JP4241320B2 - Thermal sensing element - Google Patents

Thermal sensing element Download PDF

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JP4241320B2
JP4241320B2 JP2003366878A JP2003366878A JP4241320B2 JP 4241320 B2 JP4241320 B2 JP 4241320B2 JP 2003366878 A JP2003366878 A JP 2003366878A JP 2003366878 A JP2003366878 A JP 2003366878A JP 4241320 B2 JP4241320 B2 JP 4241320B2
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heat
metal conductive
detection element
storage portion
mounting
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JP2005134119A (en
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克裕 内沢
慎司 桐畑
常弘 北村
智宏 上津
剛嗣 和田
昭一 岡
章生 仲野
保司 小西
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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Description

本発明は、温度を電気的に検出して火災を感知する感知器に用いられる熱検知素子に関する。   The present invention relates to a heat detection element used in a sensor that detects a fire by electrically detecting a temperature.

従来の熱検知素子としては、サーミスタに電極を設けてなるサーミスタ部と、前記電極に延設される一対のリード線とを備え、前記リード線の前記サーミスタ部近傍側をエポキシ樹脂でディップコーティングしているものがあった（特許文献１）。   As a conventional heat detection element, a thermistor part in which an electrode is provided on a thermistor and a pair of lead wires extending to the electrode are provided, and the vicinity of the thermistor part of the lead wire is dip coated with an epoxy resin. (Patent Document 1).

同様に、図８に示す熱検知素子１０１では、樹脂で被覆された一対のリード線１０２、１０３を互いに平行に配置し、その一端部１０２ａ、１０３ａ間に亘ってサーミスタのチップ１０４を実装するとともにチップ１０４をガラス１０５で封止し、他端部１０２ｂ、１０３ｂにそれぞれＬ字形の接続端子１０６を半田付けしたものをエポキシ層１０７でディップコーティングしていた。
特開２００２−２７７３３４号公報（第１図） Similarly, in the heat detection element 101 shown in FIG. 8, a pair of lead wires 102 and 103 coated with resin are arranged in parallel to each other, and a thermistor chip 104 is mounted between the one end portions 102a and 103a. The chip 104 was sealed with glass 105, and the L-shaped connection terminals 106 were soldered to the other ends 102b and 103b, respectively, and dip-coated with an epoxy layer 107.
JP 2002-277334 A (FIG. 1)

上述の後者の熱検知素子１０１では、サーミスタのチップ１０４をガラス１０５で封じているため、チップ１０４を均一の厚さ寸法で封止することが困難であり、かつ、エポキシ層１０７をエポキシ樹脂でディップコーティングして形成しているため、チップ１０４を被覆するエポキシ層１０７の厚さ寸法が不均一となり、また、エポキシ層１０７のリード線１０２、１０３を被覆する部位においても厚さ寸法が不均一となる。そのため、熱検知素子１０１の熱応答性にバラツキが生じるという問題があった。   In the latter thermal detection element 101 described above, the thermistor chip 104 is sealed with the glass 105, so that it is difficult to seal the chip 104 with a uniform thickness, and the epoxy layer 107 is made of epoxy resin. Since it is formed by dip coating, the thickness dimension of the epoxy layer 107 covering the chip 104 is non-uniform, and the thickness dimension is also non-uniform in the portion of the epoxy layer 107 covering the lead wires 102 and 103. It becomes. Therefore, there has been a problem that variation occurs in the thermal response of the heat detection element 101.

また、このようにして製造された熱検知素子１０１は、製品ごとに熱応答性が異なってしまうため、熱検知素子１０１の品質を一定に保てないという問題があった。   Moreover, since the heat sensing element 101 manufactured in this way has different thermal responsiveness for each product, there is a problem that the quality of the heat sensing element 101 cannot be kept constant.

さらに、接続端子１０６をリード線１０２、１０３に半田付けするために製造工程が多くなり、製造コストが高くなるという問題があった。   Furthermore, since the connection terminal 106 is soldered to the lead wires 102 and 103, the number of manufacturing processes increases, and there is a problem that the manufacturing cost increases.

本発明は上述の点に鑑みて為されたもので、その目的は、熱応答性のバラツキがなく、製造し易い安定した品質の熱検知素子を提供することである。   The present invention has been made in view of the above points, and an object of the present invention is to provide a heat sensing element with stable quality that is easy to manufacture without variation in thermal response.

上述の課題を解決するために、請求項１の発明では、合成樹脂を成形してなる有底の収納部と、当該収納部の底面に一端部が露出された一対の金属導電板と、前記収納部内において前記一対の金属導電板の一端部間に亘るように実装されたサーミスタのチップとを備え、前記収納部内には、サーミスタのチップを封止する封止用樹脂が充填され、前記金属導電板は、実装基板の面に対して垂直となるように垂立されるとともに、他端部が前記実装基板に電気的に接続され、前記収納部の開口部は、前記金属導電板の他端部が電気的に接続される前記実装基板の面とは反対側を向いていることを特徴とする。 In order to solve the above-mentioned problem, in the invention of claim 1, a bottomed storage part formed by molding a synthetic resin, a pair of metal conductive plates with one end exposed at the bottom surface of the storage part, A thermistor chip mounted between one end portions of the pair of metal conductive plates in the storage portion, and the storage portion is filled with a sealing resin for sealing the thermistor chip, and the metal The conductive plate is suspended so as to be perpendicular to the surface of the mounting substrate, the other end is electrically connected to the mounting substrate, and the opening of the storage portion is formed in addition to the metal conductive plate. The end portion is directed to the side opposite to the surface of the mounting substrate to be electrically connected.

請求項１の発明によれば、サーミスタのチップが封止される収納部を合成樹脂で成形して形成したので、成形金型の精度により収納部に充填する封止用樹脂の充填量がほぼ一定となる。そのため、熱検知素子の熱応答性のバラツキを抑制することができる。また、収納部の外周面において、成形金型の精度により熱応答性の偏りがなくなる。そのため、熱検知素子の熱応答性のバラツキを抑制することができる。 According to the first aspect of the present invention , since the storage portion in which the thermistor chip is sealed is formed of synthetic resin, the amount of sealing resin filled in the storage portion is almost equal to the accuracy of the molding die. It becomes constant. Therefore, variation in the thermal response of the heat detection element can be suppressed. In addition, on the outer peripheral surface of the storage portion, there is no bias in thermal response due to the accuracy of the molding die. Therefore, variation in the thermal response of the heat detection element can be suppressed.

