JP4430184B2 - Illumination method, illumination apparatus, and component mounting apparatus using the same - Google Patents

Illumination method, illumination apparatus, and component mounting apparatus using the same Download PDF

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Publication number
JP4430184B2
JP4430184B2 JP2000010248A JP2000010248A JP4430184B2 JP 4430184 B2 JP4430184 B2 JP 4430184B2 JP 2000010248 A JP2000010248 A JP 2000010248A JP 2000010248 A JP2000010248 A JP 2000010248A JP 4430184 B2 JP4430184 B2 JP 4430184B2
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Japan
Prior art keywords
light
recognition
component
reflected
recognition object
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JP2001202515A5 (en
JP2001202515A (en
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崇行 深江
規之 鈴木
良久 大井戸
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、各種部品などを画像認識する用途などに広く用いられている画像処理システムにおける撮像対象物に光照射するための照明方法および照明装置に関するものであり、特に、電子部品実装装置のアライメントとしての用途に好適な照明方法および照明装置に関するものである。
【0002】
【従来の技術】
近年、様々な分野で広く用いられている画像処理システムでは、高精度の画像認識を行うために、カメラの撮像対象物つまり認識対象物と背景とに高いコントラストを得ることのできる照明装置が要求されている。従来の画像処理システムに用いられている照明装置は、その概略構成の斜視図を示す図9のように、光源1からの出射光(一般にハロゲン光が用いられている)を、スライドガイド2を通じて認識対象物3の表面に照射するよう構成されている。このように認識対象物3に光を照射すると、認識対象物3とこれの背景とのコントラストを高くすることができ、認識対象物3を画像的に容易、且つ正確に認識することが可能となる。認識対象物3と背景とのコントラストが高くならない場合には、光源1とスライドガイド2との間に、複種類の色フィルタ4を順次交換しながら介挿して、この色フィルタ4を通した光を順次替えながら照射することにより、認識対象物3と背景とのコントラストが高くなるように調整している。
【0003】
【発明が解決しようとする課題】
しかしながら、上記構成の照明装置では、認識対象物3の種類によっては背景とのコントラストをどうしても高くできない場合があった。例えば、白いセラミック製の回路基板の本体面(背景)上に金めっきを施して形成された回路パターン(認識対象物)を画像認識する場合には、金めっきの回路パターンおよび回路基板の本体面の双方の光反射率が共に高いので、色フィルタ4を種々変更しながらコントラストの調整を行っても、撮像された画像における回路パターンと基板本体面とのコントラストがどうしても高くならず、高精度の画像認識を行えないという問題があった。そのため、白いセラミック製の回路基板上の金めっきによる回路パターンを画像認識しようとする電子部品実装装置では、パターン認識に失敗して装置の作動が自動停止することがあった。
【0004】
そこで、本発明は、上記従来の課題に鑑みてなされたもので、認識対象物の素材の如何に拘わらず、この認識対象物と背景とのコントラストを確実に高く出すことのできるように光照射できる照明方法、照明装置およびそれを用いた部品実装装置を提供することを目的とするものである。
【0005】
【課題を解決するための手段】
上記目的を達成するために、本発明の照明方法は認識対象物の反射光の波長成分を含む光を、前記認識対象物の表面と同じ元素成分反射面で反射させた後、前記反射面で反射した光を前記認識対象物に照射する認識対象物の反射光の波長成分を含む光を、前記認識対象物の成分を含む反射面で反射させた後、前記反射面で反射した光を前記認識対象物に照射することを特徴とする。また本発明の照明装置は認識対象物の反射光の波長成分を含む光を出射する光源と、前記認識対象物の表面と同じ元素成分反射面を有する反射板とを備えてなり、前記光源から出射され前記反射面で反射した光を前記認識対象物に照射するように構成されていると好適である。
【0006】
本発明によれば、光源の出射光は、例えば認識対象物に白色光を照射したときに反射してくる光の波長成分を有しているが、この出射光が反射板の前記認識対象物の表面と同じ元素成分光反射面で反射された反射光は、認識対象物に例えば白色光を照射したときに反射してくる光の波長成分のみが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、反射板からの反射光は、認識対象物以外の背景に例えば白色光を照射したときに反射してくる波長成分が減衰された光となるので、この反射光を認識対象物に照射しながらカメラで撮像することにより、認識対象物と背景とのコントラストが高い画像を得ることができる。
【0007】
上記発明において、複数の認識対象物の各々の成分をそれぞれ主成分として含んだ光反射面を有する複種類の反射板を備え、前記各反射板が、光照射すべき前記各認識対象物の相違に対応して入れ換え可能に具備されている構成とすることができる。
【0008】
これにより、各反射板における各々の光反射面からの反射光は、各反射板に適応する認識対象物以外の背景に例えば白色光を照射したときに反射してくる波長成分が減衰された光となる。したがって、互いに異なる成分を有する複種類の認識対象物が存在する場合には、それら各認識対象物に適応する反射板を選択して設置して、それら反射板からの反射光を認識対象物に照射しながら撮像することにより、各認識対象物に応じて背景とのコントラストが高い画像を得ることが可能となる。
【0009】
また、上記発明において、光源からの出射光を、反射板における金を主成分として含んだ光反射面で反射させて、金を主成分とする認識対象物に照射するよう構成することもできる。これにより、主成分が金である認識対象物と主成分が金でない背景との間でのコントラストの高い画像を得ることが可能となり、特に、電子部品実装装置において使用されることの多い金めっきによる回路パターンと基板本体部とのコントラストが高い画像を得るのに適している。
【0010】
