JP4254383B2 - Chip-type electronic component storage mount - Google Patents
Chip-type electronic component storage mount Download PDFInfo
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- JP4254383B2 JP4254383B2 JP2003191845A JP2003191845A JP4254383B2 JP 4254383 B2 JP4254383 B2 JP 4254383B2 JP 2003191845 A JP2003191845 A JP 2003191845A JP 2003191845 A JP2003191845 A JP 2003191845A JP 4254383 B2 JP4254383 B2 JP 4254383B2
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- 238000003860 storage Methods 0.000 title claims description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 238000010521 absorption reaction Methods 0.000 claims description 20
- 238000004513 sizing Methods 0.000 claims description 20
- 238000007654 immersion Methods 0.000 claims description 7
- 239000012153 distilled water Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 16
- 238000007789 sealing Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 5
- 235000011613 Pinus brutia Nutrition 0.000 description 5
- 241000018646 Pinus brutia Species 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- -1 alkyl ketene dimer Chemical compound 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010893 paper waste Substances 0.000 description 4
- 239000013055 pulp slurry Substances 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 229920001131 Pulp (paper) Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229920006319 cationized starch Polymers 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
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- Packaging Frangible Articles (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明はチップ型電子部品収納台紙に関するものであり、さらに詳しくは高温・多湿といった過酷な環境条件においても走行不良を起こす事なく良好に使用できるチップ型電子部品収納台紙に関するものである。
【０００２】
【従来の技術】
チップ型電子部品収納台紙は、通常次のように加工処理をして、チップ型電子部品のキャリアとして使用される。
▲１▼所定の幅にスリットする。
▲２▼所定大きさの角穴と丸穴を開ける。角穴はチップ型電子部品収納用で、丸穴は充填機内送り用である。
▲３▼台紙の裏面にボトムテープを接着する。なお、角穴を開けないで、所定の大きさの角状エンボンス加工をすることもあり、この場合、この工程は省かれる。なお、台紙とカバーテープを接着する方法は、台紙とカバーテープを重ね、カバーテープ上から熱と圧力を加えて接着する所謂ヒートシール法で行われる。
▲４▼チップ型電子部品を充填する。
▲５▼台紙の表面(トップ側)にカバーテープを接着する。