請求項２の発明では、請求項１の発明において、前記合成樹脂は熱可塑性樹脂であり、前記一対の金属導電板において前記収納部から突出された突出部位は、前記熱可塑性樹脂によりモールドされていることを特徴とする。 In the invention of claim 2, in the invention of claim 1, wherein the synthetic resin is Ri der thermoplastic resin, the protruding portion that protrudes from the housing part in the pair of metal conductive plates are molded by the thermoplastic resin It is characterized by.

請求項２の発明によれば、金属導電板の収納部より突出した部位を熱可塑性樹脂でモールドしたので、成形金型の精度により、熱応答性に影響する前記金属導電板の突出した部位の厚さ寸法のバラツキを抑えることができる。そのため、熱検知素子の熱応答性のバラツキをさらに抑制することができる。   According to the second aspect of the present invention, since the portion that protrudes from the housing portion of the metal conductive plate is molded with the thermoplastic resin, the portion of the protruding portion of the metal conductive plate that affects the thermal response is affected by the accuracy of the molding die. Variations in thickness can be suppressed. Therefore, variation in thermal response of the heat detection element can be further suppressed.

請求項３の発明では、請求項２の発明において、前記各金属導電板は所定の間隔を有して並行に配置され、前記一対の金属導電板の前記突出部位それぞれは、前記金属導電板間に隙間部が形成されるように、前記熱可塑性樹脂により各別にモールドされていることを特徴とする。 According to a third aspect of the present invention, in the second aspect of the present invention , the metal conductive plates are arranged in parallel at a predetermined interval, and the protruding portions of the pair of metal conductive plates are respectively located between the metal conductive plates. It is characterized by being individually molded with the thermoplastic resin so that a gap is formed in the glass.

請求項３の発明によれば、金属導電板の突出部を各別に熱可塑性樹脂でモールドしている。そのため、前記金属導電板を各別にモールドしてない場合に比べて、前記金属導電板に熱可塑性樹脂を介して気流が当たる面積は増えることとなり、熱検知素子の熱応答性が向上する。   According to invention of Claim 3, the protrusion part of a metal electrically-conductive board is separately molded with the thermoplastic resin. Therefore, compared to the case where the metal conductive plate is not molded separately, the area where the metal conductive plate is exposed to the airflow via the thermoplastic resin is increased, and the thermal response of the heat detecting element is improved.

請求項４の発明では、請求項１〜３のうちいずれか１項の発明において、前記封止用樹脂はエポキシ樹脂であって、前記合成樹脂は、荷重たわみ温度が２８５℃以上、かつ、比熱が６００Ｊ／ｋｇＫ以下の熱可塑性樹脂であることを特徴とする。 The invention according to claim 4 is the invention according to any one of claims 1 to 3 , wherein the sealing resin is an epoxy resin, and the synthetic resin has a deflection temperature under load of 285 ° C. or more and a specific heat. Is a thermoplastic resin of 600 J / kgK or less .

請求項４の発明によれば、荷重たわみ温度が２８５℃以上、かつ、比熱が６００Ｊ／ｋｇＫ以下であるような熱可塑性樹脂を用いたので、エポキシ樹脂と同等の熱応答性を実現することができるとともに、熱変形しにくくなる。そのため、より広い温度範囲で安定した熱検知が可能となる。   According to the invention of claim 4, since a thermoplastic resin having a deflection temperature under load of 285 ° C. or more and a specific heat of 600 J / kgK or less is used, it is possible to achieve a thermal response equivalent to that of an epoxy resin. While being able to do, it becomes difficult to heat-deform. Therefore, stable heat detection is possible in a wider temperature range.

請求項５の発明では、請求項１〜４のうちいずれか１項の発明において、前記収納部には、前記収納部の開口部から前方へ向かうにつれ徐々に外側へ広がる形のすり鉢状のフィンが一体的に形成され、前記フィンの前記収納部の開口部付近の基部には、前記フィンの内部と外部とを連通する孔が形成されていることを特徴とする。 In the invention of claim 5, in the invention of any one of claims 1 to 4, wherein the housing portion is gradually form conical fins extending outward as the direction from the opening of the accommodating portion to the front There is formed integrally with, the base of the vicinity of the opening of the housing portion of the fin, characterized in that hole communicating the inside and the outside of the fins are formed.

請求項５の発明によれば、収納部の開口部から、外側へ徐々に広がるようにすり鉢状のフィンを設け、前記フィンの基部では前記フィンの内部と外部とを連通する孔を形成したので、前記収納部に前記フィンを介して気流が入り込み易くなり、かつ、前記孔により気流が循環しやすくなる。そのため、気流を効率的に集めることができるようになり、熱検知素子の熱応答性が向上する。 According to the fifth aspect of the present invention, the mortar-shaped fins are provided so as to gradually spread outward from the opening of the storage portion, and the base of the fin is formed with a hole that communicates the inside and outside of the fin. The airflow easily enters the storage portion via the fins, and the airflow easily circulates through the holes. Therefore, airflow can be collected efficiently, and the thermal response of the heat detection element is improved.

請求項６の発明では、請求項１〜５のうちいずれか１項の発明において、前記金属導電板には、１又は２以上の集熱板が一体的に形成されていることを特徴とする。 In the invention of claim 6, in the invention of any one of claims 1 to 5, wherein the metal conductive plate, one or more of the heat collecting plate is characterized in that it is formed integrally .

請求項６の発明によれば、金属導電板に集熱板を一体的に延設形成したので、気流を受ける面積が増大するとともに、前記金属導電板に熱が効率よく伝わる。そのため、熱検知素子の熱応答性が向上する。 According to the sixth aspect of the present invention, since the heat collecting plate is integrally extended and formed on the metal conductive plate, the area for receiving the airflow is increased and the heat is efficiently transmitted to the metal conductive plate. Therefore, the thermal response of the heat detection element is improved.

