JP4379339B2 - Semiconductor cooling device - Google Patents

Description

  The present invention relates to a technique for cooling a semiconductor.

Patent Document 1 discloses a semiconductor module cooling structure. In this cooling structure, a tube through which the refrigerant passes is used. The semiconductor module has a heat radiating surface on the front surface and the back surface, and the tube is disposed along the surface of the semiconductor module. In the embodiment, the tube is pressed against the front surface and the back surface of the semiconductor module by bending the tube. The front and back surfaces of the semiconductor module are cooled by the refrigerant passing through the tube. Patent Documents 2 to 4 disclose other semiconductor cooling techniques.
JP 2001-352023 A JP 2002-141164 A JP 2001-24125 A Japanese Patent Laid-Open No. 10-107194

In the conventional technique, the positional relationship between the semiconductor module and the refrigerant tube greatly affects the degree of cooling of the semiconductor module. If the semiconductor module and the refrigerant tube are separated from each other, the semiconductor module cannot be effectively cooled. In the conventional cooling structure, the semiconductor module is sandwiched between the bent and folded refrigerant tubes in order to bring the semiconductor module and the refrigerant tubes into close contact with each other. If the sandwiching force is too strong, the semiconductor module may be destroyed, and if it is too weak, the cooling capacity may be insufficient.
In the case of the conventional structure, it is difficult to adjust the force for sandwiching the semiconductor module by the refrigerant tube, and there is a problem that the burden of assembling work of the cooling device for the semiconductor module is large.

  An object of this invention is to reduce the burden of the assembly operation | work of a semiconductor cooling device.

The semiconductor cooling device of the present invention includes a case in which a refrigerant passage is formed inside, and a plurality of compartments that house a semiconductor inside and have a heat dissipating surface that radiates heat generated from the semiconductor on the front and back surfaces. Yes. In the semiconductor cooling device of the present invention, a plurality of partitions are inserted into the refrigerant passage of one case, and the partitions whose one side end is in contact with the case and the partitions whose other side end is in contact with the case are alternated. Are arranged parallel to each other. In the above, the side end of the partition means an end portion that is present laterally with respect to the front and back surfaces of the partition, and the direction along the refrigerant passage that the partition faces in the state of being inserted into the case. The end of the compartment. Moreover, in the semiconductor cooling device of the present invention, a plurality of partition bodies are inserted into the coolant passage of one case, so that one coolant passage is partitioned in the planar direction. In the above description, “the refrigerant passage is defined” includes both “the refrigerant passage is divided into a plurality of flows” and “the refrigerant passage is bent without being divided”. The partitioned refrigerant passage passes through the front face and the back face with respect to one compartment, and passes through all compartments. Projections that project into the refrigerant passage are formed on the front surface and the rear surface of each partition, and the front end surface of the projecting portion is exposed to the coolant passage. There are no partition walls between adjacent compartments. The protrusion positions of the front-side protrusion and the rear-side protrusion of the adjacent partition are different, and the front-end surface of the front-side protrusion and the front-end surface of the rear-side protrusion are adjacent to each other. The protrusions are aligned with a slight gap in the protrusion direction.

  In this cooling device, a partition body in which a semiconductor is housed is inserted into the refrigerant passage, and the front surface and the rear surface of the partition body face the refrigerant passage partitioned by the partition body. Therefore, the semiconductor accommodated in the compartment is cooled from both the front and back sides via the compartment.

