JP4435433B2 - Inspection jig for semiconductor devices - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device inspection jig, and inspects characteristics of a semiconductor device constituting a local oscillator in a high-frequency electronic circuit such as a radio transmission / reception device or a broadcast reception device mainly used in a frequency band higher than a microwave band. It relates to an inspection jig.
[0002]
[Prior art]
3A and 3B show a conventional inspection jig for a semiconductor device, FIG. 3A shows a planar structure of the inspection jig, and FIG. 3B shows a cross-sectional structure of the inspection jig. Is shown.
[0003]
As shown in FIGS. 3A and 3B, a conventional inspection jig for a semiconductor device includes an oscillation circuit board 100, an output connector 110 provided on a side of the oscillation circuit board 100, and an oscillation circuit board. It is comprised from the grounding block 120 provided in the back surface (lower surface) of 100.
[0004]
On the surface (upper surface) of the dielectric substrate 101 constituting the oscillation circuit substrate 100, a surface wiring 102, a chip component 103, a power supply terminal 104, and a strip line 105 for transmitting a high frequency signal are provided. An open stub 106 is connected in the middle of the line 105. A ground wiring 107 is formed on the back surface of the dielectric substrate 101, and the surface wiring 102 and the ground wiring 107 are electrically connected via a via 108 penetrating the oscillation circuit board 100 in the front-back direction. Yes.
[0005]
The output connector 110 is connected to the surface wiring 102 of the oscillation circuit board 100, and is for taking out the oscillation output to the outside.
[0006]
The ground block 120 is in contact with the ground wiring 107 of the oscillation circuit board 100, and is for improving the ground characteristics and reinforcing the mechanical strength.
[0007]
The semiconductor device A to be inspected forms an oscillation circuit by being pressed against a predetermined part of the surface wiring 102 of the oscillation circuit substrate 100.
[0008]
When inspecting the semiconductor device A, the power supply voltage can be applied to the power supply terminal 104 and the characteristic of the semiconductor device A can be determined by a characteristic evaluation device connected to the output connector 110. The resonance circuit that determines the oscillation frequency is formed by an open stub 106 connected to the strip line 105.
[0009]
In order to obtain good phase noise characteristics in a microwave oscillator, a dielectric oscillator using a dielectric resonator having excellent resonance characteristics is used.
[0010]
The dielectric oscillator has a feature that it cannot be operated unless the entire circuit is shielded by a conductive case. The semiconductor device A used for such a purpose is an actual application circuit using a dielectric resonator. Therefore, the oscillation circuit is formed by using the open stub 106 formed on the strip line 105, and thereby the oscillation output power and the current consumption are inspected. .
[0011]
[Problems to be solved by the invention]
However, since the resonance circuit using an open stub has inferior resonance characteristics compared to a dielectric resonator, the problem that the phase noise characteristic cannot be inspected when a semiconductor device is used as a dielectric oscillator in an actual application circuit. There is.
[0012]
In view of the above, the present invention allows a semiconductor device used as a dielectric oscillator to operate under conditions equivalent to those of an actual application circuit, thereby accurately evaluating various operating characteristics including phase noise characteristics. The purpose is to provide an inspection jig.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, an inspection jig for a semiconductor device according to the present invention includes an oscillation circuit board and a shielding case made of a conductive material and containing the oscillation circuit board. A body substrate, a strip line formed on the surface of the dielectric substrate, a dielectric resonator provided on the surface of the dielectric substrate so as to be electromagnetically coupled to the strip line, and a back surface of the dielectric substrate. A ground electrode, and a connection electrode formed on the back surface of the dielectric substrate, electrically connected to the end of the strip line, and electrically connected to the external electrode of the semiconductor device to be inspected. The ground electrode is in contact with the bottom of the storage case, and the bottom of the storage case is provided with an opening for exposing the connection electrode so that the external electrode of the semiconductor device is electrically connected to the connection electrode.
[0014]
According to the inspection jig for a semiconductor device according to the present invention, the oscillation circuit substrate housed in the shielding case made of the conductive material is provided with the dielectric resonator so as to be electromagnetically coupled to the strip line. Therefore, since the semiconductor device to be inspected can be operated under the same condition as an actual application circuit using a dielectric resonator, various operating characteristics including phase noise characteristics can be accurately evaluated. .
[0015]
In the inspection jig of the semiconductor device according to the present invention, derivative collector substrate, as well has an opening having a shape in which the semiconductor device is fitted, the external electrodes of the semiconductor device fitted to the opening of the derivative collector substrate Is preferably in contact with the connection electrode in a self-aligning manner.
[0016]
In this way, when the semiconductor device is fitted into the opening of the dielectric substrate, the external electrode of the semiconductor device contacts the connection electrode in a self-aligning manner, so that the labor for positioning the semiconductor device and the connection electrode is omitted. be able to.
[0017]
In the inspection jig for a semiconductor device according to the present invention, a frequency adjusting screw is screwed above the dielectric resonator in the shielding case, and the distance between the tip of the frequency adjusting screw and the dielectric resonator is adjusted. Thus, the oscillation frequency of the dielectric resonator is preferably adjustable.
[0018]
In this way, the oscillation frequency of the dielectric resonator can be easily adjusted by rotating the frequency adjusting screw and adjusting the distance between the tip of the frequency adjusting screw and the dielectric resonator.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an inspection jig according to an embodiment of the present invention will be described with reference to FIGS. 1 (a), (b), and FIG. 2. FIG. 1A shows a plan structure of an inspection jig with the cover of the shielding case removed, FIG. 1B shows a cross-sectional structure of the inspection jig, and FIG. 2 shows an oscillation housed in the shielding case. The back surface structure of a circuit board is shown.
[0020]
As shown in FIGS. 1A and 1B, the inspection jig is made of a conductive material and has a shielding case 10 having an opening 10a at the center of the bottom, and a lid 11 that covers the upper opening of the shielding case 10. And have.
[0021]
An oscillation circuit board 13 is housed inside the shielding case 10, and surface wiring 15, chip components 16, and high-frequency signals are transmitted to the surface (upper surface) of the dielectric substrate 14 constituting the oscillation circuit board 13. A strip line 17 and a dielectric resonator 18 arranged so as to be electromagnetically coupled to the strip line 17 are provided. In addition, an opening 19 having a shape into which the semiconductor device A to be inspected is fitted is formed at the center of the dielectric substrate 14, and the semiconductor device A is fitted into the opening 19 to thereby form the dielectric substrate 14. Retained.
[0022]
As shown in FIGS. 1B and 2, a ground wiring 20 and a connection electrode 21 are provided on the back surface (lower surface) of the dielectric substrate 14, and the connection electrode 21 and the end of the strip line 17 are The dielectric substrate 14 is electrically connected by a via 22 extending in the front and back direction.
[0023]
In this case, when the semiconductor device A is fitted into the opening 19 of the dielectric substrate 14, the position of the opening 19 and the connection electrode 21 are arranged so that the external electrode of the semiconductor device A contacts the connection electrode 21 in a self-aligning manner. The position is adjusted. For this reason, the trouble of alignment with the semiconductor device A and the connection electrode 21 can be omitted.
[0024]
As described above, since the oscillation circuit board 13 is housed in the conductive shielding case 10, the entire oscillation circuit is electrically shielded, and the dielectric oscillation circuit operates normally. In addition, since the ground wiring 20 provided on the back surface of the dielectric substrate 14 is in contact with the bottom surface of the shielding case 10, the ground characteristics are improved.
[0025]
As shown in FIGS. 1A and 1B, on the side of the shielding case 10, a power supply terminal 23 that is electrically connected to the surface wiring 15 and to which a power supply voltage is applied, and the surface wiring 15 And an output connector 24 for taking out the oscillation output to the outside.
[0026]
Further, a frequency adjusting screw 25 is screwed onto the lid 11 of the shielding case 10 above the dielectric resonator 18, and the frequency adjusting screw 25 is rotated so that the tip of the frequency adjusting screw 25 and the dielectric body are rotated. By adjusting the distance from the resonator, the resonance frequency of the dielectric resonator 18 can be adjusted.
[0027]
When inspecting the characteristics of the semiconductor device A, the semiconductor device A is fitted into the opening 19 of the dielectric substrate 14 to hold the semiconductor device A on the dielectric substrate 14, and the external electrode of the semiconductor device A is connected to the connection electrode. 21 is contacted. In this way, the semiconductor device A is electrically connected to the oscillation circuit substrate 13 and thus forms an oscillation circuit. In this state, when a power supply voltage is applied to the power supply terminal 23, the characteristics of the semiconductor device A can be determined by the characteristic evaluation apparatus connected to the output connector 24.
[0028]
【The invention's effect】
According to the inspection jig for a semiconductor device according to the present invention, the oscillation circuit substrate housed in the shielding case made of the conductive material is provided with the dielectric resonator so as to be electromagnetically coupled to the strip line. Therefore, since the semiconductor device to be inspected can be operated under the same condition as an actual application circuit using a dielectric resonator, various operating characteristics including phase noise characteristics can be accurately evaluated. .
[Brief description of the drawings]
FIGS. 1A and 1B show an inspection jig for a semiconductor device according to an embodiment of the present invention, and FIG. 1A is a plan view of the inspection jig with a cover of a shielding case removed. (B) is sectional drawing of the jig for an inspection.
FIG. 2 is a rear view of the oscillation circuit board housed in the shielding case of the inspection jig of the semiconductor device according to the embodiment of the present invention.
3A and 3B show a conventional semiconductor device inspection jig, FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view.
[Explanation of symbols]
A Semiconductor Device 10 to be Shielded Shielding Case 10a Opening 11 Lid 13 Oscillation Circuit Board 14 Dielectric Substrate 15 Surface Wiring 16 Chip Component 17 Strip Line 18 Dielectric Resonator 19 Opening 20 Ground Wiring 21 Connection Wiring 22 Via 23 Power Supply Voltage 24 Output connector 25 Frequency adjusting screw

