JP4429767B2 - Conductive polyester resin sheet and tray for transporting electronic components - Google Patents
Conductive polyester resin sheet and tray for transporting electronic components Download PDFInfo
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- JP4429767B2 JP4429767B2 JP2004068288A JP2004068288A JP4429767B2 JP 4429767 B2 JP4429767 B2 JP 4429767B2 JP 2004068288 A JP2004068288 A JP 2004068288A JP 2004068288 A JP2004068288 A JP 2004068288A JP 4429767 B2 JP4429767 B2 JP 4429767B2
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Description
本発明は、ポリエステル系樹脂よりなる多層構成の導電性シート、とくに熱成形され電子部品の搬送トレイなどに用いられる導電性ポリエステル系樹脂シートに関する。 The present invention relates to a conductive sheet having a multilayer structure made of a polyester resin, and more particularly to a conductive polyester resin sheet that is thermoformed and used for a transport tray of an electronic component.
電子部品等を搬送、包装するためにプラスチックシート、とくに熱成形されたものが用いられている。このプラスチックシートは、電子部品の静電気による破壊を防ぐために、導電性塗料をシート表面に塗布するといった導電処理が施されている。プラスチックシートとしては、ポリスチレン、ポリ塩化ビニル、ポリエチレンテレフタレート、非晶性ポリエステル樹脂、ポリカーボネートなどを基材とするものが用いられ、これら導電性シートは、真空成形や圧空成形などの熱成形によりトレイ状とされる。
しかしながら、上記導電性シートを熱成形して搬送トレイ等に供しようとすると、とくに展開倍率の大きな熱成形をしようとすると、熱成形性に劣り良好な成形品が得られない、あるいは熱成形によってシートが延伸されるに従って表面抵抗値が上昇し本来の静電気対策という目的が達成できなくなるという問題があった。例えば、ポリエチレンテレフタレートの場合は成形性に劣る。ポリスチレンあるいは非晶性ポリエステルの場合、成形性はあるものの成形後の導電性能の低下がみられる。 However, if the conductive sheet is thermoformed and used for a transport tray or the like, especially if it is to be thermoformed with a large expansion ratio, the thermoformed property is inferior, and a good molded product cannot be obtained. As the sheet was stretched, the surface resistance value increased, and the original purpose of countermeasures against static electricity could not be achieved. For example, polyethylene terephthalate is inferior in moldability. In the case of polystyrene or amorphous polyester, although there is moldability, a decrease in conductive performance after molding is observed.
本発明は、上記問題を解決し、展開倍率の大きな熱成形をしても導電性の低下が見られない導電性ポリエステル系樹脂シートを提供することを目的とする。 An object of the present invention is to solve the above-mentioned problems and to provide a conductive polyester resin sheet in which no decrease in conductivity is observed even when thermoforming with a large expansion ratio is performed.
本発明者は、ポリエステル系樹脂シートを用い、かつ特定の多層構成とすることにより上記目的が達成されることを見出した。すなわち、本発明は、導電性樹脂シートを熱成形して得られる電子部品搬送用トレイを形成するのに用いられる、導電性ポリエステル系樹脂シートであって、非晶性ポリエステル樹脂層の少なくとも片面にポリエチレンテレフタレート樹脂層が積層され、該ポリエチレンテレフタレート樹脂層の表面に導電層が設けられたことを特徴とする導電性ポリエステル系樹脂シートを要旨とする。
また、本発明によれば、非晶性ポリエステル樹脂の両面にポリエチレンテレフタレート樹脂が設けられている、導電性ポリエステル系樹脂シートが提供される。
また、本発明によれば、ポリエチレンテレフタレート樹脂層の厚みが、シート全体の４０％以下である、導電性ポリエステル系樹脂シートが提供される。
また、本発明によれば、上記導電性ポリエステル系樹脂シートを熱成形して得られる、電子部品搬送用トレイが提供される。
This inventor discovered that the said objective was achieved by using a polyester-type resin sheet and setting it as a specific multilayer structure. That is, the present invention is a conductive polyester-based resin sheet used to form an electronic component transport tray obtained by thermoforming a conductive resin sheet, on at least one surface of an amorphous polyester resin layer. The gist is a conductive polyester resin sheet characterized in that a polyethylene terephthalate resin layer is laminated, and a conductive layer is provided on the surface of the polyethylene terephthalate resin layer.
