperture can be formed at a low cost at a low cost of the entire apparatus.
[0029]
Next, the manufacturing method of the workpiece | work 1000 is demonstrated using FIG. 4 and FIG. FIG. 4 shows a state in which the transparent material 103 is formed on the substrate material 104, and then the chip mask 101 and the stopper mask 102 are formed. 4A shows a top view, and FIG. 4B shows a cross-sectional view at a position indicated by AA ′ in FIG. 4A. The transparent material 103 is formed on the substrate material 104 by chemical vapor deposition (CVD) or spin coating. The transparent material 103 can also be formed on the substrate material 104 by a method such as solid phase bonding or adhesion. Next, a chip mask 101 and a stopper mask 102 are formed on the transparent material 103 by a photolithography process. The chip mask 101 and the stopper mask 102 may be formed simultaneously or separately.
[0030]
The chip mask 101 and the stopper mask 102 are made of a photoresist, a nitride film, or the like, depending on the material of the transparent material 103 and the etchant used in the next process. The transparent material 103 is made of a dielectric material having high transmittance in the visible light region such as silicon dioxide or diamond, a dielectric material having high transmittance in the infrared light region such as zinc selenium or silicon, or magnesium fluoride or calcium fluoride. A material having high transmittance in the ultraviolet region is used.
[0031]
The diameter of the chip mask 101 is, for example, several mm or less. The width W1 of the stopper mask 102 is, for example, the same as or smaller than the diameter of the chip mask 101 by several tens of nm to several μm. Further, the width W1 of the stopper mask 102 may be several tens nm to several μm larger than the diameter of the chip mask 101. The length of the stopper mask 102 is several tens of μm or more.
[0032]
FIG. 5 shows a state in which the chip 1 and the stopper 2 are formed. 5A is a top view, and FIG. 5B is a cross-sectional view at a position indicated by AA ′ in FIG. 5A. After the chip mask 101 and the stopper mask 102 are formed, the chip 1 and the stopper 2 are formed by isotropic etching by wet etching. The transparent layer 5 shown in FIG. 1 is formed or not formed by adjusting the relationship between the thickness of the transparent material 103 and the height of the chip 1 and the stopper 2. The tip radius of the chip 1 is several nm to several hundred nm. Thereafter, a work 1000 shown in FIG. 1 can be formed by depositing a light shielding film by a method such as sputtering or vacuum evaporation. When the light shielding film 3 is deposited only on the chip 1, in the deposition process of the light shielding film 3, a metal mask having a shape such that the light shielding film is deposited on the chip 1 is placed on the chip 1 and sputtering or vacuum evaporation is performed. Further, even if a photolithography process in which the light shielding film 3 remains only on the chip 1 after the light shielding film 3 is deposited on the entire surface of the workpiece 1000 on which the chip is formed, the light shielding film 3 is formed only on the chip 1. Needless to say, it can be formed.
[0033]
7 and 8 are diagrams for explaining the relationship between the height of the chip 1 and the stopper 2 in the method for manufacturing the workpiece 1000 described above. Hereinafter, the case where the diameter of the chip mask 101 is smaller than the width of the stopper mask 102 will be described. FIG. 7 is a view showing only the chip 1 and the stopper 2 in the process described with reference to FIG. 5A. FIG. 8 is a view of the chip 1 at the position indicated by BB ′ in FIG. It is sectional drawing of the stopper 2 of the position shown by CC '.
[0034]
FIG. 8A is a view showing a state in which the chip 1 is just formed. Since the width of the stopper mask 102 is larger than the diameter of the chip mask 101, in the state shown in FIG. 8A, a flat portion remains on the upper surface of the stopper 2, and the stopper mask is formed on the flat portion. 102 remains. However, the chip mask 101 comes off because the contact area with the chip 1 is very small. In the state of FIG. 8A, the height H11 of the chip 1 and the height H22 of the stopper 2 are the same.
[0035]
FIG. 8B shows a state where the etching is further advanced from the state of FIG. 8A, and the flat portion on the upper surface of the stopper 2 has just disappeared. When further etching is performed from the state of FIG. 8A, the height H111 of the chip 1 without the chip mask 101 gradually decreases. On the other hand, the height H222 of the stopper 2 in which the stopper mask remains remains the same as H22. The width of the flat portion of the upper surface of the stopper 2 gradually decreases, and the cross-sectional shape becomes a triangle as shown in FIG. 8 (b). The height difference ΔH between the chip 1 and the stopper 2 at this time varies depending on the difference between the diameter of the chip mask 101 and the width of the stopper mask 102 and the tip angle of the chip 1 and the stopper 2, but is approximately 1000 nm or less. It is.
