JP4273707B2 - Method for manufacturing plasma display panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a plasma display panel.
[0002]
[Prior art]
In a plasma display device known as a thin, lightweight display device with a large screen, ultraviolet rays are generated by gas discharge, and phosphors are excited by the ultraviolet rays to emit light to perform color display. And the display cell divided by the partition on the board | substrate is provided, and it has the structure by which the fluorescent substance layer is formed in this.
[0003]
This plasma display device is roughly classified into an AC type and a DC type in terms of driving, and there are two types of discharge types: a surface discharge type and a counter discharge type, but high definition, large screen, and simple manufacturing are possible. Therefore, at present, the mainstream of the plasma display device is a surface discharge type of a three-electrode structure, and the structure has a display electrode paired with a scan electrode and a sustain electrode on the front substrate, and the rear substrate. It has an address electrode arranged in a direction intersecting with the display electrode, a partition wall, and a phosphor layer. The peripheral portions of the front substrate and the back substrate are sealed with a sealing material such as glass frit, and a discharge gas such as neon and xenon is sealed inside.
[0004]
The sealing material is usually a low-melting glass that is softened by heat. Before forming a panel by arranging the front substrate and the back substrate to face each other, for example, the low-melting glass on the peripheral edge of the back substrate. In a mixture with a binder and applied with a dispenser, etc., and in the sealing process, the temperature above the softening point of the low-melting glass while fixing with a clip etc. from the location where the sealing material was applied to the outer peripheral edge Sealing is carried out by heating and baking.
[0005]
[Problems to be solved by the invention]
By the way, the display electrodes formed on the front substrate and the address electrodes formed on the rear substrate are connected to an electric circuit for performing display driving and control using a flexible wiring board. That is, the display electrode and the address electrode are connected to terminals formed on the end portions of the front substrate and the rear substrate, respectively, and a flexible wiring board is crimped to the terminals via anisotropic conductive members having anisotropy. The connection is made by
[0006]
However, when the front substrate and the rear substrate are sealed with a sealing material, the sealing material sometimes protrudes toward the terminal. This will be described with reference to FIGS. 10 and 11. FIG. 10 is a plan view seen from the back substrate 2 side after the front substrate 1 and the back substrate 2 are sealed, and FIGS. 11 (a) and 11 (b) are cross-sectional views taken along line AA in FIG. It is a BB sectional view. As shown in FIG. 10, a plurality of terminals 3 are provided at the left and right ends of the front substrate 1, and scan electrodes and sustain electrodes are connected to the terminals 3. A plurality of terminals to which the address electrodes are connected are provided at both upper and lower ends of the rear substrate 2. As shown in FIG. 11A, the sealing material 4 is formed at the left and right ends of the front substrate 1 without protruding to the terminal 3 side, whereas at the upper and lower ends of the rear substrate 2, the sealing material 4 is formed. As shown in (b), the sealing material 4 protruded from the terminal 3 side. When the sealing material 4 is formed so as to protrude to the terminal 3 side in this way, the protruding sealing material 4 becomes an obstacle when the flexible wiring board is crimped to the terminal 3 via the anisotropic conductive member, and production is performed. There was a problem that the performance decreased.
[0007]
The present invention has been made in order to solve such problems, and aims to improve productivity.
[0008]
[Means for Solving the Problems]
As a result of examining the manufacturing process in order to solve the above problems, the sealing material 4 is formed without protruding to the terminal 3 side at the left and right end portions of the front substrate 1, whereas the upper and lower end portions of the back substrate 2 are formed. Then, the cause of the sealing material 4 protruding from the terminal 3 side was considered as follows.
[0009]
When the front substrate 1 and the rear substrate 2 are sealed, first, a sealing material 4 is applied on the rear substrate 2 as shown in FIG. Here, a two-dot chain line 5 in FIG. 12 represents the position of the front substrate 1 facing the rear substrate 2, and the sealing material 4 is applied along the edge of the rear substrate 2 at both left and right ends of the rear substrate 2. And the sealing material 4 is apply | coated so that it may be located in the upper-and-lower-ends part of the back substrate 2 along the edge of the front substrate 1 when opposingly arranged. Next, the rear substrate 2 on which the sealing material 4 is formed and the front substrate 1 are aligned and arranged to face each other, and sealing is performed by heating and firing while fixing the peripheral portion with a clip or the like. Since the sealing material 4 is already formed on the back substrate 2 when performing this heat firing, the surface of the back substrate 2 is more heated than the surface of the front substrate 1 by the heat firing at the time of sealing. As a result, it is considered that sealing is performed in a state as shown in FIG.