Moreover, according to this invention, the electroconductive polyester-type resin sheet in which the polyethylene terephthalate resin is provided in both surfaces of the amorphous polyester resin is provided.
Moreover, according to this invention, the electroconductive polyester-type resin sheet whose thickness of a polyethylene terephthalate resin layer is 40% or less of the whole sheet | seat is provided.
Moreover, according to this invention, the tray for electronic component conveyance obtained by thermoforming the said electroconductive polyester-type resin sheet is provided.
この発明に係る導電性ポリエステル系樹脂シートは、非晶性ポリエステル樹脂層の少なくとも片面にポリエチレンテレフタレート樹脂層が積層され、該ポリエチレンテレフタレート樹脂層の表面に導電層が設けられたものであり、電子部品等の搬送トレイ等に供するため、展開倍率の大きな熱成形をしても導電性の低下が見られない。 The conductive polyester resin sheet according to the present invention is a sheet in which a polyethylene terephthalate resin layer is laminated on at least one surface of an amorphous polyester resin layer, and a conductive layer is provided on the surface of the polyethylene terephthalate resin layer. Therefore, even if thermoforming with a large expansion ratio is used, no decrease in conductivity is observed.
ポリエチレンテレフタレート樹脂は、エチレングリコールとテレフタル酸との重縮合により得られる公知のものが用いられる。非晶性ポリエステル樹脂としては、ポリエチレンテレフタレート樹脂におけるエチレングリコール成分の１０〜７０モル％をシクロヘキサンジメタノールで置換した共重合樹脂であるものが用いられる。 As the polyethylene terephthalate resin, a known one obtained by polycondensation of ethylene glycol and terephthalic acid is used. As the amorphous polyester resin, a copolymer resin in which 10 to 70 mol% of the ethylene glycol component in the polyethylene terephthalate resin is substituted with cyclohexanedimethanol is used.
導電層は、カーボン、銀や銅、ニッケルなどの金属、酸化錫等の金属酸化物等の粉末の入った塗料を、ポリエチレンテレフタレート樹脂シートに塗布することにより形成される。あるいは、ポリアニリン、ポリチオフェン、ポリピロールなどの導電性高分子の薄膜を形成することによっても導電層が形成される。 The conductive layer is formed by applying a paint containing powders of metals such as carbon, silver, copper, nickel, and metal oxides such as tin oxide to a polyethylene terephthalate resin sheet. Alternatively, the conductive layer can also be formed by forming a thin film of a conductive polymer such as polyaniline, polythiophene, or polypyrrole.
本発明の導電性ポリエステル系樹脂シートは、ポリエチレンテレフタレート樹脂層と非晶性ポリエステル樹脂層とが積層されたもので、導電層は必ずポリエチレンテレフタレート樹脂層の表面に設けられなければならない。ポリエチレンテレフタレート樹脂層と非晶性ポリエステル樹脂層との積層体で、非晶性ポリエステル樹脂層の表面に導電層が設けられたものでは、熱成形後に導電性の低下がみられるからである。 The conductive polyester resin sheet of the present invention is a laminate of a polyethylene terephthalate resin layer and an amorphous polyester resin layer, and the conductive layer must be provided on the surface of the polyethylene terephthalate resin layer. This is because in a laminate of a polyethylene terephthalate resin layer and an amorphous polyester resin layer and a conductive layer provided on the surface of the amorphous polyester resin layer, the conductivity is reduced after thermoforming.
ポリエチレンテレフタレート樹脂は、導電塗料との適度な密着力を確保し、熱成形時にシートが延伸され表面抵抗が上昇することを抑制する。また導電塗料に含まれる溶剤成分による膨潤が少ないため、シートへの残留溶剤が少なく、電子部品等への影響も少ないという効果もある。 The polyethylene terephthalate resin ensures an appropriate adhesion with the conductive paint, and suppresses an increase in surface resistance due to the sheet being stretched during thermoforming. Further, since there is little swelling due to the solvent component contained in the conductive paint, there is also an effect that there is little residual solvent on the sheet and there is little influence on the electronic parts and the like.
