JP4420808B2 - Mold changing equipment for extrusion molding machines - Google Patents

Description

  The present invention transports a support in a mold-mounted state in which the mold is placed and supported from a storage means for storing the mold to a supply location for the extruder, and is returned from the extruder. A mold transporting means for transporting the support in a mold-mounted state from a return position for receiving a mold to the storage means; and the mold is detached from the support in a mold-mounted state existing at the supply position. The mold is transferred to a die carrier supply means provided in the extrusion molding machine, and returned from the extrusion molding machine to the support that exists in the mold release state in which the mold is detached at the return location. A mold for an extrusion molding machine provided with a mold transfer means for transferring the mold to be transferred and a support transport means for transporting the support in a mold-released state from the supply location to the return location It relates to mold change equipment.

The above-mentioned mold changing equipment of the extrusion molding machine is such that when the exchange of the mold used in the extrusion molding machine is required, the mold mounting means for mounting and supporting the mold to be used next by the mold conveying means. The support in the state is transported to the supply location, the mold transfer means transfers the next mold to be used from the support to the die carrier supply means, and the die carrier supply means is next to the extruder. The mold used is exchanged with the mold currently used.
Then, when the currently used mold becomes a used mold, for the used mold, the mold transfer means is located at the place where the mold is transferred from the die carrier supply means, and the support in the mold release state. Then, the mold conveying means conveys the mold-mounted support to the storage means.
Further, the mold and the support for mounting and supporting the mold are configured to correspond one to one, and it is determined which mold is to be mounted and supported on which support.

  In such a mold exchange facility of an extrusion molding machine, conventionally, the die carrier supply means is configured to replace the mold with respect to the extrusion molding machine while holding the next mold and the used mold. The support conveying means is configured such that the mold is detached from the mold-mounted support by the mold transfer means, and the mold-mounted support is transferred from the return place by the mold transfer means. Then, there is one configured to transport the support in a mold detached state from which a mold has been detached from a supply location to a return location (see, for example, Patent Document 1).

Patent Publication No. 2990672

In the above-described conventional mold exchanging equipment of the extrusion molding machine, the die carrier supply means replaces the mold with respect to the extrusion molding machine while holding the next mold and the used mold. Then, there is a support in the mold release state in which the next mold is released at the supply location, and there is a support in the mold release status in which the used die is released at the return location. Become.
After that, after the mold transfer means transfers the used mold to the support in the mold release state existing at the return location, the mold transfer means mounts and supports the used mold. By first transporting the support in the state from the return location, the support transport means transports the support in the mold release state from the supply location to the return location.

However, for example, when the exchange of the mold used in the extrusion molding machine is required immediately after the exchange of the mold in the extrusion molding machine, the mold in which the used mold is detached at the return point Due to the presence of the support in the detached state, the support transport means cannot transport the support in the mold detached state from the supply location to the return location, and the mold release state in which the next mold to be used is removed from the supply location. There will be a support.
Therefore, when the replacement of the mold used in the extrusion molding machine is required at short intervals, such as immediately after the replacement of the mold in the extrusion molding machine, there is a support in the mold release state at the supply location. Therefore, after the replacement of the mold used in the extrusion molding machine is required, supply until the support body in the mold mounting state where the next mold to be used is placed and supported can be transported to the supply location. There is a possibility that a waiting time until the support existing at the location is transported is generated, and the time required for exchanging the mold with respect to the extruder is increased.

  The present invention has been made paying attention to such a point, and an object thereof is to provide a mold exchanging facility for an extrusion molding machine that can shorten the time required for exchanging the mold with respect to the extrusion molding machine. There is in point to do.

In order to achieve this object, the first characteristic configuration of the mold changing facility of the extruder according to the present invention is that the mold is placed and supported from a storage means for storing the mold to a supply point to the extruder. A mold transporting means for transporting the support in the mold mounted state to the storage means from a return location for transporting the mold mounted support and receiving the mold returned from the extrusion machine; The mold is detached from the support in the mold-mounted state existing at the supply location, the mold is transferred to a die carrier supply means provided in the extrusion molding machine, and the return location is returned to the return location. Mold transfer means for transferring the mold returned from the extruder to the support that exists in the mold release state where the mold is released, and mold release from the supply location to the return location Support transport means for transporting the support in a state; In die change equipment extruder provided,
Between the supply location and the return location, a buffer location where the support can be stored is provided, and the support transport means is moved from the support in a mold-mounted state by the mold transfer means. When the mold is detached, the support in the mold detached state from which the mold has been detached is transported from the supply location to the buffer location, and the mold is mounted by the mold transportation means. When the support is transported from the return location, the support in the mold detached state stored in the buffer location is transported to the return location.

