JP4330427B2 - Method and apparatus for manufacturing transfer master for forming fine uneven surface - Google Patents

Description

  The present invention relates to a method for manufacturing a transfer master for forming a fine uneven surface and a transfer master manufacturing apparatus.

  A portable electronic device such as a mobile phone or a portable game machine has a reflective liquid crystal display device capable of suppressing power consumption as a display unit because its battery driving time greatly affects usability. The reflection-type liquid crystal display device includes a reflection film for reflecting external light incident from the front surface, and includes a reflection film built-in between two substrates constituting a liquid crystal panel, 2. Description of the Related Art A reflection type including a reflective film provided on the back side of a transmissive liquid crystal panel is known.

For example, in the reflective liquid crystal display device described in Patent Document 1, the reflector for reflecting the light transmitted through the liquid crystal layer is composed of two or more regions having different directivities when scattering light, and The maximum dimension of each region is 5 mm square or less. That is, regions having different diffusion directivities are mixed within one pixel or in units of pixels to obtain necessary reflection characteristics.
As a method for forming such a concavo-convex structure on the surface of the reflection band to provide diffuse reflection, sand blasting, etching with an etchant, photolithography, or the like is used as described in Patent Document 1 or Patent Document 2. Embossing or the like is used for the film substrate.
Japanese Patent No. 3019058 JP-A-9-54318

  However, the reflector having a fine uneven shape formed by the above-described forming method has a problem that it is extremely difficult to control the reflection characteristics to a desired state. In order to give anisotropy and asymmetry to the reflection and diffusion characteristics of the reflector, it is necessary to appropriately control the uneven shape. However, in the above method, the distribution of the uneven portions is random. This is because, although easy to apply, the concavo-convex portions must be isotropic. Therefore, it is desired to develop a processing tool capable of manufacturing the fine uneven shape of the reflecting surface with high accuracy and high efficiency.

  The present invention has been made in order to solve the above-described problem, and a method for producing a transfer master for forming a fine uneven surface capable of producing a random fine uneven shape with high efficiency and high yield, and It aims at providing the manufacturing apparatus.

In order to achieve the above object, the present invention employs the following configuration .

The method for producing a transfer master for forming a fine uneven surface according to the present invention includes a substantially cylindrical base that is rotatably held on a surface plate, and a rotational drive around the base for rotation. Substrate driving means, cutting means for cutting the outer peripheral surface of the matrix substrate, stamping means for stamping indentations on the outer peripheral surface of the matrix substrate, and the substrate driving And the control means for controlling the cutting means and the punching means, and the control means operates the base material driving means and the cutting means to cut the outer peripheral surface of the matrix base material. Centering the matrix base material, and then operating the base material driving means and the embossing means by the control means to imprint an indentation on the outer peripheral surface of the matrix base material. It is characterized by.

According to the above method for producing a transfer mother die, the outer periphery of the mother die substrate is cut and centered in a state where the mother die substrate is rotatably held on the surface plate. Since the indentation is imprinted on the outer peripheral surface, it is possible to improve the accuracy of the formation position of the indentation and the depth of the indentation with respect to the rotating core of the matrix substrate. That is, the center of rotation of the matrix substrate can be accurately determined by performing centering in a state where the matrix substrate is rotatably held with respect to the surface plate. Since the indentation is engraved without separating the matrix base material from the surface plate, the indentation formation position with respect to the rotating core and the depth accuracy at that position are increased to submicron (less than 1 μm) order. Can do.
By forming the concavo-convex shape of the reflector using the transfer master manufactured in this manner, the reflection characteristics can be easily controlled to a desired state.

  Moreover, the manufacturing method of the transfer mother die for forming the fine uneven surface of the present invention is the method for manufacturing the transfer mother die described above, because the cutting means cuts the outer peripheral surface of the mother die substrate. And a tool conveying unit for moving the cutting tool in parallel with the axial direction of the matrix substrate, and the cutting tool is moved to the matrix substrate while rotating the matrix substrate. It moves parallel to the axial direction, and centering is performed so that the rotation axis of the matrix substrate is parallel to the surface plate surface of the surface plate.

  According to the manufacturing method of the transfer master, the axial direction of the rotating core of the base substrate can be made parallel to the surface plate surface, so that the formation position of the indentation with respect to the rotating core and the depth at that position Can be improved to submicron order (less than 1 μm).

  The method for producing a transfer mother die for forming a fine uneven surface according to the present invention is the method for producing a transfer mother die described above, wherein centering is performed while both ends of the mother die substrate are rotatably supported. It is characterized by performing indentation.

  According to the above method for producing a transfer mother die, centering and indentation are performed in a state where both ends of the mother die base material are rotatably supported. There is no blurring, and the position of the indentation relative to the rotating core and the accuracy of the depth at that position can be increased to the order of submicrons (less than 1 μm).

Next, the transfer mold manufacturing apparatus of the present invention includes a substantially cylindrical matrix base material rotatably held on a surface plate, and a base material drive for rotationally driving the matrix base material about an axis. Means, cutting means for cutting the outer peripheral surface of the matrix substrate, stamping means for stamping indentations on the outer peripheral surface of the matrix substrate, the substrate driving means and the cutting And control means for controlling the engraving means, and the control means operates the base material driving means and the cutting means to cut the outer peripheral surface of the base material of the base material so as to cut the base material. After centering the base material, the base material driving means and the embossing means are operated to indent an indentation on the outer peripheral surface of the matrix base material .

