JP4428338B2 - Powder for grinding, grinding method, and method for producing substrate for flat display panel - Google Patents

Description

The present invention relates to a powder for grinding, a grinding method and a flat display panel substrate manufacturing how.

As a kind of grinding process, there is a method (shot blasting) in which metal powder is sprayed onto a member to be processed and particles in the metal powder collide with the member to be processed.
As the abrasive used in the shot blasting method, powders of non-metallic materials such as sand and ceramic materials, various metal powders and the like are used.
In particular, since the specific gravity of the contained particles is large, the metal powder can impart sufficient collision energy (kinetic energy) to the member to be processed even if the particle size is reduced, and exhibits excellent grindability. Thereby, fine grinding is also possible.

Furthermore, it has also been proposed to use amorphous metal powder as the abrasive. Amorphous metal has almost no crystal grain boundaries because its atomic arrangement is irregular. For this reason, unlike the crystalline metal, deformation due to dislocations and breakage starting from the crystal grain boundary hardly occur, and the hardness and toughness are high.
As such an amorphous metal abrasive, for example, an Fe-Ni-B-Si-Mo-based one has been proposed (for example, see Patent Document 1).

By the way, a glass material (nonmagnetic material) may be ground using such an amorphous metal abrasive.
The grinding material after grinding is in a mixed state together with grinding scraps, and from this, the grinding material is selectively collected and reused as the grinding material.
For the recovery, magnetic separation is used, that is, a method of selecting and recovering only the amorphous metal abrasive by the magnetic force.

However, since the amorphous metal having the composition of Patent Document 1 has a high coercive force, it is magnetized when attracted by the magnetic force, and high residual magnetization is generated even if the external magnetic field is removed.
For this reason, in the metal powder in which remanent magnetization has occurred, the powder aggregates and shifts in a direction in which the particle size distribution increases. As a result, the size of the particles that collide with the member to be processed is increased, resulting in a decrease in processing accuracy and a problem that metal powder stays in the injection nozzle.
Moreover, since the amorphous metal of the composition of patent document 1 has the low maximum magnetic flux density, there also exists a problem that recovery efficiency is low.

Japanese Patent Laid-Open No. 2002-4015

An object of the present invention is to provide a grinding powder that can be efficiently ground and hardly causes residual magnetization, a state in which a workpiece is efficiently ground using the grinding powder, and the grinding powder can be reused. in grinding method can be recovered, and to provide manufacturing how efficiently formable flat display panel substrate with the partition walls by using the powder for grinding.

The above object is achieved by the present invention described below.
The grinding powder of the present invention is composed of an amorphous metal and is a grinding powder for grinding the surface by colliding with the surface of the member to be treated.
The amorphous metal has Fe, Si, B, Cr and C as essential elements ,
Si content is 4-9 wt%,
The content of B is 2 to 5 wt%,
Cr content is 1 to 3 wt%,
C content is 0.01 to 1 wt% ,
The balance is an impurity other than Fe and the essential elements .
As a result, it is possible to obtain a grinding powder that can be ground efficiently and hardly causes residual magnetization.

In the grinding powder of the present invention, the average particle size is preferably 3 to 30 μm.
When such a fine powder is used as a grinding powder, local grinding can be performed. As a result, for example, a desired fine pattern on the surface of the member to be processed can be ground with high dimensional accuracy, or the surface of the member to be processed can be smoothed more smoothly.
In the grinding powder of the present invention, the ratio of the powder having a particle size of 50 μm or more measured with a laser particle size distribution meter is preferably 10 wt% or less.
As a result, it is possible to prevent a reduction in the dimensional accuracy of grinding due to the inclusion of particles having a significantly large particle size in the grinding powder.

In the grinding powder of the present invention, it is preferable that the amorphous metal does not substantially contain Ni and Co.
Thereby, since the maximum magnetic flux density is larger and the coercive force is smaller, the grinding powder of the present invention can be easily attracted when sorting by magnetic force. As a result, the grinding powder can be reliably separated and collected.

The grinding powder of the present invention is preferably obtained by pulverization by an atomizing method.
As a result, it is possible to efficiently produce a spherical powder of amorphous metal having a very small crystal structure and crystal grain boundary.
In the grinding powder of the present invention, the atomizing method is preferably a water atomizing method.
Thereby, the spherical powder of an amorphous metal with especially few crystal grain boundaries can be manufactured efficiently.

In the grinding powder of the present invention, the amorphous metal preferably has a maximum magnetic flux density of 20 [emu / g] or more and a coercive force of 5 [Oe] or less.
Thereby, the agglomerated material that is easily separated and collected by a general magnetic field generating means is hardly agglomerated.
In the grinding powder of the present invention, the impurity content is preferably 2 wt% or less.
In the grinding powder of the present invention, it is preferable that it is selectively recovered by magnetic force and used for at least one reuse.
Since the grinding powder of the present invention can exhibit grindability equivalent to that at the first use even when reused, the cost for grinding can be reduced by reuse.

