JP4400131B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device in which a main body and a substrate are electrically connected by bringing a substrate into contact with an electrode provided in the device main body.

Conventionally, various techniques for downsizing electronic devices such as printers have been developed. For example, in Patent Document 1, a control board is arranged along the paper introduction direction of a U-shaped guide plate that changes the paper conveyance path by 180 degrees, and a power board is arranged perpendicular to the control board, and the guide By disposing a large electronic component in a space opened from another portion formed between the curved portion of the plate and the power substrate, the printer device is miniaturized.
JP 2001-260472 A

  By the way, in the process of improving the performance and downsizing of electronic devices, the number of each electronic component to be mounted on the substrate and the number of electrodes to be connected to the electronic device main body has increased, or the arrangement density of each electronic component on the substrate has increased. There is a case. In such a case, if the electronic device is not accurately positioned at the time of mounting the substrate, there is a problem in that a contact failure occurs between the electrode on the substrate side and the electrode on the device body side, or electronic components on the substrate are damaged. Will occur.

  In particular, when the electrode on the electronic device body side or the electrode on the substrate is constituted by a protruding component such as a coil spring, the electrode (coil spring) is not attached unless the substrate is attached to the electronic device side along the protruding direction of the electrode. There is a high possibility that it will be distorted and damaged, or the connection between the electrodes will be poor.

  The present invention has been made in view of such problems, and in an electronic device in which one of the electrode of the electronic device body and the electrode of the substrate is a protruding electrode protruding toward the other electrode, the contact failure between the electrodes It is an object of the present invention to enable a substrate to be attached to an electronic device main body without causing the above.

  The electronic device according to claim 1, which has been made to achieve such an object, is in contact with the main body side electrode of the main body side electrode of the electronic device main body having the substrate mounting portion provided with the main body side electrode. A substrate having a substrate side electrode electrically connected to the main body side electrode. In this electronic device, either the main body side electrode or the substrate side electrode is directed toward the other electrode along the normal direction of the substrate in a state where the substrate is attached to the substrate mounting portion of the electronic device main body. It is comprised as a protruding salient electrode.

Also, the board mounting portion is used for guiding a protruding part protruding in the normal direction of the board among the parts mounted on the board to the electronic device main body side along the protruding direction of the protruding electrode when the board is mounted. A guide member is provided.
Further, the substrate mounting portion is a positioning portion that engages with the substrate while the substrate is guided by the guide member, and fixes the substrate at a predetermined position of the substrate mounting portion in a direction perpendicular to the normal direction of the substrate. Is provided. After the substrate is guided by the guide member, the substrate is attached to the substrate attachment portion so as to be fixed at a predetermined position by the positioning portion.

  According to the electronic device according to claim 1, configured as described above, the guide member guides the tall protruding component mounted on the substrate toward the electronic device main body along the protruding direction of the protruding electrode. The board can be attached correctly. That is, the main body side electrode and the substrate side electrode can be correctly brought into contact without damaging the salient electrode.

Therefore, according to the present invention (Claim 1), it is possible to prevent contact failure between the main body side electrode and the substrate side electrode, and to provide a highly reliable electronic device.
Further, according to this electronic apparatus, the substrate can be accurately positioned by the positioning unit after the substrate is guided to the approximately correct mounting position by the guide member.
In an electronic device not provided with a guide member, it takes time to engage the substrate with the positioning portion, and the assembly efficiency of the electronic device is poor. However, according to the present invention, the substrate is connected to the positioning portion by the guide member. Since it can guide to a matching position, a board | substrate can be correctly attached to an electronic device main body in a short time. Therefore, according to the present invention, the assembly efficiency of the electronic device is improved.
By the way, although only one guide member may be provided in the board mounting portion, it is preferable to provide a plurality of guide members. The electronic device according to claim 2 is characterized in that the guide member is provided corresponding to at least two of the plurality of protruding parts mounted on the substrate. In addition, when providing a plurality of guide members, it is necessary to provide a plurality of protruding parts protruding in the normal direction of the board on the board, but a plurality of protruding parts such as tall capacitors and transformers may be provided on the board. Since it is general, the present invention (Claim 2) can be applied to many substrates on which protruding components are mounted.

  In the electronic apparatus according to claim 2, which is configured as described above, since the plurality of guide members are provided, the substrate is less likely to swing when the substrate is mounted, and the substrate is more reliably moved along the protruding direction of the protruding electrode. Can be guided to the device body side. Therefore, according to this invention (Claim 2), the contact failure between the main body side electrode and the substrate side electrode can be prevented more reliably, and a highly reliable electronic device can be provided.

  In addition, in the case where a plurality of guide members are provided, the distance between projecting parts provided corresponding to the guide members may be set as described in claim 3. The electronic device according to claim 3, wherein at least two of the projecting parts provided corresponding to the guide member are on a rectangular substrate in plan view, and the distance is not less than half the length of the diagonal in the rectangle. Are provided separately.

  When the protruding component is provided as described in claim 3, the protruding component is guided by the guide member at two points away from the center of the substrate, so that the substrate is less likely to swing during mounting. Therefore, according to this invention (Claim 3), it is possible to more reliably prevent a contact failure between the main body side electrode and the substrate side electrode, and to provide a highly reliable electronic device. be able to.

