JP4388502B2

JP4388502B2 - Micro relay

Info

Publication number: JP4388502B2
Application number: JP2005133117A
Authority: JP
Inventors: 憲輝古本; 健橋本; 直樹奥村; 勝己垣本
Original assignee: Panasonic Corp; Matsushita Electric Works Ltd
Current assignee: Panasonic Corp; Panasonic Electric Works Co Ltd
Priority date: 2005-04-28
Filing date: 2005-04-28
Publication date: 2009-12-24
Anticipated expiration: 2025-04-28
Also published as: JP2006310175A

Description

本発明は、マイクロリレーに関するものである。 The present invention relates to a micro relay.

従来から、静電駆動型のマイクロリレーに比べて駆動力を大きくできるマイクロリレーとして、電磁石装置の電磁力を利用してアーマチュアを駆動し接点を開閉するようにしたマイクロリレーが知られている（例えば、特許文献１参照）。 2. Description of the Related Art Conventionally, as a microrelay that can increase the driving force compared to an electrostatically driven microrelay, a microrelay that uses an electromagnetic force of an electromagnet device to drive an armature to open and close a contact is known ( For example, see Patent Document 1).

特許文献１に記載されているマイクロリレーは、ガラス基板を加工してなるボディと、電磁石装置と、シリコン基板のような半導体基板を半導体微細加工プロセスにより加工することで形成されるアーマチュアブロックと、ガラス基板を加工してなるカバーとを備える。アーマチュアブロックは矩形枠状のフレーム部と、複数の支持ばねを介してフレーム部に揺動自在に支持されたアーマチュアとを有し、アーマチュアブロックを両側から挟むようにしてフレーム部をボディ及びカバーに陽極接合することでマイクロリレーが構成されている。ここで、陽極接合とは重ね合わせた基板を加熱してガラス側を軟化させると同時にシリコン側を陽極として両者の間に高電圧を印加することで電気的二重層を発生させ、静電引力により基板同士を接合する接合方法であって、可動イオンを含むガラスとシリコン基板を密着接合する方法として一般的に用いられている。
特開２００５−５０７６８号公報 The microrelay described in Patent Document 1 includes a body formed by processing a glass substrate, an electromagnet device, an armature block formed by processing a semiconductor substrate such as a silicon substrate by a semiconductor micromachining process, A cover formed by processing a glass substrate. The armature block has a rectangular frame-shaped frame part and an armature that is swingably supported by the frame part via a plurality of support springs, and the frame part is anodically bonded to the body and cover so that the armature block is sandwiched from both sides. Thus, a micro relay is configured. Here, anodic bonding heats the stacked substrates to soften the glass side, and at the same time generates a double layer by applying a high voltage between the two with the silicon side as the anode. It is a joining method for joining substrates, and is generally used as a method for tightly joining a glass containing movable ions and a silicon substrate.
JP-A-2005-50768

ところで、上記従来のマイクロリレーにおける可動接点及び固定接点は、一般的な接点材料（例えば、金、ニッケル、銅、クロムなどの合金）で形成されていたが、アーマチュアブロックとボディ及びカバーとの陽極接合時に加熱（通常は４００℃以上）されることで両接点の接触面が酸化してしまい、電気抵抗が増大してしまうという問題があった。 By the way, although the movable contact and the fixed contact in the conventional micro relay are formed of a general contact material (for example, an alloy such as gold, nickel, copper, chromium, etc.), the anode of the armature block, the body and the cover. Heating at the time of joining (usually 400 ° C. or higher) oxidizes the contact surfaces of both contacts, resulting in an increase in electrical resistance.

本発明は上記事情に鑑みてなされたものであり、製造時や使用時に高温環境に置かれても可動接点並びに固定接点の電気抵抗の増大を抑えることができるマイクロリレーを提供することにある。 The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a micro relay capable of suppressing an increase in electric resistance of a movable contact and a fixed contact even when placed in a high temperature environment at the time of manufacture or use.

請求項１の発明は、上記目的を達成するために、コイルへの励磁電流に応じて電磁力を発生する電磁石装置と、電磁石装置を収納する収納部が設けられ且つ厚み方向の一表面側に固定接点が設けられたボディと、ボディの前記一表面側に揺動自在に設けられ、電磁石装置の電磁力によって揺動するアーマチュアと、アーマチュアが揺動した際に固定接点と接離する可動接点とを備え、製造プロセスにおいて、可動接点が固着される可動接点基台部と可動接点との界面にクロムを介在させ、加熱することによって可動接点の可動接点基台部との界面近傍の部位にクロムを含有させており、可動接点並びに固定接点は、少なくとも相手方との接触面を含む先端部が金と銀の元素数の比率を１対３と１対２と３対５とから選択される比率とした金と銀の合金で形成され、且つ何れか一方の接点における前記先端部に白金族元素を含有することを特徴とする。 In order to achieve the above object, the invention according to claim 1 is provided with an electromagnet device that generates an electromagnetic force in response to an exciting current to the coil, and a housing portion that houses the electromagnet device, and is provided on one surface side in the thickness direction. A body provided with a fixed contact, an armature swingably provided on the one surface side of the body and swinging by the electromagnetic force of the electromagnet device, and a movable contact contacting and separating from the fixed contact when the armature swings In the manufacturing process, chromium is interposed at the interface between the movable contact base part to which the movable contact is fixed and the movable contact, and is heated to a part near the interface with the movable contact base part of the movable contact. Chromium is contained, and the movable contact and the fixed contact are selected from the ratio of the number of elements of gold and silver of 1 to 3, 1 to 2, and 3 to 5 at least including the contact surface with the counterpart. With gold as a ratio Is formed in the alloy, characterized in that it contains a platinum group element on the distal end of and one of the contacts.

請求項２の発明は、上記目的を達成するために、コイルへの励磁電流に応じて電磁力を発生する電磁石装置と、電磁石装置を収納する収納部が設けられ且つ厚み方向の一表面側に固定接点が設けられたボディと、ボディの前記一表面側に揺動自在に設けられ、電磁石装置の電磁力によって揺動するアーマチュアと、アーマチュアが揺動した際に固定接点と接離する可動接点とを備え、製造プロセスにおいて、可動接点が固着される可動接点基台部と可動接点との界面にクロムを介在させ、加熱することによって可動接点の可動接点基台部との界面近傍の部位にクロムを含有させており、可動接点並びに固定接点は、少なくとも相手方との接触面を含む先端部が金と銀の元素数の比率を１対３と１対２と３対５とから選択される比率とした金と銀の合金で形成され、且つ何れか一方の接点における前記先端部にコバルトを含有することを特徴とする。 In order to achieve the above object, the invention according to claim 2 is provided with an electromagnet device that generates an electromagnetic force in response to an exciting current to the coil, and a housing portion that houses the electromagnet device, and is provided on one surface side in the thickness direction. A body provided with a fixed contact, an armature swingably provided on the one surface side of the body and swinging by the electromagnetic force of the electromagnet device, and a movable contact contacting and separating from the fixed contact when the armature swings In the manufacturing process, chromium is interposed at the interface between the movable contact base part to which the movable contact is fixed and the movable contact, and is heated to a part near the interface with the movable contact base part of the movable contact. Chromium is contained, and the movable contact and the fixed contact are selected from the ratio of the number of elements of gold and silver of 1 to 3, 1 to 2, and 3 to 5 at least including the contact surface with the counterpart. With gold as a ratio Is formed in the alloy, characterized in that it contains the cobalt to the tip in and one of the contacts.