請求項７の発明では、請求項６の発明において、前記集熱板を、前記集熱板は、板面が前記収納部の側周面に対向するように前記収納部の側部から突出され、かつ、当該板面と前記収納部の側周面との間の距離が、前記収納部の開口部の前方向側に向かうにつれて大きくなるように傾斜していることを特徴とする。 According to a seventh aspect of the present invention, in the sixth aspect of the present invention , the heat collecting plate is protruded from a side portion of the storage portion such that the plate surface faces the side peripheral surface of the storage portion. And it is inclined so that the distance between the said plate | board surface and the side peripheral surface of the said accommodating part may become large as it goes to the front direction side of the opening part of the said accommodating part .

請求項７の発明によれば、集熱板の板面を収納部の側周面に対向させ、かつ、収納部の開口部の前方向に傾斜させている。そのため、気流が入り込み易くなり、かつ、前記集熱板を介して金属導電板に熱が伝わるために、熱検知素子の熱応答性が向上する。 According to invention of Claim 7 , the plate | board surface of a heat collecting plate is made to oppose the side peripheral surface of a storage part, and it inclines in the front direction of the opening part of a storage part. For this reason, airflow is likely to enter, and heat is transmitted to the metal conductive plate through the heat collecting plate, so that the thermal responsiveness of the heat detecting element is improved.

請求項８の発明では、請求項２〜７のうちいずれか１項の発明において、前記突出部位は、蛇行形状であることを特徴とする。 The invention of claim 8 is characterized in that, in the invention of any one of claims 2 to 7, the protruding portion has a meandering shape .

請求項８の発明によれば、前記金属導電板の突出部位が平板状のものよりも長くなる。そのため、前記金属伝動板の熱伝導が悪くなり、熱検知素子から熱が逃げにくくなる。これにより、熱検知素子の熱応答性が向上する。 According to invention of Claim 8 , the protrusion part of the said metal conductive plate becomes longer than a flat thing. For this reason, the heat conduction of the metal transmission plate is deteriorated, and it is difficult for heat to escape from the heat detection element. Thereby, the thermal responsiveness of a heat sensing element improves.

請求項９の発明では、請求項１〜８のうちいずれか１項の発明において、前記金属導電板の他端側には、表面実装用の略直方体形状の実装部が形成され、前記実装部の実装基板と溶接される面には、前記金属導電板の他端部に形成した電極部が露出していることを特徴とする。 In the invention of claim 9, in the invention of any one of claims 1 to 8, a mounting portion having a substantially rectangular parallelepiped shape for surface mounting is formed on the other end side of the metal conductive plate, and the mounting portion the surface to be mounted board the welding, characterized in that the electrode portion formed on the other end portion of the metal conductive plate is exposed.

請求項９の発明によれば、実装部の底面に金属導体板を露出させたので、熱検知素子を実装基板に表面実装することができる。 According to the invention of claim 9 , since the metal conductor plate is exposed on the bottom surface of the mounting portion, the heat detection element can be surface-mounted on the mounting substrate.

サーミスタのチップが封止される収納部を熱可塑性樹脂で成形して形成したので、成形金型の精度により収納部の容積が一定となるため、収納部に充填する封止用樹脂の充填量がほぼ一定となる。そのため、熱検知素子の製品ごとの熱応答性のバラツキを抑制することができ、安定した品質の熱検知素子を製造できる。また、収納部の外周面において、成形金型の精度により熱応答性の偏りがなくなる。そのため、熱検知素子の熱応答性のバラツキを抑制することができる。 Since the storage part in which the thermistor chip is sealed is molded from a thermoplastic resin, the volume of the storage part is constant due to the accuracy of the molding die, so the filling amount of the sealing resin that fills the storage part Is almost constant. Therefore, variation in thermal responsiveness for each product of the heat detection element can be suppressed, and a heat detection element with stable quality can be manufactured. In addition, on the outer peripheral surface of the storage portion, there is no bias in thermal response due to the accuracy of the molding die. Therefore, variation in the thermal response of the heat detection element can be suppressed.

以下に、図１乃至７を用いて本発明の基本形態及び実施形態について説明する。 Below, the basic form and embodiment of this invention are demonstrated using FIG. 1 thru | or 7. FIG.

（基本形態１）
図１を用いて本発明の基本形態１について説明する。本基本形態の熱検知素子８は、図１（ａ）に示すように、Ｃｕ−Ｓｎめっきを施されたリードフレームを打ち抜いて、一端に後述するサーミスタのチップ３を実装する幅広の実装部１ａ、２ａと、他端に熱検知素子８を実装する実装プリント基板４用の接続端子１ｂ、２ｂとを有する金属導電板１、２をインサートして成形され、実装部１ａ、２ａを底面に露出させた有底の熱可塑樹脂製の収納部５と、この収納部５と同時に成形され、下面から接続端子１ｂ、２ｂを突出させた略直方体形状の基台６と、収納部５及び基台６とともに成形され、収納部５と基台６に亘って露出する収納部５からの突出部位である金属導電板１、２の脚部１ｃ、２ｃをモールドする外被部７と、半田もしくは導電接着剤等の接着材９を用いて、収納部５の底面に露出した実装部１ａ、２ａ間に亘って固着実装されるサーミスタのチップ３とを有し、図１（ｂ）に示すように、エポキシ樹脂１０を、サーミスタのチップ３が実装された収納部５内に充填して封止して、図１（ｃ）に示すように構成されている。なお、熱可塑性樹脂を成形してなる収納部５、基台６、及び外被部７は、一対の金属導電板１、２の位置ずれを防ぐために、部分的に２回に分けて成形されている。 ( Basic form 1)
A basic embodiment 1 of the present invention will be described with reference to FIG. As shown in FIG. 1A, the heat detection element 8 of this basic form is formed by punching out a lead frame plated with Cu—Sn and mounting a thermistor chip 3 (described later) at one end with a wide mounting portion 1a. 2a and metal conductive plates 1 and 2 having mounting terminals 1b and 2b for mounting printed circuit board 4 on which heat detection element 8 is mounted on the other end, are molded and the mounting portions 1a and 2a are exposed to the bottom surface. The bottomed thermoplastic resin storage part 5, a substantially rectangular parallelepiped base 6 formed simultaneously with the storage part 5 and projecting the connection terminals 1 b and 2 b from the lower surface, the storage part 5 and the base 6 and an outer cover portion 7 for molding the legs 1c and 2c of the metal conductive plates 1 and 2 which are projecting portions from the storage portion 5 exposed between the storage portion 5 and the base 6, and solder or conductive Using the adhesive 9 such as an adhesive, the bottom surface of the storage unit 5 And a thermistor chip 3 fixedly mounted between the exposed mounting parts 1a and 2a. As shown in FIG. 1B, the epoxy resin 10 is placed in the storage part 5 in which the thermistor chip 3 is mounted. It is filled and sealed, and is configured as shown in FIG. In addition, the storage part 5, the base 6, and the jacket part 7 formed by molding a thermoplastic resin are partly divided into two parts in order to prevent displacement of the pair of metal conductive plates 1 and 2. ing.

