JP4267796B2 - Contact probe position adjustment device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is used as a probe pin, a socket pin or the like, and a position of a contact probe used when assembling a contact probe for making an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device or the like to a probe card. The present invention relates to an adjusting device.
[0002]
[Prior art]
In general, contact pins are used to perform an electrical test by contacting each terminal of a semiconductor chip such as an IC chip or LSI chip or an LCD (liquid crystal display).
In recent years, with the high integration and miniaturization of IC chips and the like, the pitch of contact pads, which are electrodes, has been reduced, and there has been a demand for a narrower pitch of contact pins. However, with a tungsten needle contact probe used as a contact pin, it is difficult to cope with a narrow multi-pin pitch due to the limit of the diameter of the tungsten needle.
[0003]
On the other hand, for example, in Japanese Patent Publication No. 7-82027, a plurality of pattern wirings are formed on a resin film, and respective tip portions of these pattern wirings are arranged in a protruding state from the resin film to form contact pins. Technology has been proposed. In this technical example, the tip portions of a plurality of pattern wirings are used as contact pins to reduce the pitch of the multi-pins and eliminate the need for many complicated parts.
[0004]
As shown in FIG. 8, this type of contact probe 1 has a structure in which a pattern wiring 3 formed of Ni (nickel) or Ni alloy is attached to one surface of a polyimide resin film 2. The tip of the pattern wiring 3 protrudes from the end to form a contact pin 3a.
The contact probe 1 can contact the rear end side of the pattern wiring 3 with the electrode of the printed circuit board, and can transmit a signal obtained from the pattern wiring 3 to an external inspection device or the like through the electrode of the printed circuit board. Yes.
Reference numeral 4 denotes an alignment hole.
[0005]
When assembling the contact probe 1 into a probe device such as a probe card, the needle tips of dozens to thousands of contact pins are accurately positioned in three directions of X, Y, and Z directions within a fixed dimension. There is a need.
Conventionally, as shown in FIG. 9, the contact probe positioning means incorporates the contact probe 1 into a probe card 70 in a temporarily fixed state, and a mask serving as a reference while looking into the microscope 100 through the opening A of the probe card 70. The position of the contact probe 3a is aligned with the mask pattern of M, and the position of the contact probe 1 is adjusted by repeatedly adjusting in the Z (needle height) direction while observing with another microscope (not shown). It is carried out.
[0006]
[Problems to be solved by the invention]
The above-described conventional contact probe position adjustment technology still has the following problems. That is, since the contact pin 3a and the mask pattern are observed in an overlapping form, it is difficult to determine the actual contact position of the contact pin 3a, it is difficult to accurately adjust the position, and a certain level of skill is required for the operator. Was requested. Further, in order to align the mask M and the needle tip of the contact pin 3a while observing with the microscope 100, the probe card 70 requires an opening A, and a probe card having a structure without the opening A, for example, a contact It is difficult to assemble with a probe card of a type in which pins are arranged vertically. Furthermore, in order to adjust the needle tip of the contact pin 3a by XYZ, it is necessary to observe the contact pin 3a from above and below, and the work is complicated. Further, it is necessary to adjust so that the contact probe 1 and the PCB substrate can be connected simultaneously with the needle tip of the contact pin 3a, which is opposite to the case where the surface of the reference PCB substrate is viewed from the opening A of the probe card 70. When the probe card with four sides of the contact probe 1 is assembled, there is a possibility that a problem that the connection part with the PCB board does not match at the last side may occur. .
[0007]
The present invention has been made in view of the above-mentioned problems, and can easily adjust the position of the contact pin without bringing the contact pin into contact with the mask pattern, and can be positioned even with respect to a probe card or the like having no opening. An object of the present invention is to provide a position adjusting device for a contact probe which can be adjusted and assembled.
[0008]
[Means for Solving the Problems]
The present invention employs the following configuration in order to solve the above problems. That is, in the contact probe position adjusting device according to claim 1, a plurality of pattern wirings are attached to one side of the film, and the tip ends of the pattern wirings are arranged in a protruding state from the leading end portions of the film to form contact pins. When the contact probe for bringing the pattern wiring on the rear end side into contact with the electrode of the printed circuit board of the probe device is incorporated in the probe device, the position of the contact probe is adjusted, and the pattern of the window portion is adjusted. A device for adjusting the positional relationship between the wiring and the printed circuit board, the probe device holding portion holding the probe device capable of adjusting the position of the contact probe, and a reference mark serving as a reference for the position adjustment is provided on the surface a reference plate installation part of the reference plate is installed which is movably X at any position on a plane Provided in the observation optical system on the Y stage, and the contact pins of the contact probe incorporated in the probe apparatus of the probe device holding portion, and the pattern wiring and observable pin side optical system of the window, the A pattern side optical system provided in an observation optical system and capable of observing a reference mark on the reference plate; an image of the contact pin observed by the pin side optical system; and the reference mark observed by the pattern side optical system A technique is employed that includes an image display unit that superimposes and simultaneously displays the image and displays the pattern wiring of the window unit.