[0010]
Based on the above considerations, the present invention has been achieved. In the present invention, when sealing is performed by heating the first substrate and the second substrate while facing each other, the second substrate In the vicinity of the terminal formed on the substrate, a sealing material is formed so as to be located on the inner side of the end of the first substrate when the first substrate and the second substrate are arranged to face each other. It is.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
That is, according to the first aspect of the present invention, the first substrate and the second substrate are arranged to face each other so that a discharge space is formed therebetween, and the peripheral portion is sealed with a sealing material. And a method of manufacturing a plasma display panel in which a plurality of terminals are formed on a portion of the first substrate and the second substrate outside the sealing material, wherein the terminals are sealed on the second substrate. In the vicinity of the terminals formed on the second substrate, the first substrate and the second substrate are placed opposite to each other and heated to form a bonding material. A terminal formed on the first substrate by forming the sealing material so as to be positioned on an inner side than an end of the first substrate when the first substrate and the second substrate are arranged to face each other. in the vicinity of, along the edge of the second substrate, without edges and gaps of the second substrate A method of manufacturing a plasma display panel and forming a Kifu adhesive material.
[0013]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0014]
First, the structure of the plasma display panel will be described with reference to FIG. As shown in FIG. 1, on a glass front substrate (first substrate) 11, a plurality of stripe-shaped display electrodes paired with a scan electrode 12 and a sustain electrode 13 are formed. A dielectric layer 14 is formed so as to cover it, and a protective layer 15 is formed on the dielectric layer 14.
[0015]
A plurality of stripe-shaped addresses covered with an overcoat layer 17 are formed on the rear substrate (second substrate) 16 disposed opposite to the front substrate 11 so as to intersect the scan electrode 12 and the sustain electrode 13. An electrode 18 is formed. On the overcoat layer 17 between the address electrodes 18, a plurality of partition walls 19 are arranged in parallel with the address electrodes 18, and a phosphor layer 20 is provided on the side surfaces of the partition walls 19 and the surface of the overcoat layer 17. .
[0016]
The front substrate 11 and the rear substrate 16 are arranged to face each other with a minute discharge space so that the scan electrode 12, the sustain electrode 13 and the address electrode 18 are substantially orthogonal to each other, and the periphery is sealed, In the discharge space, a mixed gas composed of neon, xenon, and the like is sealed as a discharge gas. Further, discharge cells are provided at the intersections of the scan electrodes 12 and the sustain electrodes 13 and the address electrodes 18, and the phosphor layers 20 are sequentially arranged in the respective discharge cells so that the colors are red, green and blue. ing. Then, one pixel is constituted by three discharge cells in which red, green and blue phosphor layers 20 are arranged adjacent to each other, and color display is performed.
[0017]
In such a plasma display panel, an address pulse is applied between the address electrode 18 and the scan electrode 12 by applying a write pulse between the address electrode 18 and the scan electrode 12 to select a discharge cell. By applying a periodic sustain pulse that is alternately inverted between the scan electrode 12 and the sustain electrode 13, a sustain discharge is performed between the scan electrode 12 and the sustain electrode 13 and a predetermined display is performed. It is.
[0018]
FIG. 2 shows an example of the overall configuration of a plasma display device incorporating the plasma display panel having the structure described above. In FIG. 2, a housing that accommodates the panel body 21 is composed of a front frame 22 and a metal back cover 23, and an opening of the front frame 22 has an optical filter and glass that also protects the panel body 21. A front cover 24 is arranged. The front cover 24 is subjected to, for example, silver deposition in order to suppress unnecessary radiation of electromagnetic waves. Further, the back cover 23 is provided with a plurality of vent holes 23a for releasing heat generated in the panel body 21 and the like to the outside.
[0019]
The panel body 21 is held by adhering to the front surface of the chassis member 25 made of aluminum or the like via a heat conductive sheet 26, and a plurality of panels for driving the panel body 21 to be displayed are provided on the rear surface side of the chassis member 25. A circuit block 27 is attached. The heat conductive sheet 26 is for efficiently transferring the heat generated in the panel main body 21 to the chassis member 25 for heat dissipation. Further, the circuit block 27 includes an electric circuit for performing display driving of the panel main body 21 and its control, and the electric circuit and terminals formed on the edge of the panel main body 21 are not illustrated, The chassis members 25 are electrically connected by a plurality of flexible wiring boards (hereinafter referred to as FPCs) extending beyond the edges of the four sides.