前記熱可塑性樹脂としては、例えば、荷重たわみ温度が２８５℃以上、比熱が６００Ｊ／ｋｇＫ、及び比重が１．７ｇ／ｃｍ３であるようなナイロン系ポリアミドを用いている。 As the thermoplastic resin, for example, a nylon polyamide having a deflection temperature under load of 285 ° C. or more, a specific heat of 600 J / kgK, and a specific gravity of 1.7 g / cm 3 is used.

基台６の下面には、基台６が実装プリント基板４に載置される際に、実装プリント基板４の位置合わせ用の孔と嵌め合わされる一対の凸部６ａを２組形成してある。   Two sets of a pair of convex portions 6 a are formed on the lower surface of the base 6 so that the base 6 is fitted to the alignment holes of the mounting printed board 4 when the base 6 is placed on the mounting printed board 4. .

本基本形態によれば、サーミスタのチップ３が封止される収納部５を熱可塑性樹脂で成形して形成したので、成形金型の精度により収納部５の容積が一定になるため、収納部５に充填するエポキシ樹脂１０の充填量がほぼ一定となる。そのため、熱検知素子８の熱応答性のバラツキを抑制することができる。 According to this basic form, since the storage portion 5 in which the thermistor chip 3 is sealed is formed of thermoplastic resin, the volume of the storage portion 5 becomes constant depending on the accuracy of the molding die. The filling amount of the epoxy resin 10 filled in 5 becomes substantially constant. Therefore, variation in the thermal response of the heat detection element 8 can be suppressed.

加えて、熱可塑性樹脂は、荷重たわみ温度が２８５℃以上、かつ、比熱が６００Ｊ／ｋｇＫ以下であるものを用いたので、封止用のエポキシ樹脂１０と同等の熱応答性を実現することができるとともに、熱変形しにくくなる。そのため、より広い温度範囲で安定した熱検知が可能となる。   In addition, since a thermoplastic resin having a deflection temperature under load of 285 ° C. or more and a specific heat of 600 J / kgK or less is used, it is possible to realize a thermal response equivalent to that of the epoxy resin 10 for sealing. While being able to do, it becomes difficult to heat-deform. Therefore, stable heat detection is possible in a wider temperature range.

また、金属導電板の脚部１ｃ、２ｃをインサートして外被部７を成形したので、成形金型の精度により、外被部７の厚さ寸法のバラツキを±０．０５ｍｍ程度に抑えて形成することができる。そのため、熱検知素子８の熱応答性のバラツキをさらに抑制することができる。   Further, since the outer cover portion 7 is formed by inserting the leg portions 1c and 2c of the metal conductive plate, the thickness variation of the outer cover portion 7 is suppressed to about ± 0.05 mm due to the accuracy of the molding die. Can be formed. Therefore, variation in the thermal response of the heat detection element 8 can be further suppressed.

しかも、金属導電板の脚部１ｃ、２ｃを各別にインサートして外被部７を成形したので、金属導電板１、２間に隙間部が形成され、前記隙間部にも気流が入り込むことで外被部７の全周にわたり気流が当たることとなり、気流の当たる面積が増加する。そのため、熱検知素子８の熱応答性が向上する。   In addition, since the outer cover portion 7 is formed by inserting the leg portions 1c and 2c of the metal conductive plate separately, a gap portion is formed between the metal conductive plates 1 and 2, and airflow enters the gap portion as well. The airflow hits the entire circumference of the jacket portion 7, and the area where the airflow hits increases. Therefore, the thermal responsiveness of the heat detection element 8 is improved.

さらに、接続端子１ｂ、２ｂを金属導電板１、２と一体に形成してあるので、接続端子を金属導電板１、２に接続する必要はなく、また、端子ピッチを自由に設定できるとともに、自由性を十分確保できる。   Furthermore, since the connection terminals 1b and 2b are formed integrally with the metal conductive plates 1 and 2, there is no need to connect the connection terminals to the metal conductive plates 1 and 2, and the terminal pitch can be freely set, Sufficient freedom can be secured.

以上により、熱応答性のバラツキがなく、製造し易い品質の安定した熱検知素子８を得ることができる。   As described above, it is possible to obtain a heat detecting element 8 having a stable quality and easy to manufacture without variation in heat responsiveness.

なお、本発明の熱検知素子８は、図２に示すような火災感知器１１に用いられ、この火災感知器１１は、器体１１ａ内の回路基板ブロック１２に熱検知素子８の接続端子１ｂ、２ｂを半田付けすることで、熱検知素子８を固着するとともに、熱検知素子８を火災感知器１１の器体１１ａ中央下部の気流流入室１３内に、収納部５を気流流入室１３内の下部側に位置するように垂下させて配置して使用する。この火災感知器１１は、気流流入室１３に流れ込む空気流の温度を熱検知素子８で感知する。   The heat detection element 8 of the present invention is used in a fire detector 11 as shown in FIG. 2, and the fire detector 11 is connected to the circuit board block 12 in the body 11a with a connection terminal 1b of the heat detection element 8. 2b is soldered to fix the heat detection element 8, the heat detection element 8 in the air flow inflow chamber 13 at the lower center of the body 11a of the fire detector 11, and the storage part 5 in the air flow inflow chamber 13. It is used by suspending it so that it is located on the lower side. The fire detector 11 detects the temperature of the airflow flowing into the airflow inflow chamber 13 with the heat detection element 8.