▲６▼所定の大きさのカセットリールに巻き付け、チップ型電子部品と共に出荷する。
▲７▼最終ユーザーでトップ側カバーテープを剥がし、チップ型電子部品を取り出す。
【０００３】
以上のように使用されることから、台紙の重要品質項目として、カバーテープとの接着性が良好なことが挙げられていた。
例えば特開平７−１３７７６７号公報(特許文献１)ではカーバーテープと接触する表面の表面粗さ（Ｒｍａｘ）を特定値以下にすることでカバーテープの接着性向上を図っている。また、特開平３−２１２３８７号公報(特許文献２)では特定の樹脂層を表面に設け、接着性の向上を図っている。しかしながらそれだけでは十分な特性を維持できないのが現状である。
【０００４】
チップ型電子部品収納台紙にチップ型電子部品を収納する場合、収納台紙が収納台紙メーカーから電子部品メーカーに輸送され、部品が収納台紙に収納される。この台紙の輸送から部品の収納までの使用環境は必ずしも一定ではなく、特に高温、高湿の環境で使用された場合、チップ型電子部品収納台紙が収納機内で台紙が環境中の水分を吸収し、トップとボトムの両テープをヒートシールする際の熱で台紙中の水分が水蒸気となり、結露水が発生、その結露水をエッジ部より吸収し、エッジ部が膨れ紙厚みが増加し、ガイド部に引っかかり、走行に支障をきたす問題が起こっていた。特に、収納機の運転を一時的に停止し、再び運転を再開する時に発生し易い傾向があり、チップ型電子部品収納台紙を高温、高湿の環境下で使用する場合の最も重大な問題となっていた。
【０００５】
【特許文献１】
特開平７−１３７７６７号公報
【特許文献２】
特開平３−２１２３８７号公報
【０００６】
【発明が解決しようとする課題】
本発明はチップ型電子部品収納台紙が過酷な条件、特に高温、高湿な条件で保管された後で使用されても、走行不良を起こす事なく良好に使用できるチップ型電子部品収納台紙を提供することにある。
【０００７】
【課題を解決するための手段】
本発明は以下の発明を包含する。
(１)チップ型電子部品を収納する紙製収納台紙において、表裏面、横方向断面からの吸水がないようにし、２０℃の蒸留水に３０秒浸漬して、下記式により算出される抄紙機流れ方向断面の吸水度（Ｍ）が３００ｇ／ｍ2以下であるチップ型電子部品収納台紙。
式：Ｍ＝（Ｗ２−Ｗ１）×１０００/Ｔ
[上記式中、Ｗ1：浸漬前の試料５枚の合計重量（ｇ）、Ｗ2：浸漬後の試料５枚の合計重量（ｇ）、Ｔ：試料の厚さ（ｍｍ）を表す。]
【０００８】
（２）内添サイズ剤をパルプに対して０．５〜１．０質量％配合している（１）記載のチップ型電子部品収納台紙。
【０００９】
【発明の実施の形態】
本発明者らは、従来技術の紙製のチップ型電子部品収納台紙が高温、高湿で使用された場合に、チップ型電子部品の収納機において走行不良を起こす問題について、紙製収納台紙の形状変化と走行性について検討した結果、吸水により厚さ膨張率が３０％以上になると走行不良を起こすことがら、収納台紙の断面吸水度を３００ｇ／ｍ2以下にすることによって、問題を解決し、発明を完成させた。断面吸水度とは収納台紙の抄紙機流れ方向の断面以外の面を非吸水性フィルムで包み３０秒間水中に浸漬させた時の、抄紙機流れ方向の断面のみの吸水量を収納台紙の厚さと長さから換算した断面単位面積当たりの吸水量である。
【００１０】
本発明者らは従来技術のチップ型電子部品収納台紙を高温、高湿の環境下で使用した場合の問題点を解析した結果、次のような結論に達した。即ち、高温、高湿の環境下では、紙製のチップ型電子部品収納台紙は吸湿してしまい、吸湿した収納台紙はチップ型電子部品の収納機において、裏面にボトムテープをヒートシールされ、チップ型電子部品が収納された後、表面にカバーテープがヒートシールされるが、これらのヒートシールの際に収納台紙にも熱が加わり、その結果、吸湿されていた水分が収納台紙外に水蒸気として放出される。放出された水蒸気は収納機内で冷却され結露し、水滴となる。このようなメカニズムで発生する水滴は、収納台紙が走行する部分にも発生するので、収納台紙がその水滴を吸って膨らみ、厚さが異常に増大し、収納機の走行に支障をきたすのである。
【００１１】
本発明者らは前述のような解析に基づき、この問題を解決すべく方法を検討した結果、収納台紙の断面吸水度を特定の値以下となるようにすれば、高温、高湿の環境下でもチップ型電子部品の収納機で問題なく使用できることを発見し、本発明を完成することに至った。
【００１２】
本発明は断面吸水度を３００ｇ／ｍ2以下にする。３００ｇ／ｍ2にすることにより結露水のエッジ部からの吸収が抑制され、紙厚さ変化が３０％以上にならないため走行不良が改善される、２０ｇ／ｍ2未満に使用とした場合には耐水化剤などの薬品処理が必要となり、製造工程での系内の汚れが考えられるほかリサイクルが不可能となるため好ましくない。