非晶性ポリエステル樹脂は、熱成形性を向上させ、展開倍率の大きな形状の成形品を得ることができる。 The amorphous polyester resin can improve thermoformability and obtain a molded product having a large unfolding magnification.
本発明の導電性ポリエステル系樹脂シートにおけるポリエチレンテレフタレート樹脂層の厚みは、シート全体の４０％以下であることが望ましい。４０％を超えると、熱成形時のシートの伸びが低下し、所望の形状の成形品を再現性よく得られなくなるからである。 The thickness of the polyethylene terephthalate resin layer in the conductive polyester resin sheet of the present invention is desirably 40% or less of the entire sheet. If it exceeds 40%, the elongation of the sheet at the time of thermoforming is lowered, and a molded product having a desired shape cannot be obtained with good reproducibility.
本発明の導電性ポリエステル系樹脂シートは、ポリエチレンテレフタレート樹脂および非晶性ポリエステル樹脂とを共押出成形することにより得ることが出来る。得られたシート表面に、上記の通り、導電塗料あるいは導電性高分子による導電層が形成され、導電性ポリエステル系樹脂シートを得ることが出来る。 The conductive polyester resin sheet of the present invention can be obtained by coextrusion molding of a polyethylene terephthalate resin and an amorphous polyester resin. As described above, a conductive layer made of a conductive paint or a conductive polymer is formed on the surface of the obtained sheet, and a conductive polyester resin sheet can be obtained.
本発明をさらに具体的に説明するために、以下に実施例及び比較例をあげて説明する。
＜実施例＞
ポリエチレンテレフタレート樹脂（イーストマンケミカル社製「９９２１」）および非晶性ポリエステル樹脂（ＳＫケミカル社製「SKYGREEN PETG S2008」）を用意し、共押出成形により、非晶性ポリエステル樹脂の両面にポリエチレンテレフタレート樹脂が積層された、厚み１ｍｍ（厚み構成が表面より、１：８：１）のシートを得た。このシートの表面に、ロール塗装機を用いて、カーボン含有導電塗料を表裏ともに２回塗布することにより導電性ポリエステル系樹脂シートを得た。
In order to describe the present invention more specifically, examples and comparative examples will be described below.
<Example>
Polyethylene terephthalate resin (“9921” manufactured by Eastman Chemical Co., Ltd.) and amorphous polyester resin (“SKYGREEN PETG S2008” manufactured by SK Chemical Co., Ltd.) are prepared, and polyethylene terephthalate resin is coated on both sides of the amorphous polyester resin by coextrusion molding. Was obtained, and a sheet having a thickness of 1 mm (thickness structure is 1: 8: 1 from the surface) was obtained. A conductive polyester-based resin sheet was obtained by applying a carbon-containing conductive paint to the surface of the sheet twice on both sides using a roll coater.
得られた導電性シートについて、真空成形機（成光産業製：フォーミング４８０）を用いて、シート表面温度を１６０℃〜１７０℃にし、３倍、４倍、５倍の展開倍率を持った直方体の木型によって成形を行った。得られた成形品をカッターによって展開し、成形品のシート厚さをマイクロメーターを用いて測定した。さらに、この厚みを測定した個所の表面抵抗を、ＪＩＳ Ｋ７１９４（導電性プラスチックの４探針法による抵抗率試験方法）により測定した。マイクロメーターで測定した成形品の厚みと成形前のシート厚さの比から展開倍率を求め、この展開倍率と表面抵抗とを表１に示した。なお、この表において、展開倍率０とあるのは、成形前のシートであることを示す。 About the obtained electroconductive sheet, the sheet | seat surface temperature shall be 160 degreeC-170 degreeC using a vacuum forming machine (made by Seiko Industry: Forming 480), and the rectangular parallelepiped which has the expansion magnification of 3 times, 4 times, and 5 times. Molding was performed using a wooden mold. The obtained molded product was developed with a cutter, and the sheet thickness of the molded product was measured using a micrometer. Furthermore, the surface resistance of the part where the thickness was measured was measured by JIS K7194 (resistivity test method by conductive probe 4-probe method). The expansion ratio was determined from the ratio of the thickness of the molded product measured with a micrometer and the sheet thickness before molding, and the expansion ratio and surface resistance are shown in Table 1. In this table, the development magnification of 0 indicates that the sheet is not yet formed.
