JP4395780B2 - Circuit board inspection equipment - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus for inspecting whether or not a terminal of an integrated circuit and a land formed on the circuit board are electrically joined to each other on a circuit board on which the integrated circuit is mounted.

  There is a circuit board inspection apparatus that inspects whether or not a terminal of an integrated circuit and a land formed on the circuit board are electrically joined to each other on a circuit board on which the integrated circuit is mounted. In such a circuit board inspection apparatus, a control signal is input to an input wiring related to a land to be electrically joined to an input terminal of the integrated circuit on the circuit board, and a response signal to the control signal is output to the output terminal of the integrated circuit Is detected from the output wiring associated with the lands to be electrically connected to each other, thereby inspecting whether or not the terminals of the integrated circuit and the lands formed on the circuit board are electrically connected. In recent years, there are cases where a large number of lands of output wirings on a circuit board are formed at a narrow pitch due to a demand for miniaturization of the circuit board. In this case, it is difficult to accurately contact the probe with the land associated with the output wiring. Therefore, a technique is known in which a thin plate-like probe having conductivity and an output wiring are brought into close contact with each other through an insulating film to electrostatically couple them (for example, see Patent Document 1). According to this, since it suffices to arrange the probe so as to face the plurality of output wirings, it is easy to install the probe at the time of inspection.

JP 2002-156417 A (FIG. 1)

  According to the technique described above, in order to detect a response signal from the output terminal, it is necessary to output the response signal sequentially from each output terminal related to the plurality of output wirings that are electrostatically coupled to the probe. The joint state with the terminal cannot be inspected at the same time. For this reason, when many output wirings are formed, it takes time for inspection.

  Accordingly, an object of the present invention is to provide a circuit board inspection apparatus capable of reducing the inspection time.

Means for Solving the Problems and Effects of the Invention

The circuit board inspection apparatus of the present invention is mounted with an integrated circuit having an input terminal to which a control signal is input and a plurality of output terminals for outputting a response signal based on the control signal input to the input terminal. A circuit board inspection apparatus for inspecting a circuit board on which a plurality of output wirings to be electrically connected to the plurality of output terminals are formed. And an input probe electrically connected to the input terminal, a control signal generating means for generating a control signal input from the input probe to the input terminal, and a plurality of output wirings each including two or more output wirings A detection device that detects the response signal for each output wiring group, and a determination unit that determines whether or not the output terminal and the output wiring are electrically joined based on a detection result of the detection device. ing. Said control signal generating means, from the plurality of the output terminals which belong to a common said output wiring group, respectively at different timings with have the same frequency, and the output terminals belonging to different said output wiring group together from generates a control signal such as the response signal is output the response signal to each other at the timing overlap in time with frequencies different from each other, wherein the sensing device is disposed over a plurality of said output wiring group And output from the output terminal to be electrically connected to the output wiring based on the control signal by electrostatic coupling with the output wiring included in each of the plurality of output wiring groups. response signal has a capacitive coupling probe input via the output lines, a plurality of the response input from the electrostatic coupling probe Signal detecting independently for each frequency.

  According to the present invention, when the control signal generating means generates a control signal such that response signals having different frequencies are output from a plurality of output terminals belonging to different output wiring groups, the sensing device is electrostatically coupled. A plurality of response signals having different frequencies input from the probe can be detected simultaneously. Thereby, a plurality of determination means can simultaneously determine whether or not the output wiring and the output terminal are electrically joined. For this reason, the inspection time of a circuit board can be shortened.

  In the present invention, it is preferable that the detection device further includes a plurality of filter circuits that allow only a signal in a frequency band included in a response signal input to the electrostatic coupling probe to pass. According to this, the detection device can detect a plurality of response signals having different frequencies with a simple configuration.

  In the present invention, it is preferable that the detection device further includes an amplification circuit that amplifies the signal intensity of the response signal input to the electrostatic coupling probe. According to this, since the response signal from the electrostatic coupling probe is amplified, the response signal can be reliably detected even if the response signal input to the electrostatic coupling probe is weak.