また、照明装置は、上記に加えさらに、それぞれ異なる元素成分の反射面を有する複数の反射板と、表面の元素成分が異なる複数の認識対象物の切り替えに対応して、認識対象である前記認識対象物に対応した反射面を有する反射板に入れ換える入れ換え機構と、を備えることを特徴としたもの、また、認識対象物が金めっきによる回路パターンであり、前記認識対象物の表面の元素成分が金であることを特徴としたものとすることができる。
【0011】
また、上記いずれかの照明装置は、これを具備した部品実装装置を実現する。
【0012】
【発明の実施の形態】
以下、本発明の好ましい実施の形態について図面を参照しながら説明する。図1は、本発明の第1の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図である。同図において、光源7Aからの出射光L1には、認識対象物9Aに白色光を照射したときに反射してくる光の波長成分を含んでいる。この出射光L1を反射させて認識対象物9Aに照射する反射板8Aは、認識対象物9Aの形成成分を主成分として含んで形成された光反射面を有している。この光反射面による反射光L2は認識対象物9Aに照射するよう構成されている。
【0013】
図2は、上記照明装置における光源7Aからの出射光L1と反射板8Aでの反射光L2との波長と相対放射強度との関係をそれぞれ示す分光特性図である。同図において、C1は光源8Aの出射光L1の分光分布を示す特性曲線、C2は出射光L1が反射板8Aで反射した反射光L2の分光分布を示す特性曲線、W1は光源7Aの出射光の波長成分、W2は認識対象物9Aに白色光を照射したときに反射してくる光の波長成分をそれぞれ示す。
【0014】
同図から明らかなように、光源7Aの出射光L1は、図2の波長成分W1を有しているが、この出射光L1が反射板8Aの光反射面で反射された反射光L2は、認識対象物9Aに白色光を照射したときに反射してくる光の波長成分W2のみが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、反射板8Aからの反射光L2は、認識対象物9A以外の背景に白色光を照射したときに反射してくる波長成分が減衰された光となるので、この反射光L2を認識対象物9Aに照射しながら撮像することにより、認識対象物9Aと背景とのコントラストが高い画像を得ることができる。
【0015】
図3は本発明の第2の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図である。同図において、図1と同一若しくは同等のものには同一の符号を付して、その説明を省略する。この実施の形態では、互いに異なる成分で形成された2種の認識対象物9A,9Bにそれぞれ光照射する場合を示す。光源7Bからの出射光L1には、認識対象物9A,9Bに白色光を照射したときに反射してくる光の波長成分を含んでいる。
【0016】
上記出射光L1を反射させて認識対象物9Aに照射するための反射板8Aは、図1で説明したように、認識対象物9Aの形成成分を主成分として含んだ光反射面を有している。一方、出射光L1を反射させて認識対象物9Bに照射するための反射板8Bは、認識対象物9Bの形成成分を主成分として含んだ光反射面を有している。したがって、一方の認識対象物9Aの画像認識を行う場合には、光源7Bからの出射光L1を、認識対象物9Aに適応する一方の反射板8Aで反射させて認識対象物9Aに光照射し、他方の認識対象物9Bの画像認識を行う場合には、光源7Bからの出射光L1を、認識対象物9Bに対応する他方の反射板8Bで反射させて認識対象物9Bに光照射する。したがって、上記反射板8A,8Bの切り替えは認識対象物9A,9Bに応じて行われる。なお、図3では、2枚の反射板8A,8Bを設ける場合について例示しているが、この反射板の枚数は3枚以上であってもよい。
【0017】
図4は、上記照明装置における光源7Bからの出射光L1と各反射板8A,8Bでの反射光L2との波長と相対放射強度との関係をそれぞれ示す分光特性図である。同図において、C2は、図2で説明したように、出射光L1が一方の反射板8Aで反射した反射光L2の分光分布を示す特性曲線、C3は光源7Bからの出射光L1を反射板8Bで反射した反射光L2の分光分布を示す特性曲線、C4は光源7Bからの出射光L1の分光分布を示す特性曲線、W2は、図2で説明したように、認識対象物9Aに白色光を照射したときに反射してくる光の波長成分、W3は認識対象物9Bに白色光を照射したときに反射してくる光の波長成分、W4は光源7Bからの出射光L1の波長成分をそれぞれ示す。
【0018】
同図から明らかなように、光源7Bの出射光L1は、図4の波長成分W4を有しているが、この出射光L1が反射板8Aの光反射面で反射された反射光L2は、認識対象物9Aに白色光を照射したときに反射してくる光の波長成分W2のみが残り、それ以外の波長成分を含む光が減衰された分光分布となり、同様に、出射光L1が反射板8Bの光反射面で反射された反射光L2は、認識対象物9Bに白色光を照射したときに反射してくる光の波長成分W3のみが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、反射板8A,8Bからの反射光L2は、適応する認識対象物9A,9B以外の背景に白色光を照射したときに反射してくる波長成分が減衰された光となる。したがって、互いに異なる成分を有する複種類の認識対象物9A,9Bが存在する場合には、それら各認識対象物9A,9Bに適応する反射板8A,8Bを選択して設置して、それら反射板8A,8Bからの反射光L2を認識対象物9A,9Bに照射しながら撮像することにより、各認識対象物9A,9Bに応じて背景とのコントラストが高い画像を得ることが可能となる。
【0019】
図5は本発明の第3の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図である。この実施の形態では、金を主成分とする認識対象物9Cに対し光照射するものであり、光源7Cからの出射光L1には、認識対象物9Cに白色光を照射したときに反射してくる光の波長成分を含んでいる。この出射光L1を反射させて認識対象物9Cに光照射する反射板8Cは、金めっきを施された光反射面を有している。この光反射面による反射光L2は認識対象物9Cに照射するよう構成されている。
【0020】
図6は、上記照明装置における光源7Cからの出射光L1と反射板8Cでの反射光L2との波長と相対放射強度との関係をそれぞれ示す分光特性図である。同図において、C5は光源7Cからの出射光L1の分光分布を示す特性曲線、C6は出射光L1が反射板8Cで反射した反射光L2の分光分布を示す特性曲線、W5は光源7Cからの出射光L1の波長成分、W6は認識対象物9Cに白色光を照射したときに反射してくる光の波長成分をそれぞれ示す。
【0021】
同図から明らかなように、光源7Cの出射光L1は、図6の波長成分W5を有しているが、この出射光L1が反射板8Cの光反射面で反射された反射光L2は、認識対象物9Cに白色光を照射したときに反射してくる光の波長成分W6のみが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、反射板8Cからの反射光L2は、認識対象物9C以外の背景に白色光を照射したときに反射してくる波長成分が減衰された光となるので、この反射光L2を認識対象物9Cに照射しながら撮像することにより、認識対象物9Cと背景とのコントラストが高い画像を得ることができる。したがって、この実施の形態の照明装置を用いれば、主成分が金である認識対象物9Cと主成分が金でない背景との間でのコントラストの高い画像を得ることが可能となる。
【0022】