【００１３】
本発明において、断面吸水度を３００ｇ／ｍ2以下にして、吸水による厚さ膨張率が３０％以下にする手段としては、製紙用の内添サイズ剤をパルプに対して０．５〜１．０質量％配合することが好ましい。紙製収納出台紙は１層抄きのものもあるが坪量が大きいため多層抄きのものが多い。最外層にサイズ剤を添加しただけで十分でない場合には中層に内添サイズ剤を添加することにより側面からの吸水が押えられるため好ましい。内添サイズ剤の配合量が０．５質量％未満であると、サイズ剤の効果が得られず、断面吸水度が３００ｇ／ｍ2以上になり、本発明の効果が得られ難い。また内添サイズ剤の配合量が１．０質量％を越えると内添サイズ剤の効果が頭打ちになり、不経済となるばかりでなく、過剰の内添サイズ剤により抄紙機を汚してしまう可能性があるため好ましくない。
【００１４】
本発明で使用される内添サイズ剤は、ロジン系サイズ剤、スチレン・マレイン酸、アルキルケテンダイマー、アルケニル無水コハク酸など、天然および合成の製紙用の内添サイズ剤が使用できる。
【００１５】
本発明で使用される原料パルプは各種のものが使用でき、例えば、化学パルプ、機械パルプ、古紙パルプ、非木材繊維パルプ、合成パルプ等がある。これらのパルプは単独でも、二種以上混合使用しても良い。
【００１６】
本発明では、断面吸水度が３００ｇ／ｍ2以下にすることに効果があるものであれば、サイズ剤以外にも必要に応じて種々の薬品を使用できる。例えば、各種紙力増強剤、濾水歩留り向上剤、ポリアミドポリアミンエピクロルヒドリン等の耐水化剤、消泡剤、タルク等の填料、染料等を使用することができる。但し、収納する電子部品に影響を与える
【００１７】
また、ボトムテープ、カバーテープとの接着性を向上させるために収納台紙の表面、裏面に必要な薬品を塗布させることも可能である。さらに塗布手段についても、例えばバーコーター、ブレードコーター、エアーナイフコーター、ロッドコーター、ゲートロールコーターやサイズプレスやキャレンダーコーター等のロールコーター、ビルブレードコーター、ベルバパコーター等がある。
【００１８】
本発明のチップ型電子部品収納台紙の坪量は、中に収納するチップ型電子部品の大きさにより決ってくるが、一般に３００〜１０００ｇ／ｍ２程度である。このような坪量範囲であるため、単層では地合いの調整が難しいため、多層抄きで抄造される。
【００１９】
【実施例】
以下に実施例により本発明を詳細に説明するが、本発明はこれに限定されるものではない。配合、濃度等を示す数値は、固型分または有効成分の質量基準の数値である。また、特に記載の無い場合については抄造した紙はＪＩＳ Ｐ８１１１に準じて前処理を行った後、測定やテストに供した。尚、断面吸水度測定、収納機テストの条件の詳細は下記の通りである。
【００２０】
断面吸水度測定
試料の抄紙機流れ方向を縦、流れ方向と直角の方向を横とし、縦１０ｃｍ、横５ｃｍの試料を採取する。試料の表裏両面と横方向の断面に非吸水性フィルム粘着テープ（３Ｍ社製スコッチテープ＃５）を貼り付け、水中に浸漬しても表裏面、横方向断面からの吸水が無いようにする。縦方向の断面は再度、鋭利なナイフで５ｍｍずつ切り落とし、試料の大きさを縦１０ｃｍ、横４ｃｍにする。この鋭利なナイフで切り落とす際は断面を破壊しないように注意する。この試料を５枚作成し、５枚の合計重量（Ｗ１ｇ）を測定する。次に２０℃の蒸留水に３０秒間浸漬し、浸漬後直ちにロ紙で表裏の非吸水性フィルム粘着テープ表面の水滴を除去し、再度５枚の合計重量（Ｗ２ｇ）を測定する。浸漬前後の重量差（Ｗ２−Ｗ１）が抄紙機流れ方向断面の吸水量となるが、試料断面の長さ（１ｍ）と厚さ（Ｔｍｍ）から、次の式により単位面積当たりの断面吸水度（Ｍ ｇ／ｍ2）が算出される。
Ｍ＝（Ｗ２−Ｗ１）×１０００／Ｔ
【００２１】
厚さ膨張率測定
試料の抄紙機流れ方向を縦、流れ方向と直角の方向を横とし、縦１０ｃｍ、横８ｍｍの試料を採取する。採取した試料の厚さをＪＩＳ Ｐ に準拠し測定し、その値をＴ１とする。次に試料を２３℃の純水に３０秒間浸漬し、浸漬直後の厚さを測定しＴ２とする。Ｔ１とＴ２から次の式により厚さ膨張率Ｓ（％）を算出する。
Ｓ（％）＝（Ｔ２−Ｔ１）／Ｔ１
【００２２】
収納機テスト