[0036]
FIG. 8C shows a state where etching is further advanced from the state of FIG. The height H1111 of the chip 1 is lower than the height H111. Similarly, the height of the stopper H2222 is also smaller than the height H222. However, since the reduction amounts of the height H1111 and the height H2222 are the same, the height difference ΔH between the tip 1 and the stopper 2 does not change. When the width of the stopper mask 102 is smaller than that of the chip mask 101, the height relationship between the chip 1 and the stopper 2 is merely reversed. Needless to say, when the chip mask 101 and the stopper mask 102 are equal, the heights of the chip 1 and the stopper 2 are equal.
[0037]
According to the method for manufacturing the workpiece 1000 of the present invention, the height difference ΔH between the chip 1 and the stopper 2 can be satisfactorily controlled by the photolithography process. Therefore, in the opening manufacturing method described with reference to FIGS. 1 to 3, the displacement amount of the plate 6 can be well controlled.
[0038]
As described above, according to the first embodiment of the present invention, the height of the chip 1 and the stopper 2 can be controlled well, and the displacement amount of the plate 6 is reduced by providing the stopper 2. Therefore, it is easy to form a minute opening 8 having a uniform size at the tip of the chip 1 without using an actuator with high resolution. In our experiment, it was possible to form the opening 8 having a diameter of 100 nm or less simply by striking the pushing tool 7 with a hand-held hammer. Further, since the heights of the chip 1 and the stopper 2 are well controlled, the production yield of the openings 8 is improved. In addition, since the workpiece 1000 described in the first embodiment of the present invention can be manufactured by a photolithography process, a plurality of workpieces 1000 can be manufactured on a sample having a large area such as a wafer, and the force F is constant. By doing so, it is possible to form the openings 8 having a uniform opening diameter for each of the plurality of workpieces 1000 produced. In addition, since it is very easy to change the magnitude of the force F, it is possible to form the openings 8 having different opening diameters individually for the plurality of workpieces 1000 produced. Further, since the opening 8 is formed by simply applying the force F, the time required for making the opening is very short, from several seconds to several tens of seconds. Moreover, according to Embodiment 1 of this invention, a processing atmosphere is not ask | required.
[0039]
Therefore, it can be processed in the atmosphere, and the processing state can be immediately observed with an optical microscope or the like. Further, by processing in a scanning electron microscope, it is possible to observe the processing state with a higher resolution than that of an optical microscope. Moreover, since the liquid functions as a damper by processing in the liquid, processing conditions with improved controllability can be obtained.
[0040]
It is also possible to produce a plurality of apertures 8 having the same aperture diameter at a time by applying force F to a sample on which a plurality of workpieces 1000 are produced. When processing in a batch, the processing time per opening is very short, several hundred milliseconds or less, depending on the number of workpieces 1000 per wafer.
(Embodiment 2)
FIGS. 10A and 10B are views for explaining an opening forming apparatus for forming an optical opening according to Embodiment 2 of the present invention.
[0041]
It is a figure explaining the opening formation apparatus which forms an opening automatically with respect to the workpiece | work 1000 with which the to-be-opened formation body of Embodiment 2 was formed in multiple numbers.
[0042]
FIG. 10A shows a configuration diagram of the opening forming apparatus, and FIG. 10B shows an observation image of the work 1000 and the plate 6 that is a transparent plane from above the work 1000 by the magnifying glass 402.
[0043]
Detailed description of the same parts as those in the first embodiment will be omitted.
[0044]
The rotation gear 302 of the load controller 300 includes a rotation motor capable of controlling the rotation angle, a clutch, and a simultaneous gear. The rotation motor may be a combination of a stepping motor, a DC motor, and an angle sensor. The magnifier 402 is a CCD camera. The stage 401 also used an XY stage having an I / F such as GPIB. These are configured to be controlled by the automatic controller 403.
[0045]
The automatic controller 403 is a well-known one such as a personal computer. After matching the load target point 201 and the load point 304 with the image data from the magnifying glass 402, the motor of the rotating gear 302 is rotated, and the weight 301 is naturally dropped. It works to let you. The automatic controller 403 is programmed so that these operations can be sequentially controlled.