  Further, the above-described guide member has a pair of facing surfaces that extend along the protruding direction of the protruding electrode and face each other with the protruding parts interposed therebetween, and the side surfaces of the protruding parts are the pair of facing surfaces. The projecting component may be guided to the electronic device main body side along the projecting direction of the projecting electrode. In the electronic device according to the second and third aspects, the guide members may be arranged so that the opposing surfaces of the guide members intersect the opposing surfaces of the other guide members.

  If each guide member has a configuration in which the protruding components are sandwiched between a pair of opposing surfaces and the protruding components are guided to the electronic device main body, the swing of the substrate is restricted in the normal direction of the opposing surfaces. For this reason, if the direction of the opposing surface of a guide member is set in a different direction with respect to other guide members, the swinging of the substrate in a plurality of directions is restricted according to the direction of each opposing surface. Therefore, according to the electronic device of the fourth aspect, when mounting the substrate, the substrate can be guided to the electronic device main body side in a correct state, and contact failure between the electrodes can be more reliably prevented. .

  Further, in the electronic device according to claim 5, the substrate includes a transformer as the protruding component, the power source voltage input from the external power source is converted into a high voltage by the transformer, and the high voltage is converted into the substrate side electrode. It is comprised as a high voltage | pressure board | substrate applied to an electronic device main body via, and the guide member is provided in the position corresponding to a transformer, and it was set as the structure which guides the transformer to the electronic device main body side. According to the electronic device of the fifth aspect, connection failure between the electrodes can be prevented when the high voltage substrate including the transformer is attached.

  In the electronic device according to claim 6, a heat sink for cooling the electronic component mounted on the board is provided on the board as the protruding component, and the guide member is provided at a position corresponding to the heat sink. The heat radiating plate is guided to the electronic device main body side. According to the electronic device of the sixth aspect, it is possible to prevent a connection failure between the electrodes from occurring at the time of mounting the substrate including the heat sink.

  In addition, in the electronic device according to claim 7, the salient electrode is constituted by a coil spring. When the salient electrode is constituted by a coil spring, if the substrate is not correctly attached along the axial direction of the coil spring (that is, the projecting direction of the coil spring), the spring is distorted and poor contact between the electrodes occurs. Therefore, when the present invention is applied to an electronic device in which the salient electrode is configured by a coil spring, the above-described effect is further exhibited.

The electronic device of claim 8, the positioning unit, the substrate is guided by the guide member, after the substrate side electrode is in contact with the body-side electrode, in which is a structure in which the substrate engages.

According to the thus constructed electronic apparatus, the substrate-side electrode it is possible to guide the substrate through the guide member until it contacts the body-side electrode to the electronic apparatus main body, the main body side electrode and the substrate-side electrode It is possible to reliably prevent contact failure between them. Further, since the substrate can be easily moved to the engagement position with the positioning portion, the substrate can be easily engaged with the positioning portion.

In addition, in the electronic device described above, a plurality of the positioning portions may be provided on the board mounting portion. The guide member may be provided as described in claim 9 with respect to the positioning portion.

In the electronic device according to the ninth aspect , at least one of the guide members is provided on the outer edge side of the substrate with respect to at least one of the positioning portions. In the thus configured electronic devices, the positioning portion is provided with a plurality of can be attached accurately substrate in place. In addition, since at least one of the guide members is on the outer edge side of the substrate with respect to the positioning portion, the substrate is difficult to swing, and the positioning portion and the substrate can be easily engaged.

  As described above, in the electronic device of the present invention, the substrate can be attached to the electronic device body without causing poor contact between the electrodes. Further, by using the guide member and the positioning portion, the substrate can be accurately attached to the electronic device main body in a short time, and the assembly efficiency is improved.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing the configuration of a laser printer 1 as an electronic apparatus to which the present invention is applied. FIG. 2 is a schematic sectional view of the laser printer 1.

  The laser printer 1 of this embodiment is detachably mounted on the bottom of the main casing 2 and holds a paper feed tray 6 for stacking and storing paper 3 and the paper 3 imaged by the laser printer 1. A paper discharge tray 46, a display unit 60 for displaying the status of the laser printer 1, an operation unit 61 for setting operation of the laser printer 1 and the like, and a power switch 63 which is a main switch of the laser printer 1. The laser printer 1 includes a feeder unit 4 for feeding the paper 3 and an image forming unit for forming a predetermined image on the fed paper 3 in the main body casing 2.

  The feeder unit 4 includes a paper feed tray 6, a paper pressing plate 7 provided in the paper feed tray 6, a paper feed roller 8 and a paper feed pad provided above one end of the paper feed tray 6. 9, paper dust removing rollers 10 and 11 provided on the downstream side in the conveyance direction of the paper 3 with respect to the paper feed roller 8, and downstream of the paper dust removal rollers 10 and 11 in the conveyance direction of the paper 3. A registration roller 12.

  The paper pressing plate 7 is swingably supported at the end far from the paper feed roller 8 so that the near end is movable in the vertical direction, and is not shown from the back side. It is biased upward by a spring. Therefore, the sheet pressing plate 7 is swung downward against the urging force of the spring with the end far from the sheet feeding roller 8 as a fulcrum as the amount of stacked sheets 3 increases.

