JP4252565B2 - Semiconductor device - Google Patents

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JP4252565B2
JP4252565B2 JP2005224180A JP2005224180A JP4252565B2 JP 4252565 B2 JP4252565 B2 JP 4252565B2 JP 2005224180 A JP2005224180 A JP 2005224180A JP 2005224180 A JP2005224180 A JP 2005224180A JP 4252565 B2 JP4252565 B2 JP 4252565B2
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薫 宮越
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本発明は、静電破壊から半導体回路を保護する保護ダイオードを備えた半導体装置に関し、特に高周波回路を静電破壊から保護する保護ダイオードを備えた半導体装置に関する。   The present invention relates to a semiconductor device including a protection diode that protects a semiconductor circuit from electrostatic breakdown, and more particularly to a semiconductor device including a protection diode that protects a high-frequency circuit from electrostatic breakdown.

近年、半導体集積回路の高性能化、高密度化に伴い、静電耐圧が低下する傾向にある。そこで、静電気などの過大入力から半導体回路を保護するため、入力端子と接地との間に、pn接合ダイオードなどの保護素子を備える構造が採用されている。一方、携帯電話など高周波領域の分野で広く用いられているGaAsなどの化合物半導体を用いた高周波回路においても、pn接合ダイオードが保護素子として使われはじめている。   In recent years, the electrostatic withstand voltage tends to decrease as the performance and density of semiconductor integrated circuits increase. Therefore, in order to protect the semiconductor circuit from excessive input such as static electricity, a structure including a protective element such as a pn junction diode is employed between the input terminal and the ground. On the other hand, pn junction diodes are beginning to be used as protective elements in high-frequency circuits using compound semiconductors such as GaAs that are widely used in the field of high-frequency areas such as cellular phones.

従来の高周波回路用保護素子の例として、特許文献1には、印加される高周波電力の増大に伴いインピーダンスが低下する回路を、半導体装置の入力部に接続して保護を行う例が開示されている。具体的には、逆並列接続したダイオード対を一つあるいは多段に接続する保護ダイオードが開示されている。   As an example of a conventional protection element for a high-frequency circuit, Patent Document 1 discloses an example in which protection is performed by connecting a circuit whose impedance decreases with an increase in applied high-frequency power to an input portion of a semiconductor device. Yes. Specifically, a protection diode is disclosed in which a pair of diodes connected in antiparallel is connected in one or multiple stages.

また特許文献2には、複数個の順方向の第1のダイオードと第1のダイオードと同じ数の逆方向の第2のダイオードとを直列接続したダイオード列を介して、電界効果トランジスタのゲート電極を接地することにより、保護回路を構成する例が開示されている。   Patent Document 2 discloses a gate electrode of a field effect transistor through a diode array in which a plurality of forward first diodes and the same number of second diodes in the reverse direction are connected in series. An example in which a protection circuit is configured by grounding is disclosed.

特開2003−297934号公報JP 2003-297934 A 特開2002−50640号公報Japanese Patent Laid-Open No. 2002-50640

ところが、pn接合ダイオードを高周波回路の保護素子として用いる場合、高周波信号が入力端子に入力するとき、保護素子から高調波が発生する問題がある。特にスイッチ形式の高周波回路の場合、高周波入力端子をオフ状態にするため、保護素子が接続される入力端子は、電源電圧相当の電圧が印加される状態となり、保護素子から高調波が発生し、高周波回路の高調波特性の劣化の原因となることがわかってきた。   However, when a pn junction diode is used as a protection element for a high frequency circuit, there is a problem that harmonics are generated from the protection element when a high frequency signal is input to the input terminal. In particular, in the case of a switch type high frequency circuit, the high frequency input terminal is turned off, so that the input terminal to which the protective element is connected is in a state where a voltage equivalent to the power supply voltage is applied, and harmonics are generated from the protective element. It has been found that this causes deterioration of the harmonic characteristics of the high frequency circuit.