  Furthermore, in the present invention, it is preferable that the detection device further includes an integration circuit that outputs an integration value of a response signal input to the electrostatic coupling probe. According to this, since the response signal from the electrostatic coupling probe is integrated, the response signal can be reliably detected even when the response signal input to the electrostatic coupling probe is weak.

  In addition, in the present invention, a plurality of the detection devices may be provided. According to this, the inspection time of the circuit board can be further shortened.

In the present invention, the control signal generation means may generate a control signal such that response signals having different frequencies are output from the output terminals belonging to different output wiring groups at the same timing. preferable. According to this, the inspection time of the circuit board can be surely shortened according to the number of output wiring groups.

Furthermore, in the present invention, it is preferable that the plurality of output wirings belonging to the output wiring group have the same area of the region that is electrostatically coupled to the electrostatic coupling probe. According to this, the signal intensity of the response signal input to the electrostatic coupling probe is made uniform. In addition, in the present invention, the control signal generation unit may change the output wiring that constitutes the output wiring group every time the control signal is generated.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a schematic configuration diagram of a circuit board inspection apparatus according to a first embodiment of the present invention. FIG. 2 is a plan view of a COF (Chip On Film) to be inspected by the circuit board inspection apparatus 1. FIG. 3 is a partial cross-sectional view of the circuit board inspection apparatus 1 relating to line III-III shown in FIG. In the circuit board inspection apparatus 1, an input terminal 52a and an output terminal 52b of a driver IC (integrated circuit) 52 mounted on the COF 50 are electrically joined to a circuit input land 55 and a circuit output land 56 of the COF 50 corresponding thereto. This is to check whether or not As shown in FIG. 1, the circuit board inspection device 1 includes a base 2, an input probe 3, an electrostatic coupling probe 4, an insulating sheet 6, and a control device 10.

  As shown in FIG. 2, a COF 50 to be inspected includes a sheet base material 51 made of polyimide, a plurality of external input lands 53, a plurality of input wirings 54, a plurality of circuit input lands 55, a plurality of circuit output lands 56, The driver IC 52 is mounted on a flexible circuit board on which a large number of output wirings 57 and a large number of external output lands 58 are formed. The COF 50 is used for, for example, an inkjet head. In an inkjet head, a large number of pressure chambers communicating with nozzles from which ink droplets are ejected are formed, and a large number of individual electrodes are two-dimensionally arranged on piezoelectric elements that apply pressure to the pressure chambers. . Each individual electrode is disposed opposite to the corresponding pressure chamber, and the COF 50 is used to apply a driving voltage for driving the piezoelectric element to the individual electrode.

  The driver IC 52 is formed with a plurality of input terminals 52a arranged on the lower surface thereof and a large number of output terminals 52b arranged so as to face the input terminals 52a. Further, when a control signal is input to the plurality of input terminals 52a, the driver IC 52 outputs a response signal from the output terminal 52b determined by the input control signal. The number of output terminals 52b is larger than the number of input terminals 52a. Therefore, the output terminals 52b are arranged at a narrower pitch than the input terminals 52a.

  The external input land 53 receives a control signal input to the input terminal 52a, and is arranged in a staggered manner near one end (the lower end in FIG. 2) of the sheet base material 51. The circuit input land 55 is electrically joined to the input terminal 52a of the driver IC 52, and is arranged so as to face the external input land 53 in the vicinity of the center of the sheet base material 51 (the center in the vertical direction in FIG. 2). Has been. The input wiring 54 is for electrically connecting the external input land 53 and the circuit input land 55 corresponding thereto. The circuit output land 56 is electrically joined to the output terminal 52 b of the driver IC 52, and is arranged so as to face the circuit input land 55 in the vicinity of the center of the sheet base material 51. The external output land 58 is for outputting the response signal output from the output terminal 52b, and is arranged in a trapezoidal matrix near the other end (upper end in FIG. 2) of the sheet base material 51. The output wiring 57 electrically connects the circuit output land 56 and the external output land 58 corresponding thereto. In the present embodiment, as shown in FIG. 2, a plurality of external input lands 53, a plurality of circuit input lands 55 and input terminals 52a, a plurality of output terminals 52b and circuit output lands 56, and a plurality of external output lands 58 are provided. They are arranged in parallel rows.