試料を８ｍｍ幅にスリットし、芯の直径が６ｃｍのリールに１００ｍ巻き付ける。そのリールを３０℃８５％ＲＨの環境に２４時間放置し、２３℃５５％ＲＨの環境下でボトムテープのヒートシールを行う。ヒートシール機として東京ウェルズ（株）製の「ＴＷＡ６６００」機、ボトムテープとして日本マタイ（株）製のボトムテープ「チップボトムテープ ＳＰタイプ」を使用する。ヒートシール温度１５０℃で試料８０ｍを連続でヒートシールし、５分間停止後再びヒートシール操作を開始する。ヒートシール操作が支障なく開始された場合を○、ヒートシール操作の開始時に試料がひっかかり走行がやや不安定になった場合を△、ヒートシール操作の開始時に試料がひっかかり走行しなくなった場合を×と判定した。
【００２３】
実施例１
表層、中層、裏層でパルプを使い分け、表層用にはＮＢＫＰ３０％、ＬＢＫＰ７０％を混合叩解し、ＣＳＦ（カナディアンスタンダードフリーネス）４００ｍｌに調製し、中層用にはＮＢＫＰ２０％、ＬＢＫＰ２０％、上質古紙２０％、新聞古紙４０％の配合でＣＳＦ３５０ｍｌに調製し、裏層用にはＮＢＫＰ２５％、ＬＢＫＰ２５％、新聞古紙５０％の配合でＣＳＦ４００ｍｌに調製した。それぞれのパルプスラリーにロジン系サイズ剤（サイズパインＮ−１１１：荒川化学工業製）をパルプ質量に対して０．７質量％添加し、硫酸バンドを添加してＰＨ６．０に調整し、内添紙力増強剤としてポリアクリルアミドを０．３％添加した。以上の条件のパルプスラリーを円網３層抄合わせ抄造機でそれぞれ表層１００ｇ／ｍ2、中層２００ｇ／ｍ2、裏層５０ｇ／ｍ2で抄合わせ、抄紙機に設置された平滑化処理機（マシンカレンダー）で平滑化処理し、坪量３５０g/ｍ2、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２４】
実施例２
表層、中層、裏層でパルプを使い分け、表層用にはＮＢＫＰ３０％、ＬＢＫＰ７０％を混合叩解し、ＣＳＦを４００ｍｌに調製し、中層用にはＮＢＫＰ２０％、ＬＢＫＰ２０％、上質古紙２０％、新聞古紙４０％の配合でＣＳＦ３５０ｍｌに調製し、裏層用にはＮＢＫＰ２５％、ＬＢＫＰ２５％、新聞古紙５０％の配合でＣＳＦ４００ｍｌに調製した。それぞれのパルプスラリーにアルキルケテンダイマーサイズ剤（サイズパインＫ−２８７：荒川化学製）をパルプ質量に対して０．６質量％添加し、カチオン化デンプン（Ｃａｔｏ−Ｆ：王子ナショナルスターチ製）をパルプ質量に対して０．８質量％添加した。以上の条件のパルプスラリーを円網３層抄合わせ抄造機でそれぞれ表層１００ｇ／ｍ2、中層２００ｇ／ｍ2、裏層５０ｇ／ｍ2で抄き合わせ、坪量３５０ｇ／ｍ2の原紙を抄造し、平滑化処理機（マシンカレンダー）で平滑化処理し、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２５】
実施例３
ロジン系サイズ剤（サイズパインＮ−７７５：荒川化学工業製）の添加量をパルプ質量に対して０．９質量％にした以外は実施例１と同様にして坪量３５０ｇ／ｍ2、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２６】
実施例４
アルキルケテンダイマーサイズ剤（サイズパインＫ−２８７：荒川化学工業製）の添加量をパルプ質量に対して１．０質量％にして、カチオン化デンプン（Ｃａｔｏ−Ｆ：王子ナショナルスターチ製）の添加量をパルプ質量に対して１．０質量％にした以外は実施例２と同様にして坪量３５０ｇ／ｍ2、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２７】
比較例１
サイズ剤を添加しない以外は実施例１と同様にして坪量３５０ｇ／ｍ2、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２８】
比較例２
ロジン系サイズ剤（サイズパインＮ−１１１：荒川化学工業製）の添加量をパルプ質量に対して０．４質量％にした以外は実施例１と同様にして坪量３５０ｇ／ｍ2、厚さ０．４２ｍｍのチップ型電子部品収納台紙を製造した。
【００２９】
【表１】
【発明の効果】
実施例１〜４、比較例１、２の断面吸水度、収納機テスト、および製造時の抄紙用具の汚れ状況を表１に示した。本発明の実施例１〜３は収納機テストによる走行不良が無く、抄紙用具の汚れも発生しなかった。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type electronic component storage mount, and more particularly to a chip-type electronic component storage mount that can be used satisfactorily without causing poor running even under severe environmental conditions such as high temperature and high humidity.