請求項３の発明は、上記目的を達成するために、コイルへの励磁電流に応じて電磁力を発生する電磁石装置と、電磁石装置を収納する収納部が設けられ且つ厚み方向の一表面側に固定接点が設けられたボディと、ボディの前記一表面側に揺動自在に設けられ、電磁石装置の電磁力によって揺動するアーマチュアと、アーマチュアが揺動した際に固定接点と接離する可動接点とを備え、製造プロセスにおいて、可動接点が固着される可動接点基台部と可動接点との界面にクロムを介在させ、加熱することによって可動接点の可動接点基台部との界面近傍の部位にクロムを含有させており、可動接点並びに固定接点は、少なくとも相手方との接触面を含む先端部が金と銀の元素数の比率を１対３と１対２と３対５とから選択される比率とした金と銀の合金で形成され、且つ両接点の前記先端部における金と銀の成分比率が互いに異なることを特徴とする。 In order to achieve the above object, the invention according to claim 3 is provided with an electromagnet device that generates an electromagnetic force in response to an exciting current to the coil, and a housing portion that houses the electromagnet device, and is provided on one surface side in the thickness direction. A body provided with a fixed contact, an armature swingably provided on the one surface side of the body and swinging by the electromagnetic force of the electromagnet device, and a movable contact contacting and separating from the fixed contact when the armature swings In the manufacturing process, chromium is interposed at the interface between the movable contact base part to which the movable contact is fixed and the movable contact, and is heated to a part near the interface with the movable contact base part of the movable contact. Chromium is contained, and the movable contact and the fixed contact are selected from the ratio of the number of elements of gold and silver of 1 to 3, 1 to 2, and 3 to 5 at least including the contact surface with the counterpart. With gold as a ratio It is formed in the alloy, and gold and component ratio of silver in the tip portions of the contacts are characterized in mutually different.

本発明によれば、金と銀の元素数の比率を１対３と１対２と３対５とから選択される比率とした金と銀の合金からなる可動接点並びに固定接点の接触面は酸化し難いため、製造時や使用時に高温環境に置かれても可動接点並びに固定接点の電気抵抗の増大を抑えることができ、しかも、可動接点又は固定接点の一方の先端部に白金族元素やコバルトを含有するか、あるいは両接点の前記先端部における金と銀の成分比率を互いに異ならせることにより、電気抵抗を低く保ったままで可動接点と固定接点の接離に伴う接点材料の転移とそれによって生じる接触不良が防止できる。 According to the present invention, the contact surfaces of the movable contact and the fixed contact made of an alloy of gold and silver with the ratio of the number of elements of gold and silver selected from 1: 3, 1: 2, and 3: 5 are: Because it is difficult to oxidize, it is possible to suppress an increase in the electric resistance of the movable contact and the fixed contact even when placed in a high temperature environment at the time of manufacture and use. By changing the component ratio of gold and silver at the tips of the two contacts to be different from each other by containing cobalt, the transfer of the contact material accompanying the contact / separation of the movable contact and the fixed contact while keeping the electric resistance low, and that It is possible to prevent contact failure caused by.

以下、図１〜図９を参照して本発明の実施形態を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

本実施形態のマイクロリレーは、シリコン基板をマイクロマシニング技術により加工して形成されるアーマチュア３０、アーマチュア３０により変位可能な可動接点３９、可動接点３９と接離する固定接点１４を、ボディ１とカバー４とアーマチュアブロック３で構成される密閉空間に収納し、電磁石装置２の電磁力でアーマチュア３０を駆動するものである。ボディ１は矩形板状のガラス基板からなり、厚み方向の一面側において長手方向の両端部それぞれに各一対の固定接点１４が設けられている。アーマチュアブロック３は、ボディ１の上記一表面側に固着される枠状（矩形枠状）のフレーム部３１と、フレーム部３１の内側に配置されて４本の支持ばね部３２を介してフレーム部３１に揺動自在に支持され、電磁石装置２が発生する電磁力により駆動されるアーマチュア３０と、アーマチュア３０にそれぞれ２本の接圧ばね部３５を介して支持されそれぞれ可動接点３９が設けられた２つの可動接点基台部３４とを有する。また、カバー４は矩形板状のガラス基板からなり、アーマチュアブロック３におけるボディ１とは反対側で周部がフレーム部３１に固着される。 The microrelay of this embodiment includes an armature 30 formed by processing a silicon substrate by a micromachining technique, a movable contact 39 that can be displaced by the armature 30, and a fixed contact 14 that contacts and separates from the movable contact 39. 4 and the armature block 3 are housed in a sealed space, and the armature 30 is driven by the electromagnetic force of the electromagnet device 2. The body 1 is made of a rectangular plate-like glass substrate, and a pair of fixed contacts 14 are provided on both ends in the longitudinal direction on one surface side in the thickness direction. The armature block 3 includes a frame-shaped (rectangular frame-shaped) frame portion 31 that is fixed to the one surface side of the body 1 and a frame portion that is disposed inside the frame portion 31 via four support spring portions 32. The armature 30 is swingably supported by the armature 31 and driven by the electromagnetic force generated by the electromagnet device 2, and the armature 30 is supported by two contact pressure spring portions 35, and the movable contact 39 is provided. And two movable contact bases 34. The cover 4 is made of a rectangular plate-shaped glass substrate, and the peripheral portion is fixed to the frame portion 31 on the side opposite to the body 1 in the armature block 3.

電磁石装置２はヨーク２０に巻回されたコイル２２，２２への励磁電流に応じて磁束を発生するものである。ヨーク２０は、２つのコイル２２，２２が直接巻回される細長の矩形板状のコイル巻回部２０ａと、コイル巻回部２０ａの長手方向の両端部それぞれからアーマチュア３０に近づく向きに延設されコイル２２，２２への励磁電流に応じて互いの先端面が異極に励磁される一対の脚片２０ｂ，２０ｂと、ヨーク２０の両脚片２０ｂ，２０ｂの間でコイル巻回部２０ａの長手方向の中央部に重ねて配置された矩形板状の永久磁石２１と、細長の矩形板状であってヨーク２０のコイル巻回部２０ａにおける永久磁石２１との対向面とは反対側でコイル巻回部２０ａと直交するようにコイル巻回部２０ａに固着されるプリント基板２３とを備えている。なお、ヨーク２０は、電磁軟鉄などの鉄板を曲げ加工あるいは鋳造加工することにより形成されており、両脚片２０ｂ，２０ｂの断面が矩形状に形成されている。 The electromagnet device 2 generates magnetic flux in accordance with the excitation current to the coils 22 and 22 wound around the yoke 20. The yoke 20 extends in the direction of approaching the armature 30 from both ends of the coil winding portion 20a in the longitudinal direction of the elongated rectangular plate and the coil winding portion 20a in which the two coils 22 and 22 are directly wound. The length of the coil winding portion 20a between the pair of leg pieces 20b, 20b and the leg pieces 20b, 20b of the yoke 20 whose opposite end surfaces are excited with different polarities according to the excitation current to the coils 22, 22 is determined. A rectangular plate-shaped permanent magnet 21 arranged in the center of the direction, and an elongated rectangular plate-shaped coil winding on the opposite side of the coil winding portion 20a of the yoke 20 from the surface facing the permanent magnet 21. And a printed circuit board 23 fixed to the coil winding part 20a so as to be orthogonal to the turning part 20a. The yoke 20 is formed by bending or casting an iron plate such as electromagnetic soft iron, and the cross sections of both leg pieces 20b and 20b are formed in a rectangular shape.