  Thus, in the COF 50, since the circuit output lands 56 are arranged at a narrow pitch like the output terminals 52b, it is particularly determined whether or not the circuit output lands 56 and the output terminals 52b are electrically joined. Need to be inspected.

  Returning to FIG. 1, the base 2 is provided with a COF 50 to be inspected. The input probe 3 is connected to the external input land 53 of the COF 50, thereby inputting a control signal from the control device 10 to the external input land 53. The electrostatic coupling probe 4 is a conductive thin film having a rectangular shape, and a response signal output from the output terminal 52 b is input via the output wiring 57 by electrostatic coupling with all the output wirings 57 of the COF 50. Is done. The electrostatic coupling probe 4 is connected to the control device 10 via the coaxial cable 5. As shown in FIG. 3, the insulating sheet 6 is disposed between the output wiring 57 of the COF 50 installed on the base 2 and the electrostatic coupling probe 4. Thereby, the output wiring 57 of the COF 50 and the electrostatic coupling probe 4 are insulated, and the electrostatic coupling between the output wiring 57 and the electrostatic coupling probe 4 becomes possible.

  Next, the arrangement position of the electrostatic coupling probe 4 when inspecting the COF 50 will be described with reference to FIG. FIG. 4 is a diagram showing an arrangement position of the electrostatic coupling probe 4 when the COF 50 is inspected. In FIG. 4, for convenience of explanation, a region to be indicated by a broken line of the COF 50 is indicated by a solid line. As shown in FIG. 4, in the COF 50, two output wiring groups A1 and A2 including a plurality of adjacent output wirings 57 are formed. The electrostatic coupling probe 4 is arranged so that the longitudinal direction thereof is along the arrangement direction of the output wirings 57 so as to be electrostatically coupled to all the output wirings 57 belonging to the two output wiring groups A1 and A2. . Here, the areas of all the output wirings 57 that are electrostatically coupled to the electrostatic coupling probe 4 are the same.

  The control device 10 will be described with reference to FIG. FIG. 5 is a functional block diagram of the circuit board inspection apparatus 1. The control device 10 outputs a control signal from the input probe 3 and, based on the response signal output to the electrostatic coupling probe 4, a circuit input land 55 and a circuit output of the COF 50 corresponding to the input terminal 52a and the output terminal 52b. In addition to whether or not the land 56 is electrically joined, it is determined whether the connection state of the wiring from the external input land 53 to the electrostatic coupling probe 4 is good or bad. Further, as shown in FIG. 5, the control device 10 is connected to the PC 60. A user can operate the control device 10 via the PC 60.

  The control device 10 includes a control signal generation circuit (control signal generation means) 11, a driver IC drive power supply 12, two filter circuits 13a and 13b, two amplification circuits 14a and 14b, and two integration circuits 15a and 15b. And a determination circuit (determination means) 16. The control signal generation circuit 11 is connected to the input probe 3 and is input from the input probe 3 to the plurality of input terminals 52 a of the driver IC 52 via the external input land 53, the input wiring 54, and the circuit input land 55 of the COF 50. A control signal is generated. When the control signal generated by the control signal generation circuit 11 is input to the input terminal 52a of the driver IC 52, a response signal having a frequency of 20 KHz is output from one of the output terminals 52b of the output terminal group A1, and the output terminal A response signal having a frequency of 40 KHz is output from one of the output terminals 52b of the group A2. In other words, the plurality of output terminals 52b belonging to the common output wiring groups A1 and A2 have the same frequency, are at different timings, and are output from the output terminals 52b related to the different output wiring groups A1 and A2. Response signals having different frequencies are output. The driver IC drive power supply 12 is a power supply circuit for driving the driver IC 52.