図7は、本発明の第4の実施の形態に係る画像処理システム用照明装置が適用された電子部品実装装置10を示す斜視図である。先ず、この電子部品実装装置10の概略について説明する。各種の電子部品を実装すべき回路基板11は、基板搬送部12により搬送されて、基板位置決めステージ13に位置決め保持される。
【0023】
一方、回路基板11に実装するための各種の電子部品17は、部品供給部18に収納されており、この部品供給部18内の電子部品17は、これらのうちの所要のものを部品受渡し用ヘッド19によって順次取り出される。この部品受渡し用ヘッド19によって取り出された電子部品17は、一対の部品装着用ヘッド14の何れかに受け渡される。電子部品17を吸着保持した部品装着用ヘッド14は、基板位置決めステージ13に位置決め保持されている回路基板11における所定の装着位置に電子部品17を移送して装着する。
【0024】
部品装着用ヘッド14が吸着保持する電子部品17と回路基板11との位置合わせは基板位置決めステージ13において行われるのであるが、それに先立って、基板位置決めステージ13に位置決め保持されている回路基板11の回路パターンに対する画像認識に基づく所定の部品装着部の位置認識と、部品装着用ヘッド14が吸着保持している電子部品17の画像認識に基づく吸着位置および吸着姿勢などの認識が行われる。回路基板11の画像認識は、回路基板11を撮像するカメラとその回路基板11に光照射する照明装置とが一体となった基板認識部20が行う。電子部品17の画像認識は、電子部品17を撮像するカメラ(図示せず)とその電子部品17に光照射する照明装置とが一体となった部品認識部21が行う。上記の基板認識部20および部品認識部21には、それぞれ第4の実施の形態に係る照明装置が組み込まれている。この照明装置は、基板認識部20および部品認識部21の何れにも同一構成のものが用いられる。
【0025】
図8は、上記の基板認識部20または部品認識部21に用いられる照明装置の概略構成を示し、(a)は平面図、(b)は縦断面図である。この照明装置は、ライトガイド22の中央部に平面視円形の反射板23が組付けられた構造になっている。基板認識部20用の照明装置における反射板23は、回路基板11上に印刷配線手段などにより形成された回路パターンの形成成分を主成分として含んだ光反射面23aを有している。一方、部品認識部21用の照明装置における反射板23は、電子部品17の成分を主成分として含んだ光反射面23aを有している。何れの装置20,21に用いる照明装置においても、上記の光反射面23aは、ライトガイド22における下部に円周面に形成された光導出面22aからの光を真下に反射させることのできる傾斜角度を有するほぼ逆円錐台形状になっている。ライトガイド22には、光源24からの出射光が光ファイバ27を通じて導光される。
【0026】
基板認識部20は、基板位置決めステージ13が保持している回路基板11における認識対象箇所に対し照明装置から光照射し、且つカメラで撮像した画像に基づき基板位置を認識する。一方、部品認識部21は、部品装着用ヘッド14が吸着保持している電子部品17に対し照明装置から光照射し、且つカメラで撮像した画像に基づき電子部品17の位置などを認識する。そして、両認識部20,21の各々の認識結果に基づいて電子部品17の回路基板11に対する位置決めを行って、その電子部品17を部品装着用ヘッド14が回路基板11に装着する。
【0027】
基板認識部20では、ライトガイド22の光導出面22aからの光が、反射板23における回路基板11の認識対象物の成分を主成分として形成された光反射面23aで反射されて、回路基板11上の認識対象物に照射される。上記光導出面22aからの光は、光反射面23aで反射されることにより、回路基板11上に白色光を照射したときに反射してくる光の波長成分だけが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、光反射面23aでの反射光は、回路基板11上の認識対象物以外の基板背景に白色光を照射したときに反射してくる光の波長成分が減衰された光となるので、この反射光を回路基板11の認識対象物に照射することによって回路基板11上の認識対象物と基板背景とのコントラストが高い画像を得ることができる。したがって、回路基板11の位置を認識する際の認識率は、認識対象物と基板背景とのコントラストの高い画像によって向上し、高い信頼性で回路基板11の位置を認識できる。
【0028】
一方、部品認識部21では、上記の基板認識部20と同様に、ライトガイド22の光導出面22aからの光が、反射板23における電子部品17の成分を主成分として形成された光反射面23aで反射されて、部品装着用ヘッド14に吸着保持されている電子部品17に照射される。上記光導出面22aからの光は、光反射面23aで反射されることにより、電子部品17に白色光を照射したときに反射してくる光の波長成分だけが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、光反射面23aでの反射光は、電子部品17以外の周囲背景に白色光を照射したときに反射してくる光の波長成分が減衰された光となるので、この反射光を電子部品17に照射することによって電子部品17と周囲背景とのコントラストが高い画像を得ることができる。したがって、電子部品17の位置や吸着姿勢を認識する際の認識率は、電子部品17と周囲背景とのコントラストが高い画像によって向上し、高い信頼性で電子部品17の位置などを認識できる。
【0029】
したがって、図8の第4の実施の形態に係る照明装置と撮像用カメラとを組み合わせて電子部品実装装置10における基板認識部20および部品認識部21をそれぞれ構成すれば、回路基板11と電子部品17との各々の位置を共に高精度に認識することが可能となり、コントラスト不足の画像による認識不能に起因して電子部品実装装置10が停止してしまうといったトラブルの発生を確実に防止することができる。上記とは別に、電子部品17の接合時に高温を必要とする電子部品実装装置10においては、電子部品17または回路基板11が熱に対する耐性を有しているため、それら電子部品17または回路基板11の成分を主成分として含んだ光反射面23aを有する反射板23を用いることにより、高温での使用にも耐えうる照明装置を構成することが可能となる。
【0030】
【発明の効果】
本発明によれば、認識対象物の表面と同じ元素成分反射面を備えた構成としたので、反射面で反射された反射光は、認識対象物の反射光の波長成分のみが残り、それ以外の波長成分を含む光が減衰された分光分布となる。すなわち、反射面からの反射光は、認識対象物以外の背景から反射してくる波長成分が減衰された光となるので、この反射光を認識対象物に照射しながらカメラで撮像することにより、認識対象物と背景とのコントラストが高い画像を得ることができる。
【0031】
本発明の照明装置を部品実装装置に適用すれば、回路基板と電子部品との各々の位置を共に高精度に認識することが可能となり、コントラスト不足の画像による認識不能に起因して電子部品実装装置が停止してしまうといったトラブルの発生を確実に防止することができる。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図。
【図2】同上照明装置における光源からの投射光と反射板からの反射光との各々の波長と相対放射強度との関係をそれぞれ示す分光特性図。