  According to the above transfer mold manufacturing apparatus, the indentation can be formed with high positional accuracy since the cutting means and the stamping means are provided.

In addition, according to the above-described transfer mother mold manufacturing apparatus, since the indentation is engraved without removing the mother base material from the holding member after the mother base material is centered, the formation position of the indentation with respect to the rotating core And depth accuracy can be increased to sub-micron order (less than 1 μm).

According to the method for manufacturing a transfer mother die of the present invention, the outer periphery of the mother die base material is cut and centered while the mother die base material is rotatably held on the surface plate, and after the cutting. Since the indentation is imprinted on the outer peripheral surface, it is possible to improve the accuracy of the formation position of the indentation and the depth of the indentation with respect to the rotating core of the matrix substrate. That is, the center of rotation of the matrix substrate can be accurately determined by performing centering in a state where the matrix substrate is rotatably held with respect to the surface plate. Since the indentation is engraved without separating the matrix base material from the surface plate, the indentation formation position with respect to the rotating core and the depth accuracy at that position are increased to submicron (less than 1 μm) order. Can do.
By forming the concavo-convex shape of the reflector using the transfer master manufactured in this manner, the reflection characteristics can be easily controlled to a desired state.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Manufacturing method of reflector)
First, a reflector manufactured using the transfer matrix according to the present invention will be described. 1 is a partial perspective view showing an example of the configuration of a reflector, FIG. 2A is a plan configuration diagram of a recess formed in the reflector shown in FIG. 1, and FIG. 2B is a G- It is a section lineblock diagram which meets a G line.
A reflector 10 shown in FIG. 1 includes a reflective film 12 having a high reflectivity such as Al or Ag, and an organic film 11 made of an acrylic resin material or the like for giving the reflective film 12 a predetermined surface shape. Has been. A plurality of concave portions 13 are provided on the surface of the organic film 12, and reflectivity is obtained by the reflective film 12 formed on the concave portions 13.

The inner surface of the recess 13 shown in FIGS. 2A and 2B is an example of a recess preferably used in the present invention, and includes a first curved surface 13a and a second curved surface 13b, which are part of two spherical surfaces each having a different radius. These curved surfaces 13a and 13b have their cores O ₁ and O ₂ arranged on the normal line of the deepest point O of the concave portion 13, and the first curved surface 13a is a spherical surface having a radius R1 with O ₁ as the core. The second curved surface 13b is a part of a spherical surface having a radius R2 with O ₂ as the center. In the plan view shown in FIG. 2A, the first curved surface 13a and the second curved surface 13b are substantially partitioned in the vicinity of the straight line H that passes through the deepest point O of the recess 13 and is orthogonal to the GG line.

3 irradiates the reflector 10 having the above-described configuration with light at an incident angle of 30 ° from the right side in FIG. 2 and uses the light receiving angle as the center of 30 °, which is the direction of regular reflection with respect to the reflecting surface, ± 30 6 is a graph showing the result of measuring the reflectance (%) of the reflector 10 by shaking in the range of 0 ° (0 ° to 60 °; 0 ° corresponds to the normal direction of the liquid crystal panel 20).
As shown in this figure, according to the reflector 10 having the above configuration, the distribution width and frequency of the inclination angle determined by the first curved surface 13a having a large radius and the second curved surface 13b including a spherical surface having a relatively small radius are reflected. Therefore, the reflected light is scattered at a wide angle, and a high reflectance can be obtained in a wide light receiving angle range of about 15 ° to 50 °. In particular, the reflection on the first curved surface 13a made of a spherical surface having a relatively large radius causes reflection to be scattered in a narrower range in a specific direction than the second curved surface 13b. The maximum is obtained at an angle smaller than 0 °, and the reflectance in the vicinity of the peak increases. As a result, the peak of light incident on and reflected by the reflector 10 is shifted to the side closer to the normal direction of the reflector 10 than the regular reflection direction, so that the reflection luminance in the front direction of the reflector 10 can be increased. Therefore, for example, if the reflector 10 of this embodiment is applied to the reflective layer of the liquid crystal display device, the reflection luminance in the front direction of the liquid crystal display device can be improved, and thus the luminance of the liquid crystal display device in the viewer direction. Can be increased.

Next, a method for manufacturing the reflector having the above configuration will be described below with reference to the drawings.
4A is an exploded perspective view showing an example of a mother die assembly for forming a fine uneven surface for forming the uneven shape of the reflector, and FIG. 4B is a schematic plan view of the mother die assembly. FIG. 6 is a cross-sectional configuration diagram showing a step of producing a roll plate using the matrix shown in FIG. 4, FIG. 6 is a diagram showing a cross-sectional structure of the roll plate produced by the step shown in FIG. 5, and FIG. FIG. 6 is a perspective configuration diagram illustrating a process of forming a concavo-convex shape of a reflector using the roll plate illustrated in FIG. 6.

  The mother die assembly 15 shown in FIGS. 4A and 4B includes a transfer mother die 16 and a holding member 17. A transfer master (hereinafter referred to as a master) 16 includes a master body 16a and a shaft 16b, and is composed of lead, copper, brass, solder, stainless steel, nickel-plated carbide tungsten, or the like. ing. A large number of fine recesses are formed on the outer peripheral surface 16c of the matrix main body 16a. The shape of the recess formed in the outer peripheral surface 16a is substantially the same as that of the recess 13 shown in FIG. 1, and the shape of the outer peripheral surface 16a corresponds to the surface shape of the organic film 11 shown in FIG.

