JP4390880B2 - Waste removal method in punching - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a scrap removal method for a punched portion in punching processing of paper, plastic sheets, and the like, and more particularly to a scrap removal method in punching processing for punching a small area.
[0002]
[Prior art]
Conventionally, it is impossible to remove the scraped portion after punching out a small area such as a circle with a diameter of about 5 mm or less with an automatic punching machine such as paper. ing. As another special punching method, there is a laser punching method.
[0003]
[Problems to be solved by the invention]
However, when manually removing the scraped portion after extracting a small area, the efficiency is low, mass production cannot be performed, and the cost is very high. Although the laser punching method is suitable for scrap removal of a small area, the present situation is that the production capacity and cost are extremely high.
[0004]
On the other hand, the present invention is simple and efficient in removing the scraped portion after punching a small area such as a circle having a diameter of about 5 mm or less and a polygon having a maximum diagonal of about 5 mm or less. Therefore, the present invention provides a scrap removing method in a punching process that can be performed at a relatively low cost.
[0005]
[Means for Solving the Problems]
As a result of studying to solve the above-described problems, the present invention applies separation paper to the printed surface after the release varnish is printed on the portion excluding the portion to be removed on the back surface of the substrate that needs to be removed. Forming a laminated body together, putting a half-cut blade into the layer of the base material from the surface of the base material of the laminated body, and then peeling the separated paper from the base material, thereby removing the base material. A scrap removal method in a punching process, characterized in that it is possible to remove punch scraps that are dropped portions from the base material.
[0006]
According to the present invention, in punching a base material, scraping processing of a punched portion after punching a small area, for example, a circular shape having a diameter of about 5 mm or less or a polygon having a maximum diagonal of about 5 mm or less is performed. It is simple, efficient, and therefore relatively inexpensive.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the scrap removal method in the punching process of the present invention will be described in detail with reference to the drawings.
[0008]
FIG. 1 is a diagram showing a material configuration of a laminated body at the time of punching in the scrap removing method in the punching process of the present invention. The laminate 10 includes a base material 11, a surface printing layer 12, a release varnish pattern printing layer 13, an adhesive layer 14, and a separate paper 15.
[0009]
Examples of the substrate applicable to the scrap removal method in the punching process include paperboard, processed paper, synthetic paper, plastic sheet, or a composite material thereof. Especially, it is suitable for scrap removal of the punching process of the shape of a small area in paperboard. The basis weight of the paperboard is in the range of 100 to 500 g / m ² are manufacturing preferred.
[0010]
The shape to be removed is not particularly limited, such as a circle, an ellipse, a rectangle, a triangle, and other polygons, but a shape having a maximum diameter of 10 mm or less is preferable for the scrap removal method of the present invention. Furthermore, a shape having a maximum diameter of 5 mm or less is preferable.
[0011]
First, printing of a picture, a display, etc. is performed on the surface of the substrate 11 to be punched, and the surface printing layer 12 is provided. Printing methods include known printing methods such as gravure printing, gravure offset printing, lithographic offset printing, dilitho printing, letterpress printing, intaglio printing, jet printing, silk screen printing, electrostatic printing, etc. Can be selected. The ink to be used is a known ink and is not particularly limited.
[0012]
Next, a peeling varnish is printed in a pattern on a portion 11b excluding the portion 11a to be removed from the back surface of the substrate 11. In this case, as shown in FIG. 2, in order to remove the character portions of A, B, and C, a peeling varnish is printed on a portion other than the characters of A, B, and C (shaded portion) (this portion). Peeling varnish pattern printing layer 13). The front and back printing may be performed by continuously printing the pattern and the release varnish as long as the front and back can be printed in a multicolor printing machine.
[0013]
Examples of the printing method include gravure printing, gravure offset printing, planographic offset printing, dilitho printing, letterpress printing, intaglio printing, jet printing, silk screen printing, electrostatic printing, and the like, which are known printing methods.
As the release varnish, for example, an ink mainly composed of silicone resin, polyethylene wax, nitrified cotton polyamide resin or the like, or an ink obtained by adding a silicone resin or a wax resin to a known ink corresponding to each printing method is used. be able to.
[0014]
Subsequently, the back surface of the substrate 11 and the separate paper 15 are bonded together. As a method of bonding the base material 11 and the separate paper 15, there are a method of laminating a polyethylene resin or the like and laminating it with the separate paper while extruding, or a method of bonding using an adhesive. As shown in FIG. 1, the base material 11 and the separate paper 15 are bonded to each other at a portion where the peeling varnish is not printed, that is, a portion 11a to be removed.
[0015]