That is, the support transport means can transport the support from the supply location to the buffer location simply by removing the mold from the support at the supply location, even if the support exists at the return location. Even immediately after the exchange of the mold in the extruder, it is possible to prevent the support from being present at the supply location.
Therefore, even if the replacement of the mold used in the extruder is required at short intervals, such as immediately after the replacement of the mold in the extruder, the next metal to be used at the supply location in accordance with the request. It is possible to transport the support in the mold mounting state where the mold is placed and supported.

  In addition, the support transport means sequentially transfers the support in the mold release state stored in the buffer location to the return location every time the mold support is transported from the return location by the mold transport means. Since the mold can be transferred, the mold transfer means transfers the used mold returned from the extruder to the support in the mold release state, which is sequentially transferred to the return place by the support transfer means. After that, the mold transport means can transport the support with the mold mounted from the return location.

  From the above, even when replacement of the mold used in the extrusion molding machine is required at a short interval, the support body in the mold mounting state in which the mold to be used next is mounted and supported in accordance with the request. While being able to transfer to the supply location, it is possible to perform mold replacement work, and to reduce the time required for mold replacement work with respect to the extrusion molding machine. I was able to provide it.

  According to a second characteristic configuration of the die changing equipment of the extrusion molding machine according to the present invention, the die is constituted by a die, a bolster, and a sub-bolster, and the die conveying means and the support conveying means are the supporting members. The body is configured to convey a die support for mounting and supporting the die, a bolster support for mounting and supporting the bolster, and a sub-bolster support for mounting and supporting the sub-bolster. It is in.

That is, the die transporting means transfers the die support body in the mold mounting state, the bolster support body in the mold mounting state, and the sub bolster support body in the mold mounting state from the storage means to the supply location and the return location. To the storage means, and the support transport means buffers the die support in the mold detached state, the bolster support in the mold mounted state, and the sub bolster support in the mold mounted state from the supply point. It will be transported from the location and buffer location to the return location.
Therefore, not only dies and bolsters, but also sub-bolsters can be exchanged for the extrusion molding machine by transporting the support in the mold-mounted state by the mold transport means and transporting the support in the mold-released state by the support transport means. As a result, it is possible to provide a useful mold changing facility for an extrusion molding machine.

  The third feature configuration of the mold changing facility of the extrusion molding machine according to the present invention is the second feature configuration, wherein the mold transport means can bypass transport the sub-bolster support from the return location to the supply location. It is in the point which is comprised.

In other words, since the transport means bypass transports the sub bolster support from the return location to the supply location, the sub bolster support with the used sub bolster placed and supported is transported to the supply location as it is without being transported to the storage means. Will be able to.
And, as for the sub bolster, the used sub bolster may be reused without being exchanged. Therefore, by transporting the used sub bolster as it is to the supply point, the transport time can be shortened. It is possible to shorten the time required for exchanging the mold with respect to the single-layer extrusion molding machine.

An embodiment of a mold exchanging facility for an extrusion molding machine according to the present invention will be described with reference to the drawings.
The die changing equipment of this extrusion molding machine is equipment for exchanging the die 1a, the bolster 1b, and the sub bolster 1c as the die 1, and stores the die 1 as shown in FIG. 1 and FIG. The storage means 2, the heating means B for heating the mold 1, and the support 3 in the mold mounting state on which the mold 1 is placed and supported are fed from the storage means 2 to the supply location 5 for the extrusion machine 4 and the extrusion machine 4. The mold conveying means 7 that conveys the mold 1 that is returned from the mold 1 to the storage means 2, and the mold 1 is detached from the support 3 in the mold mounted state that is present at the supply location 5. The die 1 is transferred to the die carrier supply means 8 provided in 4, and is returned from the extruder 4 to the support 3 existing in the mold release state in which the die 1 is detached from the return location 6. A mold transfer device 9 as a mold transfer means for transferring the mold 1; And it is configured to provide a support or the like transport vehicle 10 as a support carrying means for carrying the support 3 of the mold disengaged to return portion 6 from the point 5.
Incidentally, FIG. 1 shows a schematic plan view in which a part of the die changing equipment of the extrusion molding machine is omitted, and FIG. 2 is a side view showing the main part of the die changing equipment of the extrusion molding machine.

The storage means 2 includes a die storage shelf 2a for storing a die 1a as a mold 1, a bolster storage shelf 2b for storing a bolster 1b as a mold 1, and a sub bolster for storing a sub bolster 1c as a mold 1. It is comprised from the storage shelf 2c.
Each of the die storage shelf 2a, the bolster storage shelf 2b, and the sub-bolster storage shelf 2c is composed of a plurality of shelves arranged vertically and horizontally, and the mold is mounted to support the mold 1. The support 3 in the state is configured to be stored in each storage unit.