永久磁石２１は、コイル巻回部２０ａとの重ね方向（厚み方向）の両面それぞれの磁極面が異極に着磁されており、一方の磁極面がヨーク２０のコイル巻回部２０ａに当接し、他方の磁極面がヨーク２０の両脚片２０ｂ，２０ｂの先端面と同一平面上に位置するように厚み寸法を設定してある。 The permanent magnet 21 is magnetized so that the magnetic pole surfaces of both surfaces in the overlapping direction (thickness direction) with the coil winding portion 20 a are different from each other, and one magnetic pole surface abuts on the coil winding portion 20 a of the yoke 20. The thickness dimension is set so that the other magnetic pole surface is located on the same plane as the tip surfaces of the leg pieces 20b, 20b of the yoke 20.

また、各コイル２２，２２はそれぞれ、永久磁石２１とヨーク２０の脚片２０ｂ，２０ｂとによって長軸方向（つまり、コイル巻回部２０ａの長手方向）への移動が規制される。プリント基板２３は、絶縁基板２３ａの一表面における長手方向の両端部に導電パターン２３ｂが形成されており、各導電パターン２３ｂにおいて円形状に形成された部位が外部接続用電極を構成し、矩形状に形成された部位がコイル接続部を構成している。ここにおいて、コイル接続部には、コイル２２，２２の端末が接続されるが、コイル２２，２２は、外部接続用電極間に電源を接続してコイル２２，２２へ励磁電流を流したときにヨーク２０の両脚片２０ｂ，２０ｂの先端面が互いに異なる磁極となるように接続されている。なお、各導電パターン２３ｂにおける外部接続用電極には、導電性材料（例えば、Ａｕ，Ａｇ，Ｃｕ，半田など）からなるバンプ２４が適宜固着されるが、バンプ２４を固着する代わりに、ボンディングワイヤをボンディングしてもよい。 Further, the movement of the coils 22 and 22 in the major axis direction (that is, the longitudinal direction of the coil winding portion 20a) is restricted by the permanent magnet 21 and the leg pieces 20b and 20b of the yoke 20, respectively. In the printed circuit board 23, conductive patterns 23b are formed at both ends in the longitudinal direction on one surface of the insulating substrate 23a, and the circularly formed portions of the conductive patterns 23b constitute external connection electrodes, and are rectangular. The site | part formed in comprises the coil connection part. Here, the terminals of the coils 22 and 22 are connected to the coil connecting portion, but the coils 22 and 22 are connected when a power source is connected between the external connection electrodes and an excitation current is passed through the coils 22 and 22. The leg surfaces 20b, 20b of the yoke 20 are connected so that the tip surfaces of the leg pieces 20b, 20b are different from each other. Note that bumps 24 made of a conductive material (for example, Au, Ag, Cu, solder, etc.) are appropriately fixed to the external connection electrodes in each conductive pattern 23b. Instead of fixing the bumps 24, bonding wires are bonded. May be bonded.

ボディ１は耐熱ガラスにより形成されており、外周形状が矩形状であって、中央部には厚み方向に貫通し電磁石装置２を収納する収納孔１６が貫設され、四隅の各近傍と長手方向両端部の中央付近には厚み方向に貫通するスルーホール１０が貫設されている。また、ボディ１の厚み方向の両面であって各スルーホール１０それぞれの周縁にはランド１２が形成されている。ここに、ボディ１の厚み方向において重なるランド１２同士はスルーホール１０の内周面を導電性材料（例えば、Ｃｕ，Ｃｒ，Ｔｉ，Ｐｔ，Ｃｏ，Ｎｉ，Ａｕ，あるいはこれらの合金など）でめっきしてなるめっき層１０ａにより電気的に接続されている。また、ボディ１の厚み方向の他表面側の各ランド１２にはバンプ１３が適宜固着されており、バンプ１３をランド１２に固着することによって、ボディ１の上記他表面側ではスルーホール１０の開口面がバンプ１３により覆われる。スルーホール１０の開口面は円形状であって、ボディ１の上記一表面には、それぞれスルーホール１０の開口面を閉塞する導電パターン１８が設けられている。 The body 1 is made of heat-resistant glass, the outer peripheral shape is rectangular, and a storage hole 16 that penetrates in the thickness direction and stores the electromagnet device 2 penetrates in the center, and the vicinity of each of the four corners and the longitudinal direction A through hole 10 penetrating in the thickness direction is provided near the center of both end portions. Further, lands 12 are formed on both sides in the thickness direction of the body 1 and on the periphery of each through hole 10. Here, the lands 12 that overlap in the thickness direction of the body 1 are plated with a conductive material (for example, Cu, Cr, Ti, Pt, Co, Ni, Au, or an alloy thereof) on the inner peripheral surface of the through hole 10. It is electrically connected by the plating layer 10a formed. Further, bumps 13 are appropriately fixed to the lands 12 on the other surface side in the thickness direction of the body 1. By fixing the bumps 13 to the lands 12, the through holes 10 are opened on the other surface side of the body 1. The surface is covered with bumps 13. The opening surface of the through hole 10 is circular, and a conductive pattern 18 that closes the opening surface of the through hole 10 is provided on the one surface of the body 1.

また、上述の各一対の固定接点１４は、ボディ１の長手方向の両端部においてボディ１の短手方向に離間して形成された２つのスルーホール１０の間で上記短手方向に並設されており、上記短手方向両端のスルーホール１０の周縁に形成されたランド１２と導電パターン１８を介して電気的に接続されている。さらに、ボディ１の長手方向両端部における固定接点１４の近傍には、上記短手方向に沿った幅細形状であって中央のスルーホール１０の周縁に形成されたランド１２と接続された接地用導電パターン１８’が設けられており、中央のスルーホール１０も接地用導電パターン１８’によって閉塞されている。 Further, each of the pair of fixed contacts 14 described above is arranged in parallel in the short direction between two through-holes 10 that are spaced apart in the short direction of the body 1 at both ends in the longitudinal direction of the body 1. It is electrically connected to the lands 12 formed at the periphery of the through-holes 10 at both ends in the short-side direction via conductive patterns 18. Further, in the vicinity of the fixed contact 14 at both ends in the longitudinal direction of the body 1, the grounding is connected to a land 12 having a narrow shape along the short direction and formed at the periphery of the central through hole 10. A conductive pattern 18 'is provided, and the central through hole 10 is also closed by the grounding conductive pattern 18'.