本発明は、高周波信号が入力端子に印加されたとき、保護素子であるpn接合ダイオードのpn接合部からの高調波発生を抑制し、十分な静電耐圧を備えた半導体装置を提供することを目的とする。   The present invention provides a semiconductor device having a sufficient electrostatic withstand voltage by suppressing generation of harmonics from a pn junction of a pn junction diode as a protection element when a high frequency signal is applied to an input terminal. Objective.

上記目的を達成するため、本願発明は、高周波回路の入力端子と接地との間に、前記高周波回路を静電破壊から保護する保護ダイオードを備えた半導体装置において、前記保護ダイオードは、pn接合を構成するp型領域とn型領域の間に、該p型領域及びn型領域よりキャリア濃度の低い中間層を備え、該中間層の厚さを、前記保護ダイオードのブレークダウン電圧に応じて設定される厚さの範囲内であり、且つ、キャリア濃度から算出される空乏層幅の1/3以下の厚さに設定し、前記入力端子に入力する高周波信号の電圧変化にかかわらず、前記p型領域と前記n型領域の間に形成する空乏層幅が、ほぼ一定であることにより、高調波の発生を抑えることを特徴とするものである。 In order to achieve the above object, the present invention provides a semiconductor device including a protection diode for protecting the high-frequency circuit from electrostatic breakdown between an input terminal of the high-frequency circuit and ground, wherein the protection diode has a pn junction. An intermediate layer having a carrier concentration lower than that of the p-type region and the n-type region is provided between the p-type region and the n-type region, and the thickness of the intermediate layer is set according to the breakdown voltage of the protection diode It is in the thickness range to be, and is set to 1/3 or less of the thickness of the depletion layer width calculated from the carrier concentration, regardless of the voltage change of the high-frequency signal input to the input terminal, before Symbol The width of the depletion layer formed between the p-type region and the n-type region is substantially constant, thereby suppressing the generation of harmonics .

本発明の半導体装置は、p型領域、n型領域の中間にキャリア濃度の低い中間層を備えるpn接合ダイオードを保護素子とし、入力端子に高周波信号が入力した場合、その振幅電圧の変化にかかわらず、保護ダイオードの中間層は常に空乏化し、空乏層幅がほぼ一定となる構造とすることで、pn接合部からの高調波の発生を抑えるものである。具体的には、中間層の厚さを、キャリア濃度から算出される空乏層幅の1/3以下程度の厚さに設定するだけで、入力端子に印加される高周波信号の振幅電圧の変化によらず、中間層が常に空乏化している構造となり、高周波信号入力時の容量変化が小さくなり、高調波の発生を簡便に抑制することができる。   In the semiconductor device of the present invention, when a pn junction diode having an intermediate layer having a low carrier concentration in the middle of the p-type region and the n-type region is used as a protective element and a high-frequency signal is input to the input terminal, the amplitude voltage changes. In other words, the intermediate layer of the protective diode is always depleted and the width of the depletion layer is substantially constant, thereby suppressing the generation of harmonics from the pn junction. Specifically, it is possible to change the amplitude voltage of the high-frequency signal applied to the input terminal simply by setting the thickness of the intermediate layer to a thickness of about 1/3 or less of the depletion layer width calculated from the carrier concentration. Regardless, the intermediate layer is always depleted, the change in capacitance when a high-frequency signal is input is reduced, and the generation of harmonics can be easily suppressed.

以下、本発明について詳細に説明する。本発明の半導体装置は、p型領域とn型領域の中間にキャリア濃度の低い中間層を備えるpn接合ダイオードを保護素子とし、入力端子に高周波信号が入力した場合、その振幅電圧の変化にかかわらず、保護ダイオードの中間層が、ほぼ一定の幅で、常に空乏化する構造とすることで、pn接合部からの高調波の発生を抑えるものである。   Hereinafter, the present invention will be described in detail. In the semiconductor device of the present invention, when a pn junction diode having an intermediate layer with a low carrier concentration between the p-type region and the n-type region is used as a protective element, and a high-frequency signal is input to the input terminal, the amplitude voltage changes. First, the intermediate layer of the protective diode has a substantially constant width and is always depleted, thereby suppressing the generation of harmonics from the pn junction.