[0046]
As described above, according to the opening manufacturing apparatus of the present invention, optical openings can be automatically formed sequentially on a plurality of openings to be formed on the workpiece 1000, and mass production can be performed at low cost. It becomes possible.
[0047]
【The invention's effect】
By controlling the height of the chip 1 and the stopper 2 and the force F, the opening 8 can be easily formed without using an actuator with high resolution. Further, since the heights of the chip 1 and the stopper 2 are well controlled, the production yield of the openings 8 is improved. In addition, since the workpiece 1000 described in the first embodiment of the present invention can be manufactured by a photolithography process, a plurality of workpieces 1000 can be manufactured on a sample having a large area such as a wafer, and the force F is constant. By doing so, it is possible to form the openings 8 having a uniform opening diameter for each of the plurality of workpieces 1000 produced. In addition, since it is very easy to change the magnitude of the force F, it is possible to form the openings 8 having different opening diameters individually for the plurality of workpieces 1000 produced.
[0048]
Further, since the opening is formed by simply applying the force F, the time required for opening preparation is as short as several tens of seconds or less. Moreover, according to Embodiment 1 of this invention, a processing atmosphere is not ask | required. Therefore, it can be processed in the atmosphere, and the processing state can be immediately observed with an optical microscope or the like. Further, by processing in a scanning electron microscope, it is possible to observe the processing state with a higher resolution than that of an optical microscope. Moreover, since the liquid functions as a damper by processing in the liquid, processing conditions with improved controllability can be obtained.
[0049]
It is also possible to produce a plurality of apertures 8 having the same aperture diameter at a time by applying force F to a sample on which a plurality of workpieces 1000 are produced. When processing in a batch, the processing time per opening is very short, several hundred milliseconds or less, depending on the number of workpieces 1000 per wafer.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a method for forming an opening according to a first embodiment of the present invention.
FIG. 2 is a diagram for explaining a method of forming an opening according to the first embodiment of the present invention.
FIG. 3 is a diagram illustrating a method for forming an opening according to the first embodiment of the present invention.
FIG. 4 is a diagram illustrating a method for manufacturing a workpiece 1000;
FIG. 5 is a diagram illustrating a method for manufacturing a workpiece 1000;
6 is a diagram illustrating a method for manufacturing the workpiece 1000. FIG.
7 is a view for explaining the relationship between the height of a chip 1 and a stopper 2 in a method for producing a workpiece 1000. FIG.
FIG. 8 is a diagram for explaining the relationship between the height of the chip 1 and the stopper 2 in the method for manufacturing the workpiece 1000;
FIG. 9 is a diagram illustrating an opening forming apparatus for forming an optical opening according to the first embodiment of the present invention.
FIG. 10 is a diagram for explaining an aperture forming apparatus for forming an optical aperture according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Chip 2 Stopper 3 Light-shielding film 4 Substrate 5 Transparent layer 6 Plate 7 Pushing tool 8 Opening 11 Chip protrusion 12 Plate 13 Positioning line 14 Sheet with pushing plate 15 Polyethylene sheet 16 Glass plate 21 Protrusion 101 Chip mask 102 Stopper mask 103 Transparent material 104 Substrate material 201 Load target point 300 Load controller 301 Weight 302 Rotating gear 303 Support shaft 304 Load point 401 Stage 402 Magnifier 403 Automatic controller 1000 Work F Force H1 Tip height H2 Stopper height

Claims (2)

An optical opening that forms an opening by plastically deforming the light shielding film by bringing a pusher into contact with the tip of the near-field optical device having a cone-shaped chip and the light shielding film provided on the chip. In the opening forming apparatus of
Forming an opening-formed body including the near-field optical device and a stopper having a contact portion having substantially the same height as the chip on a substantially flat surface;
The pusher has a substantially flat portion that covers the chip and covers at least a part of the stopper,
An opening forming device that forms the opening at the tip of the chip by controlling the displacement of the pusher by bringing the pusher into contact with the contact portion,
Load control means for displacing the pushing body with a constant load;
Position control means for controlling a relative position between a load target point located directly above the tip end portion of the pusher and a load point generated by the load means;
An opening forming apparatus characterized by comprising: The opening forming body is composed of a plurality of the chips and the stopper ,
It said plurality of openings forming apparatus according to claim 1, wherein a plurality load control means you load simultaneously to load target point.

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