また、収納孔１６の開口面は十字状であって、ボディ１の上記一表面側には、収納孔１６を閉塞するシリコン薄膜からなる蓋体１７が固着されている。すなわち、電磁石装置２は、ヨーク２０の両脚片２０ｂ，２０ｃの各先端面が蓋体１７と対向する形で収納孔１６に挿入される。なお、本実施形態では、収納孔１６の内周面と蓋体１７とで囲まれる空間が電磁石装置２を収納する収納部を構成しており、電磁石装置２は、永久磁石２１がボディ１の厚み寸法内でアーマチュア３０とヨーク２０とにより形成される磁路中に設けられ、プリント基板２３における絶縁基板２３ａの表面がボディ１の上記他表面と略面一となっている。 The opening surface of the storage hole 16 has a cross shape, and a lid 17 made of a silicon thin film that closes the storage hole 16 is fixed to the one surface side of the body 1. That is, the electromagnet device 2 is inserted into the storage hole 16 such that the front end surfaces of both leg pieces 20 b and 20 c of the yoke 20 face the lid body 17. In the present embodiment, the space surrounded by the inner peripheral surface of the storage hole 16 and the lid body 17 constitutes a storage unit that stores the electromagnet device 2, and the electromagnet device 2 includes the permanent magnet 21 of the body 1. Provided in the magnetic path formed by the armature 30 and the yoke 20 within the thickness dimension, the surface of the insulating substrate 23a in the printed circuit board 23 is substantially flush with the other surface of the body 1.

アーマチュアブロック３は、シリコン基板からなる半導体基板を半導体微細加工プロセスにより加工することによって、上述の矩形枠状のフレーム部３１と、上述の４本の支持ばね部３２と、フレーム部３１の内側に配置されアーマチュア３０の一部を構成する矩形板状の可動基台部３０ａと、上述の４本の接圧ばね３５と、上述の２つの可動接点基台部３４とを形成してあり、可動基台部３０ａと、可動基台部３０ａにおけるボディ１との対向面に固着された磁性体（例えば、軟鉄、電磁ステンレス、パーマロイなど）からなる矩形板状の磁性体部３０ｂとでアーマチュア３０を構成している。したがって、アーマチュア３０が４本の支持ばね部３２を介してフレーム部３１に揺動自在に支持されている。なお、可動基台部３０ａはフレーム部３１よりも薄肉であり、アーマチュア３０の厚み寸法は、アーマチュアブロック３とボディ１とを固着した状態においてアーマチュア３０の磁性体部３０ｂと蓋体１７との間に所定のギャップが形成されるように設定されている。 The armature block 3 is formed by processing a semiconductor substrate made of a silicon substrate by a semiconductor micromachining process so that the rectangular frame-shaped frame portion 31, the four support spring portions 32, and the frame portion 31 are placed inside the frame portion 31. A rectangular plate-shaped movable base 30a that is disposed and constitutes a part of the armature 30, the above-mentioned four contact pressure springs 35, and the above-mentioned two movable contact bases 34 are formed, and are movable. The armature 30 is composed of a base plate portion 30a and a rectangular plate-shaped magnetic body portion 30b made of a magnetic material (for example, soft iron, electromagnetic stainless steel, permalloy, etc.) fixed to the surface of the movable base portion 30a facing the body 1. It is composed. Therefore, the armature 30 is swingably supported by the frame portion 31 via the four support spring portions 32. The movable base portion 30a is thinner than the frame portion 31, and the thickness of the armature 30 is between the magnetic body portion 30b of the armature 30 and the lid body 17 in a state where the armature block 3 and the body 1 are fixed. Is set to form a predetermined gap.

上述の支持ばね部３２は、可動基台部３０ａの短手方向の両側面側で可動基台部３０ａの長手方向に離間して２箇所に形成されている。各支持ばね部３２は、一端部がフレーム部３１に連続一体に連結され他端部が可動基台部３０ａに連続一体に連結されている。なお、各支持ばね部３２は、平面形状において上記一端部と上記他端部との間の部位を同一面内で蛇行した形状に形成することにより長さ寸法を長くしてあり、アーマチュア３０が揺動する際に各支持ばね部３２にかかる応力を分散させることができ、各支持ばね部３２が破損するのを防止することができる。 The above-described support spring portions 32 are formed at two locations on both sides in the short direction of the movable base portion 30a so as to be separated from each other in the longitudinal direction of the movable base portion 30a. Each support spring portion 32 has one end portion connected to the frame portion 31 continuously and integrally, and the other end portion connected to the movable base portion 30a continuously and integrally. In addition, each support spring part 32 is lengthened by forming the site | part between the said one end part and the said other end part in the planar shape in the meandering shape in the same surface, and the armature 30 is made into the shape. It is possible to disperse the stress applied to each support spring portion 32 when swinging, and to prevent each support spring portion 32 from being damaged.

また、可動基台部３０ａは、短手方向の両側縁の中央部から矩形状の突片３６が連続一体に延設され、フレーム部３１の内周面において突片３６に対応する部位からも矩形状の突片３７が連続一体に延設されている。すなわち、可動基台部３０ａから延設された突片３６とフレーム部３１から延設された突片３７とは互いの先端面同士が対向している。ここに、可動基台部３０ａから延設された各突片３６の先端面には凸部３６ａが形成されており、フレーム部３１から延設された各突片３７の先端面には、凸部３６ａが入り込む凹部３７ａが形成されている。したがって、凸部３６ａが凹部３７ａの内周面に当接することでフレーム部３１の厚み方向に直交する面内におけるアーマチュア３０の移動が規制される。なお、アーマチュア３０の同一の側縁側に配設される２つの支持ばね部３２は、突片３６の両側に位置している。 In addition, the movable base portion 30a has a rectangular protruding piece 36 extending continuously and integrally from the center of both side edges in the lateral direction, and also from a portion corresponding to the protruding piece 36 on the inner peripheral surface of the frame portion 31. A rectangular projecting piece 37 is continuously extended. In other words, the projecting piece 36 extending from the movable base portion 30a and the projecting piece 37 extending from the frame portion 31 are opposed to each other at their front end surfaces. Here, a convex portion 36a is formed on the tip surface of each protruding piece 36 extending from the movable base portion 30a, and the protruding surface of each protruding piece 37 extended from the frame portion 31 is convex. A recess 37a into which the portion 36a enters is formed. Therefore, the movement of the armature 30 in the plane orthogonal to the thickness direction of the frame portion 31 is restricted by the convex portion 36a coming into contact with the inner peripheral surface of the concave portion 37a. The two support spring portions 32 disposed on the same side edge side of the armature 30 are located on both sides of the projecting piece 36.

また各突片３６におけるボディ１との対向面には支点突起４０がそれぞれ突設されており、これら一対の支点突起４０を設けることでアーマチュア３０の揺動動作をより安定させることができる。なお、ボディ１に当接する支点突起４０の先端部には、摩耗や割れあるいは欠けなどを低減するために、金属薄膜からなる保護膜４１が形成されている。 Further, fulcrum protrusions 40 are respectively provided on the surfaces of the protrusions 36 facing the body 1, and by providing the pair of fulcrum protrusions 40, the swinging motion of the armature 30 can be further stabilized. A protective film 41 made of a metal thin film is formed at the tip of the fulcrum protrusion 40 that contacts the body 1 in order to reduce wear, cracks, or chipping.

