JP4298083B2 - Operation panel and processing apparatus including the operation panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an operation panel that is mounted on or connected to various processing apparatuses and is operated by an operator for controlling the processing apparatus.
[0002]
[Prior art]
In processing equipment, especially precision processing equipment that requires precision processing, such as semiconductor manufacturing equipment, control in units of μm is required, so the operator must carefully operate the operation panel mounted on or connected to the processing equipment. Thus, it is necessary to control the operation of the machining apparatus by inputting various numerical values.
[0003]
For example, in a dicing apparatus for dicing a semiconductor wafer by cutting, by operating a numerical input key 11 of an operation panel 60 as shown in FIG. 5, the cutting blade feed amount, feed speed, cutting amount, cutting speed, etc. The numerical value of is input to perform precise machining.
[0004]
[Problems to be solved by the invention]
However, the numerical value input key 11 of the operation panel 60 is composed of the numeric keys 15 to 16, the decimal point key 16, and the like. If the number of digits is large or a large number of zeros after the decimal point must be input, an error occurs. Input is likely to occur. If there is an erroneous input of such a numerical value, it is not possible to cause the processing apparatus to perform a desired operation. As a result, it is not only possible to process the workpiece into a desired shape but also damage the workpiece. Or the processing apparatus may be damaged.
[0005]
On the other hand, there is a problem that if an attempt is made to input correctly when the digit is large or there are many zeros after the decimal point, the input must be performed carefully, and the operation is complicated and takes time.
[0006]
As described above, when the operation panel is operated to control the machining apparatus, there are problems in eliminating erroneous input and improving operability.
[0007]
[Means for Solving the Problems]
As a specific means for solving the above-mentioned problem, the present invention is an operation panel operated to control the processing apparatus, and numeric input keys including numeric keys from 0 to 9 are provided, A digit setting key is provided to set the digit of the numeric value input by operating the numeric input key. The digit setting key includes a plurality of digits for setting the numeric digit input from the numeric input key to different digits. Provide an operation panel with a digit key .
[0008]
The operation panel has an additional requirement that the carry-down key includes at least one of the [0.0] key, the [0.00] key, and the [0.000] key.
[0009]
Further, the present invention is a processing apparatus equipped with the above-described operation panel, wherein the first storage means for storing numerical values input by the operation of the numeric keys and the first storage means based on the operation of the digit setting keys. Stored in the digit setting means for determining the digit of the stored numerical value, the second storage means for storing the numerical value set by the digit setting means, the first storage means and the second storage means Provided is a processing apparatus including display means for displaying numerical values.
[0010]
And this processing apparatus makes it an additional requirement to be controlled based on the numerical value memorize | stored in the 2nd memory | storage means.
[0011]
In the operation panel and the processing apparatus configured as described above, since the operation is simple and erroneous input is reduced, the processing apparatus can be precisely controlled.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
As an example of the embodiment of the present invention, an operation panel 10 mounted on the dicing apparatus 20 shown in FIG. 1 will be described. In addition, the same code | symbol is attached | subjected and demonstrated to the site | part which is common in the conventional operation panel 60 shown in FIG.
[0013]
First, the outline of the dicing apparatus 20 will be described. For example, when dicing a semiconductor wafer, a plurality of semiconductor wafers W held by the frame F via the holding tape T are accommodated in the cassette 21 and unloaded by the loading / unloading means 22. After that, it is transported to the chuck table 24 by the transport means 23 and held by suction.
[0014]
Then, the semiconductor wafer W held on the chuck table 24 is positioned immediately below the alignment means 25 by the movement of the chuck table 24 in the X-axis direction, where a street to be cut is detected and the Y-axis with the cutting blade 26 is detected. Directional alignment is made. When this alignment is performed, the chuck table 24 further moves in the same direction, so that the cutting blade 26 that rotates at a high speed cuts into the detected street, and the street is cut.
[0015]
When the street detected in this manner is cut, the chuck table 24 is reciprocated in the X-axis direction while sequentially cutting and feeding the entire cutting means 27 having the cutting blade 26 in the Y-axis direction by the street interval. As a result, all streets in the same direction are cut.
[0016]
Further, when the chuck table 24 is rotated 90 degrees and cutting is performed in the same manner as described above, all the streets are cut (diced) horizontally and vertically to form individual chips.