また、基台６は、基台６の下面から接続端子１ｂ、２ｂを突出する代わりに、図３（ａ）に示すように、金属導電板１、２の他端を折り曲げて電極部１ｄ、２ｄを形成し、図３（ｂ）に示すように、基台６の下面に露出する構成としても良い。このように基台６を構成することで、熱検知素子８を実装プリント基板４に表面実装することができ、この構成は、後述する実施形態においても同様に用いることができる。   In addition, instead of projecting the connection terminals 1b and 2b from the lower surface of the base 6, the base 6 bends the other ends of the metal conductive plates 1 and 2 as shown in FIG. It is good also as a structure which forms 2d and is exposed to the lower surface of the base 6, as shown in FIG.3 (b). By configuring the base 6 in this way, the heat detection element 8 can be surface-mounted on the mounting printed circuit board 4, and this configuration can be similarly used in the embodiments described later.

（実施形態１）
次に、本発明の実施形態１について説明する。本実施形態の熱検知素子８は、上述の基本形態１とは異なり、金属導電板１、２をインサートして上述のように収納部５、基台６、外被部７を成形する際に、収納部５と外被部７との間に金属導電板１、２を露出するようにして収納部５、基台６及び外被部７を形成して、金属導電板１、２をリードフレームから分断しており、この金属導電板の露出部１ｅを、図４（ａ）に示すように、収納部５の開口部を上方向に向けて、略コ字形に折り曲げ形成している。 (Embodiment 1 )
Next, Embodiment 1 of the present invention will be described. Unlike the basic form 1 described above, the heat detection element 8 of the present embodiment inserts the metal conductive plates 1 and 2 and forms the storage part 5, the base 6, and the jacket part 7 as described above. The metal conductive plates 1 and 2 are exposed between the storage portion 5 and the jacket portion 7 to form the storage portion 5, the base 6 and the jacket portion 7, and lead the metal conductive plates 1 and 2. As shown in FIG. 4A, the exposed portion 1e of the metal conductive plate is bent in a substantially U shape with the opening of the storage portion 5 facing upward.

このように構成した露出部１ｅ及び収納部５を、露出部１ｅを埋設し、上面に収納部５の開口部を露出させるとともに、収納部５の外周面を一様な厚さ寸法で覆うように上記の熱可塑性樹脂で成形して、略箱形状の２次成形部１４を形成してある。その他の構成については、上述の基本形態１と同様であるので説明を省略する。 The exposed portion 1e and the storage portion 5 configured as described above are embedded in the exposed portion 1e so that the opening of the storage portion 5 is exposed on the upper surface and the outer peripheral surface of the storage portion 5 is covered with a uniform thickness. Are molded with the above thermoplastic resin to form a substantially box-shaped secondary molded portion 14. Other configurations are the same as those of the basic mode 1 described above, and thus description thereof is omitted.

このようにして形成された熱検知素子８は、接続端子１ｂ、２ｂを実装プリント基板４の端子取付孔に貫挿するとともに、基台６に形成された凸部６ａを実装プリント基板の前記位置合わせ用の孔に嵌め合わせることで、基台６の下面を実装プリント基板４の表面に当接して実装プリント基板４に垂立される。この状態で接続端子１ｂ、２ｂを実装プリント基板４の裏面に形成された配線パターン（図示せず）と溶接することで、熱検知素子８は実装プリント基板４に固着され、電気的に接続される。これにより、熱検知素子８は、実装プリント基板４の表面に対して垂直となるように溶接されることとなり、このとき、熱検知素子８の収納部５の開口部の開口方向は、実装プリント基板４の表面に対して垂直方向を向くこととなる。   The heat detection element 8 formed in this way inserts the connection terminals 1b and 2b into the terminal mounting holes of the mounting printed circuit board 4, and the protrusions 6a formed on the base 6 at the position of the mounting printed circuit board. By fitting into the matching holes, the lower surface of the base 6 is brought into contact with the surface of the mounting printed board 4 and is suspended from the mounting printed board 4. In this state, the connection terminals 1b and 2b are welded to a wiring pattern (not shown) formed on the back surface of the mounting printed board 4, whereby the heat detection element 8 is fixed to the mounting printed board 4 and is electrically connected. The As a result, the heat detection element 8 is welded so as to be perpendicular to the surface of the mounting printed circuit board 4. It will be oriented perpendicular to the surface of the substrate 4.

本実施形態によれば、上述の基本形態１の効果に加え、収納部５の開口部を上方向へ向け、その外周面を一様な厚さの２次成形部１４で被覆したので、収納部５の外周面にあたる気流の熱の影響の偏りがなくなり、外周面からの気流に対し、熱検知素子８が一様な熱応答性を示すこととなる。 According to this embodiment, in addition to the effects of the basic form 1 described above, the opening of the storage portion 5 is directed upward, and the outer peripheral surface thereof is covered with the secondary molding portion 14 having a uniform thickness. The bias of the influence of the heat of the airflow which hits the outer peripheral surface of the part 5 is eliminated, and the heat detection element 8 exhibits a uniform thermal response to the airflow from the outer peripheral surface.

なお、本実施形態の熱検知素子８は、火災感知器に実装するために必要な国家検定の要件である、水平方向からの気流に対する熱応答性が一様であることを満たしている。   Note that the heat detection element 8 of the present embodiment satisfies that the thermal responsiveness to the airflow from the horizontal direction, which is a requirement for national certification necessary for mounting on a fire detector, is uniform.

（実施形態２）
本発明の実施形態２の熱検知素子８としては、上述の実施形態１の熱検知素子８において、図４（ｂ）に示すように、前方へ拡開する開口部の断面形状が正方形のすり鉢状のフィン１５を２次成形部１４と同時に一体的に成形するとともに、フィン１５の基部１５ａに、フィン１５の内部と外部とを連通し、フィン１５内に流入した空気流を外部へと流出させる矩形状の孔である流出口１５ｂを、図４（ｃ）に示すようにフィン１５の各側面に一つずつ合計４つ設ける構成としたものがある。 (Embodiment 2 )
As the heat detection element 8 according to the second embodiment of the present invention, in the heat detection element 8 according to the first embodiment, as shown in FIG. The fin 15 is integrally molded simultaneously with the secondary molding portion 14, and the inside and outside of the fin 15 are connected to the base portion 15 a of the fin 15, and the air flow flowing into the fin 15 flows out to the outside. the outlet 15b is a rectangular hole for are those in which the respective side part not a one a total of four are provided in the configuration of the fin 15 as shown in FIG. 4 (c).