また、アーマチュアブロック３は、アーマチュア３０の長手方向においてアーマチュア３０の両端部とフレーム部３１との間にそれぞれ可動接点基台部３４が配置されており、各可動接点基台部３４におけるボディ１との対向面に導電性材料からなる可動接点３９が固着されている。ここに、可動接点基台部３４は上述の２本の接圧ばね部３５を介して可動基台部３０ａに支持されている。なお、可動基台部３０ａは上述のように矩形板状に形成されており、磁性体部３０ｂの変位量を制限するストッパ部３３が四隅それぞれから連続一体に延設されており、接圧ばね部３５の平面形状は、ストッパ部３３の外周縁の３辺に沿ったコ字状に形成されている。このストッパ部３３は、ボディ１の上記一表面と接触することにより磁性体部３０ｂの変位量を制限する。なお、アーマチュアブロック３は、上述の説明から分かるように、フレーム部３１、可動基台部３０ａ、支持ばね部３２、可動接点保持部３４、接圧ばね部３５が上述の半導体基板の一部により構成されている。また、カバー４は耐熱ガラスにより構成されており、アーマチュアブロック３との対向面にアーマチュア３０の揺動空間を確保する凹所(図示せず)が形成されている。 The armature block 3 has movable contact base portions 34 disposed between both end portions of the armature 30 and the frame portion 31 in the longitudinal direction of the armature 30, and the armature block 3 and the body 1 in each movable contact base portion 34. A movable contact 39 made of a conductive material is fixed to the opposite surface. Here, the movable contact base portion 34 is supported by the movable base portion 30a via the two contact pressure spring portions 35 described above. The movable base portion 30a is formed in a rectangular plate shape as described above, and the stopper portions 33 that limit the displacement amount of the magnetic body portion 30b are continuously extended from the four corners, and the contact pressure spring. The planar shape of the portion 35 is formed in a U shape along three sides of the outer peripheral edge of the stopper portion 33. The stopper portion 33 limits the amount of displacement of the magnetic body portion 30 b by contacting the one surface of the body 1. As can be seen from the above description, the armature block 3 includes the frame portion 31, the movable base portion 30a, the support spring portion 32, the movable contact holding portion 34, and the contact pressure spring portion 35, which are part of the semiconductor substrate described above. It is configured. The cover 4 is made of heat-resistant glass, and a recess (not shown) that secures a swinging space for the armature 30 is formed on the surface facing the armature block 3.

次に、本実施形態のマイクロリレーの製造方法について簡単に説明する。 Next, a method for manufacturing the micro relay of this embodiment will be briefly described.

本実施形態のマイクロリレーの製造にあたっては、半導体基板たるシリコン基板をリソグラフィ技術、エッチング技術などの半導体微細加工プロセス（マイクロマシンニング技術）により加工してフレーム部３１、支持ばね部３２、接圧ばね部３５、可動接点基台部３４、アーマチュア３０の一部を構成する可動基台部３０ａを形成した後で可動基台部３０ａにおいてボディ１側となる一面に磁性体からなる磁性体部３０ｂを固着し且つ可動接点基台部３４に可動接点３９を固着することでアーマチュアブロック３を形成するアーマチュアブロック形成工程と、アーマチュアブロック形成工程にて形成したアーマチュアブロック３とボディ１およびカバー４を陽極接合により固着することでボディ１とカバー４とアーマチュアブロック３のフレーム部３１とで囲まれる空間を密封する密封工程と、密封工程の後でボディ１の収納部に電磁石装置２を収納してボディ１に固定する電磁石装置配設工程とを備えている。 In manufacturing the microrelay of this embodiment, a silicon substrate as a semiconductor substrate is processed by a semiconductor micromachining process (micromachining technology) such as a lithography technique and an etching technique to form a frame portion 31, a support spring portion 32, and a contact pressure spring portion. 35, after forming the movable contact base 34 and the movable base 30a constituting a part of the armature 30, the magnetic base 30b made of a magnetic material is fixed to one surface of the movable base 30a on the body 1 side. In addition, the armature block forming process for forming the armature block 3 by fixing the movable contact 39 to the movable contact base 34, and the armature block 3 formed in the armature block forming process, the body 1 and the cover 4 by anodic bonding. The body 1, the cover 4, and the armature block 3 A sealing step of sealing the space surrounded by the over arm portion 31, after the sealing process by accommodating the electromagnetic device 2 to the storage portion of the body 1 at and a magnet device arranged step of fixing to the body 1.

ここにおいて、ボディ１の形成にあたっては、ボディ１となるガラス基板において収納部に対応する部位に厚み方向に貫通する収納孔１６を形成するとともにガラス基板の四隅近傍並びに長手方向両端部の中央に厚み方向に貫通するスルーホール１０を形成した後、ボディ１の一表面側に導電材料を部分的にめっきすることでランド１２、固定接点１４、導電パターン１８，１８’、めっき層１０ａを一体に形成してから、上記ガラス基板において固定接点１４を設けた側の表面に収納孔１６を覆う薄膜（例えば、シリコン薄膜、ガラス薄膜など）を固着し、当該薄膜をパターニングすることによって収納孔１６の開口面を閉塞する蓋体１７を形成すればよい。なお、収納孔１６はエッチング法やサンドブラスト法などにより形成すればよい。 Here, in forming the body 1, the storage hole 16 penetrating in the thickness direction is formed in a portion corresponding to the storage portion in the glass substrate to be the body 1, and the thickness is in the vicinity of the four corners of the glass substrate and in the center of both ends in the longitudinal direction. After forming the through hole 10 penetrating in the direction, the land 12, the fixed contact 14, the conductive patterns 18, 18 ′, and the plating layer 10 a are integrally formed by partially plating a conductive material on one surface side of the body 1. Then, a thin film (for example, a silicon thin film, a glass thin film, etc.) covering the storage hole 16 is fixed to the surface of the glass substrate on the side where the fixed contact 14 is provided, and the thin film is patterned to open the storage hole 16. What is necessary is just to form the cover body 17 which obstruct | occludes a surface. The storage hole 16 may be formed by an etching method or a sand blast method.

また、カバー４の形成にあたっては、カバー４となるガラス基板においてエッチング法やサンドブラスト法などにより凹所を形成すればよい。そして、アーマチュアブロック３のフレーム部３１にボディ１及びカバー４を陽極接合することでボディ１とカバー４とフレーム部３１とで構成される空間を密閉すれば、本実施形態のマイクロリレーが完成する。 In forming the cover 4, a recess may be formed in the glass substrate to be the cover 4 by an etching method or a sand blast method. And if the space comprised by the body 1, the cover 4, and the frame part 31 is sealed by anodically bonding the body 1 and the cover 4 to the frame part 31 of the armature block 3, the micro relay of this embodiment is completed. .

以下、本実施形態のマイクロリレーの動作について説明する。 Hereinafter, the operation of the micro relay of this embodiment will be described.