The grinding method of the present invention is characterized in that the surface is ground by causing the grinding powder of the present invention to collide with the surface of the member to be treated.
Thereby, a to-be-processed member can be ground efficiently.
The grinding method of the present invention comprises a step of grinding the surface of the member to be processed that exhibits non-magnetism by causing the grinding powder of the present invention to collide,
A step of selectively collecting the grinding powder by attracting it by magnetic force from a mixture of grinding waste of the member to be treated generated by the grinding and the grinding powder after the collision. To do.
Thereby, a to-be-processed member can be efficiently ground and the powder for grinding can be collect | recovered in the state which can be reused.

The method for manufacturing a flat display panel substrate of the present invention is a method for manufacturing a flat display panel substrate having partition walls that define a pixel space,
Forming a mask having an opening on a glass-containing layer containing a glass material;
Grinding the glass-containing layer exposed from the opening of the mask by colliding the grinding powder of the present invention;
And firing the ground glass-containing layer to obtain the partition wall.
Thereby, the flat display panel board | substrate which has a partition with a high dimensional accuracy can be manufactured efficiently.

Hereinafter, a grinding powder, a grinding method, a flat display panel substrate manufacturing method, a flat display panel substrate, a flat display panel, and an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.
[Grinding powder]
First, the grinding powder of the present invention will be described.

The grinding powder of the present invention is made of an amorphous metal, and grinds the surface by colliding with the surface of the member to be treated.
Amorphous metal has an irregular atomic arrangement and therefore contains almost no crystal structure and no grain boundaries. For this reason, unlike the crystalline metal, deformation due to dislocations and breakage starting from the crystal grain boundary hardly occur, and the hardness and toughness are high.

Moreover, since the grinding powder of the present invention is composed of a metal material, it has a relatively high specific gravity although it varies depending on the composition of the metal material. For this reason, even if the particle size in the powder for grinding is reduced, each particle can impart sufficient collision energy (kinetic energy) to the member to be processed, and exhibits excellent grindability. This also has the advantage that a fine pattern can be ground with high dimensional accuracy.
Such an amorphous metal contains Fe as a main component and contains Si, B, Cr, and C. The Si content is 4-9 wt%, the B content is 2-5 wt%, the Cr content is 1-3 wt%, and the C content is 0.01-1 wt%.

Fe is a component that constitutes the main component of the grinding powder and has a great influence on the basic mechanical properties (strength, toughness, hardness, etc.) and magnetism of the grinding powder. In addition, in this invention, a main component means the thing with the highest content rate among each component which comprises the powder for grinding.
Si is a component that can promote the amorphization of the metal constituting the grinding powder. As described above, the Si content is 4 to 9 wt%, but is preferably 4.5 to 8.5 wt%. Thereby, the amorphization of the metal further proceeds, and the included crystal structure and crystal grain boundary can be reduced.

B, like Si, is a component that can promote metal amorphization. As described above, the B content is set to 2 to 5 wt%, but is preferably 2.5 to 4 wt%. Thereby, the amorphization of the metal further proceeds, and the included crystal structure and crystal grain boundary can be reduced.
Cr is a component that can improve the corrosion resistance of the powder for grinding, and is a component that can promote amorphization like B and Si. As described above, the Cr content is 1 to 3 wt%, but is preferably 1.5 to 2.5 wt%. Thereby, the hardness, abrasion resistance and corrosion resistance of the powder for grinding become higher, and even when subjected to grinding, destruction, wear, alteration, oxidation, deterioration, etc. of the grinding powder can be reliably prevented.
C is a component that can promote amorphization in the same manner as B, Si, and Cr. As described above, the C content is set to 0.01 to 1 wt%, but is preferably 0.3 to 1 wt%. Thereby, the enlargement of the crystal grains can be surely suppressed, and a metal that is more amorphized can be obtained.

Moreover, it is preferable that an amorphous metal does not contain both Ni and Co substantially. Ni and Co belong to a ferromagnetic material like Fe, but are more expensive than Fe. Therefore, Ni and Co do not contain Ni and Co, thereby reducing the cost of the powder for grinding.
The amorphous metal constituting the grinding powder of the present invention exhibits soft magnetism. Such a grinding powder is easily magnetized even by a small external magnetic field. As a result, the magnetic flux density of the grinding powder is increased, and the grinding powder is easily selected and collected by magnetic force. Further, in the collected grinding powder, when the external magnetic field is removed, the residual magnetization becomes extremely low, so that aggregation of particles can be reliably prevented.

  For this reason, the grinding powder of the present invention is preferably used at least once after being recovered by magnetic force. Since the grinding powder of the present invention can exhibit grindability equivalent to that at the first use even when reused, the cost for grinding can be reduced by reuse.

Furthermore, since an amorphous metal containing Fe as a main component and substantially free of Ni and Co has a higher maximum magnetic flux density and a smaller coercive force than those containing them, it is suitable for grinding according to the present invention. The powder can be easily attracted during magnetic sorting. As a result, the grinding powder can be reliably separated and collected.
In this case, it is preferable that the maximum magnetic flux density of the amorphous metal is 20 [emu / g] or more and the coercive force is 5 [Oe] or less, the maximum magnetic flux density is 30 [emu / g] or more, and the coercive force. Is more preferably 3 [Oe] or less. Grinding powder composed of amorphous metal whose maximum magnetic flux density and coercive force are within the above ranges are easily separated and collected by a general magnetic field generating means, and the collected abrasive material is hardly agglomerated. Become.