According to this cooling device, it is easy to adjust the positional relationship among the refrigerant passage, the partition body, and the semiconductor device to a fixed positional relationship. It is easy to mass-produce cooling devices with well-adjusted cooling capacity.
It is not necessary to perform an assembling operation required in the conventional structure, that is, a highly difficult assembling operation of adjusting the positional relationship while the semiconductor is sandwiched between the refrigerant tubes. According to the cooling device of the present invention, the burden of assembly work can be reduced. It is easy to mass produce cooling devices that are well adjusted to a high cooling capacity.
In addition, the same flow rate of refrigerant flows through one continuous refrigerant passage. Therefore, the front and back surfaces of the plurality of partition bodies are cooled by the same flow rate of refrigerant. According to this configuration, it is possible to make the coolant flow rates used for cooling uniform for a plurality of semiconductors, and to reduce the difference in cooling efficiency depending on the location of the semiconductor in the case.
Further, since the case and the group of partition bodies form one refrigerant passage that meanders in the case, the meandering refrigerant passage can be formed without forming a partition wall or the like in the case. The semiconductor cooling device can be reduced in size and weight.
Furthermore, even if adjacent partition bodies are brought close to each other until the front end surfaces of the projecting portions are aligned with a slight gap in the projecting direction of the projecting portions, the front end surfaces of the projecting portions can be exposed to the refrigerant passage. For this reason, the semiconductor cooling device can be further reduced in size while ensuring the contact area between the protruding portion group and the refrigerant. The semiconductor device can be effectively cooled.

In the above-described semiconductor cooling device , it is preferable that the protruding portion has a convex shape extending along the refrigerant passage. Moreover, in the adjacent division body, it is preferable that the front end surface of the protrusion part of the front side is facing the recessed part formed between the protrusion parts of the back side. Moreover, it is preferable that the front-end | tip surface of the protrusion part of a front side and the edge parts of the front-end | tip surface of the protrusion part of a back side are slightly spaced apart.
According to this configuration, the end portion of the front end surface of the protruding portion on the front side and the end portion of the front end surface of the protruding portion on the rear side are close to each other, so that the front side of one of the adjacent divided bodies. The refrigerant passage and the refrigerant passage on the back side of the other compartment can be separated. The refrigerant flow directions of the front-side refrigerant passage and the rear-side refrigerant passage can be reversed, and the number of meandering passages can be increased.

In the above-described semiconductor cooling device, a substantially rectangular parallelepiped space is secured in the case, and the surface facing the side edges of the partition bodies arranged in parallel corresponds to every other side edge of the partition bodies. It is preferable that a further space is secured at the position to be operated. For example, when the surfaces facing the side edges of the partition are the A and B planes, and the partition members arranged in parallel are numbered 1, 2,. A recess is provided at a position corresponding to the partition body, and a recess is provided at a position corresponding to the even-numbered partition body on the B surface.
According to this structure, the one refrigerant path meandering in the case is formed. With such a configuration, the semiconductor cooling device can be further reduced in size.

As for said semiconductor cooling device, it is desirable that the case and the partition are formed as separate members and are configured by combining them.
According to this configuration, the semiconductor cooling device can be assembled by assembling the compartment into the case after housing the semiconductor in the compartment. The operation of housing the semiconductor in the compartment can be performed prior to the operation of housing the compartment in the case, and the assembly workability of the semiconductor cooling device is improved.

According to the present invention, it is possible to easily mass-produce a semiconductor cooling device having a high cooling capacity and stable.
In addition, the semiconductor cooling device can be reduced in size by improving the arrangement of the partitions and the position of the protruding portion.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. First, the main features of the embodiment are listed.
(Form 1) No partition is interposed between adjacent partitions. The compartments containing the semiconductor are directly adjacent to each other through the refrigerant passage.
(Mode 2) The partition body is a metal member having a substantially rectangular parallelepiped space for accommodating a semiconductor therein, and protrusions are formed on each of the front surface and the back surface.

(First embodiment)
FIG. 1 shows a cross section of a semiconductor module cooling device 20 of the first embodiment. 1 is a cross-sectional view taken along the line II of FIG. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 shows an exploded perspective view. FIG. 4 shows an enlarged cross-sectional view of the block 20b in which the power semiconductor module 32 of FIG. 2 is incorporated. FIG. 5 shows an exploded perspective view.