【図3】本発明の第2の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図。
【図4】同上照明装置における光源からの投射光と各反射板からの反射光との各々の波長と相対放射強度との関係をそれぞれ示す分光特性図。
【図5】本発明の第3の実施の形態に係る画像処理システム用照明装置の概略構成を示す斜視図。
【図6】同上照明装置における光源からの投射光と反射板からの反射光との各々の波長と相対放射強度との関係をそれぞれ示す分光特性図。
【図7】本発明の第4の実施の形態に係る画像処理システム用照明装置が適用された電子部品実装装置を示す斜視図。
【図8】同上電子部品実装装置における基板認識部または部品認識部に用いられる同上画像処理システム用照明装置の概略構成を示し、(a)は平面図、(b)は縦断面図。
【図9】従来の画像処理システムの照明装置の概略構成を示す斜視図。
【符号の説明】
7A〜7C 光源
8A〜8C 反射板
9A〜9C 認識対象物
10 電子部品実装装置
11 回路基板
17 電子部品
20 基板認識部
21 部品認識部
23 反射板
23a 光反射面
24 光源
L1 出射光
L2 反射光
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an illumination method and an illumination device for irradiating an imaging target with light in an image processing system that is widely used for image recognition of various components and the like, and in particular, alignment of an electronic component mounting device. The present invention relates to a lighting method and a lighting device suitable for use as a lighting device.
[0002]
[Prior art]
In recent years, an image processing system widely used in various fields requires a lighting device capable of obtaining a high contrast between the imaging object of the camera, that is, the recognition object and the background, in order to perform highly accurate image recognition. Has been. As shown in FIG. 9 showing a schematic perspective view of an illuminating device used in a conventional image processing system, light emitted from a light source 1 (generally halogen light is used) is passed through a slide guide 2. It is configured to irradiate the surface of the recognition object 3. When the recognition target object 3 is irradiated with light in this way, the contrast between the recognition target object 3 and the background thereof can be increased, and the recognition target object 3 can be easily and accurately recognized in terms of image. Become. When the contrast between the recognition object 3 and the background does not increase, light of the color filter 4 is inserted by interchanging a plurality of types of color filters 4 between the light source 1 and the slide guide 2 in order. Are adjusted so that the contrast between the recognition object 3 and the background increases.
[0003]
[Problems to be solved by the invention]
However, in the illumination device having the above-described configuration, the contrast with the background cannot be inevitably increased depending on the type of the recognition object 3. For example, when recognizing an image of a circuit pattern (recognition object) formed by applying gold plating on the body surface (background) of a white ceramic circuit board, the gold plating circuit pattern and the circuit board body surface Therefore, even if the color filter 4 is changed in various ways and the contrast is adjusted, the contrast between the circuit pattern and the substrate body surface in the captured image is not necessarily increased, and high accuracy is achieved. There was a problem that image recognition could not be performed. Therefore, in an electronic component mounting apparatus that attempts to recognize an image of a circuit pattern formed by gold plating on a white ceramic circuit board, pattern recognition may fail and the operation of the apparatus may be automatically stopped.