[0002]
[Prior art]
The chip-type electronic component storage board is usually processed as follows and used as a carrier for the chip-type electronic component.
(1) Slit to a predetermined width.
(2) Open a square hole and a round hole of a predetermined size. The square hole is for storing chip-type electronic components, and the round hole is for feeding into the filling machine.
(3) Adhere the bottom tape to the back of the mount. In addition, square embossing of a predetermined size may be performed without making a square hole, and in this case, this step is omitted. The method of bonding the mount and the cover tape is performed by a so-called heat sealing method in which the mount and the cover tape are overlapped and bonded by applying heat and pressure from the cover tape.
(4) Fill with chip-type electronic components.
(5) Adhere cover tape to the surface (top side) of the mount.
(6) It is wound around a cassette reel of a predetermined size and shipped with a chip-type electronic component.
(7) The end user peels off the top cover tape and removes the chip-type electronic component.
[0003]
Since it is used as described above, an excellent quality item for the mount has been described as having good adhesion to the cover tape.
For example, in JP-A-7-137767 (Patent Document 1), the surface roughness (Rmax) of the surface in contact with the carver tape is set to a specific value or less to improve the adhesiveness of the cover tape. JP-A-3-212387 (Patent Document 2) provides a specific resin layer on the surface to improve adhesion. However, at present, it is not possible to maintain sufficient characteristics by itself.
[0004]
When the chip-type electronic component is stored in the chip-type electronic component storage mount, the storage mount is transported from the storage mount manufacturer to the electronic component manufacturer, and the component is stored in the storage mount. The usage environment from transportation of this mount to storage of parts is not always constant, especially when used in a high temperature and high humidity environment, the chip-type electronic component storage mount absorbs moisture in the environment. The heat in the top and bottom tapes heat seals the moisture in the mount into water vapor, generating condensed water, absorbing the condensed water from the edge part, the edge part swells and the paper thickness increases, the guide part There was a problem that caused me to get stuck in the car. In particular, it tends to occur when the operation of the storage device is temporarily stopped and restarted, and this is the most serious problem when using the chip-type electronic component storage board in a high-temperature and high-humidity environment. It was.
[0005]
[Patent Document 1]
JP-A-7-137767 [Patent Document 2]
Japanese Patent Laid-Open No. 3-212387 [0006]
[Problems to be solved by the invention]
The present invention provides a chip-type electronic component storage mount that can be used satisfactorily without causing poor running even when the chip-type electronic component storage mount is used after being stored under severe conditions, particularly high temperature and high humidity. There is to do.
[0007]
[Means for Solving the Problems]
The present invention includes the following inventions.
(1) In a paper storage board for storing chip-type electronic components, make water absorption from the front and back surfaces and the cross section in the lateral direction, immerse in distilled water at 20 ° C. for 30 seconds, and calculate by the following formula A chip-type electronic component storage board having a water absorption (M) of 300 g / m 2 or less in the cross section in the flow direction.
