JP4419920B2 - Board connector - Google Patents

Description

  The present invention relates to a board connector.

As a board connector, one described in Patent Document 1 is known. The board connector includes a hood-like connector housing that can be fitted to a mating connector housing, and a terminal fitting is mounted on the back wall of the connector housing. One end of the terminal fitting protrudes to the inside of the connector housing and serves as a terminal connecting portion connected to the mating terminal, and the other end of the terminal fitting is exposed to the outside of the connector housing and bent toward the board side. The board fixing portion is soldered to the board.
Japanese Utility Model Publication No. 61-60486

By the way, as one method of inspecting the solder of the board connector, the solder height may be inspected with reference to the end face of the board fixing portion of the terminal fitting. For example, if the solder height is higher than the end face height of the terminal fitting, it is determined that the solder amount is appropriate and the inspection is passed. If the solder height is less than the end face height, the solder amount is sufficient. It is determined that there is no inspection and the inspection is rejected.
However, when the board connector is used for a circuit having a large electric capacity, the terminal thickness of the terminal fitting increases, and it becomes difficult to set a prescribed solder height higher than the end face height of the terminal fitting. In that case, if the portion other than the end face height of the terminal fitting is used as a mark, it is easy to make a mistaken determination, and if a dedicated inspection device for measuring the solder height is used, the cost is high. .
The present invention has been completed based on the above circumstances, and an object thereof is to make it possible to easily inspect the solder height even when the terminal thickness is large.

As a means for achieving the above object, the invention of claim 1 includes a connector housing and a terminal fitting attached to the connector housing, and the terminal fitting is a terminal connected to a mating terminal on one end side. In addition to the connection portion, a substrate fixing portion connected to the substrate by soldering is provided on the other end side, and solder adheres to the end surface of the substrate fixing portion. By gradually increasing the thickness, a prescribed solder height is set to be equal to or higher than the height of the end face of the board fixing portion, and the connector housing includes a fitting recess that can be fitted with a mating connector housing, and the terminal connection portion. Is arranged to protrude inside the fitting recess, and the board fixing portion is arranged to be exposed outside the fitting depression, and the terminal connection portion and the board fixing portion are arranged in the terminal fitting. A housing mounting portion that penetrates the inner wall of the fitting recess is provided between, the housing mounting portion is arranged at a position closer to the substrate than the terminal connection portion with respect to a height position from the substrate, The other end of the terminal connection portion and one end of the housing mounting portion are connected by a relay portion, and the relay portion is disposed within the thickness range of the back wall of the fitting recess. Has characteristics.

The invention according to claim 2 is characterized in that, in the invention according to claim 1 , the housing mounting portion penetrates the back wall of the fitting recess in a state where the housing mounting portion is horizontally arranged parallel to the surface of the substrate. Have.

<Invention of Claim 1>
According to the first aspect of the present invention, the solder is attached to the end portion of the substrate fixing portion, and the substrate fixing portion is set so that the prescribed solder height can be set higher than the height of the end surface of the substrate fixing portion. Since the end of the part is previously thinned, the solder height can be easily inspected even if the terminal thickness is increased. Note that the prescribed solder height refers to the height of solder that is determined in advance for quality control and that passes the inspection because the amount of solder is an appropriate amount.

When connecting the terminal fitting to the substrate, reflow soldering may be performed. During such reflow soldering, the connector housing may thermally expand in the height direction.In this case, if the mounting position of the housing mounting portion with respect to the back wall of the fitting recess is set to the high side in the height direction, The amount of thermal displacement at the mounting portion of the housing mounting portion in the connector housing increases by the amount of stacking from below, and there is a risk that the board fixing portion receives a force in a direction away from the substrate and causes poor solder connection. In that respect, according to the present invention, the mounting position of the housing mounting part is set at a position closer to the board than the terminal connection part with respect to the height position from the board. Thus, the connection state of the substrate fixing portion can be maintained well.
Note that when setting the mounting position of the housing mounting portion to a position closer to the board, it is not necessary to displace the terminal connecting portion to the position where the terminal connecting portion is disposed. Can be kept in.
Furthermore, according to the present invention, the other end of the terminal connection portion and one end of the housing mounting portion are connected by the relay portion, and the relay portion is disposed within the thickness range of the back wall of the fitting recess. Thus, it is possible to avoid interference between the relay portion and the counterpart housing when the counterpart housing enters the fitting recess.