而して、収納部５を覆う２次成形部１４とすり鉢状のフィン１５とを同時に一体的に成形するとともに、フィン１５の基部１５ａに流出口１５ｂを設けたので、フィン１５によって収納部５に気流が流れ込み易くなる。さらに、流出口１５ｂにより気流が循環するために、常に新しい気流が収納部５に流れ込むこととなる。そのため、気流を効率的に収納部５に集めることができるようになり、熱検知素子８の熱応答性をさらに向上させることができる。   Thus, the secondary molding portion 14 covering the storage portion 5 and the mortar-shaped fin 15 are integrally formed at the same time, and the outlet 15b is provided in the base portion 15a of the fin 15. It becomes easy to flow into the air. Furthermore, since the airflow circulates through the outlet 15b, a new airflow always flows into the storage unit 5. Therefore, airflow can be efficiently collected in the storage unit 5, and the thermal responsiveness of the heat detection element 8 can be further improved.

なお、本実施形態では、フィン１５の開口部の断面形状を正方形としたが、フィン１５の開口部の断面形状は、正方形に限られるものではなく、さらに高次の多角形としても良く、特に気流の方向性を少なくできるという点で、開口部の断面形状が円形のものが好ましい。   In the present embodiment, the cross-sectional shape of the opening of the fin 15 is a square, but the cross-sectional shape of the opening of the fin 15 is not limited to a square, and may be a higher-order polygon. From the viewpoint that the directionality of the airflow can be reduced, it is preferable that the opening has a circular cross-sectional shape.

（実施形態３）
本発明の実施形態３では、Ｌ字形の集熱板１６を、金属導電板１、２の実装部１ａ、２ａの一辺から実装部１ａ、２ａと一体的に形成してある。このような金属導電板１、２を、上述の実施形態１と同様にインサートして収納部５を成形するとともに、図５（ａ）に示すように、集熱板１６を、収納部５の底面と平行に収納部５の対向する側部から１つずつ突出させている。また、突出させた集熱板１６には、防水、防錆等のためのコーティング処理を施してある。 (Embodiment 3 )
In Embodiment 3 of the present invention, the L-shaped heat collecting plate 16 is formed integrally with the mounting portions 1a, 2a from one side of the mounting portions 1a, 2a of the metal conductive plates 1, 2. The metal conductive plates 1 and 2 are inserted in the same manner as in the first embodiment to form the storage portion 5, and the heat collecting plate 16 is attached to the storage portion 5 as shown in FIG. One side is projected from the opposite side of the storage unit 5 in parallel with the bottom surface. Further, the projected heat collecting plate 16 is subjected to a coating process for waterproofing, rust prevention and the like.

これにより、図５（ｂ）に示す熱検知素子８が構成されることとなる。その他の構成に
ついては、上述の実施形態１とほぼ同様であるので説明を省略する。 Thereby, the heat detection element 8 shown in FIG. 5B is configured. Since other configurations are substantially the same as those of the first embodiment, description thereof is omitted.

本実施形態によれば、収納部５から、金属導電板１、２と一体的に形成した集熱板１６を突出させたので、これら集熱板１６を介して収納部５に実装されているサーミスタのチップ３に熱が伝わる。そのため、熱検知素子８の熱応答性が向上することとなる。   According to the present embodiment, since the heat collecting plate 16 formed integrally with the metal conductive plates 1 and 2 is protruded from the containing portion 5, the heat collecting plate 16 is mounted on the containing portion 5 via these heat collecting plates 16. Heat is transferred to the thermistor chip 3. Therefore, the thermal responsiveness of the heat detection element 8 is improved.

また、このような集熱板１６は２枚に限られるものではなく、２枚以上の集熱板１６を収納部の側部から突出させる構成としても良い。   Further, the number of the heat collecting plates 16 is not limited to two, and two or more heat collecting plates 16 may be protruded from the side portion of the storage unit.

さらに、図５（ｃ）に示すように、集熱板１７を金属導電板１、２の脚部１ｃ、２ｃと一体に形成して、外被部７の側部から突出させる構成としても本実施形態の趣旨を逸脱することなく実施できる。   Further, as shown in FIG. 5C, the heat collecting plate 17 may be formed integrally with the leg portions 1c and 2c of the metal conductive plates 1 and 2 so as to protrude from the side portion of the jacket portion 7. It can implement without deviating from the meaning of embodiment.

本実施形態では、集熱板１６、１７を金属導電板１、２と一体的に形成することとしたが、成形部位である収納部５又は外被部７と一体に成形により形成した成形品からなる集熱板を、図５に示す集熱板１６、１７のかわりに用いることとしても良い。   In the present embodiment, the heat collecting plates 16 and 17 are formed integrally with the metal conductive plates 1 and 2, but a molded product formed by molding integrally with the storage portion 5 or the jacket portion 7 which is a molding portion. It is good also as using the heat collecting plate which consists of instead of the heat collecting plates 16 and 17 shown in FIG.

もちろん、この構成は上述の基本形態１にも用いることができる。 Of course, this configuration can also be used in the basic mode 1 described above.

（実施形態４）
本発明の実施形態４の熱検知素子８は、上述の実施形態３のように収納部５の側部から突出させた集熱板１６を後述するように折り曲げ形成することに特徴があり、その他の構成については、上述した実施形態１とほぼ同様なので説明を省略する。 (Embodiment 4 )
The heat detection element 8 according to the fourth embodiment of the present invention is characterized in that the heat collecting plate 16 protruded from the side portion of the storage portion 5 is bent as described later, as in the third embodiment. Since the configuration is substantially the same as that of the above-described first embodiment, the description thereof is omitted.