Formula: M = (W 2 −W 1 ) × 1000 / T
[W 1 represents the total weight (g) of five samples before immersion, W 2 represents the total weight (g) of five samples after immersion, and T represents the thickness (mm) of the sample. ]
[0008]
(2) The chip-type electronic component storage board according to (1), wherein 0.5 to 1.0% by mass of an internally added sizing agent is blended with respect to the pulp.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
When the paper chip type electronic component storage board of the prior art is used at a high temperature and high humidity, the present inventors are concerned with the problem of causing poor running in the chip type electronic component storage machine. As a result of examining the shape change and the running property, the problem is solved by reducing the cross-section water absorption of the storage mount to 300 g / m 2 or less while causing a poor running when the thickness expansion coefficient is 30% or more due to water absorption. , Completed the invention. The cross section water absorption is the thickness of the storage board when the surface of the storage board other than the cross section in the machine direction is wrapped with a non-water absorbent film and immersed in water for 30 seconds. It is the amount of water absorption per unit area of the cross-section converted from the length.
[0010]
As a result of analyzing the problems when the chip-type electronic component storage board of the prior art is used in a high temperature and high humidity environment, the present inventors have reached the following conclusion. That is, in a high-temperature and high-humidity environment, the paper-made chip-type electronic component storage board absorbs moisture, and the moisture-absorbing storage board is heat-sealed with a bottom tape on the back surface in the chip-type electronic component storage machine. After the mold electronic parts are stored, the cover tape is heat-sealed on the surface. During these heat seals, heat is also applied to the storage board, and as a result, the absorbed moisture is removed as water vapor outside the storage board. Released. The discharged water vapor is cooled and condensed in the storage device to form water droplets. Water droplets generated by such a mechanism also occur in the portion where the storage mount travels, so that the storage mount sucks the water droplets and swells, the thickness increases abnormally, which hinders the travel of the storage device. .
[0011]
As a result of examining the method for solving this problem based on the analysis as described above, the present inventors have determined that the cross section water absorption of the storage board is not more than a specific value. However, it was discovered that it can be used without problems in a chip-type electronic component storage machine, and the present invention has been completed.
[0012]
In the present invention, the cross-section water absorption is set to 300 g / m 2 or less. Absorption from the edge portion of the condensed water by the 300 g / m 2 is suppressed, the sheet thickness variation is improved traveling defective for not more than 30% in the case of the use in less than 20 g / m 2 is It is not preferable because chemical treatment such as a water-proofing agent is necessary, and contamination in the system in the manufacturing process is considered and recycling is impossible.
[0013]
In the present invention, as means for setting the cross-section water absorption to 300 g / m 2 or less and the thickness expansion coefficient due to water absorption to 30% or less, an internal sizing agent for papermaking is 0.5 to 1. It is preferable to add 0% by mass. Although some paper storage boards are made with a single layer, many are made with multiple layers because of the large basis weight. If it is not sufficient to add a sizing agent to the outermost layer, it is preferable to add an internal sizing agent to the middle layer because water absorption from the side surface is suppressed. When the blending amount of the internally added sizing agent is less than 0.5% by mass, the effect of the sizing agent cannot be obtained, the cross-section water absorption is 300 g / m 2 or more, and the effect of the present invention is hardly obtained. If the amount of the internal sizing agent exceeds 1.0% by mass, the effect of the internal sizing agent reaches its peak, which is not economical, and the paper machine may be soiled by excessive internal sizing agent. It is not preferable because of its properties.
[0014]
As the internal sizing agent used in the present invention, natural and synthetic paper sizing agents such as rosin sizing agent, styrene / maleic acid, alkyl ketene dimer, and alkenyl succinic anhydride can be used.
[0015]
Various types of raw material pulp can be used in the present invention, such as chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, and synthetic pulp. These pulps may be used alone or in combination of two or more.
[0016]
In the present invention, various chemicals can be used as required in addition to the sizing agent, as long as the cross-section water absorption is effective to make it 300 g / m 2 or less. For example, various paper strength enhancers, drainage retention improvers, waterproofing agents such as polyamide polyamine epichlorohydrin, antifoaming agents, fillers such as talc, dyes and the like can be used. However, it affects the electronic components to be stored. [0017]
In addition, it is possible to apply necessary chemicals to the front and back surfaces of the storage board in order to improve the adhesion to the bottom tape and the cover tape. Further, for example, there are a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a roll coater such as a size press and a calendar coater, a bill blade coater, and a bellbapa coater.