The dice storage shelf 2a, the bolster storage shelf 2b, and the sub-bolster storage shelf 2c are arranged side by side so that their horizontal directions are substantially parallel.
Then, a pair of dice storage shelves 2a are disposed with a gap therebetween with the storage portions facing each other, and the bolster storage shelves 2b and the sub-bolster storage shelves 2c are in a state in which the heating means B is disposed therebetween. They are arranged at intervals.
The heating means B is configured by arranging a plurality of heating furnaces 15 in the left-right direction of a shelf such as the dice storage shelf 2 a, and is configured to be able to heat two molds 1 in one heating furnace 15.

As shown in FIGS. 3 and 4, the support 3 includes a die support 3a for mounting and supporting the die 1a, a bolster support 3b for mounting and supporting the bolster 1b, and a sub-bolster for mounting and supporting the sub-bolster 1c. It is comprised from the support body 3c.
Each of these supports is composed of a pallet for placing and supporting the mold 1, and a pair of front and rear mold contact portions 12 are provided horizontally on a rectangular frame 11 in plan view. 12 is provided with a plurality of holes 14 for inserting the mold fixing pins 13.
Also, depending on the size of the mold 1 loaded on the support 3, the four pins 13 are inserted into the holes 14 at predetermined positions so that the mold 1 is inscribed in the four pins 13. It is configured to be loaded on the mold contact portion 12 and hold the mold 1 in a predetermined loading posture.
The mold 1 and the support 3 for placing and supporting the mold 1 are configured to correspond one-to-one, and it is determined which mold 1 is placed and supported on which support 3. ing.

  As shown in FIG. 1, the mold conveying means 7 is configured by combining a plurality of conveying devices such as a stacker crane, a traveling carriage, and a running fork device, and the mold 1 is placed between the conveying devices at a relay point or the like. It is configured to convey the support 3 in the mounted state of the mounted die from the storage means 2 to the supply location 5 and from the return location 6 to the storage means 2.

In other words, a bypass relay point 16 is disposed at a position opposite to the supply point 5, a supply relay point 17 is disposed beside the bypass relay point 16, and a return point 6. A return relay point 18 is disposed at a position opposite to the heating furnace 15, the supply relay point 17, the bypass relay point 16, and the return relay point 18 are arranged in a line. .
A dice return relay point 19 is disposed at one end portion of the dice storage shelf 2a in the left-right direction so as to face the return relay point 18.

  Each of the supply relay point 17, the bypass relay point 16, and the return relay point 18 is provided with a support portion for placing and supporting the support 3 in a mold-mounted state, and between these support portions, A stacker crane, a traveling carriage, and a running fork device are configured to transfer the support 3 in a state where the mold is mounted.

  In the supply relay point 17 and the bypass relay point 16, the support part places and supports two supports 3, that is, a bolster support 3 b in a mold-mounted state and a sub-bolster support 3 c in a mold-mounted state. In the return relay point 18, the support portion is composed of a die support 3 a in a die-mounted state, a bolster support 3 b in a die-mounted state, and a sub-bolster support 3 c in a die-mounted state. Two supports 3 are placed and supported.

Between the pair of dice storage shelves 2a, the die support in a state in which the die is mounted on the die transporting carriage 20 disposed in a part of the dice storage shelf 2a from the storage unit of the dice storage shelf 2a. There is provided a first stacker crane 21 that can transfer 3a and can transfer the die support 3a in a die-mounted state from the relay point 19 for returning the die to the storage part of the die storage shelf 2a.
Between the bolster storage shelf 2b and the heating furnace 15, it is possible to transfer the die support 3a in a die-mounted state from the die conveyance carriage 20 to the heating furnace 15, and from the storage part of the bolster storage shelf 2b. A second stacker crane 22 capable of transferring the bolster support 3b mounted in the mold to the supply relay point 17 is provided.

  Between the heating furnace 15 and the sub-bolster storage shelf 2c, the die support 3a mounted in the mold can be transferred from the heating furnace 15 to the supply location 5, and the supply relay location 17 or the bypass relay location. A third stacker crane 23 capable of transferring the bolster support 3b in the mold-mounted state and the sub-bolster support 3c in the mold-mounted state is provided from 16 to the supply location 5.

The first, second, and third stacker cranes 21, 22, and 23 have the same configuration except that the number of transferable support bodies 3 is different, and can travel in the left-right direction of the shelf. Fork devices 21a, 22a, and 23a that can freely move in and out of a lifting platform that can be moved up and down with respect to the traveling carriage are configured.
The fork device 21a of the first stacker crane 21 is configured to be able to transfer one of the supports 3 in the mold-mounted state, and the fork devices 22a and 23a of the second and third stacker cranes 22 and 23 are Two of the supports 3 in the mold mounted state can be transferred simultaneously.

Between the return point 6 and the return relay point 18, from the return point 6 to the return relay point 18, a die support 3a in a die-mounted state, a bolster support 3b in a die-mounted state, and A first running fork device 24 capable of transferring the sub-bolster support 3c mounted in the mold is provided.
In addition, a second die support 3a can be transferred between the return relay point 18 and the die return relay point 19 from the return relay point 18 to the die return relay point 19. A running fork device 25 is provided.