<Invention of Claim 2 >
According to the second aspect of the present invention, the housing mounting portion penetrates the back wall of the fitting recess in a state where the housing mounting portion is horizontally arranged parallel to the surface of the substrate. When mounting on the back wall by press-fitting, the press-fitting direction can be set horizontally in parallel with the surface of the substrate, and the workability is excellent.

< Reference Example 1>
Reference Example 1 will be described with reference to FIGS. 1 and 2. The board connector 10 of this reference example includes a connector housing 11 (hereinafter simply referred to as the housing 11) and a terminal fitting 20 attached to the housing 11.

The housing 11 is made of a heat-resistant resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide), and includes a fitting recess 12 that can be fitted to the mating housing 11 as shown in FIG. . The fitting recess 12 is formed in a horizontally long rectangular tube opening forward.
The back wall 13 of the fitting recess 12 is provided with a plurality of terminal mounting holes 15 through which the terminal fitting 20 passes. The terminal mounting hole 15 is configured to extend horizontally corresponding to the insertion direction of the terminal fitting 20 inserted therethrough. In addition, a pair of protective walls 17 that protect the terminal fitting 20 exposed from the back wall 13 are formed on the left and right sides of the back wall 13 of the fitting recess 12 so as to protrude rearward.

  The terminal fitting 20 has a relatively thick terminal thickness according to a circuit for high current, and is formed in a step shape by bending a plurality of times in the height direction. Specifically, the terminal fitting 20 is disposed on the front end side (one end side in the present invention) and is arranged inside the fitting recess 12, and can be connected to a mating terminal (not shown), and the rear end side (main A board fixing portion 23 disposed outside the fitting recess 12 and connected to the surface of a printed wiring board (hereinafter referred to as a board 18) by soldering, and the board fixing portion. 23 and a terminal connecting portion 21, and a housing mounting portion 22 that is mounted through the inner wall 13 of the fitting recess 12. The board fixing part 23 is arranged along the surface of the board 18, the terminal connection part 21 and the housing mounting part 22 are arranged horizontally, that is, parallel to the surface of the board 18, and the housing The mounting portion 22 is disposed closer to the substrate 18 than the terminal connection portion 21. The rear end of the terminal connection portion 21 and the front end of the housing mounting portion 22, and the rear end of the housing mounting portion 22 and the front end of the substrate fixing portion 23 are arranged perpendicular to the substrate 18. The relay parts 25A and 25B are connected together. The relay portion 25A is disposed inside the fitting recess 12 and in parallel with the back wall 13 at a position near the back wall 13, and the relay portion 25B is outside the fitting recess 12 and extends from the back wall 13. It is arranged a little apart and parallel to the back wall 13.

Further, the end portion of the substrate fixing portion 23 is formed with a thinning portion 24 in which the terminal thickness is reduced toward the end surface 24A by cutting out the upper surface of the substrate fixing portion 23. A part of the solder interposed between the substrate fixing portion 23 and the substrate 18 adheres to the end surface 24A of the substrate fixing portion 23. In the case of this reference example, the upper surface of the end portion of the substrate fixing portion 23 is thinned, and the height of the end surface 24A of the substrate fixing portion 23 matches the lower limit of the prescribed solder height attached to the end surface 24A. ing. The prescribed solder height refers to the height of solder that is determined in advance for quality control and that passes the inspection as being an appropriate amount of solder.

Next, the operation of this reference example will be described. First, the terminal fitting 20 is bent at a right angle twice to form the terminal connection portion 21 and the relay portion 25A. In this state, the rear end portion of the terminal fitting 20 is brought into a substantially horizontal posture and the rear wall 13 of the fitting recess 12 is formed. It inserts in the terminal mounting hole 15 in the press-fit state from the front. Further, the rear end portion of the terminal fitting 20 exposed from the back wall 13 of the fitting recess 12 is further bent at a right angle by 2 degrees to form the housing mounting portion 22, the relay portion 25B, and the board fixing portion 23.