As shown in FIGS. 1 and 2, the cooling device 20 includes a case 20a. A cooling water passage 26 (an example of a refrigerant passage) through which a refrigerant (water in the case of the first embodiment) flows is formed inside the case 20a. The cooling water passage 26 has a cooling water inlet 22 and an outlet 34. The cooling water passage 26 is partitioned by six blocks 20b inserted into the case 20a, and a meandering cooling water passage 26 is formed as shown in FIG. It can be said that the cooling water passage 26 is formed in a zigzag or continuous S shape. The cooling water flows in the direction indicated by the arrow in FIG. The blocks 20b are partition bodies that divide the cooling water passage 26. Two blocks 20b are arranged in series, and two blocks 20b are arranged in parallel. Each block 20b can also be referred to as a partition, but in the following, two blocks arranged in series are referred to as a partition. The cooling water passage 26 is partitioned into passage portion groups 26a, 26b and the like by the block 20b. The passage portion groups 26a and 26b are continuous and form a meandering cooling water passage 26.
A semiconductor module 32 is incorporated in each block 20b. The front surface of each block 20b (for example, the surface on the left side in the drawing in the block 20b in FIG. 1) and the back surface (for example, the surface on the right side in the drawing in the block 20b in FIG. 1) are semiconductors accommodated inside each block 20b. It is a heat radiating surface that radiates the heat generated by the module 32. The front and back surfaces of each block 20b face the cooling water passage 26, and the semiconductor module 32 accommodated in the block 20b is cooled from both the front and back surfaces via the block 20b.

  As shown in FIG. 1, a plurality of blocks 20b are inserted into the case 20a. Assuming that the block 20b continuous in the direction in which the refrigerant flows (up and down direction in FIG. 1) is one partition body, three partition bodies are inserted side by side in the left-right direction in FIG. The division bodies arranged in the left-right direction are parallel to each other, and one side end (for example, the lower end portion in FIG. 1) is in contact with the case 20a and the other side end (the upper end in FIG. 1). Part) are arranged in such a relationship that the partition bodies in contact with the case 20a appear alternately. The left and right compartments in FIG. 1 are in contact with the case 20a at the lower end, and the center compartment in FIG. 1 is in contact with the case 20a at the upper end.

The case 20a includes a substantially rectangular parallelepiped space 21a. In the space 21a, a plurality of partition bodies are arranged in parallel. In FIG. 1, the upper surface of the case 20 a facing the upper end of the partition is the A surface, and the lower surface of the case 20 a facing the lower end is the B surface, which are arranged in parallel. When the divided bodies are numbered 1, 2,... In order from the left, recesses 21b are provided on the A surface at positions corresponding to the first and third divided bodies. The B surface is provided with a recess 21b at a position corresponding to the second partition.
With this configuration, one continuous refrigerant passage 26 meandering in the case 20a is formed.
The partition seen in the cooling device described later is not formed, and the cooling device is downsized. In particular, the dimension in the left-right direction (referred to as the stacking direction of the compartments) in FIG. 1 is shortened.

  As shown in FIGS. 1 and 3, the cooling device 20 includes six blocks 20 b in which the semiconductor modules 32 are incorporated. As shown in FIG. 1, another block 20b is provided at a position facing a certain block 20b across the passage portion 26b. A semiconductor module 32 is also incorporated in the other block 20b. Thus, this cooling device has a layout with high cooling efficiency that effectively utilizes space.

  The cooling device 20 includes a case 20a and a block 20b as shown in FIGS. The block 20b constitutes the partition described above. In the following, names are properly used as necessary. These cases and blocks 20a and 20b may be formed by scraping an aluminum alloy or formed by aluminum die casting. As shown in FIG. 3, the six blocks 20b are accommodated in the space 21a of the case 20a. Note that the pipe portions 23 and 35 of the case 20a shown in FIG. 3 are connected to the cooling water inlet 22 and the outlet 34 shown in FIG. 1, respectively.