[0004]
Accordingly, the present invention has been made in view of the above-described conventional problems, and light irradiation is performed so that the contrast between the recognition object and the background can be reliably increased regardless of the material of the recognition object. An object of the present invention is to provide a lighting method, a lighting device, and a component mounting apparatus using the lighting method .
[0005]
[Means for Solving the Problems]
To achieve the above object, a light illumination method comprising the wavelength components of the reflected light recognition object of the present invention, after being reflected by the reflecting surface of the same element components and the surface of the object to be recognized, the reflecting surface After the light including the wavelength component of the reflected light of the recognition object that irradiates the light reflected at the recognition object is reflected by the reflection surface including the component of the recognition object, the light reflected by the reflection surface is reflected. The recognition object is irradiated. The illumination device of the present invention includes a light source that emits light including a wavelength component of reflected light of a recognition object, and a reflection plate having a reflection surface having the same elemental component as the surface of the recognition object. It is preferable that the object to be recognized is irradiated with light emitted from the reflector and reflected by the reflecting surface.
[0006]
According to the present invention, the emitted light of the light source has, for example, a wavelength component of light that is reflected when white light is irradiated on the recognition object, and this emitted light is the recognition object of the reflector . The reflected light reflected by the light reflecting surface of the same elemental component as the surface of the light remains only the wavelength component of the light reflected when, for example, white light is irradiated on the recognition target object, and includes other wavelength components. Becomes the attenuated spectral distribution. In other words, the reflected light from the reflecting plate becomes light in which the wavelength component reflected when the background other than the recognition target object is irradiated with, for example, white light is attenuated. However, an image with a high contrast between the recognition object and the background can be obtained by imaging with the camera.
[0007]
In the above invention, a plurality of types of reflecting plates having light reflecting surfaces each including a component of each of a plurality of recognition objects as main components are provided, and each of the reflecting plates is different from each of the recognition objects to be irradiated with light. It can be set as the structure comprised so that replacement | exchange was possible correspondingly.
[0008]
As a result, the reflected light from the respective light reflecting surfaces of each reflecting plate is attenuated in the wavelength component reflected when, for example, white light is irradiated on the background other than the recognition target object adapted to each reflecting plate. It becomes. Therefore, when there are multiple types of recognition objects having different components from each other, select and install reflectors suitable for each recognition object, and use the reflected light from these reflectors as recognition objects. By imaging while irradiating, it is possible to obtain an image having a high contrast with the background according to each recognition object.
[0009]
Moreover, in the said invention, it can also comprise so that the emitted light from a light source may be reflected in the light reflection surface containing the gold | metal as a main component in a reflecting plate, and may be irradiated to the recognition target object which has gold as a main component. This makes it possible to obtain a high-contrast image between a recognition object whose main component is gold and a background whose main component is not gold, especially gold plating often used in electronic component mounting apparatuses. This is suitable for obtaining an image having a high contrast between the circuit pattern and the substrate body.
[0010]
In addition to the above , the illuminating device further includes a plurality of reflectors each having a reflection surface of a different element component, and a recognition target corresponding to switching of a plurality of recognition objects having different surface element components. And a replacement mechanism for switching to a reflecting plate having a reflecting surface corresponding to the object, and the recognition object is a circuit pattern by gold plating, and the elemental component on the surface of the recognition object is It can be characterized by being gold.
[0011]
In addition, any one of the above lighting devices realizes a component mounting apparatus including the lighting device.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to the first embodiment of the present invention. In the figure, the emitted light L1 from the light source 7A includes a wavelength component of light reflected when the recognition target 9A is irradiated with white light. The reflection plate 8A that reflects the emitted light L1 and irradiates the recognition target 9A has a light reflection surface that is formed so as to include the component of the recognition target 9A as a main component. The reflected light L2 from the light reflecting surface is configured to irradiate the recognition target 9A.
[0013]
FIG. 2 is a spectral characteristic diagram showing the relationship between the wavelength of the emitted light L1 from the light source 7A and the reflected light L2 from the reflecting plate 8A and the relative radiation intensity in the illumination device. In the figure, C1 is a characteristic curve showing the spectral distribution of the outgoing light L1 of the light source 8A, C2 is a characteristic curve showing the spectral distribution of the reflected light L2 reflected by the reflecting plate 8A, and W1 is the outgoing light of the light source 7A. W2 represents the wavelength component of the light reflected when the recognition object 9A is irradiated with white light.
[0014]
As can be seen from the figure, the emitted light L1 of the light source 7A has the wavelength component W1 of FIG. 2, but the reflected light L2 reflected by the light reflecting surface of the reflecting plate 8A is Only the wavelength component W2 of the light that is reflected when the recognition target 9A is irradiated with white light remains, and the light including the other wavelength components is attenuated. That is, the reflected light L2 from the reflecting plate 8A becomes light in which the wavelength component reflected when the background light other than the recognition target 9A is irradiated with white light is attenuated. By imaging while irradiating 9A, an image with high contrast between the recognition object 9A and the background can be obtained.
[0015]
FIG. 3 is a perspective view showing a schematic configuration of an illuminating device for an image processing system according to the second embodiment of the present invention. In the figure, the same or equivalent parts as in FIG. In this embodiment, a case is shown in which light is irradiated to two types of recognition objects 9A and 9B formed of components different from each other. The emitted light L1 from the light source 7B includes a wavelength component of light that is reflected when the recognition objects 9A and 9B are irradiated with white light.