以下、GaAsからなるpn-n構造で形成されている保護素子を例にとり、本発明について説明する。まず、キャリア濃度4×1019cm-3、厚さ100nmのp型領域と、キャリア濃度5×1018cm-3、厚さ100nmのn型領域との間に、中間層として100nmのn-GaAs層を配置し、n-GaAs層のキャリア濃度を変化させた。高調波特性の測定は、入力端子に2.7Vの電圧を印加し、周波数1.9GHz、24dBmの高周波信号を入力し、2次高調波を測定している。図1はn-GaAs層のキャリア濃度と高調波特性の関係を示した図で、横軸はn-GaAs層のキャリア濃度、縦軸はn-GaAs層のキャリア濃度が1×1017 cm-3の場合に発生する高調波の大きさとの差を示している。図1に示すように、n-GaAs層のキャリア濃度が低い程、高調波特性が改善され、特にキャリア濃度が1×1016cm-3以下の場合に、高調波特性が改善することが確認された。なお図1に、キャリア濃度5×1015cm-3、厚さ100nmのp-GaAs層を中間層として用いた場合の高周波出力を図示している。p-GaAs層においても、高調波特性の改善が確認され、導電型によらず、本発明の効果が確認された。また真性領域の半導体層、即ちiGaAs層においても、本発明の効果が発揮されることも確認された。 Hereinafter, the present invention will be described by taking a protective element formed of a pn - n structure made of GaAs as an example. First, an n of 100 nm is used as an intermediate layer between a p-type region having a carrier concentration of 4 × 10 19 cm −3 and a thickness of 100 nm and an n-type region having a carrier concentration of 5 × 10 18 cm −3 and a thickness of 100 nm. A GaAs layer was disposed, and the carrier concentration of the n GaAs layer was changed. For the measurement of the harmonic characteristics, a voltage of 2.7 V is applied to the input terminal, a high frequency signal having a frequency of 1.9 GHz and 24 dBm is input, and the second harmonic is measured. 1 the n - a diagram showing the relationship between the harmonic characteristics carrier concentration of the GaAs layer, the horizontal axis the n - carrier concentration of the GaAs layer, and the vertical axis the n - carrier concentration of the GaAs layer is 1 × 10 17 cm It shows the difference from the magnitude of harmonics generated in the case of -3 . As shown in FIG. 1, the lower the carrier concentration of the n GaAs layer, the higher the harmonic characteristics, and particularly when the carrier concentration is 1 × 10 16 cm −3 or less. Was confirmed. FIG. 1 shows the high-frequency output when a p GaAs layer having a carrier concentration of 5 × 10 15 cm −3 and a thickness of 100 nm is used as an intermediate layer. Also in the p GaAs layer, the improvement of the harmonic characteristics was confirmed, and the effect of the present invention was confirmed regardless of the conductivity type. It has also been confirmed that the effect of the present invention is exhibited even in the intrinsic semiconductor layer, i.e., the iGaAs layer.

このように、中間層の厚さが一定の場合には、キャリア濃度を所定の濃度より低く設定することで、高周波特性を改善できることが確認された。これは、入力端子に印加する高周波信号の電圧振幅の範囲で、中間層が常に空乏化し、その空乏層幅の変化が少なく、ほぼ一定となり、容量変化が発生しないため、pn接合ダイオードからの高調波の発生が抑えられているからと考えられる。   Thus, it was confirmed that when the thickness of the intermediate layer is constant, the high frequency characteristics can be improved by setting the carrier concentration lower than the predetermined concentration. This is because the intermediate layer is always depleted in the range of the voltage amplitude of the high-frequency signal applied to the input terminal, the change in the depletion layer width is small, almost constant, and no capacitance change occurs. This is probably because the generation of waves is suppressed.