Moreover, as shown to FIG. 4A, a pair of axial part 16b, 16b is provided in the longitudinal direction both ends of the matrix main body part 16a. Each shaft portion 16b, a base 16b ₁ in an ascending order of distance from the mold body portion 16a and the male screw portion 16b ₂ and the distal end portion 16b ₃ are formed. Then, as shown in FIGS. 4A and 4B, the bearing 17a (bearing) to each base 16b ₁ is fitted each fixing washer 17b and a nut 17c are respectively mounted on the male screw portion 16b _2.

  Further, as shown in FIGS. 4A and 4B, the holding member 17 is a bearing attached to the holding main body portion 17d and a pair of holding legs 17e and 17e formed protruding from the holding main body portion 17d and the tips of the holding legs 17e and 17e. 17a and 17a. U-shaped grooves 17f and 17f are respectively provided at the tips of the holding legs 17e and 17e, and bearings 17a and 17a are fitted into the U-shaped grooves 17f and 17f. The holding member 17 is provided with fixing bolts 17g and 17g, and the bearings 17a and 17a are fixed from the U-shaped grooves 17f and 17f by tightening the fixing bolt 17g. In this way, the transfer master 16 and the holding member 17 are integrated.

Next, as shown in FIG. 5A, the surface shape of the mother die 16 shown in FIG. 4 is transferred to the transfer resin film 20. In this step, the mother die assembly 15 is arranged with the mother die 16 facing the stage 19. Further, a substrate 18 having a transfer resin film 20 as a workpiece applied thereon can pass between the mother die 16 and the stage 19. Means for synchronizing rotation / movement may be provided between the mother die 16 and the substrate 18 in order to prevent the mother die 16 from slipping. The mother die 16 and the substrate 18 can be driven by only one of them. Further, a resin supply unit 22 for applying and forming a transfer resin film 20 on the substrate 18 may be provided on the upstream side of the substrate 18 in the feeding direction. An ultraviolet irradiation unit 24 is disposed above the substrate 18 on the downstream side of the matrix 16. In order to control the viscosity of the material during transfer processing, a second ultraviolet irradiation unit may be provided above the substrate 18 between the resin supply unit 22 and the mother die 16.

In addition, a motor 21 is provided in the vicinity of the mother die assembly 15, and an endless annular belt 202 is wound between the tip portion 16 b ₃ of the shaft portion of the mother die 16 and the motor 21. In this way, the driving force of the motor 21 is configured to be transmitted to the mother die 16 via the endless annular belt 202.

  As the substrate 18, a glass substrate, a plastic substrate, a resin film substrate, or the like can be used. The transfer resin film 20 applied and formed on the substrate 18 by the resin supply unit 22 uses an ultraviolet curable resin in the present embodiment, but may be a thermosetting resin. Instead of the part 24, a heat source such as a heat lamp or a cooling device may be provided.

  In the process shown in FIG. 5A having the above-described configuration, the substrate 18 is inserted between the mother die 16 and the stage 19 in a state where the mother die 16 is rotated by rotating the motor 21, and the substrate 18 is moved to the right in the figure. Then, the transfer resin film 20 on the substrate 18 is pressed against the surface of the mother die 16 to transfer the surface shape of the mother die 16 to the transfer resin film 20, and an uneven surface 25 is formed on the surface of the transfer resin film 20. The transfer resin film 20 is previously formed on the substrate 18 by a spin coater or the like, or is formed by sequentially applying resin materials by the resin supply unit 22 while moving the substrate 18 in the right direction in the figure. After the processing by 16, curing by the ultraviolet irradiation unit 24 is performed to maintain the surface shape. Through the above steps, a resin plate 26 is obtained in which a concave and convex surface 25 opposite to the mother die 16 is formed on the surface of the transfer resin film 20.

Next, as shown in FIG. 5B, a metal film 27 is formed on the uneven surface 25 of the resin plate 26 obtained by the process shown in FIG. 5A. Next, a Ni film 28 is formed by electrolytic plating using the metal film 27 as an electrode (Ni electroforming). The metal film 27 is preferably a gold-plated film or the like. By forming such a metal film, the metal film 27 and the Ni film 28 can be easily separated without causing damage to the Ni film 28. Can do.
The thicknesses of the metal film 27 and the Ni film 28 are not particularly limited, but the metal film 27 may be about 10 nm to 100 nm and the Ni film 28 may be about 10 μm to 1 mm.
Next, if the Ni film 28 is formed on the metal film 27 as shown in FIG. 5B, both are peeled off at the interface between the metal film 27 and the resin film 20, and then the interface between the metal film 27 and the Ni film 28. Then, the both are separated, and a release film 29 is formed on the Ni film 28. In this way, a Ni plate 30 is obtained which is composed of the Ni film 28 having substantially the same concavo-convex shape as the surface of the mother die 16 on one side and the release film 29 along the concavo-convex shape of the Ni film 28. The metal film 27 and the release film 29 may be the same (shared).

  Next, as shown in FIG. 5C, a Ni film 31 is formed by Ni electroforming on the release film 29 of the Ni plate 30 obtained in the above process. In forming the Ni film 31, a formation method similar to that for the Ni film 28 shown in FIG. 5B can be applied. The thickness of the Ni film 31 is not particularly limited, but may be about 10 μm to 100 μm. Next, the Ni film 31 formed as described above is peeled off from the release film 29 to obtain a Ni plate having a surface shape opposite to the surface of the mother die 16.

