JP4375477B2

JP4375477B2 - Modular jack

Info

Publication number: JP4375477B2
Application number: JP2007291158A
Authority: JP
Inventors: 太西村; 裕寿奥野; 耕司山下
Original assignee: Panasonic Corp; Matsushita Electric Works Ltd
Current assignee: Panasonic Corp; Panasonic Electric Works Co Ltd
Priority date: 2007-11-08
Filing date: 2007-11-08
Publication date: 2009-12-02
Anticipated expiration: 2022-03-26
Also published as: JP2008053245A

Description

本発明は、主として情報通信に用いるモジュラジャックに関するものである。 The present invention relates to a modular jack mainly used for information communication.

従来から、情報通信においてはモジュラジャックとモジュラプラグとからなるコネクタが普及している。この種のコネクタに接続する電線には一般にツイストペアケーブルが用いられており、ツイストペアケーブルは同軸ケーブルに比較すると柔軟性ないし可撓性が大きいから、電線の引き回しが容易になる点で優れている。ところで、この種のコネクタを情報通信に用いる際にはツイストペアケーブルのうちの２ペアまたは４ペアを送受信に用いており、送受信に用いるペア間で誘導性結合（電磁結合）や容量性結合（静電結合）による漏話が生じると通信品質が低下し、情報伝送に障害が生じることがある。また、モジュラジャックないしモジュラプラグのインピーダンスがツイストペアケーブルとは異なっていると伝送される信号に反射が生じて信号が減衰することになる。要するに、この種のコネクタでは漏話および反射を低減することが重要である。 Conventionally, connectors comprising modular jacks and modular plugs have been widely used in information communication. Generally, a twisted pair cable is used as an electric wire connected to this type of connector, and the twisted pair cable is superior in flexibility and flexibility as compared with a coaxial cable, and is excellent in that the electric wire can be easily routed. By the way, when this type of connector is used for information communication, two or four pairs of twisted pair cables are used for transmission and reception, and inductive coupling (electromagnetic coupling) and capacitive coupling (static coupling) are used between the pairs used for transmission and reception. If crosstalk due to (electrical coupling) occurs, the communication quality may deteriorate and the information transmission may be disturbed. If the impedance of the modular jack or modular plug is different from that of the twisted pair cable, the transmitted signal is reflected and the signal is attenuated. In short, it is important to reduce crosstalk and reflection in this type of connector.

ところで、漏話には信号源側（近端側）において他ペアに信号が漏れる近端漏話と信号源に対して遠方側（遠端側）において他ペアに信号が漏れる遠端漏話とがあるが、とくに近端漏話による漏話量を低減することが重要である。信号源から送信した信号の大きさに対する近端漏話の信号の比は近端漏話減衰量（以下、「ＮＥＸＴ」と略称する）と呼ばれている。つまり、漏話を低減させるに際しては、ＮＥＸＴの低減を考慮することが必要である。なお、反射については信号源から与えた信号に対する反射による損失の比である反射減衰量（以下、「ＲＬ」と略称する）によって表す。 By the way, the crosstalk includes a near-end crosstalk in which a signal leaks to another pair on the signal source side (near-end side) and a far-end crosstalk in which a signal leaks to another pair on the far side (far-end side) with respect to the signal source. In particular, it is important to reduce the amount of crosstalk due to near-end crosstalk. The ratio of the near-end crosstalk signal to the magnitude of the signal transmitted from the signal source is called near-end crosstalk attenuation (hereinafter abbreviated as “NEXT”). In other words, when reducing crosstalk, it is necessary to consider the reduction of NEXT. The reflection is represented by a reflection attenuation amount (hereinafter, abbreviated as “RL”), which is a ratio of loss due to reflection to a signal given from a signal source.

ここに、モジュラプラグはモジュラジャックに差し込まれるからモジュラジャックに比較すると小型であって部材の配置変更が難しく、しかもモジュラジャックに対して電気的に接続される接触子が並設されて容量性結合が生じやすい構造になっているから、結果的に漏話が比較的大きくなるという問題がある。そこで、モジュラプラグをモジュラジャックに結合した状態でのコネクタの全体としての漏話が低減されるようにモジュラジャック側において漏話を調節することが提案されている。 Here, since the modular plug is inserted into the modular jack, it is smaller than the modular jack, and it is difficult to change the arrangement of the members. Moreover, the contacts that are electrically connected to the modular jack are arranged in parallel and capacitively coupled. As a result, there is a problem that crosstalk becomes relatively large. Thus, it has been proposed to adjust the crosstalk on the modular jack side so that the overall crosstalk of the connector with the modular plug coupled to the modular jack is reduced.

モジュラジャックにおいて漏話を調節する技術としては、ＮＥＸＴを低減させようとするペア間にコンデンサに相当する部材を設けてペア間の容量成分を補償する技術が考えられている（たとえば、特許文献１参照）。また、モジュラジャックにおける導電部材の一部を交差させることによってＮＥＸＴを低減させる技術も知られている（たとえば、特許文献２参照）。
特開平６−２４３９３７号公報特開平６−８４５６２号公報 As a technique for adjusting crosstalk in a modular jack, a technique for compensating a capacitance component between pairs by providing a member corresponding to a capacitor between a pair to reduce NEXT is considered (for example, see Patent Document 1). ). In addition, a technique for reducing NEXT by crossing a part of a conductive member in a modular jack is also known (see, for example, Patent Document 2).
JP-A-6-243937 JP-A-6-84562

ところで、最近では通信速度が高速化されてきており、通信速度の向上に伴ってモジュラジャックに要求される帯域幅も大きくなってきている。しかしながら、上述したようなコンデンサに相当する部材を用いたり導電部材の一部を交差させる技術だけでは漏話を補償できる範囲が狭く、通信速度の高速化に伴って要求されている帯域幅の全体にわたって漏話を十分に調節することは困難である。つまり、上述した構成ではモジュラプラグの漏話を広い帯域幅においてモジュラジャック側で補償することは困難である。 By the way, recently, the communication speed has been increased, and the bandwidth required for the modular jack has increased as the communication speed has increased. However, the range in which crosstalk can be compensated only by using a member corresponding to the capacitor as described above or by crossing a part of the conductive member is narrow, and the entire bandwidth required as the communication speed is increased. It is difficult to fully adjust the crosstalk. In other words, with the configuration described above, it is difficult to compensate for the crosstalk of the modular plug on the modular jack side over a wide bandwidth.

本発明は上記事由に鑑みて為されたものであり、その目的は、近端漏話減衰量の周波数特性を容易に調節することができるモジュラジャックを提供することにある。 The present invention has been made in view of the above reasons, and an object thereof is to provide a modular jack that can easily adjust the frequency characteristics of near-end crosstalk attenuation.

請求項１の発明は、モジュラプラグを挿入するプラグ挿入口が開口するハウジングと、プラグ挿入口の中に複数ペアが並行して配列されプラグ挿入口に挿入されたモジュラプラグの接触子に弾接可能なコンタクトと、コンタクトが植設されハウジングに結合された印刷配線基板を備えるコンタクト保持基板と、コンタクト保持基板に植設され各コンタクトに一対一に対応する複数個の端子とを備え、印刷配線基板が４層の導電層および導電層間を接続するスルーホールメッキまたはビアホールメッキを形成した多層配線基板からなり、印刷配線基板に形成した伝送路におけるコンタクト側の端部と端子側の端部とにそれぞれ各２個の伝送路間で静電結合を生じさせる第１および第２の静電結合部が形成されるとともに、印刷配線基板に形成した伝送路におけるコンタクト側の端部と端子側の端部との中間部には各２個の伝送路間を電磁結合が生じる程度に近接させた第１の電磁結合部が形成され、さらに伝送路と第２の静電結合部との間に形成されるとともに他の導電層の導電パターンにスルーホールメッキまたはビアホールメッキにより接続された漏洩パターンと他の伝送路に形成されるとともに他の導電層の導電パターンにスルーホールメッキまたはビアホールメッキにより接続された漏洩パターンとを電磁結合が生じる程度に近接させた第２の電磁結合部が形成されていることを特徴とする。 According to a first aspect of the present invention, there is provided a housing in which a plug insertion port into which a modular plug is inserted is opened, and a plurality of pairs arranged in parallel in the plug insertion port and elastically contacted with contacts of the modular plug inserted into the plug insertion port. A printed wiring board comprising: a contact holding board including a possible contact; a printed wiring board in which the contact is implanted and coupled to the housing; and a plurality of terminals implanted in the contact holding board and corresponding to each contact on a one-to-one basis The substrate is composed of a multilayer wiring board in which through-hole plating or via-hole plating for connecting the four conductive layers and the conductive layers is formed. The transmission side formed on the printed wiring board has a contact side end and a terminal side end. First and second electrostatic coupling portions for generating electrostatic coupling between each two transmission lines are formed and formed on the printed wiring board. A first electromagnetic coupling portion is formed in an intermediate portion between the contact-side end portion and the terminal-side end portion of the transmission path so that the two transmission paths are close enough to cause electromagnetic coupling. Formed between the first and second electrostatic coupling portions and connected to the conductive pattern of the other conductive layer by through-hole plating or via-hole plating, and formed in another transmission path and the other conductive layer A second electromagnetic coupling portion is formed by bringing the leakage pattern connected to the conductive pattern by through-hole plating or via-hole plating close enough to cause electromagnetic coupling.