  The filter circuits 13 a and 13 b are connected to the electrostatic coupling probe 4 through the coaxial cable 5. The filter circuit 13a is a band-pass filter that passes a response signal mainly having a frequency of a predetermined width centered on 20 KHz among the response signals output to the electrostatic coupling probe 4, and the filter circuit 13b is mainly It is a band pass filter that passes a response signal having a frequency of a predetermined width centered on 40 KHz. That is, in the filter circuit 13a, the response signal having a frequency of 20 KHz output from the output terminal 52b related to the output wiring group A1 passes preferentially, and in the filter circuit 13b, the output terminal 52b related to the output wiring group A2 is passed. The response signal having a frequency of 40 KHz output from is preferentially passed. The response signals that have passed through the filter circuits 13a and 13b are output to the corresponding amplifier circuits 14a and 14b, respectively. The two amplifier circuits 14a and 14b amplify the signal intensity of the response signal input from the filter circuits 13a and 13b. The response signals amplified in the amplifier circuits 14a and 14b are output to the corresponding integrating circuits 15a and 15b, respectively. The two integrating circuits 15a and 15b integrate the response signals input from the amplifier circuits 14a and 14b. The response signal integrated in the amplifier circuits 14a and 14b is output to the determination circuit 16 as a response signal detection result.

  Here, the electrostatic coupling probe 4, the filter circuits 13a and 13b, the amplifier circuits 14a and 14b, and the integrating circuits 15a and 15b form a detection device 17. In the detection device 17, the amplification circuits 14a and 14b and the integration circuits 15a and 15b are connected in this order. However, the integration circuits 15a and 15b and the amplification circuits 14a and 14b may be connected in this order.

  The determination circuit 16 determines the circuit input land 55 and the circuit output of the COF 50 corresponding to the input terminal 52 a and the output terminal 52 b based on the content of the control signal generated by the control signal generation circuit 11 and the detection result from the detection device 17. In addition to whether or not the land 56 is electrically joined, it is determined whether the connection state of the wiring from the external input land 53 to the electrostatic coupling probe 4 is good or bad.

  The operation of the circuit board inspection apparatus 1 will be described with reference to FIG. FIG. 6 is a flowchart showing the operation of the circuit board inspection apparatus 1 when inspecting the COF 50. First, the input probe 3 is connected to the external input land 53 of the COF 50 installed on the base 2, and the electrostatic coupling probe 4 is electrostatically coupled to all the output wirings 57 belonging to the corresponding output wiring groups A1 and A2. It installs with the insulating sheet 6 so that it may be (refer FIG. 4).

  Then, when the inspection is started by the user operating the PC 60, as shown in FIG. 6, the process proceeds to step S101 (hereinafter abbreviated as S101. The other steps are the same), and the control signal generation circuit 11 A response signal having a frequency of 20 KHz is output from one of the multiple output terminals 52b related to the output wiring group A1, and 1 of the multiple output terminals 52b related to the output wiring group A2 is output at the same timing. A control signal is generated so that a response signal having a frequency of 40 KHz is output. The generated control signal is input to the external input land 53 of the COF 50 via the input probe 3. When the input terminal 52a and the circuit input land 55 corresponding to the input terminal 52a are electrically joined, a control signal is input from the input terminal 52a to the driver IC 52, and one output terminal related to the output wiring group A1. A response signal having a 20 KHz frequency is output from 52b, and a response signal having a 40 KHz frequency is output from one output terminal 52b of the output wiring group A2 at the same timing. Further, when the output terminal 52b from which the response signal is output and the circuit output land 56 corresponding to the output terminal 52b are electrically joined to each other, the output wiring 57 electrically joined from each of the output terminals 52b has a predetermined value. A response signal having the above signal strength is output. Then, a response signal having a frequency of 20 KHz from the output wiring 57 belonging to the output wiring group A1 is output to the electrostatic coupling probe 4, and a response signal having a frequency of 40 KHz from the output wiring 57 belonging to the output wiring group A2. Is output to the electrostatic coupling probe 4 of the detection device 17.