  Next, as shown in FIG. 5D, a cushioning material 32 made of an elastic material such as rubber is attached to the surface opposite to the uneven surface of the Ni plate (Ni film 31) obtained in the above step. Then, as shown in FIG. 6, a roll plate 35 (transfer mold) having a surface shape opposite to the mother die 15 is obtained by winding the cylindrical base 34 with the cushioning material 32 inside. In addition, the vulcanization adhesion method using triazine thiol can also be used for adhesion / joining of the buffer material 32.

  Then, as shown in FIG. 7, an organic film is formed by applying an ultraviolet curable resin or a thermosetting resin to the processing region 38 or the entire surface of the product substrate 37 made of glass, plastic, or the like. The surface shape of the Ni film 31 of the roll plate 35 is transferred to the surface of the organic film in the processed region 38 by pressing the produced roll plate 35 against the processed region 38 while rotating. Next, the processed organic film is cured by ultraviolet irradiation or heating, and a highly reflective metal reflective film such as Al or Ag is formed on the surface of the organic film, whereby the reflector according to this embodiment shown in FIG. Obtainable. The processed region 38 may be the same size as the product substrate 37.

  In addition, the roll plate 35 used for processing the organic film and the processing region 38 are such that the processing surface of the roll plate 35 (the region where the uneven shape on the surface of the Ni film 31) 35a has a width W1. The roll plate 35 is combined so that the circumference of the roll plate 35 is longer than the length L of the work area 38. This is because the seam formed by rolling the Ni film 31 shown in FIG. 5D together with the buffer material 32 in a roll shape on the circumference of the roll plate 35 shown in FIG. 6 is generated, and the width of the Ni film 31 is finite. by. That is, in the step shown in FIG. 7, it is necessary to prevent the seam of the roll plate 35 from passing over the region to be processed 38, and the end in the width direction of the processing region 35 a does not hit the region to be processed 38. It is necessary to do so.

  In the manufacturing method of the present embodiment, the region to be processed 38 shown in FIG. 7 may be composed of one reflector organic film, or may be composed of a plurality of reflector organic films. . Further, as shown in FIG. 8, the processing using the roll plate 35 is performed using a product substrate 37 </ b> A in which a plurality of processing regions 38 </ b> A having a width W <b> 2 smaller than the width W <b> 1 of the roll plate 35 are arranged. It can also be performed on the region 38A. That is, if the area of the region that can be processed by rotating the roll plate 35 once and the area of the regions to be processed 38 and 38A have the above relationship, the roll plate 35 is formed in the regions to be processed 38 and 38A. There are no restrictions on the division of the organic film and the dimensions of the product substrates 37 and 37A.

  Further, in the above description, a case has been described in which a roll plate 35 having a concave and convex shape that is opposite to that of the master die 16 is formed, and concaves and convexes having substantially the same shape as the master die 16 are formed on the organic film of the product substrate 37. Can adopt various forms when processing the product substrate 37. For example, the organic film of the product substrate 37 can be directly processed using the mother die 16, and in this case, a reflector having a surface shape opposite to the reflector 10 shown in FIGS. 1 and 2 is used. Can be manufactured. Further, the product substrate 37 may be processed by pressing the Ni film 31 against the organic film while keeping the Ni film 31 in the form of the roll plate 35 while being held in a plate shape. The Ni film 28 can also be applied to the same processing.

(Matrix manufacturing method)
Next, a method for manufacturing the mother die 16 shown in FIG. 4 will be described. FIG. 9 is a process diagram showing an embodiment of a mother die manufacturing apparatus for producing the mother die 16 shown in FIG. A mother die manufacturing apparatus 40 shown in this figure is provided with a surface plate 41, a cylindrical mother die base material 42, and an indentation formed on the outer peripheral surface of the mother die base material 42 arranged above the mother die base material 42. And a cutting means 44 disposed below the matrix substrate 42 and cutting the outer peripheral surface of the matrix substrate 42 as its main parts. The base material driving unit 45 (base material driving means) connected to the one side end surface (the left side surface in the drawing) via an endless annular belt 45a is rotatable about its axis. As the matrix base material 42, a base material made of a metal material, such as lead, brass, solder, stainless steel, cemented steel, nickel-plated tungsten, or the like, which is relatively easy to be plastically processed, is used. Further, the base material 42 has a length W in the base-axis direction of the region where the recess 60 is formed, rather than the width of the transfer resin film 20 shown in FIG. 5 (the length in the direction perpendicular to the paper surface in FIG. 5). Choose a larger one. Further, the diameter of the matrix base material 42 is not particularly limited, but if the diameter of the base material 42 is too small, the curvature of the processing surface to be engraved by the indenter 47 increases, or the processing is performed due to deflection by its own weight or load. Since there is a possibility that the accuracy may be lowered, it is preferable to set it to at least about 10 mmφ for practical use.

In addition, the mother die manufacturing apparatus 40 includes a holding member 17 that can be attached to and detached from the surface plate 41. The holding member 17 has the same configuration as the holding member 17 described with reference to FIGS. 4A and 4B, and a matrix base material 42 is rotatably supported through a bearing (not shown). The matrix base material 42 is supported by the holding member 17 so that the rotation axis direction thereof is parallel to the surface plate surface 41 a of the surface plate 41.
The holding member 17 is placed on the surface plate 41, a holding main body portion 17d, a pair of holding legs 17e and 17e formed protruding from the holding main body portion 17d, and an unillustrated attachment attached to the tips of the holding legs 17e and 17e. The matrix base material 42 is composed of a substantially cylindrical matrix body portion 42a and a pair of shaft portions 42b and 42b provided at both ends of the matrix body portion 42a, and each shaft portion 42b. The holding member 17 and the matrix substrate 42 are integrated with each other by fitting respective bearings (not shown). The holding member 17 is detachable from the surface plate 41.