請求項２の発明は、請求項１の発明において、前記端子のうちペアになる端子は隣接して配置され、複数ペアの端子が並ぶ方向において各端子が千鳥状に配列されていることを特徴とする。 According to a second aspect of the present invention, in the first aspect of the present invention, the paired terminals are arranged adjacent to each other, and the terminals are arranged in a staggered manner in the direction in which a plurality of pairs of terminals are arranged. And

請求項３の発明は、請求項１または請求項２の発明において、前記印刷配線基板の要所に伝送路間の静電結合による漏話量を低減させるように基材の一部を切除した離間溝が形成されていることを特徴とする。 According to a third aspect of the present invention, in the first or second aspect of the present invention, a part of the base material is cut away so as to reduce the amount of crosstalk due to electrostatic coupling between transmission lines at the important points of the printed wiring board. A groove is formed.

請求項４の発明は、請求項１または請求項２の発明において、前記印刷配線基板の要所に伝送路間の静電結合による漏話量を増加させるように基材の一部に基材よりも比誘電率の高い材料からなる結合部が形成されていることを特徴とする。 According to a fourth aspect of the present invention, in the first or second aspect of the present invention, a part of the base material is more than a base material so as to increase the amount of crosstalk due to electrostatic coupling between transmission lines at the important points of the printed wiring board. Is also characterized in that a coupling portion made of a material having a high relative dielectric constant is formed.

請求項１の発明の構成によれば、コンタクト側と端子側との２箇所に静電結合部を設けるとともにコンタクトと端子との中間部において第１の電磁結合部を設けていることにより、静電結合部および電磁結合部での結合量の調節によって漏話量を調節することができるのはもちろんのこと、伝送路と第２の静電結合部との間に形成されるとともに他の導電層の導電パターンにスルーホールメッキまたはビアホールメッキにより接続された漏洩パターンと他の伝送路に形成されるとともに他の導電層の導電パターンにスルーホールメッキまたはビアホールメッキにより接続された漏洩パターンとを電磁結合が生じる程度に近接させた第２の電磁結合部を形成しているから、漏洩パターンを調整要素とすることで漏話量の周波数特性を調節することが可能になり、目的とする周波数帯域において漏話量の周波数特性を所望量に調節することが容易になる。 According to the configuration of the first aspect of the present invention, the electrostatic coupling portions are provided at two locations on the contact side and the terminal side, and the first electromagnetic coupling portion is provided at the intermediate portion between the contact and the terminal. The amount of crosstalk can be adjusted by adjusting the amount of coupling at the electric coupling portion and the electromagnetic coupling portion, and it is formed between the transmission line and the second electrostatic coupling portion and other conductive layers. Electromagnetic coupling between the leakage pattern connected to the conductive pattern of the through hole or via hole plating and the leakage pattern formed in another transmission line and connected to the conductive pattern of the other conductive layer by through hole plating or via hole plating Since the second electromagnetic coupling part is formed so as to be close to the extent of occurrence of the crosstalk, the frequency characteristics of the crosstalk amount can be adjusted by using the leakage pattern as an adjustment element. Allows, becomes the frequency characteristic of the crosstalk amount in the frequency band of interest can be easily adjusted to the desired amount.

請求項２の発明の構成によれば、端子を直線状に配列している場合に比較してペアではない端子間での漏話が一層少なくなり、漏話量の周波数特性を印刷配線基板において調節するのが容易になる。 According to the configuration of the invention of claim 2, the crosstalk between the terminals which are not a pair is further reduced as compared with the case where the terminals are arranged in a straight line, and the frequency characteristics of the crosstalk amount are adjusted in the printed wiring board. It becomes easy.

請求項３の発明の構成によれば、離間溝の寸法を適宜に設定することによって漏話量を容易に調節することができる。 According to the configuration of the invention of claim 3, the amount of crosstalk can be easily adjusted by appropriately setting the dimension of the separation groove.

請求項４の発明の構成によれば、結合部の寸法ないし材料を適宜に設定することにより漏話量を容易に調節することができる。 According to the configuration of the invention of claim 4, the crosstalk amount can be easily adjusted by appropriately setting the size or material of the coupling portion.

（第１の実施の形態）
本実施形態では、ＮＥＸＴの周波数特性に関する調節を容易にした構成を例示するが、漏話量の調節に伴ってＲＬについても低減するように調節することが可能である。図１および図２に示すように、８極８芯のモジュラジャックを示す。図示するモジュラジャックは、８本のコンタクト１１ａ〜１１ｈを保持するコンタクト保持基板１を備える。コンタクト保持基板１の厚み方向の一面には支持基板２が当接し、コンタクト保持基板１の厚み方向の他面には端子台３が被着される。コンタクト保持基板１と支持基板２と端子台３とは一体に結合されるとともにハウジング４に結合される。 (First embodiment)
In the present embodiment, a configuration that facilitates adjustment related to the frequency characteristics of NEXT is illustrated, but it is possible to adjust so that RL is also reduced as the crosstalk amount is adjusted. As shown in FIGS. 1 and 2, an 8-pole 8-core modular jack is shown. The illustrated modular jack includes a contact holding substrate 1 that holds eight contacts 11a to 11h. The support substrate 2 abuts on one surface of the contact holding substrate 1 in the thickness direction, and the terminal block 3 is attached to the other surface of the contact holding substrate 1 in the thickness direction. The contact holding substrate 1, the support substrate 2, and the terminal block 3 are coupled together and are coupled to the housing 4.

ハウジング４は、図示しないモジュラプラグを挿入するためのプラグ挿入口４１が前面（図２の左面）に開口した角筒状のカバー体４２と、カバー体４２の後面下部（図２の右面下部）から後方に延設された台板４３とを連続一体に備える形状に合成樹脂成形品により形成されている。カバー体４２に設けたプラグ挿入口４１の上縁内周面にはモジュラプラグを係止する係止突部４４が形成される。プラグ挿入口４１はカバー体４２の前面の下部に立ち上がり片４５を残す形で開口する。台板４３の中央部には組立孔４６が開口し、後述するように支持基板２に設けた組立突起２１を組立孔４６に係合させることによって、コンタクト保持基板１と支持基板２と端子台３とを一体に結合した部材がハウジング４に結合される。さらに、カバー体４２の後面下部にはプラグ挿入口４１に連通する結合孔４７が開口する。コンタクト保持基板１と支持基板２と端子台３とを一体に結合した部材は結合孔４７に挿入され、コンタクト保持基板１に設けたコンタクト１１ａ〜１１ｈがカバー体４２の内部に挿入される。 The housing 4 includes a rectangular tubular cover body 42 in which a plug insertion port 41 for inserting a modular plug (not shown) is opened on the front surface (left surface in FIG. 2), and a lower rear surface of the cover body 42 (lower right surface in FIG. 2). Is formed of a synthetic resin molded product in a shape that continuously and integrally includes a base plate 43 that extends rearward from the base plate. A locking protrusion 44 for locking the modular plug is formed on the inner peripheral surface of the upper edge of the plug insertion port 41 provided in the cover body 42. The plug insertion opening 41 is opened in such a manner that a rising piece 45 is left in the lower part of the front surface of the cover body 42. An assembly hole 46 is opened in the central portion of the base plate 43, and an assembly projection 21 provided on the support substrate 2 is engaged with the assembly hole 46 as will be described later, whereby the contact holding substrate 1, the support substrate 2, and the terminal block. 3 is integrally coupled to the housing 4. Further, a coupling hole 47 communicating with the plug insertion port 41 is opened at the lower rear surface of the cover body 42. A member obtained by integrally joining the contact holding substrate 1, the support substrate 2, and the terminal block 3 is inserted into the coupling hole 47, and the contacts 11 a to 11 h provided on the contact holding substrate 1 are inserted into the cover body 42.