このような熱検知素子８は、図６（ａ）に示すように、金属導電板１、２の実装部１ａ、２ａの隣接する２辺の縁部から、１枚ずつ合計２枚の集熱板１６が、前記２辺に対しそれぞれ直交する方向に一体的に形成されてなる金属導電板１、２を、上述の実施形態１と同様にインサートして収納部５を成形するとともに、集熱板１６を、収納部５の底面と平行に収納部５の各側部から突出させるとともに、集熱板１６を折り曲げ形成して、集熱板１６の図６（ｂ）における上面である板面１６ａを収納部５の側周面に対向させ、かつ、収納部５の開口部の前方向に、例えば４５度傾斜だけ傾斜させている。以上により、図６（ｃ）に示す熱検知素子８が構成されている。 As shown in FIG. 6A, such a heat detection element 8 has a total of two heat collecting elements one by one from the edges of two adjacent sides of the mounting portions 1a and 2a of the metal conductive plates 1 and 2. The plate 16 is integrally formed in the direction orthogonal to the two sides, and the metal conductive plates 1 and 2 are inserted in the same manner as in the first embodiment to form the storage portion 5 and heat collecting. The plate 16 is protruded from each side portion of the storage unit 5 in parallel with the bottom surface of the storage unit 5, and the heat collection plate 16 is bent to form a plate surface that is the upper surface of the heat collection plate 16 in FIG. 16a and is opposed to the side peripheral surface of the housing part 5, and before the direction of the opening of the accommodating portion 5 is inclined by for example 45 degrees inclination. Thus, the heat detecting element 8 shown in FIG. 6C is configured.

この場合、集熱板１６を、収納部５の各側部から１つずつ合計４つ突出させているので、上記の２つ設けたものに比べて気流のあたる面積が増す。そのため、さらに熱検知素子８の熱応答性が向上する。さらに、集熱板１６の板面１６ａを収納部５の側周面に対向させ、かつ、収納部５の開口部の前方向に傾斜させているので、収納部５の開口部に対して垂直方向の気流だけではなく、収納部５の開口部に対して平行方向の気流も集めることができる。これにより、集熱板１６が上述の実施形態２のすり鉢状のフィン１５と同様の役割を果たすこととなる。すなわち、気流を効率的に収納部５に集めることができるようになり、熱検知素子８の熱応答性をさらに向上させることができる。 In this case, since the heat collecting plates 16 are protruded from the side portions of the storage portion 5 in total, four in total, the area to which the airflow is applied is increased as compared with the above two. Therefore, the thermal response of the heat detection element 8 is further improved. Furthermore, it is opposed to the plate surface 16a of the heat collecting plate 16 to the side peripheral surface of the housing part 5, and, since is inclined toward the front of the opening of the accommodating portion 5, with respect to the opening of the housing part 5 In addition to the vertical airflow, an airflow parallel to the opening of the storage unit 5 can also be collected. Thereby, the heat collecting plate 16 will play the same role as the mortar-shaped fin 15 of the above-described second embodiment. That is, the airflow can be efficiently collected in the storage unit 5, and the thermal responsiveness of the heat detection element 8 can be further improved.

（基本形態２）
本発明の基本形態２は、金属導電板の脚部１ｃ、２ｃを、図７（ａ）及び（ｂ）に示すように、略ジグザグ状に打ち抜き形成したことに特徴があり、その他の構成については、上述の基本形態１と同様であるので説明を省略する。もちろん、この構成は上述の実施形態１にも用いることができる。 ( Basic form 2 )
The basic form 2 of the present invention is characterized in that the legs 1c and 2c of the metal conductive plate are punched and formed in a substantially zigzag shape as shown in FIGS. 7 (a) and (b). Since this is the same as the basic mode 1 described above, the description thereof is omitted. Of course, this configuration can also be used in the first embodiment.

本基本形態によれば、金属導電板の脚部１ｃ、２ｃを略ジグザグ状に打ち抜き形成したので、金属導電板の脚部１ｃ、２ｃの長さ寸法は、上述の実施形態１の脚部１ｃ、２ｃよりも長くなる。そのため、熱が接続端子１ｂ、２ｂ側に逃げにくくなる。これにより、熱応答性を向上させることができる。 According to this basic form, the leg portions 1c and 2c of the metal conductive plate are punched and formed in a substantially zigzag shape. 2c. Therefore, it becomes difficult for heat to escape to the connection terminals 1b and 2b. Thereby, thermal responsiveness can be improved.

（ａ）は、本発明の基本形態１の熱検知素子のエポキシ樹脂充填前の概略説明図であり、（ｂ）は、同上の熱検知素子の断面図であり、（ｃ）は、同上の熱検知素子の側面図である。(A) is schematic explanatory drawing before the epoxy resin filling of the heat detection element of the basic form 1 of this invention, (b) is sectional drawing of a heat detection element same as the above, (c) is same as the above. It is a side view of a heat sensing element. 同上の熱検知素子を備えた火災感知器の概略説明図である。It is a schematic explanatory drawing of the fire detector provided with the heat detection element same as the above. （ａ）は、同上の他の熱検知素子の概略説明図であり、（ｂ）は同図（ａ）の熱検知素子の下面図である。(A) is a schematic explanatory drawing of the other heat detection element same as the above, (b) is a bottom view of the heat detection element of the same figure (a). （ａ）は、本発明の実施形態１の熱検知素子の断面図であり、（ｂ）は、本発明の実施形態２の熱検知素子の断面図であり、（ｃ）は、同上の熱検知素子の上面図である。(A) is sectional drawing of the heat sensing element of Embodiment 1 of this invention, (b) is sectional drawing of the heat sensing element of Embodiment 2 of this invention, (c) is a heat | fever same as the above. It is a top view of a detection element. （ａ）は、本発明の実施形態３の熱検知素子の上面図であり、（ｂ）は、同上の熱検知素子の概略説明図であり、（ｃ）は、同上の他の熱検知素子の概略説明図である。(A) is a top view of the heat detection element of Embodiment 3 of this invention, (b) is a schematic explanatory drawing of a heat detection element same as the above, (c) is another heat detection element same as the above. It is a schematic explanatory drawing. （ａ）は、本発明の実施形態４の熱検知素子の上面図であり、（ｂ）は、同上の熱検知素子の概略説明図であり、（ｃ）は、同上の熱検知素子の斜視図である。(A) is a top view of the heat detection element of Embodiment 4 of this invention, (b) is a schematic explanatory drawing of a heat detection element same as the above, (c) is a perspective view of a heat detection element same as the above. FIG. （ａ）は、本発明の実施形態５の熱検知素子の概略説明図であり、（ｂ）は、同図（ａ）のＡ―Ａ矢視線断面図である。(A) is a schematic explanatory drawing of the heat detection element of Embodiment 5 of this invention, (b) is the sectional view on the AA arrow line of the same figure (a). 従来の熱検知素子の概略説明図である。It is a schematic explanatory drawing of the conventional heat detection element.