  The cutting means 44 includes a cutting tool 44a for cutting the outer peripheral surface 42c of the matrix substrate 42, and a tool for moving the cutting tool 44a in a direction parallel to the rotational axis direction of the matrix substrate 42. It is comprised from the conveyance part 44b. The tool conveying portion 44b is composed of a rail portion 44c provided on the surface plate surface 41a and a slider portion 44d that travels on the rail portion 44c, and a cutting tool 44a is attached to the slider portion 44d.

  Next, the stamping means 43 includes an indenter 47 for stamping an indentation on the outer peripheral surface 42 c of the matrix substrate 42, and an indenter drive unit 48 for driving the indenter 47 in the radial direction of the matrix substrate 42. And an indenter transport unit 49 for driving the indenter 47 in the axial direction of the matrix substrate 42.

The indenter 47 is movable in the radial direction of the matrix substrate 42 by an indenter drive unit 48, and is tapered toward the distal end portion (the lower side in the figure). The distal end 47a is formed on the matrix substrate 42. It is processed into the shape of an indentation to be stamped. That is, when manufacturing a mother die for manufacturing the reflector 10 of FIG. 1 having the concave portion 13 having the shape shown in FIG. 2, the shape of the concave and convex portions opposite to that of the concave portion 13 shown in FIG. To form. FIG. 10 is a cross-sectional configuration diagram showing the shape of the tip portion 47a of the indenter suitable for producing the mother die 16 for forming the reflector having the concave portion 13 having the shape shown in FIG. The indenter 47 shown in this figure shows an example in which the tip portion 47a includes a first curved surface 47A and a second curved surface 47B that form a part of an outwardly projecting spherical surface having a different radius. . That is, the inner surface of the first curved surface 13a of the recess 13 shown in FIG. 2 and the outer surface of the first curved surface 47A shown in FIG. 10 are substantially matched, and the inner surface of the second curved surface 13b and the outer surface of the second curved surface 47B are substantially matched. The shape is to
In addition, the shape of the said front-end | tip part can be suitably changed according to the shape of the recessed part (or convex part) of the reflector to produce. As the indenter 47, for example, a stainless steel body provided with a diamond processed into a predetermined shape at the tip thereof can be used, and may be cemented steel, ceramics, tungsten, or the like. The material of the tip 47a of the indenter 47 can be appropriately selected according to the material of the matrix substrate 42.

The indenter driving unit 48 is supported by the slider 56 and is movable in the length direction (left-right direction in the figure) of the base substrate 42. The indenter driving unit 48 and the slider 56 are used to process the base material 42. Forms the processing head. The indenter driving unit 48 can be used without any problem as long as it is a driving unit that can drive the indenter 47 in the vertical direction by a comma several μm to several tens of μm to process the matrix substrate 42. As a suitable example, a piezoelectric element (piezoelectric element) or the like can be given.

  In FIG. 9, the processing head moving means 57 (indenter transport unit) supports the processing head (indenter driving unit 48 and slider 56) so as to be movable along the axial direction of the matrix substrate 42, and further in the longitudinal direction. The position of the processing head in the longitudinal direction of the base material 42 can be controlled by being engaged with the positioning control means 55. An upper and lower stage (not shown) is built in the slider, and the indenter driving unit 48 and the indenter 47 are set to 0. The matrix substrate 42 can move in the axial direction at a pitch of several μm to several hundred μm.

  The base material driving unit 45 (base material driving means) is connected to the tip end of the shaft portion 42b of the base material 42 via an endless annular belt 45a. The material 42 can be rotated. In addition, the base material driving unit 45 is 0. The position around the axis of the matrix substrate 42 can be controlled with a pitch of several μm to several mm. For this reason, the substrate drive unit 45 uses a drive means such as a servo motor or a stepping motor that can control a minute rotation amount. Alternatively, a direct drive motor may be used without using the endless annular belt 45a.

  Further, the master mold manufacturing apparatus 40 is provided with a control means 54. In the example of this figure, an example in which the cutting means 44 is integrated is shown, and the control means 54 cuts the outer peripheral surface 42c of the matrix base material 42 by operating the base material driving unit 45 and the cutting means 44. After the matrix substrate 42 is centered, the substrate driving means 45 and the stamping means 43 are operated to stamp an indentation on the outer peripheral surface 42c.

  In order to process the mother die base material 42 by the mother die manufacturing apparatus 40 having the above configuration, first, as shown in FIG. 9, the cylindrical mother die substrate 42 and the holding member 17 are integrated. In this state, it is placed on the surface plate 41 and the tip of the shaft portion 42 b of the matrix substrate 42 is connected to the substrate driving unit 45. Further, the indenter driving unit 48 and the indenter 47 supported by the slider 56 are moved to an initial position above the center axis of the base material 42 (for example, the right end portion of the base material 42). Further, the cutting tool 44a is moved to an initial position below the center axis of the base material 42 (for example, the left end portion of the base material 42).