[0018]
The basis weight of the chip-type electronic component storage board of the present invention is determined by the size of the chip-type electronic component stored therein, but is generally about 300 to 1000 g / m 2 . Since it is in such a basis weight range, it is difficult to adjust the texture with a single layer, and therefore, it is made by multilayer paper making.
[0019]
【Example】
The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Numerical values indicating the composition, concentration, etc. are numerical values based on the mass of the solid component or active ingredient. Unless otherwise specified, the paper made was subjected to pretreatment according to JIS P8111 and then subjected to measurements and tests. The details of the conditions of the cross-section water absorption measurement and storage machine test are as follows.
[0020]
A sample of a 10 cm long and 5 cm wide sample is taken with the paper machine flow direction of the cross section water absorption measurement sample being vertical and the direction perpendicular to the flow direction being horizontal. A non-water-absorbing film adhesive tape (3M Scotch Tape # 5) is applied to both the front and back surfaces of the sample and the cross section in the horizontal direction so that water absorption from the front and back surfaces and the horizontal cross section does not occur even when immersed in water. The vertical cross section is again cut off by 5 mm with a sharp knife so that the sample size is 10 cm long and 4 cm wide. Be careful not to break the section when cutting with this sharp knife. Five samples are prepared and the total weight (W1g) of the five samples is measured. Next, it is immersed in distilled water at 20 ° C. for 30 seconds. Immediately after the immersion, water drops on the surface of the non-water-absorbent film adhesive tape on the front and back surfaces are removed with paper, and the total weight (W2g) of the five sheets is measured again. The difference in weight before and after immersion (W2-W1) is the amount of water absorption in the cross section of the paper machine in the flow direction. From the length (1 m) and thickness (Tmm) of the sample cross section, (M g / m 2 ) is calculated.
M = (W2-W1) × 1000 / T
[0021]
A sample of 10 cm in length and 8 mm in width is collected with the direction of flow of the paper machine of the sample for measuring the expansion coefficient of thickness being vertical and the direction perpendicular to the flow direction being horizontal. The thickness of the collected sample is measured according to JIS P, and the value is T1. Next, the sample is immersed in pure water at 23 ° C. for 30 seconds, and the thickness immediately after the immersion is measured to obtain T2. The thickness expansion coefficient S (%) is calculated from T1 and T2 by the following formula.
S (%) = (T2−T1) / T1
[0022]
The storage machine test sample is slit to a width of 8 mm and wound about 100 m on a reel having a core diameter of 6 cm. The reel is left in an environment of 30 ° C. and 85% RH for 24 hours, and heat sealing of the bottom tape is performed in an environment of 23 ° C. and 55% RH. A “TWA6600” machine manufactured by Tokyo Wells Co., Ltd. is used as the heat sealing machine, and a bottom tape “Chip Bottom Tape SP type” manufactured by Nippon Matai Co., Ltd. is used as the bottom tape. The sample 80m was continuously heat-sealed at a heat-sealing temperature of 150 ° C, stopped for 5 minutes, and then the heat-sealing operation was started again. ○ when the heat sealing operation is started without any problem, △ when the sample gets caught at the start of the heat sealing operation and running is slightly unstable, △ when the sample gets stuck at the start of the heat sealing operation and × It was determined.
[0023]
Example 1
Pulp is used properly for the surface layer, middle layer, and back layer, NBKP 30% and LBKP 70% are mixed and beaten for the surface layer, and prepared to 400 ml of CSF (Canadian Standard Freeness), NBKP 20%, LBKP 20%, high-quality waste paper 20% In addition, it was prepared to 350 ml of CSF with a composition of 40% of used newspaper, and 400 ml of CSF was prepared with 25% of NBKP, 25% of LBKP, and 50% of used paper for the back layer. To each pulp slurry, 0.7% by mass of rosin sizing agent (size pine N-111: manufactured by Arakawa Chemical Industries) is added to the pulp mass, and a sulfuric acid band is added to adjust the pH to 6.0. As a paper strength enhancer, 0.3% of polyacrylamide was added. The pulp slurry of the above conditions was combined with a circular three-layer paper making machine at a surface layer of 100 g / m 2 , an intermediate layer of 200 g / m 2 , and a back layer of 50 g / m 2 , and a smoothing machine installed in the paper machine ( Machine chip) to produce a chip-type electronic component storage board having a basis weight of 350 g / m 2 and a thickness of 0.42 mm.