The amorphous metal may contain other elements as impurities. In that case, the total content of elements other than the essential constituent elements is preferably 2 wt% or less.
Grinding powder composed of amorphous metal as described above has particularly few crystal structures and grain boundaries, and can reliably prevent destruction, wear, alteration, oxidation, deterioration, etc. even when the size is reduced. It is. As a result, the grinding powder after grinding can be collected and reused, and the cost for grinding can be reduced.

Further, the grinding powder of the present invention may be produced by any method, for example, it can be produced by using an atomizing method, a cooling roll method, an ingot crushing method, etc., among these, the atomizing method What was obtained by pulverizing by is preferable.
The atomizing method injects a cooling medium (liquid, gas, etc.) as a high-pressure jet, and pulverizes the metal raw material by causing the metal raw material (molten metal) that has been heated to be in a liquid state to collide with the jet. Is the method. The molten metal becomes fine droplets by colliding with the jet, and rapidly cools and solidifies when the droplets come into contact with the cooling medium. At this time, since the droplet is cooled very rapidly, each atom is fixed while maintaining the disordered atomic arrangement in the liquid state. Furthermore, since the droplets are spheroidized by the surface tension, the shape is maintained by solidifying.

As a result, the droplet becomes an amorphous metal powder having a substantially spherical shape.
As described above, according to the atomizing method, it is possible to efficiently produce a spherical powder of amorphous metal having a very small crystal structure and crystal grain boundary.
Furthermore, examples of the atomizing method include a water atomizing method, a gas atomizing method, a vacuum dissolution gas atomizing method, a gas-water atomizing method, and an ultrasonic atomizing method. Among these, the water atomizing method is preferable.

  In the water atomization method, water having a relatively large density and heat capacity is used as a cooling medium. For this reason, when the molten metal collides with a high-pressure water jet, it receives large energy and scatters to form finer droplets. Furthermore, it is possible to cool the droplets particularly rapidly by bringing them into contact with water having a large heat capacity. As a result, it is possible to efficiently produce a spherical powder of amorphous metal with particularly few crystal grain boundaries.

In addition to the above-described method of colliding with a high-pressure water jet, amorphous metal powder may be obtained by spraying the molten metal into a water stream flowing at high speed in the container.
In addition, after the amorphous metal powder is manufactured, the powder may be classified as necessary.
As a classification method, for example, a dry classification method, a wet classification method, a sieving classification method, or the like can be used.

The average particle size of the powder for grinding of the present invention is preferably about 3 to 30 μm, more preferably about 5 to 15 μm. When such a fine powder is used as a grinding powder, local grinding can be performed. As a result, for example, a desired fine pattern on the surface of the member to be processed can be ground with high dimensional accuracy, or the surface of the member to be processed can be smoothed more smoothly.
Further, the ratio of the powder having a particle size of 50 μm or more measured by a laser particle size distribution meter is preferably 10 wt% or less, and more preferably 5 wt% or less. As a result, it is possible to prevent a reduction in the dimensional accuracy of grinding due to the inclusion of particles having a significantly large particle size in the grinding powder.

[Flat display panel substrate]
Next, the flat display panel substrate of the present invention will be described.
Examples of the flat display panel substrate include a plasma display panel (PDP) substrate, a field emission display panel (FED) substrate, and a surface conduction electron emitter display panel (SED) substrate. As an example, a plasma display panel substrate will be described.

FIG. 1 is a perspective view schematically showing an embodiment of a plasma display panel substrate to which the flat display panel substrate of the present invention is applied.
A plasma display panel substrate (flat display panel substrate of the present invention) 1 shown in FIG. 1 includes a substrate 2 and partition walls 4 provided on the substrate 2 and defining a pixel space 3.

As the substrate 2, one having no deflection or scratch is preferably used.
In addition, as a constituent material of the substrate 2, glass materials such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass, ceramics such as alumina, zirconia, titania, silicon nitride, silicon carbide Examples include substrates.
In addition, the substrate 2 may be formed of a multilayered structure, and a conductive layer (electrode, wiring), an insulating layer, a dielectric layer, a protective layer, or the like is provided on or inside the substrate 2. It may be.

On the substrate 2, a partition wall 4 that defines a rectangular pixel space 3 that is rectangular in plan view is provided.
The partition wall 4 is composed mainly of a glass material having a relatively low melting point such as lead or zinc.
The pixel space 3 defined by the partition walls 4 is a space in which a gas that generates plasma discharge is enclosed.
In the present embodiment, the pixel space 3 has a band shape, but the pixel space may have a square shape or a rectangular shape with vertical and horizontal sides close to each other. Such a pixel space can be defined by newly providing a partition in a direction orthogonal to the partition 4 shown in FIG.

[Manufacture of substrates for flat display panels]
Next, a method of manufacturing the plasma display panel substrate 1 (a grinding method of the present invention and a method of manufacturing a flat display panel substrate of the present invention) will be described.
2 and 3 are views (longitudinal sectional views) for explaining the method for manufacturing the plasma display panel substrate shown in FIG. 1 (the method for manufacturing the flat display panel substrate of the present invention). In the following description, the upper side in FIGS. 2 and 3 will be described as “upper” and the lower side as “lower”.