  On the other hand, the paper feed roller 8 and the paper feed pad 9 are disposed so as to face each other, and the paper feed pad 9 is fed by a spring 13 disposed on the back side of itself (the paper feed pad 9). It is pressed to the roller 8 side. The uppermost sheet 3 on the sheet pressing plate 7 is pressed from the back side of the sheet pressing plate 7 toward the sheet feeding roller 8 by the above-described spring, and the sheet feeding roller 8 and the sheet feeding are rotated by the rotation of the sheet feeding roller 8. After being sandwiched between the pads 9, the sheets are fed one by one.

  The fed paper 3 is sent to the registration roller 12 after the paper dust is removed by the paper dust removing rollers 10 and 11. The registration roller 12 is composed of a pair of rollers, and sends the paper 3 to the image forming unit after a predetermined registration.

  The feeder unit 4 further includes a multi-purpose tray 14, a multi-purpose side feed roller 15 and a multi-purpose side feed pad 25 for feeding the sheets 3 stacked on the multi-purpose tray 14. Yes. The multi-purpose-side paper feed roller 15 and the multi-purpose-side paper feed pad 25 are disposed so as to face each other, and the multi-purpose-side paper feed pad 25 is disposed on the back side of the multi-purpose-side paper feed pad 25. The spring 25 a is pressed toward the multi-purpose side paper supply roller 15.

  The sheets 3 stacked on the multi-purpose tray 14 are sandwiched between the multi-purpose side feed roller 15 and the multi-purpose side feed pad 25 by the rotation of the multi-purpose side feed roller 15, and then each sheet 3. Paper is fed to

  Next, the image forming unit will be described. The image forming unit of this embodiment includes a scanner unit 16 as an exposure unit, a process unit 17 as a developing unit, a fixing device 18 and the like.

  The scanner unit 16 is provided at an upper portion in the main body casing 2 and includes a laser light emitting unit (not shown), a polygon mirror 19 that is rotationally driven, lenses 20, 21 and reflecting mirrors 22, 23, 24, and the like. The scanner unit 16 passes or reflects the laser beam emitted from the laser emitting section in the order of the polygon mirror 19, the lens 20, the reflecting mirror 22, the reflecting mirror 23, the lens 21, and the reflecting mirror 24 as indicated by a chain line. Then, the surface of the photosensitive drum 27 as a photosensitive member of the process unit 17 described later is irradiated.

  On the other hand, the process unit 17 is disposed below the scanner unit 16. A photosensitive drum 27, a developing cartridge 28, and a scorotron charger 29 are installed in a drum cartridge 26 that is detachably attached to the main body casing 2. , A transfer roller 30 and cleaning rollers 51a and 51b.

  The developing cartridge 28 is detachably attached to the drum cartridge 26, and includes a developing roller 31, a layer thickness regulating blade 32, a supply roller 33, a toner box 34, and the like.

  The toner box 34 is filled with toner, and this toner is agitated by rotation of an agitator 36 supported by a rotation shaft 35 provided at the center of the toner box 34, and is opened at a side portion of the toner box 34. The discharged toner supply port 37 discharges the toner. Note that a toner remaining amount detection window 38 is provided on the side wall of the toner box 34 and is cleaned by a cleaner 39 supported by the rotary shaft 35.

  Further, a supply roller 33 is disposed at a side position of the toner supply port 37 so as to be rotatable in the direction of the arrow (counterclockwise), and the developing roller 31 is in pressure contact with the supply roller 33. Arranged to be rotatable in the direction of the arrow (counterclockwise).

  The supply roller 33 has a metal roller shaft covered with a roller made of a conductive foam material. The developing roller 31 is covered with a roller made of a conductive rubber material having no magnetic characteristics on a metal roller shaft. More specifically, the roller portion of the developing roller 31 is coated with a fluorine-containing urethane rubber or silicon rubber coating layer on the surface of a roller body made of conductive urethane rubber or silicon rubber containing carbon fine particles. Is configured. A developing bias is applied to the developing roller 31 configured as described above.

  A layer thickness regulating blade 32 is disposed in the vicinity of the developing roller 31. The layer thickness regulating blade 32 includes a pressing portion having a semicircular cross section made of insulating silicone rubber at the tip of a blade body made of a metal leaf spring material, and the developing cartridge 28 near the developing roller 31. It is supported by. In this state, the pressing portion is pressed onto the developing roller 31 by the elastic force of the blade body.

  Incidentally, the toner discharged from the toner supply port 37 is supplied to the developing roller 31 by the rotation of the supplying roller 33, and at this time, the toner is positively frictionally charged between the supplying roller 33 and the developing roller 31. Further, the toner supplied to the developing roller 31 enters between the pressing portion of the layer thickness regulating blade 32 and the developing roller 31 as the developing roller 31 rotates, and is further sufficiently frictionally charged here. It is carried on the developing roller 31 as a thin layer having a constant thickness.

  On the other hand, the photosensitive drum 27 is disposed at a side position of the developing roller 31 so as to be rotatable in the arrow direction (clockwise) in a state of facing the developing roller 31. The photosensitive drum 27 has a positively chargeable photosensitive layer made of polycarbonate or the like on the surface portion, and is rotated by power from a main motor (not shown).

  The scorotron charger 29 is disposed above the photosensitive drum 27 with a predetermined distance from the photosensitive drum 27. The scorotron charger 29 is a positively charged scorotron charger that generates corona discharge from a charging wire such as tungsten, and uniformly charges the surface of the photosensitive drum 27 to a positive polarity.