  Then, the process proceeds to S102, and in the detection device 17, a response signal having a frequency of 20 KHz and the vicinity thereof among the response signals output to the electrostatic coupling probe 4 passes through the filter circuit 13a, and the signal strength is increased by the amplifier circuit 14a. Is amplified and integrated by the integration circuit 15a to generate a detection result. The generated detection result is output to the determination circuit 16. Then, the process proceeds to S103, and the determination circuit 16 determines whether or not the signal strength of the response signal, which is the detection result output from the detection device 17, is equal to or higher than a predetermined value, and the input terminal 52a and the corresponding circuit. Whether or not the input land 55 is electrically joined, and whether or not the output terminal 52b related to the output wiring group A1 that has output the response signal and the corresponding circuit output land 56 are electrically joined. Determine whether or not.

  At the same time as the process proceeds to S102, the process proceeds to S104, and among the response signals output to the electrostatic coupling probe 4, the response signal having a frequency of 40 KHz and its vicinity passes through the filter circuit 13b and amplifies. The signal intensity is amplified by the circuit 14b and integrated by the integrating circuit 15b to generate a detection result. The generated detection result is output to the determination circuit 16. Then, the process proceeds to S105, where the determination circuit 16 determines whether or not the signal strength of the response signal, which is the detection result output from the detection device 17, is equal to or higher than a predetermined value, and the input terminal 52a and the corresponding circuit. Whether or not the input land 55 is electrically connected, and whether or not the output terminal 52b related to the output wiring group A2 that outputs the response signal and the corresponding circuit output land 56 are electrically connected. Determine whether or not.

  Thereafter, the process proceeds to S106, and it is determined whether or not there is a next output terminal 52b to be inspected related to the output wiring groups A1 and A2. If there is a next output terminal 52b to be inspected (S106: YES), the process proceeds to S101 again, and the above-described operation is repeated for the next output terminal 52b to be inspected. If there is no next output terminal 52b to be inspected (S106: NO), the inspection of the COF 50 is terminated.

  As described above, according to the present embodiment described above, the control signal generation circuit 11 has two responses having the same timing and different frequencies (20 KHz, 40 KHz) from the one output terminal 52b related to the output wiring groups A1 and A2. When a control signal that generates a signal is generated, the detection device 17 detects the two response signals simultaneously. Thus, the determination circuit 16 can simultaneously determine whether or not the output terminal 52b from which the response signal is output and the corresponding circuit output land 56 are electrically joined. For this reason, the inspection time of the COF 50 can be shortened.

  In addition, since the detection device 17 includes a filter circuit 13a that passes a response signal having a frequency of 20 KHz and the vicinity thereof, and a filter circuit 13b that passes a response signal having a frequency of 40 KHz and the vicinity thereof, the configuration is simple. Thus, two response signals having different frequencies can be detected simultaneously.

  Furthermore, since the detection device 17 includes amplification circuits 14a and 14b that amplify the signal intensity of the response signal and integration circuits 15a and 15b that integrate the response signal, the response signal input to the electrostatic coupling probe 4 is Even in a weak case, the response signal can be reliably detected.

  In addition, since the areas of the regions that are electrostatically coupled to the electrostatic coupling probe 4 in all the output wirings 57 are the same, the signal intensity of the response signal output to the electrostatic coupling probe 4 is uniformized. This makes it difficult for the determination circuit 16 to make an erroneous determination.

<Second Embodiment>
Next, a second embodiment according to the present invention will be described with reference to FIG. FIG. 7 is a functional block diagram of the circuit board inspection apparatus of the second embodiment. In addition, about the substantially same member and circuit as 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted. As shown in FIG. 7, the circuit board inspection device 101 includes two electrostatic coupling probes 104 a and 104 b and a control device 110. The control device 110 includes a control signal generation circuit 111, a driver IC drive power supply 12, four filter circuits 13a to 13d, four amplification circuits 14a to 14d, four integration circuits 15a to 15d, and a determination circuit 116. have. The electrostatic coupling probe 104a, the filter circuits 13a and 13b, the amplification circuits 14a and 14b, and the integration circuits 15a and 15b serve as the detection device 117a, the electrostatic coupling probe 4b, the filter circuits 13c and 13d, the amplification circuits 14c and 14d, and the integration. Circuits 15c and 15d form a detection device 117b, respectively. That is, the substrate inspection apparatus 101 has two detection devices 117a and 117b. Since the configurations and operations of the detection devices 117a and 117b are substantially the same as those of the detection device 17 of the first embodiment, the description thereof is omitted.