[0016]
The reflection plate 8A for reflecting the emitted light L1 and irradiating the recognition object 9A has a light reflection surface containing the formation component of the recognition object 9A as a main component as described in FIG. Yes. On the other hand, the reflection plate 8B for reflecting the emitted light L1 and irradiating the recognition target object 9B has a light reflection surface including a component for forming the recognition target object 9B as a main component. Therefore, when image recognition of one recognition object 9A is performed, the emitted light L1 from the light source 7B is reflected by one reflecting plate 8A adapted to the recognition object 9A and irradiated to the recognition object 9A. When performing image recognition of the other recognition object 9B, the emitted light L1 from the light source 7B is reflected by the other reflecting plate 8B corresponding to the recognition object 9B and irradiated to the recognition object 9B. Therefore, switching of the reflectors 8A and 8B is performed according to the recognition objects 9A and 9B. 3 illustrates the case where two reflecting plates 8A and 8B are provided, the number of the reflecting plates may be three or more.
[0017]
FIG. 4 is a spectral characteristic diagram showing the relationship between the wavelength of the emitted light L1 from the light source 7B and the reflected light L2 from the reflecting plates 8A and 8B and the relative radiation intensity in the illumination device. In FIG. 2, C2 is a characteristic curve indicating the spectral distribution of the reflected light L2 reflected by the one reflecting plate 8A, and C3 is the reflecting light L1 from the light source 7B, as described in FIG. A characteristic curve showing the spectral distribution of the reflected light L2 reflected by 8B, C4 is a characteristic curve showing the spectral distribution of the outgoing light L1 from the light source 7B, and W2 is white light on the recognition object 9A as described in FIG. W3 is the wavelength component of the light reflected when the recognition target 9B is irradiated with white light, and W4 is the wavelength component of the light L1 emitted from the light source 7B. Each is shown.
[0018]
As is clear from the figure, the emitted light L1 from the light source 7B has the wavelength component W4 in FIG. 4, but the reflected light L2 reflected by the light reflecting surface of the reflecting plate 8A is Only the wavelength component W2 of the light reflected when the recognition target 9A is irradiated with white light remains, and the light including the other wavelength components is attenuated in the spectral distribution. Similarly, the emitted light L1 is reflected by the reflector. In the reflected light L2 reflected by the light reflecting surface 8B, only the wavelength component W3 of the light reflected when the recognition target 9B is irradiated with white light remains, and light including other wavelength components is attenuated. Spectral distribution. That is, the reflected light L2 from the reflectors 8A and 8B becomes light in which the wavelength component reflected when the background light other than the applicable recognition target objects 9A and 9B is irradiated with white light is attenuated. Therefore, when there are multiple types of recognition objects 9A and 9B having different components, the reflectors 8A and 8B that are suitable for the respective recognition objects 9A and 9B are selected and installed, and the reflectors By capturing images while irradiating the recognition objects 9A and 9B with the reflected light L2 from 8A and 8B, it is possible to obtain an image having a high contrast with the background according to each recognition object 9A and 9B.
[0019]
FIG. 5 is a perspective view showing a schematic configuration of an illumination apparatus for an image processing system according to the third embodiment of the present invention. In this embodiment, light is emitted to the recognition object 9C mainly composed of gold, and the emitted light L1 from the light source 7C is reflected when the recognition object 9C is irradiated with white light. Contains the wavelength component of the incoming light. The reflecting plate 8C that reflects the emitted light L1 and irradiates the recognition object 9C with light has a light reflecting surface that is plated with gold. The reflected light L2 from the light reflecting surface is configured to irradiate the recognition target 9C.
[0020]
FIG. 6 is a spectral characteristic diagram showing the relationship between the wavelength of the emitted light L1 from the light source 7C and the reflected light L2 from the reflecting plate 8C and the relative radiation intensity in the illumination device. In the figure, C5 is a characteristic curve showing the spectral distribution of the outgoing light L1 from the light source 7C, C6 is a characteristic curve showing the spectral distribution of the reflected light L2 reflected from the reflecting plate 8C by the outgoing light L1, and W5 is from the light source 7C. The wavelength component W6 of the emitted light L1 indicates the wavelength component of the light reflected when the recognition target 9C is irradiated with white light.
[0021]
As is apparent from FIG. 6, the emitted light L1 from the light source 7C has the wavelength component W5 in FIG. 6, but the reflected light L2 reflected by the light reflecting surface of the reflecting plate 8C is Only the wavelength component W6 of the light reflected when the recognition target 9C is irradiated with white light remains, and the light including the other wavelength components is attenuated. That is, the reflected light L2 from the reflecting plate 8C becomes light in which the wavelength component reflected when the background light other than the recognition target 9C is irradiated with white light is attenuated. By imaging while irradiating 9C, an image with high contrast between the recognition object 9C and the background can be obtained. Therefore, by using the illumination device of this embodiment, it is possible to obtain an image with high contrast between the recognition object 9C whose main component is gold and the background whose main component is not gold.
[0022]
FIG. 7 is a perspective view showing an electronic component mounting apparatus 10 to which an illumination device for an image processing system according to a fourth embodiment of the present invention is applied. First, an outline of the electronic component mounting apparatus 10 will be described. The circuit board 11 on which various electronic components are to be mounted is transported by the substrate transport unit 12 and positioned and held on the substrate positioning stage 13.
[0023]
On the other hand, various electronic components 17 to be mounted on the circuit board 11 are accommodated in a component supply unit 18, and the electronic component 17 in the component supply unit 18 is used to deliver a required one of these components. It is sequentially taken out by the head 19. The electronic component 17 taken out by the component delivery head 19 is delivered to one of the pair of component mounting heads 14. The component mounting head 14 that sucks and holds the electronic component 17 transfers and mounts the electronic component 17 to a predetermined mounting position on the circuit board 11 that is positioned and held on the substrate positioning stage 13.