The first and second running fork devices 24 and 25 have the same configuration except that the number of support bodies 3 that can be transferred is different, and the other configurations are the same. Therefore, only the first running fork device 24 has a side view. A description will be added based on FIG. 5 showing and FIG. 6 showing a plan view.
As shown in FIG. 5, the first running fork device 24 includes a fork portion 26 that can be retracted in the left-right direction, a link mechanism 27 for moving the fork portion 26 up and down, and the like.
Then, after the fork part 26 is operated to protrude, the fork part 26 is raised, and the fork part 26 places and supports the support 3 in a die-mounted state, and the fork part 26 is retracted to return the return portion 6. The mold-mounted support 3 present at the return relay point 18 is scooped up, and the fork 26 is protruded and operated with the fork 26 mounted and supported on the mold-mounted support 3. The part 26 is lowered, and the support 3 in a die-mounted state is wholesaled to the return relay point 18 and the die return relay point 19.

  As shown in FIG. 6, the fork portion 26 of the first running fork device 24 is configured to be able to place and support three of the support members 3 in a mold-mounted state, and to be able to transfer these three support members at the same time. Although not shown, the fork portion 26 of the second running fork device 25 is configured to be able to place and support one of the supports 3 in a mold-mounted state, and to be able to transfer one support. .

As shown in FIG. 1, a bypass traveling carriage capable of transporting the die-mounted bolster support 3b and the mold-mounted bolster support 3c from the return relay 18 to the bypass relay 16 28 is provided.
Although not shown, the bypass traveling carriage 28 includes a support portion for placing and supporting the support 3 in a die-mounted state so that the support portion 3 can be raised and lowered. The reciprocating movement with respect to the part 16 is configured to convey the die-mounted bolster support 3b and the mold-mounted bolster support 3c from the return relay point 18 to the bypass relay point 16. Has been.

  In this way, the mold conveying means 7 includes the first, second and third stacker cranes 21, 22, 23, the die conveying carriage 20, the first and second running fork devices 24, 25, and the bypass traveling carriage 28. It is composed of

Then, as shown by the arrow in FIG. 7, the die conveying means 7, as shown by the arrow in FIG. 7, for the die support body 3 a in the die mounting state to be supplied to the supply location 5, The stacker crane 22 conveys the die 1a from the storage shelf 2a to the heating furnace 15, heats the die 1a in the heating furnace 15, and then conveys it from the heating furnace 15 to the supply location 5 by the third stacker crane 23. Has been.
In addition, as shown by the arrows in FIG. 7, the die conveying means 7 has the first running fork device 24 and the second running fork device 25 for the die support 3 a in the die mounting state existing at the return place 6. Thus, after being relayed at the return relay point 18 and transported to the die return relay point 19, the first stacker crane 21 is transported to the storage part of the dice storage shelf 2 a.

The mold conveying means 7 supplies the bolster support 3b mounted in the mold to the supply location 5 from the bolster storage shelf 2b by the second stacker crane 22, as shown by the arrow in FIG. After being transported to the relay point 17, the third stacker crane 23 is configured to transport from the supply relay point 17 to the supply point 5.
Then, as shown by the arrow in FIG. 8, the mold conveying means 7 uses the first running fork device 24 and the bypass traveling carriage 28 for the bolster support 3 b in the mold mounted state existing at the return location 5. After being relayed at the return relay point 18 and transported to the bypass relay point 16, the second stacker crane 22 is configured to transport from the bypass relay point 16 to the storage part of the bolster storage shelf 2 b. .
In addition, the die conveying means 7 is configured so that the die mounting bolster support 3b existing at the return location 5 is bypassed by the third stacker crane 23 as shown by the dotted arrow in FIG. From the return point 6 to the supply point 5, it is configured to be capable of bypass transfer.

The mold conveying means 7 supplies the sub-bolster support 3c in the mold-mounted state to be supplied to the supply location 5 from the sub-bolster storage shelf 2c by the third stacker crane 23 as shown by the arrow in FIG. After being transported to the relay point 17, the third stacker crane 23 is configured to transport from the supply relay point 17 to the supply point 5.
Then, as shown by the arrows in FIG. 9, the mold conveying means 7 uses the first running fork device 24 and the bypass traveling carriage 28 for the sub-bolster support 3 c in the mold mounting state existing at the return location 5. Then, after being relayed at the return relay point 18 and transported to the bypass relay point 16, the third stacker crane 23 is transported from the bypass relay point 16 to the storage portion of the sub-bolster storage shelf 2 c. .
In addition, the mold conveying means 7 uses the third stacker crane 23 for the bypass relay point 16 for the sub-bolster support 3c in the mold mounted state that exists at the return point 5, as indicated by the dotted arrow in FIG. From the return point 6 to the supply point 5, it is configured to be capable of bypass transfer.