Hereinafter, each process is demonstrated one by one.
[1] First, the substrate 2 is prepared.
[2] Next, a glass paste is applied on the substrate 2. Thereby, as shown to Fig.2 (a), the glass containing layer 41 is formed.
The glass paste is a mixture of glass powder, a resin binder, a solvent, and additives that are the main materials of the partition 4.

As the resin binder, a resin binder that is burned at a low temperature and a residue such as a carbide hardly remains in the barrier 4 is preferably used. Specific examples include vinyl ether, methacrylate, urea resin, phenol resin, epoxy resin, unsaturated polyester resin, and the like, and one or more of these can be used in combination.
The content of the resin binder is preferably about 10 to 20 parts by weight with respect to 100 parts by weight of the glass powder.

  Examples of the solvent include ketones such as acetone, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, and diisobutyl ketone, hydrocarbons such as hexane, cyclohexane, benzene, toluene, and xylene, methyl acetate, ethyl acetate, isopropyl acetate, and normal propyl. Esters such as acetate, isobutyl acetate, normal butyl acetate, normal pentyl acetate, isopentyl acetate, alcohols such as methanol, ethanol, isopropylanol, normal propanol, normal butanol, isobutanol, toluol, xylol, methylene chloride, chloroform, 1 , 2-dichloroethane, chlorinated hydrocarbons such as 1,1,1-trichloroethane, ethyl ether, 1,4 Ethers such as dioxane and the like, can be used singly or in combination of two or more of them.

Moreover, you may add a plasticizer, a dispersing agent, an antifoamer, antioxidant, a ultraviolet absorber, a filler etc. as an additive.
Glass paste application methods include dipping method, dripping, doctor blade method, spin coating method, brush coating, spray coating method, various coating methods such as roll coating method, metal mask printing method, screen printing method, etc. The printing method etc. are mentioned.

In addition, the glass containing layer 41 may be formed by sticking the sheet-like glass containing layer 41 formed in another board | substrate on the board | substrate 2 other than the above methods, and the glass containing layer 41 previously. It may be provided by preparing the substrate 2 on which is formed.
Moreover, you may make it obtain the glass containing layer 41, after making it dry forcibly to the glass paste after application | coating as needed.

[3] Next, as shown in FIG. 2B, a resist mask 42 having an opening 43 in a region corresponding to the pixel space 3 is formed on the glass-containing layer 41.
Examples of the pattern forming method for the resist mask 42 include a printing method and a photolithography method.
Then, a resist mask 42 is formed in a region corresponding to the strip-shaped partition wall 4 in plan view, and an opening 43 is formed in a region corresponding to the strip-shaped pixel space 3 in plan view. The portion of the glass-containing layer 41 exposed in the opening 43 is removed in a process [4] described later, thereby forming a pixel space 3.

[4] Next, as shown in FIG. 2 (c), a grinding material (grinding powder of the present invention) 100 is sprayed from above the glass-containing layer 41 exposed from the opening 43, and grinding (shot blasting) is performed. I do.
Specifically, the nozzle 110 is disposed at a position spaced apart from the glass-containing layer 41 by a predetermined distance, and the abrasive 100 is ejected from the nozzle 110 while relatively moving (translating) the nozzle 110 and the substrate 2. To do. Thereby, the abrasive 100 is made to collide with an unnecessary glass-containing layer 41 in a region corresponding to the opening 43, and the glass-containing layer 41 is ground and removed, so that the pixel space 3 can be formed.

The grinding powder of the present invention has a relatively high specific gravity and can impart high collision energy to the glass-containing layer 41. Thereby, the outstanding grindability is obtained and the glass containing layer 41 can be ground efficiently.
By the way, the width in the pixel space 3 determined in the above-described step [3] is an element that greatly affects the display definition of the plasma display panel including the plasma display panel substrate 1.

In recent years, there has been an increasing demand for higher-definition display, and in order to reduce the pixel size in the plasma display panel, it is required to make the width of the pixel space 3 narrower.
From this point of view, the width of the pixel space 3, that is, the width of the opening 43 here is preferably about 30 to 150 μm, and more preferably about 30 to 100 μm. Further, shot blasting using the grinding powder of the present invention can be more suitably applied to grinding such a fine pattern. That is, the grinding powder of the present invention can reliably prevent the destruction, wear, alteration, deterioration, etc. of the particles in the powder even if the average particle size is reduced. Grinding can be easily realized.

Even when the width of the opening 43 is small as described above, if the particle size of the abrasive 100 is within the above-described range, the abrasive 100 is sandwiched in the pixel space 3 and hinders subsequent grinding. Can be reliably prevented.
The injection pressure of the abrasive 100 in grinding (shot blasting) is preferably about 1 to 10 kgf / cm ² , for example, and more preferably about ² to 5 kgf / cm ² . Thereby, grinding can be performed efficiently with high processing accuracy.

  Further, the distance between the nozzle 110 and the upper surface of the glass-containing layer 41 in grinding (shot blasting) varies depending on the spray pressure of the abrasive 100, but is preferably about 1 to 20 cm, for example, about 5 to 10 cm. More preferably. As a result, it is possible to perform grinding efficiently while preventing the sprayed abrasive 100 from colliding with the member to be processed and preventing the processing accuracy from being excessively widened.