[0024]
The positioning of the electronic component 17 held by the component mounting head 14 and the circuit board 11 is performed in the board positioning stage 13. Prior to that, the circuit board 11 positioned and held on the board positioning stage 13 is positioned. Recognition of the position of a predetermined component mounting unit based on image recognition with respect to the circuit pattern and recognition of the suction position and suction posture based on image recognition of the electronic component 17 held by the component mounting head 14 are performed. Image recognition of the circuit board 11 is performed by a board recognition unit 20 in which a camera that captures the circuit board 11 and an illumination device that irradiates the circuit board 11 with light are integrated. Image recognition of the electronic component 17 is performed by a component recognition unit 21 in which a camera (not shown) that images the electronic component 17 and an illumination device that irradiates the electronic component 17 with light are integrated. The board recognition unit 20 and the component recognition unit 21 each incorporate a lighting device according to the fourth embodiment. This lighting device has the same configuration for both the board recognition unit 20 and the component recognition unit 21.
[0025]
FIG. 8 shows a schematic configuration of the illumination device used in the board recognition unit 20 or the component recognition unit 21, wherein (a) is a plan view and (b) is a longitudinal sectional view. This illuminating device has a structure in which a reflecting plate 23 having a circular shape in plan view is assembled at the center of the light guide 22. The reflection plate 23 in the illumination device for the substrate recognition unit 20 has a light reflection surface 23a containing as a main component a circuit pattern forming component formed on the circuit board 11 by printed wiring means or the like. On the other hand, the reflection plate 23 in the illumination device for the component recognition unit 21 has a light reflection surface 23 a containing the component of the electronic component 17 as a main component. In any of the lighting devices used for the devices 20 and 21, the light reflecting surface 23 a is capable of reflecting the light from the light guide surface 22 a formed on the circumferential surface at the lower part of the light guide 22 directly below. It has a substantially inverted truncated cone shape. Light emitted from the light source 24 is guided to the light guide 22 through the optical fiber 27.
[0026]
The board recognizing unit 20 irradiates light from a lighting device to a recognition target portion on the circuit board 11 held by the board positioning stage 13 and recognizes the board position based on an image captured by the camera. On the other hand, the component recognition unit 21 irradiates the electronic component 17 held by the component mounting head 14 with light from the illumination device and recognizes the position of the electronic component 17 based on the image captured by the camera. Then, the electronic component 17 is positioned with respect to the circuit board 11 based on the recognition results of both the recognition units 20 and 21, and the component mounting head 14 mounts the electronic component 17 on the circuit board 11.
[0027]
In the board recognition unit 20, the light from the light guide surface 22 a of the light guide 22 is reflected by the light reflection surface 23 a formed mainly with the component of the recognition target object of the circuit board 11 in the reflection plate 23. The upper recognition object is irradiated. The light from the light derivation surface 22a is reflected by the light reflection surface 23a, so that only the wavelength component of the light reflected when the circuit board 11 is irradiated with white light remains, and other wavelength components are removed. The contained light has an attenuated spectral distribution. That is, the reflected light from the light reflecting surface 23a becomes light in which the wavelength component of the light reflected when the white background is irradiated to the substrate background other than the recognition target on the circuit board 11 is attenuated. By irradiating the object to be recognized on the circuit board 11 with the reflected light, an image having a high contrast between the object to be recognized on the circuit board 11 and the substrate background can be obtained. Therefore, the recognition rate when recognizing the position of the circuit board 11 is improved by an image having a high contrast between the recognition object and the substrate background, and the position of the circuit board 11 can be recognized with high reliability.
[0028]
On the other hand, in the component recognizing unit 21, similarly to the substrate recognizing unit 20 described above, light from the light guide surface 22 a of the light guide 22 is a light reflecting surface 23 a formed mainly with the component of the electronic component 17 in the reflecting plate 23. And is applied to the electronic component 17 held by suction on the component mounting head 14. The light from the light deriving surface 22a is reflected by the light reflecting surface 23a, so that only the wavelength component of the light reflected when the electronic component 17 is irradiated with white light remains and includes other wavelength components. The spectral distribution is attenuated. That is, the reflected light on the light reflecting surface 23a becomes light in which the wavelength component of the light reflected when the surrounding background other than the electronic component 17 is irradiated with white light is attenuated. By irradiating 17, an image with high contrast between the electronic component 17 and the surrounding background can be obtained. Therefore, the recognition rate when recognizing the position and suction posture of the electronic component 17 is improved by an image having a high contrast between the electronic component 17 and the surrounding background, and the position of the electronic component 17 can be recognized with high reliability.
[0029]
Therefore, if the substrate recognition unit 20 and the component recognition unit 21 in the electronic component mounting apparatus 10 are configured by combining the illumination device according to the fourth embodiment of FIG. 8 and the imaging camera, respectively, the circuit board 11 and the electronic component 17 can be recognized with high accuracy, and it is possible to reliably prevent troubles such as the electronic component mounting apparatus 10 being stopped due to the inability to recognize the image due to insufficient contrast. it can. In addition to the above, in the electronic component mounting apparatus 10 that requires a high temperature when joining the electronic component 17, the electronic component 17 or the circuit board 11 has resistance to heat. By using the reflecting plate 23 having the light reflecting surface 23a containing the above component as a main component, a lighting device that can withstand use at high temperatures can be configured.