  When the preparation for processing is completed in this way, the base material driving unit 45 and the cutting means 44 are operated by the control means 54. First, the base substrate 42 is rotationally driven around the axis by the substrate driving unit 45. Next, as shown in FIG. 11, the cutting tool 44 a provided in the cutting means 44 is moved in parallel with the axial direction of the base material 42, and the tip of the cutting tool 44 a is moved to the outer peripheral surface 42 c of the base material 42. The outer peripheral surface 42c is polished by being brought into contact with. In this way, the centering process of the matrix substrate 42 is performed. By this centering process, the rotation axis of the matrix substrate 42 becomes parallel to the surface plate surface 41 a of the surface plate 41.

Next, when the centering process is completed, as shown in FIG. 12, the indenter driving portion 48 is operated to move the indenter 47 downward in the figure, and the concave portion 60 is formed on the surface of the matrix base 42 by the tip 47a of the indenter. (Indentation) is formed. Thereafter, the indenter 47 is moved upward to be separated from the base material 42, and then the base material drive unit 45 is operated to rotationally drive the base material 42 by a predetermined pitch. Further, the radial positioning control means 55 connected to the machining head moving means 57 is operated to move the slider 56 (and the indenter 47) in the axial direction of the matrix substrate 42 by a predetermined pitch. When the movement of the base material 42 and the indenter 47 is completed in this way, the indenter driving unit 48 is operated in the same manner as described above, and the recess 60 is stamped on the surface of the base material 42 by the indenter 47. .
Then, the above steps are sequentially repeated to form a large number of recesses 60 on the outer peripheral surface 42c of the matrix substrate 42 as shown in FIG. By this process, a large number of recesses 60 having a predetermined range of pitches and depths are formed in the area of the surface of the matrix substrate 42, and the matrix 16 having the machining area 16 as shown in FIG. 4 is obtained.

  According to the method for manufacturing the transfer mother die, the outer peripheral surface 42c of the mother die base material 42 is cut and centered while the mother die base material 42 is rotatably held on the surface plate 41. Since the concave portion 60 (indentation) is stamped on the outer peripheral surface 42 c after cutting, the accuracy of the formation position of the concave portion 60 and the depth of the concave portion 60 with respect to the rotating core of the matrix substrate 42 can be increased. That is, by performing centering in a state where the base substrate 42 is rotatably held with respect to the surface plate 41, the center of rotation of the base substrate 42 can be accurately determined. Then, since the recess 60 is engraved without separating the base material 42 from the surface plate 41, the position of the recess 60 relative to the rotating core and the depth accuracy at that position are submicron (less than 1 μm). It can be raised to order. By forming the concavo-convex shape of the reflector using the transfer master manufactured in this manner, the reflection characteristics can be easily controlled to a desired state.

Further, according to the method for manufacturing the transfer master, the axial direction of the rotating core of the base substrate 42 can be made parallel to the surface plate surface 41a. The depth accuracy at the position can be increased to the order of submicron (less than 1 μm).
Furthermore, according to the method for manufacturing the transfer matrix, the centering and the recess 60 are performed while both ends of the matrix substrate 42 are rotatably supported. The center of rotation does not shake, and the accuracy of the depth at which the recess 60 is formed relative to the center of rotation and the depth accuracy at that position can be increased to the order of submicrons (less than 1 μm).

Further, according to the above-described transfer mother die manufacturing apparatus 40, since the cutting means 44 and the stamping means 43 are provided, the mother die base material 42 can be centered and the recess 60 can be formed at a time.
Further, according to the above-described transfer mold manufacturing apparatus 40, the mold base 42 can be detached from the surface plate 41 together with the holding member 17. Therefore, the transfer mold 16 obtained by processing the base mold 42 is used. Can be used for the production of a transfer mold.

  Furthermore, according to the above-described transfer mother die manufacturing apparatus, the cutting tool 44 a can be moved in parallel with the axial direction of the mother die base material 42, and the axial direction of the mother die substrate 42 is changed to the surface plate surface 41 a of the surface plate 41. Can be parallel. Furthermore, since the indenter 47 can be moved in the radial direction and the axial direction of the matrix substrate 42, the position of the recess 60 in the axial direction of the matrix substrate 42 and the depth accuracy at that position can be adjusted to submicron ( (Less than 1 μm).

Further, since the bearings are fitted and integrated with the shaft portions 42b at both ends of the matrix base material 42, the shaft portion 42b is hardly shaken as compared with the case where the matrix substrate 42 is fixed in a cantilever manner. Therefore, the center in rotation can be accurately obtained by centering, and the accuracy of the formation position and depth of the indentation can be increased.
Specifically, when a concave portion having a diameter of about several μm is formed while holding the matrix substrate in a cantilevered manner, the accuracy of the concave portion forming position is several μm to several tens of μm, and the accuracy of the depth of the concave portion However, when the transfer mold manufacturing apparatus 40 of the present invention is used, the accuracy of the recess formation position is improved to several μm, and the accuracy of the depth of the recess is up to several commas of μm. improves.