Moreover, if the average particle diameter of the abrasive 100, the injection pressure, and the distance between the nozzle 110 and the glass-containing layer 41 are within the above ranges, the resist mask 42, the partition wall 4 and the substrate 2 can be more reliably prevented from being damaged. can do.
When the pixel space 3 is formed in this way, as shown in FIG. 3D, a mixture 120 of the grinding scraps 44 of the glass-containing layer 41 that has been ground and removed and the sprayed abrasive 100. Will occur.

[5] Next, as shown in FIG. 3 (e), the magnetic field generating means 7 is brought close to the mixture 120. Thereby, an external magnetic field is generated around the mixture 120.
When the magnetic field generating means 7 approaches the inclusion 120, the abrasive 100 is attracted to the magnetic field generation means 7 from the inclusion 120 according to the external magnetic field, and the abrasive 100 is selectively separated and recovered (magnetic separation). can do. Thereby, the collected abrasive 100 can be reused again in the step [4]. As a result, the cost can be reduced as compared with the case where a new abrasive 100 is prepared.
Further, since the abrasive 100 exhibits soft magnetism, residual magnetization hardly occurs when the external magnetic field is removed after recovery. Therefore, aggregation due to residual magnetization between the abrasives 100 can be prevented. Thereby, when the recovered abrasive 100 is reused, it is possible to reliably prevent the particle size distribution of the abrasive 100 from being varied and the dimensional accuracy from being lowered.

The magnetic field generating means 7 is not particularly limited as long as it can generate a magnetic field, but a permanent magnet, an electromagnet, or the like can be used.
Moreover, the collection method of the abrasive 100 is not limited to the above method. For example, the abrasive 100 may be separated and collected after the mixture 120 is collected.
In addition, the grinding | polishing waste 44 after collect | recovering the abrasives 100 can also be reused as a raw material of the glass containing layer 41 by collect | recovering separately.

[6] Next, the resist mask 42 is removed. Thereby, the partition 4 as shown in FIG.3 (f) is obtained.
As described above, the plasma display panel substrate 1 having the substrate 2 and the partition walls 4 can be efficiently manufactured.
In addition, the grinding method of this invention has the said process [4] and the said process [5]. According to such a grinding method, grinding can be performed efficiently with high dimensional accuracy, and further, the ground abrasive 100 and the grinding waste 44 can be individually recovered and reused. Thereby, the cost of the abrasive 100, ie, the cost of grinding, can be reduced.

[Flat display panel]
A plasma display panel (flat display panel of the present invention) can be obtained by using the plasma display panel substrate (flat display panel substrate of the present invention) 1 as described above.
Below, the case where the board | substrate for flat display panels of this invention is integrated in a plasma display panel is demonstrated as an example.

FIG. 4 is an exploded perspective view showing an embodiment when the flat display panel substrate of the present invention is applied to a plasma display panel.
A plasma display panel (flat display panel of the present invention) 500 shown in FIG. 4 is generally configured by a glass substrate 501 and a glass substrate 502 that are arranged to face each other, and a discharge display portion 510 formed therebetween. ing.

The discharge display unit 510 is a collection of a plurality of discharge chambers (pixel spaces) 516, and among the plurality of discharge chambers 516, a red discharge chamber 516 (R), a green discharge chamber 516 (G), and a blue discharge chamber 516 ( The three discharge chambers 516 of B) are arranged in pairs so as to constitute one pixel.
Address electrodes 511 are formed in stripes at predetermined intervals on the upper surface of the glass substrate 501, and a dielectric layer 519 is formed so as to cover these address electrodes 511 and the upper surface of the substrate 501.

Further, a partition wall 515 is formed on the dielectric layer 519 so as to be positioned between the address electrodes 511 and 511 and along each address electrode 511.
The partition 515 is also partitioned at a predetermined interval in a direction perpendicular to the address electrode 511 at a predetermined position in the longitudinal direction (not shown).
As a result, basically, rectangular regions partitioned by partition walls adjacent to both the left and right sides of the address electrode 511 in the width direction and partition walls extending in a direction perpendicular to the address electrodes 511 are formed. A discharge chamber 516 is formed so as to correspond to this region. One pixel is formed by three pairs of these rectangular regions.

The above-described plasma display panel substrate (the flat display panel substrate of the present invention) 1 is incorporated in the substrate 501 including the address electrodes 511 and the dielectric layer 519 and the partition wall 515.
A phosphor layer 517 is provided inside a rectangular region (pixel space) partitioned by the partition 515. The phosphor layer 517 emits red, green, or blue fluorescence, and the red phosphor layer 517 (R) is disposed at the bottom of the red discharge chamber 516 (R). A green phosphor layer 517 (G) is provided at the bottom of G), and a blue phosphor layer 517 (B) is provided at the bottom of the blue discharge chamber 516 (B).

On the other hand, on the glass substrate 502 side, a plurality of transparent display electrodes 512 are formed in stripes at predetermined intervals in a direction orthogonal to the previous address electrodes 511. The transparent display electrode 512 is made of a transparent conductive material such as ITO, FTO, or ATO.
Further, a metal bus electrode 512 a is formed in contact with the transparent display electrode 512. The bus electrode 512a has a function of reducing the resistance value of the transparent display electrode 512.