[0030]
【The invention's effect】
According to the present invention, since the reflection surface of the same element component as the surface of the recognition object is provided, the reflected light reflected by the reflection surface remains only the wavelength component of the reflection light of the recognition object. The light including a wavelength component other than is attenuated spectral distribution. That is, the reflected light from the reflecting surface becomes light in which the wavelength component reflected from the background other than the recognition target object is attenuated, and by imaging with the camera while irradiating this reflected light on the recognition target object, An image with high contrast between the recognition object and the background can be obtained.
[0031]
Lever to apply the lighting device of the present invention the component mounting apparatus, it is possible to recognize both high accuracy each of positions of the circuitry board and the electronic component, electronic due to unrecognizable by the image of the insufficient contrast It is possible to reliably prevent the trouble that the component mounting apparatus stops.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a first embodiment of the present invention.
FIG. 2 is a spectral characteristic diagram showing the relationship between the wavelength and relative radiation intensity of the projection light from the light source and the reflection light from the reflector in the illumination device.
FIG. 3 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a second embodiment of the present invention.
FIG. 4 is a spectral characteristic diagram showing the relationship between the wavelength of each of the projection light from the light source and the reflected light from each reflector and the relative radiation intensity in the illumination device.
FIG. 5 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a third embodiment of the present invention.
FIG. 6 is a spectral characteristic diagram showing the relationship between the wavelength of each of the projection light from the light source and the reflected light from the reflector and the relative radiation intensity in the illumination device.
FIG. 7 is a perspective view showing an electronic component mounting apparatus to which an illumination device for an image processing system according to a fourth embodiment of the present invention is applied.
FIG. 8 shows a schematic configuration of the illumination device for the image processing system used in the board recognition unit or the component recognition unit in the electronic component mounting apparatus, wherein (a) is a plan view and (b) is a longitudinal sectional view.
FIG. 9 is a perspective view illustrating a schematic configuration of a lighting device of a conventional image processing system.
[Explanation of symbols]
7A to 7C Light sources 8A to 8C Reflectors 9A to 9C Recognition object 10 Electronic component mounting apparatus 11 Circuit board 17 Electronic component 20 Board recognition unit 21 Component recognition unit 23 Reflection plate 23a Light reflection surface 24 Light source L1 Emission light L2 Reflected light

Claims (8)

認識対象物の反射光の波長成分を含む光を、前記認識対象物の表面と同じ元素成分反射面で反射させた後、
前記反射面で反射した光を前記認識対象物に照射すること
を特徴とする照明方法。
After light containing a wavelength component of the reflected light of the object to be recognized, and is reflected by the reflecting surface of the same element components and the surface of the object to be recognized,
An illumination method, wherein the object to be recognized is irradiated with light reflected by the reflecting surface.
表面の元素成分が異なる複数の認識対象物の切り替えに対応して、認識対象である前記認識対象物の表面の元素成分反射面に切り替えること
を特徴とする請求項1記載の照明方法。
2. The illumination method according to claim 1, wherein, in response to switching of a plurality of recognition objects having different surface elemental components , switching is made to a reflection surface of an elemental component on the surface of the recognition object that is a recognition object.
認識対象物が金めっきによる回路パターンであり、前記認識対象物の表面の元素成分が金であること
を特徴とする請求項1又は2記載の照明方法。
Recognition object is a circuit pattern by gold plating, illumination method according to claim 1 or 2, wherein the elemental components of the surface of the object to be recognized is gold.
請求項1から3のいずれか記載の照明方法によって認識対象物である部品を照明した後、
前記部品を含む領域を撮像して前記部品を認識すること
を特徴とする部品認識方法。
After illuminating the component is a recognition object by the illumination method according to any one of claims 1 to 3,
A component recognition method characterized by recognizing the component by imaging a region including the component.
認識対象物の反射光の波長成分を含む光を出射する光源と、
前記認識対象物の表面と同じ元素成分反射面を有する反射板と、
前記光源から出射され前記反射面で反射した光を前記認識対象物に照射する光学系と、を備えること
を特徴とする照明装置。
A light source that emits light including the wavelength component of the reflected light of the recognition object;
A reflector having a reflecting surface of the same element components and the surface of the object to be recognized,
An illumination system comprising: an optical system that irradiates the recognition object with light emitted from the light source and reflected by the reflecting surface.
それぞれ異なる元素成分の反射面を有する複数の反射板と、
表面の元素成分が異なる複数の認識対象物の切り替えに対応して、認識対象である前記認識対象物に対応した反射面を有する反射板に入れ換える入れ換え機構と、を備えこと
を特徴とする請求項5に記載の照明装置。
A plurality of reflecting plates each having a reflecting surface of a different element component ;
Elemental constituents of the surface in response to the switching of a plurality of different recognition object, and the replacement mechanism replace the reflector having a reflecting surface corresponding to the recognition object to be recognized, characterized in that Ru comprising billing Item 6. The lighting device according to Item 5.
認識対象物が金めっきによる回路パターンであり、前記認識対象物の表面の元素成分が金であること
を特徴とする請求項5又は6に記載の照明装置。
The illumination device according to claim 5 or 6 , wherein the recognition object is a circuit pattern formed by gold plating , and the elemental component on the surface of the recognition object is gold .
請求項5から7のいずれか記載の照明装置を具備することを特徴とする部品実装装置。Component mounting apparatus characterized by comprising a lighting device according to any of claims 5 7.
JP2000010248A 2000-01-17 2000-01-17 Illumination method, illumination apparatus, and component mounting apparatus using the same Expired - Fee Related JP4430184B2 (en)

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