(Liquid crystal display device)
13 is a perspective configuration diagram showing an example in which the reflector according to the present invention is applied to the reflective layer of the liquid crystal display device, and FIG. 14 is a partial cross-sectional configuration diagram of the liquid crystal display device shown in FIG.
As shown in FIGS. 13 and 14, the liquid crystal display device of the present embodiment includes a front light (illumination device) 110 and a reflective liquid crystal panel 120 arranged on the back side (the lower surface side in the drawing). It is configured.
As shown in FIG. 13, the front light 110 includes a substantially flat transparent light guide plate 112, an intermediate light guide 113 disposed along the side end surface 112 a, and one side of the intermediate light guide 113. A light-shielding case body attached from the side of the intermediate light guide 113 so as to cover the side ends of the light-emitting element 115 disposed on the end face and the intermediate light guide 113, the light emitting element 115, and the light guide plate 112. 119. That is, the light emitting element 115 and the intermediate light guide 113 are used as the light source of the front light 110, and the side end surface 112a of the light guide plate is used as the light incident surface of the light guide plate. In addition, as shown in FIG. 13, a plurality of light guide plates 112 extend in an inclined direction with respect to the light incident surface 112 a on which the intermediate light guide 113 is disposed on the outer surface side (the upper surface side in the drawing). A prism groove 114 is arranged.

The liquid crystal panel 120 includes an upper substrate 121 and a lower substrate 122 arranged to face each other, and a rectangular region 120D indicated by a dotted line in FIG. 13 serves as a display region of the liquid crystal panel 120, and the display region 120D In reality, the pixels of the liquid crystal panel are arranged in a matrix.
In the liquid crystal display device having the above configuration, the light guide plate 112 is disposed on the display region 120D of the liquid crystal panel 120, and the display on the liquid crystal panel 120 can be visually recognized through the light guide plate 112. Further, in a dark place where external light cannot be obtained, the light emitting element 115 is turned on, and the light is introduced from the light incident surface 113 of the light guide plate 112 into the light guide plate through the intermediate light guide 113. The light is emitted from the lower surface 112b toward the liquid crystal panel 120 to illuminate the liquid crystal panel 120.

  The light guide plate 112 of the front light 110 is a flat member that is disposed on the display area of the liquid crystal panel 120 and reflects the light emitted from the light emitting element 115 onto the liquid crystal panel 120, and is made of a transparent acrylic resin or the like. ing. As shown in the partial cross-sectional view of FIG. 14, the upper surface (surface opposite to the liquid crystal panel 120) of the light guide plate 112 is a reflection in which wedge-shaped prism grooves 114 in a cross-sectional view are formed in a stripe shape in parallel with each other. The lower surface in the figure (the surface facing the liquid crystal panel 120) is an emission surface 112b from which illumination light for illuminating the liquid crystal panel 120 is emitted. The prism groove 114 is composed of a pair of slope portions formed to be inclined with respect to the reference surface N of the reflection surface 112c, one of these slope portions being a gentle slope portion 114a, and the other being this gentle slope portion. The steep slope portion 114b is formed at an inclination angle steeper than 114a. The gentle slope portion 114a has a larger inclination angle as the length of the light guide plate 112 in the light propagation direction is shorter, and a smaller inclination angle as the length is longer. Can be increased. The light propagating from the right side to the left side of the light guide plate 112 is reflected by the steep slope portion 114b of the reflection surface 112c toward the emission surface 112b and directed toward the liquid crystal panel 120 disposed on the back side of the light guide plate 112. It is made to emit.

  The liquid crystal panel 120 is a reflective passive matrix liquid crystal panel capable of color display, but the present invention can also be applied to a reflective or transflective passive matrix or active matrix panel. As shown in FIG. 14, a liquid crystal layer 123 is sandwiched between an upper substrate 121 and a lower substrate 122 arranged to face each other, and extends in the left-right direction in the figure on the inner surface side of the upper substrate 121. A plurality of strip-shaped transparent electrodes 126a and an alignment film 126b formed on the transparent electrode 126a are provided. On the inner surface side of the lower substrate 122, a reflective layer 125, a color filter layer 129, and a plurality of plan-view strips are provided. A transparent electrode 128a and an alignment film 128b are sequentially formed.

  The transparent electrode 126a of the upper substrate 121 and the transparent electrode 128a of the lower substrate 122 are both formed in a strip-like planar shape, and are arranged in a stripe shape in plan view. The extending direction of the transparent electrode 126a and the extending direction of the transparent electrode 128a are arranged so as to be orthogonal to each other in plan view. Therefore, one dot of the liquid crystal panel 120 is formed at a position where one transparent electrode 126a and one transparent electrode 128a intersect, and a color filter of three colors (red, green, blue) described later corresponding to each dot. Among them, one color filter is arranged. Then, 3 dots that develop colors of R (red), G (green), and B (blue) constitute one pixel of the liquid crystal panel 120.

  The color filter layer 129 is configured such that red, green, and blue color filters 129R, 129G, and 129B are periodically arranged, and each color filter is disposed below the corresponding transparent electrode 128a. A set of color filters 129R, 129G, and 129B is formed for each pixel 120c. The display color of the pixel 120c is controlled by driving and controlling the electrodes corresponding to the color filters 129R, 129G, and 129B.

  Next, the reflective layer 125 formed on the inner surface side of the lower substrate 122 shown in FIG. 14 has the configuration shown in the perspective configuration diagram of FIG. 1, and as shown in FIG. The metal reflective film 12 having a high reflectivity and an organic film 11 made of an acrylic resin material or the like for giving the metal reflective film 12 a predetermined surface shape are configured. A plurality of recesses 13 are provided on the surface of the organic film 11, and predetermined reflectivity is obtained by the metal reflection film 12 formed on the recesses 13. Accordingly, the recess 13 of the reflective layer 125 of the liquid crystal display device according to the present embodiment has the shape shown in FIG. 2 and the reflective characteristics shown in FIG. Reflective display is possible, and the peak of reflected luminance is shifted in the panel normal direction from the regular reflection direction, so that it is possible to increase the luminance in the front direction of the panel where the observer of a normal liquid crystal display device is normally arranged. And a substantially bright display can be obtained.