当然ながら、中間層の厚さが変われば、高調波特性に影響を与えるキャリア濃度は、図1で示したキャリア濃度とは異なることになる。そこで、空乏層幅と中間層の厚さの関係を図2に示す。図2は横軸が空乏層幅Wと中間層の厚さdとの比(W/d)、縦軸がpn接合ダイオードから発生する2次高調波出力を示した図である。高調波の測定は、前述の条件と同様とした。図2に示すようにW/d>3で、2次高調波出力が低下していることが確認された。なお、空乏層幅Wは、W=√(2εoεsEg/qN)と表すことができる。ここで、εoは真空誘電率、εsはGaAsの誘電率、Egはエネルギーギャップ、qは電荷である。   Naturally, if the thickness of the intermediate layer changes, the carrier concentration that affects the harmonic characteristics will be different from the carrier concentration shown in FIG. FIG. 2 shows the relationship between the depletion layer width and the intermediate layer thickness. In FIG. 2, the horizontal axis represents the ratio (W / d) of the depletion layer width W to the intermediate layer thickness d, and the vertical axis represents the second harmonic output generated from the pn junction diode. The harmonics were measured under the same conditions as described above. As shown in FIG. 2, it was confirmed that the second harmonic output was reduced when W / d> 3. The depletion layer width W can be expressed as W = √ (2εoεsEg / qN). Here, εo is a vacuum dielectric constant, εs is a dielectric constant of GaAs, Eg is an energy gap, and q is an electric charge.

これらの結果から、本発明はn-GaAs層のキャリア濃度Nと中間層の厚さdとn-GaAs層の空乏層幅Wにおいて、W>3dの関係を満たすことにより、高周波信号入力時の高調波特性が改善されることが確認された。なお中間層の厚さは、保護素子として機能するために要求されるpn接合ダイオードのブレークダウン電圧に応じて設定されるので、中間層の厚さの上限は適宜設定されることになる。 From these results, the present invention satisfies the relationship of W> 3d in the carrier concentration N of the n GaAs layer, the thickness d of the intermediate layer, and the depletion layer width W of the n GaAs layer. It was confirmed that the harmonic characteristics were improved. Since the thickness of the intermediate layer is set according to the breakdown voltage of the pn junction diode required to function as a protection element, the upper limit of the thickness of the intermediate layer is appropriately set.

なお、キャリア濃度の高いp型層およびn型層においては、空乏層幅の広がりは小さくなるので、高周波入力信号の振幅電圧の変化に応じて変化する空乏層幅は非常に小さく、空乏層幅は、ほぼ一定となる。また、空乏層幅の変化があっても、中間層がほぼ空乏化する条件であれば、空乏層幅の変化による接合容量の変化も少なくなり、高調波特性は劣化しないと考えられる。   Note that in the p-type layer and the n-type layer having a high carrier concentration, the depletion layer width becomes small, so that the depletion layer width that changes according to the change in the amplitude voltage of the high-frequency input signal is very small. Is almost constant. Further, even if there is a change in the depletion layer width, it is considered that if the intermediate layer is almost depleted, the change in junction capacitance due to the change in the depletion layer width is reduced and the harmonic characteristics are not deteriorated.