コンタクト保持基板１は、後述するように導電パターンの形成されている導電層を４層備えた印刷配線基板１２を有し、印刷配線基板１２に８本のコンタクト１１ａ〜１１ｈの一端部を植設してある。コンタクト１１ａ〜１１ｈは金属の線材を用いてもよいが、金属板を打ち抜き形成した部材（リードフレーム）を用いるほうが実装が容易である。図３および図４に示すように、印刷配線基板１２は前後方向が左右方向よりも長い矩形状であって、長手方向の一端部（前端部）にはコンタクト１１ａ〜１１ｈの他端部を保持する合成樹脂成形品の櫛部材１４が固着され、さらにコンタクト１１ａ〜１１ｈの中間部を支持するために合成樹脂成形品の分離基台１５が印刷配線基板１２上に固定される。 As will be described later, the contact holding substrate 1 includes a printed wiring board 12 having four conductive layers on which conductive patterns are formed, and one end portions of eight contacts 11a to 11h are implanted in the printed wiring board 12. It is. The contacts 11a to 11h may use metal wires, but mounting is easier if a member (lead frame) formed by punching a metal plate is used. As shown in FIGS. 3 and 4, the printed wiring board 12 has a rectangular shape whose longitudinal direction is longer than the lateral direction, and holds the other end portions of the contacts 11 a to 11 h at one end portion (front end portion) in the longitudinal direction. The comb member 14 of the synthetic resin molded product to be fixed is fixed, and the separation base 15 of the synthetic resin molded product is fixed on the printed wiring board 12 in order to support the intermediate portions of the contacts 11a to 11h.

櫛部材１４は印刷配線基板１２の下面に当接する受け片１４ａが延設されるとともに、印刷配線基板１２の上面に係止される挟み片１４ｂが延設されることにより、印刷配線基板１２に対する上下方向への移動が抑制されている。印刷配線基板１２と受け片１４ａとが重複する部位には印刷配線基板１２と受け片１４ａとを貫通する位置決め孔１２ａが開口する。櫛部材１４には各コンタクト１１ａ〜１１ｈの先端部（前記他端部）がそれぞれ挿入される８個の櫛溝１４ｃが形成され、櫛溝１４ｃにより各コンタクト１１ａ〜１１ｈの先端部同士が互いに接触することが防止され、しかも印刷配線基板１２の厚み方向に可撓となるようにコンタクト１１ａ〜１１ｈの先端部が保持される。櫛部材１４の下部は印刷配線基板１２の左右幅と略等しく形成され、櫛部材１４において印刷配線基板１２の上面よりも上方に突出する部位の左右幅（図４における上下幅）は下部よりも狭幅に形成されているのであって、櫛部材１４の左右両側部には段差部１４ｄが形成されている。印刷配線基板１２の前端部および櫛部材１４の左右両側部はカバー体４２の内周面に形成した位置決め溝（図示せず）に噛み合うことによって、コンタクト保持基板１はハウジング４に対して上下方向および左右方向への移動が規制される。また、カバー体４２の結合孔４７にコンタクト保持基板１を挿入すると、櫛部材１４の前面が立ち上がり片４５の後面に対向し、印刷配線基板１２の左右両側部に設けた係止段部１２ｂがカバー体４２の後面に当接するとともに、上述した組立突起２１が台板４３の組立孔４６に係合し、ハウジング４に対してコンタクト保持基板１の前後方向への移動が規制される。 The comb member 14 has a receiving piece 14 a that contacts the lower surface of the printed wiring board 12, and a clip piece 14 b that is locked to the upper surface of the printed wiring board 12, thereby extending the comb member 14. The movement in the vertical direction is suppressed. A positioning hole 12a penetrating the printed wiring board 12 and the receiving piece 14a is opened at a portion where the printed wiring board 12 and the receiving piece 14a overlap. The comb member 14 is formed with eight comb grooves 14c into which the tip portions (the other end portions) of the contacts 11a to 11h are inserted, and the tip portions of the contacts 11a to 11h are in contact with each other by the comb groove 14c. In addition, the tips of the contacts 11 a to 11 h are held so as to be flexible in the thickness direction of the printed wiring board 12. The lower part of the comb member 14 is formed to be substantially equal to the left and right width of the printed wiring board 12, and the left and right width (vertical width in FIG. 4) of the portion protruding above the upper surface of the printed wiring board 12 in the comb member 14 is lower than the lower part. The step 14 d is formed on the left and right sides of the comb member 14 because it is formed narrow. The front end portion of the printed wiring board 12 and the left and right side portions of the comb member 14 are engaged with positioning grooves (not shown) formed on the inner peripheral surface of the cover body 42, so that the contact holding substrate 1 is vertically oriented with respect to the housing 4. And movement in the left-right direction is restricted. Further, when the contact holding substrate 1 is inserted into the coupling hole 47 of the cover body 42, the front surface of the comb member 14 faces the rear surface of the rising piece 45, and the locking step portions 12 b provided on the left and right side portions of the printed wiring board 12 are provided. While contacting the rear surface of the cover body 42, the above-described assembly protrusion 21 engages with the assembly hole 46 of the base plate 43, and the movement of the contact holding substrate 1 in the front-rear direction with respect to the housing 4 is restricted.

いま、図４に示すように、各コンタクト１１ａ〜１１ｈが下から順に並んでいるものとすれば、コンタクト１１ａ，１１ｂとコンタクト１１ｃ，１１ｆとコンタクト１１ｄ，１１ｅとコンタクト１１ｇ，１１ｈとの２個ずつがそれぞれペアになる。各ペアを構成するコンタクト１１ａ〜１１ｈのうちの一方は一般にチップと呼ばれ、他方はリングと呼ばれており、本実施形態では、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇと、リングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈとで形状を異ならせてある。また、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇの印刷配線基板１２への実装位置は、リングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈの実装位置よりも櫛部材１４から離れる（たとえば、２ｍｍ程度後方になる）ように配置してあり、各コンタクト１１ａ〜１１ｈの印刷配線基板１２への実装位置は千鳥状に配列される。 As shown in FIG. 4, if the contacts 11a to 11h are arranged in order from the bottom, two contacts 11a and 11b, contacts 11c and 11f, contacts 11d and 11e, and contacts 11g and 11h, respectively. Are each paired. One of the contacts 11a to 11h constituting each pair is generally called a chip, and the other is called a ring. In this embodiment, the contacts 11a, 11c, 11e, and 11g that become chips are rings. The contacts 11b, 11d, 11f, and 11h have different shapes. Further, the mounting positions of the contacts 11a, 11c, 11e, and 11g to be chips on the printed wiring board 12 are farther from the comb member 14 than the mounting positions of the contacts 11b, 11d, 11f, and 11h to be rings (for example, about 2 mm). The mounting positions of the contacts 11a to 11h on the printed wiring board 12 are arranged in a zigzag pattern.

分離基台１５の下面には固定脚１５ｃが突設され、印刷配線基板１２に形成した固定孔１２ｃに固定脚１５ｃを挿入することにより分離基台１５が印刷配線基板１２に固定される。分離基台１５には各コンタクト１１ａ〜１１ｈが互いに接触しないように分離する分離溝１５ａ、１５ｂが形成されており、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇに対応する分離溝１５ａは、リングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈに対応する分離溝１５ｂよりも浅く形成されている。つまり、分離基台１５に対応する部位では、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇは、リングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈよりも印刷配線基板１２からの距離が大きくなっている。ただし、コンタクト１１ａ〜１１ｈにおいてモジュラプラグの接触子と接触する部位（櫛部材１４の近傍）では印刷配線基板１２からの距離が等しくなる形状に形成してある。したがって、コンタクト１１ａ〜１１ｈの折曲部位については、印刷配線基板１２への実装部位の近傍において略９０度に折曲された部位が最大の曲げ角度になる。 A fixing leg 15 c projects from the lower surface of the separation base 15, and the separation base 15 is fixed to the printed wiring board 12 by inserting the fixing leg 15 c into a fixing hole 12 c formed in the printed wiring board 12. Separation grooves 15a and 15b are formed in the separation base 15 so that the contacts 11a to 11h do not come into contact with each other, and the separation grooves 15a corresponding to the contacts 11a, 11c, 11e, and 11g that become chips are formed in a ring. It is formed shallower than the separation groove 15b corresponding to the contacts 11b, 11d, 11f, and 11h. In other words, at the portion corresponding to the separation base 15, the contacts 11a, 11c, 11e, and 11g serving as the chips have a greater distance from the printed wiring board 12 than the contacts 11b, 11d, 11f, and 11h serving as the rings. . However, the contacts 11a to 11h are formed in a shape in which the distance from the printed wiring board 12 is equal at a portion (in the vicinity of the comb member 14) in contact with the contact of the modular plug. Accordingly, with respect to the bent portions of the contacts 11a to 11h, the portion bent at approximately 90 degrees in the vicinity of the portion mounted on the printed wiring board 12 has the maximum bending angle.