  The organic film 11 provided in the liquid crystal panel 120 according to this embodiment is manufactured by the reflector manufacturing method according to the present invention, and is easily and reproducibly manufactured by the reflector manufacturing method described above. can do. Further, by applying the above manufacturing method, even when the pitch of the electrodes 126a, 128a and the color filter layer 129 is changed, the arrangement pattern of the unevenness of the reflective layer 125 can be changed very easily. it can. In addition, a so-called transflective liquid crystal display device can be obtained by forming minute apertures in the reflective layer 125 with a predetermined aperture ratio.

FIG. 1 is a partial perspective view showing an example of the configuration of a reflector according to the present invention. 2A is a plan configuration diagram of a recess formed in the reflector shown in FIG. 1, and FIG. 2B is a cross-sectional configuration diagram taken along line GG shown in FIG. 2A. 3 irradiates the reflector 10 shown in FIG. 1 with light at an incident angle of 30 ° from the right side of FIG. It is a graph which shows the result of having measured in the range of +/- 30 degrees (0 degree-60 degrees; 0 degree is equivalent to the normal line direction of the liquid crystal panel 20), and measuring the reflectance (%) of the reflector 10 as a center core. FIG. 4A is an exploded perspective view showing a mother die assembly including a transfer mother die for forming a concavo-convex shape of a reflector in the manufacturing method of the present embodiment, and FIG. 4B is a plan view of the mother die assembly. It is. FIG. 5 is a cross-sectional configuration diagram showing a process of manufacturing a roll plate using the matrix assembly shown in FIG. FIG. 6 is a view showing a cross-sectional structure of a roll plate produced by the process shown in FIG. FIG. 7 is a perspective configuration diagram illustrating a process of forming the uneven shape of the reflector using the roll plate illustrated in FIG. 6. FIG. 8 is a perspective configuration diagram showing another example of the organic film processing step according to the manufacturing method of the present embodiment. FIG. 9 is a process diagram showing an example of a transfer mold manufacturing apparatus for manufacturing the transfer mold shown in FIG. FIG. 10 is a cross-sectional configuration diagram showing an example of the tip shape of the indenter provided in the transfer master manufacturing apparatus shown in FIG. FIG. 11 is a process diagram showing an example of a transfer mold manufacturing apparatus for manufacturing the transfer mold shown in FIG. FIG. 12 is a process diagram showing an example of a transfer mold manufacturing apparatus for manufacturing the transfer mold shown in FIG. FIG. 13 is a perspective configuration diagram showing an example in which the reflector according to the present invention is applied to a reflective layer of a liquid crystal display device. FIG. 14 is a partial cross-sectional configuration diagram of the liquid crystal display device shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 17 ... Holding member, 17a ... Bearing, 17d ... Holding main-body part, 17e ... Holding leg, 40 ... Transfer master manufacturing apparatus, 41 ... Surface plate, 41a ... Surface plate surface (reference surface), 42 ... Base material (base) Material), 42a ... mother body, 42b ... shaft, 42c ... outer peripheral surface (reference processing surface), 43 ... cutting means (outer peripheral surface processing means), 44 ... cutting means (cutting and polishing means), 44a ... cutting Tool, 44b ... Tool conveying part, 45 ... Base material driving part (base material driving means), 47 ... Indenter, 48 ... Indenter driving part, 49 ... Indenter conveying part, 54 ... Control means, 60 ... Recessed part (indentation)

Claims (4)

  A substantially cylindrical base material that is rotatably held on a surface plate, base material driving means for rotationally driving the base material about its axis, and cutting of the outer peripheral surface of the base material Cutting means for processing, stamping means for stamping an indentation on the outer peripheral surface of the matrix substrate, and control means for controlling the substrate driving means, the cutting means, and the stamping means. And using the control means to operate the base material driving means and the cutting means to cut the outer peripheral surface of the base material to center the base material, and then to control the control The substrate driving means and the engraving means are operated by means to imprint an indentation on the outer peripheral surface of the matrix substrate, and a method for producing a transfer mother die for forming a fine uneven surface.   The cutting means comprises a cutting tool for cutting the outer peripheral surface of the matrix substrate, and a tool conveying unit for moving the cutting tool in parallel with the axial direction of the matrix substrate, The cutting tool is moved in parallel with the axis direction of the matrix substrate while rotating the matrix substrate so that the rotation axis of the matrix substrate is parallel to the surface of the surface plate. The method for producing a transfer master for forming a fine uneven surface according to claim 1, wherein:   3. The production of a transfer mother die for forming a micro uneven surface according to claim 1, wherein centering and indentation are performed in a state where both ends of the mother die substrate are rotatably supported. Method. A substantially cylindrical base material that is rotatably held on a surface plate, base material driving means for rotationally driving the base material about its axis, and cutting of the outer peripheral surface of the base material Cutting means for processing, stamping means for stamping an indentation on the outer peripheral surface of the matrix substrate, and control means for controlling the substrate driving means, the cutting means, and the stamping means. Prepared ,
The control means operates the base material driving means and the cutting means to cut the outer peripheral surface of the base material to center the base material, and then the base material driving means. An apparatus for producing a transfer mother die, wherein the imprinting means is configured to impress an indentation on an outer peripheral surface of the mother die base material .

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