Further, a dielectric layer 513 is formed so as to cover the transparent display electrode 512 and the bus electrode 512a, and a protective film 514 made of MgO or the like is further formed.
The glass substrate 501 and the glass substrate 502 are bonded to each other so that the address electrodes 511 and the transparent display electrodes 512 are opposed to each other so as to be orthogonal to each other, and a space portion surrounded by the phosphor layer 517 and the protective film 514 is formed. A discharge chamber 516 is formed by exhausting and sealing a rare gas.

Note that two transparent display electrodes 512 formed on the glass substrate 502 side are formed so as to be arranged two by two for each discharge chamber 516.
The address electrode 511 and the transparent display electrode 512 are connected to an AC power source (not shown), and when each electrode is energized, the phosphor layer 517 is excited to emit light in the discharge display unit 510 at a desired position, and color display is performed. It can be done.

[Electronics]
The flat display panel of the present invention can be applied to various electronic devices.
<< personal computer >>
FIG. 5 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.

In this figure, a personal computer 1100 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106. The display unit 1106 is supported by the main body portion 1104 so as to be rotatable via a hinge structure portion. Yes.
In the personal computer 1100, the display unit 1106 includes the above-described flat display panel.

FIG. 6 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the present invention is applied.
In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the above-described flat display panel in a display unit.

FIG. 7 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

On the back of the case (body) 1302 of the digital still camera 1300, the above-described flat display panel is provided in the display unit, and the display is performed based on the imaging signal from the CCD, and the subject is displayed as an electronic image. Functions as a finder.
A circuit board 1308 is installed inside the case. The circuit board 1308 is provided with a memory that can store (store) an imaging signal.

A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side of the case 1302 (on the back side in the illustrated configuration).
When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory of the circuit board 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the data communication input / output terminal 1314 as necessary. Further, the imaging signal stored in the memory of the circuit board 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  In addition to the personal computer (mobile personal computer) of FIG. 5, the mobile phone of FIG. 6, and the digital still camera of FIG. 7, the electronic apparatus of the present invention includes, for example, a television, a video camera, a viewfinder type, Monitor direct-view video tape recorder, laptop personal computer, car navigation system, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, videophone, security TV Monitors, electronic binoculars, POS terminals, devices with touch panels (for example, cash dispensers of financial institutions, automatic ticket vending machines), medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiographs, ultrasound diagnostic devices, internal Endoscope display device), fish finder, various measuring instruments, Vessels such (e.g., gages for vehicles, aircraft, and ships), a flight simulator, various monitors, and a projection display such as a projector.

As described above, the grinding powder, the grinding method, the flat display panel substrate manufacturing method, the flat display panel substrate, the flat display panel, and the electronic device according to the present invention have been described based on the preferred embodiments. It is not limited to.
For example, in the above embodiment, the case where the grinding method of the present invention is applied to a part of the method for manufacturing a substrate for a plasma display panel has been described as a representative. However, the present invention is not limited to such a case.

That is, the grinding method of the present invention can be applied to any case where grinding is performed on the surface of a non-magnetic member to be processed.
In the above embodiment, the case where a predetermined pattern is ground has been described. However, when the surface of a member to be treated is shot blasted to smooth the surface, the grinding powder and the grinding according to the present invention are also used. The method can be used.
Further, in the grinding method and the flat display panel substrate manufacturing method of the present invention, one or two or more arbitrary steps may be added.

1. Production of abrasive and plasma display panel substrate (Example 1)
<1> First, raw materials were weighed so that each of the following elements was contained at the following contents, and the raw materials were melted in a high-frequency induction furnace to obtain a melt.
<Constituent element content>
・ Si: 7.5wt%
-B: 3.8 wt%
・ Cr: 2.3 wt%
・ C: 0.5wt%
・ Fe: balance

<2> Next, the obtained melt was pulverized by a water atomization method, and the obtained metal powder was classified using a sieve mesh having a mesh size of 32 μm. Thereby, an abrasive was obtained.
About the obtained abrasive material, the particle size was measured with the laser type particle size distribution analyzer. As a result, the ratio of the powder having an average particle diameter of 11 μm and a particle diameter of 50 μm or more was 3 wt%.
The obtained abrasive was subjected to crystal structure analysis by X-ray diffraction. As a result, no sharp peak was observed in the obtained X-ray diffraction spectrum. From this, it was confirmed that the abrasive was composed of an amorphous metal.

<3> Next, a substrate on which an electrode and a dielectric layer were formed on a glass substrate having an average thickness of 3 mm was prepared.
<4> Next, a glass paste was applied on the substrate by a roll coating method. Then, this substrate was placed on a hot plate and dried at 120 ° C. for 30 minutes. This obtained the glass containing layer on the board | substrate.

<5> Next, after laminating a dry film resist on the glass-containing layer, a resist mask (mask) having a band-shaped opening having a width of 50 μm in a region corresponding to the pixel space by photolithography and etching. Formed.
<6> Next, the abrasive obtained in the step <2> was sprayed from above the resist mask to perform shot blasting. As a result, the glass-containing layer in the region corresponding to the opening can be removed, and a pixel space is formed in the region.