  That is, the surface of the photosensitive drum 27 is first uniformly charged positively by the scorotron charger 29 as the photosensitive drum 27 rotates. Thereafter, the photosensitive drum 27 is exposed by high-speed scanning of the laser beam from the scanner unit 16. As a result, an electrostatic latent image based on predetermined image data is formed on the surface of the photosensitive drum 27.

  On the other hand, the positively charged toner carried on the developing roller 31 by the rotation of the developing roller 31 is an electrostatic latent image formed on the surface of the photosensitive drum 27 when it contacts the photosensitive drum 27, that is, the electrostatic latent image. The surface of the photosensitive drum 27 that is uniformly positively charged is supplied to an exposed portion exposed to a laser beam and having a lowered potential. Thereby, the electrostatic latent image is visualized.

  The transfer roller 30 is disposed below the photosensitive drum 27 so as to face the photosensitive drum 27, and is supported so as to be rotatable in the arrow direction (counterclockwise direction). The transfer roller 30 is formed by covering a metal roller shaft with a roller made of an ion conductive rubber material, and a transfer bias (transfer forward bias) is applied during transfer. Therefore, the visible image carried on the surface of the photosensitive drum 27 is transferred to the paper 3 while the paper 3 passes between the photosensitive drum 27 and the transfer roller 30.

  In addition, the fixing device 18 is disposed on the downstream side of the process unit 17, and is made of a metal heating roller 41, a pressing roller 42 that presses the heating roller 41, and the downstream side of the heating roller 41 and the pressing roller 42. A pair of conveying rollers 43 provided in the apparatus.

  The heating roller 41 includes a halogen lamp for heating. The toner transferred onto the paper 3 in the process unit 17 is heat-fixed while the paper 3 passes between the heating roller 41 and the pressing roller 42. Let Further, the sheet 3 on which the heat fixing process has been performed is transported to the paper discharge path 44 by the transport roller 43. Then, the sheet 3 sent to the paper discharge path 44 is sent to the paper discharge roller 45 and discharged onto the paper discharge tray 46.

  In addition, the laser printer 1 is provided with a reverse conveyance unit 47 for forming images on both sides of the paper 3. The reverse conveyance unit 47 includes a paper discharge roller 45, a reverse conveyance path 48, a flapper 49, and a plurality of reverse conveyance rollers 50.

  The paper discharge roller 45 includes a pair of rollers and is configured to be able to switch between forward rotation and reverse rotation. The paper discharge roller 45 rotates in the forward direction when the paper 3 is discharged onto the paper discharge tray 46. However, when the paper 3 is reversed, the paper discharge roller 45 once rotates in the forward direction and then rotates in the reverse direction.

  The reverse conveyance path 48 is provided along the vertical direction so that the sheet 3 can be conveyed from the paper discharge roller 45 to a plurality of reverse conveyance rollers 50 disposed below the image forming unit. The upstream end is disposed near the paper discharge roller 45, and the downstream end is disposed near the reverse conveyance roller 50.

  The flapper 49 is swingably provided at a branch portion between the paper discharge path 44 and the reverse conveyance path 48, and the conveyance direction of the paper 3 reversed by the paper discharge roller 45 by excitation or non-excitation of a solenoid (not shown). Is switched from the direction toward the paper discharge path 44 to the direction toward the reverse conveyance path 48.

  A plurality of reverse conveyance rollers 50 are provided in a substantially horizontal direction above the paper feed tray 6, and the most upstream reverse conveyance roller 50 is disposed near the rear end of the reverse conveyance path 48 and is most downstream. The reverse conveying roller 50 on the side is disposed below the registration roller 12.

  That is, in the case of duplex printing, when the sheet 3 having an image formed on one side is sent from the sheet discharge path 44 to the sheet discharge roller 45 by the transport roller 43, the sheet discharge roller 45 sandwiches the sheet 3 therebetween. In this state, the paper 3 is rotated forward, and once transported toward the outside (the discharge tray 46 side), most of the paper 3 is sent to the outside, and the rear end of the paper 3 is sandwiched between the paper discharge rollers 45. When this occurs, the forward rotation stops and the reverse rotation occurs.

  At this time, the flapper 49 switches the transport direction so that the paper 3 is transported to the reverse transport path 48 and transports the paper 3 to the reverse transport path 48 in a reverse direction. The flapper 49 is switched to the original state when the conveyance of the sheet 3 is completed.

  Next, the sheet 3 conveyed in the reverse direction to the reverse conveyance path 48 is conveyed to the reverse conveyance roller 50 and is sent from the reverse conveyance roller 50 to the registration roller 12. The paper 3 conveyed to the registration roller 12 is turned over and sent again to the image forming unit after a predetermined registration, whereby a predetermined image is formed on both sides of the paper 3.

  Although the schematic configuration of the laser printer 1 has been described above, the laser printer 1 includes a frame for configuring the paper transport path in the paper transport path from the downstream side of the paper dust removing roller 11 to the fixing unit 18. A transfer base 70 is provided. Below the transfer base 70, a plan view for converting a power supply voltage input from an external power source into a high voltage and applying the high voltage to each part of the process unit 17 via the electrodes S1 to S7. A rectangular high-voltage substrate 100 is fixed.