本実施形態のマイクロリレーでは、コイル２２，２２への通電が行われると、磁化の向きに応じて磁性体部３０ｂの長手方向の一端部がヨーク２０の一方の脚片２０ｂに吸引されてアーマチュア３０が揺動しアーマチュア３０の一端側の可動接点基台部３４に固着された可動接点３９が対向する一対の固定接点１４，１４に所定の接点圧で接触する。この状態で通電を停止しても、永久磁石２１の発生する磁束により、吸引力が維持され、そのままの状態が保持される。 In the micro relay of this embodiment, when the coils 22 are energized, one end in the longitudinal direction of the magnetic body portion 30b is attracted to one leg piece 20b of the yoke 20 according to the direction of magnetization, and the armature The movable contact 39 fixed to the movable contact base 34 at one end of the armature 30 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

また、コイル２２，２２への通電方向を逆向きにすると、アーマチュア３０の磁性体部３０ｂがヨーク２０の他方の脚片２０ｂに吸引されてアーマチュア３０が揺動しアーマチュア３０の他端側の可動接点基台部３４に保持された可動接点３９が対向する一対の固定接点１４，１４に所定の接点圧で接触する。この状態で通電を停止しても、永久磁石２１の発生する磁束により、吸引力が維持され、そのままの状態が保持される。 Further, when the energization direction to the coils 22 and 22 is reversed, the magnetic body portion 30b of the armature 30 is attracted to the other leg piece 20b of the yoke 20, and the armature 30 swings to move the other end side of the armature 30. The movable contact 39 held by the contact base 34 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

次に、本発明の要旨である固定接点１４並びに可動接点３９の構造について説明する。本実施形態における固定接点１４は、図１（ｂ）に示すように少なくとも可動接点３９との接触面（図１（ａ）における上面）を含む全体が金と銀の合金で形成されている。ここで、リレーに用いられる一般的な接点の構造は、例えば、図７（ａ）に示すように接触面（図中の上面）から順に金、ニッケル、銅、クロムの各金属を積層したような構造となっているが、既に説明したように本発明に係るマイクロリレーではアーマチュアブロック３のフレーム部３１にカバー４を陽極接合する際にリフロー炉の温度（おおよそ２００℃）よりも十分に高い高温環境（例えば、４００℃）に長時間（例えば、１時間）晒されることから、加熱によって各金属が拡散し且つ酸化され、図７（ｂ）に示すように接触面から順に酸化ニッケル−酸化銅−金の合金、銅−金の合金、銅−クロムの合金を積層したような構造となり、接点の電気抵抗が増大して導通不良などの不具合が生じる虞がある。 Next, the structure of the fixed contact 14 and the movable contact 39 which are the gist of the present invention will be described. As shown in FIG. 1B, the fixed contact 14 in the present embodiment is entirely made of an alloy of gold and silver including at least a contact surface with the movable contact 39 (upper surface in FIG. 1A). Here, the structure of a general contact used for a relay is, for example, as shown in FIG. 7A, in which gold, nickel, copper, and chromium metals are stacked in order from the contact surface (upper surface in the drawing). As described above, in the micro relay according to the present invention, when the cover 4 is anodically bonded to the frame portion 31 of the armature block 3, the temperature is sufficiently higher than the temperature of the reflow furnace (approximately 200 ° C.). Since it is exposed to a high temperature environment (for example, 400 ° C.) for a long time (for example, 1 hour), each metal is diffused and oxidized by heating, and nickel oxide-oxidized in order from the contact surface as shown in FIG. There is a structure in which a copper-gold alloy, a copper-gold alloy, and a copper-chromium alloy are laminated, and there is a risk that the electrical resistance of the contact increases, causing problems such as poor conduction.

そこで本発明者らは、製造プロセスや使用状態で高温環境に長時間晒された場合でも接点抵抗の増大による導通不良などが起こらない接点材料を種々検討し、少なくとも接触面を含む固定接点１４の先端部分を金と銀の合金で形成すれば、上述の導通不良などの不具合の発生が防止できることを見いだした。すなわち、図１（ａ）に示すようにボディ１に銀１４ａと金１４ｂを順に固着し、上記高温環境による加熱後に金−銀の合金からなる固定接点１４が形成されるようにしている。 Therefore, the present inventors have studied various contact materials that do not cause poor conduction due to an increase in contact resistance even when exposed to a high temperature environment for a long time in the manufacturing process or use state, and at least the fixed contact 14 including the contact surface. It has been found that if the tip portion is made of an alloy of gold and silver, the above-mentioned problems such as poor conduction can be prevented. That is, as shown in FIG. 1A, silver 14a and gold 14b are fixed to the body 1 in order, and the fixed contact 14 made of a gold-silver alloy is formed after heating in the high temperature environment.

一方、可動接点３９についても固定接点１４と事情は同じであるから、本来ならば固定接点１４と同一構造、すなわち、少なくとも固定接点１４と接触する先端部分を金と銀の合金で形成することが望ましい。しかしながら、固定接点１４と可動接点３９の接触面の接点材料が同一であると、固定接点１４と可動接点３９が接離を繰り返すうちに両者の間で接点材料の金属が転移して接触不良を起こす可能性がある。 On the other hand, since the situation of the movable contact 39 is the same as that of the fixed contact 14, originally, it has the same structure as that of the fixed contact 14, that is, at least the tip portion in contact with the fixed contact 14 can be formed of an alloy of gold and silver. desirable. However, if the contact materials of the contact surfaces of the fixed contact 14 and the movable contact 39 are the same, the metal of the contact material is transferred between the fixed contact 14 and the movable contact 39 while repeatedly contacting and separating. There is a possibility of waking up.

そこで本実施形態では、固定接点１４との接触面を含む可動接点３９の先端部に金及び銀以外の金属、例えば、白金を含有させて金−銀−白金の合金で可動接点３９の先端部を形成することにより、可動接点３９の電気抵抗を増大させずに固定接点１４との接離に伴う金属の転移を防止している。具体的には、図１（ａ）に示すようにシリコン基板（可動接点基台部３４）に銀３９ａと白金３９ｃと金３９ｂを順に固着し、上記高温環境による加熱後に先端部が金−銀−白金の合金３９ｄからなり、他の部分が白金３９ｃ、金−銀−白金の合金３９ｄ、金−銀の合金３９ｅからなる可動接点３９が形成されるようにしている。また白金は酸化しにくく、酸化しやすい金属の拡散を防止する効果もあるため、可動接点３９内で取り得る成分比率の範囲が広くなり、厳密な製造プロセスの管理を必要としないという利点がある。なお、可動接点３９の先端部に含有すべき金属は白金に限定されるものではなく、他の白金族元素（特にロジウム又はパラジウム）であっても構わない。 Therefore, in the present embodiment, the tip of the movable contact 39 including a gold-silver-platinum alloy containing metal other than gold and silver, for example, platinum, is added to the tip of the movable contact 39 including the contact surface with the fixed contact 14. As a result, the metal transfer accompanying the contact with and separation from the fixed contact 14 is prevented without increasing the electric resistance of the movable contact 39. Specifically, as shown in FIG. 1A, silver 39a, platinum 39c, and gold 39b are fixed to a silicon substrate (movable contact base portion 34) in this order, and the tip portion is gold-silver after heating in the high temperature environment. The movable contact 39 is formed of a platinum alloy 39d, and the other part is formed of platinum 39c, a gold-silver-platinum alloy 39d, and a gold-silver alloy 39e. In addition, platinum is difficult to oxidize and has an effect of preventing diffusion of easily oxidizable metals, so that the range of component ratios that can be taken in the movable contact 39 is widened, and there is an advantage that strict management of the manufacturing process is not required. . The metal to be contained at the tip of the movable contact 39 is not limited to platinum, and may be other platinum group elements (particularly rhodium or palladium).