＜比較例＞
上記実施例と同じ原料樹脂を用意し、共押出成形により、ポリエチレンテレフタレート樹脂の両面に非晶性ポリエステル樹脂が積層された厚み1ｍｍ（厚み構成が表面より、１：８：１）のシートを得た。得られたシートに対し、実施例と同じ操作により、導電性を付与し、さらに真空成形を行い、展開倍率および表面抵抗を測定した。その値を表１に併せて示す。
<Comparative example>
The same raw material resin as in the above example was prepared, and a sheet having a thickness of 1 mm (thickness structure is 1: 8: 1 from the surface) in which an amorphous polyester resin was laminated on both sides of a polyethylene terephthalate resin was obtained by coextrusion molding. It was. Conductivity was imparted to the obtained sheet by the same operation as in the example, vacuum forming was further performed, and a development magnification and a surface resistance were measured. The values are also shown in Table 1.
表１から明らかなように、本発明の導電性ポリエステル系樹脂シートは、熱成形しても導電性の低下が見られない。一方、本発明と同様の樹脂を用いているが、積層構成において異なる比較例においては、熱成形することにより、とくに展開倍率の大きな成形をすると導電性が大きく低下することが解る。 As is clear from Table 1, the conductive polyester resin sheet of the present invention does not show a decrease in conductivity even when thermoformed. On the other hand, although the same resin as that of the present invention is used, it can be understood that, in the comparative examples different in the laminated structure, the electrical conductivity is greatly lowered by thermoforming, particularly when molding with a large expansion ratio is performed.
Claims (4)
非晶性ポリエステル樹脂層の少なくとも片面にポリエチレンテレフタレート樹脂層が積層され、
該ポリエチレンテレフタレート樹脂層の表面に導電層が設けられた、導電性ポリエステル系樹脂シート。 A conductive polyester-based resin sheet used to form an electronic component transport tray obtained by thermoforming a conductive resin sheet,
A polyethylene terephthalate resin layer is laminated on at least one side of the amorphous polyester resin layer ,
A conductive polyester resin sheet in which a conductive layer is provided on the surface of the polyethylene terephthalate resin layer .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004068288A JP4429767B2 (en) | 2004-03-11 | 2004-03-11 | Conductive polyester resin sheet and tray for transporting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004068288A JP4429767B2 (en) | 2004-03-11 | 2004-03-11 | Conductive polyester resin sheet and tray for transporting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005254584A JP2005254584A (en) | 2005-09-22 |
| JP4429767B2 true JP4429767B2 (en) | 2010-03-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2004068288A Expired - Fee Related JP4429767B2 (en) | 2004-03-11 | 2004-03-11 | Conductive polyester resin sheet and tray for transporting electronic components |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07178880A (en) * | 1993-12-24 | 1995-07-18 | Sekisui Chem Co Ltd | Antistatic transparent resin plate |
| JP3401327B2 (en) * | 1994-06-30 | 2003-04-28 | 信越ポリマー株式会社 | Conductive thermoplastic resin sheet |
| JP2000153594A (en) * | 1998-11-20 | 2000-06-06 | Unitika Ltd | Two-layered polyester resin sheet, polyester resin laminate using the same, and production thereof |
| JP4390885B2 (en) * | 1999-01-08 | 2009-12-24 | 帝人株式会社 | Transparent field wave shielding structure and manufacturing method thereof |
| JP4204248B2 (en) * | 2002-04-10 | 2009-01-07 | 電気化学工業株式会社 | Resin composition and sheet |
| JP4273393B2 (en) * | 2003-02-21 | 2009-06-03 | 東洋紡績株式会社 | Conductive polyester sheet and packaging container for electronic parts comprising the same |
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2004
- 2004-03-11 JP JP2004068288A patent/JP4429767B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2005254584A (en) | 2005-09-22 |
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