  Here, the arrangement positions of the electrostatic coupling probes 104a and 104b when inspecting the COF 50 will be described with reference to FIG. FIG. 8 is a diagram showing the arrangement positions of the electrostatic coupling probes 104a and 104b when the COF 50 is inspected. In FIG. 8, for convenience of explanation, a region to be indicated by a broken line of the COF 50 is indicated by a solid line. As shown in FIG. 8, in the COF 50, four output wiring groups B1 to B4 including a plurality of adjacent output wirings 57 are formed. The electrostatic coupling probe 104a is arranged so that its longitudinal direction is along the arrangement direction of the output wirings 57 so as to be electrostatically coupled to all the output wirings 57 belonging to the two output wiring groups B1 and B2. . The electrostatic coupling probe 104b is arranged so that its longitudinal direction is along the arrangement direction of the output wirings 57 so as to be electrostatically coupled to all the output wirings 57 belonging to the two output wiring groups B3 and B4. .

  When the inspection of the COF 50 is started, the control signal generation circuit 111 outputs a response signal having a frequency of 20 KHz from one of the output terminals 52b related to the output wiring groups B1 and B3 to the output wiring 57, which is the same as this. At the timing, a control signal is output so that a response signal having a frequency of 40 KHz is output to the output wiring 57 from one output terminal 52b related to each of the output wiring groups B2 and B4. Thereby, the detection device 117a outputs a response signal having a frequency of 20 KHz from the output wiring 57 belonging to the output wiring group B1 output to the electrostatic coupling probe 104a and 40 KHz from the output wiring 57 belonging to the output wiring group B2. And a response signal having a frequency of. At the same time, the detection device 117b outputs a response signal having a frequency of 20 KHz from the output wiring 57 belonging to the output wiring group B3 output to the electrostatic coupling probe 104b and the output wiring 57 belonging to the output wiring group B4. A response signal having a frequency of 40 KHz is detected and a detection result is generated. The determination circuit 116 is based on the contents of the control signal generated by the control signal generation circuit 111 and the detection results from the detection devices 117a and 117b, and the circuit input land 55 of the COF 50 corresponding to the input terminal 52a and the output terminal 52b. It is determined whether or not the circuit output land 56 is electrically joined.

  As described above, according to the present embodiment described above, since each of the detection devices 117a and 117b can simultaneously detect two response signals having different frequencies, the determination circuit 116 outputs a response signal. It is possible to simultaneously determine whether or not the output terminal 52b to be connected and the circuit output land 56 corresponding thereto are electrically connected. Thereby, the inspection time of the COF 50 can be further shortened.

  In addition, the determination circuit 116 can determine four response signals at the same time. Two electrostatic coupling probes 104a and 104b are used, and response signals having different frequencies are used between the adjacent output wiring groups B1 to B4. Is controlled so that is output.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various design changes can be made as long as they are described in the claims. For example, according to the first embodiment described above, the output wiring groups A1 and A2 are formed by the output wirings 57 adjacent to each other, but the output wiring group is formed by the output wirings 57 that are not adjacent to each other. Alternatively, every time the control signal generation circuit 11 generates a control signal, the output wiring 57 forming the output wiring group may change.

  Furthermore, according to the first embodiment described above, the control signal generation circuit 11 is different from each other at the same timing from one output terminal 52b related to the output wiring group A1 and one output terminal 52b related to the output wiring group A2. The control signal is generated so that a response signal having a frequency is output, but the control signal generation circuit has one output terminal 52b related to the output wiring group A1 and one output terminal 52b related to the output wiring group A2. The control signal may be generated so that the response signal is output at a different timing. In this case, it is preferable that part of the time during which each response signal is output overlap.

  In the second embodiment, the circuit board inspection apparatus 1 has the two detection devices 117a and 17b. However, the circuit board inspection device 1 may have three or more detection devices.