ここで、図８（ａ）に示すように加熱前において可動接点基台部３４との界面にクロム３９ｆを介在させ、図８（ｂ）に示すように加熱後において可動接点３９の可動接点基台部３４との界面近傍の部位にクロム３９ｆを含有させれば、クロムが金や銀に比較してシリコンなどの半導体との密着性に優れることから、可動接点基台部３４と可動接点３９との密着性を高めることができる。 Here, as shown in FIG. 8 (a), chromium 39f is interposed at the interface with the movable contact base 34 before heating, and the movable contact base of the movable contact 39 after heating as shown in FIG. 8 (b). If chromium 39f is contained in the vicinity of the interface with the base 34, the chromium is superior in adhesion to a semiconductor such as silicon as compared with gold or silver, so the movable contact base 34 and the movable contact 39 are excellent. Adhesion can be improved.

ところで、本発明者らの実験結果によれば、固定接点１４並びに可動接点３９の先端部における金と銀の成分比率が４対１（Ａｕ：Ａｇ≒４：１）となるとき、加熱後の先端部には金−銀の合金と同時に可動接点基台部３４との界面からクロム３９ｆが拡散し且つ接触面でそれらが酸化することが確認された。一方、金と銀の成分比率が１対３（Ａｕ：Ａｇ≒１：３）、１対２（Ａｕ：Ａｇ≒１：２）、あるいは３対５（Ａｕ：Ａｇ≒３：５）となるときは、先端部へのクロムやチタンの拡散及びそれらの酸化が見られないことが確認されたので、固定接点１４及び可動接点３９の接触面を含む先端部における金と銀の成分比率は金の方が銀よりも少ないことが望ましい。但し、成分比率が１対３の場合に比較して、成分比率が１対２又は３対５の場合の方が固定接点１４及び可動接点３９の接触抵抗が小さくなることが本発明者らの実験によって確認されている。なお、「成分比率」は重量比率ではなく、元素数の比率（いわゆる原子パーセント）である。 By the way, according to the experiment results of the present inventors, when the component ratio of gold and silver at the tips of the fixed contact 14 and the movable contact 39 is 4: 1 (Au: Ag≈4: 1), It was confirmed that chromium 39f diffuses from the interface with the movable contact base portion 34 at the same time as the gold-silver alloy at the tip portion and that they are oxidized at the contact surface. On the other hand, the component ratio of gold and silver is 1 to 3 (Au: Ag≈1: 3), 1 to 2 (Au: Ag≈1: 2), or 3 to 5 (Au: Ag≈3: 5). At that time, it was confirmed that diffusion of chromium and titanium to the tip portion and oxidation thereof were not observed, so the gold to silver component ratio in the tip portion including the contact surface of the fixed contact 14 and the movable contact 39 is gold. It is desirable that is less than silver. However, the present inventors show that the contact resistance of the fixed contact 14 and the movable contact 39 is smaller when the component ratio is 1: 2 or 3: 5 than when the component ratio is 1: 3. It has been confirmed by experiments. The “component ratio” is not a weight ratio but a ratio of the number of elements (so-called atomic percent).

ここで、本発明者らの実験結果によると固定接点１４並びに可動接点３９の厚みｄを１．０μｍ乃至５０μｍの範囲とすることが望ましい。すなわち、固定接点１４及び可動接点３９の抵抗値が目標値（例えば、１００ｍΩ）よりも大きくならず、且つガラス基板（ボディ１）又はシリコン基板（可動接点基台部３４）から不純物の拡散も発生しないためには、厚みｄの下限値を１．０μｍ以上とし、固定接点１４及び可動接点３９を形成する金属材料（金、銀、白金、クロム）の成膜応力及び製造プロセスにおける熱応力に対して固定接点１４及び可動接点３９が基材（ボディ１又は可動接点基台部３４）との密着力を保つためには、厚みｄの上限値を５０μｍ以下とすればよい。但し、マイクロリレーの寸法設計や製造プロセス設計を考慮した最適な例においては、固定接点１４及び可動接点３９の厚みｄを２．５μｍ〜２０μｍの範囲に設定することが望ましい。 Here, according to the experiment results of the present inventors, it is desirable that the thickness d of the fixed contact 14 and the movable contact 39 is in the range of 1.0 μm to 50 μm. That is, the resistance values of the fixed contact 14 and the movable contact 39 are not larger than the target value (for example, 100 mΩ), and impurities are diffused from the glass substrate (body 1) or the silicon substrate (movable contact base 34). To prevent this, the lower limit of the thickness d is set to 1.0 μm or more, and the film formation stress of the metal material (gold, silver, platinum, chromium) forming the fixed contact 14 and the movable contact 39 and the thermal stress in the manufacturing process are not affected. In order for the fixed contact 14 and the movable contact 39 to maintain the adhesive force with the base material (the body 1 or the movable contact base 34), the upper limit value of the thickness d may be set to 50 μm or less. However, in an optimal example in consideration of dimensional design and manufacturing process design of the micro relay, it is desirable to set the thickness d of the fixed contact 14 and the movable contact 39 in the range of 2.5 μm to 20 μm.

なお、上述の説明では固定接点１４を金−銀の合金で形成し、可動接点３９の先端部を金−銀−白金の合金で形成しているが、可動接点３９を金−銀の合金で形成し、固定接点１４の先端部を金−銀−白金の合金で形成しても同様の効果が得られることは言うまでもない。また、可動接点３９の先端部に含有する金属は白金に限定されるものではなく、他の金属、例えばコバルトであってもよい。具体的には、図９（ａ）に示すように可動接点基台部３４にクロム３９ｆ、金３９ｂ、銀３９ａ、金３９ｂ、コバルトを含有する金３９ｂ’を順に固着し、上記高温環境による加熱後に先端部が金−銀−コバルトの合金３９ｇからなり、他の部分が金−銀の合金３９ｅ及びクロム３９ｆからなる可動接点３９が形成されるようにすればよい。またコバルトを含む合金は含まない合金に比べて硬度が高くなることからも金属の転移防止が図れる。但し、多量のコバルトを含有するとコバルトの酸化膜が可動接点３９の接触抵抗を増大させる虞があるため、先端部における金−銀−コバルトの合金におけるコバルトの含有率は１０％（原子パーセント）以下が望ましい。 In the above description, the fixed contact 14 is made of a gold-silver alloy and the tip of the movable contact 39 is made of a gold-silver-platinum alloy. However, the movable contact 39 is made of a gold-silver alloy. Needless to say, the same effect can be obtained by forming the tip of the fixed contact 14 with a gold-silver-platinum alloy. Moreover, the metal contained in the front-end | tip part of the movable contact 39 is not limited to platinum, Another metal, for example, cobalt, may be sufficient. Specifically, as shown in FIG. 9 (a), chromium 39f, gold 39b, silver 39a, gold 39b, and gold 39b ′ containing cobalt are fixed to the movable contact base 34 in order, and heating by the high temperature environment is performed. A movable contact 39 may be formed after the tip portion is made of a gold-silver-cobalt alloy 39g and the other portion is made of a gold-silver alloy 39e and chromium 39f. Moreover, since the hardness is higher than that of the alloy containing no cobalt, the metal transition can be prevented. However, since a cobalt oxide film may increase the contact resistance of the movable contact 39 if a large amount of cobalt is contained, the content of cobalt in the gold-silver-cobalt alloy at the tip is 10% (atomic percent) or less. Is desirable.

