JP4396623B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a main circuit unit including a semiconductor module that constitutes a part of a power conversion circuit, and a control circuit unit that controls the semiconductor module.

  For example, in a hybrid vehicle having both an internal combustion engine and an electric motor as a drive source, and other vehicles having an electric motor as a drive source, a large-capacity inverter that performs bidirectional conversion between DC power and AC power is required. And Therefore, various power converters including this inverter have been developed.

The power conversion apparatus includes a main circuit unit configured using a semiconductor module including an IGBT element and the like, and a control circuit unit that controls the semiconductor module. The power converter is provided with a connector for supplying control power to the control circuit unit, and the connector is connected to the control circuit unit via connection wiring such as a cable.
And in order to achieve size reduction of a power converter, it is necessary to store these components in a case compactly. At this time, there is a case where the connection wiring has to be routed so as to pass through the vicinity of the main circuit portion.

However, the main circuit section easily generates electromagnetic noise because a large current flows and the on / off switching of the current is performed violently. On the other hand, if electromagnetic noise affects the connection wiring connecting the connector and the control circuit unit, there is a risk of causing problems such as malfunction of the control circuit unit.
Therefore, as described above, if the connection wiring is wired so as to pass through the vicinity of the main circuit unit, it may be difficult to ensure the normal operation of the control circuit unit.

JP 2005-073374 A

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a power converter that can ensure a normal operation of a control circuit unit and can be easily downsized.

The present invention controls a semiconductor module electrically connected to a main circuit portion including a semiconductor module constituting a part of a power conversion circuit and a cooler for cooling the semiconductor module, and a signal terminal of the semiconductor module. A power conversion device having a control circuit unit and a connector for supplying control power to the control circuit unit,
Between the connection wiring for electrically connecting the connector and the control circuit unit and the main circuit unit, a shielding plate for shielding electromagnetic noise generated from the main circuit unit is disposed ,
The cooler includes a cooling pipe disposed so as to sandwich the semiconductor module from both sides, and the shielding plate is configured by a spring member for pressurizing the cooling pipe and the semiconductor module in the stacking direction. And
The shield plate made of the spring member is curved so that the center part is directed to the main circuit part side,
In the power converter, the connection wiring is arranged to pass between the inner wall of the case of the power converter and the curved portion of the shielding plate .

Next, the effects of the present invention will be described.
In the power converter, the shielding plate is disposed between the connection wiring and the main circuit unit. Thereby, the electromagnetic noise generated from the main circuit portion can be shielded by the shielding plate, and the electromagnetic noise can be prevented from affecting the connection wiring.
Since the connection wiring is a supply path of control power to the control circuit unit, if electromagnetic noise affects this part, there is a risk of hindering normal operation of the control circuit unit. Therefore, the normal operation of the control circuit unit can be ensured by blocking the influence of electromagnetic noise.

  Further, by providing the shielding plate between the connection wiring and the main circuit portion, the connection wiring can be routed in the vicinity of the main circuit portion, and the degree of design freedom is increased. be able to. Thereby, it becomes easy to achieve size reduction and space saving of the power converter.

  As described above, according to the present invention, it is possible to provide a power converter that can ensure normal operation of the control circuit unit and can be easily downsized.

  In the present invention (Claim 1), examples of the power converter include a DC-DC converter and an inverter. Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is power sources, such as an electric vehicle and a hybrid vehicle, for example.

Also, the connection wiring, arranged to pass between the inner wall and the shielding plate of the case of the power converter.
Thereby , the said connection wiring can make it difficult to be influenced also about the electromagnetic noise from components other than the said main circuit part in a power converter device.

Further, the cooler has a cooling pipe arranged so as to sandwich the semiconductor module from both sides, and the shielding plate is provided by a spring member for pressurizing the cooling pipe and the semiconductor module in the stacking direction. that has been configured.
Thereby, since the said spring member will also serve as the said shielding board, the number of parts of a power converter device can be decreased. Thereby, further size reduction and cost reduction of a power converter device can be aimed at.

A power converter according to an embodiment of the present invention will be described with reference to FIGS.
The power conversion device 1 of this example includes a main circuit unit 2 including a semiconductor module 2 that forms part of a power conversion circuit and a cooler 22 that cools the semiconductor module 21, and a signal terminal 211 of the semiconductor module 2. A control circuit unit 3 that is electrically connected to control the semiconductor module 21 and a connector 4 for supplying control power to the control circuit unit 3 are provided.
Between the connection wiring 5 for electrically connecting the connector 4 and the control circuit unit 3 and the main circuit unit 2, a shielding plate 6 for shielding electromagnetic noise generated from the main circuit unit 2 is disposed. is there.
The shielding plate 6 is made of a metal such as carbon tool steel (SK5).

Further, the connection wiring 5 is disposed so as to pass between the inner wall of the case 11 of the power conversion device 1 and the shielding plate 6.
The power conversion device 1 includes a main circuit portion 2 and a control circuit portion 3 in an aluminum case 11, and a connector 4 is attached to a side surface portion of the case 11. One end of the cable-like connection wiring 5 is connected to the connector 4, and the other end of the connection wiring 5 is connected to the control circuit unit 3 in the case 11.