[0009]
This contact probe position adjustment device includes an image display unit that simultaneously displays an image of a contact pin observed by the pin side optical system and an image of a reference mark observed by the pattern side optical system. By adjusting the position of the contact probe built into the probe device while looking at the position of the contact pin and the reference mark displayed on the image display unit without actually contacting the contact pin with the reference mark Can do. Further, since the contact pin and the mask pattern are observed with separate optical systems, the position can be easily adjusted even if the probe device has no opening.
In this contact probe position adjustment device, the pin-side optical system is provided so that the connection portion can also be observed, so that the position adjustment and the position adjustment can be performed while checking the positional relationship between the connection portion and another substrate (for example, a PCB substrate). Assembly adjustment is possible, and problems such as re-adjustment and re-assembly due to misalignment at the connecting portion are solved.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a contact probe position adjusting apparatus according to the present invention will be described with reference to FIGS.
In these drawings, reference numeral 31 denotes a gantry, 32 denotes a mask stage, 33 denotes a card holder, 34 denotes an observation optical system, and 35 denotes a monitor.
[0015]
The position adjusting device according to the present embodiment is for assembling a probe card (probe device) 70, and incorporates the contact probe 1 in alignment with the mechanical part 10. As shown in FIGS. 1 to 3, this position adjusting device is configured to mount a mask table (reference plate) on which a mask (reference plate) M having a mask pattern (reference mark) P formed on the surface of a frame 31 is mounted. Plate mounting portion) 32, a card holder (probe device holding portion) 33 that is disposed above the mask mounting base 32 and holds the probe card 70, and a contact pin of the contact probe 1 held movably on the probe card 70 3a and an observation optical system 34 for observing the mask pattern P of the mask M, and a monitor (image display unit) for simultaneously displaying images of the contact pins 3a and the mask pattern P observed by the observation optical system 34 in an overlapping manner. 35 are installed.
[0016]
As shown in FIG. 3, the mask M is a position where a mask pattern P having the same pattern (the same size and the same arrangement) as an electrode pattern of an IC (electronic component) to be inspected by the contact probe 1 is formed on the surface. It is a mask substrate for adjustment.
As shown in FIG. 4, the observation optical system 34 includes a pin side optical system 36 that can observe the contact pins 3 a of the contact probe 1 movably held on the probe card 70 in the card holder 33, and a mask mount 32. A pattern side optical system 37 capable of observing the mask pattern P of the mask M above, and a CCD camera 38 for simultaneously capturing images of the contact pins 3a and the mask pattern P by these optical systems 36, 37 are provided.
[0017]
The observation optical system 34 is provided on an XY stage 39 installed on the gantry 31, and can be moved to an arbitrary position on the horizontal plane by a control unit 40 that drives and controls the XY stage 39. ing.
The pattern-side optical system 37 includes a mask observation objective lens 41 that can be disposed above the mask mounting table 32. As shown in FIG. It is supported by. That is, the mask observation objective lens 41 can be set to an arbitrary height by a moving mechanism (not shown) of the mask observation objective lens 41 provided on the lens support 42.
[0018]
On the other hand, the pin-side optical system 36 includes a pin observation objective lens 43 that can be disposed below the card holder 33. As shown in FIG. Supported as possible. That is, the pin observation objective lens 43 can be set to an arbitrary height by a moving mechanism (not shown) of the pin observation objective lens 43 provided on the lens support portion 42. Each moving mechanism of the mask observation objective lens 41 and the pin observation objective lens 43 incorporates an encoder (not shown).
[0019]
Further, the pattern side optical system 37 is set so that the image of the mask pattern P is taken into the CCD camera 38 via the mask observation objective lens 41, the mirrors 44 and 45, and the optical coupler 46. Further, the pin side optical system 36 is set so that the image of the contact pin 3 a is taken into the CCD camera 38 via the pin observation objective lens 43, mirrors 47, 48, 49 and the optical coupler 46. That is, in the CCD camera 38, the mask pattern P and the image of the contact pin 3a are simultaneously captured in a state where they overlap, and this image is displayed on the monitor 35.