上述した説明から明らかなように、各コンタクト１１ａ〜１１ｈは印刷配線基板１２に実装した部位の近傍において分離基台１５に支持されて分離基台１５との当接部位を固定端とし、他端部は櫛部材１４に挿入されて上下方向に移動可能な自由端となった片持ち梁構造を有している。また、各コンタクト１１ａ〜１１ｈにおいてモジュラプラグに接触する部位と印刷配線基板１２に実装される部位との間では、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇとリングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈとの間の距離が比較的大きくなるように配置してある。具体的には、モジュラプラグに接触する部位と分離基台１５との間では、チップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇとリングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈとは左右方向だけではなく上下方向においても離れて配置され、さらに印刷配線基板１２に対する実装部位もチップになるコンタクト１１ａ，１１ｃ，１１ｅ，１１ｇがリングになるコンタクト１１ｂ，１１ｄ，１１ｆ，１１ｈよりも後方に位置している。このように、コンタクト１１ａ〜１１ｈ同士の距離を比較的大きくとることによって、コンタクト１１ａ〜１１ｈの間の誘導性結合（電磁結合）が小さくなり、またコンタクト１１ａ〜１１ｈの間の容量成分が小さくなることによって容量性結合（静電結合）も小さくなる。 As is clear from the above description, each of the contacts 11a to 11h is supported by the separation base 15 in the vicinity of the portion mounted on the printed wiring board 12, and a contact portion with the separation base 15 is a fixed end and the other end. The part has a cantilever structure which is inserted into the comb member 14 and becomes a free end movable in the vertical direction. Further, in each of the contacts 11a to 11h, between the portion that contacts the modular plug and the portion that is mounted on the printed wiring board 12, the contacts 11a, 11c, 11e, and 11g that become chips and the contacts 11b, 11d, and 11f that become rings. , 11h, the distance is relatively large. Specifically, the contacts 11a, 11c, 11e, and 11g that become the chips and the contacts 11b, 11d, 11f, and 11h that become the rings between the portion that contacts the modular plug and the separation base 15 are only in the left-right direction. The contacts 11a, 11c, 11e, and 11g that become chips are also located behind the contacts 11b, 11d, 11f, and 11h that become rings, and are arranged apart from each other in the vertical direction. . As described above, by making the distance between the contacts 11a to 11h relatively large, inductive coupling (electromagnetic coupling) between the contacts 11a to 11h is reduced, and a capacitance component between the contacts 11a to 11h is reduced. As a result, capacitive coupling (electrostatic coupling) is also reduced.

印刷配線基板１２には各コンタクト１１ａ〜１１ｈに対応する端子としての８枚の端子板１６が左右４個ずつ実装される。端子板１６は圧接端子であってＵ字状に切欠された圧接スリット（図示せず）を有し、ツイストペアケーブルの絶縁被覆電線を圧接スリットに圧入することにより絶縁被覆を切って芯線を端子板１６に接触させるものである。印刷配線基板１２の上面に被着される端子台３の上面は、左右両側に突基台３１が突設され、突基台３１の間は端子台３の前後方向の略全長に亘る溝部３２を形成する。各突基台３１には印刷配線基板１２に実装した端子板１６を差し込む４個ずつのスリット孔３３が形成される。また、各突基台３１の上面には各端子板１６の圧接スリットに対応する部位にそれぞれ端子板１６に交差する方向の導入溝３４が形成される。導入溝３４は左右方向に形成されるが、端子板１６は導入溝３４に対して斜めに交差し、左右に並ぶ２個ずつの端子板１６は前端部から後方に向かって互いの距離を広げるように配置されている。しかして、導入溝３４に上方から絶縁被覆電線を圧入すると、導入溝３４に露出する圧接スリットにより絶縁被覆が切られ、端子板１６に芯線が接続されるのである。また、導入溝３４内での絶縁被覆電線の保持強度を高めるために、端子板１６の厚み方向の両側において導入溝３４の内周面には導入溝３４の上下方向（つまり、深さ方向）の全長に亘る保持リブ３４ａが突設されている。したがって、保持リブ３４ａを設けた部位では導入溝３４の幅が狭くなり、幅の狭くなった部位に絶縁被覆電線が圧入されることになる。ツイストペアケーブルの各ペアを構成する２本ずつの絶縁被覆電線は、それぞれ前後方向において隣り合う２個の端子板１６に接続される。また、各ペアを接続する２個の端子板１６の間には四角錐状に突出する分線突起３５が形成される。つまり、各ペアを構成する２本の絶縁被覆電線は撚られているから、絶縁被覆電線を導入溝３４に導入する際に２本の絶縁被覆電線の間に分線突起３５を差し込むことによって、２本の絶縁被覆電線の撚りを解きながら導入溝３４に導入することができ、端子板１６への絶縁被覆電線の接続作業が容易になるのである。 Eight terminal boards 16 as terminals corresponding to the contacts 11a to 11h are mounted on the printed wiring board 12 on the left and right sides, respectively. The terminal plate 16 is a pressure contact terminal and has a pressure contact slit (not shown) cut out in a U shape. The insulation coating is cut by press-fitting an insulation coated wire of a twisted pair cable into the pressure contact slit, and the core wire is connected to the terminal plate. 16 is contacted. On the upper surface of the terminal block 3 to be attached to the upper surface of the printed wiring board 12, protruding bases 31 protrude from the left and right sides, and the groove 32 extends over the substantially entire length in the front-rear direction of the terminal block 3 between the protruding bases 31. Form. Each protruding base 31 is formed with four slit holes 33 into which the terminal board 16 mounted on the printed wiring board 12 is inserted. In addition, on the upper surface of each protrusion base 31, an introduction groove 34 is formed at a portion corresponding to the pressure contact slit of each terminal plate 16 in a direction intersecting the terminal plate 16. The introduction groove 34 is formed in the left-right direction, but the terminal plate 16 obliquely intersects the introduction groove 34, and the two terminal plates 16 arranged side by side increase the distance from the front end toward the rear. Are arranged as follows. Thus, when the insulation-coated electric wire is press-fitted into the introduction groove 34 from above, the insulation coating is cut by the pressure contact slit exposed in the introduction groove 34, and the core wire is connected to the terminal plate 16. Further, in order to increase the holding strength of the insulated wire in the introduction groove 34, the vertical direction of the introduction groove 34 (that is, the depth direction) is formed on the inner peripheral surface of the introduction groove 34 on both sides in the thickness direction of the terminal plate 16. The holding rib 34a is provided so as to project over the entire length. Therefore, the width of the introduction groove 34 is narrowed at the portion where the holding rib 34a is provided, and the insulation-coated electric wire is press-fitted into the narrowed portion. Two insulation-coated wires constituting each pair of twisted pair cables are connected to two terminal plates 16 adjacent in the front-rear direction. Further, between the two terminal plates 16 that connect each pair, a branching projection 35 protruding in a quadrangular pyramid shape is formed. That is, since the two insulation-coated electric wires constituting each pair are twisted, when the insulation-coated electric wires are introduced into the introduction groove 34, by inserting the branching protrusion 35 between the two insulation-coated electric wires, The two insulation-coated electric wires can be introduced into the introduction groove 34 while untwisting, and the connection work of the insulation-coated electric wires to the terminal plate 16 is facilitated.

ところで、印刷配線基板１２および櫛部材１４の受け片１４ａを貫通するように形成した位置決め孔１２ａには、支持基板２の上面に突設した位置決め突起２２が挿通される。位置決め突起２２は端子台３の前端部にも挿通される。また、支持基板２の後端縁には組立爪２３が上向きに突設され、印刷配線基板１２および端子台３の後端縁にそれぞれ形成された組立切欠１７，３６に組立爪２３が係合するとともに、組立爪２３の先端部に設けたフック２３ａが端子板３の上面に係止される。したがって、位置決め突起２２が位置決め孔１２ａに挿入され、組立爪２３が組立切欠１７，３６に係合することによって、コンタクト保持基板１と支持基板２と端子台３とが一体に結合される。また、上述のように、コンタクト保持基板１と支持基板２と端子台３とを一体に結合した部材はハウジング４に結合されるのであって、コンタクト保持基板１と支持基板２と端子台３との結合後にハウジング４を結合することによって容易に組み立てることができる。 By the way, a positioning projection 22 protruding from the upper surface of the support substrate 2 is inserted into the positioning hole 12a formed so as to penetrate the printed wiring board 12 and the receiving piece 14a of the comb member 14. The positioning protrusion 22 is also inserted through the front end portion of the terminal block 3. Further, an assembly claw 23 projects upward from the rear edge of the support substrate 2, and the assembly claw 23 engages with the assembly notches 17 and 36 formed at the rear edges of the printed wiring board 12 and the terminal block 3, respectively. At the same time, a hook 23 a provided at the tip of the assembly claw 23 is locked to the upper surface of the terminal board 3. Therefore, when the positioning protrusion 22 is inserted into the positioning hole 12a and the assembly claw 23 engages with the assembly notches 17 and 36, the contact holding substrate 1, the support substrate 2, and the terminal block 3 are integrally coupled. In addition, as described above, the member in which the contact holding substrate 1, the support substrate 2, and the terminal block 3 are integrally coupled is coupled to the housing 4, and the contact holding substrate 1, the support substrate 2, the terminal block 3, and the like. It can be easily assembled by connecting the housing 4 after the connection.

