JP4441503B2 - Manufacturing method of crystal oscillator for surface mounting - Google Patents

Description

The present invention has a manufacturing method of a surface-mount crystal oscillator (hereinafter referred to as a surface-mount oscillator) as an industrial technical field, and in particular, a surface that measures the electrical characteristics of a crystal resonator independently of an IC chip. The present invention relates to a method for manufacturing a mounted oscillator.

BACKGROUND OF THE INVENTION Surface-mounted oscillators are widely used in various electronic devices, especially communication devices, including communication devices as frequency and time reference sources. As one of such devices, there is a surface mount oscillator in which a crystal piece and an IC chip are integrally accommodated in a container body.

(Example of Prior Art) FIG. 3 to FIG. 5 are diagrams of a surface mount oscillator for explaining a conventional example, FIG. 3 is a sectional view, FIG. 4 is a plan view, and FIG. 5 is a bottom view. . The surface mount oscillator is formed by housing an IC chip 2 and a crystal piece 3 in a container body 1 and bonding a cover 4. The container body 1 includes a bottom wall 5, an intermediate frame wall 6, and an upper frame wall 7, and has a recess and an inner wall step. These are formed by firing a ceramic having a multilayer structure.

The IC chip 2 integrates each element such as an amplifier constituting an oscillation circuit, and has each terminal including a crystal terminal 8 (ab) on one main surface. Then, one main surface side is fixed to the bottom surface of the recess which is the inner bottom surface of the container body 1 by face-down bonding using ultrasonic thermocompression using, for example, bumps 9. An IC chip connection terminal 10 (ab) that is electrically connected to the crystal terminal 8 (ab) of the IC chip 2 is provided on the bottom surface of the recess.

The quartz crystal piece 3 has excitation electrodes 11 (ab) opposed to both main surfaces, and extends extraction electrodes 12 (ab) at both ends in opposite directions. Then, both end portions are fixed to the inner wall step portion on which the crystal connection terminal 14 (ab) is formed by the conductive adhesive 13, and are electrically and mechanically connected. The crystal connection terminal 14 (ab) is electrically connected to the IC chip connection terminal 10 (ab) by a connection line (wiring pattern) 15. In addition, the code | symbol 16 in a figure is a metal ring, and the cover 4 is joined by seam welding.

In such a case, the pair of extraction electrodes 12 (ab) of the crystal piece 3 are connected to the crystal terminals 8 (ab) of the IC chip 2 through through holes (electrode through holes) provided in the stepped portion. And I
Terminals such as a power source, an output, and a ground of the C chip 2 extend as mounting electrodes 16 on the outer bottom surface and side surfaces of the container body 1. Configuration Further, the order to measure the electrical characteristics of the crystal resonator (quartz crystal piece 3), provided with a crystal measuring terminals 17 extend a pair of lead electrodes 12 (ab) outside the side surface of the container body 1 (ab) I was trying.
JP 2001-326533 A

(Problems in the conventional technology), however, the crystal oscillator of the above configuration, the crystal measurement terminal 17 provided on the outer side surface (ab) is crystal terminals 8 of IC chip 2 with the extraction electrode 12 of the crystal element 3 (ab) ( ab) (see FIG. 6). For this reason, when measuring the electrical characteristics of the crystal resonator, there is a problem that the independent characteristics of the crystal resonator alone cannot be measured due to the electrical influence of the IC chip 2.

Further, for example, during strong excitation when measuring the crystal impedance (CI) characteristics with respect to the drive level (drive level) of the crystal resonator, an overvoltage is also applied to the IC chip 2 and I
There is also a risk of electrically destroying the C chip 2.

Therefore, the IC chip crystal terminal 1 connected to the crystal terminal 8 (ab) of the IC chip 2.
8 (ab) and the crystal measurement terminal 17 (ab) are led out to the outer surface of the container body 1 independently of each other. Then, after measuring the electrical characteristics of the crystal oscillator itself, connected by a crystal measurement terminal 17 (ab) and IC chip crystal terminals 18 (ab) and, for example, conductive adhesive 13 formed on the outer side surface that (Reference: Patent Document 1, FIG. 7). 6 (ab) in the figure is a divided intermediate frame wall.