  FIG. 3 is a schematic perspective view of the transfer base 70, and FIG. 4 is a plan view of the transfer base 70 as viewed from below. In addition, FIG. 5A is a plan view illustrating a schematic configuration of the surface of the high-voltage substrate 100, and FIG. 5B is a block diagram illustrating a circuit configuration of the high-voltage substrate 100.

  As shown in FIG. 4, the transfer base 70 of this embodiment has a substrate mounting portion 71 having screw holes H1, H2, H3, H4, and H5 for fixing the high-pressure substrate 100 to the transfer base 70 by screwing. . The screw holes H1 to H5 are formed so that the axial direction thereof is perpendicular to the bottom surface of the transfer base 70, and the high-pressure substrate 100 is screwed by being perpendicular to the axial direction of the screw holes H1 to H5. It is stopped and fixed to the substrate mounting portion 71 of the transfer base 70.

  The substrate mounting portion 71 is electrically connected to the electrode S1 electrically connected to the scorotron charger 29 of the process unit 17, S2 electrically connected to the transfer roller 30, and the photosensitive drum 27. Connected electrode S3, electrode S4 electrically connected to cleaning roller 51a, electrode S5 electrically connected to cleaning roller 51b, electrode S6 electrically connected to developing roller 31, and scorotron An electrode S7 electrically connected to a grid (not shown) for converging the charging potential attached to the opening of the mold charger 29 to a constant value is provided.

  These electrodes S1 to S7 are formed by coil springs, and are located on the high voltage substrate 100 side (that is, the high voltage substrate 100) along the axial direction of the screw holes H1 to H5 (that is, the normal direction of the high voltage substrate 100 when the attachment is completed). Projecting toward the electrodes S11 to S17 of the substrate 100.

  In addition, the board mounting portion 71 includes transformers 111 and 112 that are components mounted on the high-voltage board 100 and protrude in the normal direction of the board when the high-voltage board 100 is mounted in the protruding direction of the electrodes S1 to S7. Ribs 81, 82, 83, 84, 85, 86 for guiding the transfer base 70 to the side are provided. The plurality of ribs 81 to 86 extend from the bottom surface of the transfer base 70 along the axial direction of the screw holes H1 to H5, and correspond to the two transformers 111 and 112 mounted on the high-voltage board 100, respectively. It is provided in the position to do. In FIG. 4, the arrangement positions of the transformers 111 and 112 and the high-voltage board 100 in the board attachment portion 71 are indicated by a one-dot chain line.

  In addition, the board mounting portion 71 is provided with convex bosses 91 and 92 for fixing the high-voltage board 100 at a predetermined position. The bosses 91, 92 are projected along the axial direction of the screw holes H 2, H 3, inserted into the positioning holes 141, 142 provided in the high voltage substrate 100, and engaged with the high pressure substrate 100, The high voltage substrate 100 is fixed in a direction perpendicular to the normal direction of the high voltage substrate 100.

  Note that the two bosses 91 and 92 are provided in the direction parallel to the short side of the high-voltage board 100 after attachment (the y direction in the drawing) and the ribs 85, 86. Are arranged so as to be parallel to the long side of the high-voltage substrate 100 (in other words, the x direction in the drawing, which is the longitudinal direction of the transfer base 70).

  That is, the ribs 81 to 84 are provided closer to one long side (one outer edge in the longitudinal direction) side of the high-voltage board 100 than the bosses 91 and 92, and the ribs 85 and 86 are closer to the high-voltage board 100 than the bosses 91 and 92. It is provided closer to the other long side (the other outer edge in the longitudinal direction).

  On the other hand, as shown in FIG. 5, the high-voltage board 100 includes a connector 101 to which a power supply voltage is input from an external power supply, transformers 111 and 112 that constitute a conversion circuit 110 for converting the input voltage to a high voltage, and the like. Electrodes 121, 122, 123, heat sink 131 for cooling electronic components 121, heat sink 133 for cooling electronic components 122, 123, and electrodes S 11 to S 17 electrically connected to each part of conversion circuit 110 Is provided.

  Note that since the configuration of the conversion circuit 110 is well known, description of the specific configuration is omitted, but the power supply voltage input from the external power supply through the connector 101 is transmitted to the process unit by the transformers 111 and 112. It is converted into a high voltage suitable for each part. The converted high voltage is applied to each part of the process unit through the electrodes S11 to S17 that are in contact with the electrodes S1 to S7 of the transfer base 70 and electrically connected to the corresponding electrodes S1 to S7.

  By the way, in the high voltage substrate 100, the transformers 111 and 112 are provided at two corners located diagonally to the high voltage substrate 100. The reason for this is that when the arrangement distance of the transformers 111 and 112 to be guided is as large as possible, the high-voltage board 100 does not swing during mounting, and the ribs 81 to 86 accurately bring the high-voltage board 100 to the normal line. This is because it can be guided in the direction.

  However, if the transformers 111 and 112 cannot be provided at the corners of the high-voltage board 100 due to the circuit configuration, the transformers 111 and 112 may be provided at least half the diagonal of the high-voltage board 100. I do not care. Moreover, it is not necessary to use the transformers 111 and 112 as guidance objects, and tall parts protruding from the high-voltage board 100 may be guided by the ribs 81 to 86. The arrangement of the ribs 81 to 86 can be variously changed according to the configuration of the substrate.