[0020]
Further, a boss portion 25a for attaching the circuit block 27 and fixing the back cover 23 is protruded from the rear surface of the chassis member 25 by integral molding such as die casting. The chassis member 25 may be configured by fixing a fixing pin to an aluminum flat plate.
[0021]
FIG. 3 is a plan view showing the internal arrangement structure of the plasma display device having such a configuration with the back cover 23 removed, and in FIG. 3, the scan driver circuit block 28 has a predetermined signal voltage applied to the scan electrodes of the panel body 21. The sustain driver circuit block 29 supplies a predetermined signal voltage to the sustain electrode of the panel body 21, and the address driver circuit block 30 supplies a predetermined signal voltage to the address electrode of the panel body 21. The circuit block 28 and the sustain driver circuit block 29 are disposed at both ends in the width direction of the chassis member 25, and the address driver circuit block 30 is disposed at the upper end portion and the lower end portion in the height direction of the chassis member 25.
[0022]
The control circuit block 31 displays image data on the basis of a video signal sent from an input signal circuit block 32 having an input terminal portion to which a connection cable for connecting to an external device such as a television tuner is detachably connected. It is converted into an image data signal corresponding to the number of pixels of the main body 21 and supplied to the address driver circuit block 30, and a discharge control timing signal is generated and supplied to the scan driver circuit block 28 and the sustain driver circuit block 29, respectively. It performs display drive control such as tone control, and is arranged at substantially the center of the chassis member 25.
[0023]
The power supply block 33 supplies a voltage to each circuit block described above. Like the control circuit block 31, the power supply block 33 is disposed at a substantially central portion of the chassis member 25 and includes a connector 34 to which a power supply cable (not shown) is attached. The commercial power supply voltage is supplied through the power input block 35 having the power supply.
[0024]
The bracket 36 is attached to the stand pole, and is attached to the position of the lower end portion of the chassis member 25 in the height direction. The stand is attached by inserting the tip of the stand pole attached to the stationary stand into the hole of the bracket 36 and fixing the stand pole to the bracket 36 with a screw or the like, thereby holding the panel in an upright state. It will be.
[0025]
The FPC 37 connects the terminals connected to the scan electrodes 12 and the sustain electrodes 13 of the panel body 21 to the printed wiring boards of the scan driver circuit block 28 and the sustain driver circuit block 29, and the FPC 38 connects to the address electrodes of the panel body 21. Are connected to the printed wiring board of the address driver circuit block 30 and are arranged by being bent 180 degrees from the front side to the back side through the outer periphery of the panel body 21.
[0026]
FIG. 4 is a plan view showing the panel body 21 before the FPCs 37 and 38 are attached, and FIGS. 4A and 4B are views of the panel body 21 as seen from the back side and the front side, respectively. The front substrate 11 and the back substrate 16 of the panel body 21 are substantially rectangular and have long sides and short sides. The front substrate 11 is longer on the long side than the back substrate 16 and shorter on the short side. is there. Further, sealing is performed by providing a sealing material between the front substrate 11 and the rear substrate 16, and the sealing material is provided around a region where the front substrate 11 and the rear substrate 16 overlap. As shown in FIG. 4A, a plurality of terminals connected to the scan electrode 12 or the sustain electrode 13 are divided into a plurality of blocks at the left and right ends, which are the short sides of the front substrate 11, respectively. ing. In other words, a plurality of terminal blocks 39 each having one block constituted by a plurality of predetermined terminals are provided in a portion outside the sealing material, and an FPC 37 is connected to each terminal block 39 as shown in FIG. Is done. Further, as shown in FIG. 4B, a plurality of terminals connected to the address electrodes 18 are divided into a plurality of blocks at both upper and lower ends which are the long sides of the back substrate 16. That is, a plurality of terminal blocks 40 each having one block constituted by a plurality of predetermined terminals are provided outside the sealing material, and each terminal block 40 is connected to an FPC 38 as shown in FIG. Is done.