符号の説明Explanation of symbols

１、 ２ 金属導電板
１ａ、２ａ 実装部
１ｂ、２ｂ 接続端子
１ｃ、２ｃ 脚部
３ チップ
４ 実装プリント基板
５ 収納部
６ 基台
６ａ 凸部
７ 外被部
８ 熱検知素子
９ 接着剤
１０ エポキシ樹脂 DESCRIPTION OF SYMBOLS 1, 2 Metal conductive plate 1a, 2a Mounting part 1b, 2b Connection terminal 1c, 2c Leg part 3 Chip 4 Mounting printed circuit board 5 Storage part 6 Base 6a Protrusion part 7 Cover part 8 Heat detection element 9 Adhesive 10 Epoxy resin

Claims (9)

合成樹脂を成形してなる有底の収納部と、当該収納部の底面に一端部が露出された一対の金属導電板と、前記収納部内において前記一対の金属導電板の一端部間に亘るように実装されたサーミスタのチップとを備え、
前記収納部内には、サーミスタのチップを封止する封止用樹脂が充填され、
前記金属導電板は、実装基板の面に対して垂直となるように垂立されるとともに、他端部が前記実装基板に電気的に接続され、
前記収納部の開口部は、前記金属導電板の他端部が電気的に接続される前記実装基板の面とは反対側を向いていることを特徴とする熱検知素子。 A bottomed storage portion formed by molding a synthetic resin, a pair of metal conductive plates with one end exposed at the bottom surface of the storage portion, and between one end portions of the pair of metal conductive plates in the storage portion Thermistor chip mounted on the
The storage portion is filled with a sealing resin for sealing the thermistor chip,
The metal conductive plate is suspended so as to be perpendicular to the surface of the mounting substrate, and the other end is electrically connected to the mounting substrate.
The opening part of the said accommodating part has faced the opposite side to the surface of the said mounting board | substrate to which the other end part of the said metal conductive plate is electrically connected, The heat detection element characterized by the above-mentioned . 前記合成樹脂は熱可塑性樹脂であり、
前記一対の金属導電板において前記収納部から突出された突出部位は、前記熱可塑性樹脂によりモールドされていることを特徴とする請求項１記載の熱検知素子。 The synthetic resin is Ri der thermoplastic resin,
The heat detection element according to claim 1 , wherein projecting portions of the pair of metal conductive plates projecting from the storage portion are molded with the thermoplastic resin . 前記各金属導電板は所定の間隔を有して並行に配置され、
前記一対の金属導電板の前記突出部位それぞれは、前記金属導電板間に隙間部が形成されるように、前記熱可塑性樹脂により各別にモールドされていることを特徴とする請求項２記載の熱検知素子。 The metal conductive plates are arranged in parallel with a predetermined interval,
3. The heat according to claim 2 , wherein each of the protruding portions of the pair of metal conductive plates is individually molded with the thermoplastic resin so that a gap is formed between the metal conductive plates. Sensing element. 前記封止用樹脂はエポキシ樹脂であって、
前記合成樹脂は、荷重たわみ温度が２８５℃以上、かつ、比熱が６００Ｊ／ｋｇＫ以下の熱可塑性樹脂であることを特徴とする請求項１〜３のうちいずれか１項記載の熱検知素子。 The sealing resin is an epoxy resin,
The synthetic resin, deflection temperature under load 285 ° C. or higher, and the thermal detection element according to any one of claims 1-3 specific heat characterized in that it is a less thermoplastic resin 600 J / kgK. 前記収納部には、前記収納部の開口部から前方へ向かうにつれ徐々に外側へ広がる形のすり鉢状のフィンが一体的に形成され、
前記フィンの前記収納部の開口部付近の基部には、前記フィンの内部と外部とを連通する孔が形成されていることを特徴とする請求項１〜４のうちいずれか１項記載の熱検知素子。 The storage part is integrally formed with a mortar-shaped fin that gradually spreads outward as it goes forward from the opening of the storage part,
The heat according to any one of claims 1 to 4 , wherein a hole that communicates the inside and the outside of the fin is formed in a base portion of the fin in the vicinity of the opening of the storage portion. Sensing element. 前記金属導電板には、１又は２以上の集熱板が一体的に形成されていることを特徴とする請求項１〜５のうちいずれか１項記載の熱検知素子。 The metal in the conductive plate, one or more of the heat collecting plate heat sensing element according to any one of the preceding claims, characterized in that it is formed integrally. 前記集熱板は、板面が前記収納部の側周面に対向するように前記収納部の側部から突出され、かつ、当該板面と前記収納部の側周面との間の距離が、前記収納部の開口部の前方向側に向かうにつれて大きくなるように傾斜していることを特徴とする請求項６記載の熱検知素子。 The heat collecting plate protrudes from the side portion of the storage portion such that the plate surface faces the side peripheral surface of the storage portion, and the distance between the plate surface and the side peripheral surface of the storage portion is The thermal detection element according to claim 6 , wherein the thermal detection element is inclined so as to increase toward the front side of the opening of the storage portion . 前記突出部位は、蛇行形状であることを特徴とする請求項２〜７のうちいずれか１項記載の熱検知素子。 The heat detection element according to claim 2 , wherein the protruding portion has a meandering shape . 前記金属導電板の他端側には、表面実装用の略直方体形状の実装部が形成され、
前記実装部の実装基板と溶接される面には、前記金属導電板の他端部に形成した電極部が露出していることを特徴とする請求項１〜８のうちいずれか１項記載の熱検知素子。 On the other end side of the metal conductive plate, a substantially rectangular parallelepiped mounting portion for surface mounting is formed,
The electrode part formed in the other end part of the said metal conductive plate is exposed to the surface welded with the mounting board | substrate of the said mounting part, The any one of Claims 1-8 characterized by the above-mentioned. Thermal sensing element .
JP2003366878A 2003-10-28 2003-10-28 Thermal sensing element Expired - Fee Related JP4241320B2 (en)

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