また、金−銀の合金からなる先端部に白金やコバルトなどの金属を含有する代わりに、固定接点１４の先端部における金−銀の合金の成分比率と可動接点３９の先端部における金−銀の合金の成分比率とを互いに異ならせれば、可動接点３９及び固定接点１４の電気抵抗の増大を防ぎつつ金属の転移が防止できる。ここで、上述のように単体金属を積層した後の加熱による固溶体として可動接点３９及び固定接点１４を形成する場合を一例にとると、金−銀の合金における金と銀の成分比率は、積層する金の層と銀の層の厚みの比率や、各層の厚みの絶対値、印加される熱量等によって決まるため、それらのパラメータを制御することで可動接点３９及び固定接点１４の先端部における金と銀の成分比率を調整することが可能である。 Further, instead of containing a metal such as platinum or cobalt at the tip part made of a gold-silver alloy, the component ratio of the gold-silver alloy at the tip part of the fixed contact 14 and the gold-silver at the tip part of the movable contact 39 If the alloy component ratios are different from each other, it is possible to prevent the metal from being transferred while preventing the electric resistance of the movable contact 39 and the fixed contact 14 from increasing. Here, taking as an example the case where the movable contact 39 and the fixed contact 14 are formed as a solid solution by heating after laminating single metals as described above, the component ratio of gold to silver in the gold-silver alloy is Since the thickness is determined by the ratio of the thickness of the gold layer to the silver layer, the absolute value of the thickness of each layer, the amount of heat applied, etc., the gold at the tips of the movable contact 39 and the fixed contact 14 can be controlled by controlling those parameters. And the silver component ratio can be adjusted.

なお、本発明者らの実験結果によれば、可動接点３９の先端部における金と銀の成分比率が１対２（Ａｕ：Ａｇ≒１：２）、固定接点１４の先端部における金と銀の成分比率が３対５（Ａｕ：Ａｇ≒３：５）となるとき、固定接点１４と可動接点３９の１億回の接離後においても両者の間で金属の転移による接触不良が生じないことが確認されている。但し、上記成分比率は一例であって、固定接点１４の先端部と可動接点３９の先端部の金と銀の成分比率が互いに異なっていれば、金属の転移による接触不良が防止できる。 According to the results of experiments conducted by the present inventors, the gold / silver component ratio at the tip of the movable contact 39 is 1: 2 (Au: Ag≈1: 2), and the gold and silver at the tip of the fixed contact 14. When the component ratio is 3 to 5 (Au: Ag≈3: 5), contact failure due to metal transfer does not occur between the fixed contact 14 and the movable contact 39 even after 100 million contact / separation. It has been confirmed. However, the above component ratio is an example, and if the gold and silver component ratios at the distal end portion of the fixed contact 14 and the distal end portion of the movable contact 39 are different from each other, contact failure due to metal transfer can be prevented.

本発明の実施形態における固定接点及び可動接点を示し、（ａ）は加熱前の断面図、（ｂ）は加熱後の断面図である。The fixed contact and movable contact in an embodiment of the present invention are shown, (a) is a sectional view before heating, and (b) is a sectional view after heating. 同上の分解斜視図である。It is an exploded perspective view same as the above. 同上におけるボディを示し、（ａ）は正面図、（ｂ）は同図（ａ）のＸ−Ｘ’線断面矢視図である。The body in the above is shown, (a) is a front view, (b) is a cross-sectional view taken along the line X-X 'in FIG. 同上の背面斜視図である。It is a back perspective view same as the above. （ａ）は同上におけるアーマチュアブロックの正面図、（ｂ）は同上におけるアーマチュアブロックの背面図である。(A) is a front view of the armature block in the above, and (b) is a rear view of the armature block in the above. 同上におけるアーマチュアブロックの分解斜視図である。It is a disassembled perspective view of the armature block in the same as the above. 一般的な接点を示し、（ａ）は加熱前の断面図、（ｂ）は加熱後の断面図である。A general contact is shown, (a) is sectional drawing before a heating, (b) is sectional drawing after a heating. 同上における別の可動接点を示し、（ａ）は加熱前の断面図、（ｂ）は加熱後の断面図である。The other movable contact in the same is shown, (a) is sectional drawing before a heating, (b) is sectional drawing after a heating. 同上におけるさらに別の可動接点を示し、（ａ）は加熱前の断面図、（ｂ）は加熱後の断面図である。The other movable contact in the same as above is shown, (a) is sectional drawing before a heating, (b) is sectional drawing after a heating.

Explanation of symbols

１ボディ
１４固定接点
１４ａ銀
１４ｂ金
３４可動接点基台部
３９可動接点
３９ａ銀
３９ｂ金
３９ｃ白金
３９ｄ金−銀−白金の合金 1 Body 14 Fixed Contact 14a Silver 14b Gold 34 Movable Contact Base 39 Movable Contact 39a Silver 39b Gold 39c Platinum 39d Gold-Silver-Platinum Alloy

Claims

An electromagnet device that generates an electromagnetic force in response to an excitation current to the coil; a body that is provided with a housing portion that houses the electromagnet device and has a fixed contact on one surface side in the thickness direction; and the one surface side of the body The armature swingably provided by the electromagnetic force of the electromagnet device and the movable contact that contacts and separates from the fixed contact when the armature swings , and the movable contact is fixed in the manufacturing process. Chromium is interposed at the interface between the contact base and the movable contact, and heated to contain chromium in the vicinity of the interface between the movable contact and the movable contact base, and the movable contact and the fixed contact are at least The tip including the contact surface with the other party is formed of an alloy of gold and silver with a ratio of the number of elements of gold and silver selected from 1: 3, 1: 2, and 3: 5, and either One contact Microrelay characterized by containing a platinum group element on the distal end that.

An electromagnet device that generates an electromagnetic force in response to an excitation current to the coil; a body that is provided with a housing portion that houses the electromagnet device and has a fixed contact on one surface side in the thickness direction; and the one surface side of the body The armature swingably provided by the electromagnetic force of the electromagnet device and the movable contact that contacts and separates from the fixed contact when the armature swings , and the movable contact is fixed in the manufacturing process. Chromium is interposed at the interface between the contact base and the movable contact, and heated to contain chromium in the vicinity of the interface between the movable contact and the movable contact base, and the movable contact and the fixed contact are at least The tip including the contact surface with the other party is formed of an alloy of gold and silver with a ratio of the number of elements of gold and silver selected from 1: 3, 1: 2, and 3: 5, and either One contact Microrelay characterized by containing cobalt to the tip that.

An electromagnet device that generates an electromagnetic force in response to an excitation current to the coil; a body that is provided with a housing portion that houses the electromagnet device and has a fixed contact on one surface side in the thickness direction; and the one surface side of the body The armature is swingably provided, and includes an armature that swings due to the electromagnetic force of the electromagnet device, and a movable contact that contacts and separates from the fixed contact when the armature swings , and the movable contact is fixed in the manufacturing process. Chromium is interposed at the interface between the contact base and the movable contact, and heated to contain chromium in the vicinity of the interface between the movable contact and the movable contact base, and the movable contact and the fixed contact are at least The tip including the contact surface with the counterpart is formed of a gold-silver alloy with a ratio of the number of elements of gold and silver selected from 1: 3, 1: 2, and 3: 5, and both contacts At the tip of Microrelay wherein the ratio of components takes gold and silver are different from each other.