<7> Next, an electromagnet was brought close to the grinding waste generated in the step <6> and the sprayed abrasive. Thereby, the abrasive was attracted to the electromagnet, and the abrasive was recovered. Further, grinding scraps after collecting the abrasive were also collected separately.
<8> Next, the resist mask was removed. Thereby, a substrate for a plasma display panel was obtained.

(Examples 2 to 6)
Except that the constituent elements contained in the melt, the content of each constituent element, and the size of the sieve mesh opening are as shown in Table 1, respectively, a grinding material was obtained in the same manner as in Example 1, A substrate for a plasma display panel was obtained using this abrasive.

(Comparative Example 1)
First, an abrasive was manufactured in the same manner as in Example 1.
Next, the obtained abrasive was placed in a furnace and heat-treated at 1046 ° C. (773 K).
Next, the ground material after the heat treatment was subjected to crystal structure analysis by X-ray diffraction in the same manner as in Example 1. As a result, sharp peaks were observed in the obtained X-ray diffraction spectrum. From this, it was confirmed that the abrasive contained crystal metal because it was crystallized by heat treatment.

(Comparative Examples 2-3)
Except that the constituent elements contained in the melt, the content of each constituent element, and the size of the sieve mesh opening are as shown in Table 1, respectively, a grinding material was obtained in the same manner as in Example 1, A substrate for a plasma display panel was obtained using this abrasive.
(Comparative Example 4)
Except that the heat-resistant ferritic stainless steel having the composition shown in Table 1 was melted to obtain a melt, a grinding material was obtained in the same manner as in Example 1, and a substrate for a plasma display panel was prepared using this grinding material. Obtained.
As a result of crystal structure analysis, it was confirmed that the obtained abrasive contained crystal metal.

(Comparative Example 5)
Except that the austenitic stainless steel having the composition shown in Table 1 was melted to obtain a melt, an abrasive was obtained in the same manner as in Example 1, and a plasma display panel substrate was obtained using this abrasive. .
As a result of crystal structure analysis, it was confirmed that the obtained abrasive contained crystal metal.

(Comparative Example 6)
Except that the ferritic stainless steel having the composition shown in Table 1 was melted to obtain a melt, a grinding material was obtained in the same manner as in Example 1, and a plasma display panel substrate was obtained using this grinding material. .
As a result of crystal structure analysis, it was confirmed that the obtained abrasive contained crystal metal.

(Comparative Example 7)
A grinding material was obtained in the same manner as in Example 1 except that a hard magnetic permanent magnet having the composition shown in Table 1 was melted to obtain a melt, and a plasma display panel substrate was obtained using this grinding material. It was.
As a result of crystal structure analysis, it was confirmed that the obtained abrasive contained crystal metal.

As described above, the constituent elements of the abrasives obtained in each Example and each Comparative Example and their content, crystal structure, sieve mesh size, average particle diameter, and ratio of powder having a particle diameter of 50 μm or more are shown in Table 1. Shown in
In addition, about the abrasives obtained in Example 1, Comparative Example 2, and Comparative Example 3, the maximum magnetic flux density and the coercive force were measured, respectively. This measurement result is also shown in Table 1.

2. Evaluation 2-1 Evaluation of availability of grinding material and presence / absence of aggregation First, in the step <7> of each example and each comparative example, whether or not the grinding material after injection is allowed to be collected and whether or not the grinding material is aggregated Was evaluated visually according to the following criteria.
A: Grinding material can be recovered satisfactorily and no agglomeration is observed. O: Abrasive material was recovered satisfactorily, but agglomeration is slightly observed. Δ: Abrasive material can be recovered satisfactorily. However, many agglomerations were observed. ×: Almost no abrasive was recovered.

2-2 Evaluation of Appearance of Grinding Material Next, in step <7> of each example and each comparative example, the appearance of the abrasive after injection was visually evaluated according to the following criteria.
◎: Defect or deformation of the abrasive is not recognized ○: Defect or deformation of the abrasive is slightly observed △: Many defects or deformation of the abrasive are observed ×: Defect or deformation of the abrasive is almost Allowed for all

2-3 Composition Evaluation of Collected Grinding Scrap Next, composition analysis was performed on the grinding scrap collected in the step <7> of each Example and each Comparative Example using a fluorescent X-ray analyzer.
And the content rate of the abrasive component in the grinding | polishing waste collect | recovered in each Example and each comparative example was calculated | required.
2-4 Appearance Evaluation of Plasma Display Panel Substrate Next, the appearance of the plasma display panel substrate manufactured in each Example and each Comparative Example was visually evaluated.
The appearance was evaluated according to the following items and evaluation criteria.

2-4-1 Workability ◎: Processing speed is very fast ○: Processing speed is slightly fast △: Processing speed is slightly slow ×: Processing speed is very slow

2-4-2 Abrasive material is sandwiched in the pixel space A: No abrasive is sandwiched in the pixel space ○: Abrasive material is slightly sandwiched in the pixel space Δ: Many abrasives are sandwiched in the pixel space × : Many abrasives are sandwiched in the pixel space, and there are parts that are not ground

2-4-3 Damage to partition wall or mask ◎: No damage to partition wall or mask is observed ○: Some damage is observed on mask △: Many damages are observed on mask ×: Some damage is observed on partition wall

2-4-4 Damage to the substrate ◎: No damage is observed on the substrate ○: Unevenness is generated on the substrate △: Some damage is observed on the substrate ×: Many damages are recognized on the substrate As described above, 2-1 Table 2 shows the evaluation results of 2-4.