However, in such a case, as the surface-mount oscillator is further miniaturized, the crystal measurement terminal 17 is increased.
The area of (ab) is reduced, and it is difficult to contact the terminal (probe) from the measuring instrument,
There was a problem that smooth measurement was not possible.

(Object of the Invention) The present invention is capable of measuring independent electrical characteristics of a single crystal unit, and is also an IC.
It is an object of the present invention to provide a method for manufacturing a surface mount oscillator that prevents electrical breakdown of a chip and facilitates measurement.

According to the present invention, an outer peripheral portion of a crystal piece in which an extraction electrode extends from a pair of excitation electrodes is fixed to an inner wall step portion of a surface mounting container having a mounting electrode on an outer bottom surface, and an oscillation circuit is formed with the crystal piece. An IC chip having a crystal terminal is fixed to the inner bottom surface of the container body, and the excitation electrode and the crystal terminal of the IC chip are electrically connected by a connection line formed inside the surface mount container, A crystal oscillator for surface mounting provided with crystal measuring terminals extending in parallel to the connection line from a pair of excitation electrodes of the crystal piece on a pair of opposed outer surfaces of the surface mounting container, respectively. In the manufacturing method, the connection line that connects the excitation electrode of the crystal piece and the crystal terminal of the IC chip is divided inside the surface mount container, and is opposed to each other where the crystal measurement terminal is formed. Of extending the other set of outer surfaces of different opposite the outer surface, after the inspection of the electrical characteristics of the crystal piece by the quartz measuring terminal, a configuration in which electrically connects the connection line.

In the present invention, since by dividing the connecting line for connecting the crystal terminals of the excitation electrodes and the IC chip of the crystal piece housed in surface mount container crystal measuring terminals provided outside the side surface, of the crystal oscillator electrical Characteristics can be measured electrically independent of the IC chip. Further, since the extending connection lines were divided into different outer sides the crystal measuring terminal can increase the area of the crystal measuring terminal to be formed on the outer side surface. These result, can be measured independent electrical characteristics of the crystal oscillator itself, yet to prevent electrical breakdown of the IC chip, as possible out easily measured by increasing the area of crystal inspection terminals.

FIGS. 1 and 2 are plan views of a surface mount oscillator (excluding a cover and a metal ring ) for explaining an embodiment (manufacturing method) of the present invention. In addition, the same number is attached | subjected to the part same as a prior art example figure, and the description is simplified or abbreviate | omitted.
Surface mount oscillator, extraction electrode bottom wall 5, as described above, the IC chip 2 with intermediate casing wall 6 and the upper casing wall 7 inner bottom surface to the crystal terminals of the container body 1 8 consisting of (ab), the inner wall step portion 12 fixing a rolled crystal blank 3 out of (ab), quartz measurement terminal 17 (ab) an intermediate frame wall 6 and the upper casing wall 7 two opposite outer sides namely extending to a pair of outer surfaces of opposing (Refer to the previous FIG. 3).

In this embodiment, the connection line between the crystal connection terminal 14 (ab) connected to the extraction electrode 12 (ab) of the crystal piece 3 and the IC chip connection terminal 10 (ab) connected to the crystal terminal 8 of the IC chip 2. 15 is divided on the surface of the inner wall step. Then, extending to different other set of outer side and a pair of outer opposite sides formed of quartz measurement terminals 17 (ab) (Figure 1). Next, the quartz measurement terminal 17 provided on the outer side surface of the surface mount oscillator 1 (ab), measuring each characteristic of the crystal oscillator (crystal blank 3). Then, after the measurement of the crystal resonator, for example, the connection line 15 divided by the conductive adhesive 13 is connected (FIG. 2). In FIG. 2, the conductive adhesive 13 is applied to only one of the opposing outer surfaces of the other set, but the other conductive adhesive of the outer surface is omitted.