[0017]
In the dicing performed in this manner, the street interval of the semiconductor wafer W, that is, the cutting feed amount of the cutting means 27 in the Y-axis direction, the cutting depth and cutting speed of the cutting blade 26, the feeding speed of the chuck table 24 in the X-axis direction, etc. It is necessary to input the data in advance. Therefore, in the example of FIG. 1, data necessary for dicing is input in advance using the operation panel 10 provided on the front side of the dicing apparatus 20 according to the guidance screen displayed on the display means 28. In the example of FIG. 1, the display means 28 is configured to be provided in the upper part of the dicing apparatus 20, but may be provided in the operation panel 10.
[0018]
For example, as shown in FIG. 2, the operation panel 10 is used to move a cursor on a display screen of a display unit 28, a numerical value input key 11 used to input a numerical value, a digit setting key 12 for setting a digit of the input numerical value It consists of a cursor key 13 and a character input key 14 used for character input.
[0019]
Here, as shown in FIG. 3, the numerical value input key 11 is connected to the first storage means 31 for storing the numerical value input inside the dicing apparatus 20, and the first storage means 31 and the digit setting are connected. The key 12 is connected to a digit setting means 32 for setting a numeric digit stored in the first storage means 31 based on the operation of the digit setting key 12. The digit setting means 32 is connected to the second storage means 33 and can store a numerical value set with a digit. Further, the first storage means 31 and the second storage means 33 are connected to the display means 28, and the numerical values stored in both can be displayed on the display means 28.
[0020]
As shown in FIG. 2, the numerical value input key 11 includes a group of numeric keys 15 from 0 to 9, a decimal point key 16, a sign key 17 for setting the sign of the numerical value to be input, etc., which are necessary prior to dicing. Data is input from here. The input numerical value is stored in the first storage means 31 shown in FIG.
[0021]
The numerical values input from the numerical value input key 11 and stored in the first storage means 31 are [0.0] key 12a, [0.00] key 12b, [0. By pressing any one of the [000] key 12c, the digit setting means 32 sets the digit corresponding to the key.
[0022]
Here, the [0.0] key 12a, the [0.00] key 12b, and the [0.000] key 12c are all digit-removing keys for lowering the digit of the numerical value input from the numerical key 11. Conversely, a key for enlarging a numerical digit may be provided.
[0023]
For example, when data is input, an input screen is displayed on the display means 28, and necessary data is input according to the guidance. At this time, units such as cm and mm are displayed in advance on the screen. It is necessary to input a numerical value according to the unit. Therefore, for example, even when it is desired to input data “5 μm”, if the unit is displayed in mm, “0.005” must be input.
[0024]
In such a case, after inputting “5” of the numeric key 15, the [0.00] key 12b is pressed. Here, the numerical value of 5 is stored in the first storage means 31 and displayed on the display means 28 in the configuration shown in FIG. Also, the digit setting means 32 is notified that the [0.00] key 12b has been pressed.
[0025]
In the digit setting means 32, “5” is converted to “0.005”, and this numerical value is stored in the second storage means 33 and displayed on the display means 28.
[0026]
By utilizing the digit setting key portion 12 in this way, the number of times of inputting “0” can be reduced and erroneous input can be prevented, so that the semiconductor wafer can be diced precisely. In addition, since the number of times of input is reduced, a complicated operation is not required and operability is improved. Therefore, the workpiece is not damaged and the processing apparatus is not damaged.
[0027]
In addition to the dicing apparatus 20 shown in FIG. 1, as a processing apparatus on which the operation panel according to the present invention is mounted, for example, there is a grinding apparatus 40 shown in FIG. The polishing apparatus 40 is an apparatus for grinding the surface of a plate-like object such as a semiconductor wafer, and generally operates as follows.
[0028]
First, a plurality of objects to be ground, for example, semiconductor wafers W, are accommodated in a cassette 41a, and are unloaded by loading / unloading means 42 and placed on a centering table 43, where the center position is aligned. After being made, it is conveyed to the chuck table 46 disposed on the turntable 45 by the first conveying means 44 and is sucked and held.