次に、本発明の要旨である印刷配線基板１２の構成について具体的に説明する。本実施形態に用いる印刷配線基板１２は導電パターンを形成した導電層を表裏の各面に備えるほかに内部にも２層備える。つまり、印刷配線基板１２には４層の導電層が形成される。以下では、各導電層を最上層から順に第１層Ｆ１、第２層Ｆ２、第３層Ｆ３、第４層Ｆ４として説明する。つまり、第２層Ｆ２と第３層Ｆ３とは印刷配線基板１２の内部に形成されている導電層を意味する。この種の印刷配線基板１２は多層配線基板として形成される。また、以下に説明する印刷配線基板１２では誘導性結合（電磁結合）は１つの導電層の内部で生じる場合と他の導電層との間で生じる場合とがあり、容量性結合（静電結合）は他の導電層との間で生じ１つの導電層の内部では無視できるように設計されているものとする。各導電層における導電パターンを重ねて見ることができるように、第１層Ｆ１〜第４層Ｆ４を示す図５〜図８においては、すべての導電層を上方から見た形で表している。したがって、最下層である第４層Ｆ４を示す図８は印刷配線基板１２の下面（半田を適用する面）に形成されている導電パターンの左右を反転させた形になっている。 Next, the configuration of the printed wiring board 12 that is the gist of the present invention will be specifically described. The printed wiring board 12 used in the present embodiment includes two layers inside as well as a conductive layer having a conductive pattern formed on each of the front and back surfaces. That is, four conductive layers are formed on the printed wiring board 12. Hereinafter, each conductive layer will be described as the first layer F1, the second layer F2, the third layer F3, and the fourth layer F4 in order from the top layer. That is, the second layer F2 and the third layer F3 mean conductive layers formed inside the printed wiring board 12. This type of printed wiring board 12 is formed as a multilayer wiring board. In the printed wiring board 12 described below, inductive coupling (electromagnetic coupling) may occur inside one conductive layer or between other conductive layers, and capacitive coupling (electrostatic coupling). ) Occurs between other conductive layers and is designed to be negligible within one conductive layer. In FIG. 5 to FIG. 8 showing the first layer F1 to the fourth layer F4, all the conductive layers are shown as seen from above so that the conductive patterns in the respective conductive layers can be seen in an overlapping manner. Therefore, FIG. 8 showing the fourth layer F4 which is the lowermost layer has a shape in which the left and right of the conductive pattern formed on the lower surface (surface to which the solder is applied) of the printed wiring board 12 are reversed.

さらに、本実施形態に用いる印刷配線基板１２はすべての導電層を通る１８個のスルーホールＴａ〜Ｔｈ，Ｔ１〜Ｔ８，Ｔ１１，Ｔ１２を有し、スルーホールＴａ〜Ｔｈにはコンタクト１１ａ〜１１ｈがそれぞれ実装され、スルーホールＴ１〜Ｔ８には端子板１６がそれぞれ実装される。スルーホールＴ１〜Ｔ８は左列においては前からＴ１，Ｔ２，Ｔ３，Ｔ６の順で並び、右列においては前からＴ８，Ｔ７，Ｔ４，Ｔ５の順で並ぶ。ここで、左列のスルーホールＴ１，Ｔ２，Ｔ３，Ｔ６ではペアである２個ずつのスルーホール（Ｔ１，Ｔ２）、（Ｔ３，Ｔ６）のうちチップ側（Ｔ１，Ｔ３）が左側に配置されて千鳥状に配列される。また、右列のスルーホールＴ８，Ｔ７，Ｔ４，Ｔ５ではペアである２個ずつのスルーホール（Ｔ８，Ｔ７）、（Ｔ４，Ｔ５）のうちリング側（Ｔ８，Ｔ４）が右側に配置されて千鳥状に配列される。要するに、左列と右列とのいずれにおいてもスルーホールＴ１〜Ｔ８は左側がチップ側になり、右側がリング側になるように千鳥状に配列される。このように端子板１６を千鳥状に配列することによって、端子板１６を直線上に配列する場合に比較すると、ペアではない端子板１６間の漏話量を一層低減することができる。なお、隣接する各一対の端子板１６については、ペアとならない端子板１６間の距離をペアとなる端子板１６間の距離よりも広げてあり、このことによってもペアではない端子板１６間の漏話量が低減される。上述のような端子板１６の配列によって、ペアではない端子板１６間の漏話量を低減することができ、後述する印刷配線基板１２による漏話量の調節の際に端子板１６で生じる漏話の影響を軽減させて漏話量の調節が容易になる。 Further, the printed wiring board 12 used in the present embodiment has 18 through holes Ta to Th, T1 to T8, T11, and T12 that pass through all the conductive layers, and contacts 11a to 11h are provided in the through holes Ta to Th. The terminal board 16 is mounted in each of the through holes T1 to T8. The through holes T1 to T8 are arranged in the order of T1, T2, T3, T6 from the front in the left column, and are arranged in the order of T8, T7, T4, T5 from the front in the right column. Here, in the through-holes T1, T2, T3, and T6 in the left column, the chip side (T1, T3) of the two through-holes (T1, T2) and (T3, T6) that are a pair is arranged on the left side. Arranged in a staggered pattern. Further, in the through holes T8, T7, T4, and T5 in the right row, the ring side (T8, T4) of the two through holes (T8, T7) and (T4, T5) that are a pair is arranged on the right side. Arranged in a staggered pattern. In short, in both the left column and the right column, the through holes T1 to T8 are arranged in a staggered manner so that the left side is the chip side and the right side is the ring side. By arranging the terminal boards 16 in a staggered manner in this way, the amount of crosstalk between the terminal boards 16 that are not a pair can be further reduced as compared with the case where the terminal boards 16 are arranged on a straight line. In addition, about each pair of adjacent terminal boards 16, the distance between the terminal boards 16 which are not paired is expanded rather than the distance between the terminal boards 16 which become a pair, and also between the terminal boards 16 which are not a pair by this The amount of crosstalk is reduced. The arrangement of the terminal boards 16 as described above can reduce the amount of crosstalk between the terminal boards 16 that are not paired, and the influence of crosstalk generated in the terminal board 16 when adjusting the amount of crosstalk by the printed wiring board 12 described later. This makes it easy to adjust the amount of crosstalk.

スルーホールＴ１１，Ｔ１２は左右に並ぶ２個のスルーホールＴ３，Ｔ４の中間付近に形成される。スルーホールＴａ〜ＴｈとスルーホールＴ１〜Ｔ８とは一対一に対応付けられて電気的に接続される。また、以下では各スルーホールＴ１〜Ｔ８にそれぞれ電気的に接続された伝送路をそれぞれスルーホールＴ１〜Ｔ８を表している数字と同じ番号で呼ぶこととし、各伝送路を１番、２番、……、８番として説明する。なお、各導電層の導電パターン間では、スルーホールＴａ〜Ｔｈ，Ｔ１〜Ｔ８，Ｔ１１，Ｔ１２にスルーホールメッキないしビアホールメッキを施すことによって電気的接続がなされる。以下の説明においては、スルーホールメッキないしビアホールメッキに対して電気的に接続していることの意味で、スルーホールＴａ〜Ｔｈ，Ｔ１〜Ｔ８，Ｔ１１，Ｔ１２に電気的に接続するという表現を用いる。 The through holes T11 and T12 are formed near the middle between the two through holes T3 and T4 arranged side by side. The through holes Ta to Th and the through holes T1 to T8 are electrically connected in a one-to-one correspondence. In the following, the transmission lines electrically connected to the through holes T1 to T8 will be referred to by the same numbers as the numbers representing the through holes T1 to T8, respectively. ...... I will explain as No.8. In addition, between the conductive patterns of each conductive layer, the through holes Ta to Th, T1 to T8, T11 and T12 are electrically connected by performing through hole plating or via hole plating. In the following description, the expression “electrically connected to the through holes Ta to Th, T1 to T8, T11, and T12” is used in the sense of being electrically connected to the through hole plating or the via hole plating. .