As shown in FIGS. 1 and 7 to 9, the die support 3a, the bolster support 3b, and the sub-bolster support 3c can be stored one by one between the supply location 5 and the return location 6. A buffer portion 29 is provided, and the support transport carriage 10 passes from the supply location 5 via the buffer location 29 to the return location 6 for the die support 3a in the mold release state and for the bolster in the mold release state. It is configured to transport the support 3b and the sub-bolster support 3c in a mold-released state.
Then, when the mold 1 is detached from the support 3 in the mold mounting state by the mold transfer device 9 in the support transport carriage 10, the support in the mold detached state from which the mold 1 is detached. 3 is transported from the supply location 5 to the buffer location 6, and when the support 3 in the mold-mounted state is conveyed from the return location 6 by the mold transport means 7, the mold stored in the buffer location 29 The detached support 3 is transported to the return point 6.

  If explanation is added, as shown in FIG. 10 which is a side view and FIG. 11 which is a front view, the support carrier cart 10 includes a die support 3a, a bolster support 3b, and a sub-bolster support 3c. A mounting portion 10a for mounting and supporting the three supports 3 is provided so as to be movable up and down by a pair of front and rear lifting mechanisms 10c, and the wheel 10b is rotationally driven by the operation of the drive motor 10d to supply the supply portion 5 and the return portion 6; It is comprised so that it may reciprocate between.

The supply location 5, the buffer location 29, and the return location 6 are arranged in a line, and the supply location 5, the return location 6 and the buffer location 29 are respectively provided with a die support 3a and a bolster support 3b. And a sub bolster support 3c as a set, a pair of left and right frames 30 for mounting and supporting the set of supports 3 and a pair of front and rear receiving portions 31 provided on the pair of left and right frames 30 are provided. It is arranged.
The support carriage 10 is provided between the pair of left and right frames 30 so as to be capable of reciprocating between the supply location 5 and the return location 6 via the buffer location 29.

  The support transport carriage 10 is supported by being placed and supported by the receiving portion 31 by raising the placement portion 10a while the placement portion 10a is positioned below the receiving portion 31 by the movement of the carriage. In the state where the body 3 is scooped and the mounting portion 10a on which the support body 3 is mounted and supported by the movement of the carriage is positioned above the receiving portion 31, the mounting portion 10a is lowered to support the receiving portion 31. 3 is configured to wholesale.

As shown in FIG. 2 and FIG. 12 which is a plan view, the mold transfer device 9 is movably supplied in a direction perpendicular to the arrangement direction of the supply location 5 and the return location 6 with respect to the base frame 52. A first cart 33 having a series of lengths in the direction in which the location 5 and the return location 6 are arranged, and a second cart 34 that is movable with respect to the first cart 33 in the direction in which the supply location 5 and the return location 6 are arranged. And is configured.
The second carriage 34 is provided with a grip portion 35 that can move up and down and can grip the mold 1.

  Moreover, between the supply location 5 and the die carrier supply means 8, as shown in FIG.1, FIG.2 and FIG.12, the set which sets the dice | dies 1a, the bolster 1b, and the sub bolster 1c in the position facing the supply location 5 is set. A table 36 is provided, and a dividing table 37 for dividing the die 1a, the bolster 1b, and the sub-bolster 1c is provided between the die carrier supply means 8 and the return location 6 at a position facing the return location 6.

As shown in FIG. 13 which is a plan view and FIG. 14 which is a side view, the set table 36 includes a die receiving frame 39, a bolster receiving frame 40, and a sub-bolster receiving frame which are movable along a pair of rails 38. 41.
14 (a), the die 1a is supplied to the die receiving frame 39 in a state where the die receiving frame 39, the bolster receiving frame 40, and the sub-bolster receiving frame 41 are separated from each other. After supplying the bolster 1b and supplying the sub bolster 1c to the sub bolster receiving frame 41, as shown in FIG. 14 (b), the die receiving frame 39, the bolster receiving frame 40, the sub bolster receiving frame 41, and It is comprised so that it may move and set.

Similarly to the set table 36, the split table 37 is also provided with a die receiving frame 44 and a bolster support that are movable along a pair of rails 43, as shown in FIG. 15 as a plan view and FIG. 16 as a side view. A frame 45 and a sub-bolster receiving frame 46 are provided.
Then, as shown in FIG. 16A, the dice 1a is supplied to the die receiving frame 44 in a state where the die receiving frame 44, the bolster receiving frame 45, and the sub-bolster receiving frame 46 are close to each other. After supplying the bolster 1b and supplying the sub bolster 1c to the sub bolster receiving frame 46, as shown in FIG. 16B, the die receiving frame 44, the bolster receiving frame 45, the sub bolster receiving frame 46, and Are separated and separated.