[0020]
Between the mirror 44 and the mirror 45 of the pattern side optical system 37 and between the mirror 47 and the mirror 48 of the pin side optical system 36, a light source 49 for optical fiber illumination and a shutter 50 for blocking the optical path are respectively installed. By illuminating the mask pattern P and the contact pin 3 a and blocking the optical path by the shutter 50, only one image can be taken into the CCD camera 38.
[0021]
Next, a configuration in which the contact probe 1 is incorporated into the mechanical part 10 to form the probe card 11 will be described with reference to FIGS. 5, 6, and 9.
[0022]
As shown in FIG. 5, the mechanical part 10 includes a mounting base 12, a top clamp 13, and a bottom clamp 14.
First, the top clamp 13 is mounted on the printed circuit board 15, and then the mounting base 12 to which the four contact probes 1 are mounted is mounted on the top clamp 13 by screwing bolts 17 into the bolt holes 16 (see FIG. 6). ).
Then, by pressing the contact probe 1 with the bottom clamp 14, the pattern wiring 3 is kept in a certain inclination state.
[0023]
As shown in FIG. 9, the mounting base 12 is provided with positioning pins 18 for adjusting the positions of the contact probes 1. The positioning pins 18 are inserted into the alignment holes 4 of the contact probes 1. By doing so, a certain degree of alignment can be achieved. The elastic body 20 of the bottom clamp 14 is pressed against the pattern wiring (connection portion) 3 of the window portion 19 provided in the contact probe 1 so that the pattern wiring 3 of the window portion 19 is connected to the printed circuit board (PCB substrate) 15. A signal obtained from the pattern wiring 3 is brought into contact with the electrode 21 and can be transmitted to the outside through the electrode 21 of the printed board 15.
[0024]
Next, a method for incorporating the probe card 70 by adjusting the position of the contact probe 1 using the position adjusting device of the present embodiment will be described.
[0025]
First, the probe card 70 in a state where the contact probe 1 is temporarily fixed is attached to the card holder 33. Further, the mask M is placed at a predetermined position on the mask mounting table 32.
Then, the XY stage 39 is driven by the control unit 40 so that the pin observation objective lens 43 and the mask observation objective lens 41 face the contact pins 3a and the mask pattern P, respectively, and are in positions where they can be observed. Then, the observation optical system 34 is moved.
[0026]
Next, the pin observation objective lens 43 and the mask observation objective lens 41 are moved up and down by the respective movement mechanisms of the lens support portion 42 to move to the respective focal positions.
At this time, the image of the contact pin 3a is taken into the CCD camera 38 via the pin observation objective lens 43, the mirrors 47, 48, and 49 and the optical coupler 46, and the image of the mask pattern P is the pattern observation objective. The image is taken into the CCD camera 38 through the lens 41, the mirrors 44 and 45, and the optical coupler 46, and these images are superimposed and simultaneously displayed on the monitor 35.
[0027]
In this state, while confirming the positional relationship between the contact pin 3a and the mask pattern P on the monitor 35, the position adjustment of the contact probe 1 temporarily fixed so that the needle tip position of the contact pin 3a coincides with the mask pattern P. I do.
The needle tip height of the contact pin 3a can be measured from the encoder value at this time by moving the pin observation objective lens 43 up and down to focus on the needle tip. I do.
[0028]
In addition to the adjustment of the needle tip position of the contact pin 3a, the position adjustment of the pattern wiring 3 and the printed board 15 in the window portion 19 is also performed as appropriate.
First, the pin observation objective lens 43 is moved by the XY stage 39 to a position where the pattern wiring 3 of the window 19 can be observed, and the pattern of the window 19 is closed by closing the shutter 50 on the pattern side optical system 37 side. Only the image of the wiring 3 is taken into the CCD camera 38.
[0029]
In this state, while observing the pattern wirings 3 of the window portion 19 on the monitor 35, it adjusts the position.
After adjusting the position of these, by the contact probe 1 which has been temporarily fixed fixing the probe card 70, assembly is completed.
[0030]
Thus, in this embodiment, the image of the contact pin 3a observed by the pin side optical system 36 and the image of the mask pattern P observed by the pattern side optical system 37 are superimposed and simultaneously displayed on the monitor 35. The contact probe of the probe card 70 is arranged so that the contact pins 3a overlap each other on the monitor 35 while observing the positions of the contact pins 3a and the mask pattern P displayed on the monitor 35 without actually contacting the contact pins 3a with the mask pattern P. If the position of 1 is adjusted, the position of the contact pin 3a can be easily adjusted.
Further, since the pin side optical system 36 is provided so as to be movable to a position where the pattern wiring 3 of the window portion 19 can also be observed, the positional relationship between the pattern wiring 3 of the window portion 19 and the printed board 15 is also confirmed. Position adjustment becomes possible, and re-adjustment, re-assembly, etc. can be reduced.