本実施形態では、主として３番−６番のペアと４番−５番のペアとの間の漏話について考慮した構成例を説明する。最上層である第１層Ｆ１では図５に示すように、３番と６番とに対応するスルーホールＴｃ，Ｔｆに引出パターンＤ１１，Ｄ１２，Ｄ１３を介して静電結合パターンＣ１１，Ｃ１２，Ｃ１３を接続してある。さらに、第１層Ｆ１においてはスルーホールＴ１２にも引出パターンＤ１４を介して静電結合パターンＣ１４が接続される。この静電結合パターンＣ１４はスルーホールＴ１２とスルーホールＴ４との間に位置するように形成される。静電結合パターンＣ１１〜Ｃ１４はコンデンサの一方の電極として機能する導電パターンであって、静電結合を補償するための容量成分の大きさに応じて適宜の面積に設定される。スルーホールＴｃにはそれぞれ引出パターンＤ１１，Ｄ１２を介して２個の静電結合パターンＣ１１，Ｃ１２が接続され、各静電結合パターンＣ１１〜Ｃ１４は後述する第２層Ｆ２の静電結合パターンＣ２１〜Ｃ２４と静電結合する位置に配置される。 In the present embodiment, a configuration example in which crosstalk between the No. 3-6 pair and the No. 4-5 pair is mainly considered will be described. In the first layer F1, which is the uppermost layer, as shown in FIG. 5, electrostatic coupling patterns C11, C12, C13 are formed in through holes Tc, Tf corresponding to No. 3 and No. 6 via lead patterns D11, D12, D13. Is connected. Further, in the first layer F1, the electrostatic coupling pattern C14 is also connected to the through hole T12 via the lead pattern D14. The electrostatic coupling pattern C14 is formed so as to be positioned between the through hole T12 and the through hole T4. The electrostatic coupling patterns C11 to C14 are conductive patterns that function as one electrode of the capacitor, and are set to have an appropriate area according to the size of the capacitance component for compensating for electrostatic coupling. Two electrostatic coupling patterns C11 and C12 are connected to the through holes Tc through lead patterns D11 and D12, respectively, and the electrostatic coupling patterns C11 to C14 are electrostatic coupling patterns C21 to C2 of the second layer F2, which will be described later. It is arranged at a position where it is electrostatically coupled to C24.

第２層Ｆ２では図６に示すように、１番、３番、６番、８番についてそれぞれスルーホールＴａ，Ｔｃ，Ｔｆ，ＴｈとスルーホールＴ１，Ｔ３，Ｔ６，Ｔ８とを接続する接続パターンＰ２１，Ｐ２３，Ｐ２６，Ｐ２８が形成される。各接続パターンＰ２１，Ｐ２３，Ｐ２６，Ｐ２８は前後方向および左右方向に引き回され、１番−３番の接続パターンＰ２１，Ｐ２３と、６番−８番の接続パターンＰ２６，Ｐ２８とについては、それぞれ電磁結合が生じるように前後方向に沿う部分の少なくとも一部を近接させて配置してある。すなわち、１番、３番、６番、８番の接続パターンＰ２１，Ｐ２３，Ｐ２６，Ｐ２８の一部には電磁結合パターンＬ２１，Ｌ２３，Ｌ２６，Ｌ２８が形成され、電磁結合パターンＬ２１，Ｌ２３の間と電磁結合パターンＬ２６，Ｌ２８の間とにそれぞれ電磁結合が生じる。さらに、第２層Ｆ２では４番に対応するスルーホールＴ４に引出パターンＤ２４を介して静電結合パターンＣ２４が接続される。引出パターンＤ２４と接続パターンＰ２６とは、電磁結合が生じるように前後方向に沿う部分の一部を近接させて配置してある。つまり、引出パターンＤ２４と接続パターンＰ２６との近接部位が前後方向に沿った漏洩パターンＫ２４，Ｋ２６になり、漏洩パターンＫ２４，Ｋ２６によって電磁結合部が形成される。また、静電結合パターンＣ２４は第１層Ｆ１の静電結合パターンＣ１４に対向する。第２層Ｆ２においては、スルーホールＴａ，Ｔｅ，Ｔｈに引出パターンＤ２１，Ｄ２２，Ｄ２３を介して静電結合パターンＣ２１，Ｃ２２，Ｃ２３が接続され、各静電結合パターンＣ２１〜Ｃ２３は第１層Ｆ１の静電結合パターンＣ１１〜Ｃ１３に対向する。なお、第２層Ｆ２では電磁結合パターンＬ２６と漏洩パターンＫ２６との中間部が引出パターンＤ２６を介してスルーホールＴ１１に接続される。 In the second layer F2, as shown in FIG. 6, the connection patterns for connecting the through holes Ta, Tc, Tf, Th and the through holes T1, T3, T6, T8 with respect to No. 1, No. 3, No. 6, and No. 8, respectively. P21, P23, P26, and P28 are formed. The connection patterns P21, P23, P26, and P28 are routed in the front-rear direction and the left-right direction, and the first to third connection patterns P21 and P23 and the sixth to eighth connection patterns P26 and P28 are respectively At least a part of the portion along the front-rear direction is arranged close to the other so that electromagnetic coupling occurs. That is, the electromagnetic coupling patterns L21, L23, L26, and L28 are formed in part of the first, third, sixth, and eighth connection patterns P21, P23, P26, and P28, and between the electromagnetic coupling patterns L21 and L23. And electromagnetic coupling patterns L26 and L28 are respectively electromagnetically coupled. Further, in the second layer F2, the electrostatic coupling pattern C24 is connected to the through hole T4 corresponding to No. 4 via the lead pattern D24. The lead-out pattern D24 and the connection pattern P26 are arranged such that a part of the portion along the front-rear direction is close so that electromagnetic coupling occurs. That is, the proximity part of the drawing pattern D24 and the connection pattern P26 becomes the leakage patterns K24 and K26 along the front-rear direction, and an electromagnetic coupling portion is formed by the leakage patterns K24 and K26. The electrostatic coupling pattern C24 faces the electrostatic coupling pattern C14 of the first layer F1. In the second layer F2, electrostatic coupling patterns C21, C22, and C23 are connected to the through holes Ta, Te, and Th through extraction patterns D21, D22, and D23, and the electrostatic coupling patterns C21 to C23 are connected to the first layer. It faces the electrostatic coupling patterns C11 to C13 of F1. In the second layer F2, an intermediate portion between the electromagnetic coupling pattern L26 and the leakage pattern K26 is connected to the through hole T11 via the lead pattern D26.

第３層Ｆ３では図７に示すように、２番、４番、５番、７番についてそれぞれスルーホールＴｂ，Ｔｄ，Ｔｅ，ＴｇとスルーホールＴ２，Ｔ４，Ｔ５，Ｔ７とを接続する接続パターンＰ３２，Ｐ３４，Ｐ３５，Ｐ３７が形成される。２番−５番の接続パターンＰ３２，Ｐ３５と４番−７番の接続パターンＰ３４，Ｐ３７とについては、それぞれ電磁結合が生じるように、電磁結合パターンＬ３２，Ｌ３４，Ｌ３５，Ｌ３７が形成されている。これらの電磁結合パターンＬ３２，Ｌ３４，Ｌ３５，Ｌ３７は第２層Ｆ２の電磁結合パターンＬ２１，Ｌ２３，Ｌ２６，Ｌ２８にそれぞれ重なる位置に形成され、Ｌ２１−Ｌ３２、Ｌ２３−Ｌ３５、Ｌ２６−Ｌ３４、Ｌ２８−Ｌ３７の間でそれぞれ電磁結合が生じるようにしてある。また、スルーホールＴｅとスルーホールＴ５との間の接続パターンＰ３５には、スルーホールＴ１１，Ｔ１２とスルーホールＴ３との間の部位で分岐した引出パターンＤ３１を介して静電結合パターンＣ３１が接続される。さらに、スルーホールＴｆにも引出パターンＤ３２を介して静電結合パターンＣ３２が接続され、静電結合パターンＣ３２は後述する第４層Ｆ４の静電結合パターンＣ４２と対向するように配置される。さらに、スルーホールＴｄとスルーホールＴ４との間の接続パターンＰ３４の一部と第２層Ｆ２に設けた接続パターンＰ２６とは比較的長い範囲に亘って対向して電磁結合を生じ、またスルーホールＴｅとスルーホールＴ５との間の接続パターンＰ３５の一部と第２層Ｆ２に設けた接続パターンＰ２３とについても比較的長い範囲に亘って対向して電磁結合を生じる。 In the third layer F3, as shown in FIG. 7, connection patterns for connecting the through holes Tb, Td, Te, Tg and the through holes T2, T4, T5, T7 with respect to Nos. 2, 4, 5, and 7 respectively. P32, P34, P35, and P37 are formed. The second to fifth connection patterns P32 and P35 and the fourth to seventh connection patterns P34 and P37 are formed with electromagnetic coupling patterns L32, L34, L35, and L37 so that electromagnetic coupling occurs. . These electromagnetic coupling patterns L32, L34, L35, and L37 are formed at positions overlapping the electromagnetic coupling patterns L21, L23, L26, and L28 of the second layer F2, respectively, and L21-L32, L23-L35, L26-L34, L28-. Electromagnetic coupling occurs between L37. In addition, the electrostatic coupling pattern C31 is connected to the connection pattern P35 between the through hole Te and the through hole T5 via the lead pattern D31 branched at a portion between the through holes T11 and T12 and the through hole T3. The Further, the electrostatic coupling pattern C32 is also connected to the through hole Tf via the lead pattern D32, and the electrostatic coupling pattern C32 is arranged to face the electrostatic coupling pattern C42 of the fourth layer F4 described later. Further, a part of the connection pattern P34 between the through hole Td and the through hole T4 and the connection pattern P26 provided in the second layer F2 face each other over a relatively long range to cause electromagnetic coupling, and the through hole A part of the connection pattern P35 between Te and the through hole T5 and the connection pattern P23 provided in the second layer F2 also face each other over a relatively long range to generate electromagnetic coupling.