  Subsequently, the board connector 10 is placed on the surface of the board 18, and accordingly, the board fixing portion 23 of the terminal fitting 20 is placed on a land (not shown) on the surface of the board 18. In this state, the board 18 with the board connector 10 is run in a reflow furnace (not shown), so that the solder applied in advance on the land of the board 18 is melted and the board fixing portion 23 is placed on the land. Adhere. Thereafter, when the solder is cooled and solidified, the board fixing portion 23 is connected to the corresponding land in a fixed state. At this time, if the amount of solder is an appropriate value, as shown in FIG. 2, it is judged that the inspection has passed if the upper end height position of the solder is equal to or higher than the upper end height position of the end surface 24 </ b> A of the board fixing portion 23. . On the other hand, when the amount of solder is less than the appropriate value, the upper end height position of the solder is less than the upper end height position of the end surface 24A of the board fixing portion 23, and the inspection failure is determined by visually checking such a state. The

By the way, during reflow soldering, there is a concern that the substrate fixing portion 23 may be lifted from the substrate 18 due to thermal expansion of the housing 11, but in this reference example , the housing 11 is LCP (liquid crystal polymer) or PPS (polyphenylene). Since it is made of a highly heat-resistant resin such as sulfide, the influence of the housing 11 due to thermal expansion can be effectively suppressed. Moreover, in the case of this reference example , the mounting position of the housing mounting portion 22 with respect to the back wall 13 of the fitting recess 12 is set to a position closer to the substrate 18 than the terminal connection portion 21 with respect to the height from the substrate 18. That is, since it is set at a position close to the substrate 18 side, the stacking from the bottom of the displacement amount (hereinafter referred to as the thermal displacement amount) accompanying thermal expansion (from the substrate 18 side) is not added so much. The amount of thermal displacement of the mounting portion of the housing mounting portion 22 in the back wall 13 of the joint recess 12 can be reduced. Therefore, it is possible to avoid a situation where the substrate fixing portion 23 integrally connected to the housing mounting portion 22 is lifted from the substrate 18.

As described above, according to the present reference example , the amount of thermal displacement of the mounting portion of the housing mounting portion 22 in the back wall 13 of the fitting recess 12 can be reduced, and as a result, the connection state of the board fixing portion 23 is maintained well. can do. In this case, even if the mounting position of the housing mounting portion 22 is close to the board 18, it is not necessary to bring the terminal connecting section 21 to the board 1 side as the terminal mounting section 21 is disposed. Can be kept at a predetermined position.

Further, by forming the thinned portion 24 at the end portion of the substrate fixing portion 23, a prescribed solder height can be set to be higher than the height of the end surface 24 </ b> A of the substrate fixing portion 23. Therefore, the solder inspection can be easily performed by visually checking whether the height of the end surface 24A of the board fixing portion 23 is a height at the end surface 24A or not.
Further, since the housing mounting portion 22 penetrates the back wall 13 of the fitting recess 12 in a state of being horizontally disposed parallel to the surface of the substrate 18, the press fitting direction of the terminal fitting 20 to the back wall 13 of the fitting recess 12 Can be set horizontally in parallel with the surface of the substrate 18, and the workability is excellent.

<Reference Example 2 >
FIG. 3 shows Reference Example 2 . This reference example is not directly related to the terminal fitting according to the reference example 1, and FIG. 3 shows a schematic view in which the terminal fitting is omitted and the rear portion of the housing 11 is viewed obliquely from above.

  The housing 11 according to this reference example includes a fitting concave portion 12 having a horizontally long rectangular tube shape that opens forward, and during reflow soldering, the fitting concave portion 12 warps in a direction in which an intermediate portion thereof floats from the substrate 18 due to thermal expansion. It has a means for avoiding deformation. That is, the housing 11 is provided with at least three fixing portions 19 for the substrate 18 at intervals around the outer wall, thereby increasing the fixing force of the housing 11 to the substrate 18. In the case of this reference example, each fixing portion 19 has a vertical rib shape extending in the height direction along the screwing direction of a screw screwed from below the substrate 18, and a total of five fixing portions 19 are provided for one housing 11. It is arranged. Specifically, each fixing portion 19 is disposed at a position close to both ends of the back wall 13 of the fitting recess 12, and at the center in the width direction of the back wall 13 with an equal interval therebetween. One is disposed on each side wall 14 of the housing 11. Among the fixing portions 19, those arranged on the back wall 13 of the fitting recess 12 are set at positions that do not interfere with the exposed portions of the terminal fittings drawn from the back wall 13.

  Further, the height of each fixing portion 19 is raised from the position of the lower surface of the housing 11 to the position near the upper surface of the housing 11, thereby increasing the screwing amount of the screw, and the housing with respect to the substrate 18. The fixing force of 11 is further increased.

  According to this reference example, since the fixing force of the housing 11 to the substrate 18 is increased, the housing 11 is forcibly suppressed from being displaced in the height direction due to thermal expansion. The housing 11 can be reliably prevented from being lifted, and as a result, the solder connection state of the terminal fitting can be maintained well.