Claims (3)

An oscillation circuit board, and a shielding case made of a conductive material and containing the oscillation circuit board,
The oscillation circuit substrate includes a dielectric substrate, a strip line formed on the surface of the dielectric substrate, and a dielectric resonator provided on the surface of the dielectric substrate so as to be electromagnetically coupled to the strip line. A ground electrode formed on the back surface of the dielectric substrate; and an external electrode of the semiconductor device formed on the back surface of the dielectric substrate and electrically connected to the end of the stripline and to be inspected And a connection electrode to be electrically connected,
The ground electrode is in contact with the bottom of the shielding case;
An inspection jig for a semiconductor device, wherein an opening for exposing the connection electrode is provided at the bottom of the shielding case so that the external electrode of the semiconductor device is electrically connected to the connection electrode. . The derivative collector substrate, said together with the semiconductor device has an opening having a shape to be fitted, the connecting electrode external electrodes in a self-aligned manner in the semiconductor device fitted to the opening of the derivative collector substrate The jig for inspection of a semiconductor device according to claim 1, wherein the jig is in contact with the jig.   A frequency adjustment screw is screwed above the dielectric resonator in the shielding case, and the distance between the tip of the frequency adjustment screw and the dielectric resonator is adjusted to adjust the distance of the dielectric resonator. 2. The semiconductor device inspection jig according to claim 1, wherein the oscillation frequency is adjustable.

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