With such a configuration, the crystal connection terminal 14 (ab) and the IC chip connection terminal 10 (ab
) Is disconnected, that is, the connection line between the excitation electrode 11 (ab) of the crystal piece 3 and the crystal terminal 8 (ab) of the IC chip is disconnected, and the crystal measurement terminal 17 (ab) is disconnected. extending to the side surface. Therefore, each characteristic of the crystal resonator can be measured as a single crystal resonator independently of the IC chip 2 by the crystal measuring terminal 17 (ab). This prevents electrical destruction of the IC chip 2 during strong excitation.

Further, after measurement of the crystal oscillator, the conductive connection line 15 extending to the other pair of outer side surfaces different from facing the crystal was separated on the surface of the inner wall step portion of the surface mount container 1 measurement terminal 17 (ab) Electrical connection is made by the adhesive 13. Accordingly, since the IC chip crystal terminal 18 (ab) and the crystal oscillation measurement terminal 17 (ab) are not formed on the same side as in the prior art, the area of the crystal measurement terminal 17 (ab) is increased accordingly. it can. Thereby, it is easy to abut the probe of the measuring instrument, and the measurement work is facilitated.

(Other matters)
In the above embodiment, the divided connection line 15 is electrically connected by the conductive adhesive 13, but any conductive material including solder or the like may be used. The crystal piece 3 has an extraction electrode 12 (ab
) Is extended to hold both ends, but the extraction electrode may be extended to both ends of one end to hold both ends of the same end. Further, the cover 4 is joined by seam welding, but it goes without saying that beam welding, glass sealing, or resin sealing may be used.

It is a top view of the surface mount oscillator explaining one Example of this invention. It is a top view of the surface mount oscillator explaining one Example of this invention. It is sectional drawing of the surface mount oscillator explaining a prior art example. It is a top view of the surface mount oscillator explaining a prior art example. It is a bottom view of the surface mount oscillator explaining a conventional example. It is a connection diagram of a crystal resonator and an IC for explaining a conventional example. It is sectional drawing of the surface mount oscillator explaining a prior art example.

1 container body, 2 IC chip, 3 crystal piece, 4 cover, 5 bottom wall, 6 intermediate frame wall,
7 Upper frame wall, 8 Crystal terminal, 9 Bump, 10 IC chip connection terminal, 11 Excitation electrode,
12 Lead electrode, 13 Conductive adhesive, 14 Crystal connection terminal, 15 Connection line, 16 Mounting electrode, 17 Crystal measurement terminal, 18 IC chip crystal terminal, 19 Split line terminal, 20
Metal ring.

Claims (2)

The outer peripheral portion of the crystal piece with the extraction electrode extending from the pair of excitation electrodes is fixed to the inner wall step portion of the surface mounting container having the mounting electrode on the outer bottom surface, and the crystal piece and the oscillation circuit are formed to form the crystal terminal. An IC chip having an inner surface fixed to the inner bottom surface of the container body;
The excitation electrode and the crystal terminal of the IC chip are electrically connected by a connection line formed inside the surface mount container,
Crystals for surface mounting, each provided with a crystal measuring terminal extending in parallel with the connection line from a pair of excitation electrodes of the crystal piece on a pair of opposed outer surfaces of the surface mounting container In the method for manufacturing an oscillator,
The connection line connecting the excitation electrode of the crystal piece and the crystal terminal of the IC chip is divided inside the surface mount container, and a pair of opposed outer surfaces on which the crystal measurement terminal is formed. Extends to the outer surfaces of different opposing pairs,
A method of manufacturing a surface-mount crystal oscillator, wherein the connection line is electrically connected after the electrical characteristics of the crystal piece are inspected by the crystal measurement terminal. 2. The method for manufacturing a surface-mount crystal oscillator according to claim 1, wherein the inside of the surface-mount container where the connection line is divided is a surface of the inner wall step portion.

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