[0029]
Next, the turntable 45 is rotated by a required angle so that the semiconductor wafer W held on the chuck table 46 is positioned immediately below the first grinding means 47. Then, the first grinding wheel portion 48 provided in the first grinding means 47 descends while rotating, and comes into contact with the upper surface of the semiconductor wafer W to apply a pressing force, whereby rough grinding is performed.
[0030]
When rough grinding is performed in this way, the turntable 45 rotates by a required angle, and the semiconductor wafer W is positioned directly below the second grinding means 49. Then, the second grinding wheel portion 50 provided in the second grinding means 49 descends while rotating and comes into contact with the upper surface of the semiconductor wafer W to apply a pressing force, whereby finish grinding is performed.
[0031]
After finishing grinding, the turntable 45 is rotated by a required angle so that the ground semiconductor wafer W is positioned in the vicinity of the cleaning means 51, and then the semiconductor wafer W is moved to the cleaning means 51 by the second transport means 52. Grinding debris and the like conveyed and adhered are removed by washing. Then, the semiconductor wafer W that has been ground and cleaned is accommodated in the cassette 41 b by the loading / unloading means 42. Grinding is performed sequentially as described above, and finally the ground semiconductor wafer W is all stored in the cassette 41b.
[0032]
In grinding performed as described above, it is necessary to finally finish the semiconductor wafer W to a desired thickness by specifying the rotation speed of the chuck table 46, the grinding amount of the semiconductor wafer W, and the like.
[0033]
Therefore, in the example of FIG. 4, data necessary for grinding is input according to the guide screen displayed on the display means 53 using the operation panel 10 provided on the front side of the grinding apparatus 40. The input method is the same as in the case of the dicing apparatus, and since grinding can be performed precisely, a plate-like product having a desired thickness can be finished.
[0034]
【The invention's effect】
As described above, according to the operation panel and the processing apparatus according to the present invention, since erroneous input is reduced, the processing apparatus can be precisely controlled. Therefore, the workpiece or the processing apparatus is not damaged. Further, the operation does not take time and the operability is improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a dicing apparatus as a first embodiment of a processing apparatus according to the present invention.
FIG. 2 is a plan view showing an operation panel according to the present invention.
FIG. 3 is a block diagram showing a flow of numerical values input from the operation panel.
FIG. 4 is a perspective view showing a grinding apparatus which is a second embodiment of the processing apparatus according to the present invention.
FIG. 5 is a plan view showing a conventional operation panel.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Operation panel 11 ... Numerical value input key 12 ... Digit setting key 12a ... [0.0] key 12b ... [0.00] key 12c ... [0.000] key 13 ... Cursor key 14 ... Character input key 15 ... Number Key 16 ... Decimal point key 17 ... Sign key 20 ... Dicing device 21 ... Cassette 22 ... Loading / unloading means 23 ... Transport means 24 ... Chuck table 25 ... Alignment means 26 ... Cutting blade 27 ... Cutting means 28 ... Display means 31 ... First Storage means 32 ... Digit setting means 33 ... Second storage means 40 ... Grinding device 41 ... Cassette 42 ... Carry-in / out means 43 ... Centering table 44 ... First transport means 45 ... Turntable 46 ... Chuck table 47 ... First Grinding means 48 ... first grinding wheel 49 ... second grinding means 50 ... second grinding wheel 51 ... cleaning means 52 Second conveying means 53 ... display unit 60 ... operation panel

Claims (4)

An operation panel operated to control the processing apparatus,
A numeric input key including numeric keys from 0 to 9 is provided, and a digit setting key for setting the digit of the numeric value input by operating the numeric input key is provided.
The digit setting key is provided with a plurality of digit dropping keys for setting the digits of the numerical values input from the numerical value input keys to different digits . The operation panel according to claim 1 , wherein the carry-over key includes at least a [0.0] key, a [0.00] key, and a [0.000] key. 3. A processing apparatus equipped with the operation panel according to claim 1 or 2 , wherein the first storage means for storing a numerical value input by operating a numeric key and the first storage based on the operation of a digit setting key. A digit setting means for determining a digit of a numerical value stored in the means; a second storage means for storing a numerical value set by the digit setting means; the first storage means and the second storage means; A processing apparatus including display means for displaying stored numerical values. The processing apparatus according to claim 3 , which is controlled based on a numerical value stored in the second storage unit.

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