次に実施例を説明する。保護素子としてGaAsからなるpn-n構造で形成されているpn接合ダイオードを用い、中間層n-GaAs層のキャリア濃度をN=1×1016 cm-3、厚さを100nmとした。前述のように算出される空乏層幅Wは、約350nmとなり、n-GaAs層の厚さを100nmとすれば、入力端子に高周波信号が入力した場合、常に中間層は空乏化することになり、キャリア濃度の高いp型領域あるいはn型領域に広がる空乏層幅はわずかとなる。つまり、入力端子に入力する高周波信号の電圧振幅によって変化する空乏層幅は、常に中間層幅とほぼ等しいことになり、接合容量の変化がわずかになる。その結果、高周波信号によるダイオードの容量変化がわずかとなり、高調波特性が改善されることになる。 Next, examples will be described. Pn comprising GaAs as a protective element - using a pn junction diode formed by the n structure, the intermediate layer n - and the carrier concentration of the GaAs layer N = 1 × 10 16 cm -3 , and its thickness was 100 nm. The depletion layer width W calculated as described above is about 350 nm. If the thickness of the n GaAs layer is 100 nm, the intermediate layer is always depleted when a high-frequency signal is input to the input terminal. The width of the depletion layer extending in the p-type region or the n-type region having a high carrier concentration is small. That is, the depletion layer width that changes depending on the voltage amplitude of the high-frequency signal input to the input terminal is always substantially equal to the intermediate layer width, and the change in the junction capacitance is small. As a result, the capacitance change of the diode due to the high-frequency signal becomes small, and the harmonic characteristics are improved.

以上本発明について説明したが、本発明は、上記実施例の他、中間層としてp-GaAs層、iGaAs層を用いたpn接合ダイオードの他、GaAsの代わりに、他の化合物半導体で構成することが可能である。また、保護ダイオードは、pn接合ダイオード単体で用いるほか、保護ダイオードとして公知の複数のpn接合ダイオードをアンチパラレル型に接続したり、逆方向に直列に接続する等、種々変更することが可能である。 Although the present invention has been described above, the present invention is composed of other compound semiconductors in place of GaAs, in addition to the above embodiments, in addition to pn junction diodes using p GaAs layers and iGaAs layers as intermediate layers. Is possible. Further, the protection diode can be variously modified such as using a single pn junction diode, or connecting a plurality of pn junction diodes known as protection diodes in an anti-parallel type or in series in the opposite direction. .

本発明の半導体装置のキャリア濃度と高調波出力特性の関係を示す図である。It is a figure which shows the relationship between the carrier concentration of the semiconductor device of this invention, and a harmonic output characteristic. 本発明の半導体装置のW/dと2次高調波出力特性の関係を示す図である。It is a figure which shows the relationship between W / d and the second harmonic output characteristic of the semiconductor device of this invention.

Claims (1)

高周波回路の入力端子と接地との間に、前記高周波回路を静電破壊から保護する保護ダイオードを備えた半導体装置において、
前記保護ダイオードは、pn接合を構成するp型領域とn型領域の間に、該p型領域及びn型領域よりキャリア濃度の低い中間層を備え、
該中間層の厚さを、前記保護ダイオードのブレークダウン電圧に応じて設定される厚さの範囲内であり、且つ、キャリア濃度から算出される空乏層幅の1/3以下の厚さに設定し、前記入力端子に入力する高周波信号の電圧変化にかかわらず、前記p型領域と前記n型領域の間に形成する空乏層幅が、ほぼ一定であることにより、高調波の発生を抑えることを特徴とする半導体装置。
In a semiconductor device provided with a protective diode for protecting the high-frequency circuit from electrostatic breakdown between the input terminal of the high-frequency circuit and the ground,
The protective diode includes an intermediate layer having a carrier concentration lower than that of the p-type region and the n-type region between the p-type region and the n-type region constituting the pn junction,
The thickness of the intermediate layer is set to a thickness within the range of the thickness set according to the breakdown voltage of the protection diode, and not more than 1/3 of the depletion layer width calculated from the carrier concentration. and, regardless of the voltage change of the high-frequency signal to be inputted to said input terminal, a depletion layer width formed between the front Symbol p-type region and the n-type region, by a substantially constant, suppressing the generation of harmonics wherein a.
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