  Next, how the high voltage substrate 100 is attached to the transfer base 70 having the above-described configuration will be described. FIG. 6 is a cross-sectional view of the transfer base 70 taken along the line AA, showing the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. 7 is a BB cross-sectional view of the transfer base 70 showing the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. FIG. It is CC sectional drawing. FIG. 9 is a DD cross-sectional view of the transfer base 70 showing the positional relationship between the high-voltage substrate 100 and each portion of the transfer base 70 when the high-voltage substrate 100 is attached. It is EE sectional drawing of.

  When the high-voltage board 100 is attached, the high-voltage board 100 is located on the upper part of the guide portion provided corresponding to the transformer 112 constituted by the ribs 81 to 84, and the ribs 85 and 86 are used. It arrange | positions so that the transformer 111 may be located in the upper part of the guide part provided corresponding to the comprised transformer 111 (FIG. 6 (a), FIG. 7 (a), FIG. 8 (a), FIG. 9 (a) and FIG. 10 (a)).

  Thereafter, the high-voltage substrate 100 is conveyed toward the transfer base 70. When the high-voltage substrate 100 is conveyed toward the transfer base 70, the transformer 112 is surrounded by the ribs 81 to 84, and the transformer 111 is surrounded by the ribs 85 and 86. Thereafter, the transformer 112 is guided in the protruding direction of the electrode S2 by the ribs 81 to 84, and the transformer 111 is guided in the protruding direction of the electrode S1 by the ribs 85 and 65.

  That is, the guide portion constituted by the ribs 81 to 84 is a surface along the projecting direction of the electrode S2, and a pair of opposing surfaces (the ribs 81 facing the transformer 112 facing each other with the transformer 112 interposed therebetween). A surface 81a, a surface 82a of a rib 82 facing the transformer 112, and a surface 83a) of a rib 83, and enclosing the side surface of the transformer 112 with a pair of facing surfaces 81a, 82a, 83a. The container 112 is guided to the transfer base 70 side along the protruding direction of the electrode S2.

  On the other hand, the guide member constituted by the ribs 85 and 86 is a surface along the projecting direction of the electrode S1, and a pair of opposing surfaces (the ribs 85 facing the transformer 111) facing each other with the transformer 111 interposed therebetween. A surface 85a and a surface 86a of a rib 86 facing the transformer 111), and by surrounding the side surface of the transformer 111 with the pair of facing surfaces 85a and 86a, the transformer 111 is projected in the protruding direction of the electrode S1. Are guided to the transfer base 70 side.

  By this guidance, the positioning holes 141 and 142 provided in the high-voltage substrate 100 are carried to substantially correct positions (upper portions of the bosses 91 and 91 provided in the transfer base 70). Then, immediately before the positioning holes 141 and 142 are inserted into the bosses 91 and 92, the electrodes S11 to S17 provided on the high-voltage substrate 100 are respectively electrodes S1 to S1 provided corresponding to the transfer base 70. It contacts the tip of S7 (see FIG. 7B, FIG. 8B, and FIG. 10B).

  Thereafter, when the high-voltage substrate 100 is further conveyed toward the transfer base 70 while being guided by the ribs 81 to 86, the boss 91 is inserted into the hole 141 and the boss 92 is inserted into the hole 142. As a result, the high-voltage board 100 is engaged with the bosses 91 and 92, and is strictly positioned in a direction perpendicular to the normal line. At this time, the electrodes S1 to S7 contract and contract strongly with the electrodes S11 to S17.

  Then, when the high-voltage board 100 is carried to the lower ends of the bosses 91 and 92 (see FIGS. 6C, 7C, 8C, 9C, and 10C), The screw holes H1 to H5 communicate with the holes H11 to H15 of the high-pressure board 100, and screws (not shown) are inserted into the communicated spaces. Thereby, the high voltage substrate 100 and the transfer base 70 are screwed together.

  Although the laser printer 1 according to the present embodiment has been described above, according to the laser printer 1, the guide portion constituted by the ribs 81 to 84 and the guide portion constituted by the ribs 85 and 86 are high-pressure. In order to guide the transformers 111 and 112, which are tall projecting parts mounted on the substrate 100, to the transfer base 70 side along the projecting direction of the electrodes S1 to S7 which are projecting electrodes, the electrodes S1 to S1 on the printer main body side are provided. S7 and the electrodes S11 to S17 on the substrate side can be properly brought into contact with each other. Therefore, according to the present embodiment, it is possible to prevent a contact failure between the electrodes S1 to S7 and the electrodes S11 to S17 on the substrate side, and the electrodes S1 to S7 (coil springs) are distorted or damaged. Can be prevented.

  In particular, in this embodiment, the high-voltage substrate 100 is moved to the transfer base 70 side by the ribs 81 to 86 until the electrodes S11 to S17 come into contact with the electrodes S1 to S7 on the main body side and the high-voltage substrate 100 is positioned by the bosses 91 and 92. Since the guidance is provided, poor contact and the like can be reliably prevented.

  In addition, in this embodiment, the transformers 111 and 112 are provided apart by a distance equal to or longer than half the length of the diagonal line in the high-voltage board 100, and the ribs 81 to 86 are separated at two points away from the center of the high-voltage board 100. Therefore, it is possible to suppress the swing of the high-voltage board 100 during mounting.