  As shown in FIG. 2, a projecting portion group 30 a and a projecting portion group 30 b are formed on the block 20 b constituting the partition body. Both the protruding portion group 30a and the protruding portion group 30b are formed side by side in the vertical direction of FIG. These protrusion part groups 30a and 30b function as heat exchange fins. In FIG. 2, the positions of the protruding portion group 30b extending rightward from the left block 20b and the protruding portion group 30a extending leftward from the central block 20b are shifted in the vertical direction, and the protruding positions are different from each other.

  As well shown in FIG. 2, the protruding portion group 30a and the protruding portion group 30b are in such a relationship that their front end surfaces are aligned on substantially the same plane. By arranging the blocks 20b in this way, the intervals between the adjacent blocks 20b are close to each other, and the cooling device 20 is downsized. The dimension in the stacking direction of the compartments is shortened.

As well shown in FIGS. 4 and 5, the semiconductor module 32 includes a plate-like substrate 50 and an electrode 56. Although the substrate 50 can also be said to be substantially an electrode, it is expressed as the substrate 50 in this specification. The power semiconductor element 46 and the back surface of the diode 40 are soldered to the surface of the substrate 50. The power semiconductor element 46 is composed of an IGBT, a MOSFET, or the like. As shown in FIGS. 4 and 5, the power semiconductor element 46 and the surface of the diode 40 are soldered to the back surface of the electrode 56. An insulating layer 52 is formed on the surface of the substrate 50, and control wiring 54 is disposed on the surface of the insulating layer 52. The control wiring 54 is connected to the power semiconductor element 46 through the second control wiring 58. The control wiring 54 may be made of copper, phosphor bronze, brass, aluminum or the like. The second control wiring 58 is preferably composed of a bonding wire such as aluminum or gold.
The back surface of the substrate 50 is fixed to the inner surface of the block 20 b by the first adhesive layer 42. Similarly, the surface of the second electrode 56 is fixed to the inner surface of the block 20 b by the second adhesive layer 36. The first adhesive layer 42 and the second adhesive layer 36 have an electrical insulation property and a heat transmission property. The first adhesive layer 42 and the second adhesive layer 36 may be composed of an epoxy resin, a polyimide resin, a silicon resin, or the like in which a material having a good thermal conductivity such as AN, alumina, silicon nitride, boron nitride or the like is blended as a filler. . The housing space of the semiconductor module 32 in the block 20b is filled with a sealing material 38. The sealing material 38 is preferably composed of silicone gel, epoxy resin, or the like.
As shown in FIGS. 3 and 4, a lid 62 is disposed above the block 20b. As shown in FIGS. 4 and 5, a gasket 64 is disposed between the block 20 b and the lid 62. The gasket 64 is for preventing water leakage between the block 20b and the lid 62 or between the semiconductor module 32 and the lid 62, and may be a solid sheet or a sealing material such as resin. An insulating collar 48 is disposed on the lid 62. The insulating collar 48 is for ensuring insulation from the lid 62, and is formed by using an insulating resin or ceramic material.
The distance from the outer surface of the first adhesive layer 42 to the outer surface of the second adhesive layer 36 has a tolerance of about ± 0.1 to 0.3 mm when the semiconductor module 32 is assembled. If the semiconductor module 32 and the block 20b are not in close contact with each other, the heat generated from the semiconductor module 32 is difficult to be transmitted to the outside, so that the part 31 of the block 20b is in close contact with the outer surface of the second adhesive layer 36 as shown in FIG. Set to do.

  A semiconductor module 32 including a set of power semiconductor elements 46 and diodes 40 is incorporated in each of the six blocks 20b. These six sets of power semiconductor elements 46 and diodes 40 constitute a three-phase inverter circuit.

  L1 (the height of the block 20b) in FIG. 4 is 30 to 100 mm. L2 (thickness of the electrode 56) is 1 to 5 mm. L3 (the interval between the protruding portions 30b arranged in the vertical direction) is 1 to 10 mm. L4 (thickness of the protrusion 30b) is 1 to 10 mm. L5 (wall thickness of the block 20b) is 1 to 10 mm. L6 (length of the protrusion 30b) is 5 to 20 mm.