[0027]
Specifically, the number of terminals for connection of the panel main body 21 is about 500 to 1000 on one side of the front substrate 11 and about 2000 to 4000 on one side of the back substrate 16. For example, in the wide VGA model, 480 terminals are pulled out on one side of the front substrate 11 and 2556 terminals are pulled out on the back substrate 16, and in the dual scan structure, 2556 terminals are provided on both upper and lower sides of the rear substrate 16. It will be. The normal terminals are divided into a plurality of terminal blocks 39 and 40 each having about 100 to 200 as one block.
[0028]
FIG. 6 is a cross-sectional view of the portion where the FPC 37 is attached to the front substrate 11, and the portion where the FPC 38 is attached to the rear substrate 16 has the same structure. As shown in FIG. 6, the FPC 37 forms a plurality of wiring patterns 42 made of copper foil or the like on a resin base film 41 having insulation properties and flexibility such as polyimide, and only the connection portions at both ends are formed. The wiring pattern 42 is connected to a terminal 45 provided on the terminal block 39 via an anisotropic conductive member 44 through a structure in which other wiring pattern portions are similarly covered with a resin cover film 43 such as polyimide. Yes. The anisotropic conductive member 44 is formed by dispersing conductive particles such as nickel in an insulating material, and normally has no conductivity. However, the anisotropic conductive member 44 is interposed between the front substrate 11 and the FPC 37 by thermocompression bonding. By crushing, the conductive particles between the terminal 45 and the wiring pattern 42 are combined, and conduction is obtained only between the terminal 45 and the wiring pattern 42.
[0029]
Further, as shown in FIG. 6, a predetermined region 46 is provided between the front end portion of the FPC 37 and the end portion of the rear substrate 16 to fix the FPC 37. An adhesive 47 is applied to the base film 41 side of the FPC 37 so as to cover the terminal 45 and the anisotropic conductive member 44 in this region 46. That is, the adhesive 47 is applied to the connection portion side between the front substrate 11 and the FPC 37. Further, an adhesive 47 is applied on the cover film 43 side of the FPC 37 so as to cover the anisotropic conductive member 44. That is, the adhesive 47 is applied to the back side of the FPC 37. Reference numeral 48 denotes a sealing material for sealing the front substrate 11 and the rear substrate 16. Further, the terminal 45 is provided at a portion outside the sealing material 48 and is connected to the scan electrode 12 or the sustain electrode 13 inside the panel body 21.
[0030]
Next, a method for sealing the front substrate 11 and the back substrate 16 using the sealing material 48 will be described with reference to FIGS.
[0031]
First, after forming a sealing material 48 on the back substrate 16 as shown in FIG. 7 by applying low melting point glass in a mixture with a binder onto the back substrate 16 with a dispenser or the like, the sealing material is then formed. The rear substrate 16 and the front substrate 11 on which the 48 is formed are aligned and face each other. Here, a two-dot chain line 49 in FIG. 7 represents the position of the front substrate 11. Next, with the front substrate 11 facing down with respect to the back substrate 16, while fixing with a clip or the like from the location where the sealing material 48 is applied to the outer peripheral edge, at a temperature equal to or higher than the softening point of the low melting point glass. Sealing is performed by heating and baking.
[0032]
FIG. 8 is a cross-sectional view when the rear substrate 16 and the front substrate 11 on which the sealing material 48 is formed are aligned and opposed to each other, and FIG. 9 is a cross-sectional view after sealing. 8 (a) and 9 (a) show a cross section taken along line CC in FIG. 7, and FIGS. 8 (b) and 9 (b) show DD in FIG. It represents a section cut by a line.
[0033]
When the sealing material 48 is formed on the back substrate 16, the sealing material 48 is attached to the end 16 a of the back substrate 16 on the short side which is the left and right ends of the back substrate 16 as shown in FIG. Along and between the end 16a. Further, on the long side which is the upper and lower ends of the back substrate 16, as shown in FIG. 8B, the end of the sealing material 48 is positioned inside the end 11 a of the front substrate 11 by a distance a. It is formed as follows. That is, the sealing material 48 is formed so as to be located inside the end of the front substrate 11.