[0024]
Example 2
Pulp is properly used for the surface layer, middle layer and back layer, NBKP 30% and LBKP 70% are mixed and beaten for the surface layer, CSF is prepared to 400 ml, NBKP 20%, LBKP 20%, high-quality waste paper 20%, newspaper waste paper 40 for the middle layer CSF was 350 ml with a composition of%, and for the back layer, it was prepared with 400 ml of CSF with a composition of NBKP 25%, LBKP 25%, and used newspaper 50%. Alkyl ketene dimer sizing agent (size pine K-287: manufactured by Arakawa Chemical Co., Ltd.) is added to each pulp slurry in an amount of 0.6% by mass, and cationized starch (Cato-F: manufactured by Oji National Starch) is added to the pulp. 0.8 mass% was added with respect to the mass. These conditions each pulp slurry in round net 3 layer Extract alignment papermaking machine surface 100 g / m 2, the middle layer 200 g / m 2, the combined paper making in the backing layer 50 g / m 2, papermaking raw paper having a basis weight of 350 g / m 2 Then, it was smoothed by a smoothing machine (machine calendar) to produce a chip-type electronic component storage board having a thickness of 0.42 mm.
[0025]
Example 3
Basis weight 350 g / m 2 , thickness as in Example 1 except that the amount of rosin sizing agent (size pine N-775: manufactured by Arakawa Chemical Industries) was 0.9 mass% with respect to the pulp mass. A 0.42 mm chip-type electronic component storage board was manufactured.
[0026]
Example 4
Addition amount of alkyl ketene dimer sizing agent (size pine K-287: manufactured by Arakawa Chemical Industry Co., Ltd.) to 1.0 mass% with respect to pulp mass, and addition amount of cationized starch (Cato-F: manufactured by Oji National Starch) A chip-type electronic component storage board having a basis weight of 350 g / m 2 and a thickness of 0.42 mm was produced in the same manner as in Example 2 except that the content of the base material was 1.0% by mass with respect to the pulp mass.
[0027]
Comparative Example 1
A chip-type electronic component storage board having a basis weight of 350 g / m 2 and a thickness of 0.42 mm was produced in the same manner as in Example 1 except that the sizing agent was not added.
[0028]
Comparative Example 2
Basis weight 350 g / m 2 , thickness as in Example 1 except that the amount of rosin sizing agent (size pine N-111: manufactured by Arakawa Chemical Industries) was 0.4 mass% with respect to the pulp mass. A 0.42 mm chip-type electronic component storage board was manufactured.
[0029]
[Table 1]
【The invention's effect】
Table 1 shows the cross-sectional water absorbency of Examples 1 to 4 and Comparative Examples 1 and 2, storage machine tests, and the state of soiling of the papermaking tool during production. In Examples 1 to 3 of the present invention, there was no running failure due to the storage machine test, and the papermaking tool was not soiled.
Claims (2)
式：Ｍ＝（Ｗ２−Ｗ１）×１０００/Ｔ
[上記式中Ｗ1：浸漬前の試料５枚の合計重量（ｇ）、Ｗ2：浸漬後の試料５枚の合計重量（ｇ）、Ｔ：試料の厚さ（ｍｍ）を表す。]In a paper storage board for storing chip-type electronic components, make sure that there is no water absorption from the front and back surfaces and the cross section in the lateral direction, soak in distilled water at 20 ° C for 30 seconds, and calculate the cross section in the machine direction in the paper machine. The chip-type electronic component storage board is characterized by having a water absorption (M) of 300 g / m 2 or less.
Formula: M = (W 2 −W 1 ) × 1000 / T
[W 1 represents the total weight (g) of five samples before immersion, W 2 represents the total weight (g) of five samples after immersion, and T represents the thickness (mm) of the sample. ]
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