In the mold transfer device 9, when the die support 3 a in the mold mounted state, the bolster support 3 b in the mold mounted state, and the sub bolster support 3 c in the mold mounted state are conveyed to the supply location 5. After the first carriage 33 and the second carriage 34 are moved and the gripping part 35 is positioned above the supply point 5, the gripper 35 is gripped by the downward movement and gripping operation of the gripping part 35, and then the gripping part The mold 1 is configured to be detached from the support 3 by moving 35 upward.
The mold transfer device 9 is configured to supply the die 1a, the bolster 1b, and the sub-bolster 1c conveyed to the supply location 5 to the set stand 36 and set them to the die carrier supply means 8. Yes.

  In addition, when the mold 1 is returned from the extrusion molding machine 4, the mold transfer device 9 supplies the dice 1a, the bolster 1b, and the sub bolster 1c to the dividing table 37 and divides them. In a state where the two-wheel carriage 34 is moved and the gripping part 35 is positioned above the return point 6, the die 1a, the bolster 1b and the sub-bolster 1c are moved to the mold 1 by the downward movement of the gripping part 35 and the release operation of the gripping. Are transferred to the die support 3a in the mold detached state, the bolster support 3b in the mold detached state, and the sub-bolster support 3c in the mold detached state.

As shown in FIGS. 17 and 18, the die carrier supply means 8 includes a holding member 48 that is movable in the direction along the billet extrusion direction on the off-line of the extruder 4, and the holding member 48. However, the two die carriers 49 can be positioned and held, and each die carrier 49 can be moved between the die transfer device 9 by the air cylinder 50 to the transfer location P3 and the retreat location P4. It is configured.
The die transfer device 9 is configured to transfer the die 1a, the bolster 1b, and the sub-bolster 1c set on the setting table 36 to the empty die carrier 49 in the transfer position P3. Yes.

In addition, a locking member 51 that is movable in a direction crossing the billet extrusion direction is provided, and the die carrier 49 is transferred by driving the holding member 48 in a state where the locking member 51 is moved to the off-line side. The die carrier 49 and the locking member 51 are configured to be engageable and disengageable by moving to the place P3 and the retracted place P4.
Then, by moving the locking member 51 in a state where the die carrier 49 is locked to the locking member 51, the die carrier 49 is moved to the transfer location P3 that is offline and online. ing.

The die carrier supply means 8 transfers the die 1a, the bolster 1b, and the sub bolster 1c to be used next to the empty die carrier 49 in the transfer position P3 in advance, and moves the die carrier 49 to one retracted position. It is configured to be saved in P4.
The die carrier supply means 8 first moves the seated die carrier 49 loaded with the used dice 1a, bolster 1b, and sub-bolster 1c from online to the transfer position P3. It is configured to let you.
Next, the die carrier supply means 8 moves the die carrier 49 loaded with the die 1a, the bolster 1b, and the sub bolster 1c to be used next while the seated die carrier 49 is moved to the other retracted position P4. The die carrier 49 is moved from the retracted position P4 to the transfer position P3, and the die carrier 49 is moved online and used in the extruder 4.
Further, the die carrier supply means 8 moves the die carrier 49 loaded with the used dice 1a, the bolster 1b and the sub bolster 1c to the transfer position P3 again, and the die transfer device 9 causes the used dice 1a to move. The bolster 1b and the sub-bolster 1c are transferred.

  As shown in FIG. 19, a management device H that controls the operation of the mold transport means 7, the die carrier supply means 8, the mold transfer device 9, and the support transport cart 10 is provided. When there is a request to use a new die 1a in the extruder 4 as a request for replacement of the mold 1 to be used, a mold transport means 7, a die carrier supply means 8, a mold transfer device 9, and The operation of the support carriage 10 is controlled to replace the die 1a, bolster 1b, and sub-bolster 1c to be used for the extruder 4.

Hereinafter, an operation when the die 1a, the bolster 1b, and the sub-bolster 1c are exchanged for the extruder 4 will be described with reference to FIGS.
Incidentally, in FIGS. 20 and 21, the supports 3a, 3b, and 3c shown with diagonal lines indicate the support in the mold mounted state in which the mold 1 is placed and supported, and the support that is outlined As for the bodies 3a, 3b, 3c, a support body in a mold detached state from which the mold 1 is detached is shown.

The management device H transports the die support 3a in a state where the die 1a to be used is placed and supported to the heating furnace 15 and heats the die 1a to be used in order to heat the die 1a. Is configured to operate.
Then, as shown in FIG. 20 (a), the management device H has a mold in which the bolster 1b to be used next is placed and supported before there is a request to use a new die 1a in the extruder 4 or the like. In order to transport the mounted bolster support 3b and the sub bolster support 3c mounted on the sub bolster 1c to be used next to the supply location 5, the mold transport means 7 is operated. Has been.
Further, the management device H includes a die support 3a in a state where the die 1a, the bolster 1b and the sub bolster 1c used in the extrusion machine 4 are detached, and a bolster support 3b in a state where the die is detached. In addition, the support transport carriage 10 is configured to be operated so as to transport the sub-bolster 3c in a mold-released state to the return location 6.