  In the present embodiment, the transformers 111 are surrounded by the surfaces 85a, 86a of the ribs 85, 86 from both sides in the y direction, and the transformers 112 are arranged in the y direction by the surfaces 81a, 82a, 83a of the ribs 81-84. Is surrounded from both sides of the intersecting x direction and guides the transformers 111 and 112, so that the swinging of the high-voltage board 100 during mounting is further restricted.

  Therefore, according to the present embodiment, the high voltage substrate 100 can be guided to the printer main body side in a correct state (that is, in a state perpendicular to the electrodes S1 to S7) when mounting the substrate, easily and reliably. The electrodes S1 to S7 on the main body side and the electrodes S11 to S17 on the substrate side can be properly brought into electrical contact with each other.

  In the present embodiment, the ribs 81 to 86 are used to guide the holes 141 and 142 of the high-voltage board 100 to the upper portions of the bosses 91 and 92 provided in the board mounting portion 71. High-precision positioning using can be performed easily and quickly. Therefore, according to the present embodiment, the assembly efficiency of the laser printer 1 is improved.

  In particular, in the present embodiment, the guide portion constituted by the ribs 81 to 84 and the guide portion constituted by the ribs 85 and 86 are located on the outer edge side of the high-pressure board 100 from the bosses 91 and 92. The substrate 100 is less likely to swing, and the high-pressure substrate 100 and the bosses 91 and 92 can be easily engaged.

  By the way, in addition to the ribs 81 to 86, the board mounting portion 71 has ribs for guiding the heat radiating plate 133 toward the transfer base 70 along the protruding direction of the electrodes S1 to S7 at positions corresponding to the heat radiating plate 133. 211, 212 may be provided, or ribs 213, 214 for guiding the heat radiating plate 131 to the transfer base 70 side along the protruding direction of the electrodes S1 to S7 may be provided at positions corresponding to the heat radiating plate 131. Good.

  FIG. 11 is a plan view illustrating a configuration of a transfer base 70 ′ according to a modification in which ribs 211 to 214 are provided on the substrate mounting portion 71. The ribs 211 and 212 are extended in the protruding direction of the electrodes S1 to S7, and surround the heat sink 133 for cooling the electronic components 122 and 123 mounted on the high-voltage board 100 from both sides in the x direction.

  That is, the rib 211 is a surface along the protruding direction of the electrodes S <b> 1 to S <b> 7, and has a surface parallel to the y direction facing the other rib 212 through the heat dissipation plate 133, and the electrode S <b> 1 of the rib 212. The heat radiating plate 133 is accommodated between the surfaces along the surfaces S7 to S7, and the heat radiating plate 133 is guided to the transfer base 70 side along the directions of the electrodes S1 to S7.

  On the other hand, the ribs 213 and 214 are provided so as to intersect with the ribs 211 and 212. The ribs 213 and 214 are extended in the protruding direction of the electrodes S1 to S7, and surround the heat sink 131 for cooling the electronic component 121 mounted on the high-voltage board 100 from both sides in the y direction.

  That is, the rib 213 is a surface along the projecting direction of the electrodes S1 to S7 and has a surface parallel to the x direction facing the other rib 214 via the heat dissipating plate 131, and the electrode S1 of the rib 214. The heat radiating plate 131 is accommodated between the surfaces along the lines S7 to S7, and the heat radiating plate 131 is guided to the transfer base 70 side along the directions of the electrodes S1 to S7.

  According to the transfer base 70 ′ of the modification, the ribs 211 to 214 are provided for the heat sinks 131 and 133, respectively. Therefore, the electrodes S <b> 1 to S <b> 7 and the corresponding high-voltage substrate 100 side are more accurately provided. The electrodes S11 to S17 can be brought into contact with each other. In addition, the same effects as in the above embodiment can be obtained.

  The positioning portion of the present invention corresponds to the bosses 91 and 92. Moreover, the electronic apparatus of the present invention is not limited to the above-described embodiments, and can take various forms. For example, the present invention is not limited to the laser printer 1 and can be applied to various types of electronic devices. Further, the mounting parts of the board guided by the ribs are not limited to the transformers 111 and 112 and the heat sinks 131 and 133, and various types such as capacitors can be considered.

  In addition, in the said Example, although the electrodes S1-S7 of the board | substrate attachment part 71 were comprised with the coil spring, you may comprise the electrodes S11-S17 of the high voltage board | substrate 100 with a coil spring. In that case, the electrodes S <b> 1 to S <b> 7 of the substrate mounting portion 71 may be made flat like the electrodes of the high-voltage substrate 100 in the above embodiment.

  In the above embodiment, the high voltage substrate 100 is fixed to the substrate mounting portion 71 by screwing. However, a claw is formed on the substrate mounting portion 71 or the high voltage substrate 100, and the high pressure substrate 100 is attached to the substrate mounting portion by the claw. You may make it fix to 71.