  The procedure for assembling the cooling device 20 will be described. As shown in FIG. 3, the semiconductor module 32 is accommodated in each of the six blocks 20b. Next, these blocks 20b are accommodated in the space 21a of the case 20a. Next, the lid 62 and the insulating collar 48 are disposed on the block 20b. In this case, the semiconductor module 32 protruding from the block 20 b is disposed so as to pass through the opening 63 of the lid 62 and the opening 49 of the insulating collar 48. As described above, as shown in FIG. 1, the cooling water passage 26 is formed in the cooling device 20, and the semiconductor module 32 is assembled in the block 20b, and the assembling work is completed.

  The cooling device 20 includes a case 20a in which a cooling water passage 26 is formed. As shown in FIG. 1, the semiconductor module 32 is assembled in a block 20b whose front and back faces the passage group 26a and 26b. Therefore, by incorporating the semiconductor module 32 into the block 20b and housing the block 20b in the case 20a, the semiconductor module 32 and the case 20a, and further the semiconductor module 32 and the cooling water passage 26 can be arranged in a desired positional relationship. . For this reason, the highly difficult operation | work of adjusting a positional relationship by pinching | interposing a semiconductor module with a tube-shaped cooling member like the conventional structure can be omitted. Therefore, according to this cooling device, the burden of the assembly work of the cooling structure of the semiconductor module 32 can be reduced.

Next, the operation of this cooling device will be described. When cooling water is injected from the inlet 22 of the cooling device 20 shown in FIG. 1, the cooling water flows through the cooling water passage 26 as indicated by the arrows in FIG. On the other hand, when a large current is passed through the power semiconductor element 46 and the diode 40 in order to operate the three-phase inverter circuit, heat is generated from the semiconductor module 32 as a result. This heat is transmitted to the protrusion group 30a, 30b formed in the block 20b. In FIG. 6, which is an enlarged view of region A in FIG. 2, the state of heat transfer is schematically shown by arrows. Since the positions of the protruding portion group 30a and the protruding portion group 30b are shifted in the vertical direction, both the front end surface and the side portion of both protruding portion groups 30a and 30b are exposed to the cooling water. As a result, the semiconductor module 32 is effectively cooled.
Advantages of the first embodiment compared to the second to fifth embodiments will be described after the second to fifth embodiments are described.

(Modification of First Embodiment) FIG. 7 is a cross-sectional view corresponding to FIG. 1 of a modification of the first embodiment. This modification differs from the first embodiment in that the cooling water passage 26 between the opposing blocks 20b is divided into two passages 26c and 26d that flow in opposite directions. These passages 26c and 26d correspond to the passages 26c and 26d shown in FIG. In this manner, the positions of the protruding portion group 30a and the protruding portion group 30b are shifted in the vertical direction as shown in FIG. 2, and the protruding portion group 30a and the protruding portion group 30b extend along the cooling water passage 26. In the case of the structure in which the end portions (corner portions) of the front end surfaces of the projecting portion group 30a and the projecting portion group 30b are substantially in contact with each other, a mutually separated passage may be formed between the opposing blocks 20b. it can. In such a case, the protruding portion group 30a and the protruding portion group 30b have little cooling water entering and exiting between the passage 26c and the passage 26d even if the end portions (corner portions) of the front end surfaces are slightly separated from each other. Therefore, it can be formed as a passage substantially separated from each other.

(Second embodiment)
FIG. 8 shows a sectional view taken along line VIII-VIII of FIG. 9 for the cooling device 72 of the second embodiment. 9 shows a cross-sectional view taken along the line IX-IX in FIG. In the second embodiment, a partition wall 73 is provided between a pair of blocks 72b and 72b in which the semiconductor module 32 is incorporated. Further, as shown in FIG. 9, the positions of the protruding portion group 70 b extending rightward from the left block 72 b and the protruding portion group 70 a extending leftward from the central block 72 b coincide with each other in the vertical direction of FIG. 9. This is different from the first embodiment.