As shown in the evaluation results in Table 2, each of the abrasives in each example was able to recover (separate magnetically) the abrasives satisfactorily.
On the other hand, some of the abrasives of each comparative example could not collect the abrasive or could collect many particles even though they could be recovered.
In addition, all of the abrasives in each example were found to have no or some damage or deformation of the abrasive after injection.

On the other hand, in the abrasives of Comparative Example 1 and Comparative Examples 4 to 7, a number of abrasives that were missing or deformed after spraying were observed.
In addition, the grinding waste generated when the glass-containing layer was ground in each example contained almost no abrasive component, whereas each comparative example contained several percent. There was a thing. This suggests that in each example, the separation and recovery of the abrasive and the grinding waste are reliably performed.
Further, in each of the plasma display panel substrates of each example, the grinding with the abrasive was satisfactorily performed and an excellent appearance was exhibited.
On the other hand, the plasma display panel substrate of each comparative example was remarkably inferior in some evaluation items of grinding and appearance.

It is a perspective view showing typically an embodiment of a substrate for plasma display panels to which a substrate for flat display panels of the present invention is applied. It is a figure (longitudinal sectional view) for demonstrating the manufacturing method (the manufacturing method of the flat display panel substrate of this invention) of the substrate for plasma display panels shown in FIG. It is a figure (longitudinal sectional view) for demonstrating the manufacturing method (the manufacturing method of the flat display panel substrate of this invention) of the substrate for plasma display panels shown in FIG. It is a disassembled perspective view which shows embodiment at the time of applying the board | substrate for flat display panels of this invention to a plasma display panel. 1 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Plasma display panel substrate 2 ... Substrate 3 ... Pixel space 4 ... Partition wall 41 ... Glass-containing layer 42 ... Resist mask 43 ... Opening 44 ... Grinding waste 7 ... Magnetic field generating means 100 ... ... Grinding material 110 ... Nozzle 120 ... Mixture 500 ... Plasma display panel 501, 502 ... Glass substrate 510 ... Discharge display section 511 ... Address electrode 512 ... Transparent display electrode 512a ... Bus electrode 513 ... Dielectric layer 514... Protective film 515... Partition 516... Discharge chamber 517... Phosphor layer 519... Dielectric layer 1100 ... Personal computer 1102 ... Keyboard 1104. ... mobile phone 1202 ... operation buttons 1204 ... earpiece 1206 ... mouthpiece 1300 ... Digital still camera 1302 …… Case (body) 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Circuit board 1312 …… Video signal output terminal 1314 …… Data communication input / output terminal 1430 …… TV monitor 1440 …… Personal computer

Claims (12)

It is composed of amorphous metal, and is a grinding powder for grinding the surface by colliding with the surface of the member to be treated,
The amorphous metal has Fe, Si, B, Cr and C as essential elements ,
Si content is 4-9 wt%,
The content of B is 2 to 5 wt%,
Cr content is 1 to 3 wt%,
C content is 0.01 to 1 wt% ,
A grinding powder, wherein the balance is impurities other than Fe and the essential elements .   The grinding powder according to claim 1, wherein the average particle size is 3 to 30 µm.   The powder for grinding according to claim 1 or 2, wherein a ratio of powder having a particle size of 50 µm or more measured by a laser particle size distribution meter is 10 wt% or less.   The grinding powder according to any one of claims 1 to 3, wherein the amorphous metal does not substantially contain Ni and Co.   The grinding powder according to any one of claims 1 to 4, which is obtained by pulverization by an atomizing method.   The grinding powder according to claim 5, wherein the atomizing method is a water atomizing method.   The grinding powder according to claim 1, wherein the amorphous metal has a maximum magnetic flux density of 20 [emu / g] or more and a coercive force of 5 [Oe] or less.   The powder for grinding according to any one of claims 1 to 7, wherein the impurity content is 2 wt% or less. The grinding powder according to any one of claims 1 to 8 , which is selectively recovered by magnetic force and used for at least one reuse. Grinding method characterized by the surface of the member to be processed, for grinding the surface by colliding the powder for grinding according to any one of claims 1 to 9. A step of grinding the surface by causing the grinding powder according to any one of claims 1 to 9 to collide with a surface of a member to be processed that exhibits non-magnetism;
A step of selectively collecting the grinding powder by attracting it by magnetic force from a mixture of grinding waste of the member to be treated generated by the grinding and the grinding powder after the collision. Grinding method. A method of manufacturing a flat display panel substrate having a partition wall defining a pixel space,
Forming a mask having an opening on a glass-containing layer containing a glass material;
Grinding the glass-containing layer exposed from the opening of the mask by colliding the grinding powder according to any one of claims 1 to 9 ,
And baking the ground glass-containing layer to obtain the partition wall. A method for producing a flat display panel substrate.

Images