1 is a schematic perspective view illustrating a configuration of a laser printer 1 to which the present invention is applied. 1 is a schematic cross-sectional view illustrating a configuration of a laser printer 1. 3 is a schematic perspective view illustrating a configuration of a transfer base 70. FIG. FIG. 3 is a plan view of a transfer base 70 as viewed from below. FIG. 2 is a plan view (a) showing a schematic configuration of the surface of the high-voltage board 100 and a block diagram (b) showing a circuit configuration of the high-voltage board 100. FIG. 4 is a cross-sectional view of the transfer base 70 taken along the line AA, showing the positional relationship between the high voltage substrate 100 and each part of the transfer base 70 when the high voltage substrate 100 is attached. FIG. 4 is a cross-sectional view of the transfer base 70 taken along the line B-B showing the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. FIG. FIG. 6 is a cross-sectional view of the transfer base 70 taken along the line C-C showing the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. FIG. 4 is a DD cross-sectional view of the transfer base 70 showing stepwise the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. 4 is a cross-sectional view of the transfer base 70 taken along the line E-E showing the positional relationship between the high-voltage substrate 100 and each part of the transfer base 70 when the high-voltage substrate 100 is attached. FIG. FIG. 9 is a plan view illustrating a configuration of a transfer base 70 ′ according to a modified example in which ribs 211 to 214 are provided on a substrate mounting portion 71.

DESCRIPTION OF SYMBOLS 1 ... Laser printer, 2 ... Main body casing, 4 ... Feeder part, 6 ... Paper feed tray, 7 ... Paper press plate, 8 ... Paper feed roller, 10, 11 ... Paper dust removal roller, 12 ... Registration roller, 16 ... Scanner Unit: 17 ... Process unit 18 ... Fixing device 26 ... Drum cartridge 27 ... Photosensitive drum 28 ... Developing cartridge 29 ... Scorotron charger 30 ... Transfer roller 31 ... Developing roller 32 ... Layer thickness regulating blade 33 ... Supply roller, 34 ... Toner box, 36 ... Agitator, 37 ... Toner supply port, 41 ... Heating roller, 42 ... Pressing roller, 43 ... Conveying roller, 44 ... Discharge path, 45 ... Discharge roller, 46 ... Paper discharge tray, 51a, 51b ... cleaning roller, 70, 70 '... transfer base, 71 ... substrate mounting portion, 81-86, 211-214 ... , 81a, 82a, 83a, 85a, 86a ... opposing surfaces, 91, 92 ... boss, 100 ... high voltage substrate, 101 ... connector, 110 ... conversion circuit, 111, 112 ... transformer, 121-123 ... electronic component, 131, 133 ... Radiating plate, 141, 142, H11-H15 ... Hole, H1-H5 ... Screw hole, S1-S7, S11-S17 ... Electrode

Claims (9)

An electronic device body having a substrate mounting portion provided with a body side electrode;
A substrate having a substrate-side electrode electrically connected to the body-side electrode by contacting the body-side electrode; and
One of the main body side electrode and the substrate side electrode is directed toward the other electrode along the normal direction of the substrate in a state where the substrate is attached to the substrate mounting portion of the electronic device main body. An electronic device configured as a protruding salient electrode,
Among the components mounted on the substrate, a protruding component that protrudes in the normal direction of the substrate is attached to the electronic device main body side along the protruding direction of the protruding electrode. guide members for guiding the provided et al is,
Further, the substrate mounting portion engages with the substrate in a state where the substrate is guided by the guide member, and the substrate is mounted on the substrate mounting portion in a direction perpendicular to the normal direction of the substrate. A positioning part that is fixed in place is provided,
2. The electronic apparatus according to claim 1, wherein the substrate is attached to the substrate attachment portion so as to be fixed at a predetermined position by the positioning portion after being guided by the guide member . The substrate is provided with a plurality of protruding parts protruding in the normal direction of the substrate,
The electronic apparatus according to claim 1, wherein the guide member is provided corresponding to at least two of the plurality of projecting parts mounted on the substrate.   At least two of the projecting parts provided with the guide members are provided on the substrate having a rectangular shape in plan view and separated by a distance equal to or more than half the length of the diagonal line in the rectangle. The electronic device according to claim 2, wherein Each of the guide members has a pair of facing surfaces that are along the protruding direction of the protruding electrode and face each other with the protruding component interposed therebetween, and the side surfaces of the protruding component at the pair of facing surfaces Is configured to guide the protruding component to the electronic device main body side along the protruding direction of the protruding electrode,
The electronic device according to claim 2, wherein the facing surface of each guide member is disposed so as to intersect the facing surface of another guide member. The board includes a transformer as the projecting part, converts a power supply voltage input from an external power source into a high voltage by the transformer, and the high voltage is converted into the electronic device main body through the board-side electrode. A high-pressure substrate to be applied to
The said guide member is provided in the position corresponding to the said transformer, and is set as the structure which guides this transformer to the said electronic device main body side, The Claim 1 characterized by the above-mentioned. Electronic equipment. The board is provided with a heat radiating plate for cooling an electronic component mounted on the board as the protruding part,
The said guide member is provided in the position corresponding to the said heat sink, It is comprised by the structure which guides this heat sink to the said electronic device main body side, The Claim 1 characterized by the above-mentioned. Electronic equipment.   The electronic device according to claim 1, wherein the salient electrode is formed by a coil spring. The positioning portion, the substrate is guided by the guide member, after the substrate side electrode is in contact with the body-side electrode, claims 1, characterized in that it is in the configuration of the substrate engaging Item 8. The electronic device according to any one of Items 7 . The board mounting portion includes a plurality of the positioning portions,
The electronic device according to claim 1 , wherein at least one of the guide members is provided on the outer edge side of the substrate with respect to at least one of the positioning portions.

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