  Further, in the first and second embodiments, the detection devices 17, 117a, and 117b are configured to include the amplifier circuits 14a to 14d and the integration circuits 15a to 15d. It may be a configuration having only one of them.

1 is a schematic configuration diagram of a circuit board inspection apparatus according to a first embodiment of the present invention. It is a top view of COF used as the test object of the circuit board inspection apparatus shown in FIG. It is a fragmentary sectional view of the circuit board inspection apparatus regarding the III-III line shown in FIG. It is a figure which shows the arrangement position of the electrostatic coupling probe shown in FIG. It is a functional block diagram of the circuit board inspection apparatus shown in FIG. It is a flowchart which shows the action | operation of the circuit board inspection apparatus shown in FIG. It is a functional block diagram of the circuit board inspection apparatus of 2nd Embodiment which concerns on this invention. It is a figure which shows the arrangement position of the electrostatic coupling probe shown in FIG.

DESCRIPTION OF SYMBOLS 1,101 Circuit board inspection apparatus 3 Input probe 4, 104a, 104b Electrostatic coupling probe 5 Coaxial cable 6 Insulation sheet 10, 110 Control apparatus 11, 111 Control signal generation circuit 12 Drive power supply 13a-13d Filter circuit 14a-14d Amplifier circuit 15a to 15d Integration circuits 16, 116 Determination circuits 17, 117a, 117b Detector 50 COF
51 Sheet Base 52 Driver IC
52a input terminal 52b output terminal 53 external input land 54 input wiring 55 circuit input land 56 circuit output land 57 output wiring 58 external output land A1, A2 output wiring group B1-B4 output wiring group

Claims (8)

An integrated circuit having an input terminal to which a control signal is input and a plurality of output terminals for outputting a response signal based on the control signal input to the input terminal is mounted and electrically connected to the plurality of output terminals. A circuit board inspection apparatus for inspecting a circuit board on which a plurality of output wirings to be bonded are formed,
An input probe electrically connected to the input terminal;
Control signal generating means for generating a control signal input to the input terminal from the input probe;
A detection device, each of which detects the response signal for each of a plurality of output wiring group consisting of 2 or more of said output lines,
Determination means for determining whether or not the output terminal and the output wiring are electrically joined based on a detection result of the detection device;
Said control signal generating means, from the plurality of the output terminals which belong to a common said output wiring group, respectively at different timings with have the same frequency, and the output terminals belonging to different said output wiring group together From , generate a control signal such that the response signal is output at a timing when the response signals having different frequencies overlap each other in time ,
The detection device is disposed across the plurality of output wiring groups, and is electrically joined to the output wiring by electrostatically coupling with the output wirings included in the plurality of output wiring groups, respectively. Rubeki the response signal output based on the control signal from the output terminal has a capacitive coupling probe input via the output lines, a plurality of the input from the electrostatic coupling probe A circuit board inspection apparatus, wherein a response signal is detected independently for each frequency.   The circuit board inspection according to claim 1, wherein the detection device further includes a plurality of filter circuits that allow only signals in a frequency band included in a response signal input to the electrostatic coupling probe to pass therethrough. apparatus.   The circuit board inspection apparatus according to claim 1, wherein the detection device further includes an amplification circuit that amplifies the signal intensity of the response signal input to the electrostatic coupling probe.   The circuit board inspection apparatus according to claim 1, wherein the detection device further includes an integration circuit that outputs an integrated value of a response signal input to the electrostatic coupling probe. .   The circuit board inspection apparatus according to claim 1, comprising a plurality of the detection apparatuses. The control signal generating means generates a control signal that outputs response signals having different frequencies at the same timing from the output terminals belonging to the different output wiring groups. 5. The circuit board inspection apparatus according to any one of 5 above.   7. The plurality of output wirings belonging to the output wiring group have the same area of a region that is electrostatically coupled to the electrostatic coupling probe. 8. Circuit board inspection device. The circuit inspection apparatus according to claim 1, wherein the control signal generation unit changes the output wiring configuring the output wiring group every time the control signal is generated.

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