  And when the management apparatus H has a request | requirement of using the new die 1a in the extrusion molding machine 4 in the state shown to (b) of FIG. 20, as shown to (b) of FIG. In order to transport the die support 3 a mounted and supported in the mold mounted state from the heating furnace 15 to the supply location 5, the mold transport means 7 is operated.

Next, when the die support 3a in the mold mounting state, the bolster support 3b in the mold mounting state, and the sub bolster support 3c in the mold mounting state are conveyed to the supply location 5, the management device H As shown in FIG. 21C, after the dies 1a, bolster 1b, and sub-bolster 1c are detached from the supports 3a, 3b, 3c and set on the set stand 36, the transfer of the die carrier supply means 8 is performed. The die transfer device 9 is configured to operate in order to transfer to the empty die carrier 49 present at the mounting location P3.
Further, the management device H includes a die 1a, a die support 3a in the mold mounting state, a bolster support 3b in the mold mounting state, and a sub bolster support 3c in the mold mounting state that exist at the supply location 5. When the bolster 1b and the sub-bolster 1c are separated, the die support 3a in the mold-released state, the bolster support 3b in the mold-released state, and the sub-bolster support 3c in the mold-released state are conveyed to the buffer location 29. Therefore, it is configured to operate the support carrier cart 10.

  The management device H then replaces the used die 1a, bolster 1b, and sub-bolster 1c with the die 4a, bolster 1b, and sub-bolster 1c to be used next to the extrusion molding machine 4 in a die carrier supply means. 8 is configured to operate.

  Thereafter, as shown in FIG. 21 (d), the management device H is a seated die loaded with used dice 1a, bolster 1b, and sub-bolster 1c that are present at the transfer location P3 of the die carrier supply means 8. After the used die 1a, bolster 1b, and sub-bolster 1c are detached from the carrier 49 and divided by the dividing table 37, the die support 3a in the die removal state existing at the return point 6 and the die removal state are separated. In order to transfer to the bolster support body 3b and the sub-bolster support body 3c in the mold release state, the mold transfer device 9 is operated.

Then, the management device H adds the die 1a and the bolster to the die support 3a in the mold release state, the bolster support 3b in the mold release state, and the sub-bolster support 3c in the mold release state that exist at the return location 6. When the 1b and the sub bolster 1c are transferred, the die support 3a in the die mounting state, the bolster support 3b in the die mounting state, and the sub bolster support 3c in the die mounting state are stored in the die storage shelf 2a, The mold conveying means 7 is configured to be operated so as to be conveyed to the bolster storage shelf 2b and the sub-bolster storage shelf 2c.
In addition, when the management device H uses the used bolster 1b and the sub bolster 1c for the next time, the bolster support 3b in the mold mounted state and the sub bolster support 3c in the mold mounted state are returned to the return location. The die conveying means 7 is configured to operate so as to bypass and convey from 6 to the supply point 5 as it is.

  Then, when the support body 3 is transported from the return place 6, the management device H stores the die support body 3a in the mold detached state, the bolster support body 3b in the mold detached state, A bolster support in a mold-mounted state in which the support transport carriage 10 is operated and a bolster 1b to be used next is placed and supported so as to transport the sub-bolster support 3c in a mold-released state to the return point 6. In order to transport the sub-bolster support 3c mounted with the mold 3b and the sub-bolster 1c to be used next to the supply location 5, the mold transport means 7 is operated, so that FIG. It is configured to return to the state shown.

  In this way, the management device H is configured to repeat the above-described operation whenever there is a request to use a new die 1a in the extrusion molding machine 4. For example, as shown in FIG. As shown, even if there is a request to use a new die 1a in the extruder 4 immediately after the die carrier supply means 8 replaces the die 1 in the extruder 4, the supply location 5 In this case, a state in which the support 3 is not present is created, and the support 3 in a mounted state in which the mold 1 to be used next is placed and supported can be transported to the supply location 5 in accordance with the request.

[Another embodiment]
(1) In the above embodiment, the sub bolster storage shelf 2c is provided separately from the bolster storage shelf 2b. However, the bolster storage shelf 2b is not limited to the bolster support 3b. The sub-bolster support 3c on which the sub-bolster 1c is placed and supported can also be stored and implemented.

(2) In the above embodiment, after the die conveying means 7 heats only the dice 1 a in the heating furnace 15, the die support 3 a in a die-mounted state in which the die 1 a is placed and supported is supplied to the supply location 5. Although the die conveying means 7 heats the die 1a and the bolster 1b in the heating furnace 15, the die supporting member 3a in a die-mounted state in which the die 1a is placed and supported. The bolster support 3b mounted with the bolster 1b placed and supported on the bolster 1b may be configured to be transported to the supply location 5.