(Third embodiment)
FIG. 10 shows a cross-sectional view of the cooling device of the third embodiment. FIG. 11 shows an enlarged view of region B in FIG. In the third embodiment, the distance between the protruding portion 70b of the block 72b and the partition wall 73 is wider than that in the second embodiment.
In the case of the third embodiment, compared to the second embodiment, there is an advantage that the cooling water can be directly applied to the front end surface of the protruding portion 70b by the cooling water existing in the space 76.

(Fourth embodiment)
FIG. 12 shows a sectional view of the cooling device of the fourth embodiment. FIG. 13 shows an enlarged view of region D in FIG. The fourth embodiment differs from the second embodiment in that no partition is provided between the pair of blocks 72b in which the semiconductor module 32 is incorporated. Or it can be said that it differs from 1st Example by the point which the position of the protrusion part group 70a and the protrusion part group 70b of the block 72b which opposes corresponds in the vertical direction of FIG.
In the case of the fourth embodiment, compared to the second embodiment, there is an advantage that the space occupied by the cooling device can be reduced as much as there is no partition wall.

(5th Example) FIG. 14: shows sectional drawing of the cooling device of 5th Example. FIG. 15 shows an enlarged view of region F in FIG. In the fifth embodiment, the distance between the protruding portion group 70a and the protruding portion group 70b of the opposing block 72b is wider than that in the fourth embodiment.
In the case of the fifth embodiment, compared to the fourth embodiment, there is an advantage that the cooling water can be directly applied to the front end surface of the protruding portion by the cooling water existing in the space 84.

(Advantages of the first embodiment compared to the second to fifth embodiments)
In the case of the first embodiment, compared to the second and third embodiments, there is an advantage that the space occupied by the cooling device can be reduced by the amount of no partition.
Also, unlike the second to fifth embodiments, in the first embodiment, the positions of the protruding portion group 30a and the protruding portion group 30b of the opposing block 20b are shifted in the vertical direction of FIGS. Therefore, as compared with the second and fourth embodiments, the cooling water can be directly applied to the tip surfaces of the protrusions 30a and 30b by the cooling water present in the space facing the protrusion groups 30a and 30b. There is an advantage.

  Further, in order to directly apply the cooling water to the top of the protruding portion, it is not necessary to widen the gap between the protruding portion and the partition wall as in the third embodiment. Alternatively, as in the fifth embodiment, it is not necessary to widen the interval between the projecting portions facing each other. Therefore, as in the third and fifth embodiments, the cooling water can be directly applied to the front end surface of the protrusion, but the space occupied by the cooling device is smaller than that in the third and fifth embodiments. There is an advantage that you can.

  Further, in the third embodiment, the cooling water located in the region C of FIG. 11 flows at a position shifted in an oblique direction with respect to the protruding portion 70b. This cooling water hardly contributes to the cooling of the semiconductor module 32. The same applies to the cooling water in the region E of FIG. 13 in the fourth embodiment and the region G of FIG. 15 in the fifth embodiment. On the other hand, in the first embodiment, the positions of the protruding portion group 30a and the protruding portion group 30b of the opposing block 20b are shifted in the vertical direction of FIGS. 2 and 6, and shifted in an oblique direction with respect to the protruding portion 30a. The other protrusion 30b is located at this position. Therefore, it is possible to greatly reduce the region unlikely to contribute to cooling as in the third to fifth embodiments. As a result, the semiconductor module 32 can be efficiently cooled in a small space.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
For example, in this cooling device, a semiconductor chip or the like can be cooled instead of the semiconductor module 32. Further, the circuit constituted by the semiconductor module or the like may be a multi-phase inverter circuit other than three phases. Further, like a hybrid vehicle, an inverter for power generation and driving may be combined. Further, it may be combined with other power circuits such as a booster circuit.