[0031]
The present invention includes the following embodiments.
(1) The probe card 70 in the above embodiment has a cantilever shape in which the opening A is formed at the center and the contact pin 3a extends obliquely downward. As shown in FIG. 7, the present invention may be applied to the assembly of a probe card (probe device) 80 in which a plurality of contact probes 1 are arranged so as to be substantially vertical.
[0032]
That is, in the probe card 80, a plurality of contact probes 1 are arranged so as to be substantially perpendicular to the electrode surface of an object to be measured such as an IC chip, and ceramics or the like is provided between the surfaces of the resin film 2. These are arranged side by side through a spacer 2e made of a non-conductive material. The probe card 80 is configured such that the pattern wiring 3 of the contact probe 1 is connected to one end of a flexible substrate (FPC) 9 and the other end of the flexible substrate 9 is connected to the printed circuit board 20.
Therefore, according to the position adjusting device, since the contact pin and the mask pattern are observed and displayed with separate optical systems, even if the probe card 80 has no opening at the center, contact can be easily made. The pins can be assembled and adjusted.
[0033]
(2) In the above embodiment, the probe card for IC measurement is assembled as the probe device, but it may be adopted for assembling other probe devices. For example, the IC chip may be held and protected on the inside, and applied to an IC chip test socket or the like mounted on an IC chip burn-in test apparatus or the like. Further, the present invention may be applied to an LCD test probe device.
[0034]
【The invention's effect】
According to the contact probe position adjusting device of the present invention, the image display unit that simultaneously displays the image of the contact pin observed by the pin side optical system and the image of the reference mark observed by the pattern side optical system. Because it is equipped, the position of the contact probe in the probe device can be adjusted easily and accurately while adjusting the position of the contact probe while looking at the image display section without actually contacting the contact pin with the reference mark. Since the contact pin and the mask pattern are observed with separate optical systems, the position can be easily adjusted even if the probe device has no opening, and the assembly workability of various probe devices can be improved.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of a contact probe position adjusting device according to the present invention.
FIG. 2 is a side view showing an embodiment of a contact probe position adjusting device according to the present invention.
FIG. 3 is a plan view showing a mask pattern in an embodiment of a contact probe position adjusting apparatus according to the present invention.
FIG. 4 is a layout view showing a configuration of an observation optical system in an embodiment of a contact probe position adjusting apparatus according to the present invention.
FIG. 5 is an exploded perspective view showing an example of a probe card incorporating a contact probe in one embodiment of the contact probe position adjusting apparatus according to the present invention.
FIG. 6 is a perspective view of a principal part showing an example of a probe card incorporating a contact probe in one embodiment of a contact probe position adjusting apparatus according to the present invention.
FIGS. 7A and 7B are a plan view and a cross-sectional view showing another example of a probe card incorporating a contact probe in an embodiment of a contact probe position adjusting apparatus according to the present invention. FIGS.
FIG. 8 is a perspective view showing a main part of a contact probe according to the present invention.
FIG. 9 is a cross-sectional layout diagram illustrating a positional relationship for explaining position adjusting means when a contact probe is incorporated in a probe card in a conventional example of a contact probe position adjusting device according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Contact probe 2 Resin film 3 Pattern wiring 3a Contact pin 15 Printed circuit board 32 Mask mounting (reference | standard board installation part)
33 Card holder (Probe device holder)
35 Monitor (image display part)
36 pin side optical system 37 pattern side optical system 70, 80 Probe card (probe device)
M mask (reference plate)
P mask pattern

Claims (1)

A plurality of pattern wirings are attached to one side of the film, and the leading ends of the pattern wirings are arranged in a protruding state from the leading end portions of the films to form contact pins. A device for adjusting the position of the contact probe and adjusting the positional relationship between the pattern wiring of the window and the printed board when a contact probe to be brought into contact with an electrode of the board is incorporated in the probe device. ,
A probe device holding portion for holding the probe device in which the position of the contact probe is adjustable;
A reference plate installation portion on which a reference plate provided with a reference mark serving as a reference for the position adjustment is provided on the surface;
A contact pin of the contact probe provided in an observation optical system on an XY stage movably to an arbitrary position on a plane and incorporated in the probe device of the probe device holding portion, and the pattern wiring of the window portion A pin side optical system capable of observing
A pattern-side optical system provided in the observation optical system and capable of observing a reference mark of the reference plate;
The image of the contact pin observed by the pin side optical system and the image of the reference mark observed by the pattern side optical system are displayed simultaneously and superimposed, and the pattern wiring of the window is displayed. An apparatus for adjusting the position of a contact probe, comprising: an image display unit.

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