第４層Ｆ４では図８に示すように、スルーホールＴ３とスルーホールＴ１２とを接続する接続パターンＰ４３が形成され、スルーホールＴ１１，Ｔ１２とスルーホールＴ３との間に設けた静電結合パターンＣ４１が引出パターンＤ４１を介してスルーホールＴ１１に接続され、スルーホールＴｄには引出パターンＤ４２を介して静電結合パターンＣ４２が接続される。静電結合パターンＣ４１は第３層Ｆ３の静電結合パターンＣ３１との間で静電結合を生じ、静電結合パターンＣ４２は第３層Ｆ３の静電結合パターンＣ３２との間で静電結合を生じる。 In the fourth layer F4, as shown in FIG. 8, a connection pattern P43 for connecting the through hole T3 and the through hole T12 is formed, and the electrostatic coupling pattern C41 provided between the through holes T11, T12 and the through hole T3. Is connected to the through hole T11 via the lead pattern D41, and the electrostatic coupling pattern C42 is connected to the through hole Td via the lead pattern D42. The electrostatic coupling pattern C41 generates electrostatic coupling with the electrostatic coupling pattern C31 of the third layer F3, and the electrostatic coupling pattern C42 performs electrostatic coupling with the electrostatic coupling pattern C32 of the third layer F3. Arise.

上述の構成から明らかなように、３番−６番のペアの接続パターンＰ２３，Ｐ２６は第２層Ｆ２に形成され、４番−５番のペアの接続パターンＰ３４，Ｐ３５は第３層Ｆ３に形成され、チップである３番と５番とは電磁結合パターンＬ２３，Ｌ３５が重複することにより電磁結合を生じ、リングである４番と６番とは電磁結合パターンＬ２６，Ｌ３４に重複することにより電磁結合を生じる。 As apparent from the above-described configuration, the connection patterns P23 and P26 of the third to sixth pairs are formed on the second layer F2, and the connection patterns P34 and P35 of the fourth to fifth pairs are formed on the third layer F3. The formed chips No. 3 and No. 5 cause electromagnetic coupling by overlapping the electromagnetic coupling patterns L23 and L35, and the rings No. 4 and No. 6 overlap by the electromagnetic coupling patterns L26 and L34. Electromagnetic coupling is generated.

上述したように、コンタクト１１ａ〜１１ｈの一端が挿入されるスルーホールＴａ〜Ｔｈの近傍には端子板１６が挿入されるスルーホールＴ１〜Ｔ８から離れる向きに延設された引出パターンＤ１２，Ｄ２２，Ｄ３２，Ｄ４２を介して静電結合パターンＣ１２，Ｃ２２，Ｃ３２，Ｃ４２が接続され、静電結合パターンＣ１２，Ｃ２２，Ｃ３２，Ｃ４２の組合せにより第１の静電結合部が構成されている。一方、端子板１６が挿入されるスルーホールＴ１〜Ｔ８の近傍には静電結合パターンＣ１４，Ｃ２４，Ｃ３１，Ｃ４１がそれぞれ引出パターンＤ１４，Ｄ２４，Ｄ３１，Ｄ４１に接続された第２の静電結合部が構成されている。漏話量の周波数特性を調節するには、引出パターンＤ１１，Ｄ２１，Ｄ３１，Ｄ４１，Ｄ１２，Ｄ２２，Ｄ３２，Ｄ４２の長さを調節するか、静電結合パターンＣ１２，Ｃ２２，Ｃ３２，Ｃ４２，Ｃ１４，Ｃ２４，Ｃ３１，Ｃ４１の面積を調節する。これらの要素を調節すれば、所望の周波数帯域における漏話量の周波数特性が調節可能になる。 As described above, the lead-out patterns D12, D22, extending in the direction away from the through holes T1 to T8 into which the terminal plate 16 is inserted in the vicinity of the through holes Ta to Th into which one ends of the contacts 11a to 11h are inserted. The electrostatic coupling patterns C12, C22, C32, and C42 are connected through D32 and D42, and the first electrostatic coupling unit is configured by a combination of the electrostatic coupling patterns C12, C22, C32, and C42. On the other hand, in the vicinity of the through holes T1 to T8 into which the terminal board 16 is inserted, electrostatic coupling patterns C14, C24, C31 and C41 are connected to the lead patterns D14, D24 , D31 and D41, respectively. The part is composed. In order to adjust the frequency characteristic of the crosstalk amount, the lengths of the extraction patterns D11, D21, D31, D41, D12, D22, D32, D42 are adjusted, or the electrostatic coupling patterns C12, C22, C32, C42, C14, The area of C24, C31, C41 is adjusted. By adjusting these factors, the frequency characteristics of the crosstalk amount in a desired frequency band can be adjusted.

さらに、第２の静電結合部を構成する静電結合パターンＣ２４と接続されている引出パターンＤ２４には上述のように漏洩パターンＫ２４が形成され、接続パターンＰ２６において漏洩パターンＫ２４に隣接する部位も漏洩パターンＫ２６として機能するから、両漏洩パターンＫ２４，Ｋ２６の間での漏話量を調節することによっても漏話量の周波数特性が調節可能である。 Further, the lead pattern D24 connected to the electrostatic coupling pattern C24 constituting the second electrostatic coupling portion is formed with the leakage pattern K24 as described above, and the connection pattern P26 includes a portion adjacent to the leakage pattern K24. Since it functions as the leakage pattern K26, the frequency characteristics of the crosstalk amount can be adjusted also by adjusting the crosstalk amount between the two leakage patterns K24 and K26.

（第２の実施の形態）
第１の実施の形態として説明したように、端子板１６を実装するスルーホールＴ１〜Ｔ８のうちの２個のスルーホールＴ１，Ｔ８は、コンタクト１１ａ〜１１ｈが実装されるスルーホールＴａ〜Ｔｈの左右に配置され、たとえば第１層Ｆ１では図５に示したように、スルーホールＴａ〜Ｔｈの左右に静電結合パターンＣ１１，Ｃ１３が形成されている。そこで、本実施形態では図９に示すように、端子板１６を実装する２個のスルーホールＴ１，Ｔ８と各スルーホールＴ１，Ｔ８に隣接する各静電結合パターンＣ１１，Ｃ１３との間において、それぞれ印刷配線基板１２に表裏に貫通するように切除した離間溝１８を形成してある。すなわち、印刷配線基板１２を形成する基材の一部を除去することによって、２個のスルーホールＴ１，Ｔ８と各スルーホールＴ１，Ｔ８に隣接する各静電結合パターンＣ１１，Ｃ１３との間で比誘電率が小さくなるから、スルーホールＴ１，Ｔ８と静電結合パターンＣ１１，Ｃ１３との結合度を小さくし、この間での漏話を抑制することができる。つまり、第１の実施の形態において説明した各要素による漏話量の周波数特性の調節を容易に行うことが可能になる。他の構成および機能は第１の実施の形態と同様である。 (Second Embodiment)
As described in the first embodiment, two through holes T1 and T8 out of the through holes T1 to T8 on which the terminal plate 16 is mounted are formed on the through holes Ta to Th on which the contacts 11a to 11h are mounted. For example, as shown in FIG. 5, electrostatic coupling patterns C <b> 11 and C <b> 13 are formed on the left and right sides of the through holes Ta to Th in the first layer F <b> 1. Therefore, in the present embodiment, as shown in FIG. 9 , between the two through holes T1, T8 on which the terminal plate 16 is mounted and the electrostatic coupling patterns C11, C13 adjacent to the through holes T1, T8, Each of the printed wiring boards 12 is formed with a separation groove 18 cut out so as to penetrate the front and back. That is, by removing a part of the base material forming the printed wiring board 12, between the two through holes T1, T8 and the electrostatic coupling patterns C11, C13 adjacent to the through holes T1, T8. Since the relative dielectric constant is reduced, the degree of coupling between the through holes T1 and T8 and the electrostatic coupling patterns C11 and C13 can be reduced, and crosstalk between them can be suppressed. That is, it is possible to easily adjust the frequency characteristic of the crosstalk amount by each element described in the first embodiment. Other configurations and functions are the same as those in the first embodiment.