[0034]
As described with reference to FIGS. 7 and 8, by forming the sealing material 48 on the back substrate 16 and performing sealing, as shown in FIGS. 9A and 9B, the long side of the panel In both cross sections on the short side, the sealing material 48 can be sealed so as not to protrude to the terminal 45 side. Since the sealing material 48 has already been formed on the back substrate 16 when sealing, the sealing material 48 is heated on the surface of the back substrate 16 compared to the surface of the front substrate 11 by heating and baking at the time of sealing. It is considered that the sealing material 48 is spread by forming the sealing material 48 on the inner side of the end of the front substrate 11 on the long side of the back substrate 16. Also, the terminal 45 is prevented from protruding. Therefore, since the sealing material 48 does not become an obstacle when the FPCs 37 and 38 are pressure-bonded to the terminal 45 via the anisotropic conductive member 44, the productivity can be improved.
[0035]
For example, in FIG. 8, the sealing material 48 having a width b = 5 mm and a thickness of 500 μm is formed on the back substrate 16 so that the distance a = 2 mm, so that the sealing material 48 does not protrude to the terminal 45 side. Can be sealed. These sizes may be appropriately adjusted depending on the panel design and the type of the sealing material 48, and the distance a may be set so that the sealing material 48 does not protrude to the terminal 45 side when sealed.
[0036]
In the case where terminals are formed only at the upper end of the upper and lower ends of the back substrate 16, for example, when the sealing material 48 is formed on the back substrate 16, the terminals formed on the back substrate 16 In the vicinity, that is, the upper end portion, the sealing material 48 may be formed so as to be located inside the end of the front substrate 11 when the front substrate 11 and the rear substrate 16 are arranged to face each other. Thereby, since the sealing material 48 does not become a hindrance at the time of crimping | bonding FPC to a terminal, productivity can be improved.
[0037]
In the above embodiment, the case where the sealing material 48 is formed on the back substrate 16 when the front substrate 11 and the back substrate 16 are sealed has been described, but the sealing material 48 is formed on the front substrate 11. In the case of forming, the sealing material 48 is positioned in the vicinity of the terminal formed on the front substrate 11 so as to be located inside the end of the rear substrate 16 when the front substrate 11 and the rear substrate 16 are opposed to each other. What is necessary is just to form.
[0038]
【The invention's effect】
As described above, according to the present invention, the sealing material for sealing the front substrate and the rear substrate can be prevented from becoming an obstacle when connecting the terminal portion of the panel and the flexible wiring board. And productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of a panel of a plasma display device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing an overall configuration of the plasma display device. FIG. 4A and FIG. 4B are plan views showing the terminal block when the panel body of the plasma display device is viewed from the front substrate side and the rear substrate side. FIG. 6 is a plan view showing a state in which a flexible wiring board is attached in the plasma display device. FIG. 6 is a cross-sectional view showing a state in which the flexible wiring board is attached in the plasma display device. FIG. 8 is a schematic plan view showing a state where a sealing material is formed on a substrate. FIGS. 8A and 8B show the plasma display device. FIGS. 9A and 9B are cross-sectional views showing the main part when the front substrate and the rear substrate are arranged opposite to each other. FIGS. 9A and 9B are views after sealing the front substrate and the rear substrate in the plasma display device. FIG. 10 is a plan view seen from the back substrate side after sealing the front substrate and the back substrate in the conventional plasma display device. FIG. 11 (a) and FIG. Sectional drawing which shows the principal part after sealing a front substrate and a back substrate in the conventional plasma display apparatus. [FIG. 12] In the conventional plasma display apparatus, when sealing a front substrate and a back substrate, a back substrate Schematic plan view showing the state where the sealing material is formed on top [Explanation of symbols]
11 Front substrate 16 Rear substrate 21 Panel body 39, 40 Terminal block 45 Terminal 48 Sealing material

Claims (1)

The first substrate and the second substrate are arranged so as to face each other so that a discharge space is formed therebetween, and a peripheral portion is sealed with a sealing material, and the first substrate and the second substrate are formed. A method of manufacturing a plasma display panel in which a plurality of terminals are formed on a portion of the substrate outside the sealing material,
After forming the sealing material on the second substrate, when performing sealing by arranging and heating the first substrate and the second substrate,
In the vicinity of the terminals formed on the second substrate, the sealing is performed so that the first substrate and the second substrate are positioned on the inner side of the end of the first substrate when the first substrate and the second substrate are disposed to face each other. Forming the material,
In the vicinity of the terminal formed on the first substrate, the sealing material is formed along the end of the second substrate without a gap from the end of the second substrate. Manufacturing method.

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