As the separate paper 15, paper, processed paper, synthetic paper, plastic film, or the like can be used. This separate paper is preferably in the range of 50 to 150 g / m ² from the viewpoint of reducing costs, with a minimum required thickness.
[0016]
Adhesives include, for example, cellulose, polyvinyl acetate, polyacryl, polyolefin, polyester, polyamide, polyurethane, epoxy, amino resin, rubber, diene, etc. Adhesives such as a solvent type, an emulsion type, a hot melt type, and the like as a main component can be used.
[0017]
Next, punching is performed. In the punching machine, the laminated body 10 in which the separate paper 15 is bonded to the base material 11 is punched out. When punching, as shown in FIG. 3, half-cutting from the surface side of the substrate 11 is performed so that the half-cut blade penetrates only the portion of the substrate 11 and reaches the adhesive layer 14. Do not punch through. Ideally, the thickness of the adhesive layer 14 absorbs variations in the position at which the half-cut blade 16 arrives, and the half-cut blade 16 does not enter the separate paper 15. It is important that the half-cut blade 16 enters the surface layer of the partly separated paper 15 and penetrates the portion of the base material 11.
[0018]
Finally, after punching, as shown in FIG. 4, when the separation paper 15 is peeled off from the substrate 11, the portion where the release varnish is printed can be easily peeled off, while the removed portion 11a where the release varnish is not printed. Is adhered to the separate paper 15, so that the scrap can be removed at the same time as the separation paper 15 is peeled off.
[0019]
In the waste removal method in the punching process of the present invention formed as described above, a laminated body 10 in which the separate paper 15 is bonded to the base material 11 that needs to be removed is created, and the laminated body 10 is punched. After half-cutting, the separation paper 14 is peeled off, and at the same time, the removed portion can be easily and reliably removed as a scrap.
[0020]
【Example】
Next, the scrap removal method in the punching process of the present invention will be described more specifically with reference to examples.
[0021]
[Example 1]
First, a large number of patterns (multi-faceted) were printed by offset printing on the surface of a sheet of paper having a basis weight of 210 g / m ² (trade name: Pearl DX <made by Hokuetsu Paper Co., Ltd.>).
[0022]
Next, the peeling varnish was similarly applied by offset printing to the portion excluding the portion to be removed on the back surface. As the peeling varnish, a peeling OP varnish (trade name: UP-2 <manufactured by T & K TOKA>) was used.
[0023]
Next, using an acrylic resin emulsion adhesive with a coated paper with a basis weight of 150 g / m ² as the laminated paper on the back side of the substrate on which the pattern was printed on the front side and the release varnish was printed on the back side And pasted together.
[0024]
Next, the laminated body of this base material and laminated paper is punched out from the surface by half-cutting, so that the tip of the half-cut blade leaves the separate paper layer and reaches the adhesive layer. It was adjusted so that
[0025]
Furthermore, since the separate paper was peeled from the base material and the removed portion was adhered to the separate paper, the removed portion could be easily removed from the base material as a scrap.
[0026]
Finally, the substrate after the separation paper was peeled off was again punched in a punching process to produce a stencil card product as shown in FIG.
[0027]
【The invention's effect】
In punching of base materials such as paper and plastic sheets, since scrap removal after punching a small area such as a circle or polygon is performed manually, productivity is low. When the maximum diameter is 5 mm or less, the productivity of scrap removal processing is significantly reduced, and the cost is high.
According to the present invention, even in the punching of such a small area shape, the scraping process of the punched-out portion after punching is simple and efficient, and therefore the cost can be relatively low.
[Brief description of the drawings]
FIG. 1 is a diagram showing a material configuration of a laminate in a scrap removing method in a punching process of the present invention.
FIG. 2 is a partially enlarged view provided with a release varnish pattern printing layer for forming a laminate in the residue removing method in the punching process of the present invention.
FIG. 3 is a schematic cross-sectional view obtained by half-cutting a laminated body by a residue removing method in the punching process of the present invention.
FIG. 4 is a schematic cross-sectional view in which a separated paper is peeled off after half-cutting a laminated body by a residue removing method in the punching process of the present invention.
FIG. 5 is a perspective view showing a product created by a scrap removal method in the punching process of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Laminated body 11 Base material 12 Surface printing layer 13 Peeling varnish pattern printing layer 14 Adhesive layer 15 Separate paper 16 Half-cut blade

Claims (2)

A laminate is formed by attaching separate paper to the printed surface after the release varnish is printed on a portion excluding the portion to be removed on the back surface of the substrate that needs to be removed, and the surface of the substrate of the laminate After removing a half-cut blade from the base material layer, the separation paper is peeled off from the base material, so that the scraped portion of the base material can be removed from the base material. A waste removal method in a punching process characterized by the above. The scrap removal method in the punching process according to claim 1, wherein the maximum diameter of the shape of the dropout portion is 5 mm or less.

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