  In addition, the technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings can achieve a plurality of purposes at the same time, and has technical utility by achieving one of the purposes.

FIG. 3 is a cross-sectional view taken along line II of FIG. 2 for the cooling device of the first embodiment. FIG. 2 is a sectional view taken along line II-II in FIG. 1 for the cooling device of the first embodiment. The disassembled perspective view of the part shown in FIG. 2 is shown. The expanded sectional view of the division body in which the semiconductor module of FIG. 2 was integrated is shown. The disassembled perspective view of the part shown in FIG. 4 is shown. The enlarged view of the area | region A of FIG. 2 is shown. About the modification of 1st Example, sectional drawing corresponding to FIG. 1 is shown. About the cooling device of 2nd Example, the VIII-VIII sectional view taken on the line of FIG. 9 is shown. About the cooling device of 2nd Example, the IX-IX sectional view taken on the line of FIG. 8 is shown. Sectional drawing of the cooling device of 3rd Example is shown. The enlarged view of the area | region B of FIG. 10 is shown. Sectional drawing of the cooling device of 4th Example is shown. The enlarged view of the area | region D of FIG. 12 is shown. Sectional drawing of the cooling device of 5th Example is shown. The enlarged view of the area | region F of FIG. 14 is shown.

Explanation of symbols

20: Cooling device 20a: Case 20b: Block (partition body)
21a: space 21b: space 22: inlet 26: cooling water passage (refrigerant passage)
26a, 26b: passage portion 30a: projecting portion group 30b: projecting portion group 31: part of block 20b 32: semiconductor module (semiconductor)
34: outlet 36: second adhesive layer 38: sealant 40: diode 42: first adhesive layer 46: power semiconductor element 48: insulating collar 49: opening 50: first electrode 52: insulating layer 54: for control Wiring 56: Second electrode 62: Lid 72: Cooling device 70a: Projection part group 70b: Projection part group 72b: Block 73: Partition wall 76: Space

Claims (4)

A device for cooling semiconductors,
A case in which a refrigerant passage is formed inside;
It contains a plurality of compartments that house a semiconductor inside and have a heat radiating surface that radiates the heat generated by the semiconductor on the front and back sides ,
The plurality of partitions are inserted into the refrigerant passage of one case, and a partition body in which one side end is in contact with the case and a partition body in which the other side end is in contact with the case appear alternately. Arranged in parallel,
By inserting the plurality of compartments into the refrigerant passage of one case, one refrigerant passage is partitioned with respect to the planar direction,
The partitioned refrigerant passages face the front and the back of each of the plurality of partitions, pass through the front and back of one partition, and pass through all the partitions.
Each of the front and back surfaces of each partition is formed with a protruding portion that protrudes into the refrigerant passage, and the side surface and the tip surface of the protruding portion are exposed in the refrigerant passage,
There is no partition between adjacent compartments,
In adjacent compartments, the protruding positions of the front-side protruding portion and the rear-side protruding portion are different, and the front-end surface of the front-side protruding portion and the front-end surface of the rear-side protruding portion protrude from the protruding portion. Aligned slightly spaced in the direction,
A semiconductor cooling device. The protrusion has a convex shape extending along the refrigerant passage;
  In adjacent compartments, the front end surface of the front-side protruding portion faces the recess formed between the rear-side protruding portions, and the front surface of the front-side protruding portion and the front end of the rear-side protruding portion 2. The semiconductor cooling device according to claim 1, wherein the end portions of the surfaces are slightly spaced from each other. A substantially rectangular parallelepiped space is secured in the case,
The space facing the side ends of the partition bodies arranged in parallel is provided with a further space at a position corresponding to every other side end of the partition bodies. Semiconductor cooling device. The semiconductor cooling device according to any one of claims 1 to 3, wherein the case and the partition are formed of different members and are combined.

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