（第３の実施の形態）
本実施形態は、第１の実施の形態において説明した第２層Ｆ２に形成している電磁結合パターンＬ２１，Ｌ２３，Ｌ２６，Ｌ２８は電磁結合を生じるように形成しているものであるが、本実施形態では、１番−２番のペアと３番−６番のペアとのチップ同士および７番−８番のペアと３番−６番のペアとのリング同士の結合度を調節するために、図１０に示すように、第２層Ｆ２において電磁結合パターンＬ２１，Ｌ２３の隣接部位および電磁結合パターンＬ２６，Ｌ２８の隣接部位にそれぞれ比誘電率が印刷配線基板１２の基材よりも高い誘電材料からなる結合部１９を設けたものである。要するに、電磁結合パターンＬ２１，Ｌ２３の間と電磁結合パターンＬ２６，Ｌ２８の間とにそれぞれ結合部１９を設けることによって、１番と３番とのチップ間の漏話量を調節し、６番と８番とのリング間の漏話量を調節することが可能になる。他の構成および機能は第１の実施の形態と同様である。 (Third embodiment)
In the present embodiment, the electromagnetic coupling patterns L21, L23, L26, and L28 formed in the second layer F2 described in the first embodiment are formed so as to generate electromagnetic coupling. In the embodiment, in order to adjust the degree of coupling between the chips of the first and second pairs and the third and sixth pairs and between the rings of the seventh and eighth pairs and the third and sixth pairs. In addition, as shown in FIG. 10, in the second layer F2, the dielectric constant higher than the base material of the printed wiring board 12 in the adjacent portions of the electromagnetic coupling patterns L21 and L23 and the adjacent portions of the electromagnetic coupling patterns L26 and L28, respectively. A connecting portion 19 made of a material is provided. In short, by providing the coupling portions 19 between the electromagnetic coupling patterns L21 and L23 and between the electromagnetic coupling patterns L26 and L28, the amount of crosstalk between the first and third chips is adjusted, and the sixth and eighth It is possible to adjust the amount of crosstalk between the ring and the ring. Other configurations and functions are the same as those in the first embodiment.

なお、上述した実施形態では第１の静電結合部および第２の静電結合部を多層配線基板からなる印刷配線基板１２の導電層を用いて実現する例を示したが、個別部品のコンデンサに代えてもよい。また、上述した各実施形態は本発明の具体例として例示したものであり、本発明の技術思想を限定する趣旨ではない。 In the above-described embodiment, the example in which the first electrostatic coupling portion and the second electrostatic coupling portion are realized by using the conductive layer of the printed wiring board 12 made of a multilayer wiring board is shown. It may be replaced with. Moreover, each embodiment mentioned above is illustrated as a specific example of this invention, and is not the meaning which limits the technical idea of this invention.

本発明の第１の実施の形態を示す一部破断した平面図である。It is the partially broken top view which shows the 1st Embodiment of this invention. 同上の縦断面図である。It is a longitudinal cross-sectional view same as the above. 同上に用いるコンタクト保持基板を示す側面図である。It is a side view which shows the contact holding substrate used for the same as the above. 同上に用いるコンタクト保持基板を示す平面図である。It is a top view which shows the contact holding substrate used for the same as the above. 同上に用いる印刷配線基板の第１層を示す図である。It is a figure which shows the 1st layer of the printed wiring board used for the same as the above. 同上に用いる印刷配線基板の第２層を示す図である。It is a figure which shows the 2nd layer of the printed wiring board used for the same as the above. 同上に用いる印刷配線基板の第３層を示す図である。It is a figure which shows the 3rd layer of the printed wiring board used for the same as the above. 同上に用いる印刷配線基板の第４層を示す図である。It is a figure which shows the 4th layer of the printed wiring board used for the same as the above. 本発明の第２の実施の形態に用いる印刷配線基板の第１層を示す図である。It is a figure which shows the 1st layer of the printed wiring board used for the 2nd Embodiment of this invention. 本発明の第３の実施の形態に用いる印刷配線基板の第２層を示す図である。It is a figure which shows the 2nd layer of the printed wiring board used for the 3rd Embodiment of this invention.

Explanation of symbols

１コンタクト保持基板
４ハウジング
１１ａ〜１１ｈコンタクト
１２印刷配線基板
１６端子板
１８離間溝
１９結合部
４１プラグ挿入口
Ｃ１１，Ｃ１２，Ｃ１３，Ｃ１４静電結合パターン
Ｃ２１，Ｃ２２，Ｃ２３，Ｃ２４静電結合パターン
Ｃ３１，Ｃ３２静電結合パターン
Ｃ４１，Ｃ４２静電結合パターン
Ｄ１１，Ｄ１２，Ｄ１３，Ｄ１４引出パターン
Ｄ２１，Ｄ２２，Ｄ２３，Ｄ２４引出パターン
Ｄ３１，Ｄ３２引出パターン
Ｄ４１，Ｄ４２引出パターン
Ｆ１第１層
Ｆ２第２層
Ｆ３第３層
Ｆ４第４層
Ｋ２４，Ｋ２６漏洩パターン
Ｌ２１，Ｌ２３，Ｌ２６，Ｌ２８電磁結合パターン
Ｌ３２，Ｌ３４，Ｌ３５，Ｌ３７電磁結合パターン DESCRIPTION OF SYMBOLS 1 Contact holding board | substrate 4 Housing 11a-11h Contact 12 Printed wiring board 16 Terminal board 18 Separation groove 19 Coupling part 41 Plug insertion slot C11, C12, C13, C14 Electrostatic coupling pattern C21, C22, C23, C24 Electrostatic coupling pattern C31 , C32 electrostatic coupling pattern C41, C42 electrostatic coupling pattern D11, D12, D13, D14 extraction pattern D21, D22, D23, D24 extraction pattern D31, D32 extraction pattern D41, D42 extraction pattern F1 first layer F2 second layer F3 3rd layer F4 4th layer K24, K26 Leakage pattern L21, L23, L26, L28 Electromagnetic coupling pattern L32, L34, L35, L37 Electromagnetic coupling pattern

Claims

A housing in which a plug insertion slot for inserting a modular plug is opened, a plurality of pairs arranged in parallel in the plug insertion slot, and a contact that can be elastically contacted with a contact of the modular plug inserted in the plug insertion slot, and a contact A contact holding board having a printed wiring board implanted and bonded to a housing, and a plurality of terminals implanted in the contact holding board and corresponding to each contact in a one-to-one relationship, and the printed wiring board has four conductive layers And a multilayer wiring board on which through-hole plating or via-hole plating for connecting conductive layers is formed, and two transmission lines each at the end on the contact side and the end on the terminal side of the transmission line formed on the printed wiring board The first and second electrostatic coupling portions that cause electrostatic coupling between them are formed, and the transmission line in the transmission line formed on the printed wiring board is coupled. A first electromagnetic coupling portion is formed in the middle portion between the tact-side end portion and the terminal-side end portion so that the two transmission paths are close enough to generate electromagnetic coupling. A leakage pattern formed between the electrostatic coupling portion of the other conductive layer and connected to the conductive pattern of the other conductive layer by through-hole plating or via-hole plating and a conductive pattern of the other conductive layer formed in another transmission line And a leakage pattern connected by through-hole plating or via-hole plating, and a second electromagnetic coupling portion that is close enough to cause electromagnetic coupling.

2. The modular jack according to claim 1, wherein a pair of terminals among the terminals are arranged adjacent to each other, and each terminal is arranged in a staggered manner in a direction in which a plurality of pairs of terminals are arranged.

3. A separation groove formed by cutting a part of a base material is formed at a point of the printed wiring board so as to reduce a crosstalk amount due to electrostatic coupling between transmission lines. The described modular jack.

A coupling portion made of a material having a relative dielectric constant higher than that of the base material is formed on a part of the base material so as to increase the amount of crosstalk due to electrostatic coupling between the transmission lines at the important points of the printed wiring board. The modular jack according to claim 1 or 2, characterized in that