  The connector 4 is arranged at a height position substantially equal to the main circuit portion 2, and a part of the case 11 is interposed between the connector 4 and the main circuit portion 2. In addition, the control circuit unit 3 is disposed above the main circuit unit 2. The connection wiring 5 once extends downward from the connector 4 and then passes upward through a portion inside the case 11 and on the side of the main circuit portion 2 to be connected to the control circuit portion 3.

The cooler 22 in the main circuit unit 2 includes a plurality of cooling pipes 221 arranged to sandwich the semiconductor module 21 from both sides. That is, the cooling pipes 221 and the semiconductor modules 21 are alternately stacked. Each cooling pipe 221 is provided with a refrigerant flow path (not shown) inside, and is configured to allow a cooling medium to flow therethrough. Further, as shown in FIG. 2, a bellows pipe 222 is arranged so as to connect both ends of the plurality of refrigerant pipes 221 and two header portions 223 are formed. In addition, a refrigerant inlet 224 and a refrigerant outlet 225 connected to a refrigerant pipe 221 arranged at one end of the cooler 22 are provided at the ends of the two header portions 223, respectively. .
Then, two semiconductor modules 21 are sandwiched between adjacent cooling pipes 221 in parallel.

A spring member 12 for pressurizing the semiconductor modules 21 and the cooling pipes 221 stacked in this manner in the stacking direction is disposed in the case 11. The spring member 12 constitutes the shielding plate 6.
As shown in FIG. 2, the spring member 12 is curved so that its central portion is directed toward the main circuit portion 2, and the two end portions of the spring member 12 are fixed to the two fixing pins 13 fixed in the case 11. Locked. And the spring member 12 is arrange | positioned in the center part in the state urged | biased so that the cooling pipe 221 and the semiconductor module 21 may be pressed on the lamination direction.
The connection wiring 5 passes between the spring member 12 (that is, the shielding plate 6) arranged in this way and the inner wall of the case 4.

Next, the function and effect of this example will be described.
In the power conversion device 1, a shielding plate 6 is disposed between the connection wiring 5 and the main circuit portion 2. Thereby, the electromagnetic noise generated from the main circuit unit 2 can be shielded by the shielding plate 6, and the electromagnetic noise can be prevented from affecting the connection wiring 5.
Since the connection wiring 5 is a supply path of control power to the control circuit unit 3, if this part is affected by electromagnetic noise, the normal operation of the control circuit unit 3 may be hindered. By blocking the influence of electromagnetic noise by the plate 6, the normal operation of the control circuit unit 3 can be ensured.

  Further, by providing the shielding plate 6 between the connection wiring 5 and the main circuit portion 2, it is possible to wire the connection wiring 5 so as to pass through the vicinity of the main circuit portion 2, and the degree of freedom in design is increased. Can be increased. Thereby, it becomes easy to achieve size reduction and space saving of the power converter device 1.

Further, the connection wiring 5 is arranged so as to pass between the inner wall of the case 11 of the power conversion device 1 and the shielding plate 6. Therefore, the connection wiring 5 can be made less susceptible to electromagnetic noise from components other than the main circuit unit 2 in the power conversion device 1.
Further, the shielding plate 6 is constituted by the spring member 12. That is, since the spring member 12 also serves as the shielding plate 6, the number of components of the power conversion device 1 can be reduced. Thereby, the further size reduction and cost reduction of the power converter device 1 can be achieved.

  As described above, according to this example, it is possible to provide a power converter that can ensure normal operation of the control circuit unit and can be easily downsized.

The partial cross section explanatory drawing of the power converter device in an Example. Sectional explanatory drawing equivalent to the AA arrow cross section of FIG. 1 in an Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power converter 11 Case 12 Spring member 2 Main circuit part 21 Semiconductor module 211 Signal terminal 22 Cooler 221 Cooling pipe 3 Control circuit part 4 Connector 5 Connection wiring 6 Shielding plate

Claims (1)

A main circuit unit including a semiconductor module constituting a part of the power conversion circuit and a cooler for cooling the semiconductor module; a control circuit unit electrically connected to a signal terminal of the semiconductor module to control the semiconductor module; A power converter having a connector for supplying control power to the control circuit unit,
Between the connection wiring for electrically connecting the connector and the control circuit unit and the main circuit unit, a shielding plate for shielding electromagnetic noise generated from the main circuit unit is disposed ,
The cooler includes a cooling pipe disposed so as to sandwich the semiconductor module from both sides, and the shielding plate is configured by a spring member for pressurizing the cooling pipe and the semiconductor module in the stacking direction. And
The shield plate made of the spring member is curved so that the center part is directed to the main circuit part side,
The power converter according to claim 1, wherein the connection wiring is disposed so as to pass between an inner wall of the case of the power converter and the curved portion of the shielding plate .

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