< Reference Example 3 >
Next, Reference Example 3 will be described with reference to FIG. The reference example 3 is different from the reference example 1 in the solder height with respect to the end surface 24A of the board fixing portion 23 of the terminal fitting 20. Others are the same as those in Reference Example 1, and the same structural parts are denoted by the same reference numerals and redundant description is omitted.
In the case shown in FIG. 4A, the solder height in the board fixing portion 23 is substantially the same as the terminal thickness of the terminal fitting 20 excluding the thickness removing portion 24. In the case shown in FIG. 4B, the solder height in the substrate fixing portion 23 is located in the range of the height of the end face 24A and less than the terminal thickness.
In short, if the solder covers the entire end face 24A of the board fixing portion 23, the inspection pass determination is made, and if not, the inspection failure determination is made.

<Embodiment 1 >
Next, Embodiment 1 of the present invention will be described with reference to FIG. In the first embodiment, the relay portion 25A provided between the rear end of the terminal connection portion 21 and the front end of the housing mounting portion 22 is disposed within the thickness range of the back wall 13 of the fitting recess 12. It is different from the reference example 1 in that it includes a recess 30 into which the relay unit 25A enters.

By the way, a mating housing enters the inside of the fitting recess 12 so that both housings are fitted. According to the first embodiment, since the relay portion 25A enters the recess 30 of the back wall 13 and is disposed within the thickness range of the back wall 13, the mating housing interferes with the relay portion 25A. It becomes possible to enter into the fitting recess 12 without any change. As a result, when the two housings are properly fitted, the front of the mating housing can be set to abut against the front of the back wall 13 of the fitting recess 12.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) In Reference Example 1, the terminal fitting is mounted on the housing by press fitting. However, according to the present invention, the terminal fitting may be mounted on the housing by insert molding.
(2) In the reference example 1, the thinning portion is gradually reduced in thickness toward the end surface of the substrate fixing portion. According to the present invention, the thinning portion is provided at the end portion of the substrate fixing portion. As a result, the end face height of the substrate fixing portion is only required to be less than the prescribed solder height, and the shape of the thinned portion is arbitrary.
(3) According to the present invention, it is only necessary that a defined solder height is set to be equal to or higher than the end face height of the substrate fixing portion by forming the thinned portion at the end portion of the substrate fixing portion. The form of is arbitrary.

Sectional view of the board connector of Reference Example 1 Expanded cross-sectional view of the main part of the terminal bracket board fixing part The schematic perspective view which looked at the rear part of the board connector of the reference example 2 from diagonally upward The principal part expanded sectional view of the board | substrate fixed part of the terminal metal fitting of the reference example 3 . Sectional drawing of the board | substrate connector of Embodiment 1. FIG.

Explanation of symbols

10 ... Board connector 11 ... Housing
DESCRIPTION OF SYMBOLS 12 ... Fitting recessed part 13 ... Back wall 20 ... Terminal metal fitting 21 ... Terminal connection part 22 ... Housing mounting part 23 ... Board | substrate fixing | fixed part 24 ... Thinning part

Claims (2)

A connector housing and a terminal fitting to be mounted on the connector housing;
The terminal fitting includes a terminal connection portion connected to the mating terminal on one end side, and a substrate fixing portion connected to the substrate by soldering on the other end side,
Solder adheres to the end surface of the substrate fixing portion, and by gradually increasing the thickness of the end portion of the substrate fixing portion, a prescribed solder height is set to be higher than the height of the end surface of the substrate fixing portion. The connector housing includes a fitting recess that can be mated with a mating connector housing, the terminal connecting portion is arranged to protrude inside the fitting recess, and the board fixing portion is the fitting recess. A housing mounting portion penetrating through the back wall of the fitting recess between the terminal connection portion and the board fixing portion of the terminal fitting, the housing mounting portion being provided between the terminal connection portion and the board fixing portion. The part is arranged at a position closer to the board than the terminal connection part with respect to the height position from the board, and the other end of the terminal connection part and one end of the housing mounting part are connected by a relay part, Inside Board connector, wherein a part is disposed within the thickness range of the back wall of the fitting recess. 2. The board connector according to claim 1, wherein the housing mounting portion penetrates the back wall of the fitting recess in a state where the housing mounting portion is horizontally arranged parallel to the surface of the board.

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