(3) In the above embodiment, the die 1 to be exchanged for the extrusion molding machine 4 is the die 1a, the bolster 1b, and the sub-bolster 1c, and the die conveying means 7 and the support conveyance cart 10 are the die support 3a. The bolster support 3b and the sub bolster support 3c are transported. For example, the sub bolster 1c is supplied to the extrusion machine 4 by an overhead crane device or the like, and is supplied to the extrusion machine 4. The mold 1 to be exchanged is a die 1a and a bolster 1b, and the mold transport means 7 and the support transport carriage 10 are configured to transport the die support 3a and the bolster support 3b. It is possible.

(4) In the above embodiment, the mold conveying means 7 is configured to be capable of bypass conveyance from the return point 6 to the supply point 5 with respect to the bolster support 3b and the sub bolster support 3c. It is also possible that the transport means 7 is configured to be capable of bypass transport from the return point 6 to the supply point 5 only for the sub-bolster support 3c.
Further, the mold conveying means 7 always conveys the bolster support 3b and the sub bolster support 3c from the return location 6 to the storage means 2 without bypass conveyance from the return location 6 to the supply location 5. It is also possible to configure and implement.

(5) In the above embodiment, the management device H for controlling the operation of the mold transport means 7, the die carrier supply means 8, the mold transfer device 9, and the support transport cart 10 is provided. However, for example, control information is transmitted between the mold transfer means 7, the die carrier supply means 8, the mold transfer apparatus 9, and the support transfer carriage 10. It is also possible to configure so that each device can operate based on the control information to be communicated.

(6) In the above embodiment, the buffer location 29 is configured to be able to store a single support 3. For example, a storage shelf that can store a plurality of supports 3 is provided in the buffer location 29. It is possible to configure and implement such that a plurality of supports 3 are stored on the shelf.
That is, the buffer portion 29 may be any as long as it can store the support 3, and the number of the supports 3 to be stored can be appropriately changed.

Partially omitted plan view of die change equipment for extrusion molding machines Side view of the main part of the die change equipment of an extrusion molding machine Perspective view of support Side view of support Side view of running fork device Top view of running fork device The figure which shows the conveyance route of the support body for dies The figure which shows the conveyance route of the support body for bolster The figure which shows the conveyance route of the support body for a sub bolster Side view of support carriage Front view of support carriage Plan view of the main part of the die change equipment of an extrusion molding machine Top view of set stand Side view of set stand Plan view of dividing table Side view of split table Side view of main part of die carrier supply means Front view of main part of die carrier supply means Control block diagram of die change equipment for extrusion molding machines Plan view showing the state of mold transfer Plan view showing the state of mold transfer

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a Die as a mold 1b Bolster as a mold 1c Sub bolster as a mold 2 Storage means 3a Support for a die as a support 3b Support for a bolster as a support 3c Support for a sub bolster as a support 4 Extrusion Molding machine 5 Supply location 6 Return location 7 Mold transport means 8 Die carrier supply means 9 Mold transfer means 10 Support transport means 29 Buffer location

Claims (3)

A mold-mounted support body on which the mold is placed and supported is transferred from a storage means for storing the mold to a supply location for the extruder, and the mold returned from the extruder is received. A mold transport means for transporting the support in a mold-mounted state from a return location to the storage means;
The mold is detached from the support in a mold-mounted state existing at the supply location, the mold is transferred to a die carrier supply means provided in the extrusion molding machine, and the return location is A mold transfer means for transferring the mold returned from the extrusion molding machine to the support that exists in a mold release state in which the mold is released; and
A mold changing facility for an extrusion molding machine provided with a support conveying means for conveying the support in a mold detachment state from the supply location to the return location,
Between the supply location and the return location is provided a buffer location capable of storing the support,
When the mold is detached from the support in the mold-attached state by the mold transfer means, the support transport means disposes the support in the mold detached state from which the mold has been detached. When the support in a mold-mounted state is transported from the return location by the mold transport means from the supply location to the buffer location, the mold detached state stored in the buffer location is A mold change facility for an extrusion molding machine configured to convey the support to the return location. The mold is composed of a die, a bolster, and a sub-bolster,
The die conveying means and the support conveying means serve as the support, a die support for placing and supporting the die, a bolster support for placing and supporting the bolster, and the sub-bolster. The die change equipment of the extrusion molding machine according to claim 1, wherein the die bolster is configured to convey a supporting body for a sub bolster.   The mold changing facility for an extrusion molding machine according to claim 2, wherein the mold conveying means is configured to be capable of bypass conveyance from the return point to the supply point with respect to the support for the sub bolster.

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